JP3834566B2 - Pitch variable machining method using multi-type wire saw and multi-type wire saw - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pitch variable processing method using a multi-type wire saw for processing (cutting, cutting, etc.) various workpieces and a multi-type wire saw, and in particular, the processing pitch can be changed finely. The present invention relates to a pitch variable processing method and a multi-type wire saw.
[0002]
[Prior art]
Conventionally, as a method for cutting a ceramic green sheet for producing a laminated chip part or the like, main methods are (1) press cutting, (2) blade cutting, and the like.
[0003]
(1) Press-cutting is a method of making a cut by pressing a cutting blade having no shear angle against the laminated ceramic green sheets.
[0004]
(2) Blade cutting is a method of cutting a laminated ceramic green sheet with a rotary blade.
[0005]
In both cases, the table on which the ceramic green sheet is placed moves at a predetermined pitch in accordance with the chip size (size for cutting the ceramic green sheet) to define the cutting position. These methods are disadvantageous in terms of process lead time because the cuts are made one by one in order.
[0006]
Problems in cutting ceramic green sheets, part 1 is that ceramic green sheets are: (1) dimensional error in electrode pattern,
(2) Stacking error when stacking
(3) The distortion error at the time of crimping is included.
[0007]
Since these errors exist, in the case of fixed-size cutting (for example, the moving distance of the work table is set to a fixed size), it leads to the occurrence of defects such as the internal electrode pattern protruding from the cut-out chip parts. Accordingly, it is necessary to perform cutting while correcting the cutting position in consideration of these dimensional errors. Therefore, the use of a multi-slicer (having a plurality of rotary blades having a predetermined pitch) having a fixed pitch is required. It is difficult, and it is necessary to rely on a method by sequential processing, which is an obstacle to shortening the lead time of the above process.
[0008]
The problem in cutting ceramic green sheets, part 2, is the miniaturization of products. In other words, with the recent reduction in size and size of electronic devices, the size of chip parts used in the devices is less than 1005 (1.0 × 0.5 × 0.5 mm), and 0402 (0.4 × 0.2). × 0.2mm) and is becoming smaller. Therefore, in the above-described press-cutting, the cutting surface is distorted and distorted due to narrow pitch cutting and processing load, and blade cutting causes problems such as chipping and breakage due to chipping. .
[0009]
On the other hand, the wire saw attaches abrasive grains to the wire (hangs free abrasive grains, which are a mixture of abrasive grains and cutting oil, on the traveling wire) and cuts a workpiece such as a semiconductor ingot with the abrasive grains. It is expected to solve the problems caused by the processing load of push cutting and the high speed rotary blade of blade cutting.
[0010]
Also, a multi-type machine that processes a workpiece by running a wire by forming a wire row by winding a wire between a plurality of work rollers that have been subjected to grooving according to the processing pitch. Wire saws are also known. The advantage of the multi-type wire saw is that it can cut and process narrow pitches at a number of locations (for the number of wires in the wire array) at once, and is widely used for cutting and grooving electronic components. This multi-type wire saw has the potential to reduce the lead time of the ceramic green sheet cutting process.
[0011]
However, the multi-type wire saw is suitable for cutting and processing at a predetermined pitch, but it is difficult to change the processing pitch according to the workpiece having a dimensional error. Although it is possible to change the pitch by providing a plurality of independent work rollers, it is difficult when the processing pitch is small. In other words, in the current multi-type wire saw, there is no method for correcting the dimensional error (there is a dimensional error for each sheet) of the ceramic green sheet. It is difficult to put the cutting into practical use.
[0012]
In addition, as a well-known example of a multi-type wire saw, there exist the following patent document 1, patent document 2, patent document 3, and patent document 4.
[0013]
[Patent Document 1]
JP-A-5-185419 [Patent Document 2]
JP-A-8-323741 [Patent Document 3]
JP-A-9-155717 [Patent Document 4]
[Patent Document 1] Japanese Patent Laid-Open No. 2003-19711
Patent Document 1 shows a cutting method and a cutting apparatus for a workpiece by a wire saw for stably obtaining a wafer having a small undulation and a uniform thickness.
[0015]
In Patent Document 2, when a silicon semiconductor single crystal ingot or the like is cut into a wafer shape, a wire saw apparatus and a workpiece that can freely control the warpage of the wafer by displacing the roller of the wire saw in the axial direction. Shows the cutting method.
[0016]
In Patent Document 3, in a multi-type wire saw provided with a work table that is movable in the vertical direction and the crossing direction with respect to a wire row, a wire saw device with high dimensional accuracy and excellent productivity and a method for cutting a workpiece. Show.
[0017]
Patent Document 4 shows a method of manufacturing a ceramic substrate by bonding a plurality of ceramic sintered bodies having a uniform internal density and cutting with a multi-type wire saw while avoiding the bonding portion.
[0018]
As outlined, none of the patent documents discloses a method for correcting a processing position for a workpiece having a dimensional error for each sheet, such as the ceramic green sheet.
[0019]
[Problems to be solved by the invention]
This invention is made | formed in view of said point, The process pitch by the wire row | line stretched | interposed between the said rollers is made by inclining the several roller wound around the wire, maintaining the mutual parallel. Can be variably adjusted, and by extension, a multi-type wire saw using a multi-type wire saw and a multi-type wire saw capable of simultaneously cutting or grooving a plurality of positions on a workpiece having a dimensional error such as a ceramic green sheet. The purpose is to provide a saw.
[0020]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0021]
[Means for Solving the Problems]
In order to achieve the above object, a variable pitch machining method using a multi-type wire saw according to the invention of claim 1 of the present invention is to wind a wire between a pair of opposing work rollers having a plurality of grooves at a predetermined pitch interval. In the case of forming a wire row and processing a workpiece with the wire row,
A pair of work rollers which the counter while keeping parallel to each other, said to be inclined so as to be non-perpendicular to the running direction of the wire columns, varying the processing pitch of the workpiece by the wire column It is characterized by.
The pitch variable processing method using the multi-type wire saw according to the invention of claim 2 of the present invention forms a wire row by winding a wire between a pair of opposing work rollers having a plurality of grooves at a predetermined pitch interval. In the case of processing a workpiece with the wire row,
The pair of opposing work rollers are kept in parallel with each other, and the processing pitch of the workpiece by the wire row is varied by inclining the pair of opposing work rollers with respect to a plane perpendicular to the ascending / descending direction of the workpiece. Yes.
[0022]
The pitch variable type machining method using the multi-type wire saw according to the invention of claim 3 of the present application is the pitch variable machining method according to claim 1, wherein the pair of opposing work rollers are left or right in a horizontal plane while being kept parallel to each other. And the pitch of the wire row is variable.
[0023]
The pitch variable machining method using the multi-type wire saw according to the invention of claim 4 is the method of claim 2 , wherein the opposing pair of work rollers are moved upward or downward in a vertical plane while being kept parallel to each other. The pitch of the wire rows is varied by inclining in the direction.
[0024]
The variable pitch processing method using the multi-type wire saw according to the invention of claim 5 is characterized in that, in claim 1, 2 , 3 or 4 , the workpiece and the wire in the wire row are imaged by an imaging means. The processing position and the processing pitch of the wire row are corrected.
[0025]
The multi-type wire saw according to the invention of claim 6 forms a wire row by winding a wire between a pair of opposing work rollers having a plurality of grooves at a predetermined pitch interval, and is processed by the wire row. In the configuration to process things,
In order to change the processing pitch of the workpiece by the wire row , the pair of opposed work rollers are inclined so as to be non-perpendicular to the traveling direction of the wire row while being kept parallel to each other . A roller swing mechanism is provided.
The multi-type wire saw according to the invention of claim 7 of the present application forms a wire row by winding a wire between a pair of opposing work rollers having a plurality of grooves at predetermined pitch intervals, and is processed by the wire row. In the configuration to process things,
In order to make the processing pitch of the workpiece by the wire row variable, the roller swing that inclines the pair of opposing work rollers with respect to a plane perpendicular to the ascending / descending direction of the workpiece while keeping them parallel to each other. It features a moving mechanism.
[0026]
A multi-type wire saw according to the invention of claim 8 of the present application has image pickup means for picking up an image of the workpiece and the wire in the wire row according to claim 6 or 7 , and based on an image pickup result of the image pickup means. It is characterized by correcting the processing position and processing pitch of the wire row.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a variable pitch processing method using a multi-type wire saw and a multi-type wire saw according to the present invention will be described below with reference to the drawings.
[0028]
FIG. 1 is a schematic view of a multi-type wire saw according to a first embodiment of the present invention. The multi-type wire saw includes a wire saw body and a workpiece 1 such as a ceramic green sheet that is a processing target. And a work table 2 which is horizontally placed and positioned, and the work table 2 is a Z table having a lifting function. A wire supply reel 3 and a wire take-up reel 4 are rotatably provided in the wire saw body, and a single wire W made of a steel wire fed from the supply reel 3 absorbs the looseness of the wire W. After being wound a plurality of times between a pair of work rollers (main rollers) 61 and 62 facing each other in parallel via the tension control mechanism 51, the take-up reel 4 is again routed via the tension control mechanism 52. Rolled up. Here, the pair of work rollers 61 and 62 are rotatably supported by the roller rocking mechanism 6 and the central axes of the rollers 61 and 62 can be inclined in the left-right direction within a horizontal plane.
[0029]
As shown in the plan view of FIG. 2A and the perspective view of FIG. 2B, the pair of work rollers 61 and 62 are arranged in parallel with each other in a horizontal plane and are rotatable. 62 each has a plurality of wire grooves (grooves formed so as to make one round of the outer periphery) at a constant pitch interval, and the wire W passes through each work roller 61, 62 in order and is one wire groove. From the first wire groove to the other wire groove, and the winding interval of the wire W is made uniform. As a result, a wire row WL having a uniform wire arrangement interval (pitch) is formed between the two work rollers 61 and 62 in the horizontal position.
[0030]
Then, one of the pair of work rollers 61, 62, for example, the work roller 61, is rotated forward and backward by a drive motor, so that the wire row WL performs a reciprocating linear motion.
[0031]
In this state, the work table 2 is raised (or the wire row WL is lowered) to press the workpiece 1 against the wire row WL that reciprocates linearly with a predetermined force from below, and abrasive grains are included in the machining portion. While supplying the slurry, it is cut into a plurality of layers at a desired pitch interval.
[0032]
As described above, when the two work rollers 61 and 62 are kept in a parallel arrangement in a horizontal plane, and set to be perpendicular to the traveling direction of the wire row WL (work roller inclination angle θ = 0 °). The wire pitch is the maximum, and the dimension of the processing pitch of the workpiece 1 cut under this condition is also the maximum (in FIG. 2, the position of the two-dot chain line). Further, when the central axis of the rollers 61, 62 is inclined in the horizontal direction by an inclination angle θ (θ> 0) in the roller swing mechanism 6 of FIG. 1 (the central axis of the work roller is the wire row WL). As shown in FIG. 2, the plane view wire row changes from a two-dot chain line with an inclination angle θ of 0 ° to a solid line (when the wire interval is narrowed, that is, the wire). The pitch decreases). The machining pitch dimension of the workpiece 1 cut by the wire row under such a condition of the inclination angle θ is cos θ times when the inclination angle is zero.
[0033]
According to the first embodiment, the following effects can be obtained.
[0034]
(1) A wire row WL is formed by winding a wire W between a pair of work rollers 61 and 62 facing each other while maintaining a plurality of grooves at a predetermined pitch interval, and the wire row WL. In the case of processing the workpiece (cutting or forming a groove), the pair of work rollers 61 and 62 are inclined in the horizontal plane in the horizontal plane with respect to the traveling direction of the wire row WL while being kept parallel. The pitch of the wire rows WL can be variably adjusted. For this reason, when a large number of processings are required at a fine pitch, it can be applied to, for example, cutting a ceramic green sheet when manufacturing chip components such as capacitors and coils.
[0035]
Conventionally, a rotary blade type slicer or a push cutting with a blade is used for the cutting, and a workpiece such as a ceramic green sheet with material expansion and contraction is simultaneously processed with a wire saw with a fixed cutting pitch. Cutting has been considered difficult. According to the configuration of the present embodiment, by changing the inclination angle θ of one work roller 61, 62, the pitch of the wire rows WL is changed in accordance with the dimensional error caused by the expansion / contraction of the workpiece. Etc. can be processed.
[0036]
(2) Multi-type wire saws can be applied to the processing of workpieces that could not be used because the pitch is fixed, compared to the case of processing one place at a time (one wire at a time). Productivity can be greatly improved by several tens to several hundred times.
[0037]
In the first embodiment, the target workpiece is a ceramic green sheet horizontally supported by the work table 2 (for example, laminated and pressure-bonded thick film ceramic green sheets patterned with electrodes). Yes, since the heights of the wire rows WL need to be uniform, the swinging inclination of the work rollers 61 and 62 is in the horizontal direction in the horizontal plane, but if conditions permit (for example, the work piece bottom surface is supported by a table) The effect is the same even if the rocking inclination is in the vertical direction (vertical direction).
[0038]
An example of the swing inclination in the vertical direction (vertical direction) is shown in FIGS. 3A and 3B as the second embodiment of the present invention. 3A is a plan view, and FIG. 3B is a perspective view. A pair of work rollers 61 and 62 parallel to each other are rotatably supported by the roller swinging mechanism 6 of FIG. The central axes 61 and 62 can be inclined. The other mechanisms are the same as in FIG.
[0039]
In this case, when the work rollers 61 and 62 are in the horizontal position (inclination angle θ = 0 °), they are indicated by a two-dot chain line, and tilted to a predetermined angle θ (θ> 0) upward or downward. As shown in FIG. 3, the plane view wire row changes from a one-dot chain line in which the two work rollers 61 and 62 are horizontal (inclination angle θ is 0 °) to a solid line (the wire pitch itself is The machining pitch is narrowed by the tilt of the work rollers 61 and 62 when viewed from the work piece which is not changed but is horizontally arranged). The machining pitch dimension of the workpiece 1 cut by the wire row under the condition of the inclination angle θ is cos θ times the machining pitch when the inclination angle is zero.
[0040]
A third embodiment of the present invention that uses image processing together will be described with reference to FIGS. In the third embodiment, an electrode-patterned thick film ceramic green sheet is laminated and pressure-bonded to a predetermined chip component size (eg, 3216, 1608, 1005, 0402, etc.), each having a long side and a short side of 10 ^{− The} process of cutting into ¹ mm) will be described as an example. In this case, as shown in FIG. 4, a processing mark (position reference mark) 13 for image processing is attached to a rectangular ceramic green sheet 11 as a workpiece, and this is imaged by a camera as an imaging means. To do. The multi-type wire saw has the same configuration as that shown in FIGS.
[0041]
The chip component group 12 formed on the ceramic green sheet 11 is started from a multi-type wire saw having a wire row pitch corrected to a processing pitch with processing marks 13 attached to four corners of the green sheet 11 as reference points. Cut along the horizontal cutting line HCL. In this case, the correction of the cutting position and the processing pitch is performed based on the position of the processing mark 13 and the distance between the processing marks, and the processing pitch is calculated by apportioning the dimensional error of the workpiece and cutting is performed at an equal pitch. To do.
[0042]
FIG. 5 is a flowchart in that case. First, a processing mark 13 attached to a ceramic green sheet as a workpiece is imaged by an image processing camera provided in a multi-type wire saw having a variable pitch function. By detecting the position, a position to be processed on the workpiece (processing start point on the workpiece) is determined. Next, the distance between the plurality of processing marks 13 is detected, the processing pitch is corrected, and the planned processing dimensions are determined. Then, the position which should be processed first with a wire is determined by imaging a wire row | line | column and detecting the position (it is made to correspond with the starting point of the process on a workpiece). Further, the wire row pitch is detected, the difference between the planned machining dimension and the wire row pitch (the correction amount of the wire row pitch) is calculated, and the two work rollers 61 and 62 in FIG. In the horizontal plane, it is tilted so as to have a predetermined angle θ in the right direction or the left direction, and the pitch of the plane view wire row is made to match the planned processing dimension. Again, after imaging the wire row from the image processing camera and verifying the optimization of the correction amount of the pitch of the wire row that matches the planned processing dimensions, the wire row is lowered to the workpiece on the work table, Alternatively, the work table can be raised to bring the workpiece into contact with the wire row and cut to the desired dimensions.
[0043]
When the ceramic green sheet is cut into chip parts, the vertical and horizontal dimensions of the chip parts are different as described above (1.0 × 0.5 mm, etc.). In this case, two countermeasures are prepared, the cutting along the horizontal cutting line HCL in FIG. 4 is performed by the first apparatus, and the cutting along the vertical cutting line VCL is performed by the second apparatus. Each may be performed according to the process flow of FIG.
[0044]
In addition to using two devices, there are the following measures.
[0045]
(1) A wire is wound around two predetermined areas (pitch) of a work roller with two desired dimensions (pitch), and the workpiece (ceramic green sheet) is moved in the axial direction of the work roller, and cut in each dimension area. I do. That is, the horizontal direction cutting line HCL of FIG. 4 performs the cutting process in the region of the first pitch wire row corresponding thereto, and the vertical direction cutting line VCL is the region of the second pitch wire row corresponding thereto. Execute the disconnection process with. In this case, a 90 ° rotation function (θ table) is added to the work table (Z table in FIG. 1).
[0046]
{Circle around (2)} Two work roller units having different wire line pitches are arranged, and a workpiece is conveyed between the units to obtain a desired cutting dimension.
[0047]
As described above, by using a multi-type wire saw equipped with an image processing camera and having a pitch variable function, a wire array is used to correct dimensional variations for each workpiece, misalignment of processing marks, etc. It is possible to minutely change the processing pitch by, and high-precision processing is possible.
[0048]
In addition, a multi-type wire saw having a variable pitch function equipped with an image processing camera can also be used for setting conditions when the size of a product that remains uncut is important, such as cutting.
[0049]
In addition, even when the workpiece does not reach the target dimensions due to changes in the processing conditions, the processing pitch can be finely adjusted without reworking the work roller.
[0050]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.
[0051]
【The invention's effect】
As explained above, the conventional multi-type wire saw can be processed many times at once, but it cannot be processed according to the object by changing the pitch or the processing dimensions cannot be finely adjusted. Met. According to the present invention, since the processing pitch when processing a workpiece with a wire array can be varied, a wire saw can be used for processing a member (cutting or grooving) that could not be used because the pitch is fixed. As a result, the productivity can be improved drastically by several tens to several hundred times as compared with the case of processing one place at a time.
[0052]
Further, by combining the function of changing the pitch of the wire row and the position correction function by image processing, simultaneous cutting or simultaneous grooving with a minute change in the position and size of the workpiece can be performed.
[0053]
In addition, it is possible to variably adjust the pitch of the wire row even when setting the conditions when the uncut product dimensions are important, such as cutting, and the work piece can be processed by changing the processing conditions. Even if it does not become the size of, there is an advantage that can be dealt with by finely adjusting the processing pitch without remaking the roller.
[Brief description of the drawings]
FIG. 1 is a front view showing a schematic configuration of a first embodiment of a variable pitch processing method using a multi-type wire saw and a multi-type wire saw according to the present invention.
FIGS. 2A and 2B show a state where the center axis of the work roller is inclined in the horizontal direction in a horizontal plane in the first embodiment, where FIG. 2A is a plan view and FIG. 2B is a perspective view.
FIG. 3 is a second embodiment of the present invention in a state where the central axis of the work roller is inclined in the vertical direction, (A) is a plan view, and (B) is a perspective view.
FIG. 4 is a plan view showing a ceramic green sheet as a workpiece in the third embodiment that uses image processing of the present invention together, and an example with a processing mark (position reference mark) attached thereto.
FIG. 5 is a flowchart for explaining a process flow in the case of the third embodiment;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Workpiece 2 Work table 3 Wire supply reel 4 Wire take-up reel 6 Roller swing mechanism 11 Ceramic green sheet 12 Chip component 13 Processing mark 51, 52 Tension control mechanism 61, 62 Work roller W Wire WL Wire row HCL Horizontal direction Processing line VCL Longitudinal processing line θ Inclination angle

Claims (8)

In a processing method using a multi-type wire saw that forms a wire row by winding a wire between a pair of opposing work rollers having a plurality of grooves at a predetermined pitch interval, and processes a workpiece in the wire row ,
A pair of work rollers which the counter while keeping parallel to each other, said to be inclined so as to be non-perpendicular to the running direction of the wire columns, varying the processing pitch of the workpiece by the wire column A pitch-variable machining method using a multi-type wire saw characterized by this. In a processing method using a multi-type wire saw that forms a wire row by winding a wire between a pair of opposing work rollers having a plurality of grooves at a predetermined pitch interval, and processes a workpiece in the wire row ,
The pair of opposing work rollers are kept in parallel with each other, and the machining pitch of the workpiece by the wire row is varied by inclining the pair of opposing work rollers with respect to a plane perpendicular to the ascending / descending direction of the workpiece. Pitch variable type machining method using a multi-type wire saw. The pitch variable type using the multi-type wire saw according to claim 1, wherein the pitch of the wire row is varied by inclining the pair of opposing work rollers leftward or rightward in a horizontal plane while being kept parallel to each other. Processing method. The pitch variable using the multi-type wire saw according to claim 2 , wherein the pitch of the wire row is varied by inclining the pair of opposing work rollers upward or downward in a vertical plane while being kept parallel to each other. Formula processing method. Wherein the wire and the workpiece the wire rows imaged by the imaging unit, according to claim 1 for correcting the machining position and the machining pitch of the wire column, variable pitch with multi-type wire saw of 3 or 4, wherein Formula processing method. In a multi-type wire saw that forms a wire row by winding a wire between a pair of opposed work rollers having a plurality of grooves at a predetermined pitch interval, and processes a workpiece in the wire row,
In order to change the processing pitch of the workpiece by the wire row , the pair of opposed work rollers are inclined so as to be non-perpendicular to the traveling direction of the wire row while being kept parallel to each other . A multi-type wire saw characterized by a roller swing mechanism. In a multi-type wire saw that forms a wire row by winding a wire between a pair of opposed work rollers having a plurality of grooves at a predetermined pitch interval, and processes a workpiece in the wire row,
  In order to make the processing pitch of the workpiece by the wire row variable, the roller swing that inclines the pair of opposing work rollers with respect to a plane perpendicular to the ascending / descending direction of the workpiece while keeping them parallel to each other. Multi-type wire saw characterized by having a moving mechanism. The multi-type wire according to claim 6 or 7 , further comprising an imaging unit that images the workpiece and the wire of the wire row, and correcting a machining position and a machining pitch of the wire row based on an imaging result of the imaging unit. Saw.

Images