JP3821083B2 - Electronics - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device that includes a power supply device that can supply power obtained by receiving a radio signal transmitted by an external device, and that is configured to be portable while operating with the power .
[0002]
[Problems to be solved by the invention]
In recent years, IC cards, RFID tags, and the like are becoming popular. Microcomputer (microcomputer) chips are embedded in these, and personal and article ID information and data are stored in the memory on the chip, and are used by people carried or attached to objects. . Then, when approaching a card reader that reads stored data, a microcomputer such as an IC card is activated by being fed by an electromagnetic signal or radio wave signal transmitted from the card reader, and communicates with the card reader. It is like that.
[0003]
16A and 16B show the configuration of the IC card, where FIG. 16A is a plan view showing the inside of the IC card in a transparent manner, FIG. 16B is a side view (thickness dimension is slightly enlarged), and FIG. FIG. 4 is an enlarged view showing a cross section AA ′ shown in FIG. The IC card 1 is configured by disposing a control LSI 3 and a coil pattern 4 constituting an antenna on the surface of a base substrate 2 and attaching protective films 5 and 6 to the upper and lower layers.
[0004]
Such a communication system using the IC card 1 has a problem that the communication distance is short due to restrictions on the structure of the apparatus and the manufacturing method. For example, when the IC card 1 is used as an ID card for entrance / exit management, as shown in FIG. 17, a gate provided with a card reader 7 is provided, and a person carrying the IC card 1 passes the gate. However, at that time, communication is not possible unless the IC card 1 is brought close to the communication antenna 8 of the card reader 7 arranged at the gate to about several centimeters. For this reason, the user needs to hold the IC card 1 over the part where the communication antenna 8 is placed.
[0005]
Therefore, for example, when both hands of the user are closed to carry the luggage, the user stops in front of the gate, lowers the luggage, takes out the IC card 1 from a pocket of clothes, and holds the card 1 over the antenna. There is a case where it is not convenient because it is necessary to go through the gate registration after entering the card and holding the card 1 and passing the gate.
[0006]
The present invention has been made in view of the above circumstances, and an object, even if between the device that transmits power using radio signals are spaced at a greater distance, enables communication with the Do that electronic To provide equipment.
[0007]
[Means for Solving the Problems]
According to the electronic device of claim 1, the first antenna coil wound around the outer edge portion of the base substrate a plurality of times, and arranged on the inner surface of the first antenna coil so as to be arranged on the base substrate surface. A plurality of second antenna coils, a switching unit for switching the connection between the plurality of second antenna coils in series and in parallel, and a control means for controlling switching in the switching unit, The antenna coil is configured to supply the received power to the control means, and the second antenna coil is configured to supply the received power to the main body of the device.
[0008]
And a control means switches the connection between several 2nd antenna coils in series and parallel by controlling the switching in a switching part. That is, the induced voltage increases when a plurality of second antenna coils are connected in series, and the current obtained increases when they are connected in parallel. Therefore, it is possible to adjust so as to obtain the optimum voltage and current by appropriately switching the connection between the plurality of second antenna coils.
[0009]
According to the electronic apparatus according to claim 2, the base substrate on which the second antenna coil are arranged a plurality of stacked, the second antenna coil is constituted by connecting in series for the stacking direction. Therefore, since the electric power supplied through the second antenna coil is increased by receiving the radio signal, the communicable distance between the external device and the electronic device can be further increased, and convenience can be improved. It becomes possible.
[0010]
According to the electronic equipment according to claim 3, a base substrate on which the first antenna coil is arranged laminating a plurality of the first antenna coil is constituted by connecting in series for the stacking direction. Therefore, the power supplied through the first antenna coil is increased by receiving the radio signal.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
A first embodiment when the present invention is applied to an IC card will be described below with reference to FIGS. FIG. 1A is a plan view showing the inside of the IC card in this embodiment, FIG. 1B is a side view (showing a slightly enlarged thickness dimension), and FIG. It is a figure which expands and shows an AA 'cross section.
[0013]
The IC card 11 is a base substrate in which a coil pattern (antenna coil) 13 constituting an antenna is disposed on a thermoplastic resin film 12 and a conductive paste 15 is filled in a via hole 14 for electrically connecting each layer. A plurality of (coil arrangement layers) 16 are stacked and integrally formed. The control LSI 17 that is a microcomputer may be disposed on the base substrate 16 of any layer. Protective films 18 and 19 on which a predetermined display is printed are affixed to the upper layer and the lower layer of the base substrate 16 overlaid in a plurality of layers as in the conventional configuration. When the control LSI 17 is disposed on the inner layer, the protective films 18 and 19 are not necessarily required.
[0014]
FIG. 3 shows a manufacturing process of the IC card 11. First, a conductor such as copper foil 20 (thickness is, for example, 18 μm) is attached to one surface of the resin film 12 that is an insulating substrate (see FIG. 3A), and the coil pattern 13 is patterned by etching (FIG. 3). (See (b)). The composition of the resin film 12 is composed of, for example, 35 to 65% by weight of a polyetherketone resin and 65 to 35% by weight of a polyetherimide, and the thickness thereof is formed to be about 25 to 75 μm.
[0015]
After the patterning is completed, a protective film 21 is attached to the opposite surface of the resin film 12, and a carbon dioxide laser is irradiated from the protective film 21 side to form a bottomed via hole 14 having the contact point 13a of the coil pattern 13 as a bottom surface. (See FIG. 3C). At this time, the laser output and the irradiation time are adjusted so as not to penetrate the contact point 13a.
[0016]
Next, the conductive paste 15 is filled into the via hole 14 (see FIG. 3D). The conductive paste 15 is a paste formed by adding a binder resin or an organic solvent to metal particles such as copper, silver, tin, and the like, and is printed and filled in the via hole 14 by a screen printer using a metal mask. . Thereafter, the protective film 21 is peeled off (see FIG. 3E). Thus, one base substrate 16 is formed.
[0017]
Subsequently, a predetermined number of layers are laminated with the surface of the base substrate 16 on which the coil pattern 13 is formed facing downward (see FIG. 3F). Note that a cover layer 22 is disposed in the lowermost layer in order to protect the upper coil pattern 13. The elastic modulus of the cover layer 22 is preferably 1 to 1000 Mpa in consideration of the heat-fusibility between the films 12. If the value exceeds this value, heat fusion becomes difficult.
[0018]
And in the state laminated | stacked like FIG.3 (f), they are collectively heated by a vacuum press machine at 200-350 degreeC, and it pressurizes with the pressure of 0.1-10 Mpa. Then, since each film 12 heat-seal | fuses, they are integrally formed (refer FIG.3 (g)). In addition, an example of the material characteristic of the film 12 is shown in FIG. 6, and pressurization conditions are shown in FIG. Further, when the control LSI 17 is arranged in the inner layer, it is necessary to connect the coil pattern 13 of the layer arranged when the base substrate 16 is laminated at the stage of FIG. good.
[0019]
FIG. 4 shows two base substrates 16 arranged one above the other and connected directly via contact points 13a on the same surface side. The coil pattern 13 is arranged with the number of turns “3” for each base substrate 16, and the outer contact point 13 a OUT of the upper base substrate 16 is connected to the contact point 13 a OUT of the upper base substrate 16.
[0020]
The inner contact point 13aIN in the upper base substrate 16 is connected to the inner contact point 13aIN in the lower base substrate 16, and the outer contact point 13aOUT in the lower base substrate 16 is connected to the lower base substrate 16. To the contact point 13aOUT. FIG. 5 is a three-dimensional perspective view showing the connection state of the coil patterns 13 of each layer after lamination (the windings are connected so as to be continuously in the same direction).
[0021]
That is, since the electromotive force of the coil is proportional to the number of turns, the electromotive force induced by electromagnetic induction on the IC card 11 side is increased by the electromagnetic signal transmitted from the card reader in accordance with the number of base substrates 16 to be stacked.
[0022]
Therefore, for example, assuming that the IC card 11 configured in this way is used as an ID card in which an employee number or the like is stored, the transmission output on the card reader side remains the current specification, and FIG. As shown, the antenna 24 of the card reader (external device) 23 is placed on the user's passage head.
[0023]
If the user enters the IC card 11 in the communicable area 25 of the antenna 24 with the IC card 11 placed in, for example, a jacket pocket or a bag, the IC card 11 transmits a radio signal (for example, 13 MHz band) is received and power is supplied, and both can automatically communicate. That is, the user can automatically read the employee number stored in the IC card 11 by the card reader 23 without taking the IC card 11 out of the pocket or bag and bringing it close to the antenna 24. Verification is performed.
[0024]
As described above, according to this embodiment, the IC card 11 is laminated with a plurality of base substrates 16 on which the coil pattern 13 for receiving a radio signal transmitted from the card reader 23 is arranged in a plane. The coil patterns 13 arranged in the respective layers were electrically connected. Therefore, since the electric power supplied through the coil pattern 13 is increased by receiving the radio signal, the communicable distance between the card reader 23 and the IC card can be further increased, and the convenience is improved. It becomes possible.
[0025]
In addition, since the base substrate 16 is composed of the thermoplastic resin film 12 as a base material, the IC card 11 is integrally formed by performing heating and pressurization in a state where a plurality of base substrates 16 are laminated. In addition, the thickness of the laminated base substrate 16 as a whole can be reduced, and it can be manufactured in a much shorter time than the conventional method of laminating a plurality of layers.
[0026]
(Second embodiment)
8 to 12 show a second embodiment of the present invention. The same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted, and only different parts will be described below. FIG. 8 shows the configuration of the entire power feeding system. A plurality of transmission antennas 33 of the power transmission device 32, which is an external device, are arranged side by side above the user's passage 31, and their communicable areas 34 overlap each other.
[0027]
When the user carries the electronic device 35 and is positioned in the passage 31, the electronic device 35 is powered by receiving a radio wave signal transmitted from the transmitting antenna 33 and is operable. That is, the electronic device 35 is configured to be portable such as a PDA (Personal Digital Assistants), a personal computer, a mobile phone, a television, a radio, a digital camera, and the like, and includes a power supply device 36.
[0028]
9 to 12 show the configuration of the power feeding device 36. The power feeding device 36 is formed by the same manufacturing method as the IC card 11 in the first embodiment. FIG. 9 is a plan view of one layer of the base substrate (coil arrangement layer) 37. A coil pattern ( first antenna coil) 38 as a receiving antenna that is wound a plurality of times is disposed on the outer edge portion of the base substrate 37 that forms a rectangle. This coil pattern 38 supplies power to a control LSI (control means) 39. Similar to the IC card 11, similar coil patterns 38 are arranged on a plurality of base boards, and these are connected in series. Yes.
[0029]
On the inner peripheral side of the coil pattern 38, 20 plural coil patterns (second antenna coils) 40 are arranged in an array of 4 rows and 5 columns. These coil patterns 40 are connected in series for each row, and as shown in FIG. 11 (for convenience, only three layers and three rows), the coil patterns 40 having the same arrangement are arranged on a plurality of base boards. They are connected in series in the stacking direction.
[0030]
The power output line 41 is connected to the first row and first column of the coil pattern 40 and is also connected to the switching terminal c of the switching units 42A to 42C arranged at the end of the coil pattern 40. The power output line 43 is connected to the fourth row and fifth column of the coil pattern 40 and is also connected to the switching terminal d of the switching units 42A to 42C.
[0031]
The switching unit 42 includes a plurality of switching elements, and is controlled by the control LSI 39 in order to switch the electrical connection of the coil pattern 40. The power output lines 41 and 43 are power lines for supplying power to the main body of the electronic device 35. The control LSI 39 is connected to a signal line 44 for communicating a control command and the like with the main body of the electronic device 35.
[0032]
The switching terminal a of the switching unit 42A is connected to the coil pattern 40 at the end of the first row, and the switching terminal b is connected to the coil pattern 40 at the second row and first column. Similarly, the switching terminal a of the switching unit 42B is connected to the coil pattern 40 at the end of the second row, and the switching terminal b is connected to the coil pattern 40 of the third row and first column, for switching the switching unit 42C. The terminal a is connected to the coil pattern 40 at the end of the third row, and the switching terminal b is connected to the coil pattern 40 in the fourth row and first column. The switching terminals c and d of the switching unit 42 are connected to power output lines 41 and 43, respectively.
[0033]
FIG. 10 is simplified for easy understanding of the connection switching mode of the coil pattern 40. When three coil patterns 40 (1) to 40 (3) are connected in series, the control LSI 39 controls to connect the switching terminals a-b of the switching units 42 (1) and 42 (2). (The terminals a and d and the terminals bc are separated). On the other hand, when the three coil patterns 40 (1) to 40 (3) are connected in parallel, the control LSI 39 is connected between the switching terminals a-d of the switching units 42 (1) and 42 (2), the terminal b- Control to connect between c.
[0034]
As shown in FIG. 9, the power supply device 36 configured as described above is arranged in a state of being attached on the surface of the electronic device 35, and supplies power to the electronic device 35 via the power output lines 41 and 43. . As shown in FIG. 12, when a plurality of coil patterns 40 are connected in series, the voltage level of the received power can be increased, and when a plurality of coil patterns 40 are connected in parallel, the current level of the received power is Can be raised. In FIG. 12, the direction in which the number of coil connections increases for both voltage and current is reversed.
[0035]
A control circuit (not shown) arranged on the electronic device 35 side monitors the received power state at each time, and when it is desired to increase the voltage level, the power feeding device 36 connects the coil patterns 40 of each row in series. A control command is transmitted to the control IC 39. Further, when it is desired to increase the current level, a control command is transmitted to the control IC 39 so that the coil patterns 40 in each row are connected in parallel. Then, the control IC 39 switches the switching unit 42 in response to the control command.
[0036]
As described above, according to the second embodiment, the power feeding device 36 receives the radio wave signal transmitted from the transmission antenna 33 of the power transmission device 32 and feeds power to the portable electronic device 35. Arranged. That is, since the power supply device 36 can be configured to be extremely thin, the power supply device 36 can be configured integrally with the electronic device 35, and the electronic device 35 can operate when close to the place where the power transmission device 32 is installed. In that area, it is not necessary to use a battery or connect a power line for connecting to a power source, and the user can surely get an opportunity to operate the electronic device 35.
[0037]
The control LSI 39 of the power feeding device 36 switches the connection between the plurality of coil patterns 40 in series and in parallel by controlling the switching of the switching unit 42. Therefore, the electronic device 35 can be adjusted so as to obtain an optimum voltage and current.
[0038]
(Third embodiment)
FIG. 13 shows a third embodiment of the present invention. 3rd Example shows the other example which comprises the electronic device 51 and the electric power feeder 52 integrally. The electrical configurations of the electronic device 51 and the power feeding device 52 are the same as those of the electronic device 51 and the power feeding device 52 in the second embodiment. And as shown in FIG. 13, the display operation part 53, such as a display and an operation panel, is arrange | positioned at the surface side of the electronic device 51, and the electric power feeder 52 is arrange | positioned at the back side. The display operation unit 53 is provided with an indicator (such as an LED) 54 that is in a state where power is supplied from the power supply device 52 and the electronic device 51 is operable.
[0039]
(Fourth embodiment)
14 and 15 show a fourth embodiment of the present invention. The fourth embodiment shows another example in which the power supply device 56 is integrated when the electronic device 55 is a personal computer, for example. The electronic device 55 is, for example, a laptop type. When the upper lid 57 is opened via a hinge mechanism (not shown), the display 58 and the operation panel 59 appear and become usable. The power feeding device 56 is built in the upper lid 57. In addition, an indicator 60 similar to that of the third embodiment is disposed on the power feeding device 56 side. As shown in FIG. 15, the power feeding device 56 and the main body of the electronic device 55 are connected via a power line, a communication line 61, and a connector 52.
As in the third and fourth embodiments, the electronic device and the power feeding device can be configured integrally.
[0040]
The present invention is not limited to the embodiments described above and shown in the drawings, and the following modifications or expansions are possible.
The configuration of the power feeding device 36 in the second embodiment may be applied to the operation power source of the IC card 11 in the first embodiment.
In the second embodiment, the control circuit of the electronic device 35 simply informs the power feeding device 36 of the excess or deficiency of the voltage level and current level, and the control IC 39 adjusts the coil pattern 40 in response to the notification. You may decide whether to connect in parallel.
[0041]
Further, the power supply apparatus is not limited to the configuration of the second embodiment, and may be configured to supply power received in the configuration of the first embodiment to the electronic device, for example.
In the second and third embodiments, the power feeding device may charge the secondary battery included in the electronic device.
Further, when the electronic device includes a solar cell, the electronic device may be configured to be used in combination with a power source obtained from the solar cell.
In the fourth embodiment, the display 58 may be disposed on the upper lid 57 side.
[Brief description of the drawings]
1A and 1B show a first embodiment in which the present invention is applied to an IC card, wherein FIG. 1A is a plan view showing the inside of the IC card as seen through, and FIG. 1B is a side view (thickness dimension slightly enlarged); (C) is an enlarged view of the AA ′ cross section shown in (a). FIG. 2 is a diagram showing a state in which a card reader reads data from an IC card. FIG. FIG. 4 is a diagram showing a process, and FIG. 4 is a diagram showing two base substrates arranged one above the other and directly connected via contact points on the same surface side. FIG. 5 shows a connection state of each layer coil pattern after lamination. FIG. 6 is a diagram showing an example of material characteristics of a thermoplastic resin film. FIG. 7 is a diagram showing pressurizing conditions of the thermoplastic resin film. FIG. 8 is a second embodiment of the present invention, and shows the entire power supply system. FIG. 9 is a plan view of one layer of the base substrate. FIG. 11 is a simplified view for easy understanding of the connection switching mode of coil patterns. FIG. 11 is a perspective view showing the connection state of coil patterns in each layer in three dimensions. FIG. FIG. 13 is a perspective view showing an electronic apparatus and a power feeding apparatus according to a third embodiment of the present invention. FIG. 15 is a view corresponding to FIG. 13 showing a fourth embodiment of the present invention. FIG. 15 is a view showing an upper lid portion of an electronic device including a power feeding device. FIG. 16 is a view corresponding to FIG. Fig. 2 equivalent [Explanation of symbols]
11 is an IC card, 12 is a thermoplastic resin film, 13 is a coil pattern (antenna coil), 16 is a base substrate (coil arrangement layer), 23 is a card reader (external device), 32 is a power transmission device (external device), 35 is an electronic device, 36 is a power feeding device, 37 is a base substrate (coil arrangement layer), 38 is a coil pattern ( first antenna coil), 39 is a control LSI (control means), and 40 is a coil pattern ( second antenna coil). , 42 is a switching unit, 51 is an electronic device, 52 is a power supply device, 55 is an electronic device, and 56 is a power supply device.

Claims (3)

In an electronic device that includes a power supply device that can supply power obtained by receiving a wireless signal transmitted by an external device, and that is configured to be portable while operating with the power.
The power supply device
A first antenna coil wound around the outer edge of the base substrate a plurality of times;
A plurality of second antenna coils arranged on the inner surface side of the first antenna coil so as to be arranged on the base substrate surface;
A switching unit for switching the connection between the plurality of second antenna coils in series and in parallel;
Control means for controlling switching in the switching unit,
The first antenna coil supplies received power to the control means;
The electronic device, wherein the second antenna coil is configured to supply received power to a main body of the device. A plurality of base substrates on which the second antenna coil is disposed are laminated,
The electronic device according to claim 1, wherein the second antenna coil is connected in series in the stacking direction. A plurality of base substrates on which the first antenna coil is disposed are stacked,
The electronic device according to claim 1, wherein the first antenna coil is connected in series in the stacking direction.

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