JP3880024B2

JP3880024B2 - Method for producing electrodeposition resist coating and apparatus therefor

Info

Publication number: JP3880024B2
Application number: JP17240698A
Authority: JP
Inventors: 弘道鈴木; 渉立川
Original assignee: ローム・アンド・ハース電子材料株式会社
Priority date: 1998-06-19
Filing date: 1998-06-19
Publication date: 2007-02-14
Anticipated expiration: 2018-06-19
Also published as: JP2000008188A

Description

【０００１】
【発明の属する技術分野】
本発明は、電着レジスト塗布物の製造方法及びそのための装置に関し、更に詳しくは、改良された電着工程及びそのための装置に関する。
【０００２】
【従来の技術】
プリント配線基板やリードフレーム等の製造プロセスにおいて、それらの表面に選択的なメッキやエッチング等を施すために電着レジストを保護膜として利用する方法がある（電着レジストを用いたメッキ用又はエッチング用の画像形成法の基本構成を図５に示す）。
【０００３】
この電着レジストは選択的なメッキやエッチング等を施すための保護膜として用いられるので、該電着レジストは被電着物の表面に均一な厚みで、且つ所定の密着性をもって形成されねばならない。
【０００４】
そのためには、被電着物が電着レジスト液と接触する際、被電着物の表面が迅速に該電着レジスト液にて濡れること、すなわち被電着物の表面と該電着レジスト液との間には異物が存在しないことが要求される。そのような異物としては、電着工程の前の工程から被電着物に同伴して持ち込まれる水や薬剤等に加え、電着工程の過程において被電着物表面に電気化学的反応の結果発生する気泡がある。
【０００５】
その対策としては、被電着物と電着レジスト液との接触時間を長くする方法（主に良好な被電着物表面の濡れ性の確保）や被電着物に機械的な振動を与える方法（主に気泡の排除）があるが、前者についてはその時間が長くなり過ぎると保護すべき表面の侵食が生じてしまうし、後者については所望特性を満足し得る電着の結果物が得られなかった（特に微細パターンの形成を要するものについて）。
【０００６】
【発明が解決しようとする課題】
本発明の目的は、このような従来技術の課題を解決して、信頼性に優れたレジストパターンを形成し得る電着レジスト塗布物の製造方法及びそのための装置を提供することにある。
【０００７】
【課題を解決するための手段】
本発明は、電着レジスト塗布物の製造方法であって、電着工程において、該工程を実行する間、コーテイング槽の下部より上部に向けて電着レジスト液を強制的に流す（図１参照）と共に、該工程の初期、被電着物をコーテイング槽に投入する際に、投入される該被電着物にコーテイング槽の直下部にて電着レジスト液を散布する（図２参照）ことを特徴とする。
【０００８】
前記のコーティング槽は被電着物表面に実際に電着レジストを塗布（より正確には、電着レジストの保護膜を電気化学的反応にて形成させる）するための槽であるが、その側壁面を隔膜とし、その底面が混合槽に開放された槽として該混合槽中に設けられた槽であることが好ましい。被電着物表面に所定の流速で電着レジスト液を流すことができると共に、所定の電気化学反応を行わせることができるからである。尚、電気化学的反応のための電極（図示せず）は、混合槽中の、該隔膜に近接する位置にそれぞれ配される。尚、隔膜としては、該電着レジスト液、特に溶剤成分に侵されないものであって、該コーティング槽から該混合槽への該電着レジスト液のオーバーフローによる流出が可能な程度の仕切り機能を有し、該電極と被電着物間の電気の流れを疎外しない程度の孔径を有するものを市販品の中から適宜選定すればよい。
【０００９】
前記の電着レジスト液の上向流が、その流れに直交するコーテイング槽の断面において均一に流されるものであり、その流量が少なくとも３．０〜４．０m³/m²/min.であることが好ましい。ここで、該電着レジスト液の上向流は、被電着物の表・裏面に沿って流される。尚、単位中の“m²”は、該コーテイング槽の単位断面積である。
【００１０】
更に、前記の電着レジスト液の散布流が被電着物の表・裏面に向けて該被電着物の幅方向に均一に噴出させられるものであり、その流量が０．０５〜０．１５m³/m/min. である。尚、単位中の“m ”は、該被電着物の投入方向に直交する方向における該被電着物の単位長さ（以下、特に断りがない限り、幅という）である。
【００１１】
本発明の製造方法において、被電着物としてはプリント配線基板、リードフレームやＩＣパッケージが代表的なものであるが、もちろん目的を同じくするものであればこれらの用途に限定されない。そのようなものとしては、その表面に導電膜を形成されたプラスチックフィルム、射出成形基板、シリコンウエハ、金属板が挙げられる。
【００１２】
また本発明は、電着レジスト塗布物の製造装置であって、少なくとも、電解レジスト液の循環ラインと、所定組成の電着レジスト液を貯留すると共に、該電着レジスト液の循環のためのポンプ井としても機能する混合槽（Ｖ１）と、該混合槽の内部に隔膜をその側壁とし、その底面を該混合槽に開口した槽として設けた被電着物を収容し電着操作を行うためのコーティング槽（Ｖ２）と、を備えてなり、該循環ラインが、少なくとも、該電着レジスト液を該混合槽の下部から抜き出し該コーティング槽の直下部に該コーティング槽の断面において均一な流速となるように放出して該コーティング槽中を下から上に向けて流れる該電着レジスト液の流れを形成させるための第１循環ライン（図１図示のポンプ（Ｐ１）とフィルター（Ｆ１）を流れの方向に順に擁するラインがその１例である）と、該電着レジスト液を該混合槽の下部から抜き出し該コーティング槽の液面直下部に、該コーティング槽に投入される被電着物の表・裏面に向けて放出して該電着レジスト液を該被電着物の幅方向に均一に散布するための第２循環ライン（図２図示のポンプ（Ｐ２）とフィルター（Ｆ２）及び流路切替弁（Ｂ）を流れの方向に順に擁するラインがその１例である。尚、このラインにおいて、該電着レジスト液の散布は該流路切替弁の一方の出口、すなわち図面上で上方に向かうラインを経由してなされるが、前記の通り、この散布は電着工程の初期、被電着物をコーテイング槽に投入する際にのみ必要故、その時以外は、該流路切替弁は他方の出口、すなわち図面上で左方に向かうラインに“開”の状態におかれる）と、を備えてなるものであることを特徴とする。
【００１３】
ここで、前記の電着レジスト液の上向流形成手段が、ポンプのデリバリー（図示ではフィルターＦ１の後流）に接続され、前記のコーテイング槽の直下部に配された箱体であって、その上板に該電着レジスト液を整流・放出可能な通孔が等ピッチに配された箱体（Ｎ１）（詳細は図示せず。具体的には水処理装置の補機として市販されているものの中から適宜選定すれば良い）が好ましい。その流れの均一性を確保するのに資するからである。尚、該電着レジスト液の上向流を前記のコーテイング槽中をその断面全体に渡って均一に、且つその流量が３．０〜４．０m³/m²/min.となるように流すことができるものであれば、その形態は、例えば、スプレイ管群であってもよい。
【００１４】
更に、前記の電着レジスト液の散布手段が、ポンプのデリバリー（図示ではフィルターＦ２及び流路切替弁（Ｂ）の後流）に接続され、前記のコーテイング槽の液面直下部に、該コーティング槽に投入される被電着物の表・裏面を挟むように平行に配された管であって、該管の軸方向に等ピッチに配されたスプレイノズル、又は該管の軸方向に形成されたスリットを、両管のそれらが対向するように有する管（Ｎ２）（詳細は図示せず。具体的には水処理装置の補機として市販されているものの中から適宜選定すれば良い）が好ましい。勿論、該散布手段の要件は、それにて形成される散布流が該コーティング槽に投入される被電着物の表・裏面に向けて該被電着物の幅方向に均一に散布されること、その流量が０．０５〜０．１５m³/m/min. となるように散布し得ること故、その形態はスプレイ管やスリット管に限定されない。
【００１５】
尚、図１及び図２に示された「回収槽（Ｖ３）」とは、従来の製造方法にても用いられているものであって、図３に示すような第３の循環ライン（電着レジスト液をポンプ（Ｐ３）にて混合槽（Ｖ１）の下部から抜き出し、フィルター（Ｆ３１）（一般的には、カートリッジフィルターが用いられる。前記の第１及び第２循環ライン並びに後述の第４循環ラインのそれらも同様）にて該電着レジスト液中の外部由来のきょう雑物を予め除去した後、粒子ろ過装置（Ｆ３２）（一般的には、中空糸型の限外ろ過器が用いられる）にて該電着レジスト液中の所定成分に分別し、所定の槽に該分別されたそれぞれの成分を戻すライン）を用いて該粒子ろ過装置にて分別された該電着レジスト液中の安定剤成分リッチなろ過液：Ｂを一旦受け入れ、電着工程にて消費された該電着レジスト液中の樹脂成分を必要に応じて補充し、該電着レジスト液を所定の組成範囲内にコントロールするためのものである。尚、該粒子ろ過装置にて分別された他方の成分、すなわち該電着レジスト液中の樹脂成分リッチなろ過液：Ａは、図示の通り、コーティング槽（Ｖ２）に循環させられる。
【００１６】
また、これも従来の製造方法にても用いられているものであるが、混合槽（Ｖ１）には、図４に示すような第４の循環ライン、すなわち電着レジストの温度をコントロールするための循環ライン（電着レジスト液をポンプ（Ｐ４）にて混合槽（Ｖ１）の下部から抜き出し、フィルター（Ｆ４）にて該電着レジスト液中のきょう雑物を予め除去した後、熱交換器（Ｈ）にて間接加熱する構成）も設けるのが一般的である。
【００１７】
尚、これらの各循環ラインは、原則として個別のラインとするが、各ポンプ（Ｐ１、Ｐ２、Ｐ３、Ｐ４）のサクションはすべて混合槽の下部であり、該各ポンプのデリバリー側にはすべてフィルター（Ｆ１、Ｆ２、Ｆ３１、Ｆ４）が備えられているので、この部分までは共用してもよい（基数は各１基とは限らない）。
【００１８】
【発明の実施の形態】
以下、１実施態様を例として本発明を更に詳細に説明する。
【００１９】
１．装置の構成
下記の仕様（寸法は内寸である）の槽を夫々準備した。
▲１▼ 混合槽：３５０mm^W ×８３０mm^L ×７２０mm^H
▲２▼ コーティング槽：１２０mm^W ×７３０mm^L ×６５０mm^H （その側壁面を隔膜とし、その底面は混合槽に開放させたそうであって、該混合槽に内蔵）
循環ラインは、第１から第４までの全ラインを夫々個別に準備した（各系統キャパシティーは循環量基準で下記の通りとなるよう設計した。尚、各系統の構成機器は、細かい補機を除き前述の通りのものを準備した）。
▲１▼ 第１循環ライン：３００L/min.（上向流発生手段として整流ボックス−上板寸法：１２０mm^W ×７３０mm^L 、すなわち該コーティング槽の底面と同寸、通孔：直径３mmの孔を１０mmピッチで配置。したがってその総数は７９２個であるーを使用。上向流の流量：３．４２４m³/m²/min.）
▲２▼ 第２循環ライン：８０L/min.（コーティング槽直下部における散布手段としてスプレイ管−スプレイノズル：イケウチＣＥＲＪＥＴ９０５０（スプレイ角度：９０度。尚、このスプレイノズルはファンタイプ故、スプレイは該コーティング槽に投入される被電着物の幅方向にのみ拡がる。また、該スプレイノズルはノズルの軸が液面に対し３０度下向きに設置）、その個数：１９個／管−を使用。使用時間：２０〜３０秒／回。スプレイ圧力：１kg/cm²以上。散布流量：０．１１５m³/m/min.)
▲３▼ 第３循環ライン：６０〜１００ L/min. （粒子ろ過器は、ユアサコーポレーション社製の型番：ＵＦＤ−９ＭＨＦ−ＬＴを使用）
▲４▼ 第４循環ライン：１００L/min.
尚、系全体の内溶液量は、３００L(リットル）である。
【００２０】
２．電着レジスト液の調整
シプレイ・ファーイースト社製ポジ型電着レジスト（商品名：ＰＥＰＲ２４００ＥＤ）を純水にて希釈（混合比＝１：１）した。
【００２１】
３．被電着用サンプルの準備
被電着物として、その表面に１８μm の厚さの銅箔を有する銅貼り積層板（日立製ＣＣＬ基板ＦＲ−４。５００mm^W ×５００mm^L ×１．６mm^t)を準備した。
【００２２】
４．電着塗膜の特性確認試験用サンプルの製造
１項記載の装置を用い、２項記載の電着レジスト液にて、３項記載のサンプルにレジスト厚みがそれぞれ７μm となるように電着を行った（ここで、本発明のそれは、第１〜第４の循環ラインすべてを稼働させたのに対し、比較のための試験Ａでは第１の循環ラインを、比較のための試験Ｂでは第２の循環ラインを、夫々停止させて行った）。電着後の各被電着物に下記の後処理を順に施し、電着塗膜の特性確認試験用の各サンプルとした。
▲１▼ 水洗
▲２▼ エアナイフ
▲３▼ 温風乾燥（１０５℃×５min.）
▲４▼ 露光（任意の片面。使用装置：ハイテック社製の型番がＨＴＥ−１０２Ｓ）
▲５▼ 現像（１．０％炭酸ナトリウム水溶液に１２０秒間浸漬）
▲６▼ エッチング（エッチング液：５０％硝酸水溶液に室温で４分間浸漬し、露出した部分の銅箔を除去）
【００２３】
５．電着塗膜の特性確認試験
４項で準備した各サンプルを下記の要領にて夫々試験した。
▲１▼ レジストカバーリング不良の有無
サンプルの下面（銅箔を除去した部分を含む面）から該サンプルにライトを当て、目視にてレジストカバーリング不良箇所（ピンホールができているところ）を観察した。結果を表１に示す。尚、計測した範囲は該サンプル全域である。
【００２４】
【表１】

【００２５】
▲２▼ 膜厚の均一性
サンプルの膜厚をＵＰＡ社製のマイクロダーム（商品名）にて計測した。尚、１サンプル当たりの計測点数は９点である。結果を表１に示す。
【００２６】
【表２】

【００２７】
【発明の効果】
上記の通り、本発明の製造方法及び装置によれば、膜厚の均一性に優れ、且つピンホールのない良好な電着レジスト塗膜を形成し得る。
【図面の簡単な説明】
【図１】本発明の第１循環ラインの構成を示す系統図（槽は断面にて表示）である。
【図２】本発明の第２循環ラインの構成を示す系統図（槽は断面にて表示）である。
【図３】第３循環ラインの構成を示す系統図（槽は断面にて表示）である。
【図４】第４循環ラインの構成を示す系統図（槽は断面にて表示）である。
【図５】電着レジストを用いたメッキ用又はエッチング用の画像形成法の基本構成を示すブロックダイヤグラムである。
【符号の説明】
Ｖ１：混合槽
Ｖ２：コーティング
Ｖ３：回収
Ｐ１、Ｐ２、Ｐ３、Ｐ４：ポンプ
Ｆ１、Ｆ２、Ｆ３１、Ｆ４：フィルター
Ｆ３２：粒子ろ過器
Ｂ：流路切替弁
Ｈ：熱交換器[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an electrodeposition resist coating and an apparatus therefor, and more particularly, to an improved electrodeposition process and an apparatus therefor.
[0002]
[Prior art]
In the manufacturing process of printed wiring boards, lead frames, etc., there is a method of using an electrodeposition resist as a protective film in order to perform selective plating or etching on the surface (for plating or etching using an electrodeposition resist). The basic configuration of the image forming method for use is shown in FIG.
[0003]
Since this electrodeposition resist is used as a protective film for performing selective plating, etching, etc., the electrodeposition resist must be formed on the surface of the electrodeposition object with a uniform thickness and a predetermined adhesion.
[0004]
For this purpose, when the electrodeposition comes into contact with the electrodeposition resist solution, the surface of the electrodeposition quickly gets wet with the electrodeposition resist solution, that is, between the surface of the electrodeposition and the electrodeposition resist solution. Is required to be free of foreign matter. Such foreign matter is generated as a result of an electrochemical reaction on the surface of the electrodeposition in the process of electrodeposition in addition to water, chemicals, etc. brought along with the electrodeposition from the process before the electrodeposition process. There are bubbles.
[0005]
As countermeasures, a method of increasing the contact time between the electrodeposit and the electrodeposition resist solution (mainly ensuring good wettability of the electrodeposit surface) or a method of applying mechanical vibration to the electrodeposit (mainly However, if the time is too long for the former, the surface to be protected will be eroded, and the latter will not result in electrodeposition that satisfies the desired characteristics. (Especially those that require the formation of fine patterns).
[0006]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems of the prior art and to provide a method for producing an electrodeposition resist coating product and an apparatus therefor that can form a highly reliable resist pattern.
[0007]
[Means for Solving the Problems]
The present invention is a method for producing an electrodeposition resist coating product, and in the electrodeposition step, the electrodeposition resist solution is forced to flow from the lower part to the upper part of the coating tank during the process (see FIG. 1). In addition, in the initial stage of the process, when depositing the electrodeposits into the coating bath, the electrodeposition resist solution is sprayed on the charged deposits immediately below the coating bath (see FIG. 2). And
[0008]
The coating tank is a tank for actually applying an electrodeposition resist on the surface of an electrodeposit (more precisely, forming a protective film of the electrodeposition resist by an electrochemical reaction), but its side wall surface. Is a tank provided in the mixing tank as a tank whose bottom face is open to the mixing tank. This is because the electrodeposition resist solution can flow at a predetermined flow rate on the surface of the electrodeposit, and a predetermined electrochemical reaction can be performed. In addition, the electrode (not shown) for electrochemical reaction is each arrange | positioned in the mixing tank in the position close | similar to this diaphragm. The diaphragm is not affected by the electrodeposition resist solution, particularly the solvent component, and has a partition function that allows the electrodeposition resist solution to overflow from the coating tank to the mixing tank. And what has the hole diameter of the grade which does not alienate the electric flow between this electrode and a to-be-deposited thing should just be selected suitably from a commercial item.
[0009]
The upward flow of the electrodeposition resist solution is made to flow uniformly in the cross section of the coating tank perpendicular to the flow, and the flow rate is at least 3.0 to 4.0 m ³ / m ² / min. It is preferable. Here, the upward flow of the electrodeposition resist solution flows along the front and back surfaces of the electrodeposit. “M ² ” in the unit is a unit cross-sectional area of the coating tank.
[0010]
Further, the sprayed flow of the electrodeposition resist solution is jetted uniformly in the width direction of the electrodeposit toward the front and back surfaces of the electrodeposit, and the flow rate is 0.05 to 0.15 m ^3. / m / min. Note that “m” in the unit is the unit length of the electrodeposit in the direction orthogonal to the charging direction of the electrodeposit (hereinafter referred to as the width unless otherwise specified).
[0011]
In the manufacturing method of the present invention, as the electrodeposits, a printed wiring board, a lead frame, and an IC package are representative, but of course, they are not limited to these uses as long as they have the same purpose. Examples thereof include a plastic film having a conductive film formed on the surface thereof, an injection molded substrate, a silicon wafer, and a metal plate.
[0012]
The present invention also relates to an apparatus for producing an electrodeposition resist coating, comprising at least an electrolytic resist solution circulation line, an electrodeposition resist solution having a predetermined composition, and a pump for circulating the electrodeposition resist solution. A mixing tank (V1) that also functions as a well, and an electrodeposition operation for accommodating an electrodeposition provided with a diaphragm as a side wall inside the mixing tank and a bottom surface opened as a tank in the mixing tank A coating tank (V2), and the circulation line draws at least the electrodeposition resist solution from the lower part of the mixing tank and has a uniform flow velocity in the cross section of the coating tank immediately below the coating tank. The first circulation line (the pump (P1) and the filter (F1) shown in FIG. 1 flow through the coating tank to form a flow of the electrodeposition resist solution flowing from bottom to top in the coating tank). A line that holds in order in the direction of the electrode) is an example), and the electrodeposition resist solution is extracted from the lower part of the mixing tank, and the surface of the electrodeposit to be put into the coating tank immediately below the liquid level of the coating tank. A second circulation line (the pump (P2) and the filter (F2) shown in FIG. 2 and the flow path switching) for discharging toward the back surface and uniformly spreading the electrodeposition resist solution in the width direction of the electrodeposit One example is a line that sequentially holds the valve (B) in the flow direction, in which the electrodeposition resist solution is sprayed upward in one outlet of the flow path switching valve, that is, in the drawing. As described above, this spraying is necessary only at the beginning of the electrodeposition process, when the electrodeposit is put into the coating tank, and the flow path switching valve is the other outlet. That is, on the line that goes to the left in the drawing And placed as) to the state of open ", and characterized in that comprising comprises a.
[0013]
Here, the upward flow forming means of the electrodeposition resist solution is connected to a pump delivery (the downstream of the filter F1 in the drawing), and is a box disposed directly below the coating tank, A box body (N1) in which through holes capable of rectifying and discharging the electrodeposition resist solution are arranged on the upper plate at an equal pitch (the details are not shown. Specifically, they are commercially available as auxiliary equipment for water treatment equipment. It may be selected as appropriate from among those present. This is because it helps to ensure the uniformity of the flow. The upward flow of the electrodeposition resist solution is made to flow uniformly in the coating tank over the entire cross section and at a flow rate of 3.0 to 4.0 m ³ / m ² / min. If possible, the form may be, for example, a spray tube group.
[0014]
Further, the electrodeposition resist solution spraying means is connected to a pump delivery (in the figure, the downstream of the filter F2 and the flow path switching valve (B)), and the coating is applied immediately below the liquid surface of the coating tank. It is a pipe arranged in parallel so as to sandwich the front and back surfaces of the electrodeposit to be put in the tank, and is formed in the spray nozzle arranged at an equal pitch in the axial direction of the pipe, or formed in the axial direction of the pipe (N2) (the details are not shown. Specifically, it may be selected as appropriate from those commercially available as an auxiliary machine of the water treatment apparatus). preferable. Of course, the requirement of the spraying means is that the spray flow formed thereby is uniformly sprayed in the width direction of the electrodeposits toward the front and back surfaces of the electrodeposits to be fed into the coating tank, Since it can be sprayed so that the flow rate becomes 0.05 to 0.15 m ³ / m / min., Its form is not limited to the spray tube or the slit tube.
[0015]
The “recovery tank (V3)” shown in FIG. 1 and FIG. 2 is also used in the conventional manufacturing method, and is a third circulation line (electrical device) as shown in FIG. The resist solution is extracted from the lower part of the mixing tank (V1) by a pump (P3), and a filter (F31) (generally, a cartridge filter is used. The first and second circulation lines described above and the fourth described later). After removing foreign contaminants in the electrodeposition resist solution in advance in the circulation line, the particle filtration device (F32) (generally, a hollow fiber type ultrafilter is used) In the electrodeposition resist solution separated by the particle filtration device using a line for separating the components into the predetermined components in the electrodeposition resist solution and returning the separated components to a predetermined tank) Stabilizer component rich filtrate: once accept B, Supplemented as necessary resin component has been electrodeposition resist solution consumed in the process is for controlling electrodeposition resist solution in a predetermined composition range. The other component separated by the particle filtration device, that is, the resin component-rich filtrate A in the electrodeposition resist solution: A is circulated in the coating tank (V2) as shown.
[0016]
This is also used in the conventional manufacturing method. In the mixing tank (V1), the fourth circulation line as shown in FIG. 4, that is, the temperature of the electrodeposition resist is controlled. Circulation line (the electrodeposition resist solution is extracted from the lower part of the mixing tank (V1) with a pump (P4), and impurities in the electrodeposition resist solution are removed in advance with a filter (F4), and then a heat exchanger It is common to provide a configuration in which (H) is indirectly heated.
[0017]
Each of these circulation lines is, in principle, an individual line, but the suction of each pump (P1, P2, P3, P4) is all in the lower part of the mixing tank, and all the delivery side of each pump has a filter. Since (F1, F2, F31, F4) are provided, this part may be shared (the number of bases is not limited to one).
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail by taking one embodiment as an example.
[0019]
1. Structure of apparatus Each tank of the following specifications (the dimensions are internal dimensions) was prepared.
(1) Mixing tank: 350mm ^W x 830mm ^L x 720mm ^H
(2) Coating tank: 120mm ^W x 730mm ^L x 650mm ^H (The side wall is used as a diaphragm, and the bottom is opened to the mixing tank, which is built into the mixing tank)
The circulation lines were prepared individually for each of the first to fourth lines (the capacity of each system was designed to be as follows on the basis of the amount of circulation. Except as described above).
(1) First circulation line: 300 L / min. (Rectifier box as upper flow generating means-upper plate dimension: 120 mm ^W x 730 mm ^L , that is, the same size as the bottom of the coating tank, and a hole with a diameter of 3 mm Arranged at a pitch of 10 mm, so use a total of 792. Upflow rate: 3.424 m ³ / m ² / min.)
(2) Second circulation line: 80 L / min. (Spray pipe-spray nozzle: Ikeuchi CERJET 9050 as spraying means just below the coating tank (spray angle: 90 degrees. Since this spray nozzle is a fan type, the spray is the coating) The spray nozzle is expanded only in the width direction of the electrodeposit to be put into the tank, and the spray nozzle is installed with the nozzle axis set at 30 degrees downward with respect to the liquid level), and the number of the nozzles used is 19 / tube. (20-30 seconds / time, spray pressure: 1 kg / cm ² or more, spraying flow rate: 0.115 m ³ / m / min.)
(3) Third circulation line: 60-100 L / min. (The particle filter uses model number: UFD-9MHF-LT manufactured by Yuasa Corporation)
(4) Fourth circulation line: 100L / min.
The amount of the solution in the entire system is 300 L (liter).
[0020]
2. Preparation of electrodeposition resist solution A positive electrodeposition resist (trade name: PEPR2400ED) manufactured by Shipley Far East was diluted with pure water (mixing ratio = 1: 1).
[0021]
3. Preparation of electrodeposited sample A copper-clad laminate (Hitachi CCL substrate FR-4. 500 mm ^W x 500 mm ^L x 1.6 mm ^t ) having a copper foil with a thickness of 18 μm on its surface was prepared as an electrodeposit. .
[0022]
4). Production of electrodeposition coating characteristic confirmation test sample Using the apparatus described in item 1, electrodeposition is performed on the sample described in item 3 so that the resist thickness is 7 μm, using the electrodeposition resist solution described in item 2. (Here, in the present invention, all of the first to fourth circulation lines were operated, whereas in the test A for comparison, the first circulation line was used, and in the test B for comparison, the second circulation line was used. Each of the circulation lines was stopped). Each electrodeposit after electrodeposition was subjected to the following post-treatment in order to obtain samples for a property confirmation test of the electrodeposition coating film.
(1) Washing with water (2) Air knife (3) Hot air drying (105 ° C x 5 min.)
(4) Exposure (arbitrary single-sided. Equipment used: Model number manufactured by Hitec Corporation is HTE-102S)
(5) Development (immersion in 1.0% sodium carbonate aqueous solution for 120 seconds)
(6) Etching (etching solution: immersed in 50% nitric acid aqueous solution at room temperature for 4 minutes to remove the exposed copper foil)
[0023]
5). Each of the samples prepared in Section 4 for confirming the characteristics of the electrodeposition coating film was tested in the following manner.
(1) Presence / absence of resist covering failure Light is applied to the sample from the lower surface of the sample (including the surface from which the copper foil has been removed), and the resist covering failure location (where a pinhole is formed) is visually observed. did. The results are shown in Table 1. The measured range is the entire sample.
[0024]
[Table 1]

[0025]
(2) Film thickness uniformity The film thickness of the sample was measured with a microderm (trade name) manufactured by UPA. The number of measurement points per sample is 9 points. The results are shown in Table 1.
[0026]
[Table 2]

[0027]
【The invention's effect】
As described above, according to the production method and apparatus of the present invention, a good electrodeposition resist coating film having excellent film thickness uniformity and no pinholes can be formed.
[Brief description of the drawings]
FIG. 1 is a system diagram showing a configuration of a first circulation line according to the present invention (a tank is shown in cross section).
FIG. 2 is a system diagram showing the configuration of a second circulation line according to the present invention (the tank is shown in cross section).
FIG. 3 is a system diagram showing the configuration of a third circulation line (the tank is shown in cross section).
FIG. 4 is a system diagram showing the configuration of a fourth circulation line (the tank is shown in cross section).
FIG. 5 is a block diagram showing a basic configuration of an image forming method for plating or etching using an electrodeposition resist.
[Explanation of symbols]
V1: Mixing tank V2: Coating V3: Recovery P1, P2, P3, P4: Pumps F1, F2, F31, F4: Filter F32: Particle filter B: Flow path switching valve H: Heat exchanger

Claims

In the electrodeposition process, the electrodeposition resist solution is forcibly flowed from the lower part to the upper part of the coating tank during the electrodeposition process. A method of producing an electrodeposition product, comprising: depositing an electrodeposition resist solution immediately below the surface of the coating bath when the electrodeposit is put into the coating bath.

The manufacturing method according to claim 1, wherein the coating tank is a tank provided in the mixing tank as a tank whose side wall is a diaphragm and whose bottom surface is open to the mixing tank.

The upward flow of the electrodeposition resist solution is made to flow uniformly in the cross section of the coating tank perpendicular to the flow, and the flow rate is 3.0 to 4.0 m ³ / m ² / min. Item 3. The method according to Item 1 or 2.

The above-mentioned electrodeposition resist solution is connected to the delivery of the pump, and is a box disposed immediately below the coating tank, and has through holes disposed at an equal pitch on the upper plate. The method according to claim 3, wherein the electrodeposition resist solution is ejected from the box.

The spray flow of the electrodeposition resist solution is jetted uniformly in the width direction of the electrodeposit toward the front and back surfaces of the electrodeposit, and the flow rate is 0.05 to 0.15 m ³ / m. The method according to claim 1 or 2, which is / min.

The dispersion of the electrodeposition resist solution is connected to the delivery of the pump, and is arranged in parallel so as to sandwich the front and back surfaces of the electrodeposit to be fed into the coating tank, immediately below the liquid surface of the coating tank. A spray nozzle provided at an equal pitch so that the two pipes face each other in the axial direction of the pipe, or a slit formed so that the two pipes face each other in the axial direction of the pipe The manufacturing method of Claim 5 performed by the electrodeposition resist liquid sprayed more.

7. The method according to claim 1, wherein the electrodeposits are a printed wiring board, a lead frame, an IC package, a plastic film having a conductive film formed on the surface thereof, an injection molded board, a silicon wafer, and a metal plate. The production method described in 1.

An electrodeposition resist coating product manufacturing apparatus that stores at least an electrolytic resist solution circulation line and an electrodeposition resist solution having a predetermined composition, and also functions as a pump well for circulation of the electrodeposition resist solution. A mixing tank; and a coating tank for accommodating an electrodeposition provided as a tank having a diaphragm as a side wall and a bottom surface opened in the mixing tank, and performing an electrodeposition operation. The circulation line draws at least the electrodeposition resist solution from the lower part of the mixing tank and discharges it directly below the coating tank so that the flow rate is uniform in the cross section of the coating tank. A first circulation line for forming a flow of the electrodeposition resist solution flowing upward from the top, and the electrodeposition resist solution is extracted from the lower part of the mixing tank and immediately below the liquid level of the coating tank, A second circulation line for discharging toward the front and back surfaces of the electrodeposit to be fed into the coating tank and for uniformly spreading the electrodeposition resist solution in the width direction of the electrodeposit A device characterized by being.

The upward flow forming means of the electrodeposition resist solution is a box connected to the delivery of the pump and arranged immediately below the coating tank, and the electrodeposition resist solution is rectified on the upper plate. The apparatus according to claim 8, wherein the discharge holes are box bodies arranged at an equal pitch.

The upward flow forming means for forming the electrodeposition resist solution causes the upward flow formed thereby to flow uniformly in the coating tank over the entire cross section, and the flow rate is 3.0 to 4.0 m. The apparatus according to claim 9, wherein a through hole is arranged so as to be ³ / m ² / min.

The electrodeposition resist solution spraying means is connected to the delivery of the pump, and is arranged in parallel with the coating tank directly below the liquid level so as to sandwich the front and back surfaces of the electrodeposit to be fed into the coating tank. A pipe having a spray nozzle arranged at an equal pitch in the axial direction of the pipe, or a slit formed in the axial direction of the pipe so that they are opposed to each other. 9. The apparatus according to 8.

The spraying means for the electrodeposition resist solution is uniformly sprayed in the width direction of the electrodeposited object toward the front and back surfaces of the electrodeposited object to be applied to the coating tank. The apparatus according to claim 11, wherein a spray nozzle or a slit is provided so that the flow rate is 0.05 to 0.15 m ³ / m / min.