JP3821400B2

JP3821400B2 - Treatment liquid coating apparatus and treatment liquid coating method

Info

Publication number: JP3821400B2
Application number: JP10130596A
Authority: JP
Inventors: 隆行佐藤
Original assignee: Screen Holdings Co Ltd; Dainippon Screen Manufacturing Co Ltd
Current assignee: Screen Holdings Co Ltd; Dainippon Screen Manufacturing Co Ltd
Priority date: 1996-04-23
Filing date: 1996-04-23
Publication date: 2006-09-13
Anticipated expiration: 2016-04-23
Also published as: KR100227645B1; KR970072028A; JPH09289151A

Description

【０００１】
【発明の属する技術分野】
本発明は、例えば半導体基板や液晶表示基板、カラーフィルタ、プラズマ表示パネル（ＰＤＰ：Plasma Display Panel）などの製造工程において、例えばフォトレジスト液や現像液などの処理液を基板上に塗布する処理液塗布装置および処理液塗布方法に関するものである。
【０００２】
【従来の技術】
従来、例えば半導体基板や液晶表示基板などの製造工程において、フォトプロセスでパターンを形成する際には、基板にフォトレジスト液を塗布する工程や、基板に現像液を塗布する工程など、各種の処理液を塗布する塗布工程が不可欠である。このような処理液塗布工程に用いられる処理液塗布装置には、基板を水平状態に保持して回転させる基板載置部が設けられており、この基板載置部の周辺を半密閉空間として、基板上の中央部に処理液が乗せられた状態で半密閉空間内の空気といっしょに基板および基板載置部を回転させることにより、その遠心力で均一に処理液を基板上面に塗布している。
【０００３】
図７は従来の処理液塗布装置の斜視図である。
【０００４】
図７において、処理液塗布装置５は、角形の基板３を保持して回転させる基板載置部１と、この基板載置部１の上方に基板載置部１と平行に配置された上部回転板６と、これらの基板載置部１および上部回転板６を囲むように配設された下部ケース７ａおよび上部ケース７ｂと、基板載置部１上に保持された基板３にフォトレジスト液を供給するための処理液供給部８と、基板載置部１の上面を洗浄するための上面洗浄部９ａと、上部回転板６の下面を洗浄するための下面洗浄部９ｂとを有している。窒素ガス弁１０ａおよび真空弁１０ｂは、基板載置部１の基板吸着面２ａを負圧または正圧に択一的に切り換えする。
【０００５】
図８は図７の処理液塗布装置５における基板載置部１の平面図である。
【０００６】
図８において、基板載置部１は、上面に吸着面２ａが形成され基板３を真空吸着することで保持するバキュームチャック２と、このバキュームチャック２の周辺部に配設された外周が円形状の整流板４とを有している。このバキュームチャック２は長方形状に構成されており、整流板４の中央部に埋め込まれるように配置されている。この場合のバキュームチャック２の上面の高さは、スピン処理後の処理液の基板裏面への回り込みを防止するために、整流板４の上面の高さよりも僅かに高くなるように設定されている。これによって、基板３がバキュームチャック２の上面に真空吸着により保持された場合、基板裏面と整流板４の上面との間に僅かな隙間が生じることになる。
【０００７】
また、バキュームチャック２の吸着面２ａには多数の溝（図示せず）が形成されており、それらの溝がバキュームチャック２の中央部付近に設けられた真空配管と連通しており、バキュームチャック２の上面を均一な吸着面２ａとしている。これにより、吸着による基板保持は基板３をその吸着面２ａで受けているため、基板３が大型化や薄型化していても機械的な保持に比べて基板３の損傷を防止することができる。
【０００８】
【発明が解決しようとする課題】
上記従来の構成では、基板３の中央部をバキュームチャック２により真空吸着して保持するが、大型化および薄型化した基板３に対して処理液を塗布する場合に、基板３の端部とバキュームチャック２の距離であるオーバーハング量が大きく、スピン処理後に基板３の端縁部が垂れ下がって基板３と整流板４の上面とが接触してその隙間が保てなくなる。このように、基板３の端部が整流板４の上面に接触したりその隙間が少な過ぎると、その接触部または隙間に液残りを生じやすく、処理液の基板裏面への回り込みが生じるという問題があった。逆に、基板３の端縁部と整流板４の上面との隙間を予め多く取っておくことも考えられるが、この隙間が多過ぎても、処理液の基板裏面への回り込みが生じやすいという問題があった。
【０００９】
この場合に、バキュームチャック２および整流板４を基板３のサイズ毎に設ければ、バキュームチャック２との基板３のオーバーハング量を適正にすることができて基板３の端縁部の垂れ下がりは防止されることになる。ところが、バキュームチャック２および整流板４の組を基板３のサイズ毎に設けて交換装着作業をしなければならないという問題があった。
【００１０】
本発明は、上記問題を解決するもので、基板上面に処理液を塗布する際に、基板サイズ毎に各種サイズのチャックおよび整流板を必要とせず、その処理液が基板裏面に回り込むのを確実に防止することができる処理液塗布装置および処理液塗布方法を提供することを目的とする。
【００１１】
【課題を解決するための手段】
請求項１記載の処理液塗布装置は、基板を回転させた状態で前記基板上に処理液を塗布する処理液塗布装置において、基板を水平にかつ回転可能に保持する基板保持部材と、この基板保持部材の周囲に、この基板保持部材の上面位置よりも上面が僅かに所定寸法だけ低い位置に配設された整流部材と、前記基板保持部材上に保持された基板の裏面と前記整流部材の上面との間隙を、０．１ｍｍを越えて０．６ｍｍ未満に維持しかつ基板の裏面にのみ当接する突起部材とを備えて構成されていることを特徴とするものである。
【００１２】
請求項２記載の処理液塗布装置は、基板を水平に保持する基板保持部材が中央に設けられ、この基板保持部材の周囲に、この基板保持部材の上面位置よりも上面が僅かに所定寸法だけ低い位置に配設された整流部材が設けられ、前記基板保持部材上に保持された基板を回転させることにより前記基板上に処理液を塗布する処理液塗布装置において、前記基板保持部材上に保持された基板の裏面と前記整流部材の上面との間隙を、０．１ｍｍを越えて０．６ｍｍ未満に維持すべく、前記基板の端縁部の裏面にのみ当接する突起を有する突起部材が前記整流部材側に設けられていることを特徴とするものである。
【００１３】
これらの発明によれば、基板サイズが大きくて薄い場合に、基板の端縁部と基板保持部材との距離であるオーバーハング量が多くなり、スピン処理後に基板の端縁部が垂れ下がろうとしても、少なくとも最も垂れ下がる位置に突起部材の突起部（基板保持部材上に保持された基板の裏面と前記整流部材の上面との間隙を前記所定寸法に維持する部材）が位置していれば、基板の端縁部と整流部材の上面との隙間が所定寸法に維持され、従来のようにその接触部または隙間に液残りを生じるようなことはない。これによって、処理液が基板裏面に回り込むのが防止されて、基板の信頼性が向上するとともにその歩留まりも向上することになる。しかも、この処理液の基板裏面への回り込み防止によって、従来のように、基板サイズ毎に各種の基板保持部材および整流部材を設けて、交換装着作業をする必要はなくなる。
【００１４】
請求項３記載の処理液塗布装置は、請求項１または２記載の処理液塗布装置において、前記突起部材は、前記基板の端縁部のうち少なくとも４角部に対応した前記整流部材側にそれぞれ設けられていることを特徴とするものである。
【００１５】
この構成により、４角形の基板の場合、基板の端縁部と基板保持部材との距離であるオーバーハング量が最も多い４角部に突起部材が設置されていれば、基板上面に処理液を塗布する際に、基板サイズ毎に各種サイズのチャックおよび整流板を必要とせず、その処理液が基板裏面側に回り込むのが防止されるという効果が得られる。
【００１６】
請求項４記載の処理液塗布装置は、請求項３記載の処理液塗布装置において、基板の端縁部の４角部に対応した前記整流部材側の突起部材と、当該突起部材に隣設されている突起部材とを結ぶ直線に略沿うように他の突起部材が設けられていることを特徴とするものである。
【００１７】
請求項５記載の処理液塗布装置は、請求項１乃至４のいずれかに記載の処理液塗布装置において、前記突起部材は、前記保持部材に保持された基板の外周縁内側に沿って全体として矩形を形成する位置に配設されていることを特徴とするものである。
【００１８】
請求項６記載の処理液塗布装置は、請求項１乃至５のいずれかに記載の処理液塗布装置において、前記突起部材は、整流部材からの突出量が０．１ｍｍを越えて０．６ｍｍ未満に設定されていることを特徴とするものである。
【００１９】
請求項７記載の処理液塗布装置は、請求項１乃至６のいずれかに記載の処理液塗布装置において、前記整流部材には、前記突起部材を装着する穴が設けられていることを特徴とするものである。
【００２０】
請求項８記載の処理液塗布装置は、請求項７記載の処理液塗布装置において、前記突起部材は、前記穴に嵌入される本体部を有し、前記突起は、この本体部の上面から突設されていることを特徴とするものである。
【００２１】
請求項９記載の処理液塗布装置は、請求項８記載の処理液塗布装置において、前記本体部は、所定厚さを有する円形の板状に形成されていることを特徴とするものである。
【００２２】
請求項１０記載の処理液塗布装置は、請求項２乃至９のいずれかに記載の処理液塗布装置において、前記突起は、先端が針鋭に形成されていることを特徴とするものである。
【００２３】
請求項１１記載の処理液塗布装置は、請求項２乃至１０のいずれかに記載の処理液塗布装置において、前記整流部材と基板との間の間隙寸法は、前記突起によって調整されることを特徴とするものである。
【００２４】
請求項１２記載の処理液塗布装置は、請求項１乃至１１のいずれかに記載の処理液塗布装置において、前記基板保持部材は、最も小さい基板に対応し得るように寸法設定されていることを特徴とするものである。
【００２５】
請求項１３記載の処理液塗布装置は、請求項１乃至１２のいずれかに記載の処理液塗布装置において、前記基板保持部材は、真空吸着することで基板を保持するバキュームチャックであることを特徴とするものである。
【００２６】
請求項１４記載の処理液塗布装置は、請求項１乃至１３のいずれかに記載の処理液塗布装置において、前記処理液は、フォトレジスト液または現像液であることを特徴とするものである。
【００２７】
請求項１５記載の処理液塗布装置は、請求項１乃至１４のいずれかに記載の処理液塗布装置において、前記基板は、半導体基板、液晶表示基板、カラーフィルタおよびプラズマ表示パネルの内のいずれかに使用されるものであることを特徴とするものである。
【００２８】
請求項１６記載の処理液塗布方法は、基板を回転させた状態で前記基板上に処理液を塗布する処理液塗布方法において、基板を水平かつ回転可能に保持する基板保持部材の上面位置よりも上面が僅かに所定寸法だけ低い位置に配設された当該保持部材を囲む整流部材の上面と、基板の裏面との間に０．１ｍｍを越えて０．６ｍｍ未満の間隙を形成させかつ基板の裏面にのみ当接する部材を介設した上で前記基板保持部材、整流部材および基板を中心回りに一体回転させながら、回転している基板の表面に処理液を供給することを特徴とするものである。
【００２９】
請求項１７記載の処理液塗布方法は、請求項１６記載の処理液塗布方法において、前記間隙を形成させる部材として基板の端縁部の裏面に当接する突起を有する突起部材を用いることを特徴とするものである。
【００３０】
請求項１８記載の処理液塗布方法は、請求項１７記載の処理液の塗布方法において、前記突起として針状のものを用いることを特徴とするものである。
【００３１】
請求項１９記載の処理液塗布装置は、基板を回転させた状態で前記基板上に処理液を塗布する処理液塗布装置において、基板を水平にかつ回転可能に保持する基板保持部材と、この基板保持部材の周囲に、この基板保持部材の上面位置よりも上面が僅かに所定寸法だけ低い位置に配設された整流部材と、前記基板保持部材上に保持された基板の裏面と前記整流部材の上面との間隙寸法を０．１ｍｍを越えて０．６ｍｍ未満に維持する突起部材とを備えて構成されていることを特徴とするものである。
【００３２】
【発明の実施の形態】
以下、本発明の実施形態について図面を参照して説明する。
【００３３】
図１は本発明の一実施形態を示す処理液塗布装置における基板載置部の平面図であり、図２は図１の基板載置部のＡＡ′断面図である。
【００３４】
図１および図２において、基板載置部１１の中央部に、上面に吸着面１２ａが形成され基板１３を真空吸着することで基板１３を保持する長方形状の基板保持部材としてのバキュームチャック１２が設けられている。このバキュームチャック１２の周辺部に外周が円形状の整流部材としての整流板１４が配設されており、この整流板１４の中央部にバキュームチャック１２が埋め込まれるように配置されている。この場合のバキュームチャック１２の上面の高さは、スピン処理後のレジストの基板裏面への回り込みを防止するために、整流板１４の上面の高さよりも僅かに高くなるように設定されている。これによって、基板１３がバキュームチャック１２の上面に真空吸着により保持された場合、基板裏面と整流板１４の上面との間に僅かな隙間が生じることになる。この僅かな隙間は、０．２〜０．５ｍｍ程度の間隙であることが望ましい。この間隙が０．１ｍｍ以下であっても０．６ｍｍ以上であってもレジストの基板裏面への回り込みが起こりやすくなる。
【００３５】
このような基板端部の裏面と整流板１４の上面との間の僅かな隙間を維持するために、基板１３のサイズが大きく、これがバキュームチャック１２上に保持された場合、基板１３のオーバーハング量が大きいので、基板１３の端縁部が垂れ下がるが、その位置に垂れ下がり防止用の突起部材１５を配置する。この突起部材１５の配置は、少なくとも基板１３の４角部に配置する必要がある。つまり、基板１３のオーバーハング量が少なくとも最も大きい位置に突起部材１５を配置することになる。本実施形態においては、基板１３の４角部の他に、長方形状のバキュームチャック１２の短辺側では、基板１３の端縁部中央に対応する整流板１４側の位置に突起部材１５を埋め込んで、基板裏面と整流板１４の上面との間の隙間が最適になるように調整している。また、基板１３の４角部の他に、長方形状のバキュームチャック１２の長辺側では、その基板１３の長辺寸法の半分のピッチ寸法を開けた位置に対応する整流板１４側の位置にも突起部材１５を２個ずつ埋め込んで、基板裏面と整流板１４の上面との間の隙間が最適になるように調整している。
【００３６】
また、この垂れ下がり防止用の突起部材１５と基板１３の端縁部との接触位置は、スピン処理後に、図３に示すように基板１３の端縁部にレジスト１８が溜って基板１３の下面側に球状のしずく１８ａとなった場合に、少なくともそのしずく１８ａの直径寸法よりも内側の位置である必要がある。また、基板裏面と整流板１４の上面との隙間を保つ必要から、この突起部材１５の基板１３の裏面との接触部分は一点の針状である方が望ましい。
【００３７】
さらに、バキュームチャック１２の吸着面１２ａには多数の溝（図示せず）が形成されており、それらの溝がバキュームチャック１２の中央部付近に設けられた真空配管と連通しており、真空配管内の空気を脱気することによりバキュームチャック１２の上面の多数の溝を介して吸着面１２ａ全体を均一な吸着面としている。
【００３８】
図４は図１の突起部材１５の斜視図であり、図５は図４の突起部材１５の平面図であり、図６は図４の突起部材１５の側面図である。
【００３９】
図４〜図６において、この突起部材１５は、所定厚さを有する円形状の板状に構成されており、その一方面の中央部に突起部１６を有している。この突起部１６の高さはこの突起部材１５が整流板１４の凹部内にセットされたときに整流板１４の上面から突出する寸法が、上記０．２〜０．５ｍｍ程度となるように設定している。この突起部１６の位置に対して点対称な位置には、皿グリがなされたねじ用の孔１７ａ，１７ｂが設けられており、これらの孔１７ａ，１７ｂを介して整流板１４側の凹部のねじ穴にねじを螺合させて突起部材１５を整流板１３側の凹部に固定する。このような突起部１６は、突起部材１５に少なくとも１個あればよい。
【００４０】
上記構成により、数種類のサイズの基板を処理する必要があるときに、最も小さい基板に対応したバキュームチャック１２を製作し、このバキュームチャック１２で大きいサイズの基板１３を保持する場合にも、基板１３の端縁部の垂れで整流板１４の上面に基板１３の裏面が接触しないように基板１３のオーバーハング量の大きい位置に突起部材１５を配置することにより、強制的に基板１３の端縁部裏側と整流板１４の上面部との間隙を所定寸法以内に維持することができ、従来のようにその接触部または隙間に液残りを生じるようなことはなく、レジスト１８の基板裏面への回り込みを防止することができる。
【００４１】
また、このレジスト１８の基板裏面への回り込み防止によって、基板サイズが多種類にわたってもバキュームチャック１２および整流板１４は１種類で済ますことができるため、基板サイズの変更に伴うバキュームチャック１２および整流板１４の交換装着作業は不要となる。
【００４２】
さらに、大型サイズの基板に対してもバキュームチャック１２を小さく構成することができるため、バキュームチャック１２の作製が容易であり、軽いのでスピンモータにかかる負荷も低減することができる。
【００４３】
さらに、突起部材１５の突起部１６で、基板１３の端縁部裏側と整流板１４の上面部との間隙を所定寸法以内に調整することができるため、整流板１４の精度や、組立精度に応じて調整することができる。
【００４４】
なお、本実施形態では、処理液としてレジスト１８を用いたが、処理液として現像液などの他の処理液を用いても良い。
【００４５】
【発明の効果】
以上のように本発明によれば、基板保持部材上に保持された基板の裏面と整流部材の上面との間隙が所定寸法を維持すべく、基板の端縁部のうち少なくとも４角部に対応した整流部材側に突起部材が設けられているため、基板サイズが大きくて薄い場合、スピン処理後に基板の端縁部が垂れ下がろうとしても、少なくとも最も垂れ下がる位置に突起部材の突起部が位置しており、基板端縁部と整流板の上面との隙間が所定寸法に確保でき、従来のようにその接触部または隙間に液残りを生じるようなことはなく、処理液の基板裏面への回り込みを防止することができる。これによって、各種の基板の信頼性が向上するとともにその歩留まりも向上することができる。しかも、この処理液の基板裏面への回り込み防止によって、基板サイズ毎に基板保持部材および整流板を設けて、交換装着作業をする必要もなくなる。
【図面の簡単な説明】
【図１】本発明の一実施形態を示す処理液塗布装置における基板載置部の平面図である。
【図２】図１の基板載置部のＡＡ′断面図である。
【図３】図２のＸ部の拡大図である。
【図４】図１の突起部材の斜視図である。
【図５】図４の突起部材の平面図である。
【図６】図４の突起部材の側面図である。
【図７】従来の処理液塗布装置の斜視図である。
【図８】図７の処理液塗布装置における基板載置部の平面図である。
【符号の説明】
１１基板載置部
１２バキュームチャック
１２ａ吸着面
１３基板
１４整流板
１５突起部材
１６突起部
１８レジスト
１８ａしずく[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing solution for applying a processing solution such as a photoresist solution or a developing solution on a substrate in a manufacturing process of a semiconductor substrate, a liquid crystal display substrate, a color filter, a plasma display panel (PDP), etc., for example. The present invention relates to a coating apparatus and a processing liquid coating method.
[0002]
[Prior art]
Conventionally, when a pattern is formed by a photo process in a manufacturing process of a semiconductor substrate or a liquid crystal display substrate, for example, various processes such as a step of applying a photoresist solution to the substrate and a step of applying a developer to the substrate. An application process for applying the liquid is indispensable. The processing liquid coating apparatus used in such a processing liquid coating process is provided with a substrate mounting portion that rotates while holding the substrate in a horizontal state, and the periphery of the substrate mounting portion is a semi-sealed space. By rotating the substrate and the substrate mounting section together with the air in the semi-enclosed space with the processing liquid placed on the center of the substrate, the processing liquid is uniformly applied to the upper surface of the substrate by the centrifugal force. Yes.
[0003]
FIG. 7 is a perspective view of a conventional treatment liquid coating apparatus.
[0004]
In FIG. 7, the processing liquid coating apparatus 5 includes a substrate platform 1 that holds and rotates a square substrate 3, and an upper rotation that is disposed above the substrate platform 1 in parallel with the substrate platform 1. A photoresist solution is applied to the plate 6, the lower case 7 a and the upper case 7 b disposed so as to surround the substrate platform 1 and the upper rotating plate 6, and the substrate 3 held on the substrate platform 1. A processing liquid supply unit 8 for supplying, an upper surface cleaning unit 9 a for cleaning the upper surface of the substrate mounting unit 1, and a lower surface cleaning unit 9 b for cleaning the lower surface of the upper rotating plate 6 are provided. . The nitrogen gas valve 10a and the vacuum valve 10b selectively switch the substrate adsorption surface 2a of the substrate platform 1 to a negative pressure or a positive pressure.
[0005]
FIG. 8 is a plan view of the substrate platform 1 in the processing liquid coating apparatus 5 of FIG.
[0006]
In FIG. 8, the substrate mounting portion 1 has a vacuum chuck 2 that has an adsorption surface 2 a formed on the upper surface and holds the substrate 3 by vacuum suction, and a circular outer periphery disposed on the periphery of the vacuum chuck 2. The current plate 4 is provided. The vacuum chuck 2 is configured in a rectangular shape and is disposed so as to be embedded in the central portion of the rectifying plate 4. In this case, the height of the upper surface of the vacuum chuck 2 is set to be slightly higher than the height of the upper surface of the rectifying plate 4 in order to prevent the processing liquid after the spin processing from entering the back surface of the substrate. . Thereby, when the substrate 3 is held on the upper surface of the vacuum chuck 2 by vacuum suction, a slight gap is generated between the rear surface of the substrate and the upper surface of the rectifying plate 4.
[0007]
The suction surface 2a of the vacuum chuck 2 is formed with a number of grooves (not shown), and these grooves communicate with a vacuum pipe provided near the center of the vacuum chuck 2. 2 is a uniform suction surface 2a. Thereby, since the substrate 3 is held by the suction by the suction surface 2a, the substrate 3 can be prevented from being damaged as compared with the mechanical holding even if the substrate 3 is enlarged or thinned.
[0008]
[Problems to be solved by the invention]
In the above-described conventional configuration, the central portion of the substrate 3 is vacuum-sucked and held by the vacuum chuck 2, but when the processing liquid is applied to the large and thin substrate 3, the end portion of the substrate 3 and the vacuum The amount of overhang, which is the distance of the chuck 2, is large, the edge of the substrate 3 hangs down after the spin processing, the substrate 3 and the upper surface of the rectifying plate 4 come into contact, and the gap cannot be maintained. As described above, when the end portion of the substrate 3 is in contact with the upper surface of the rectifying plate 4 or the gap is too small, a liquid residue is likely to be generated in the contact portion or the gap, and the processing liquid wraps around the back surface of the substrate. was there. Conversely, it is conceivable to leave a large gap between the edge of the substrate 3 and the upper surface of the rectifying plate 4 in advance, but even if there are too many gaps, the processing liquid tends to wrap around the back surface of the substrate. There was a problem.
[0009]
In this case, if the vacuum chuck 2 and the current plate 4 are provided for each size of the substrate 3, the amount of overhang of the substrate 3 with the vacuum chuck 2 can be made appropriate, and the sag of the edge portion of the substrate 3 is reduced. Will be prevented. However, there is a problem in that a replacement chucking operation must be performed by providing a set of the vacuum chuck 2 and the current plate 4 for each size of the substrate 3.
[0010]
The present invention solves the above-mentioned problem, and when applying the processing liquid to the upper surface of the substrate, it does not require chucks and current plates of various sizes for each substrate size, and ensures that the processing liquid wraps around the back surface of the substrate. It is an object of the present invention to provide a treatment liquid coating apparatus and a treatment liquid coating method that can be prevented.
[0011]
[Means for Solving the Problems]
The processing liquid coating apparatus according to claim 1 is a processing liquid coating apparatus for coating a processing liquid on the substrate while the substrate is rotated, and a substrate holding member that holds the substrate horizontally and rotatably, and the substrate. A rectifying member disposed around the holding member at a position where the upper surface is slightly lower than the upper surface position of the substrate holding member by a predetermined dimension, a back surface of the substrate held on the substrate holding member, and the rectifying member It is characterized by comprising a projecting member that maintains a gap with the upper surface of more than 0.1 mm and less than 0.6 mm and that abuts only on the back surface of the substrate.
[0012]
The processing liquid coating apparatus according to claim 2, wherein a substrate holding member that holds the substrate horizontally is provided in the center, and the upper surface of the substrate holding member is slightly larger than the upper surface of the substrate holding member by a predetermined dimension. A rectifying member disposed at a low position is provided, and is held on the substrate holding member in a processing liquid coating apparatus that applies a processing liquid onto the substrate by rotating the substrate held on the substrate holding member. A protrusion member having a protrusion that abuts only on the back surface of the edge portion of the substrate so as to maintain a gap between the back surface of the formed substrate and the top surface of the rectifying member to be more than 0.1 mm and less than 0.6 mm; It is provided on the rectifying member side.
[0013]
According to these inventions, when the substrate size is large and thin, the amount of overhang, which is the distance between the edge portion of the substrate and the substrate holding member, increases, and the edge portion of the substrate hangs down after the spin processing. As long as the protruding portion of the protruding member (a member that maintains the gap between the back surface of the substrate held on the substrate holding member and the upper surface of the rectifying member at the predetermined dimension) is positioned at least at the most drooping position, The gap between the edge portion of the substrate and the upper surface of the rectifying member is maintained at a predetermined size, and no liquid residue is generated at the contact portion or the gap as in the prior art. This prevents the processing liquid from flowing around the back surface of the substrate, improving the reliability of the substrate and improving the yield. In addition, by preventing the processing liquid from flowing into the back surface of the substrate, it is not necessary to provide various substrate holding members and rectifying members for each substrate size and to perform replacement mounting work as in the prior art.
[0014]
The treatment liquid coating apparatus according to claim 3 is the treatment liquid coating apparatus according to claim 1 or 2, wherein the protrusion member is on the rectifying member side corresponding to at least four corners of the edge portion of the substrate. It is characterized by being provided.
[0015]
With this configuration, in the case of a quadrangular substrate, if the protruding member is installed at the quadrangular portion where the overhang amount that is the distance between the edge portion of the substrate and the substrate holding member is the largest, the processing liquid is applied to the upper surface of the substrate. When applying, there is no need for chucks and rectifying plates of various sizes for each substrate size, and it is possible to obtain an effect that the processing liquid is prevented from entering the back side of the substrate.
[0016]
The treatment liquid coating apparatus according to claim 4 is the treatment liquid coating apparatus according to claim 3, wherein the rectifying member side projection member corresponding to the four corners of the edge portion of the substrate is adjacent to the projection member. Another projecting member is provided so as to be substantially along a straight line connecting the projecting member.
[0017]
The treatment liquid coating apparatus according to claim 5 is the treatment liquid coating apparatus according to any one of claims 1 to 4, wherein the protruding member is entirely along the inner periphery of the substrate held by the holding member. It is arranged at a position where a rectangle is formed.
[0018]
The treatment liquid coating apparatus according to claim 6 is the treatment liquid coating apparatus according to any one of claims 1 to 5, wherein the protruding member has a protruding amount from the rectifying member of more than 0.1 mm and less than 0.6 mm. It is characterized by being set to.
[0019]
The treatment liquid coating apparatus according to claim 7 is the treatment liquid coating apparatus according to any one of claims 1 to 6, wherein the rectifying member is provided with a hole for mounting the protruding member. To do.
[0020]
The treatment liquid application apparatus according to claim 8 is the treatment liquid application apparatus according to claim 7, wherein the protrusion member has a main body portion fitted into the hole, and the protrusion protrudes from an upper surface of the main body portion. It is characterized by being provided.
[0021]
According to a ninth aspect of the present invention, there is provided the processing liquid coating apparatus according to the eighth aspect, wherein the main body is formed in a circular plate shape having a predetermined thickness.
[0022]
A treatment liquid application apparatus according to a tenth aspect is the treatment liquid application apparatus according to any one of the second to ninth aspects, wherein the protrusion has a sharp tip.
[0023]
The treatment liquid coating apparatus according to claim 11 is the treatment liquid coating apparatus according to any one of claims 2 to 10, wherein a gap dimension between the rectifying member and the substrate is adjusted by the protrusion. It is what.
[0024]
The processing liquid coating apparatus according to claim 12 is the processing liquid coating apparatus according to any one of claims 1 to 11, wherein the substrate holding member is dimensioned so as to correspond to the smallest substrate. It is a feature.
[0025]
The processing liquid coating apparatus according to claim 13 is the processing liquid coating apparatus according to any one of claims 1 to 12, wherein the substrate holding member is a vacuum chuck that holds the substrate by vacuum suction. It is what.
[0026]
A treatment liquid coating apparatus according to a fourteenth aspect is the treatment liquid coating apparatus according to any one of the first to thirteenth aspects, wherein the treatment liquid is a photoresist liquid or a developer.
[0027]
The processing liquid coating apparatus according to claim 15 is the processing liquid coating apparatus according to any one of claims 1 to 14, wherein the substrate is one of a semiconductor substrate, a liquid crystal display substrate, a color filter, and a plasma display panel. It is what is used for.
[0028]
The processing liquid coating method according to claim 16 is a processing liquid coating method in which the processing liquid is applied onto the substrate in a state where the substrate is rotated, than the upper surface position of the substrate holding member that holds the substrate horizontally and rotatably. A gap of more than 0.1 mm and less than 0.6 mm is formed between the upper surface of the rectifying member surrounding the holding member disposed at a position where the upper surface is slightly lower by a predetermined dimension and the back surface of the substrate, and A process liquid is supplied to the surface of the rotating substrate while the substrate holding member, the rectifying member, and the substrate are integrally rotated around the center after a member that contacts only the back surface is interposed. is there.
[0029]
The treatment liquid application method according to claim 17 is characterized in that, in the treatment liquid application method according to claim 16, a protrusion member having a protrusion abutting against a back surface of an edge portion of the substrate is used as the member for forming the gap. To do .
[0030]
A treatment liquid coating method according to an eighteenth aspect is characterized in that, in the treatment liquid coating method according to the seventeenth aspect, a needle-shaped protrusion is used as the protrusion.
[0031]
20. The processing liquid coating apparatus according to claim 19, wherein the processing liquid coating apparatus applies a processing liquid onto the substrate while the substrate is rotated, and a substrate holding member that holds the substrate horizontally and rotatably, and the substrate. A rectifying member disposed around the holding member at a position where the upper surface is slightly lower than the upper surface position of the substrate holding member by a predetermined dimension, a back surface of the substrate held on the substrate holding member, and the rectifying member And a projecting member that maintains a gap dimension with the upper surface of more than 0.1 mm and less than 0.6 mm.
[0032]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0033]
FIG. 1 is a plan view of a substrate mounting portion in a processing liquid coating apparatus showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the substrate mounting portion of FIG.
[0034]
In FIG. 1 and FIG. 2, a vacuum chuck 12 as a rectangular substrate holding member that holds the substrate 13 by forming a suction surface 12 a on the upper surface and vacuum-sucking the substrate 13 at the center of the substrate platform 11. Is provided. A rectifying plate 14 as a rectifying member having a circular outer periphery is disposed on the periphery of the vacuum chuck 12, and the vacuum chuck 12 is disposed so as to be embedded in the central portion of the rectifying plate 14. In this case, the height of the upper surface of the vacuum chuck 12 is set to be slightly higher than the height of the upper surface of the rectifying plate 14 in order to prevent the resist after spin processing from entering the back surface of the substrate. Thus, when the substrate 13 is held on the upper surface of the vacuum chuck 12 by vacuum suction, a slight gap is generated between the rear surface of the substrate and the upper surface of the rectifying plate 14. This slight gap is desirably a gap of about 0.2 to 0.5 mm. Regardless of whether the gap is 0.1 mm or less or 0.6 mm or more, the resist tends to wrap around the back surface of the substrate.
[0035]
In order to maintain a slight gap between the back surface of the substrate end and the upper surface of the rectifying plate 14, when the size of the substrate 13 is large and is held on the vacuum chuck 12, the substrate 13 overhangs. Since the amount is large, the edge of the substrate 13 hangs down, but a protrusion member 15 for preventing the sag is disposed at that position. The projecting member 15 needs to be disposed at least at the four corners of the substrate 13. That is, the protruding member 15 is disposed at a position where the overhang amount of the substrate 13 is at least the largest. In the present embodiment, in addition to the four corners of the substrate 13, the projecting member 15 is embedded at a position on the current plate 14 side corresponding to the center of the edge of the substrate 13 on the short side of the rectangular vacuum chuck 12. Thus, the gap between the back surface of the substrate and the upper surface of the rectifying plate 14 is adjusted to be optimum. In addition to the four corners of the substrate 13, on the long side of the rectangular vacuum chuck 12, a position on the rectifying plate 14 side corresponding to the position where the pitch dimension that is half the long side dimension of the substrate 13 is opened. Also, two protruding members 15 are embedded, and the gap between the back surface of the substrate and the upper surface of the rectifying plate 14 is adjusted to be optimal.
[0036]
Further, the contact position between the projecting member 15 for preventing the drooping and the edge of the substrate 13 is such that a resist 18 is accumulated on the edge of the substrate 13 as shown in FIG. In the case of a spherical drop 18a, the position needs to be at least inside the diameter dimension of the drop 18a. Further, since it is necessary to maintain a gap between the back surface of the substrate and the top surface of the rectifying plate 14, the contact portion of the protruding member 15 with the back surface of the substrate 13 is preferably a single needle.
[0037]
Furthermore, a number of grooves (not shown) are formed in the suction surface 12a of the vacuum chuck 12, and these grooves communicate with a vacuum pipe provided near the center of the vacuum chuck 12. By degassing the air inside, the entire suction surface 12a is made uniform through a large number of grooves on the upper surface of the vacuum chuck 12.
[0038]
4 is a perspective view of the protruding member 15 of FIG. 1, FIG. 5 is a plan view of the protruding member 15 of FIG. 4, and FIG. 6 is a side view of the protruding member 15 of FIG.
[0039]
4 to 6, the protruding member 15 is formed in a circular plate shape having a predetermined thickness, and has a protruding portion 16 at the center of one surface thereof. The height of the projecting portion 16 is set so that the dimension of the projecting member 15 protruding from the upper surface of the rectifying plate 14 is about 0.2 to 0.5 mm when the projecting member 15 is set in the recess of the rectifying plate 14. is doing. Screw holes 17a and 17b, which are countersunk, are provided at positions that are point-symmetric with respect to the positions of the protrusions 16, and the recesses on the rectifying plate 14 side are provided through these holes 17a and 17b. Screws are screwed into the screw holes to fix the protruding member 15 to the recess on the rectifying plate 13 side. It is sufficient that at least one protrusion 16 is provided on the protrusion member 15.
[0040]
With the above configuration, when it is necessary to process several types of substrates, the vacuum chuck 12 corresponding to the smallest substrate is manufactured, and even when the large size substrate 13 is held by the vacuum chuck 12, the substrate 13 By arranging the protruding member 15 at a position where the overhang amount of the substrate 13 is large so that the back surface of the substrate 13 does not contact the upper surface of the rectifying plate 14 due to sagging of the edge portion of the substrate 13, the edge portion of the substrate 13 is forcibly The gap between the back side and the upper surface portion of the rectifying plate 14 can be maintained within a predetermined dimension, and no liquid residue is generated at the contact portion or the gap as in the prior art, and the resist 18 wraps around the back surface of the substrate. Can be prevented.
[0041]
Further, by preventing the resist 18 from entering the back surface of the substrate, only one type of vacuum chuck 12 and rectifying plate 14 can be used even when there are many types of substrate sizes. 14 replacement mounting work becomes unnecessary.
[0042]
Further, since the vacuum chuck 12 can be made small even with respect to a large-sized substrate, the vacuum chuck 12 can be easily manufactured, and the load on the spin motor can be reduced because it is light.
[0043]
Furthermore, since the gap between the rear edge of the substrate 13 and the upper surface portion of the rectifying plate 14 can be adjusted within a predetermined dimension by the protruding portion 16 of the protruding member 15, the accuracy of the rectifying plate 14 and the assembly accuracy can be improved. Can be adjusted accordingly.
[0044]
In the present embodiment, the resist 18 is used as the processing liquid. However, other processing liquid such as a developer may be used as the processing liquid.
[0045]
【The invention's effect】
As described above, according to the present invention, the gap between the back surface of the substrate held on the substrate holding member and the top surface of the rectifying member corresponds to at least four corners of the edge portion of the substrate so as to maintain a predetermined dimension. If the substrate size is large and thin, even if the edge of the substrate tries to hang down after the spin processing, the protruding portion of the protruding member is positioned at least at the position where it hangs down. The gap between the edge of the substrate and the upper surface of the current plate can be secured to a predetermined size, and there is no liquid residue at the contact portion or gap as in the prior art. A wraparound can be prevented. As a result, the reliability of various substrates can be improved and the yield can be improved. In addition, by preventing the processing liquid from entering the back surface of the substrate, it is not necessary to provide a substrate holding member and a rectifying plate for each substrate size to perform replacement mounting work.
[Brief description of the drawings]
FIG. 1 is a plan view of a substrate mounting portion in a processing liquid coating apparatus showing an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA ′ of the substrate mounting portion in FIG.
FIG. 3 is an enlarged view of a portion X in FIG. 2;
4 is a perspective view of the protruding member of FIG. 1. FIG.
FIG. 5 is a plan view of the protruding member of FIG.
6 is a side view of the protruding member of FIG. 4;
FIG. 7 is a perspective view of a conventional processing liquid coating apparatus.
8 is a plan view of a substrate mounting portion in the processing liquid coating apparatus of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Substrate mounting part 12 Vacuum chuck 12a Suction surface 13 Substrate 14 Current plate 15 Protruding member 16 Protruding part 18 Resist 18a Drop

Claims

In a processing liquid coating apparatus that coats a processing liquid on the substrate while the substrate is rotated, a substrate holding member that holds the substrate horizontally and rotatably, and the substrate holding member is disposed around the substrate holding member. The gap dimension between the rectifying member disposed at a position where the upper surface is slightly lower than the upper surface position by a predetermined dimension, and the back surface of the substrate held on the substrate holding member and the upper surface of the rectifying member is 0.1 mm. A processing liquid coating apparatus comprising: a protruding member that is maintained to be less than 0.6 mm and contacts only the back surface of the substrate.

A substrate holding member for horizontally holding the substrate is provided in the center, and a rectifying member is provided around the substrate holding member and the upper surface of the substrate holding member is disposed at a position slightly lower than the upper surface by a predetermined dimension. And a back surface of the substrate held on the substrate holding member and an upper surface of the rectifying member in the processing liquid coating apparatus for applying the processing liquid on the substrate by rotating the substrate held on the substrate holding member. characterized in that gap and to maintain over a 0.1mm to less than 0.6 mm, the protrusion member having a projection only contacts the back surface of the edge portion of the substrate is provided on the rectifying member side with A processing liquid coating apparatus.

The treatment liquid coating apparatus according to claim 1, wherein the protruding member is provided on each of the rectifying members corresponding to at least four corners of the edge portion of the substrate.

Other projecting members are provided so as to be substantially along a straight line connecting the rectifying member side projecting member corresponding to the four corners of the edge of the substrate and the projecting member adjacent to the projecting member. The treatment liquid coating apparatus according to claim 3.

5. The process according to claim 1, wherein the protruding member is disposed at a position that forms a rectangle as a whole along the inner periphery of the substrate held by the holding member. 6. Liquid coating device.

The treatment liquid coating apparatus according to claim 1, wherein the protruding member is set so that a protruding amount from the rectifying member is more than 0.1 mm and less than 0.6 mm.

The treatment liquid coating apparatus according to claim 1, wherein the rectifying member is provided with a hole for mounting the protruding member .

The treatment liquid coating apparatus according to claim 7, wherein the protrusion member has a main body portion fitted into the hole, and the protrusion protrudes from an upper surface of the main body portion .

The processing liquid coating apparatus according to claim 8, wherein the main body is formed in a circular plate shape having a predetermined thickness .

The treatment liquid coating apparatus according to claim 2, wherein the protrusion has a sharp tip .

The processing liquid coating apparatus according to claim 2, wherein a gap dimension between the rectifying member and the substrate is adjusted by the protrusion .

The processing liquid coating apparatus according to claim 1, wherein the substrate holding member is dimensioned so as to correspond to the smallest substrate .

The processing liquid coating apparatus according to claim 1, wherein the substrate holding member is a vacuum chuck that holds the substrate by vacuum suction .

The processing liquid coating apparatus according to claim 1, wherein the processing liquid is a photoresist liquid or a developer .

The substrate includes a semiconductor substrate, a liquid crystal display substrate, the treatment liquid application apparatus according to any one of claims 1 to 14, characterized in that for use in any of the color filter and the plasma display panel.

In the processing liquid coating method in which the processing liquid is applied onto the substrate while the substrate is rotated, the upper surface is disposed at a position slightly lower than the upper surface of the substrate holding member that holds the substrate horizontally and rotatably. The upper surface of the rectifying member surrounding the holding member and the back of the substrate A gap between 0.1 mm and less than 0.6 mm is formed between the substrate and a member that contacts only the back surface of the substrate, and the substrate holding member, the rectifying member, and the substrate are integrally rotated around the center. A processing liquid coating method, wherein the processing liquid is supplied to the surface of the rotating substrate.

The process liquid coating method according to claim 16, wherein a projection member having a projection abutting against the back surface of the edge portion of the substrate is used as the member for forming the gap .

The treatment liquid coating method according to claim 17, wherein a needle-like member is used as the protrusion .

In a processing liquid coating apparatus that coats a processing liquid on the substrate while the substrate is rotated, a substrate holding member that holds the substrate horizontally and rotatably, and the substrate holding member is disposed around the substrate holding member. The gap dimension between the rectifying member disposed at a position where the upper surface is slightly lower than the upper surface position by a predetermined dimension, and the back surface of the substrate held on the substrate holding member and the upper surface of the rectifying member is 0.1 mm. A processing liquid coating apparatus comprising a protruding member that is maintained to be less than 0.6 mm.