JP3818219B2 - Electronic component encapsulated package and manufacturing method thereof - Google Patents

Electronic component encapsulated package and manufacturing method thereof Download PDF

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Publication number
JP3818219B2
JP3818219B2 JP2002153009A JP2002153009A JP3818219B2 JP 3818219 B2 JP3818219 B2 JP 3818219B2 JP 2002153009 A JP2002153009 A JP 2002153009A JP 2002153009 A JP2002153009 A JP 2002153009A JP 3818219 B2 JP3818219 B2 JP 3818219B2
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Prior art keywords
glass epoxy
epoxy laminate
electronic component
wiring pattern
laminate
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JP2003347448A (en
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智彦 大坂
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Mitsumi Electric Co Ltd
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Mitsumi Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Dicing (AREA)

Description

【０００１】
【発明の属する技術分野】
この発明は、センサ等の電子部品を収容する電子部品封入パッケージ並びにその製造方法に関するものであり、特に、生産性を向上した電子部品封入パッケージ並びにその製造方法に関するものである。
【０００２】
【従来の技術及び発明が解決しようとする課題】
従来、防塵や防湿のために密閉して外気を遮断した状態に保つ必要があるセンサ類、例えば加速度センサや角速度センサ等は、セラミック板を積層した箱型パッケージにセンサ本体を収納してコバール等の金属で上面を閉鎖した形態としている。セラミックパッケージは高強度であって防塵防湿性に優れ、熱膨張率が小さく且つセンサの材料であるシリコンやガラスに熱膨張率が近いので、センサの安定性を損なう要素が少ないという理由で用いられているが、樹脂系材や金属材よりも原材料が高価であり加工が困難であるのでセンサが高価格となる原因となっている。そこで、電子部品封入パッケージの生産性を向上し、製造コストを低減するために解決すべき技術的課題が生じてくるのであり、本発明は上記課題を解決することを目的とする。
【０００３】
【課題を解決するための手段】
この発明は、上記目的を達成するために提案するものであり、第１のガラスエポキシ積層板と、電子部品を収容する第１の開口を備え、第１のガラスエポキシ積層板上に積層した第２のガラスエポキシ積層板と、前記第１の開口よりも大型の第２の開口を備え、第２のガラスエポキシ積層板上に積層した第３のガラスエポキシ積層板とからなり、開口内に電子部品を収容し開口上面に蓋を固着して電子部品を封止するように構成した電子部品封入パッケージであり、
上記第１のガラスエポキシ積層板の底面と第２のガラスエポキシ積層板の上面に配線パターンを形成するとともに、第１及び第２のガラスエポキシ積層板の側面に上下に貫通する複数のスルーホールを形成して、第１のガラスエポキシ積層板の配線パターンと第２のガラスエポキシ積層板の配線パターンとを接続した電子部品封入パッケージであって、上記第３のガラスエポキシ積層板の上面に配線パターンを形成するとともに角部に上下へ貫通するスルーホールを形成し、前記配線パターンを第１乃至第３のガラスエポキシ積層板に形成したスルーホールを通じて第１のガラスエポキシ積層板の配線パターンへ接続した電子部品封入パッケージに於いて、
上記角部に上下へ貫通するスルーホールは前記第３、第２、第１の各ガラスエポキシ積層板の三箇所の角に加工するとともに残りの一箇の角は面取り角形状とし、該三箇所のスルーホールに金または銅メッキを施し、前記上面の配線パターンを第２のガラスエポキシ積層板の三箇所の角部スルーホールを通じて第１のガラスエポキシ積層板の裏面三箇所の角部配線パターンへ接続してアースラインを形成してなり、上記電子部品は、ピエゾ抵抗型３軸加速度センサの加速度センサであり、該加速度センサを、前記第１のガラスエポキシ積層板上面の配線パターンにエポキシ系弾性接着材で接着した電子部品封入パッケージを提供するものである。
【０００７】
また、請求項２記載の発明は、第１のガラスエポキシ積層板の底面に複数の配線パターンを併設する工程と、第２のガラスエポキシ積層板の上面に複数の配線パターンを併設し、複数の開口を形成する工程と、第３のガラスエポキシ積層板の上面に複数の配線パターンを併設し、複数の開口を形成する工程と、第１のガラスエポキシ積層板に第２のガラスエポキシ積層板を接着する工程と、第１及び第２のガラスエポキシ積層板にスルーホールを形成し、スルーホール及び前記配線パターンに金属メッキを形成する工程と、第２のガラスエポキシ積層板上に第３のガラスエポキシ積層板を接着する工程と、第３のガラスエポキシ積層板にスルーホールを形成し、スルーホール及び前記配線パターンに金属メッキを形成する工程と、第１乃至第３の三層を接着したガラスエポキシ積層板を切断して複数の電子部品封入パッケージを個別に分離する工程からなる電子部品封入パッケージの製造方法を提供するものである。
【０００８】
【発明の実施の形態】
以下、この発明の実施の一形態を図に従って詳述する。図1(a)乃至(d)は、電子部品封入パッケージを示し、図1(a)はパッケージPの平面図、図1(b)はA-A方向での断面図、図1 (c)は正面図、図1 (d)は右側面図を示している。パッケージPは、図1(b)に示すように第1乃至第3のガラスエポキシ樹脂からなるガラスエポキシ銅張積層板1, 2, 3（以下、第1積層板、第２積層板、第3積層板という）を積層した3層構造の箱型パッケージであり、第1積層板1上に積層した第２積層板２にセンサ等の電子部品を収納するための開口8を備え、第2積層板2上に積層した第3積層板3に設けられた開口10よりセンサ等の電子部品をパッケージ内部へ挿入して固定した後に第3積層板3の上面に例えばコバール製の上蓋4をはんだ付けまたは接着して封止する構成である。
【０００９】
また、パッケージPは、図示しない回路基板と収納する電子部品との接続のための後述する複数の配線パターン5, 7, 9が第1, 2および3積層板1, 2, 3にそれぞれ形成され、第1, 2および3積層板1, 2, 3にそれぞれ形成されたスルーホール11, 11aによって接続されている。
【００１０】
図2乃至図4に、電子部品封入パッケージPを構成する第1積層板1、第２積層板2、第3積層板3を示す。図2(a)は電子部品封入パッケージの底板となる第1積層板1の裏面の配線パターン5、(b)は上面の配線パターン6を示し、上面の配線パターン6はセンサ等の電子部品の台座となる。図3は第2積層板2の上面の配線パターン7を示し、第２積層板2はその製造過程においてガラスエポキシ樹脂が硬化完了する前の半硬化状態のときに例えば打抜き等の手段により開口8を形成する。図4は第3積層板3の上面の配線パターン9を示し、第２積層板2と同様に例えば打抜き等の手段により開口10を形成する。第1積層板1、第２積層板2、第3積層板3は、それぞれ或る寸法のガラスエポキシ銅張積層板に複数個の単位積層板を縦横に隣接させたマトリックス状に形成し、後述する製造工程の最終段階で個別に切断される。図5はスルーホール11を形成した切断前の第２積層板2の平面図である。
【００１１】
図6及び図7は、電子部品封入パッケージPの製造工程を示し、先ず図6のように底板となる第1積層板1の上に、所定間隔で形成された複数個の開口8を有する第２積層板2が熱接着される。次に、開口8の周囲に例えば打抜き等の手段により第２積層板2と第1積層板1を貫通するスルーホール11を形成し、スルーホール11に金メッキまたは銅メッキを施して第2積層板2の上面の配線パターン7と第1積層板1の裏面の配線パターン5とを電気的に接続して配線パターンを形成する。
【００１２】
続いて、図7に示すように、開口10を形成した第3積層板3を第２積層板2の上面に熱接着する。図4に示すように、切断前の銅張りガラスエポキシ積層板の段階で第3積層板3の三箇所の角にスルーホール11aを加工することにより、個別分断後の第3積層板3の三箇所の角が凹面形状となり、残りの一箇所の角が面取り角形状となって、電子部品封入パッケージPを回路基板へ取付ける際に端子配列順序の目安となる。尚、図2及び図3のように第1積層板1と第2積層板2も三箇所の角にスルーホール11aを配置して、第3積層板3の形状に対応させている。
【００１３】
次に、第3積層板3の三箇所のスルーホール11aに金メッキまたは銅メッキを施して、図4に示す上面の配線パターン9を第2積層板2の三箇所の角部スルーホール11aを通じて第1積層板1の裏面三箇所の角部配線パターン5aへ接続し、アースラインを形成する。そして、図7に示すスルーホール11の中心位置Cをカットラインとして第1積層板1、第２積層板2、第3積層板3を井桁状に切断することにより、隣接する電子部品封入パッケージPが個別に分断され、図1に示した電子部品封入パッケージPが完成する。電子部品封入パッケージPに例えばピエゾ抵抗型３軸加速度センサを収納する場合は、第1積層板1の上面の配線パターン6にエポキシ系弾性接着剤を塗布して加速度センサを開口8の中心に接着し、加速度センサの配線端子と第2積層板2の上面の配線パターン7とをワイヤボンディングした後に、第3積層板3の上面にコバール製上蓋4をはんだ付けしてパッケージ入りピエゾ抵抗型３軸加速度センサが完成する。
【００１４】
上記のガラスエポキシ基材にて形成されたパッケージ入りの電子部品は、一般のガラスエポキシ銅張印刷配線板に搭載した場合に、パッケージと印刷配線板とが同一素材であるので熱膨張率の相違によるパッケージへのストレスが生じることがない。また、従来パッケージとして用いられているセラミックよりも熱膨張率は大きいが、センサ等の電子部品を弾性接着剤によって接着することにより、センサとガラスエポキシパッケージの膨張収縮量の差異を吸収できる。
【００１５】
尚、この発明は上記の実施形態に限定するものではなく、この発明の技術的範囲内において種々の改変が可能であり、この発明がそれらの改変されたものに及ことは当然である。
【００１６】
【発明の効果】
以上説明したように、本発明の電子部品封入パッケージは、ガラスエポキシ基材を用いるので、材料及び加工のコストがセラミックよりも低く、コストの削減に効果を奏する発明である。
そして、角部に上下へ貫通するスルーホールは前記第３、第２、第１の各ガラスエポキシ積層板の三箇所の角に加工するとともに残りの一箇所の角は面取り角形状とし、該三箇所のスルーホールに金または銅メッキを施し、前記上面の配線パターンを第２のガラスエポキシ積層板の三箇所の角部スルーホールを通じて第１のガラスエポキシ積層板の裏面三箇所の角部配線パターンへ接続してアースラインを形成してなり、上記電子部品は、ピエゾ抵抗型３軸加速度センサの加速度センサであり、該加速度センサを、前記第１のガラスエポキシ積層板上面の配線パターンにエポキシ系弾性接着材で接着した構成を採用したので、電子部品封入パッケージＰを回路基板へ取付ける際に、上記一箇所の面取り角形状が端子配列順序の目安となり製造に便宜を与えるとともに、ガラスエポキシ基材にて形成されたパッケージ入りの加速度センサは、ガラスエポキシ銅張印刷配線板に搭載した場合、パッケージと印刷配線板とが同一素材であるから熱膨張率の相違によるパッケージへのストレスを生じることがない。
また、ガラスエポキシ基材は、従来よりパッケージとして用いられているセラミックよりも熱膨張率は大きいが、加速度センサなる電子部品を弾性接着剤によって接着することにより、加速度センサとガラスエポキシパッケージの膨張収縮量の差異を吸収することができるので、防塵、防湿を要する密閉型の電子部品であるところの加速度センサの用に供するパッケージを、生産性の向上を図りながら低廉に提供することができる。
【図面の簡単な説明】
【図１】本発明の電子部品封入パッケージを示し、(a)は平面図、(b)は(a)のA-A線断面図、(c)は正面図、(d)は側面図である。
【図２】 (a)は第1積層板の裏面の配線パターン図、(b)は上面の配線パターン図である。
【図３】第2積層板の上面の配線パターン図である。
【図４】第3積層板の上面の配線パターン図である。
【図５】個別分断前の第2積層板の平面図である。
【図６】電子部品封入パッケージの製造工程を示し、図5のA-A線断面に相当する解説図。
【図７】図６に続く電子部品封入パッケージの製造工程解説図。
【符号の説明】
1 第1積層板
2 第2積層板
3 第3積層板
4 上蓋
5 配線パターン
5a 配線パターン（角部）
6 配線パターン
7 配線パターン
8 開口
9 配線パターン
10 開口
11 スルーホール
11a スルーホール（角部）
C 切断線
P 電子部品封入パッケージ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component encapsulating package for housing an electronic component such as a sensor and a method for manufacturing the same, and more particularly to an electronic component enclosing package with improved productivity and a method for manufacturing the same.
[0002]
[Prior art and problems to be solved by the invention]
Conventionally, sensors that need to be sealed to keep outside air sealed to prevent dust and moisture, such as accelerometers and angular velocity sensors, are housed in a box-type package with laminated ceramic plates, such as Kovar. The top surface is closed with metal. Ceramic packages are high-strength, excellent in dustproof and moisture-proof, have a low coefficient of thermal expansion, and have a coefficient of thermal expansion that is close to that of silicon and glass, which are sensor materials, and are used because there are few factors that impair the stability of the sensor. However, since raw materials are more expensive than resin-based materials and metal materials, and processing is difficult, it is a cause of high price of the sensor. Therefore, technical problems to be solved in order to improve the productivity of the electronic component encapsulated package and reduce the manufacturing cost arise, and the present invention aims to solve the above problems.
[0003]
[Means for Solving the Problems]
The present invention proposes to achieve the above object, and includes a first glass epoxy laminate and a first opening for accommodating an electronic component, and is laminated on the first glass epoxy laminate. 2 glass epoxy laminate and a third glass epoxy laminate having a second opening larger than the first opening and laminated on the second glass epoxy laminate, and an electron in the opening. An electronic component encapsulating package configured to seal the electronic component by housing the component and fixing the lid to the upper surface of the opening,
A wiring pattern is formed on the bottom surface of the first glass epoxy laminate and the top surface of the second glass epoxy laminate, and a plurality of through holes penetrating vertically are formed on the side surfaces of the first and second glass epoxy laminates. An electronic component encapsulating package formed and connected to the wiring pattern of the first glass epoxy laminate and the wiring pattern of the second glass epoxy laminate, wherein the wiring pattern is formed on the upper surface of the third glass epoxy laminate. And a through hole penetrating vertically at the corner, and connecting the wiring pattern to the wiring pattern of the first glass epoxy laminate through the through hole formed in the first to third glass epoxy laminates In the electronic component enclosure package,
The through-hole penetrating up and down the corner is processed into three corners of the third, second and first glass epoxy laminates, and the remaining one corner is chamfered, and the three corners Gold or copper plating is applied to the through hole of the first glass epoxy laminate, and the wiring pattern on the upper surface is transferred to the corner wiring pattern on the back surface of the first glass epoxy laminate through the three corner through holes of the second glass epoxy laminate. The electronic component is an acceleration sensor of a piezoresistive triaxial acceleration sensor, and the acceleration sensor is connected to the wiring pattern on the upper surface of the first glass epoxy laminated board. The present invention provides an electronic component encapsulating package bonded with an adhesive .
[0007]
According to the second aspect of the present invention , a plurality of wiring patterns are provided on the bottom surface of the first glass epoxy laminate, a plurality of wiring patterns are provided on the top surface of the second glass epoxy laminate, and a plurality of wiring patterns are provided. A step of forming an opening; a step of forming a plurality of wiring patterns on the upper surface of the third glass epoxy laminate; and a step of forming a plurality of openings; and a second glass epoxy laminate on the first glass epoxy laminate. Bonding, forming through holes in the first and second glass epoxy laminates, forming metal plating on the through holes and the wiring pattern, and third glass on the second glass epoxy laminate. A step of bonding the epoxy laminate, a step of forming a through hole in the third glass epoxy laminate, and forming a metal plating on the through hole and the wiring pattern; By cutting the glass epoxy laminate bonding the three layers of which is provided a method of manufacturing the electronic component encapsulation package comprising a step of separating the plurality of electronic components encapsulation package individually.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. 1 (a) to 1 (d) show an electronic component encapsulated package, FIG. 1 (a) is a plan view of the package P, FIG. 1 (b) is a cross-sectional view in the AA direction, and FIG. 1 (c) is a front view. Fig. 1 (d) shows a right side view. As shown in FIG. 1 (b), the package P includes glass epoxy copper clad laminates 1, 2, and 3 (hereinafter referred to as a first laminate, a second laminate, a third laminate, and the like made of first to third glass epoxy resins). A box-type package with a three-layer structure (referred to as a laminated board). The second laminated board 2 laminated on the first laminated board 1 is provided with an opening 8 for storing electronic components such as sensors. An electronic component such as a sensor is inserted into the package from the opening 10 provided in the third laminated plate 3 laminated on the plate 2 and fixed, and then an upper cover 4 made of Kovar, for example, is soldered to the upper surface of the third laminated plate 3 Or it is the structure which adhere | attaches and seals.
[0009]
In the package P, a plurality of wiring patterns 5, 7, and 9 to be described later for connection between a circuit board (not shown) and an electronic component to be stored are formed on the first, second, and third laminated plates 1, 2, and 3, respectively. The first, second, and third laminated plates 1, 2, and 3 are connected to each other through through holes 11, 11a.
[0010]
2 to 4 show the first laminated plate 1, the second laminated plate 2, and the third laminated plate 3 constituting the electronic component enclosing package P. FIG. Fig. 2 (a) shows the wiring pattern 5 on the back surface of the first laminated board 1 that is the bottom plate of the electronic component enclosing package, (b) shows the wiring pattern 6 on the top surface, and the wiring pattern 6 on the top surface shows the electronic component such as a sensor. Become a pedestal. FIG. 3 shows a wiring pattern 7 on the upper surface of the second laminated board 2. When the second laminated board 2 is in a semi-cured state before the glass epoxy resin is completely cured in the manufacturing process, the opening 8 is formed by means such as punching. Form. FIG. 4 shows the wiring pattern 9 on the upper surface of the third laminated plate 3, and the opening 10 is formed by means such as punching as in the second laminated plate 2. The first laminated plate 1, the second laminated plate 2, and the third laminated plate 3 are formed in a matrix form in which a plurality of unit laminated plates are vertically and horizontally adjacent to a certain size glass epoxy copper clad laminated plate, respectively. It is cut individually at the final stage of the manufacturing process. FIG. 5 is a plan view of the second laminated plate 2 before the cutting in which the through hole 11 is formed.
[0011]
6 and 7 show the manufacturing process of the electronic component encapsulating package P. First, as shown in FIG. 6, a first laminate 1 having a plurality of openings 8 formed at predetermined intervals on the first laminated plate 1 serving as a bottom plate. Two laminates 2 are heat bonded. Next, a through hole 11 that penetrates the second laminated plate 2 and the first laminated plate 1 is formed around the opening 8 by, for example, punching, and the second laminated plate is plated with gold or copper. A wiring pattern is formed by electrically connecting the wiring pattern 7 on the top surface of 2 and the wiring pattern 5 on the back surface of the first laminate 1.
[0012]
Subsequently, as shown in FIG. 7, the third laminated plate 3 in which the opening 10 is formed is thermally bonded to the upper surface of the second laminated plate 2. As shown in FIG. 4, by processing through holes 11a at three corners of the third laminated plate 3 at the stage of the copper-clad glass epoxy laminated plate before cutting, three of the third laminated plates 3 after individual division are obtained. The corners of the portions are concave, and the remaining one corner is a chamfered corner, which is a measure of the terminal arrangement order when the electronic component encapsulating package P is attached to the circuit board. 2 and 3, the first laminated plate 1 and the second laminated plate 2 are also arranged with through holes 11a at three corners so as to correspond to the shape of the third laminated plate 3.
[0013]
Next, gold plating or copper plating is applied to the three through-holes 11a of the third laminate 3, and the upper wiring pattern 9 shown in FIG. 4 is passed through the three corner through-holes 11a of the second laminate 2. 1 Connect to the corner wiring pattern 5a at the three positions on the back surface of the laminate 1 to form an earth line. Then, the first laminated plate 1, the second laminated plate 2, and the third laminated plate 3 are cut into a cross-beam shape with the center position C of the through hole 11 shown in FIG. Are individually divided, and the electronic component encapsulating package P shown in FIG. 1 is completed. For example, when a piezoresistive three-axis acceleration sensor is housed in the electronic component encapsulating package P, an epoxy elastic adhesive is applied to the wiring pattern 6 on the upper surface of the first laminated board 1 to adhere the acceleration sensor to the center of the opening 8. Then, after wire bonding the wiring terminals of the acceleration sensor and the wiring pattern 7 on the upper surface of the second laminated board 2, a Kovar upper cover 4 is soldered to the upper surface of the third laminated board 3, and the packaged piezoresistive triaxial The acceleration sensor is completed.
[0014]
Packaged electronic parts formed with the above glass epoxy base material, when mounted on a general glass epoxy copper-clad printed wiring board, the package and the printed wiring board are the same material, so the difference in thermal expansion coefficient The package does not cause stress. Moreover, although the thermal expansion coefficient is larger than that of a ceramic conventionally used as a package, the difference in expansion and contraction between the sensor and the glass epoxy package can be absorbed by bonding an electronic component such as a sensor with an elastic adhesive.
[0015]
Note that the present invention is not limited to the above-described embodiment, and various modifications are possible within the technical scope of the present invention, and the present invention naturally extends to those modified.
[0016]
【The invention's effect】
As described above, since the electronic component encapsulating package of the present invention uses a glass epoxy base material, the cost of material and processing is lower than that of ceramic, and is effective in reducing the cost.
And the through-hole penetrating vertically in the corner is processed into three corners of the third, second, and first glass epoxy laminates, and the other corner is chamfered, and the three Gold or copper plating is applied to the through holes at the locations, and the wiring patterns on the upper surface are connected to the corner wiring patterns on the back surface of the first glass epoxy laminate through the three corner through holes of the second glass epoxy laminate. connected to it to form a ground line, the electronic component is an acceleration sensor of the piezoresistive type 3-axis acceleration sensor, epoxy acceleration sensor, the wiring pattern of the first glass epoxy laminate top Since a configuration bonded with an elastic adhesive is adopted, when the electronic component encapsulating package P is mounted on a circuit board, the chamfered corner shape at one location is a guideline for the terminal arrangement order. In addition to providing convenience, a packaged acceleration sensor formed of a glass epoxy base material has a different thermal expansion coefficient when mounted on a glass epoxy copper-clad printed wiring board because the package and the printed wiring board are the same material. This will not cause any stress on the package.
The glass epoxy substrate is thermal expansion than ceramic conventionally used as a package larger, by adhering an acceleration sensor comprising an electronic component by an elastic adhesive, expansion and contraction of the acceleration sensor and the glass epoxy package Since the difference in quantity can be absorbed, a package provided for an acceleration sensor, which is a sealed electronic component that needs to be protected against dust and moisture, can be provided at low cost while improving productivity.
[Brief description of the drawings]
1A and 1B show an electronic component encapsulating package of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view taken along the line AA in FIG.
FIG. 2A is a wiring pattern diagram on the back surface of the first laminated board, and FIG. 2B is a wiring pattern diagram on the top surface.
FIG. 3 is a wiring pattern diagram of an upper surface of a second laminated board.
FIG. 4 is a wiring pattern diagram on an upper surface of a third laminated board.
FIG. 5 is a plan view of a second laminated plate before individual division.
6 is an explanatory view showing the manufacturing process of the electronic component encapsulating package and corresponding to a cross section taken along line AA of FIG. 5;
FIG. 7 is an explanatory diagram of a manufacturing process of the electronic component encapsulating package following FIG. 6;
[Explanation of symbols]
1 First laminate
2 Second laminate
3 Third laminate
4 Upper lid
5 Wiring pattern
5a Wiring pattern (corner)
6 Wiring pattern
7 Wiring pattern
8 opening
9 Wiring pattern
10 opening
11 Through hole
11a Through hole (corner)
C cutting line
P Electronic component package

Claims (2)

第１のガラスエポキシ積層板と、電子部品を収容する第１の開口を備え、第１のガラスエポキシ積層板上に積層した第２のガラスエポキシ積層板と、
前記第１の開口よりも大型の第２の開口を備え、第２のガラスエポキシ積層板上に積層した第３のガラスエポキシ積層板とからなり、
開口内に電子部品を収容し開口上面に蓋を固着して電子部品を封止するように構成した電子部品封入パッケージであり、
上記第１のガラスエポキシ積層板の底面と第２のガラスエポキシ積層板の上面に配線パターンを形成するとともに、第１及び第２のガラスエポキシ積層板の側面に上下に貫通する複数のスルーホールを形成して、第１のガラスエポキシ積層板の配線パターンと第２のガラスエポキシ積層板の配線パターンとを接続した電子部品封入パッケージであって、
上記第３のガラスエポキシ積層板の上面に配線パターンを形成するとともに角部に上下へ貫通するスルーホールを形成し、前記配線パターンを第１乃至第３のガラスエポキシ積層板に形成したスルーホールを通じて第１のガラスエポキシ積層板の配線パターンへ接続した電子部品封入パッケージに於いて、
上記角部に上下へ貫通するスルーホールは前記第３、第２、第１の各ガラスエポキシ積層板の三箇所の角に加工するとともに残りの一箇の角は面取り角形状とし、該三箇所のスルーホールに金または銅メッキを施し、前記上面の配線パターンを第２のガラスエポキシ積層板の三箇所の角部スルーホールを通じて第１のガラスエポキシ積層板の裏面三箇所の角部配線パターンへ接続してアースラインを形成してなり、上記電子部品は、ピエゾ抵抗型３軸加速度センサの加速度センサであり、該加速度センサを、前記第１のガラスエポキシ積層板上面の配線パターンにエポキシ系弾性接着材で接着したことを特徴とする電子部品封入パッケージ。A first glass epoxy laminate, a second glass epoxy laminate comprising a first opening for housing an electronic component and laminated on the first glass epoxy laminate;
A third glass epoxy laminate having a second opening larger than the first opening and laminated on the second glass epoxy laminate,
An electronic component enclosing package configured to enclose an electronic component in an opening and to seal the electronic component by fixing a lid on the upper surface of the opening,
A wiring pattern is formed on the bottom surface of the first glass epoxy laminate and the top surface of the second glass epoxy laminate, and a plurality of through holes penetrating vertically are formed on the side surfaces of the first and second glass epoxy laminates. An electronic component encapsulated package formed by connecting the wiring pattern of the first glass epoxy laminate and the wiring pattern of the second glass epoxy laminate,
A wiring pattern is formed on the upper surface of the third glass epoxy laminate and a through-hole penetrating vertically is formed at the corner, and the wiring pattern is passed through the through-hole formed in the first to third glass epoxy laminates. In the electronic component enclosing package connected to the wiring pattern of the first glass epoxy laminate,
The through-hole penetrating up and down the corner is processed into three corners of the third, second and first glass epoxy laminates, and the remaining one corner is chamfered, and the three corners Gold or copper plating is applied to the through hole of the first glass epoxy laminate, and the wiring pattern on the upper surface is transferred to the corner wiring pattern on the back surface of the first glass epoxy laminate through the three corner through holes of the second glass epoxy laminate. it forms a ground line connected, the electronic component is an acceleration sensor of the piezoresistive type 3-axis acceleration sensor, an acceleration sensor, an epoxy-based wiring pattern of the first glass epoxy laminate top An electronic component encapsulating package characterized by being bonded with an elastic adhesive. 第１のガラスエポキシ積層板の底面に複数の配線パターンを併設する工程と、
第２のガラスエポキシ積層板の上面に複数の配線パターンを併設し、複数の開口を形成する工程と、
第３のガラスエポキシ積層板の上面に複数の配線パターンを併設し、複数の開口を形成する工程と、
第１のガラスエポキシ積層板に第２のガラスエポキシ積層板を接着する工程と、
第１及び第２のガラスエポキシ積層板にスルーホールを形成し、スルーホール及び前記配線パターンに金属メッキを形成する工程と、
第２のガラスエポキシ積層板上に第３のガラスエポキシ積層板を接着する工程と、
第３のガラスエポキシ積層板にスルーホールを形成し、スルーホール及び前記配線パターンに金属メッキを形成する工程と、
第１乃至第３の三層を接着したガラスエポキシ積層板を切断して複数の電子部品封入パッケージを個別に分離する工程からなる電子部品封入パッケージの製造方法。Providing a plurality of wiring patterns on the bottom surface of the first glass epoxy laminate;
Providing a plurality of wiring patterns on the upper surface of the second glass epoxy laminate and forming a plurality of openings;
A step of providing a plurality of wiring patterns on the upper surface of the third glass epoxy laminate and forming a plurality of openings;
Bonding the second glass epoxy laminate to the first glass epoxy laminate;
Forming a through hole in the first and second glass epoxy laminates, and forming a metal plating on the through hole and the wiring pattern;
Bonding a third glass epoxy laminate on the second glass epoxy laminate;
Forming a through hole in the third glass epoxy laminate, and forming a metal plating on the through hole and the wiring pattern;
An electronic component encapsulating package manufacturing method comprising a step of individually cutting a plurality of electronic component encapsulating packages by cutting a glass epoxy laminate having first to third three layers bonded thereto.
JP2002153009A 2002-05-27 2002-05-27 Electronic component encapsulated package and manufacturing method thereof Expired - Fee Related JP3818219B2 (en)

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