JP3827314B2 - Inductive device manufacturing method - Google Patents

Description

The present invention, coils, transformers, the method for manufacturing an inductive device using a magnetic induction phenomenon such as common mode choke coils, in particular high performance, a manufacturing method of inductive devices the elements of narrow tolerance good mass productivity can be created.

Conventionally, as a method for producing this type of inductive device, the following methods are roughly classified.
(1) Winding method A wire is wound around a magnetic or nonmagnetic core, and is the most common method.
(2) Method of forming by build-up As shown in Patent Document 1 below, a helical coil is formed by alternately laminating an insulating substrate and an insulating layer on which a coil conductor forming a part of a helical is formed.
(3) Method of the following patent document 2 (unpublished and not a known technique) proposed by the present applicant

JP 2002-134321 A Japanese Patent Application No. 2002-262372

Each of the above methods has the following problems.
(1) Winding method a. Although the performance as a coil is good, there is a tendency that the tolerance increases.
b. Winding work is required, resulting in poor mass production and high cost.
(2) Method of forming by build-up a. When the number of turns increases, the tolerance increases due to the increase in the number of layers.
b. When the number of windings increases, the number of stacked layers increases and mass productivity decreases.
(3) Method of Patent Document 2 proposed by the applicant The collective substrate is used in the manufacturing process, but in this case, there are the following problems.
a. The thicknesses of the core substrate and the insulating layer vary, and the pitches in the X direction and Y direction of the element arrangement on the collective substrate are not constant.
b. This causes a decrease in yield (open failure due to poor connection between coil conductors) and a variation in inductance value due to a variation in coil inner diameter.
c. In the case where the core substrate and / or the insulating layer is an organic material, the above problem is particularly remarkable, and new problems of warpage and cracking occur.
d. It is difficult to align the front and back between the strip conductors on both sides of the core substrate, resulting in a decrease in yield and an increase in inductance tolerance.

  In view of the above points, the present invention has a first object to provide an inductive device with high performance and narrow tolerance, and also provides a method for manufacturing an inductive device capable of producing the inductive device with high yield and high productivity. This is the second purpose.

  Other objects and novel features of the present invention will be clarified in embodiments described later.

In order to achieve the above object, an inductive device manufacturing method according to the invention of claim 1 of the present invention forms a plurality of strip-like conductor patterns on the front and back surfaces of an organic core substrate having a core material, which is formed on a prepreg or an adhesive sheet. A laminating process in which a plurality of sheets are pressed and integrated through an insulating layer;
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern .

In the inductive device manufacturing method according to the second aspect of the present invention, a plurality of strip-shaped conductor patterns and an insulating layer covering the plurality of strip-shaped conductor patterns are formed on the front and back surfaces of an organic core substrate having a core material, and the adhesive layer is formed. A stacking process in which a plurality of sheets are pressed and integrated through
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to claim 3 of the present application, a plurality of strip-like conductor patterns are formed on one side of an organic core substrate having a core material, and a plurality of these are laminated via an insulating layer of a prepreg or an adhesive sheet. A laminating process for pressing and integrating;
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to claim 4 of the present application, a plurality of strip-shaped conductor patterns and an insulating layer covering the strip-shaped conductor patterns are formed on one surface of an organic core substrate having a core material. A lamination process in which a plurality of sheets are stacked and pressed to be integrated;
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

The inductive device manufacturing method according to claim 5 of the present invention is characterized in that, in claim 2, 3 or 4 , the insulating layer is polished to adjust the thickness.

The method for manufacturing an inductive device according to the invention of claim 6 is characterized in that, in claim 3 or 4 , the thickness of the organic core substrate having the core material is adjusted by polishing the surface without the strip-like conductor pattern. It is a feature.

The inductive device manufacturing method according to the invention of claim 7 is the method of claim 1, 2 , 3, 4, 5 or 6 , wherein after the slicing step, the slice surface is polished to adjust the thickness. It is a feature.

The inductive device manufacturing method according to claim 8 of the present application is the method according to claim 1, 2 , 3, 4, 5, 6 or 7 , wherein the organic conductor substrate having the core material is transferred with the strip-shaped conductor pattern. It is characterized by being provided.

In the inductive device manufacturing method according to the invention of claim 9 of the present application, a plurality of inorganic sintered core substrates each having a plurality of strip-like conductor patterns formed on the front and back surfaces are stacked and pressed through an insulating layer of a prepreg or an adhesive sheet. Integrated lamination process;
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to the invention of claim 10 of the present application, an insulating layer covering the plurality of strip-shaped conductor patterns is formed on the front and back surfaces of the inorganic sintered body core substrate in which a plurality of strip-shaped conductor patterns are formed on the front and back surfaces. , A laminating step in which a plurality of sheets are pressed and integrated through an adhesive layer,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to the invention of claim 11 of the present application, a plurality of inorganic sintered core substrates each having a plurality of strip-like conductor patterns formed on one side are pressed and laminated together via an insulating layer of a prepreg or an adhesive sheet. Laminating process
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to the invention of claim 12 of the present application, an insulating layer that covers the plurality of strip-shaped conductor patterns is formed on the one surface of the inorganic sintered body core substrate in which the plurality of strip-shaped conductor patterns are formed on one surface. A stacking process in which a plurality of sheets are pressed and integrated through an adhesive layer,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

In the inductive device manufacturing method according to the invention of claim 13 of the present invention, an adhesive insulating layer is formed by bonding a plurality of strip-shaped conductor patterns on the front and back surfaces of an organic core substrate having a core material and an inorganic sintered body core substrate. A stacking process in which a plurality of sheets are alternately stacked and pressed and integrated,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the multilayer slice into individual chips so as to have at least one helical coil composed of the strip-like conductor pattern and the bridged conductor pattern.

The inductive device manufacturing method according to claim 14 of the present application is characterized in that, in claim 9, 10, 11, 12 or 13 , the insulating layer is polished to adjust the thickness.

A method for manufacturing an inductive device according to the invention of claim 15 of the present application is characterized in that, in claim 11 or 12 , the surface of the inorganic sintered core substrate without the strip-like conductor pattern is polished to adjust the thickness. It is said.

The inductive device manufacturing method according to claim 16 of the present application is the method of claim 9, 10, 11, 12, 13 , 14 or 15 , wherein after the slicing step, the slice surface is polished to adjust the thickness. It is characterized by that.

An inductive device manufacturing method according to claim 17 of the present application is characterized in that, in claim 9, 10, 11, 12, 13 , 14, 15 , or 16 , the inorganic sintered body is a porous ceramic. Yes.

An inductive device manufacturing method according to claim 18 of the present application is characterized in that, in claim 9, 10, 11, 12, 13 , 14, 15 , or 16 , the inorganic sintered body is a magnetic body. .

  According to the present invention, a high performance, narrow tolerance inductive device can be manufactured with high yield and high productivity.

  Also, when using an inorganic sintered body core substrate as the core substrate, the deformation due to shrinkage, warpage, etc. due to the temperature of the core substrate is small and excellent in dimensional stability. Yield is improved and cost reduction can be realized. Further, when a porous ceramic is used as the inorganic sintered body core substrate, the machinability is good, the strength of the substrate is higher than that of only the organic substrate, and the handling is good. Furthermore, when a magnetic material is used as the inorganic sintered body core substrate, the magnetic permeability can be increased, and thus there is an advantage that the coupling between the helical coils can be strengthened when a transformer is formed.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an inductive device manufacturing method will be described below with reference to the drawings as the best mode for carrying out the present invention.

  A first embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 1A, in the band-shaped conductor manufacturing process, an organic core substrate 1 having a core material is prepared, and through use of front and back alignment through holes 9 formed in a plurality of locations on the substrate 1, A plurality of parallel strip conductor patterns 2 are formed on the front and back surfaces of 1.

  An organic core substrate 1 having a core material is obtained by impregnating a resin with a core material such as a resin cloth such as glass cloth or Kepler, or a porous sheet of fluororesin (trade name: Teflon). Reinforced with. In addition, for the purpose of controlling the linear expansion coefficient and improving electrical characteristics, for example, a resin added with a spherical silica filler, a ferroelectric powder such as barium titanate, or a ferrite powder (composite) Ferrite) and the like are also preferably used. The type of resin is preferably a high-Q, low-dielectric constant material such as vinylbenzyl resin for high-frequency parts such as a high-frequency coil.

  The plurality of parallel strip conductor patterns 2 are formed by a conductor layer patterning method using a subtractive method, a semi-additive method, a full additive method such as transfer, or the like. The subtractive method is a method in which a resist layer corresponding to the strip-shaped conductor pattern 2 is formed on a conductor layer, and a conductor layer not covered with the resist layer is removed by etching, which is the most common method for producing a printed wiring board. Is the method. The semi-additive method forms a resist layer on the underlying conductor layer, exposes the underlying conductor layer portion corresponding to the strip-shaped conductor pattern 2, and forms a conductor layer to be the strip-shaped conductor pattern 2 by electroplating with a desired thickness. This is a method of removing an unnecessary underlying conductor layer portion after the formation.

  Next, as shown in FIG. 1B, in the laminating step, a plurality of parallel strip conductor patterns 2 formed on the front and back surfaces of the organic core substrate 1 having a core material are used as an interlayer insulating layer (prepreg, adhesive sheet). A plurality of layers are stacked through 3 (however, an insulating layer is also provided on the lowermost layer and the uppermost layer so that the conductive pattern 2 is not exposed), and heated and pressurized to be laminated and integrated to obtain a laminated substrate 10. The material of the interlayer insulating layer 3 and the lowermost and uppermost insulating layers may be the same as that of the core substrate 1, and the interlayer insulating layer 3 may or may not have a core material.

  In the laminating step, the prepreg or adhesive sheet to be the interlayer insulating layer 3 and the substrate 1 are alternately stacked and stacked together by hot press or vacuum press, and alignment is performed so that the substrate 1 is accurately overlapped when viewed from above. There is a need. As an alignment method, pin alignment, alignment by an image, an external dimension of the substrate 1 is accurately obtained, and at least two sides thereof are pressed against an alignment mold formed with high accuracy. As the prepreg, for example, a vinylbenzyl resin containing glass cloth, and as the adhesive sheet, an adhesive film GF3600 manufactured by Hitachi Chemical Co., Ltd. having moderate fluidity (can absorb the irregularities of the conductor pattern 2) can be preferably used. Note that it is preferable that the thickness of the prepreg or the adhesive sheet as the interlayer insulating layer 3 is as thin as possible in order to improve the pitch accuracy in the stacking direction.

  After the laminating step, in the slicing step as shown in FIG. 1C, the laminated substrate obtained in the laminating step is cut along a cutting line P that crosses the strip-shaped conductor pattern 2 with a cutting means such as a multi-wire saw or a multi-blade saw. It cut | disconnects and the lamination | stacking slice body 20 is produced.

  Next, as shown in FIG. 2A, the ends of the strip-like conductor pattern 2 exposed on the cut surface of the laminated slice body 20 in the bridged conductor forming step (the front side pattern and the back side pattern of the substrate 1) are connected. Cross-linked conductor patterns 21 are formed on both the front and back surfaces. Here, the bridging conductor pattern 21 constitutes a helical coil together with the strip-shaped conductor pattern 2 on the front and back of the substrate 1, and the formation of the bridging conductor pattern 21 is the same as in the case of the strip-shaped conductor pattern 2. The patterning of the conductor layer can be performed by the method or the full additive method.

  And the protective layer 25 is provided in the protective layer formation process of FIG.2 (B) so that the front and back of the lamination | stacking slice body 20 after formation of the bridge | crosslinking conductor pattern 21 may be covered. The protective layer 25 is preferably a resin such as epoxy, vinyl benzyl, polyimide, or the like, and a filler such as quartz added thereto, and a material similar to the organic core substrate 1 is more preferable in consideration of thermal expansion. In the protective layer 25, via holes 26 for exposing the end portions of the bridging conductor pattern 21 serving as the end portions of the helical coils are formed for connection between the terminal electrodes and the helical coils to be formed in a later step. As a method for forming the via hole 26, laser processing, sandblasting, or a method of forming a linear groove with a dicer is preferably used. In addition, it is preferable to form the via hole 26 by a photolithography method using a photosensitive epoxy or polyimide resin for the protective layer 25 in consideration of positional accuracy or mass productivity.

  Thereafter, in the terminal electrode forming step of FIG. 2C, the terminal electrode 30 connected to the end portion of the bridged conductor pattern 21 is a method similar to the formation of the strip-like conductor pattern 2 or the bridged conductor pattern 21, such as a subtractive method, It is formed by the additive method or the full additive method.

  Then, in the chip separation step of FIG. 2 (D), a cutting means such as a dicing saw cuts and separates the individual chip 40 of the inductive device having one (or plural) helical coils along the cutting lines Q1 and Q2. To do.

  After separation into chips 40, for example, an electroplating layer is formed in the order of nickel and tin by barrel electroplating treatment of the terminal electrode 30.

  Note that the electroplating treatment may be performed subsequent to the formation of the terminal electrode 30 in the terminal electrode formation step before chip separation.

  Examples of the types of the strip-like conductor pattern 2 and the bridged conductor pattern 21 include gold, silver, copper, and aluminum, but copper is preferable in consideration of electric resistance and cost during mass production.

  According to the first embodiment, the following effects can be obtained.

(1) The inductance value of the inductive device has a narrow tolerance for the following reasons.
a. Since the organic core substrate 1 has a core material, the curing shrinkage of the substrate is small, the dimensional stability is excellent, the variation in the substrate thickness is small, and the band-like conductor pattern 2 is formed on both sides of the substrate. The inner diameter of the coil is constant.
b. Shrinkage in the plane direction (direction perpendicular to the thickness) of the organic core substrate 1 having the core material is small, and the coil pitch accuracy is good.

(2) Yield is good for the following reasons.
Since the organic core substrate 1 having the core material has a small thickness variation and small shrinkage in the plane direction of the substrate as described above, the X direction and the Y direction of the element to be an inductive device formed on the organic core substrate 1 having the core material The accuracy of the direction arrangement pitch is good.

(3) Excellent in mass productivity for the following reasons.
a. Yield is good.
b. Since the organic core substrate 1 having the core material is used, the substrate strength is good and the substrate can be prevented from cracking in the process.

  A second embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 3A, in the strip conductor manufacturing process, a core substrate 1A is prepared, and a plurality of parallel strip conductor patterns 2 are formed on one surface of the substrate 1A.

  The core substrate 1A is a resin plate, or a resin cloth such as a glass cloth or Kepler, or a core material such as a porous sheet of fluororesin (trade name: Teflon), in which the resin plate is reinforced with a core material. Can be used. In addition, for the purpose of controlling the linear expansion coefficient and improving electrical characteristics, for example, the resin that is the main material is added with spherical silica filler, the addition of ferroelectric powder such as barium titanate, and the addition of ferrite powder Those obtained (composite ferrite) are also preferably used. The type of resin is preferably a high-Q, low-dielectric constant material such as vinylbenzyl resin for high-frequency parts such as a high-frequency coil. Further, as the core substrate 1A, an inorganic substrate such as quartz, glass, alumina, or ferrite may be used. Further, when not used at a high frequency, a metal substrate such as a permalloy substrate and a thin sheet of permalloy laminated with a thin insulating layer may be used. However, in the case of a metal substrate, an insulating adhesive sheet is provided on the side where the strip-shaped conductor pattern 2 is provided.

  The formation of the plurality of parallel strip conductor patterns 2 can be performed by the same method as in the first embodiment.

  Next, as shown in FIG. 3B, in the laminating step, a plurality of parallel strip-like conductor patterns 2 formed on one side of the core substrate 1A are provided via an interlayer insulating layer (prepreg, adhesive sheet) 3. Stacking (however, an insulating layer is also provided on the uppermost layer so that the conductor pattern 2 is not exposed), heating and pressurizing are performed to integrate and obtain a laminated substrate 10A. When the core substrate 1A is an organic material, the material of the interlayer insulating layer 3 may be the same as that of the core substrate 1A. When the interlayer insulating layer 3 is a resin layer, the core material may or may not be present. Moreover, when using an inorganic material for the interlayer insulation layer 3, it laminates | stacks on both sides on both sides of a thin insulating adhesive sheet. As the adhesive sheet used here, an adhesive film GF3600 manufactured by Hitachi Chemical Co., Ltd., which has moderate fluidity (can absorb the irregularities of the conductor pattern 2), and the like can be suitably used. Other conditions for the lamination process may be the same as those in the first embodiment.

  After the laminating step, in the slicing step as shown in FIG. 3C, the laminated substrate obtained in the laminating step is cut along a cutting line P that crosses the strip-shaped conductor pattern 2 by a cutting means such as a multi-wire saw or a multi-blade saw. Cut to produce a laminated slice 20A.

  Next, as shown in FIG. 4A, the ends of the strip-like conductor pattern 2 exposed on the cut surface of the laminated slice body 20A in the bridged conductor forming step (the patterns of the upper and lower sets of core substrate 1A) are connected to each other. The bridge | crosslinking conductor pattern 21 to be formed is formed. Here, the bridging conductor pattern 21 constitutes a helical coil together with the strip-shaped conductor pattern 2 of the two core substrates 1A that make a pair, and the formation of the bridging conductor pattern 21 is the same as in the case of the strip-shaped conductor pattern 2. The conductive layer can be patterned by a subtractive method, a semi-additive method, a full additive method, or the like.

  Thereafter, the protective layer forming step in FIG. 4B, the terminal electrode forming step in FIG. 4C, and the chip separating step in FIG. 4D can be performed in the same manner as in the first embodiment. However, in the chip separation step, the portion of the interlayer insulating layer is cut in the first embodiment, but in the second embodiment, the intermediate position of the thickness of the core substrate 1A is cut along the cutting line Q1. In other respects, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and details thereof are omitted.

  According to the second embodiment, the strip-shaped conductor pattern 2 may be formed only on one surface of the core substrate 1A, and the process can be simplified. In addition, it is possible to avoid a decrease in yield due to misalignment between the front and back conductor patterns, which becomes a problem when the strip-like conductor patterns 2 are formed on both surfaces of the substrate.

  In addition, as a laminating method in the laminating step in the second embodiment, a method in which a parallel strip conductor pattern is formed on one side of a core substrate is alternately reversed on a surface on which the parallel strip conductor pattern is formed. It is also possible to laminate.

  A third embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 5A, in the band-shaped conductor manufacturing process, an organic core substrate 1 having a core material is prepared, and front and back alignment through holes 9 formed in a plurality of locations on the organic core substrate 1 are used. A plurality of parallel strip conductor patterns 2 are formed on the front and back surfaces of the organic core substrate 1. This step is the same as in the first embodiment.

  Next, as shown in FIG. 5B, in the first laminating step, an interlayer insulating layer (on the front and back sides) is formed on the organic core substrate 1 on which the parallel strip-like conductor patterns 2 are formed on the front and back sides in the strip conductor manufacturing step. A prepreg 4 or an adhesive sheet) 4 is stacked and subjected to pressurization, heating, and the like to be laminated and integrated to produce a laminate 5 in which the substrate front and back are covered with the interlayer insulating layer 4. The interlayer insulating layer 4 is, for example, one using a vinyl benzyl resin as a prepreg, or one having moderate fluidity as an adhesive sheet (can absorb the irregularities of the conductor pattern 2), for example, an adhesive film manufactured by Hitachi Chemical Co., Ltd. GF3600 etc. can be used conveniently. Note that the upper and lower surfaces of the laminated body 5 are formed in planes parallel to each other, and it is also preferable to perform a polishing treatment as necessary in order to increase the thickness accuracy of the laminated body 5.

  Thereafter, as shown in FIG. 5C, in the second laminating step, the laminate 5 and the adhesive sheet 6 serving as an adhesive layer are alternately stacked, and are laminated together by heat press or vacuum press to produce a laminate substrate 10B. . In that case, it is necessary to align so that the laminated body 5 may overlap correctly seeing from the top. The alignment method can be performed in the same manner as in the first embodiment.

  The material of the adhesive sheet 6 used in the second laminating step is preferably a material having as little fluidity as possible at the time of pressing. For this purpose, for example, a technique such as increasing the degree of curing of the resin of the adhesive sheet can be applied. For the adhesive sheet 6, an adhesive film GF3500 manufactured by Hitachi Chemical Co., Ltd. with little fluidity can be suitably used. The adhesive sheet 6 is preferably as thin as possible for improving the pitch accuracy in the stacking direction (for aligning the cross-linked conductor pattern 21). Further, a conductive sheet may be used as the adhesive sheet 6. For example, a thin adhesive is applied to the front and back surfaces of a brass or aluminum substrate. As a result, the mechanical strength of the substrate and the laminate in the process can be further improved, and the pitch accuracy is improved.

  Thereafter, the slicing step in FIG. 5D, the bridging conductor forming step in FIG. 6A, the protective layer forming step in FIG. 5B, the terminal electrode forming step in FIG. 5C, and the FIG. The chip separation step can be performed in the same manner as in the first embodiment. The same reference numerals are given to the same or corresponding parts as in the first embodiment, and the details are omitted.

  According to the third embodiment, in the first stacking step, the interlayer insulating layer 4 is made as thin as possible, and the thickness accuracy of the stacked body 5 after forming the interlayer insulating layer is increased (if necessary, grinding with a grinder, etc. Polishing is performed), and in the second lamination step, the adhesive sheet 6 is made as thin as possible and the fluidity at the time of pressing is low, so that the pitch accuracy in the laminating direction of the element that becomes the inductive device included in the laminated substrate 10B is good. Thus, it is difficult for positional deviation between the cross-linked conductor pattern 21 and the strip-shaped conductor pattern 2 in the cross-linked conductor forming step of FIG. 6A to occur, and the yield can be further improved. Other functions and effects are the same as those of the first embodiment.

  The third embodiment can also be applied to the case where a strip conductor pattern is formed only on one side of the core substrate. In this case, similarly to the second embodiment, after connecting the strip-like conductor patterns of the upper and lower core substrates forming a pair with the bridging conductor pattern, the intermediate thickness position of the core substrate may be cut. However, the adhesive layer is limited to an insulating layer.

  A fourth embodiment of the present invention will be described with reference to FIGS. First, in the strip conductor manufacturing step of FIG. 7A, a prepreg to be the core substrate 7 is prepared, and the parallel strip conductor pattern 2 is formed with a predetermined thickness on the transfer substrate having conductivity by a pattern plating method. . Then, the prepreg is overlaid on the transfer substrate, pressurized (vacuum press) and heated to cure the prepreg, and then the transfer substrate is peeled off. Thereby, as shown in FIG. 7A, the parallel strip-like conductor pattern 2 is formed on one surface of the core substrate 7 by transfer. In addition, in order to transfer the parallel strip | belt-shaped conductor pattern 2, the core board | substrate 7 hardens | cures the resin sheet and prepreg which are in the semi-hardened state at the time of transcription | transfer. For example, a resin cloth such as glass cloth or Kepler, or a porous material such as a fluororesin (trade name: Teflon) porous sheet is impregnated with resin, and a resin plate is reinforced with a core material. In addition, for the purpose of controlling the linear expansion coefficient and improving electrical characteristics, for example, a resin added with a spherical silica filler, a ferroelectric powder such as barium titanate, or a ferrite powder (composite) Ferrite) and the like are also preferably used. The type of resin is preferably a high-Q, low-dielectric constant material such as vinylbenzyl resin for high-frequency parts such as a high-frequency coil. In this strip conductor manufacturing step, the parallel strip conductor pattern 2 is provided on one side of the core substrate 7 in a semi-cured state during transfer by transfer, so that the surface of the core substrate 7 onto which the conductor pattern 2 is transferred can be smoothed. Here, “smooth” indicates a surface state in which Rmax is 10 μm or less, preferably 5 μm or less, and most preferably 2 μm or less.

  Next, in the substrate thickness adjusting step of FIG. 7B, the surface opposite to the surface to which the conductor pattern 2 of the core substrate 7 is transferred is ground and polished by a polishing process so that the substrate thickness is a predetermined constant thickness. adjust.

  Next, as shown in FIG. 7C, in the laminating step, a plurality of parallel strip-like conductor patterns 2 formed on one side of the core substrate 7 are provided via an insulating adhesive sheet 8 that is as thin as possible as an adhesive layer. Sheet stacking (however, the adhesive sheet 8 is also provided on the uppermost layer so that the conductor pattern 2 is not exposed), heating and pressurization are performed to integrate the layers, thereby obtaining a multilayer substrate 10C. As the material of the adhesive sheet 8, an adhesive film GF3500 manufactured by Hitachi Chemical Co., Ltd. having a low fluidity can be preferably used.

  Thereafter, the slicing step in FIG. 7D, the bridging conductor forming step in FIG. 8A, the protective layer forming step in FIG. 7B, the terminal electrode forming step in FIG. The chip separation step can be performed in the same manner as in the second embodiment, and the same reference numerals are given to the same or corresponding parts as in the second embodiment, and the details are omitted.

  In the case of the fourth embodiment, the belt-like conductor pattern 2 is provided by transfer on one surface of the core substrate 7, and the surface on which the belt-like conductor pattern 2 is arranged is smoothed, and at the same time, in the substrate thickness adjusting step The core substrate thickness can be controlled to a constant thickness with high accuracy.

  Moreover, since both surfaces of the core substrate 7 are smooth, the adhesive sheet 8 can be thin and less fluid, and the pressing pressure in the laminating process can be reduced. For this reason, the pitch accuracy in the stacking direction is extremely good, and in addition to the effects of the second embodiment, the pitch accuracy in the stacking direction of the element that is an inductive device included in the stacked substrate 10C is extremely good. In addition, misalignment between the cross-linked conductor pattern 21 and the strip-shaped conductor pattern 2 in the cross-linked conductor forming step in FIG. 8A is less likely to occur, and the yield can be further improved.

  As a laminating method in the laminating step in the fourth embodiment, the parallel strip conductor pattern formed on one side of the core substrate is laminated by alternately inverting the plane on which the parallel strip conductor pattern is formed. It is also possible to do.

  In the first, second, or third embodiment described above, similarly to the fourth embodiment, a strip-shaped conductor pattern is formed on the core substrate surface by transfer, and the strip-shaped conductor pattern arrangement of the core substrate is performed. A configuration with a smooth side surface is possible.

  A fifth embodiment of the present invention will be described with reference to FIGS. In the fifth embodiment, an inorganic sintered body core substrate is used instead of an organic core substrate having a core material. First, as shown in FIG. 1A, in the band-shaped conductor manufacturing process, an inorganic sintered body core substrate 1 is prepared, and the substrate 1 is formed using the front and back alignment through holes 9 formed in a plurality of locations on the substrate 1. A plurality of parallel strip-like conductor patterns 2 are formed on the front and back surfaces. In this case, the conductor pattern 2 may be formed after the core substrate 1 is sintered, or a conductor paste may be provided on the unfired core substrate, and the conductor pattern 2 may be formed simultaneously with the firing of the core substrate 1.

  The inorganic sintered body core substrate 1 can be made of a magnetic material such as ferrite in consideration of magnetic characteristics, or can be made of a porous ceramic having good machinability during production.

  The plurality of parallel strip conductor patterns 2 are formed by a conductor layer patterning method using a subtractive method, a semi-additive method, a full additive method, or the like.

  Next, as shown in FIG. 1B, in the laminating step, a plurality of parallel strip conductor patterns 2 formed on the front and back surfaces of the inorganic sintered body core substrate 1 are formed as an interlayer insulating layer (prepreg, adhesive sheet) 3. A plurality of layers are stacked (provided that an insulating layer is also provided on the lowermost layer and the uppermost layer so that the conductive pattern 2 is not exposed), heated and pressurized to be laminated and integrated to obtain a laminated substrate 10. The interlayer insulating layer 3 may or may not have a core material.

  In the laminating step, the prepreg or adhesive sheet to be the interlayer insulating layer 3 and the substrate 1 are alternately stacked and stacked together by hot press or vacuum press, and alignment is performed so that the substrate 1 is accurately overlapped when viewed from above. There is a need. As an alignment method, pin alignment, alignment by an image, an external dimension of the substrate 1 is accurately obtained, and at least two sides thereof are pressed against an alignment mold formed with high accuracy. As the prepreg, for example, a vinylbenzyl resin containing glass cloth, and as the adhesive sheet, an adhesive film GF3600 manufactured by Hitachi Chemical Co., Ltd. having moderate fluidity (can absorb the irregularities of the conductor pattern 2) can be preferably used. Note that it is preferable that the thickness of the prepreg or the adhesive sheet as the interlayer insulating layer 3 is as thin as possible in order to improve the pitch accuracy in the stacking direction.

  After the laminating step, in the slicing step as shown in FIG. 1C, the laminated substrate obtained in the laminating step is cut along a cutting line P that crosses the strip-shaped conductor pattern 2 with a cutting means such as a multi-wire saw or a multi-blade saw. It cut | disconnects and the lamination | stacking slice body 20 is produced.

  Next, as shown in FIG. 2A, the ends of the strip-like conductor pattern 2 exposed on the cut surface of the laminated slice body 20 in the bridged conductor forming step (the front side pattern and the back side pattern of the substrate 1) are connected. Cross-linked conductor patterns 21 are formed on both the front and back surfaces. Here, the bridging conductor pattern 21 constitutes a helical coil together with the strip-shaped conductor pattern 2 on the front and back of the substrate 1, and the formation of the bridging conductor pattern 21 is the same as in the case of the strip-shaped conductor pattern 2. The patterning of the conductor layer can be performed by the method or the full additive method.

  And the protective layer 25 is provided in the protective layer formation process of FIG.2 (B) so that the front and back of the lamination | stacking slice body 20 after formation of the bridge | crosslinking conductor pattern 21 may be covered. The protective layer 25 is preferably a resin such as epoxy, vinyl benzyl, polyimide, or the like, and a filler such as quartz added thereto. In the protective layer 25, via holes 26 for exposing the end portions of the bridging conductor pattern 21 serving as the end portions of the helical coils are formed for connection between the terminal electrodes and the helical coils to be formed in a later step. As a method for forming the via hole 26, laser processing, sandblasting, or a method of forming a linear groove with a dicer is preferably used. In addition, it is preferable to form the via hole 26 by a photolithography method using a photosensitive epoxy or polyimide resin for the protective layer 25 in consideration of positional accuracy or mass productivity.

  Thereafter, in the terminal electrode forming step of FIG. 2C, the terminal electrode 30 connected to the end portion of the bridged conductor pattern 21 is a method similar to the formation of the strip-like conductor pattern 2 or the bridged conductor pattern 21, such as a subtractive method, It is formed by the additive method or the full additive method.

  Then, in the chip separation step of FIG. 2 (D), a cutting means such as a dicing saw cuts and separates the individual chip 40 of the inductive device having one (or plural) helical coils along the cutting lines Q1 and Q2. To do.

  After separation into chips 40, for example, an electroplating layer is formed in the order of nickel and tin by barrel electroplating treatment of the terminal electrode 30.

  Note that the electroplating treatment may be performed subsequent to the formation of the terminal electrode 30 in the terminal electrode formation step before chip separation.

  Examples of the types of the strip-like conductor pattern 2 and the bridged conductor pattern 21 include gold, silver, copper, and aluminum, but copper is preferable in consideration of electric resistance and cost during mass production.

  According to the fifth embodiment, the following effects can be obtained.

(1) The inductance value of the inductive device has a narrow tolerance for the following reasons.
a. Since it is an inorganic sintered body core substrate 1, the helical coil is coupled with the fact that the substrate has small curing shrinkage, excellent dimensional stability, less substrate thickness variation, and the formation of the strip-like conductor pattern 2 on both surfaces of the substrate. The inner diameter is constant.
b. Shrinkage in the plane direction (direction perpendicular to the thickness) of the inorganic sintered body core substrate 1 is small, and the coil pitch accuracy is good.

(2) Yield is good for the following reasons.
As described above, the inorganic sintered body core substrate 1 has a small thickness variation and a small shrinkage in the plane direction of the substrate. Therefore, the elements in the X direction and the Y direction of the element to be an inductive device formed on the inorganic sintered body core substrate 1 The accuracy of the arrangement pitch is good.

(3) Excellent in mass productivity for the following reasons.
a. Yield is good.
b. Since the inorganic sintered body core substrate 1 is used, the substrate strength is good and the substrate can be prevented from cracking in the process.

  A sixth embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 3A, in the band-shaped conductor manufacturing step, an inorganic sintered body core substrate 1A is prepared, and a plurality of parallel band-shaped conductor patterns 2 are formed on one surface of the inorganic sintered body core substrate 1A.

  The inorganic sintered body core substrate 1A is made of ferrite, ceramic, or the like, and a high-Q, low-dielectric constant material is preferable for high-frequency components such as a high-frequency coil.

  The formation of the plurality of parallel strip conductor patterns 2 can be performed by the same method as in the first embodiment.

  Next, as shown in FIG. 3B, in the laminating step, an interlayer insulating layer (prepreg, adhesive sheet) 3 is formed by forming a plurality of parallel strip conductor patterns 2 on one side of the inorganic sintered core substrate 1A. A plurality of layers are stacked (however, an insulating layer is also provided on the uppermost layer so that the conductor pattern 2 is not exposed), heated and pressed to be laminated and integrated to obtain a laminated substrate 10A. When the interlayer insulating layer 3 is a resin layer, the core material may or may not be present. Moreover, when using an inorganic material for the interlayer insulation layer 3, it laminates | stacks on both sides on both sides of a thin insulating adhesive sheet. As the adhesive sheet used here, an adhesive film GF3600 manufactured by Hitachi Chemical Co., Ltd., which has moderate fluidity (can absorb the irregularities of the conductor pattern 2), and the like can be suitably used. Other conditions for the lamination process may be the same as those in the first embodiment.

  After the laminating step, in the slicing step as shown in FIG. 3C, the laminated substrate obtained in the laminating step is cut along a cutting line P that crosses the strip-shaped conductor pattern 2 by a cutting means such as a multi-wire saw or a multi-blade saw. Cut to produce a laminated slice 20A.

  Next, as shown in FIG. 4A, the ends of the strip-like conductor pattern 2 exposed on the cut surface of the laminated slice body 20A in the bridged conductor forming step (the patterns of the upper and lower sets of core substrate 1A) are connected to each other. The bridge | crosslinking conductor pattern 21 to be formed is formed. Here, the bridging conductor pattern 21 constitutes a helical coil together with the strip-shaped conductor pattern 2 of the two core substrates 1A that make a pair, and the formation of the bridging conductor pattern 21 is the same as in the case of the strip-shaped conductor pattern 2. The conductive layer can be patterned by a subtractive method, a semi-additive method, a full additive method, or the like.

  Thereafter, the protective layer forming step in FIG. 4B, the terminal electrode forming step in FIG. 4C, and the chip separating step in FIG. 4D can be performed in the same manner as in the first embodiment. However, in the chip separation step, the portion of the interlayer insulating layer is cut in the first embodiment, but in the sixth embodiment, the intermediate position of the thickness of the core substrate 1A is cut along the cutting line Q1. In other respects, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and details thereof are omitted.

  According to the sixth embodiment, the strip-like conductor pattern 2 may be formed only on one surface of the inorganic sintered body core substrate 1A, and the process can be simplified. In addition, it is possible to avoid a decrease in yield due to misalignment between the front and back conductor patterns, which becomes a problem when the strip-like conductor patterns 2 are formed on both surfaces of the substrate.

  In addition, as a laminating method in the laminating step in the sixth embodiment, a method in which a parallel strip conductor pattern is formed on one side of a core substrate, and a surface on which the parallel strip conductor pattern is formed are alternately inverted. It is also possible to laminate.

  A seventh embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 5A, in the band-shaped conductor manufacturing process, an inorganic sintered body core substrate 1 is prepared, and front and back alignment through holes 9 formed in a plurality of locations on the inorganic sintered body core substrate 1 are used. Then, a plurality of parallel strip conductor patterns 2 are formed on the front and back surfaces of the inorganic sintered body core substrate 1. This step is the same as in the first embodiment.

  Next, as shown in FIG. 5B, in the first laminating step, the inorganic sintered core substrate 1 on which the parallel strip-shaped conductor pattern 2 is formed on the front and back in the strip-shaped conductor manufacturing step, the interlayer is formed on the front and back. An insulating layer (prepreg or adhesive sheet) 4 is stacked and pressurized, heated, etc., and laminated and integrated to produce a laminate 5 in which the substrate front and back are covered with the interlayer insulating layer 4. The interlayer insulating layer 4 is, for example, one using a vinyl benzyl resin as a prepreg, or one having moderate fluidity as an adhesive sheet (can absorb the irregularities of the conductor pattern 2), for example, an adhesive film manufactured by Hitachi Chemical Co., Ltd. GF3600 etc. can be used conveniently. Note that the upper and lower surfaces of the laminated body 5 are formed in planes parallel to each other, and it is also preferable to perform a polishing treatment as necessary in order to increase the thickness accuracy of the laminated body 5.

  Thereafter, as shown in FIG. 5C, in the second laminating step, the laminate 5 and the adhesive sheet 6 serving as an adhesive layer are alternately stacked, and are laminated together by heat press or vacuum press to produce a laminate substrate 10B. . In that case, it is necessary to align so that the laminated body 5 may overlap correctly seeing from the top. The alignment method can be performed in the same manner as in the first embodiment.

  The material of the adhesive sheet 6 used in the second laminating step is preferably a material having as little fluidity as possible at the time of pressing. For this purpose, for example, a technique such as increasing the degree of curing of the resin of the adhesive sheet can be applied. For the adhesive sheet 6, an adhesive film GF3500 manufactured by Hitachi Chemical Co., Ltd. with little fluidity can be suitably used. The adhesive sheet 6 is preferably as thin as possible for improving the pitch accuracy in the stacking direction (for aligning the cross-linked conductor pattern 21). Further, a conductive sheet may be used as the adhesive sheet 6. For example, a thin adhesive is applied to the front and back surfaces of a brass or aluminum substrate. As a result, the mechanical strength of the substrate and the laminate in the process can be further improved, and the pitch accuracy is improved.

  Thereafter, the slicing step in FIG. 5D, the bridging conductor forming step in FIG. 6A, the protective layer forming step in FIG. 5B, the terminal electrode forming step in FIG. 5C, and the FIG. The chip separation step can be performed in the same manner as in the first embodiment. The same reference numerals are given to the same or corresponding parts as those in the fifth embodiment, and the details are omitted.

  According to the seventh embodiment, in the first stacking step, the interlayer insulating layer 4 is made as thin as possible, and the thickness accuracy of the stacked body 5 after forming the interlayer insulating layer is increased (if necessary, grinding with a grinder, etc. Polishing is performed), and in the second lamination step, the adhesive sheet 6 is made as thin as possible and the fluidity at the time of pressing is low, so that the pitch accuracy in the laminating direction of the element that becomes the inductive device included in the laminated substrate 10B is good. Thus, it is difficult for positional deviation between the cross-linked conductor pattern 21 and the strip-shaped conductor pattern 2 in the cross-linked conductor forming step of FIG. 6A to occur, and the yield can be further improved. Other effects are the same as in the fifth embodiment.

  The seventh embodiment can also be applied to the case where a band-like conductor pattern is formed only on one surface of the inorganic sintered body core substrate. In this case, similarly to the second embodiment, after connecting the strip-like conductor patterns of the upper and lower core substrates forming a pair with the bridging conductor pattern, the intermediate thickness position of the core substrate may be cut. However, the adhesive layer is limited to an insulating layer.

  The eighth embodiment of the present invention will be described with reference to FIG. Like the strip | belt-shaped conductor preparation process of FIG. 10 (A), the some parallel strip | belt-shaped conductor pattern 2 is formed in the front and back of the organic core board | substrate 1 which has a core material. The core substrate 1 may be made by reinforcing a resin plate made by impregnating a resin with a core material such as a glass cloth, a resin cloth such as a Kepler, or a porous sheet of fluororesin (trade name: Teflon). . In addition, for the purpose of controlling the linear expansion coefficient and improving electrical characteristics, for example, the resin that is the main material is added with spherical silica filler, the addition of ferroelectric powder such as barium titanate, and the addition of ferrite powder Those obtained (composite ferrite) are also preferably used. The type of resin is preferably a high-Q, low-dielectric constant material such as vinylbenzyl resin for high-frequency parts such as a high-frequency coil.

  The formation of the plurality of parallel strip conductor patterns 2 can be performed by the same method as in the first embodiment.

  Next, as shown in FIG. 10B, in the laminating step, the inorganic sintered body core substrate 50 having a plurality of parallel strip conductor patterns 2 formed on the front and back surfaces of the organic core substrate 1 having a core material, A plurality of sheets are alternately stacked via an adhesive interlayer insulating layer (adhesive sheet) 51, and heated and pressed to be laminated and integrated to obtain a laminated substrate 60.

  After the laminating step, in the slicing step as shown in FIG. 10C, a cutting line P crossing the strip-shaped conductor pattern 2 with the cutting means such as a multi-wire saw and a multi-blade saw in the laminating step in the laminating step. The laminated sliced body 70 is produced by cutting.

  Next, as shown in FIG. 10D, a bridged conductor pattern 21 that connects the ends of the strip-like conductor pattern 2 exposed on the cut surface of the laminated slice 70 in the bridged conductor forming step is formed. Here, the bridging conductor pattern 21 constitutes a helical coil together with the strip-like conductor pattern 2 of the two organic core substrates 1 that are paired with the inorganic sintered body core substrate 50 interposed therebetween. The conductive layer can be patterned by the subtractive method, the semi-additive method, the full-additive method, or the like, as in the case of the strip-shaped conductor pattern 2.

  The subsequent steps can be performed in the same manner as in FIGS. 2B, 2C, and 2D in the first embodiment. However, in the chip separation step, the portion of the interlayer insulating layer is cut in the first embodiment, but in the eighth embodiment, the intermediate position of the thickness of the organic core substrate (the virtual line S in FIG. 10D). ).

  In the case of the eighth embodiment, the same effects as those of the fifth embodiment described above can be obtained.

  FIG. 9 shows an example of a strip-shaped conductor pattern formed on the front and back of the core substrate, and FIG. 9A shows the parallel strip-shaped conductor pattern 2 exemplified in each embodiment. FIG. 9B shows a modified example of the strip-shaped conductor pattern 2 in which a wide conductor 28 serving as a connection end portion of the strip-shaped conductor pattern is embedded in the end portion of the substrate in order to increase the strength of the terminal electrode. FIG. 9C shows another modification in which the inductive device is a low-inductance product, and the middle one of the strip-shaped conductor pattern 2 is arranged obliquely.

  Hereinafter, the present invention will be described in detail with reference to examples.

  See FIG. 1 and FIG. 2: The details of each step are shown below.

(1) Band-shaped conductor manufacturing process A glass cloth-containing vinylbenzyl resin substrate (76 mm square, thickness 350 μm) was prepared as an organic core substrate having a core material. Next, parallel strip conductor patterns were formed on the front and back surfaces of the organic core substrate by copper plating by a semi-additive method, respectively. In the pattern, the conductor width was 35 μm (the end was 100 μm), the conductor interval was 20 μm, and the conductor height was 35 μm. The front and back alignment was performed as an alignment mark by drilling holes with a diameter of 0.2 mm at two locations on the substrate.

(2) Lamination process The organic core board | substrate and interlayer insulation layer which produced the strip | belt-shaped conductor pattern above were piled up alternately, and it heated and pressurized with the vacuum press, and was laminated | stacked collectively, and it was set as the laminated board. The number of laminated core substrates was set so that the thickness after pressing was 76 mm (138 sheets). As the interlayer insulating layer, a vinylbenzyl resin prepreg containing 200 μm thick glass cloth was used. The alignment was performed by pin alignment with holes having a diameter of 5 mm formed at the four corners of each substrate at fixed positions with respect to the parallel electrode pattern.

(3) Slicing step The laminated substrate was cut so that the thickness after cutting with a multi-wire saw was 0.45 mm to obtain a laminated sliced body. Thereafter, both sides of the sliced surface were polished by 50 μm, and the thickness of the laminated sliced body was adjusted to 350 μm.

(4) Bridged conductor formation process The bridged conductor pattern was created by copper plating by a semi-additive method. In the pattern, the conductor width was 35 μm (the end was 100 μm), the conductor interval was 20 μm, and the conductor height was 35 μm.

(5) Protective layer formation process The protective layer was formed with 50-micrometer-thick vinyl benzyl resin. Via holes were formed in the protective layer by sandblasting.

(6) Terminal electrode formation process The copper terminal electrode was formed by the semi-additive method. After chip separation, a nickel layer of 1 μm was formed on the terminal electrode by barrel plating, and a tin layer of 2 μm was formed thereon.

(7) Chip separation step Dicing was performed.

(8) Yield Yield when 10 sliced substrates are manufactured is 100% in process yield, about 10,000 pieces per substrate, about 100 out of a total of about 100,000 produced with 10 substrates When the characteristic inspection was performed, the characteristic inspection yield was 65% (the main cause of failure was disconnection due to pattern deviation), and the consistent yield was 65%.
Yield in process = {(number of substrates loaded−number of substrates out of wafer) / (number of substrates loaded)} × 100 (%)
(Number of wafer-out substrates: Number of substrates removed in the process due to cracks, poor appearance, etc.)
The determination criteria for the characteristic inspection were inductance value: reference value ± 2%, Q ≧ 45 at 1 GHz, DC resistance Rdc: reference value ± 30%. Moreover, the inductance value (L value) variation of non-defective products was 3.2% at 3σ / X (where σ: standard deviation, X: average value).
(Consistent yield) = (in-process yield) x (characteristic inspection yield)

Comparative Example 1
When the core material cloth is not inserted into the core substrate in Example 1, the yield is 20% in the process (the cause of failure is cracking in the process), the inspection yield is 20% (the main cause of failure is disconnection due to pattern deviation), and the consistent yield. 4%. The inductance value variation of the non-defective product was 6.7% at 3σ / X.

  3 and 4, the same as Example 1 except for the following.

(1) Strip conductor manufacturing process Patterning was performed only on one side.

(2) Laminating process As the interlayer insulating layer, a vinylbenzyl resin prepreg having a thickness of 50 μm and having no cloth was used.

(3) Yield When 10 slice substrates are manufactured, the yield is 100% in the process, the inspection yield is 72% (the main cause of failure is disconnection due to pattern deviation), and the consistent yield is 72%. The inductance value variation of non-defective products was 2.1% at 3σ / X. The improvement in yield compared to Example 1 is due to the improvement in alignment accuracy between the strip-like conductor patterns that form a pair in the upper and lower sides.

  In addition, as a lamination | stacking method in the lamination | stacking process in Example 2, what formed the parallel strip | belt-shaped conductor pattern in the single side | surface of a core substrate is laminated | stacked by alternately inverting the surface in which the said parallel strip | belt-shaped conductor pattern is formed. Is also possible.

  5 and FIG. 6, the same as Example 1 except for the following.

(1) 1st lamination process,
A glass cloth-containing vinylbenzyl resin substrate was sandwiched and laminated by a 100 μm-thick vinylbenzyl resin prepreg. Both sides were cut by 40 μm, and the thickness of the laminate including the substrate was adjusted to 470 μm (to increase the accuracy of the laminate thickness).

(2) Second Laminating Step The epoxy adhesive sheet was 20 μm thick and used a type that hardly flows during pressing (adhesive film GF3500 manufactured by Hitachi Chemical Co., Ltd.).

(3) Yield When 10 sliced substrates are manufactured, the yield is 100% in the process, the inspection yield is 83% (the main cause of failure is disconnection due to pattern deviation), and the consistent yield is 83%. The inductance value variation of the non-defective product was 1.5% at 3σ / X. The improvement in yield compared to Example 1 is attributed to the improvement in the accuracy of the pitch in the vertical direction of the cross-sectional views of FIGS.

  Same as Example 3 except for the following.

(1) Strip conductor manufacturing process Patterning was performed only on one side.

(2) first lamination step,
A 100 μm-thick vinylbenzyl resin prepreg was laminated on the surface of the belt-like conductor production surface of the glass cloth-containing vinylbenzyl resin substrate. The surface on the prepreg side was shaved by 40 μm to obtain an accurate thickness of the laminate.

(3) Yield When 10 slice substrates are manufactured, the yield is 100% in the process, the inspection yield is 86% (the main cause of failure is disconnection due to pattern shift), and the consistent yield is 86%. Moreover, the inductance value variation of the non-defective product was 1.4% at 3σ / X. The improvement in yield compared to Example 1 is attributed to the improvement in the accuracy of the pitch in the longitudinal direction of the laminate.

  In addition, as a laminating method in the laminating process in Example 4, the one in which the parallel strip conductor pattern is formed on one surface of the core substrate is laminated by alternately inverting the surface on which the parallel strip conductor pattern is formed. Is also possible.

  See FIG. 7 and FIG.

(1) Band-shaped conductor manufacturing process A 0.1 mm thick (76 mm square) stainless steel thin plate (SUS304 material) was used as a transfer substrate, and a parallel band-shaped conductor pattern was formed thereon by a pattern plating method. The pattern had a conductor width: 35 μm (the end was 100 μm), a conductor interval: 20 μm, and a height: 35 μm. As the core substrate, a vinylbenzyl resin substrate containing 150 μm thick glass cloth was used. For this core substrate, a semi-cured (B-stage) glass benzyl resin prepreg containing glass cloth is stacked on the above-mentioned transfer substrate, pressurized and heated with a vacuum press to cure the prepreg, and then the transfer substrate is It peeled and produced by transferring a strip | belt-shaped conductor pattern.

(2) Substrate thickness adjustment step The surface without the strip-shaped conductor pattern was polished to adjust the thickness of the core substrate to 400 μm.

(3) Lamination process Vacuum pressing was performed with an adhesive sheet made of vinylbenzyl resin having a thickness of 10 μm.

(4) Yield When 10 slice substrates were produced, the yield was 100% in the process, the inspection yield was 90% (the main cause of failure was disconnection due to pattern deviation), and the consistent yield was 90%. The inductance value variation of the non-defective product was 1.2% at 3σ / X. The improvement in yield compared to Example 1 is attributed to the improvement in alignment accuracy between the upper and lower strip-like conductor patterns and the improvement in pitch accuracy in the vertical direction in FIGS.

  In addition, as a lamination | stacking method in the lamination | stacking process in Example 5, what formed the parallel strip | belt-shaped conductor pattern in the single side | surface of a core board | substrate is laminated | stacked by alternately inverting the surface in which the said parallel strip | belt-shaped conductor pattern is formed. Is also possible.

  See FIG. 10: Details of each step are shown below.

(1) Band-shaped conductor manufacturing process A vinyl cloth resin substrate with glass cloth (70 mm square, thickness 200 μm) was prepared as an organic core substrate having a core material. Next, parallel strip conductor patterns were respectively formed on the front and back surfaces of the organic core substrate by copper plating by a semi-additive method. The pattern was conductor width: 35 μm, conductor spacing: 20 μm, and conductor height: 30 μm. The front and back alignment was performed as an alignment mark by drilling holes with a diameter of 0.2 mm at two locations on the substrate.

(2) Laminating step A plurality of organic core substrates and inorganic sintered core substrates with the band-shaped conductor patterns prepared above are alternately stacked via an adhesive interlayer insulating layer (adhesive sheet), and heated and pressed to laminate them. To obtain a laminated substrate. The number of laminated core substrates was set so that the thickness after pressing was 40 mm (80 sheets). The interlayer insulating layer was a 50 μm epoxy adhesive sheet. Ferrite (Ni-Co series) was used for the inorganic sintered body core substrate. Alignment was performed by pin alignment with holes having a diameter of 5 mm formed at four corners of each substrate at fixed positions with respect to the parallel electrode pattern.

(3) Slicing step The laminated substrate was cut so that the thickness after cutting with a multi-wire saw was 0.45 mm to obtain a laminated sliced body. Thereafter, both sides of the sliced surface were polished by 50 μm, and the thickness of the laminated sliced body was adjusted to 350 μm.

(4) Bridged conductor formation process The bridged conductor pattern was produced by copper plating by a semi-additive method. The pattern was a conductor width: 35 μm, a conductor interval of 20 μm, and a conductor height: 30 μm.

(5) Protective layer formation process The protective layer was formed with 50-micrometer-thick vinyl benzyl resin. Via holes were formed in the protective layer by sandblasting.

(6) Terminal electrode formation process The copper terminal electrode was formed by the semi-additive construction method. After chip separation, a nickel layer of 1 μm was formed on the terminal electrode by barrel plating, and a tin layer of 2 μm was formed thereon.

(7) Chip separation step Dicing was performed.

(8) Yield When 10 slice substrates are manufactured, the yield is 100% in the process, the inspection yield is 88% (the main cause of failure is disconnection due to pattern deviation), and the consistent yield is 88%. Moreover, the inductance value variation of the non-defective product was 1.3% at 3σ / X. The improvement in yield compared to Example 1 is attributed to the improvement in pitch accuracy in the vertical direction in the cross-sectional view of FIG.

(9) Inductance value The inductance value at 50 MHz was about 10 times that of the coil of Example 1. This is due to the increase in the magnetic permeability due to the use of the inorganic sintered body core substrate (Ni-Co ferrite).

  Table 1 below collectively shows the substrates, electrodes (strip-shaped conductor patterns), adhesion methods (lamination methods), and yields of the examples and comparative examples.

  Table 2 below shows a comparison of the inductance values of Example 1 and Example 6.

  Although the embodiments and examples of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited thereto and various modifications and changes can be made within the scope of the claims. I will.

It is sectional drawing and a top view which show the first half part of the process in the 1st and 5th embodiment of this invention. It is sectional drawing and a top view which show the latter half part of the process in 1st and 5th embodiment. It is sectional drawing and the top view which show the first half part of the process in 2nd and 6th Embodiment. It is sectional drawing and a top view which show the latter half part of the process in 2nd and 6th Embodiment. It is sectional drawing and a top view which show the first half part of the process in 3rd and 7th Embodiment. It is sectional drawing and a top view which show the latter half part of the process in 3rd and 7th Embodiment. It is sectional drawing and a top view which show the first half part of the process in 4th Embodiment. It is sectional drawing and a top view which show the latter half part of the process in 4th Embodiment. It is the top view and bottom view which show the modification of the strip | belt-shaped conductor pattern in each embodiment. It is sectional drawing and the top view which show the process in 8th Embodiment.

Explanation of symbols

1, 1A, 7, 50 Core substrate 2 Parallel strip conductor pattern 3 Interlayer insulating layer 5 Laminate 8 Insulating adhesive sheet 9 Front / back alignment through hole 10, 10A, 10B, 10C, 60 Laminated substrate 20, 20A, 70 Laminated slice Body 21 Cross-linked conductor pattern 25 Protective layer 26 Via hole 30 Terminal electrode 40 Chip

Claims (18)

A laminating step of a plurality of band-shaped conductor patterns formed on front and rear surfaces of the organic core board having a core, which is pressed integrally stacked plurality through an insulating layer of prepreg or adhesive sheet,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. A laminating step of forming a plurality of strip conductor patterns and an insulating layer covering the plurality of strip conductor patterns on the front and back surfaces of the organic core substrate having a core material, and stacking and pressurizing the plurality of strips via an adhesive layer; ,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. A laminating step of forming a plurality of strip-like conductor patterns on one side of an organic core substrate having a core material, and stacking and compressing a plurality of them through an insulating layer of a prepreg or an adhesive sheet ; and
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. A laminating step of forming an insulating layer covering the plurality of band-shaped conductor patterns and the belt-shaped conductor pattern on one surface of the organic core board having a core material is pressed integrally stacked plurality via an adhesive layer so,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. The method for manufacturing an inductive device according to claim 2, wherein the insulating layer is polished to adjust the thickness. 5. The method for manufacturing an inductive device according to claim 3 , wherein the thickness of the organic core substrate having the core material is adjusted by polishing a surface without the strip-like conductor pattern. The slice after the step, the manufacturing method of the inductive device of claim 2, 3, 4, 5 or 6, wherein the adjusting the thickness by polishing the slice plane. The inductive device manufacturing method according to claim 1, 2, 3, 4, 5, 6 or 7 , wherein the organic core substrate having the core material is provided by transferring the strip-shaped conductor pattern. A lamination process in which a plurality of inorganic sintered body core substrates having a plurality of strip-like conductor patterns formed on the front and back surfaces are stacked and pressed together via an insulating layer of a prepreg or an adhesive sheet ; and
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. An insulating layer that covers the plurality of strip-shaped conductor patterns is formed on the front and back surfaces of the inorganic sintered body core substrate on which the plurality of strip-shaped conductor patterns are formed on the front and back surfaces, and a plurality of these layers are pressed over the adhesive layer and pressed. Integrated lamination process;
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. A lamination step in which a plurality of inorganic sintered body core substrates, each having a plurality of strip-like conductor patterns formed on one side, are pressed and integrated through an insulating layer of a prepreg or an adhesive sheet ; and
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. An insulating layer covering the plurality of strip-shaped conductor patterns is formed on the one surface of the inorganic sintered core substrate having a plurality of strip-shaped conductor patterns formed on one side, and a plurality of the layers are pressed and integrated through an adhesive layer. Laminating process to
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. Laminating process in which a plurality of strip conductor patterns formed on the front and back surfaces of an organic core substrate having a core material and an inorganic sintered body core substrate are alternately stacked and pressed together via an adhesive insulating layer When,
A slicing step of cutting the laminated substrate obtained in the laminating step in a direction crossing the strip-shaped conductor pattern;
A bridging conductor forming step for forming a bridging conductor pattern on the cut surface that connects ends of the strip-shaped conductor pattern exposed on the cut surface of the laminated slice obtained in the slicing step; and
And a separation step of separating the laminated slice into individual chips so as to have at least one helical coil composed of the strip-shaped conductor pattern and the bridged conductor pattern. 14. The method of manufacturing an inductive device according to claim 9, wherein the thickness of the insulating layer is adjusted by polishing. The method for manufacturing an inductive device according to claim 11 or 12 , wherein a surface of the inorganic sintered core substrate without the strip-like conductor pattern is polished to adjust the thickness. 16. The method of manufacturing an inductive device according to claim 9 , wherein the thickness of the sliced surface is adjusted by polishing after the slicing step. The method for manufacturing an inductive device according to claim 9 , wherein the inorganic sintered body is a porous ceramic. The method for manufacturing an inductive device according to claim 9 , wherein the inorganic sintered body is a magnetic body.

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