JP2001110924A - Parallel gap seam welding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of sealing up a ceramic package of a semiconductor, etc., by using a cheap power source and an equipment, without requiring seal frame for the package. SOLUTION: Parallel gap roller electrodes with tapered tips which are expanded confronting each other are horizontally moved as pressed against an outer seal part, and an electric power is intermittently or continuously applied between the roller electrodes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parallel gap seam welding method for sealing a ceramic package such as a semiconductor.

[0002]

2. Description of the Related Art Micro-parallel seam welding, an electron beam method and the like are known for hermetically sealing a ceramic package such as a semiconductor. In the micro parallel seam welding method, as shown in FIG. 2, a seal frame 5 is previously brazed to a package 1, a lid 2 is placed on the seal frame 5, and a pair of tapered roller electrodes 6 are connected to the Sealing is performed by pressing against the end and moving horizontally, and at the same time energizing between the roller electrodes 6. Here, the role of the seal frame 5 is that the welding current is applied to the seal frame 5.
In this way, the effective heating of the sealing portion is promoted, the heat generation of the entire lid 2 is prevented, and the stress at the time of cooling is reduced.

In the electron beam method, as shown in FIG. 3, a lid 2 is directly mounted on a package 1 and heat sealing is performed by irradiation with an electron beam 7. This method does not require a seal frame because the stress between the package 1 and the lid 2 during cooling due to local heating is small.

[0004]

However, in the micro parallel seam welding method, the equipment including the power supply is simple and inexpensive, but the cost of the package increases because the seal frame 5 is required as described above. . On the other hand, the electron beam method does not require a seal frame, so the cost of the package is low, but the equipment for the electron beam 7 is expensive. The present invention has been made in order to solve the above-mentioned problems, and provides a method that can supplement the disadvantages of the above two methods, does not require a seal frame in a package, and can be implemented with an inexpensive power supply and equipment. Aim.

[0005]

According to a first aspect of the present invention, there is provided a method for hermetically sealing a ceramic package such as a semiconductor, wherein a pair of tapered roller electrodes having a width extending in a tip direction are opposed to each other. The electrode gap is held constant at an arbitrary value within the adjustment range, and the outer periphery of the sealing portion of the lid placed on the package to be sealed is pressed, rotated, and energized by the pair of roller electrodes. It is characterized in that the ceramic package is sealed by making a circuit while making a round.

According to the parallel gap seam welding method of the first aspect, since the heat generating portion is suppressed to the minimum necessary for joining, the lid elongation due to heat generation is small, so that the ceramic package does not crack without the seal frame. .

[0007]

FIG. 1 is a schematic side view showing one embodiment of the present invention. In the figure, 1 indicates a package, 2 indicates a lid, and 3 indicates a parallel gap roller electrode. The parallel gap roller electrode 3 has a tapered end extending in the direction of the tip, the tips of which are opposed to each other.
Is held constant at the contact portion when pressed and rotated on the welded portion, that is, the track is parallel, and the gap can be adjusted. The adjustment range of the gap between the electrodes is 0.05
From 0.15 mm is practical. Further, a copper alloy is generally used as a material of the electrode.

The sealing portion of the ceramic package 1 is metallized in advance with tungsten or the like over the entire circumference, and nickel plating and gold plating are applied thereon. The lid 2 is made of, for example, Kovar (an alloy of iron, nickel, and cobalt) and has a nickel plating, a gold plating, or the like on the entire surface. For sealing, the lid 2 is placed on the package 1 in a nitrogen gas atmosphere, and moves horizontally while pressing the parallel gap roller electrode 3 along the lid 2 outer peripheral sealing portion. The entire circumference of the sealing portion is sealed by electrically or continuously energizing. The inter-electrode gap and the conducting current are set to appropriate values by conducting a sample experiment in advance.

[0009]

According to the present invention, since the heat-generating portion is limited to the minimum portion necessary for the joining, the elongation due to the heat generation of the lid is small and the ceramic package does not crack without the seal frame. Further, since a seal frame is not required, the package cost is low, the equipment including a power supply is simple and inexpensive, and the power supply can be shared with the micro parallel seam welding method.

[Brief description of the drawings]

FIG. 1 is a schematic side view of a parallel gap seam welding method according to an embodiment of the present invention.

FIG. 2 is a schematic side view of a micro parallel seam welding method using a conventional seal frame.

FIG. 3 is a schematic side view of a conventional electron beam method.

[Explanation of symbols]

 Reference Signs List 1 package 2 lid 3 parallel gap roller electrode 4 gap between electrodes 5 seal frame 6 pair of tapered roller electrodes 7 electron beam

Claims (1)

[Claims] In a method for hermetically sealing a ceramic package such as a semiconductor, a tip of a pair of tapered roller electrodes having a spread in a tip direction is opposed to each other, and the electrode gap is kept constant at an arbitrary value within an adjustment range. The ceramic package is sealed by pressing, rotating and energizing the outer periphery of the sealing portion of the lid placed on the package to be sealed by the pair of roller electrodes. Parallel gap seam welding method.