JP3858805B2 - ボンディングワイヤー用極細線不良品選別方法 - Google Patents

ボンディングワイヤー用極細線不良品選別方法 Download PDF

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JP3858805B2
JP3858805B2 JP2002312231A JP2002312231A JP3858805B2 JP 3858805 B2 JP3858805 B2 JP 3858805B2 JP 2002312231 A JP2002312231 A JP 2002312231A JP 2002312231 A JP2002312231 A JP 2002312231A JP 3858805 B2 JP3858805 B2 JP 3858805B2
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wire
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defective products
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剛 田村
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Sumitomo Metal Mining Co Ltd
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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Description

【０００１】
【発明の属する技術分野】
本発明は半導体装置を組み立てる際に使用するボンディング用極細線の製品管理に関し、具体的には不良品の検出方法に関する。
【０００２】
【従来の技術】
半導体装置の高密度化の要請より、半導体素子を実装する際に使用されるボンディングワイヤーも、その線径が極めて細いものが要求されるようになってきた。このようにして用いられるボンディング用極細線は電気的特性、加工性などの面から純度９９．９９％の金や金合金を棒状インゴットとし、これを、ダイスを用いた引き抜き加工により得ている。
【０００３】
このようにして得られたボンディング用極細線を用いボールボンディングをすると、例えば図１に示すように、形成されたルーフが予期せぬ形に変形してしまうとことがあるという問題が生じる。この様な事態が発生した場合、最悪、結線同士が短絡して組み立てた半導体装置が不良品となる。よって、このような変形を生じるボンディング用極細線は不良品として出荷されるべきではない。
【０００４】
本発明者は、従来行われていなかったボンディングワイヤーの断面形状との関連を含め、ボンディング用極細線の特性、組成等と、ボールボンディング時にループ異常を発生させる不良品との関連を検討し、ボンディング用極細線の断面形状とループ異常とが密接な関係を有することを見いだした。なお、この記載より明らかなように先行文献は見いだされていない。
【０００５】
【発明が解決しようとする課題】
即ち、本発明の目的は、不良ボンディング用極細線の検出を容易に行うための方法の提供を目的とする。
【０００６】
【課題を解決するための手段】
上記課題を解決する本発明の管理方法は、ダイスの引き抜き加工により得られるボンディング用極細線の不良品検出において、引き抜き加工後のボンディング用極細線の線方向に対して直角となる断面の、最大直径と最小直径の差が線径の３％を越えるものを不良品とするものである。
【０００７】
【発明の実施の形態】
従来、得られるボンディングワイヤー用極細線の断面形状は、引き抜き加工で使用したダイスの孔の形状から推定しており、正確な測定や管理と言った事は行われていなかった。しかし、近年こうした極細線の断面形状を高い精度で測定する装置、例えばズムバッハ（Ｚｕｍｂａｃｈ）社製 ＤＵ６００Ｒ−ＯＬ−ＰＩを用いてボンディングワイヤー用極細線の断面形状を測定することにより、図１に示すループ異常はボンディング用極細線の断面形状が楕円、もしくはそれに近いゆがんだ状態の場合に起きることが見出された。従って、ループ異常を未然に防ぐ為にはボンディング用極細線の断面形状が楕円か、もしくはそれに近いゆがんだ状態のものであるか否かを確認し、これを除外すれば良好な製品の確保が可能となる。
【０００８】
本発明者はボンディング用極細線の断面形状とループ異常との関連を調べた結果、その最大直径と最小直径の差が線径の３％を越えないものを製品とすればループ異常は防止できることを見いだした。
【０００９】
【実施例】
次に実施例を用いて本発明をさらに説明する。
（実施例１）
ダイスを用いた引き抜き加工により得られた線径２５μｍのボンディング用極細線の断面形状をＺｕｍｂａｃｈ社製 ＤＵ６００Ｒ−ＯＬ−ＰＩ を用いてはかり、直径差が表１に示した７種類のものを用いてボンディングを行い、異常ループの発生率を調べた。表１において直径差の％表示の値は線径２５μｍを基準として求めたものである。
【００１０】
【００１１】
【表 １】
Figure 0003858805
【００１２】
表１より、引き抜き加工後のボンディング用極細線の断面形状を観察し、選別する事によって、半導体素子等の誤作動の原因となる回路の短絡を予め防止することが可能である。従って、半導体素子等の組立に於いて、検査工程の簡略や収率の改善に寄与し、ひいては総合的な信頼性の向上を計ることができる。
【００１３】
【発明の効果】
本発明では、引き抜き加工後のボンディング用極細線の線方向に対して直角となる断面の、最大直径と最小直径の差が線径の３％を越えるものを不良品とする。このことにより半導体素子等の誤作動の原因となる回路の短絡を予め防止することが可能である。従って、本発明は半導体素子等の組立に於いて、検査工程の簡略や収率の改善に寄与し、ひいては総合的な信頼性の向上を計ることができる。
【図面の簡単な説明】
【図１】ボンディング用極細湶をボールボンディングした際に発生するループ異常を示す。（ａ）は正常な状態を示した図であり、（ｂ）は異常な状態を示した図である。

Claims (1)

  1. ダイスの引き抜き加工により得られるボンディング用極細線の不良品検出において、引き抜き加工後のボンディング用極細線の線方向に対して直角となる断面の、最大直径と最小直径の差が線径の３％を越えるものを不良品とすることを特徴とする不良ボンディングワイヤー用極細線の選別方法。
JP2002312231A 2002-10-28 2002-10-28 ボンディングワイヤー用極細線不良品選別方法 Expired - Fee Related JP3858805B2 (ja)

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