JP3826685B2 - Manufacturing method of glass ceramic circuit board - Google Patents

Description

【００２１】
この試験では、ガラスセラミック回路基板のガラスセラミックとして、ＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラス：６０重量％とアルミナ：４０重量％との混合物を用いた。
また、表層導体は、＃３を除く５つのサンプル＃１，＃２，＃４〜＃６では、Ａｇを用い、＃３ではＡｇ／Ｐｄを用いた。
【００２２】
また、Ａｇ系導体ペーストに配合するガラスの組成は、＃４を除く５つのサンプル＃１〜＃３，＃５，＃６で、ガラスセラミックに含まれるガラスと同じ組成のガラス（ＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラス）を用い、＃４では、異なる組成のガラス（ＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃系ガラス）を用いた。
【００２３】
この試験結果からも明らかなように、ＡｇとＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラスとを配合した導体ペーストを用いた４つのサンプル＃１，＃２，＃５，＃６では、ガラスの配合量が少なくなるほど、表層導体の接合強度が小さくなり、ガラスの配合量が最も少ない＃６（ガラスの配合量が０．５重量％）では、めっき前の表層導体の接合強度が６．９［Ｎ／ｍｍ²］であり、この程度の接合強度では、ブラスト処理時に表層導体の剥がれが発生した。しかも、拘束焼成時に拘束用グリーンシートと表層導体とが反応して両者が接合してしまい、表層導体の表面から拘束用グリーンシートを除去しにくくなり、これもブラスト処理時に表層導体の剥がれを発生させる原因となる。
【００２４】
また、ガラスの配合量が最も多い＃５（ガラスの配合量が１２重量％）では、めっき前の表層導体の接合強度が１０．３［Ｎ／ｍｍ²］であり、十分な接合強度が得られるため、ブラスト処理時に表層導体の剥がれが発生しない。しかし、ガラスの配合量が過剰であるため、表層導体の表面へのガラス成分の析出が多くなりすぎて、めっきが付きにくくなり、良好なワイヤボンディング性が得られない。
【００２５】
これに対し、ガラスの配合量が１〜１０重量％の範囲内の実施例＃１〜＃４は、めっき前の表層導体の接合強度が７．８〜１０．８［Ｎ／ｍｍ²］であり、適度な接合強度が得られると共に、拘束焼成時に拘束用グリーンシートと表層導体との反応が発生しない。このため、ブラスト処理時に表層導体の剥がれが発生せず、ブラスト処理後も良好な状態の表層導体が得られる。これにより、ガラスセラミック回路基板と表層導体とを同時に拘束焼成することが可能となる。しかも、ガラスの配合量が１０重量％以下であれば、表層導体の表面へのガラス成分の析出が少なく、表層導体の表面にめっきが付きやすくなり、良好なワイヤボンディング性が得られる。更に、めっき後の表層導体の接合強度も十分に確保でき、ボンディングワイヤの接合強度も十分に確保できる。
【００２６】
この試験結果から、Ａｇ系導体ペーストのガラスの配合量が１〜１０重量％の範囲内であれば、導体として、Ａｇ／Ｐｔ（実施例＃３）を用いても、Ａｇの場合とほぼ同等の耐ブラスト性（表層導体の剥がれ防止）、ワイヤボンディング性が得られる。その他、Ａｇ系導体として、Ａｇ／Ｐｄ、Ａｇ／Ａｕ等を用いても、ほぼ同様の効果が得られる。
【００２７】
また、Ａｇ系導体ペーストに配合するガラスとして、ガラスセラミックに含まれるガラスと同じＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラスを用いると、ガラス配合量が３重量％（実施例＃３）でも、１２重量％（比較例＃５）と同じ接合強度が得られる。つまり、比較的少ないガラス配合量で、表層導体の接合強度を効果的に増大できる。これは、ガラスセラミックと表層導体に同じ組成のガラス成分が含まれると、拘束焼成時のガラスセラミックと表層導体のガラス成分の挙動が同じとなり、ガラスセラミックと表層導体との接合性が更に向上するためである。
【００２８】
しかし、実施例＃４のように、Ａｇ系導体ペーストに配合するガラスとして、ガラスセラミックに含まれるガラスと異なる組成のガラス（ＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃系ガラス）を用いても、十分な耐ブラスト性、ワイヤボンディング性を確保できる。従って、Ａｇ系導体ペーストに配合するガラスは、ＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラスやＣａＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃系ガラスに限定されず、例えばＭｇＯ−ＳｉＯ₂−Ａｌ₂Ｏ₃−Ｂ₂Ｏ₃系ガラス、ＳｉＯ₂−Ｂ₂Ｏ₃系ガラス等、他の組成のガラスを用いても良い。
【００２９】
【発明の効果】
以上の説明から明らかなように、本発明の請求項１によれば、ＣａＯ−ＳｉＯ ₂ −Ａｌ ₂ Ｏ ₃ −Ｂ ₂ Ｏ ₃ 系ガラスまたはＣａＯ−ＳｉＯ ₂ −Ａｌ ₂ Ｏ ₃ 系ガラス成分を１〜１０重量％含むＡｇ系導体ペーストを、ＣａＯ−ＳｉＯ ₂ −Ａｌ ₂ Ｏ _{3 −} Ｂ ₂ Ｏ ₃ 系ガラスとアルミナとの混合物からなるガラスセラミックを用いて形成された基板表面（グリーンシート）に表層導体を印刷して拘束焼成を行い、ブラスト処理後に表層導体の表面をめっき処理するようにしているので、拘束焼成時に表層導体を同時焼成しても、ブラスト処理時の表層導体の剥がれを防止でき、表層導体の品質を維持しながら生産性を向上することができると共に、ワイヤボンディング性を向上できる。
【００３０】
また、ガラスセラミックと表層導体に同じ組成のガラス成分が含まれるため、表層導体の接合強度を更に向上できる。
【図面の簡単な説明】
【図１】 本発明の一実施形態におけるガラスセラミック回路基板の製造方法を説明するためのもので、（ａ）は拘束焼成時の状態を示す縦断面図、（ｂ）はブラスト処理後のガラスセラミック回路基板の縦断面図
【図２】 ガラスセラミック回路基板の製造工程の流れを示す工程フローチャート
【符号の説明】
１１ａ，１１ｂ，１１ｃ…ガラスセラミックのグリーンシート、１２…ビアホール、１３…ビア導体、１４…表層導体、１５…内層導体、１６…拘束用グリーンシート。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a glass ceramic circuit board in which a restraining green sheet is pressure-bonded to both sides of a glass ceramic circuit board before firing and fired.
[0002]
[Prior art]
In recent years, when firing glass-ceramic circuit boards, in order to reduce firing shrinkage in the surface direction of the board and improve board dimensional accuracy, a restraining alumina green sheet is pressure-bonded to both sides of the glass-ceramic circuit board before firing. After firing the glass-ceramic circuit board while pressing from above, the residue of the unsintered alumina green sheet for restraint adhering to both surfaces of the fired board (resin alumina green sheet is a solvent or resin in the firing process) A so-called constrained firing method has been put into practical use in which a glass ceramic circuit board is produced by removing a binder by scattering through a blast process.
[0003]
[Problems to be solved by the invention]
In the conventional restraint firing method, after restraint firing, the constraining alumina green sheet on the substrate surface is removed by blasting, and then the surface conductor is printed and fired on the substrate surface. This is because if the constraining firing is performed after the surface layer conductor is printed, the surface layer conductor is also peeled off when the constraining alumina green sheet is removed from the substrate surface by blasting after the constraining firing. Therefore, in the conventional constrained firing method, after the blasting process, the surface conductor is printed and fired on the substrate surface as a retrofit, and accordingly, the number of processes increases, the productivity decreases, and the production cost increases. There were drawbacks.
[0004]
The present invention has been made in consideration of such circumstances. Therefore, even if the surface conductor is simultaneously fired at the time of restraint firing, the object of the present invention is to prevent the surface conductor from peeling off at the time of blasting, and to improve the quality of the surface conductor. Another object of the present invention is to provide a glass ceramic circuit board manufacturing method capable of improving productivity while maintaining the above.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, a method for producing a glass-ceramic circuit board according to claim 1 of the present invention comprises: CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass or CaO—SiO ₂ —Al ₂ O _3. the surface layer conductor printed on a substrate surface (green sheet) by using an Ag-based conductor paste containing system glass component 1 to 10 wt%, then, before the firing _{step, CaO-SiO 2 -Al 2 O} 3 - B 2 O Restrained firing is performed by pressing a constraining green sheet that does not sinter at the sintering temperature of the glass-ceramic circuit board on both sides of a glass-ceramic circuit board formed using a glass ceramic composed of a mixture of ₃ glass and alumina. After the restraint firing, the restraining green sheet is removed by blasting, and then the surface of the surface conductor is plated.
In this case, the surface conductor is simultaneously fired at the time of constrained firing. Since the Ag-based conductor paste used for printing the surface conductor contains 1 to 10% by weight of the glass component, the glass component is composed of the surface layer conductor and the glass ceramic on the substrate surface. The bonding strength of the surface layer conductor is improved, the bonding state between the surface layer conductor and the glass ceramic is maintained even during the blasting process, and the peeling of the surface layer conductor due to the blasting process is prevented.
[0006]
In this case, the advantages of using the Ag-based conductor paste as the surface conductor are that the electrical characteristics are excellent, that it can be fired in the air, and that the plating treatment is easy. Moreover, the reason why the compounding amount of the glass component of the Ag-based conductor paste is 1 to 10% by weight is that the bonding strength between the glass ceramic and the surface conductor increases when the glass component serving as an adhesive is less than 1% by weight. Therefore, it is difficult to sufficiently prevent the surface conductor from being peeled off during blasting. On the other hand, if the glass component is more than 10% by weight, the glass component is excessively deposited on the surface of the surface conductor, making it difficult to be plated, and the wire bonding property is deteriorated and the glass component of the surface layer conductor is large. As a result, the electrical characteristics of the surface layer conductor also deteriorate. Therefore, if the glass component is 1 to 10% by weight, the bonding strength of the surface conductor can be secured, and the peeling of the surface conductor during the blasting can be sufficiently prevented, and the glass component is deposited on the surface of the surface conductor. As a result, the surface of the surface conductor can be easily plated, and the deterioration of the electrical properties of the surface conductor due to the addition of the glass component can be suppressed.
[0007]
As the glass-ceramic to form a glass-ceramic circuit board, using a mixture of _{CaO-SiO 2 -Al 2 O 3} -B 2 O 3 based glass and alumina, as the Ag-based conductor paste, the glass component CaO- Since glass containing SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass or CaO—SiO ₂ —Al ₂ O ₃ glass is used, glass components having the same composition are contained in the glass ceramic and the surface conductor. The behavior of the glass component of the glass ceramic and the surface layer conductor at the time of restraint firing becomes the same, and the bondability between the glass ceramic and the surface layer conductor is further improved.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, the structure of the glass ceramic circuit board will be described with reference to FIG. The glass ceramic circuit board is obtained by laminating a plurality of glass ceramic green sheets 11a, 11b, and 11c and firing them at 800 to 1000 ° C. As the glass ceramic, CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass: 50 to 65% by weight (preferably 60% by weight) and alumina: 50 to 35% by weight (preferably 40% by weight) Is used. In addition, for example, a mixture of MgO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass and alumina, a mixture of SiO ₂ —B ₂ O ₃ glass and alumina, PbO—SiO ₂ —B ₂ O _You may use the glass ceramic material which can be baked at 800-1000 degreeC, such as a mixture of ₃ type | system | group glass and an alumina, a cordierite type crystallized glass.
[0009]
Via holes 12 are formed in the green sheets (ceramic layers) 11a, 11b, and 11c of each layer by punching or the like, and each via hole 12 is filled with a via conductor 13. The via conductors 13 in each layer are made of, for example, an Ag-based conductor paste mainly containing Ag, Ag / Pd, Ag / Pt, Ag / Au, or the like. The via conductors 13 in each layer may be made of a paste of low melting point metal such as Au or Cu instead of the Ag conductor paste.
[0010]
On the first layer (uppermost layer) green sheet 11a, surface layer conductors 14 such as pads and wiring patterns are formed of an Ag-based conductor paste mainly containing Ag, Ag / Pd, Ag / Pt, Ag / Au, and the like. Yes. In this Ag-based conductor paste, the same glass component (CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ -based glass in this embodiment) as the glass component contained in the green sheet 11a (glass ceramic) is 1 to 10 inclusive. % By weight, more preferably 2 to 8% by weight. Further, the surface of the surface layer conductor 14 is plated after blasting described later, for example, an Au plating film having Ni plating as a base is formed. In the second and lower green sheets 11b and 11c, the inner layer conductor 15 is formed of an Ag-based conductor paste or a paste of low melting point metal such as Au-based or Cu-based. When the via conductor 13 and the inner layer conductor 15 are formed of an Ag-based conductor paste, unlike the case of the surface conductor 14, it is not necessary to add 1 to 10% by weight of a glass component to the Ag-based conductor paste.
[0011]
Next, a manufacturing method of the glass ceramic circuit board having the above configuration will be described with reference to a process flowchart of FIG. First, a glass ceramic slurry is formed into a tape by a doctor blade method or the like to form a green sheet. Thereafter, the green sheet is cut into a predetermined size, and via holes 12 are formed at predetermined positions of the green sheets 11a to 11c of each layer by a punching machine or the like.
[0012]
Thereafter, the via conductors 13 are filled in the via holes 12 of the green sheets 11a to 11c of each layer by filling the conductor paste. Thereafter, the surface layer conductor 14 is screen-printed with an Ag-based conductor paste on the first (uppermost) green sheet 11a. In this Ag-based conductor paste, the same glass component (CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ -based glass in this embodiment) as the glass component contained in the green sheet 11a (glass ceramic) is 1 to 10 inclusive. % By weight, more preferably 2 to 8% by weight. Further, the inner layer conductor 15 is screen-printed with a low melting point metal paste such as an Ag-based conductor paste or Au-based or Cu-based on the second and lower green sheets 11b and 11c.
[0013]
In the next step, green sheets 11a to 11c of each layer are laminated to make a raw substrate, and this is integrated by thermocompression bonding at 80 to 150 ° C., for example. Further, as shown in FIG. 1A, a constraining green sheet 16 is laminated on both sides of the raw substrate, and heat-pressed by the same method as described above. The constraining green sheet 16 is formed of an alumina green sheet that is not sintered at the sintering temperature of the glass ceramic.
[0014]
Thereafter, the green substrate sandwiched between the two constraining green sheets 16 is pressed at 800 to 1000 ° C. (preferably 900 ° C.) while being pressed, and green sheets 11a to 11c, via conductors 13 and inner layers of each layer are fired. The conductor 15 and the surface layer conductor 14 are fired simultaneously. Note that the green substrate may be fired without pressing, and in this case as well, firing shrinkage in the surface direction of the glass ceramic circuit board can be reduced by the restraining green sheet 16.
[0015]
In such restraint firing, the restraining green sheet 16 (alumina green sheet) pressed on both sides of the substrate does not sinter unless heated to 1550 to 1600 ° C. If fired at 800 to 1000 ° C., the restraining green sheet 16 remains unsintered. However, during the firing process, the binder and solvent in the constraining green sheet 16 are scattered and remain as alumina powder.
[0016]
After restraint firing, the residue (alumina powder) of the restraining green sheet 16 remaining on both surfaces of the substrate is removed by blasting [see FIG. 1 (b)]. In this blasting process, for example, glass beads are used as the projection material. After the blasting process, the process proceeds to a plating process, and an Au plating film having, for example, Ni plating as a base is formed on the surface of the surface conductor 14 on the substrate surface to enable wire bonding.
[0017]
According to the glass ceramic circuit board manufacturing method described above, the surface layer conductor 14 is simultaneously fired at the time of restraint firing. Since the Ag-based conductor paste used for printing the surface layer conductor 14 contains 1 to 10% by weight of the glass component, This glass component serves as an adhesive for bonding the surface layer conductor 14 and the glass ceramic on the substrate surface, and the bonding strength of the surface layer conductor 14 is improved. For this reason, the joining state of the surface layer conductor 14 and the glass ceramic is maintained even during the blasting process, and peeling of the surface layer conductor due to the blasting process is prevented. As a result, the glass ceramic circuit board and the surface conductor 14 can be constrained and fired at the same time, and the number of processes can be reduced and the productivity can be improved as compared with the conventional constrained firing in which the surface layer conductor 14 is retrofitted. Can be reduced. In addition, since the surface of the surface conductor 14 is plated, wire bonding properties can be ensured, and wire bonding specifications can be met.
[0018]
By the way, the glass component of the Ag-based conductor paste used for printing the surface layer conductor 14 serves as an adhesive for bonding the surface layer conductor 14 and the glass ceramic. Therefore, in order to increase the bonding strength of the surface layer conductor 14, It is desirable to increase the amount of ingredients to some extent. However, when the compounding amount of the glass component is too large, the deposition of the glass component on the surface of the surface layer conductor 14 is excessively increased, the plating becomes difficult to be attached, and the wire bonding property is deteriorated. A decrease in the electrical characteristics of the conductor 14 cannot be ignored.
[0019]
Then, since the present inventors performed the test which considers the suitable range of the compounding quantity of the glass component of the Ag type | system | group conductor paste used for printing of the surface layer conductor 14, the test result is shown in following Table 1. FIG.
[0020]
[Table 1]

[0021]
In this test, a mixture of CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass: 60 wt% and alumina: 40 wt% was used as the glass ceramic of the glass ceramic circuit board.
Further, as the surface layer conductor, Ag was used in five samples # 1, # 2, and # 4 to # 6 except # 3, and Ag / Pd was used in # 3.
[0022]
Further, the glass composition incorporated into Ag-based conductor paste, five samples # 1 to # 3 except for the # 4, # 5, and # 6, a glass having the same composition as the glass contained in the glass ceramic (CaO-SiO ₂ using -Al ₂ O ₃ -B ₂ O ₃ based glass), the # 4, using glass of different compositions _{(CaO-SiO 2 -Al 2 O} 3 based glass).
[0023]
As is apparent from the test results, four samples # 1, # 2, # 5, # 5 using a conductor paste containing Ag and CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass were used. In No. 6, the smaller the compounding amount of the glass, the smaller the bonding strength of the surface conductor. In the case of # 6 (the compounding amount of the glass is 0.5% by weight), the bonding of the surface layer conductor before plating is the smallest. The strength was 6.9 [N / mm ² ], and at this level of joining strength, peeling of the surface conductor occurred during blasting. Moreover, the constraining green sheet and the surface conductor react and bond together during restraint firing, making it difficult to remove the constraining green sheet from the surface of the surface conductor, which also causes peeling of the surface conductor during blasting Cause it.
[0024]
Further, in the case of # 5 having the largest glass blending amount (the glass blending amount is 12% by weight), the bonding strength of the surface conductor before plating is 10.3 [N / mm ² ], and sufficient bonding strength is obtained. Therefore, peeling of the surface layer conductor does not occur during the blasting process. However, since the compounding amount of the glass is excessive, the glass component is excessively deposited on the surface of the surface conductor, so that it is difficult to be plated, and good wire bonding properties cannot be obtained.
[0025]
On the other hand, in Examples # 1 to # 4 in which the glass blending amount is in the range of 1 to 10% by weight, the bonding strength of the surface layer conductor before plating is 7.8 to 10.8 [N / mm ² ]. In addition, an appropriate bonding strength can be obtained, and the reaction between the restraining green sheet and the surface conductor does not occur during restraint firing. For this reason, peeling of the surface layer conductor does not occur during the blasting process, and a surface layer conductor in a good state can be obtained even after the blasting process. Thereby, it becomes possible to restrain and fire the glass ceramic circuit board and the surface layer conductor at the same time. Moreover, if the amount of glass is 10% by weight or less, the precipitation of the glass component on the surface of the surface conductor is small, the surface of the surface conductor is likely to be plated, and good wire bonding properties are obtained. Furthermore, the bonding strength of the surface layer conductor after plating can be sufficiently secured, and the bonding strength of the bonding wire can be sufficiently secured.
[0026]
From this test result, if the compounding amount of the glass of the Ag-based conductor paste is in the range of 1 to 10% by weight, even if Ag / Pt (Example # 3) is used as the conductor, it is almost equivalent to the case of Ag. Blast resistance (prevention of peeling of surface layer conductor) and wire bonding property can be obtained. In addition, even when Ag / Pd, Ag / Au, or the like is used as the Ag-based conductor, substantially the same effect can be obtained.
[0027]
Moreover, when the same CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ glass as the glass contained in the glass ceramic is used as the glass to be blended in the Ag-based conductor paste, the glass blending amount is 3% by weight (Example) Even in # 3), the same bonding strength as 12 wt% (Comparative Example # 5) is obtained. That is, the bonding strength of the surface layer conductor can be effectively increased with a relatively small amount of glass. This is because if the glass component of the same composition is contained in the glass ceramic and the surface layer conductor, the behavior of the glass component of the glass ceramic and the surface layer conductor at the time of restraint firing becomes the same, and the bondability between the glass ceramic and the surface layer conductor is further improved. Because.
[0028]
However, as in Example # 4, it is sufficient to use a glass (CaO—SiO ₂ —Al ₂ O ₃ glass) having a composition different from that of the glass contained in the glass ceramic as the glass blended in the Ag based conductor paste. Secures blast resistance and wire bonding. Therefore, the glass blended in the Ag-based conductor paste is not limited to CaO—SiO ₂ —Al ₂ O ₃ —B ₂ O ₃ based glass or CaO—SiO ₂ —Al ₂ O ₃ based glass, for example, MgO—SiO _2. -Al ₂ O ₃ -B ₂ O ₃ based glass, SiO ₂ -B ₂ O ₃ based glass or the like, may be used glass having other compositions.
[0029]
【The invention's effect】
As apparent from the above description, according to claim 1 of the present invention, a _{CaO-SiO 2 -Al 2 O 3} -B 2 O 3 based glass or CaO-SiO ₂ -Al ₂ O ₃ -based glass component 1 the Ag-based conductor paste containing 10 _{wt%, CaO-SiO 2 -Al 2} O 3 - surface layer into the B ₂ O ₃ system glass and alumina with a mixture formed by using a glass-ceramic consisting of the substrate surface (green sheet) perform constrained sintering by printing the conductor, since the surface of the surface layer conductor after blasting so that the plating process, be co-fired surface layer conductor during restraint firing, it can prevent peeling of the surface layer conductor during blasting The productivity can be improved while maintaining the quality of the surface conductor, and the wire bonding property can be improved.
[0030]
Moreover, since the glass component of the same composition is contained in the glass ceramic and the surface layer conductor, the bonding strength of the surface layer conductor can be further improved.
[Brief description of the drawings]
1A and 1B are diagrams for explaining a method for manufacturing a glass ceramic circuit board according to an embodiment of the present invention, in which FIG. 1A is a longitudinal sectional view showing a state during restraint firing, and FIG. 1B is a glass after blasting; Longitudinal sectional view of ceramic circuit board [Figure 2] Process flow chart showing the flow of manufacturing process of glass ceramic circuit board [Explanation of symbols]
11a, 11b, 11c: Green sheet of glass ceramic, 12: Via hole, 13: Via conductor, 14 ... Surface conductor, 15 ... Inner layer conductor, 16 ... Restraining green sheet.

Claims (1)

A constraining green sheet that is not sintered at the sintering temperature of the glass ceramic circuit board is pressure-bonded to both surfaces of the glass ceramic circuit board before firing on which the surface layer conductor is printed. In a method for producing a glass ceramic circuit board by removing by blasting,
The glass-ceramic circuit glass ceramic to form a _{substrate, CaO-SiO 2 -Al 2 O} 3 - consists of a mixture of B ₂ O ₃ based glass and alumina,
The surface layer conductor printed with _{CaO-SiO 2 -Al 2 O 3} -B 2 O 3 based glass or CaO-SiO ₂ -Al ₂ O ₃ system Ag-based conductor paste a glass component comprising 10 wt% ,
A method for producing a glass-ceramic circuit board, comprising: removing the constraining green sheet by blasting after constraining firing and then plating the surface of the surface conductor.

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