JP3881479B2 - Parallel gap seam welding method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a parallel gap seam welding method for sealing the semiconductor ceramic package.
[0002]
[Prior art]
In order to hermetically seal a semiconductor ceramic package , a micro parallel seam welding method, an electron beam method, and the like are known.
In the micro parallel seam welding method, as shown in FIG. 2, a seal frame 5 is brazed in advance to the package 1, a lid 2 is placed on the seal frame 5, and a pair of tapered roller electrodes 6 are attached to the lid 2. Sealing is performed by pressing the end portion to move horizontally and simultaneously energizing between the roller electrodes 6. Here, the role of the seal frame 5 is to distribute the welding current to the seal frame 5, thereby promoting effective heating of the sealing portion and preventing the lid 2 from generating heat as a whole, thereby causing stress during cooling. Reduce.
[0003]
In the electron beam method, as shown in FIG. 3, the lid 2 is placed directly on the package 1 and heat sealing is performed by irradiating the electron beam 7. This method does not require a seal frame because there is little stress between the package 1 and the lid 2 during cooling due to local heating.
[0004]
[Problems to be solved by the invention]
However, in the micro parallel seam welding method, the equipment including the power source is simple and inexpensive. However, since the seal frame 5 is required as described above, the cost of the package becomes high.
On the other hand, since the electron beam method does not require a seal frame, the cost of the package is low, but the equipment for the electron beam 7 is expensive.
The present invention has been made to solve the above-described problems, and provides a method that complements the disadvantages of the above two methods, does not require a seal frame in the package, and can be implemented with an inexpensive power source and equipment. Objective.
[0005]
[Means for Solving the Problems]
The parallel gap seam welding method according to claim 1 is a method of hermetically sealing a semiconductor ceramic package , wherein the tip portions of a pair of tapered roller electrodes having a spread in the tip direction are opposed to each other so that the electrode gap is within an adjustment range. The ceramic package is sealed by making a round while pressing, rotating and energizing the outer periphery of the sealing portion of the lid placed on the package to be sealed by the pair of roller electrodes. It is characterized by doing.
[0006]
According to the parallel gap seam welding method of the first aspect, since the heat generating portion is suppressed to the minimum part necessary for joining, the lid does not stretch due to heat generation, so that the ceramic package does not crack even without the seal frame.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic side view showing an embodiment of the present invention. In the figure, 1 is a package, 2 is a lid, and 3 is a parallel gap roller electrode. The parallel gap roller electrode 3 has a taper extending in the direction of the tip, and the tips thereof are opposed to each other. The gap 4 between the electrodes is constant at the contact portion when pressed against the welded portion and rotated, that is, the track becomes parallel. So that the gap can be adjusted. The adjustment range of the gap between the electrodes is practically 0.05 to 0.15 mm. In general, a copper alloy is used as the material of the electrode.
[0008]
The sealing portion of the ceramic package 1 is previously metallized with tungsten or the like over the entire circumference, and nickel plating or gold plating is applied thereon. The lid 2 is made of, for example, Kovar (an alloy of iron, nickel, and cobalt), and has a nickel plating, gold plating, or the like on the entire surface. For sealing, the lid 2 is placed on the package 1 in a nitrogen gas atmosphere, moved horizontally while pressing the parallel gap roller electrode 3 along the outer periphery sealing portion of the lid 2, and intermittently between the roller electrodes 3. The entire circumference of the sealing portion is sealed by energizing or continuously energizing. The gap between electrodes and the energizing current are set to appropriate values by conducting a sample experiment in advance.
[0009]
【The invention's effect】
According to the present invention, since the heat generating portion is limited to the minimum portion necessary for joining, the ceramic package is not cracked even without a seal frame, with little elongation due to heat generation of the lid. Further, since no seal frame is required, the package cost is low, the equipment including the power source is simple and inexpensive, and the power source can be shared with the micro parallel seam welding method.
[Brief description of the drawings]
FIG. 1 is a schematic side view of a parallel gap seam welding method according to an embodiment of the present invention.
FIG. 2 is a schematic side view of a micro parallel seam welding method using a conventional seal frame.
FIG. 3 is a schematic side view of a conventional electron beam method.
[Explanation of symbols]
1 Package 2 Lid 3 Parallel Gap Roller Electrode 4 Interelectrode Gap 5 Seal Frame 6 Pair of Tapered Roller Electrodes 7 Electron Beam

Claims (1)

In a method for hermetically sealing a semiconductor ceramic package , a pair of tapered roller electrodes having a spread in the tip direction are opposed to each other, and the electrode gap is held constant at an arbitrary value within an adjustment range. A parallel gap seam welding method for sealing a ceramic package by making a round on the outer periphery of a sealing portion of a lid placed on a package to be sealed while pressing, rotating, and energizing the pair of roller electrodes .

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