JP3841748B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus including a peripheral exposure apparatus that exposes a peripheral portion of a substrate such as a semiconductor wafer.
[0002]
[Prior art]
The resist solution spin-coated on a substrate such as a semiconductor wafer is spread to the outer periphery of the substrate. The substrate on which the resist solution is applied is transported with its peripheral part (peripheral part) gripped. If the peripheral edge of the substrate is gripped during transportation, the resist formed on the peripheral edge of the substrate peels off and scatters, contaminating the resist thin film surface or contaminating other substrate surfaces, thereby reducing the yield. There is a case. Therefore, a peripheral exposure apparatus is used to expose the resist on the peripheral edge of the substrate in advance and to remove unnecessary resist on the peripheral edge of the substrate simultaneously with development of the resist pattern.
[0003]
6 and 7 are schematic block diagrams of the peripheral exposure apparatus. As shown in FIGS. 6 and 7, the peripheral exposure apparatus includes an ultraviolet irradiation unit 20 and an exposure unit 21. A light guide 22 for transmitting ultraviolet rays to the exposure unit 21 is attached to the ultraviolet irradiation unit 20. The light guide 22 is formed by bundling a plurality of optical fibers and covering the surface with a coating material. A lens barrel 23 that emits ultraviolet rays is attached to the tip of the light guide 22. A substrate on which a resist film is formed is disposed in the processing unit of the exposure unit 21, and ultraviolet rays are irradiated from the lens barrel 23 to the peripheral portion of the substrate surface. As a result, the peripheral edge of the substrate is exposed.
[0004]
As shown in FIGS. 6 and 7, the ultraviolet irradiation unit 20 and the exposure unit 21 are formed as separate devices. Then, the ultraviolet irradiation unit 20 and the exposure unit 21 are appropriately installed at close positions. FIG. 6 shows an ultraviolet irradiation unit 20 and an exposure unit 21 arranged side by side. FIG. 7 shows an arrangement in which the ultraviolet irradiation unit 20 is arranged on the upper part of the exposure unit 21.
[0005]
[Problems to be solved by the invention]
In the field of semiconductor manufacturing equipment, it is strongly demanded to improve processing efficiency and improve throughput.
[0006]
However, in the conventional peripheral exposure apparatus, the ultraviolet irradiation unit 20 and the exposure unit 21 are configured as independent apparatuses. Therefore, a space for individually arranging the ultraviolet irradiation unit 20 and the exposure unit 21 is required. In addition, it is necessary to supply power lines, signal lines, and the like individually, and space for that is also required. Furthermore, a space for routing the light guide 22 between the ultraviolet irradiation unit 20 and the exposure unit 21 is also required.
[0007]
The lens barrel 23 attached to the tip of the light guide 22 reciprocates on the substrate according to the exposure position. For this reason, as the lens barrel 23 is reciprocated, the light guide 22 is repeatedly bent. Since the portion where the bending action overlaps easily breaks, the light guide 22 is drawn along a relatively long path so as to maintain flexibility. For this reason, the routing space of the light guide 22 becomes large.
[0008]
Further, as shown in FIG. 7, when the ultraviolet irradiation unit 20 and the exposure unit 21 are arranged in the vertical direction, the length of the light guide 22 is increased in order to give the light guide 22 flexibility. For this reason, the height of the entire peripheral exposure apparatus is increased.
[0009]
As described above, the conventional peripheral exposure apparatus requires a large space for installation. Moreover, even if the ultraviolet irradiation unit 20 and the exposure unit 21 are arranged in the vertical direction, the height is increased, and it is difficult to save space by stacking with other substrate processing units. Therefore, there is a problem that the substrate processing efficiency cannot be improved by downsizing the entire peripheral exposure apparatus.
[0010]
SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus having a peripheral exposure apparatus that can be reduced in size, improved in substrate processing efficiency, and increased in the degree of freedom in setting the substrate processing order, and can be easily combined with other substrate processing units. Is to provide.
[0011]
[Means for Solving the Problems and Effects of the Invention]
According to a first aspect of the present invention, there is provided a substrate processing apparatus having a plurality of substrate processing units for performing various processes on a substrate, wherein a first transfer area and a second transfer area are provided on both sides of the substrate processing area. Each of the plurality of substrate processing units is provided in the substrate processing area, the first transport means for transporting the substrate is disposed in the first transport area, and the second transport means for transporting the substrate is the second transport. The plurality of substrate processing units disposed in the region includes a peripheral exposure unit, a first substrate processing unit, and a second substrate processing unit. The peripheral exposure unit includes a light source that generates light for exposure processing, and a light source. receiving light from an exposure unit for performing edge exposure processing of the substrate, the first substrate processing unit is disposed on at least one side of the upper and lower edge exposure unit, the second substrate processing Knit is disposed on the side surface side of the edge exposure unit and the first substrate processing unit along the first and second transfer region, the first substrate processing unit, a first conveying of the first transfer region And a substrate passing area for delivering the substrate between the means and the second conveying means in the second conveying area.
[0012]
In the substrate processing apparatus according to the first aspect of the invention, the peripheral exposure unit and the first substrate processing unit are stacked in the vertical direction. For this reason, space saving can be achieved compared with the case where each is arrange | positioned planarly, and the structure of the whole substrate processing apparatus can be reduced in size. In addition, the substrate processing efficiency can be improved by shortening the transport distance when transporting the substrate between the peripheral exposure unit and the first substrate processing unit arranged above and below. In addition, a series of substrate processing can be performed continuously.
[0013]
Further, the substrate can be transferred through the first substrate processing unit disposed on at least one of the upper side and the lower side of the peripheral exposure unit. As a result, the substrate is alternately delivered to the substrate processing unit capable of delivering the substrate only from the first transfer region side and the substrate processing unit capable of delivering the substrate only from the second transfer region side. Thus, the degree of freedom in setting the processing order of the substrates is increased, the processing efficiency of the substrates is improved, and the usability of the substrate processing apparatus is improved.
[0014]
Furthermore, a series of substrate processing can be continuously performed by combining various substrate processing units.
[0015]
A substrate processing apparatus according to a second invention is characterized in that, in the configuration of the substrate processing apparatus according to the first invention, the first substrate processing unit is a substrate processing unit that performs a substrate cooling process.
[0016]
In this case, the substrate can be delivered by passing through the substrate processing unit that performs the cooling process disposed on at least one of the upper side and the lower side of the peripheral exposure unit.
[0017]
A substrate processing apparatus according to a third aspect of the invention is characterized in that, in the configuration of the substrate processing apparatus according to the first aspect of the invention, the first substrate processing unit is a substrate processing unit that heats the substrate.
[0018]
In this case, the substrate can be delivered through the substrate processing unit that performs the heat treatment disposed on at least one of the upper side and the lower side of the peripheral exposure unit.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic block diagram of a peripheral exposure apparatus according to an embodiment of the present invention. In the peripheral exposure apparatus 1, an exposure unit 2, an ultraviolet irradiation unit 3, an electrical unit 4, and a controller board (not shown) are incorporated in one frame body 5.
[0020]
The ultraviolet irradiation unit 3 is incorporated in the lower part of the frame 5. The ultraviolet irradiation unit 3 is configured to generate ultraviolet rays for exposing a resist film on a substrate surface such as a semiconductor wafer. A light guide 6 is connected to the ultraviolet emission port of the ultraviolet irradiation unit 3.
[0021]
The light guide 6 is formed by bundling a plurality of optical fibers and covering the surface with a coating material. The light guide 6 is arranged to extend upward from the side surface of the ultraviolet irradiation unit 3. Further, a lens barrel 7 that emits ultraviolet rays is connected to the tip of the light guide 6.
[0022]
FIG. 2 is a cross-sectional view showing a detailed structure of the guide mounting portion 40 of the light guide 6. The guide mounting part 40 includes a fixing bracket 48 fixed to the emission port 31 of the ultraviolet irradiation part 3. The fixture 48 is formed in a cylindrical shape, and is attached so that its central axis coincides with the optical axis 33 of the ultraviolet rays 32 from the lamp.
[0023]
A light guide incident end fitting 41 is attached to the incident side end of the light guide 6. The light guide incident end fitting 41 has first to third cylindrical portions 41a to 41c having different diameters. A bearing 43 is inserted into the second cylindrical portion 41b having the second diameter. An inner ring 43 a of the bearing 43 is fixed to the light guide incident end fitting 41 by a stopper 44. Further, the outer ring 43 b of the bearing 43 is inserted into the recess 48 a of the fixing bracket 48. Further, the holding plate 45 is fixed to the surface of the fixing bracket 48 with a set screw 46 in a state where the bearing 43 is inserted into the recess 48 a.
[0024]
In the assembled state, the light guide 6 is held so as to be rotatable around the optical axis 33 together with the inner ring 43 a of the bearing 43. Further, the holding plate 45 prevents the drawing in the direction of the optical axis 33.
[0025]
FIG. 3 is an explanatory diagram for explaining the operation of the light guide 6 accompanying the movement of the lens barrel 7. As described above, the guide attachment portion 40 rotatably attaches the light guide 6 to the emission port 31 of the ultraviolet irradiation portion 3 via the bearing 43. Therefore, when the lens barrel 7 reciprocates in the X-axis direction during peripheral exposure, the lens barrel 7 rotates around the central axis of the guide mounting portion 10 as indicated by an arrow B in the vicinity of the guide mounting portion 40 of the light guide 6. For this reason, the light guide 6 swings around the guide mounting portion 40 while maintaining a substantially straight state in the vertical direction. Therefore, the light guide 6 hardly undergoes bending deformation.
[0026]
Referring again to FIG. 1, the exposure unit 2 is disposed above the ultraviolet irradiation unit 3. The exposure unit 2 includes a mechanism for holding and rotating the substrate and a mechanism for performing exposure processing while moving the lens barrel 7 to a predetermined position.
[0027]
The electrical unit 4 is provided adjacent to the exposure unit 2. The power supply line 4a, the signal line 4b, and the vacuum line 4c are drawn into the electrical equipment unit 4 from the outside, and then distributed to the ultraviolet irradiation unit 3, the exposure unit 2, and the like. The electrical unit 4 controls current and signal control operations or vacuuming operations via the exposure unit 2, the ultraviolet irradiation unit 3, wiring lines connected to the controller board, vacuum lines, and the like. In addition, the electrical unit 4 collectively transfers power and signals between the outside and the inside of the peripheral exposure apparatus.
[0028]
This peripheral exposure apparatus 1 accommodates the functions of the ultraviolet irradiation unit and the exposure unit inside the frame 5 and shortens the wiring path between the functional units, thereby individually separating the conventional ultraviolet irradiation unit and the exposure unit. The size is reduced compared to the case of stacking. Moreover, as described above, the light guide 6 is rotatably attached to the emission port 31 of the ultraviolet irradiation unit 3 via the bearing 43 (see FIG. 2). Therefore, even if the lens barrel 7 reciprocates and the light guide 6 is swung, there is no risk of breakage or the like. For this reason, the length of the light guide 6 is formed shorter than the conventional one. When the light guide 6 is shortened, the loss of light during transmission is reduced and the light transmission efficiency is improved. Moreover, the height of the peripheral exposure apparatus 1 is formed lower than a conventional apparatus in which an ultraviolet irradiation apparatus and an exposure unit are stacked.
[0029]
FIG. 4 is a perspective view schematically showing an arrangement example of each unit of the substrate processing apparatus incorporating the peripheral exposure apparatus 1 shown in FIG. In this substrate processing apparatus, the peripheral exposure apparatus 1 shown in FIG. 1 is used as one substrate processing unit that performs substrate processing (exposure processing). Therefore, the peripheral exposure apparatus 1 shown in FIG.
[0030]
The peripheral exposure unit 1 is incorporated in the upper part of another substrate processing unit 8. Further, other substrate processing units 9 and 10 are arranged on the side surfaces of the substrate processing unit 8 and the peripheral exposure unit 1. As the substrate processing unit 8, a cooling plate for cooling the substrate or a hot plate for heating the substrate is disposed.
[0031]
If the peripheral exposure unit 1 and the substrate processing unit 8 made of a hot plate or a cooling plate are arranged in the vertical direction, the transport distance when transporting the exposed substrate to the cooling plate or the hot plate is shortened. For this reason, the processing efficiency of the substrate is improved.
[0032]
FIG. 5 is a schematic configuration diagram of the entire substrate processing apparatus including each substrate processing unit shown in FIG. The substrate processing apparatus 11 has a substrate processing region in which the peripheral exposure unit 1 and the substrate processing units 8 to 10 shown in FIG. Transfer areas 16 and 17 are provided on both sides of the substrate processing area, respectively. In each of the transfer areas 16 and 17, transfer robots 14 and 15 for transferring the substrate 18 are installed. The transfer robots 14 and 15 deliver the substrate 18 to a predetermined substrate processing unit while holding the substrate 18 horizontally.
[0033]
As shown in FIG. 5, a substrate processing unit 8 composed of a cooling plate or a hot plate is disposed below the peripheral exposure unit 1. The cooling plate or the hot plate has openings for loading and unloading the substrates 18 on the transfer area 16 side and on the transfer area 17 side opposite thereto.
[0034]
Therefore, the substrate 18 can be delivered between the transport region 16 side and the transport region 17 facing the space through the space region connecting the openings. For this reason, after processing is first performed by the substrate processing apparatus that can deliver only from the transfer region 16 side, the substrate 18 is transferred to the transfer region 17 side on the opposite side through the substrate processing unit 8, and the transfer region 17 is further transferred. The substrate 18 can be supplied to a substrate processing unit that can be transferred only from the side.
[0035]
In FIG. 5, the peripheral exposure unit 1 is arranged at the end of the transport areas 16 and 17, but the position of the peripheral exposure unit 1 can be arranged at an appropriate position according to the procedure of each process. . Further, another substrate processing unit may be provided on the upper part of the peripheral exposure unit 1.
[Brief description of the drawings]
FIG. 1 is a schematic block diagram of a peripheral exposure apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing a light guide attached state.
FIG. 3 is an explanatory view showing a turning state of the light guide.
FIG. 4 is a perspective view showing an arrangement example of a peripheral exposure unit in the substrate processing apparatus.
FIG. 5 is a schematic configuration diagram of an entire substrate processing apparatus including a peripheral exposure unit according to the present invention.
FIG. 6 is a schematic view showing an example of the arrangement structure of a conventional peripheral exposure apparatus.
FIG. 7 is a schematic view showing another example of the arrangement structure of a conventional peripheral exposure apparatus.
[Explanation of symbols]
1 Peripheral exposure equipment (peripheral exposure unit)
DESCRIPTION OF SYMBOLS 2 Exposure part 3 Ultraviolet irradiation part 5 Frame 6 Light guide 7 Lens barrel 8-10 Substrate processing unit 11 Substrate processing apparatus

Claims (3)

In a substrate processing apparatus having a plurality of substrate processing units for performing various processes on a substrate,
A first transfer region and a second transfer region are provided on both sides of the substrate processing region, respectively, and the plurality of substrate processing units are arranged in the substrate processing region,
A first transport means for transporting a substrate is disposed in the first transport area; a second transport means for transporting a substrate is disposed in the second transport area;
The plurality of substrate processing units include a peripheral exposure unit, a first substrate processing unit, and a second substrate processing unit,
The peripheral exposure unit includes a light source that generates light for exposure processing, and an exposure unit that receives the light from the light source and performs peripheral exposure processing of the substrate ,
The first substrate processing unit is disposed on at least one of an upper side and a lower side of the peripheral exposure unit,
The second substrate processing unit is disposed on a side surface side of the peripheral exposure unit and the first substrate processing unit along the first and second transfer regions,
The first substrate processing unit has a substrate passage region for delivering a substrate between the first transport unit in the first transport region and the second transport unit in the second transport region. A substrate processing apparatus comprising the substrate processing apparatus. The substrate processing apparatus according to claim 1 , wherein the first substrate processing unit is a substrate processing unit that performs a substrate cooling process. The substrate processing apparatus according to claim 1 , wherein the first substrate processing unit is a substrate processing unit that heat-treats a substrate.

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