JP3816792B2 - Substrate processing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve throughput in a substrate processor. SOLUTION: Processing part groups 20, 40 and 50 are constituted of a prescribed processing part among processing parts ID, SC, and so on for performing a continuous process processing. Substrate hand over positions are each arranged in these processing part groups 20, 40 and 50. Auxiliary transfer robots TS2, TS4 and TS5 transfer the substrate between the substrate hand over positions and the processing parts constituting the processing part group. A main transfer robot transfers the substrate between processing parts ID (10) and IF (30), except the processing parts constituting the processing part groups 20, 40 and 50 and the substrate hand over position. The number (number of positions) of the processing parts where the transfer robots move is reduced, time required for the transfer robots to make one cycle is shortened, and consequently throughput is improved.

Description

[0001]
[Industrial application fields]
The present invention provides a predetermined unit in each processing unit while conveying a substrate to be processed (hereinafter simply referred to as a “substrate”) such as a semiconductor wafer or a substrate for a liquid crystal display device between a plurality of processing units in a predetermined order. The present invention relates to a substrate processing apparatus that performs a series of continuous process processing on a substrate by performing processing.
[0002]
[Prior art]
As is well known, various unit processes such as resist coating and related processes are performed on a substrate. A plurality of unit processes are performed in a predetermined order, and a series of continuous process processes are performed on the substrate. In the case of execution, a substrate processing apparatus that automatically performs this continuous process is conventionally used. An example of this type of substrate processing apparatus is the substrate processing apparatus shown in FIG.
[0003]
In this conventional substrate processing apparatus, a processing row B1 composed of a hot plate HP, a cool plate CP, and the like, and a processing row B2 composed of a spin coater SC, an edge exposure unit EEW, etc. are arranged in two rows. An indexer ID and an interface IF are respectively arranged at both ends of the columns B1 and B2. Further, a single transfer robot TR that travels in a transfer path surrounded by the processing rows B1, B2, the indexer ID, and the interface IF is provided. The transfer robot TR includes two arms that can support one substrate. As a result, the substrate can be transported sequentially from one processing unit to the next processing unit.
[0004]
In addition, in the adhesion strengthening part AH, the hot plate HP, the cool plate CP, the edge exposure part EEW, the spin coater SC, the spin developer SD, the indexer ID, and the interface IF, the heat treatment for the substrate, the thin film formation on the substrate, and other devices Although different unit processes such as a substrate transfer process between the two are performed, in this specification, when it is necessary to explain each of these parts in a unified manner, each of these parts is processed as necessary. This is expressed using the term “part”. In addition, in the adhesion strengthening part AH and the hot plate HP, the heat treatment is performed on the substrate. Therefore, this kind of processing part is referred to as a “heating processing part” in order to distinguish it from other processing parts. Further, in the cool plate CP, since the cooling process is performed on the substrate, it is referred to as a “cooling process part” in order to distinguish it from other process parts. Furthermore, processing units that are not related to the heat treatment or the cooling processing, such as the processing units such as the edge exposure unit EEW, the spin coater SC, the spin developer SD, the indexer ID, and the interface IF, are referred to as “non-heat treatment units”.
[0005]
FIG. 24 is a diagram showing an example of a procedure of continuous process processing by the substrate processing apparatus configured as described above. In this substrate processing apparatus, an unprocessed substrate is taken out from a cassette (not shown) placed on the indexer ID, and transferred to each processing unit in the order of the arrows in FIG. Then, a series of continuous process processing is performed on the substrate by performing predetermined unit processing and returning to the same or another cassette placed on the indexer ID.
[0006]
[Problems to be solved by the invention]
By the way, in order to perform continuous process processing by the conventional substrate processing apparatus, the transfer robot TR needs to circulate between the 13 processing units, and the time required to move between the processing units and the respective processings. Assuming that the total value of the total time required for delivery of the substrate to and from the unit is “TTr”, the time required for the transport robot TR to make a round, that is, the period T0, is obtained by multiplying the time TTr by the number of positions of the processing unit. (TTr × 13). Therefore, the maximum processing capacity of this apparatus is one substrate per TO time, and this determines the number of processed sheets per hour.
[0007]
Here, in order to improve the throughput of the substrate processing apparatus, there is, for example, a method of increasing the operation speed of the transfer robot TR, but this is accompanied by a great difficulty in mechanism and has a certain limit.
[0008]
In the conventional example, the transfer robot TR has access to both a heat treatment unit that performs baking processing on a substrate like the hot plate HP and a non-heat treatment unit that processes at room temperature such as the spin coater SC. Therefore, not only the hand of the transport robot TR heated in the heat treatment unit is inserted into the non-heat treatment unit, but also the substrate in a stage where the normal temperature state should be maintained is held by the warmed hand, thereby The temperature of the substrate and the non-heat-treated portion partially increases, and as a result, the thermal stability of the process is hindered.
[0009]
The present invention has been made to solve the above-described problem, and by performing predetermined unit processing in each processing unit while transporting the substrate between a plurality of processing units in a predetermined order, the substrate In contrast, an object of the present invention is to improve throughput in a substrate processing apparatus that performs a series of continuous process processes.
[0010]
[Means for Solving the Problems]
According to the first aspect of the present invention, a substrate is subjected to resist coating processing and development processing by performing predetermined unit processing in each processing unit while transporting the substrate between a plurality of processing units in a predetermined order. In order to achieve the above object, the processing apparatus is an indexer that takes out an unprocessed substrate and accommodates the substrate after the completion of the resist coating process and the development process , and a plurality of continuous units constituting the resist coating process and the development process. A processing unit group including a plurality of processing units for executing the unit processing, and having a substrate delivery position for delivering the substrate to the plurality of processing units, and the resist coating process and the development process. an interface for transferring the substrate between the exposure apparatus that performs exposure processing between the indexer, the substrate transfer position of the processing unit group and A main transfer means only transports the substrate between the serial interface, and the plurality of processing units constituting the processing unit group, and a secondary transfer means for transferring the substrate only between the substrate transfer position I have.
[0011]
The invention of claim 2 includes a plurality of the processing unit groups.
[0012]
According to a third aspect of the present invention, a substrate transport order by the main transport unit is divided into first and second transport orders, and the main transport unit is configured to transport a substrate in accordance with the first transport order; And a second transport unit that transports the substrate in accordance with the second transport order.
[0013]
According to a fourth aspect of the present invention, the plurality of processing unit groups include a first processing unit group that performs a resist coating process on a substrate and a second processing unit group that performs a development process on the substrate. , Causing the first transport unit to transport the substrate between the indexer, the substrate delivery position of the first processing unit group, and the interface, and causing the second transport unit to transfer the indexer and the second processing unit group. The substrate is transferred between the substrate delivery position and the interface.
[0014]
The invention according to claim 5 partitions the conveyance paths of the first conveyance unit and the second conveyance unit from each other.
[0015]
In a sixth aspect of the present invention, the first processing section group includes a resist coating processing section and a heat treatment section, and the second processing section group includes a development processing section and a heat processing section.
[0016]
[Action]
According to the first aspect of the present invention, a processing unit group is configured by a plurality of processing units for respectively executing a plurality of continuous unit processes constituting the resist coating process and the development process . The processing unit group is provided with a substrate transfer position for transferring the substrate, and the sub-transport means transfers the substrate between the substrate transfer position and a plurality of processing units constituting the processing unit group. On the other hand, the main transport means transports the substrate between the indexer, the interface, and the substrate delivery position of the processing unit group.
[0017]
For this reason, the number of processing units (number of positions) to which each transport unit moves is reduced, the time required for each transport unit to make a round is shortened, and as a result, the throughput can be improved.
[0018]
In the invention of claim 2, a plurality of processing unit groups are provided, and in each processing unit group, the substrate is subjected to predetermined unit processing by the processing unit while being transported between the processing unit and the substrate delivery position by the sub-transport means. . In this way, predetermined processing can be performed independently for each processing unit group, and the operating rate of the substrate processing apparatus can be improved.
[0019]
According to a third aspect of the present invention, the main transport means includes a first transport unit that transports the substrates according to the first transport order and a second transport unit that transports the substrates according to the second transport order. The number of processing units to which each transport unit moves is reduced, and the throughput can be improved.
[0020]
In the invention of claim 4, the first transfer unit transfers the substrate between the indexer, the substrate transfer position of the first processing unit group and the interface, and the second transfer unit is the indexer, the substrate transfer position of the second processing unit group. In addition, since the substrate is transferred between the interfaces, the number of processing units to which each transfer unit moves is reduced, and the throughput can be improved.
[0021]
In the invention of claim 5, since the transport paths of the first transport section and the second transport section are separated from each other, the atmosphere in the transport path of the first transport section is separated from the atmosphere in the transport path of the second transport section. The substrate can be transported in a desired atmosphere.
[0022]
In the invention of claim 6, since the first processing unit group includes a resist coating processing unit and a heat treatment unit, and the second processing unit group includes a development processing unit and a heat treatment unit, the number of processing units to which each transport unit moves is reduced. The throughput can be improved.
[0023]
【Example】
Hereinafter, embodiments of the substrate processing apparatus according to the present invention will be described in detail. In order to clarify the operation and effect of the embodiments, the same continuous process processing as in the conventional example (same as FIG. 24 for one substrate). The processing will be limited to an apparatus and a method that execute unit processing in each processing unit in the order of
[0024]
A. First Embodiment FIG. 1 is an external perspective view of a first embodiment of a substrate processing apparatus according to the present invention, in which XYZ rectangular coordinate axes are shown in order to clarify the directional relationship with each drawing described later. . FIG. 2 is a partially cutaway enlarged view of the apparatus of FIG. FIG. 3 is a conceptual layout. The Z direction is upward in the vertical direction, and the X direction and the Y direction are directions orthogonal to each other in the horizontal plane.
[0025]
A-1. Configuration of the Apparatus of the First Embodiment First, the outline of the substrate processing apparatus according to the first embodiment will be described, and then the configuration of each part will be described.
[0026]
In this substrate processing apparatus, as shown in FIG. 3, a processing unit 10, processing unit groups 20, 40, and 50 and a processing unit 30 are arranged in a line in the X direction, and these processing units 10 and 30 and the processing unit group are arranged. The main transfer robot TM moves in the direction X and (−X) between 20, 40, and 50, so that the substrate can be transferred to a desired processing unit or processing unit group (see the thin line arrow in the figure). . In addition, each processing unit group 20, 40, 50 is provided with sub-transport robots TS2, TS4, TS5 for receiving the substrate transported by the main transport robot TM at the substrate transfer positions ST2, ST4, ST5, When the processing units in the processing unit group are sequentially transferred between the processing units and the processing by the processing units in the processing unit group is completed, the substrate is transferred to the main transfer robot TM at the original positions ST2, ST4, and ST5 (see FIG. See bold arrows). On the other hand, the processing units 10 and 30 are also provided with a robot TS1 (see FIG. 1) (the robot in the processing unit 30 is not shown), and the substrate can be delivered to and from the main transfer robot TM. This is possible (see the bold arrow in the figure). As described above, in the substrate processing apparatus according to this embodiment, a predetermined unit process is performed in each processing unit while sequentially transporting the substrate between the processing units in the same order as in FIG. 24 by the cooperative operation with these robots. Run a series of continuous processes.
[0027]
Next, the configuration of the processing unit 10, the main transport robot TM, the processing unit group 20, the processing unit 30, and the processing unit groups 40 and 50 will be described in this order with reference to FIGS.
[0028]
The processing unit 10 has an indexer ID for performing substrate transfer processing in units of cassettes with other processing stations, and a cassette CS in which a lot of substrates is accommodated on the cassette table of this indexer ID A cassette CS containing a substrate that has been subjected to a series of continuous process processes in the substrate processing apparatus is carried out to another apparatus. Further, the indexer ID is provided with a robot TS1 that can move along the cassette table. The robot TS1 takes in and out the substrate to and from the cassette CS and delivers the substrate to and from the main transfer robot TM. The substrate is transferred to and from the main transfer robot TM at the substrate transfer position ST1 (FIG. 3) in the processing unit 10.
[0029]
As shown in FIG. 2, the main transfer robot TM is composed of an upper transfer unit TMU and a lower transfer unit TML arranged in two upper and lower stages, and each transfer unit TMU, TML has a 3 for holding a substrate. A book support pin 101 is erected. The structure of the main transfer robot TM will be described in detail with reference to FIG.
[0030]
4 is a cross-sectional view taken along line VV in FIG. In the figure, reference numeral 102 denotes a boom extending in the direction X, and is fixed to a base (not shown) of the apparatus. Guide rails 103 </ b> L and 103 </ b> U extending in the coaxial direction X are fixed to side surfaces of the boom 102, respectively. A bracket 104L is slidably provided on the guide rail 103L, and a support body 105L having a substantially L-shaped cross section is attached to the bracket 104L. For this reason, by operating the motor 106L for the lower transport unit TML, the support body 105L is moved in the direction X together with the bracket 104L by a drive mechanism (not shown), and is held by the support pins 101 erected from the support body 105L. The processed substrate 1 can be transported. As described above, the elements 101, 102, 103L, 104L, and 105L constitute the lower transport unit TML. As shown in FIG. 3, the substrate delivery position ST1 in the processing unit 10 and the substrate delivery of the processing unit group 20 It moves between the position ST2 and the substrate delivery position ST3 of the processing unit 30.
[0031]
The upper transport unit TMU is configured in the same manner as the lower transport unit TML, and includes a substrate delivery position ST1 in the processing unit 10, a substrate delivery position ST3 in the processing unit 30, and a substrate delivery position ST4 in the processing unit group 40. Then, it moves between the processing unit group 50 and the substrate delivery position ST5. In addition, since the structure is the same, here, an equivalent code | symbol is attached | subjected to drawing and the description is abbreviate | omitted.
[0032]
Thus, in this embodiment, the substrate transfer order by the main transfer robot TM is the first transfer order (processing unit 10 -processing unit group 20 -processing unit 30) and the second transfer order (processing unit 30 -processing unit group). 40, 50-processing section 10), the lower transport section (first transport section) TML transports the substrates according to the first transport order, while the upper transport section (second transport section) TMU transports the second transport order. The substrate is transported according to the above.
[0033]
Further, as shown in FIG. 4, a squeeze plate 107 is provided between both transport units TMU and TML, and the substrate transport path by the lower transport unit TML and the substrate transport path by the upper transport unit TMU are mutually connected. It is partitioned.
[0034]
The processing unit group 20 includes two hot plates HP21 and HP22, two cool plates (cooling units) CP21 and CP22, an adhesion strengthening unit AH, and a spin coater (rotary resist coating apparatus) SC. Among these elements, the hot plates HP21 and HP22 are heat processing units for baking the substrate 1 at a high temperature, and are stacked on the moving path of the main transport robot TM as shown in FIG. In addition, cool plates (cooling processing units) CP21 and CP22 for forcibly cooling a substrate placed on a plate to which constant temperature water at a predetermined temperature near normal temperature is supplied and an adhesion strengthening unit (heating processing unit) AH are indexers. While facing the ID, they are stacked from the bottom in this order. Further, a spin coater SC is provided so as to face the hot plates HP21 and HP22. With these arrangements, a substantially U-shape is formed when viewed from above. In addition, it is an empty room on the adhesion reinforcement part AH.
[0035]
A sub-carrying robot TS2 as a sub-carrying means is arranged at a position corresponding to the central portion of the substantially U-shape. The sub-transport robot TS2 is moved up and down in the Z direction, that is, in the vertical direction by the robot drive mechanism 121 (vertical bidirectional arrow in FIG. 4) and has a degree of freedom in turning in the θ direction. Further, the hands 123 and 124 that can be moved back and forth independently of each other include the processing units HP21, HP22, CP21, CP22, AH, and SC constituting the processing unit group 20 and the substrate delivery position ST2 provided in the processing unit group 20 (FIG. 3) is accessed, and the substrate 1 is taken out and placed.
[0036]
The processing unit 30 includes an interface IF disposed on the side opposite to the indexer ID, and serves as a substrate mounting table on which a substrate is temporarily mounted so as to be delivered to an external device, for example, a stepper, in the middle of circulation and conveyance. Further, a robot (not shown) is provided near the interface IF, and the substrate is transferred between the interface IF and the main transport robot TM at the substrate transfer position ST3 (FIG. 3) in the processing unit 30. Note that the substrate conveyed to the interface IF is sent to another apparatus, for example, a stepper, subjected to an exposure process, and then returned to the interface IF again. Then, it is transferred from the interface IF to the main transfer robot TM and transferred to the processing unit group 40 or the processing unit group 50 for performing the next processing.
[0037]
The processing unit groups 40 and 50 both have the same configuration. This is to perform so-called parallel processing. Here, the configuration of the processing unit group 40 will be described, and the configuration of the processing unit group 50 will be omitted.
[0038]
The processing unit group 40 includes an edge exposure unit EEWA arranged above the transfer path of the main transfer robot TM, CP41, 42, HP41 to HP43 stacked on each other, and a spin developer (rotary developing device) SDA. Like the processing unit group 20, these elements are arranged so as to be substantially U-shaped when viewed from above. A sub-transport robot TS4 is provided so as to be surrounded by these elements. This sub-transport robot TS4 has the same configuration as the sub-transport robot TS2 described above, and can move up and down in the vertical direction (direction Z) and swivel in the θ direction. The processing units HP41 to HP43, CP41, CP42, SDA constituting the unit group 40 and the substrate delivery position ST4 (FIG. 3) provided in the processing unit group 40 are accessed, and the substrate 1 is taken out, placed, and delivered. Do.
[0039]
Here, the arrangement of the entire apparatus will be described. As shown in FIG. 1, processing unit groups 20, 40, and 50 are arranged side by side in the central portion of the apparatus, and the (−X) direction side of the processing unit group 20. The processing unit 10 is disposed on the X direction side of the processing unit group 50. A spin coater SC and spin developers SDA and SDB are arranged side by side at the front center of the apparatus, that is, on the front side of the processing unit groups 20, 40 and 50. The movement path of the robot TS1 of the processing unit 10 is located on the X side in the processing unit 10. The main transfer robot TM reaches the processing unit 30 from the position in contact with the movement path of the robot TS1 through the back of the apparatus. A hot plate HP21, an edge exposure unit EEWA, and the like of the processing unit groups 20, 40, and 50 are arranged above the movement path of the main transfer robot TM. Between the spin coater SC, the spin developers SDA and SDB, and the movement path of the main transfer robot TM, a sub transfer robot TS and a cool plate CP are arranged for each processing unit group.
[0040]
FIG. 5 is a block diagram showing an electrical configuration of the apparatus of FIG. In addition to the computer 61, the control unit 60 of the apparatus includes an operation unit 62 for giving an instruction to the computer 61, and a display unit 63 for transmitting the progress of the process and occurrence of an abnormality to the operator. Yes. In addition to the control program, the memory 64 stores data necessary for process control. The operation unit 62 and the display unit 63 are provided in front of the indexer ID as shown in FIG.
[0041]
Further, sensors 65 that detect the status of each part of the apparatus and give the information to the computer 61 are connected to the control unit 60. Further, a drive control circuit 66 for performing drive control of each robot TM, TS1, TS2,... Based on a command from the control unit 60 is provided. The processing unit control circuit 67 also performs drive control in each processing unit based on instructions from the control unit 60, for example, heating control in the hot plates HP21, HP22,..., Rotation control in the spin coater SC and the spin developers SDA and SDB, and the like. Do.
[0042]
In addition, in the above, although the structure of the process part and the process part group was demonstrated, this apparatus has the following structural characteristics.
[0043]
First, the delivery of the substrate between the main transfer robot TM and the processing units 10, 30 and the processing unit groups 20, 40, 50 is performed through delivery windows W1L, W1U, W21,. A shutter mechanism (not shown) is attached to each window to prevent particles from adhering to the substrate in the middle of circulation and transporting, except when the substrate is being delivered. In each of the processing unit groups 20, 40, and 50, the processing units are provided with delivery windows W22 to W26, W42 to W46, W52 to W56 and a shutter mechanism, and each unit is in the middle of unit processing. Problems such as particles adhering to the substrate and non-uniform atmosphere in the processing section are prevented. However, the provision of the shutter mechanism is not an essential component of the present invention and may be appropriately provided as necessary.
[0044]
In addition, as viewed from the whole apparatus, a processing unit that uses a chemical solution such as the spin coater SC or the spin developers SDA and SDB is arranged on the front side of the apparatus, that is, in the (−Y) direction side. This is because the operator often accesses from the outside, and maintenance is improved by the arrangement. On the other hand, the hot plates HP21, HP22,... And the cool plates CP21, CP22,... Are less frequently accessed by the operator for maintenance. By concentrating on these places, it is possible to reduce the movement of the operator even when the maintenance is necessary, and the operability is excellent. Furthermore, since the chemical solution use processing units are arranged on the side different from the hot plates HP21, HP22,... And the cool plates CP21, CP22,..., Sufficient environmental separation is achieved.
[0045]
A-2. Next, the operation of the substrate processing apparatus configured as described above will be described. In this apparatus, a plurality of different substrates are processed in parallel in a steady state, but here, focusing on the order in which one substrate is transported and processed, The operation characteristics will be described.
[0046]
FIG. 6 is a process flow diagram of the substrate processing apparatus according to the first embodiment. In the figure, a spin developer SD (SDA, SDB) and an edge exposure unit EEW (EEWA, EEWB) are used for sequentially distributing and processing the substrates conveyed sequentially to the processing unit 40 and the processing unit 50. For example, odd-numbered substrates are provided on the spin developer SDA side, and even-numbered substrates are provided on the spin developer SDB side. Moreover, about hot plate HP, it distributes and processes suitably according to the baking time in each process part group.
[0047]
(1) Board removal from the indexer ID (Figure 7)
First, the robot TS1 takes out one unprocessed substrate 1 from the cassette CS and places it on the lower transport portion TML of the main transport robot TM (thick line arrow R11 in the figure). At this time, the lower transport unit TML is positioned in advance at the substrate delivery position ST1 of the processing unit 10, and a shutter mechanism attached to the window W1L is activated in response to a substrate removal command from the control unit 60 to release the shutter. open. Subsequently, the robot TS1 arranged in the processing unit 10 operates to hold one substrate 1 in the cassette CS on the arm (not shown) of the robot TS1, and the substrate together with the arm is opened from the cassette CS to the window W1L. Is moved over the lower transport section TML. And the board | substrate 1 is mounted in the lower conveyance part TML by dropping an arm. On the other hand, when the removal of the substrate 1 is completed, the arm moves backward, and the robot TS1 returns to the original position.
[0048]
In this embodiment, the shutters of the windows W1U, W1L,... Are closed except when the substrate is transferred between the main transport robot TM and the processing units 10, 30 and the processing unit groups 20, 40, 50. . That is, the shutter is opened just before the substrate delivery to enable delivery of the substrate, while the delivery of the substrate is completed and the shutter is immediately closed. For this reason, intrusion of particles and the like can be effectively prevented.
[0049]
When the removal of the substrate from the indexer ID is thus completed, the substrate transport position ST2 of the processing unit group 20 that performs the next process (resist coating process) while the substrate 1 is still mounted on the lower transport unit TML. Move (thin line arrow r12 in the figure).
[0050]
(2) Resist coating process by spin coater SC (Fig. 8)
Next, when an unprocessed substrate is transferred to the processing unit group 20, the shutter of the window W21 is opened, and the sub-transfer robot TS2 receives from the lower transfer unit TML through the window W21 (thick arrow R21 in the figure). ). Here, when neither of the hands 123 and 124 of the sub-transport robot TS2 holds the substrate, the sub-transport robot TS2 moves up and down to a height in front of the window W21, and moves the empty hand 124 through the window W21. Then, the substrate 1 is inserted into the main transport path side and the substrate 1 on the lower transport unit TML is held, and then the hand is moved backward while the substrate 1 is held (hereinafter referred to as “receiving operation”).
[0051]
The sub-transport robot TS2 that has received the substrate 1 repeats delivery of the substrate 1 to each processing unit constituting the processing unit group 20 (thick arrows R22, R23 in the figure), thereby repeating the adhesion strengthening unit AH, the cool plate CP21, The spin coater SC, hot plate HP21 (or hot plate HP22) and cool plate CP22 are conveyed in this order.
[0052]
Here, if the substrate already exists in the processing unit, the “exchange operation” of the substrate is performed as follows. For example, as shown in FIG. 4, the first hand 123 of the sub-transport robot TS2 holds the first substrate, places the first substrate on the hot plate HP21, and already has the hot plate HP21. Let us consider a case where the second substrate that has been subjected to the above process is taken out from the hot plate HP21. In this case, the sub-transport robot TS2 moves to the front of the window W22 of the hot plate HP21, inserts the empty second hand 124 into the hot plate HP21, and holds and takes out the second substrate. Thereafter, the first hand 123 is inserted into the hot plate HP21, and the first substrate held by the first hand 123 is placed on the hot plate HP21. Thereby, “exchange” of the first and second substrates is achieved. In the case where only “removal” or “placement” is performed instead of such replacement, only one of these operations may be performed, and these operations are referred to as “removal operation” and “replacement operation”, respectively. Called.
[0053]
As described above, the sub-transport robot TS2 transports the substrate 1 between the processing units by performing “exchange”, “removal”, or “placement” with the processing units, and each processing unit has been transported. By performing a predetermined unit process on the substrate, a resist film is formed on the surface of the substrate 1 (resist coating process).
[0054]
Next, for the substrate 1 that has undergone the resist coating process, the sub-transport robot TS2 moves onto the lower transport portion TML located at the substrate delivery position ST2 by an operation opposite to the “receiving operation” (hereinafter referred to as “dispensing operation”). It is placed (thick arrow R24 in FIG. 8).
[0055]
Subsequently, the lower transport unit TML moves to the substrate delivery position ST3 of the next processing unit 30 while holding the substrate 1 on which the resist film is formed (thin line arrow r23 in the figure).
[0056]
(3) Board delivery at the interface IF (Fig. 9)
In this processing unit 30, a robot (not shown) provided close to the interface IF moves to the front of the window W3L, and moves the arm of the robot to the lower transport unit TML side through the window W3L with the shutter open. Stretching and receiving the substrate 1 on the lower transport unit TML. Then, while holding the substrate 1, the arm is retracted and placed on the interface IF (thick arrow R31 in the figure). On the other hand, after transporting the substrate 1 to the processing unit 30, the lower transport unit TML moves to the substrate delivery position ST1 of the processing unit 10 (thin line arrow r31 in the figure) and takes out the next substrate ((1) above). Prepared for).
[0057]
The substrate 1 thus placed on the interface IF is transported to an external device (stepper) by another transport mechanism and is subjected to an exposure process.
[0058]
When the exposure process is completed, the substrate is returned to the interface IF. The robot supports the substrate with the arm, and extends the arm toward the substrate delivery position ST3 through the window W3U where the shutter is opened. The upper transport unit TMU is waiting in advance at the substrate delivery position ST3, and the robot returns to the original position after placing the substrate 1 on the upper transport unit TMU (thick line arrow R32 in the figure).
[0059]
Subsequently, the upper transport unit TMU moves to the substrate delivery position ST4 of the next processing unit group 40 while holding the substrate 1 on which the exposure processing has been completed (thin line arrow r34 in the figure). In this embodiment, since the next development process is alternately performed by the processing unit groups 40 and 50, when the development process is performed on the next substrate, the processing unit group 40 Instead, the processing unit group 50 moves to the substrate delivery position ST5.
[0060]
(4) Development processing by spin developer SD (Fig. 10)
In this processing unit group 40, the sub-transport robot TS4 operates in the same manner as the “receiving operation” of the substrate 1 in the processing unit group 20, and receives the substrate 1 on the upper transport unit TMU through the window W41 (FIG. Thick line arrow R41). Then, the sub-transport robot TS4 that has received the substrate 1 delivers each processing unit constituting the processing unit group 40 and the substrate 1 by the above-described “exchange operation”, “removal operation”, or “placement operation” (thick line in the figure). By repeating the arrows R42 and R43), the edge exposure unit EEWA, hot plate HP41, cool plate CP41, spin developer SDA, hot plate HP42 (or hot plate HP43) and cool plate CP42 are conveyed in this order.
[0061]
In this way, the substrate 1 is transported between the processing units by the sub-transport robot TS4, whereby the development processing of the substrate 1 is executed (development processing).
[0062]
Next, the substrate 1 that has undergone development processing is placed on the upper transport unit TMU located at the substrate delivery position ST4 by the “delivery operation” by the sub transport robot TS4 (thick line arrow R44 in the figure).
[0063]
Subsequently, the upper transport unit TMU moves to the substrate delivery position ST1 of the first processing unit 10 while holding the substrate 1 on which the development processing has been completed (thin line arrow r41 in the figure).
[0064]
(5) Board removal to indexer ID (Figure 11)
Next, the arm of the robot TS1 moves onto the upper transfer unit TMU at the substrate delivery position ST1 through the window W1U where the shutter is opened, and holds the substrate 1. Then, the substrate 1 is returned to the processing unit 10 while holding the substrate 1, and the substrate 1 that has undergone a series of continuous process processing is accommodated in a predetermined cassette CS (thick arrow R12 in the figure).
[0065]
When the accommodation of the substrate 1 in the cassette CS is completed, the upper transport unit TMU moves to the substrate delivery position ST3 in order to receive the substrate for which the next exposure process has been completed (thin line arrow r13 in the figure). Thus, the substrate can be continuously processed by returning to the state of FIG. 7 and repeating the operations (1) to (5).
[0066]
In the above description, the description has focused on only the order in which one substrate is transported. However, when the apparatus is operating in a steady state, the sub-transport robots TS2, TS4, TS5 Within the group, the above-described “exchange operation” is repeated between each processing unit and the substrate delivery position, and a plurality of substrates are circulated and conveyed in order, and processed simultaneously.
[0067]
A-3. Effects of the apparatus of the first embodiment In this first embodiment, a plurality of continuous unit processes constituting a part of a predetermined series of continuous process processes (continuous process processes in FIG. 24) are executed. A processing unit group consisting of a plurality of processing units,
(1) A processing unit group 20 including an adhesion reinforcing unit AH, a cool plate CP, a spin coater SC, and a hot plate HP;
(2) Processing unit groups 40 and 50 including an edge exposure unit EEW, a hot plate HP, a cool plate CP, and a spin developer SD;
The substrate is transferred by the main transfer robot TM between the substrate transfer positions ST1, ST3, ST2, ST4, ST5 provided in the processing units 10, 30 and the processing unit groups 20, 40, 50, respectively. In each of the processing unit groups 20, 40, 50, the same continuous process processing as in FIG. 24 is performed by circulating and transporting between the processing unit and the substrate delivery position by the sub transport robots TS2, TS4, TS5. For this reason, compared with the prior art example of FIG. 23, the number of positions of the processing unit in charge of each transfer robot is significantly reduced, and the throughput of the apparatus can be improved.
[0068]
In this embodiment, the main transfer robot transfers the substrate to the substrate transfer position of each processing unit group, and the sub transfer robot receives the substrate from the main transfer robot at the substrate transfer position, and circulates and transfers the substrate within the processing unit group. In this way, each processing unit group can independently process a substrate, and in the meantime, another substrate can be transferred by the main transfer robot. For this reason, for example, while the optimum condition for the resist coating process is being verified in the processing unit group 20, the development processing can be performed in another processing unit group 40, and the operating efficiency of the entire apparatus can be improved. it can.
[0069]
In addition, since the main transfer robot and the sub-transfer robot directly transfer the substrate at each substrate transfer position, for example, a configuration for temporarily placing the substrate at the substrate transfer position (configuration corresponding to the interface IF) is provided. The apparatus size can be reduced as compared with the case where the substrate is indirectly delivered via the configuration.
[0070]
In this embodiment, the main transport robot TM is composed of upper and lower transport units TMU, TML, and both transport units TMU, TML are transported by the lower transport unit TML by a squeezing plate 107 as shown in FIG. Since the path and the substrate transport path by the upper transport unit TMU are separated from each other, it is possible to prevent the substrate from being influenced by the atmosphere of the other transport path when the substrate is transported through the one transport path. In particular, recent resist materials are sensitive to the atmosphere. For example, if an alkali atmosphere is mixed while the substrate subjected to resist coating is being transported by the lower transport unit TML, characteristics such as sensitivity of the resist material deteriorate. However, according to this embodiment, the substrate can be transported without causing this problem.
[0071]
Further, in the substrate processing apparatus configured as described above, the substrate transfer positions ST1 to ST5 are provided on the same horizontal plane (XY plane), and the upper transfer unit TMU and the lower transfer unit TML of the main transfer robot TM are in the direction X. The movement of the upper transfer unit TMU and the lower transfer unit TML of the main transfer robot TM only needs to reciprocate in a straight line. A large drive mechanism for two-dimensional movement is unnecessary. Therefore, free spaces SPU and SPL (FIG. 4) exist at positions directly above and below the movement path of the main transfer robot TM. Therefore, in this embodiment, the processing units such as the hot plate HP and the cool plate CP can be arranged in the free space SPU directly above, and the entire apparatus can be made compact. Also, in the space SPL directly below, piping or the like (not shown) for storing or pumping chemicals necessary for the spin coater SC, the spin developer SD, or the like can be arranged as necessary. With this arrangement, the apparatus can be made compact as with the arrangement of the processing units in the free space SPU.
[0072]
A-4. Modification of the first embodiment In the first embodiment, the main transport robot TM is composed of the upper and lower transport units TMU, TML. However, the main transport robot TM may be composed of a single transport unit. .
[0073]
In this embodiment, the main transfer robot TM has a configuration that can move only in one direction (direction X). However, if the configuration can move between the substrate delivery positions ST1 to ST5, The configuration is not particularly limited, and may be a configuration that can be two-dimensionally moved in the direction Y as well as the direction X, or a configuration that has a degree of freedom of movement in the direction Z. In this embodiment, the sub-transport robot moves up and down for delivery of the substrate. However, the upper transport unit TMU and the lower transport unit TML of the main transport robot TM may be lifted and lowered slightly. Also in this case, since the raising and lowering for that purpose may be a slight raising and lowering for transferring the substrate, in this case as well, substantially similar free spaces SPU and SPL can be formed.
[0074]
Further, in the above embodiment, the upper and lower transport units TMU, TML constituting the main transport robot TM are each a transport mechanism of a type on which only one substrate can be placed, but two hands like the sub transport robot TS2 are used. A so-called double arm type having the following may be adopted.
[0075]
B. Second Embodiment FIG. 12 is an external perspective view of a second embodiment of the substrate processing apparatus according to the present invention, FIG. 13 is a sectional view of the apparatus of FIG. 12, and FIG. 14 is a conceptual layout diagram. is there.
[0076]
B-1. Configuration of Apparatus of Second Embodiment As shown in FIG. 12, the substrate processing apparatus according to the second embodiment includes, on the front side of the apparatus, a spin coater SC, two edge exposure units EEWA, EEWB, and two units. The spin developers SDA and SDB are arranged in a line in the X direction to form a processing unit row C, and an indexer ID and an interface IF are arranged on both ends of the processing unit row C, respectively. Further, elevators EV1, EV2, EV3, EV4 (details will be described later) are disposed on the back side of the apparatus. Between the elevators EV1, EV2, EV3, EV4 and the processing section row C, a main transfer robot TM is provided movably along the longitudinal direction (direction X) of the processing section row C. The processing unit groups 200 and 300 are provided on the movement path of the main transfer robot TM, and the processing unit groups 100 and 400 are arranged on the processing unit groups 200 and 300, respectively, to form a three-layer structure ( FIG. 14). That is, the first layer is formed by the indexer ID, the spin coater SC, the edge exposure units EEWA and EEWB, the spin developers SDA and SDB, and the interface IF, the second layer is formed by the processing unit groups 200 and 300, and the processing unit group A third layer is formed at 100,400.
[0077]
The main transfer robot TM is configured to be movable in the X direction in addition to the function of the sub transfer robot TS2 (FIG. 4) of the first embodiment. That is, a guide rail (not shown) extending in the X direction is provided between the elevators EV1, EV2, EV3, EV4 and the processing unit row C, and the configuration of the sub-transport robot TS2 of the first embodiment is the guide rail. By guiding, the main transfer robot TM has hands 123 and 124 that have a degree of freedom of movement in the X and Z directions and a degree of freedom of rotation in the θ direction, and can move forward and backward independently of each other. Therefore, as shown in FIG. 14, the main transfer robot TM moves in the directions X and (−X) between the indexer ID, the spin coater SC, the edge exposure units EEWA and EEWB, the spin developers SDA and SDB, and the interface IF. In addition, the substrate can be transferred to a desired processing unit or processing unit group. Furthermore, the main transfer robot TM can deliver the substrate to the desired elevators EV1, EV2, EV3, EV4, and can transfer the substrate to / from the desired processing unit group 100, 200, 300, 400 via them. It has become.
[0078]
The indexer ID is a processing unit that transfers a substrate to and from other processing stations in units of cassettes. Through this indexer ID, the cassette CS containing a lot of substrates is loaded, and the substrate processing apparatus The cassette CS in which the substrate that has undergone the series of continuous processing is accommodated is carried out. Further, the indexer ID is provided with a robot TS1 that can move along the cassette table. The robot TS1 takes in and out the substrate to and from the cassette CS and delivers the substrate to and from the main transfer robot TM. The substrate is transferred to and from the main transfer robot TM at the substrate transfer position ST1 (FIG. 14) in the vicinity of the indexer ID.
[0079]
As shown in FIG. 12, the processing unit group 100 has an adhesion strengthening portion AH and a cool plate CP1, and is located at the same height position H3 at the rising end position (two-dot chain line in FIG. 13) of an elevator EV1, which will be described later. It is arranged to be. The elevator EV1 can reciprocate between a substrate delivery position ST2 (height position H1) in the first layer and an ascending end position (height position H3) in the third layer, and the main transport is performed at the substrate delivery position ST2. After receiving the substrate from the robot TM, the substrate can be raised to the rising end position while holding the substrate.
[0080]
On the other hand, in the processing unit group 100, there is provided a circulation transport mechanism RM1 having three arms AR and simultaneously rotating these arms AR in the θ direction. For this reason, after the substrate is transported to the rising end position by the elevator EV1 and delivered to the arm AR, the arm AR is rotated by a predetermined angle, whereby the substrate is adhered to the adhesion strengthening part AH, the cool plate CP1, and The substrate can be circulated and conveyed in the order of the original positions, and unit processing can be performed on the substrate by the adhesion strengthening part AH and the cool plate CP1.
[0081]
After the substrate subjected to the adhesion strengthening process and the cooling process is delivered from the arm AR to the elevator EV1 at the original position (dotted line position in FIG. 14) by the cooperation of the elevator EV1 and the circulation transport mechanism RM1, The elevator EV1 descends to the substrate delivery position ST2 in the first layer. As described above, in the second embodiment, the elevator EV1 and the circulatory transport mechanism RM1 use the substrate between the processing unit (the adhesion reinforcing unit AH and the cool plate CP1) constituting the processing unit group 100 and the substrate delivery position ST2. Sub-conveying means for conveying is configured.
[0082]
Substrate delivery to the spin coater SC is performed by the main transport robot TM at the substrate delivery position ST3. Note that the edge exposure units EEWA and EEWB and the spin developers SDA and SDB are also loaded and unloaded by the main transfer robot TM at predetermined substrate transfer positions ST6A, ST6B, ST8A, and ST8B, respectively, similarly to the spin coater SC. The
[0083]
As shown in FIG. 14, the processing unit group 200 has two hot plates HP21, HP22 and a cool plate CP2, and is located at the same height at the rising end position (dotted line position in the figure) of the elevator EV2, which will be described later. It arrange | positions so that it may become H2 (FIG. 13). The elevator EV2 can reciprocate between a substrate delivery position ST2 (height position H1) in the first layer and a rising end position (height position H2) in the second layer. Further, in the processing unit group 200, there is provided a circulation transport mechanism RM2 having four arms AR and simultaneously rotating these arms AR in the θ direction. Therefore, as in the processing unit group 100, the elevator EV2 that has received the substrate from the main transfer robot TM is raised to the rising end position, and after the substrate is delivered to the arm AR, the arm AR is rotated by a predetermined angle. By doing so, it is possible to perform predetermined unit processing in each processing section while circulating and transporting the substrate in the order of the hot plates HP21 and HP22, the cool plate CP2, and the original position. The elevator EV2 cooperates with the circulation transport mechanism RM2 to receive the processed substrate from the arm AR, and then descends to the substrate delivery position ST2 in the first layer. As described above, in this processing unit group, the substrate between the processing unit (hot plate HP21, HP22 and cool plate CP2) constituting the processing unit group 200 and the substrate delivery position ST4 is provided by the elevator EV2 and the circulation transport mechanism RM2. Sub-conveying means for conveying is configured.
[0084]
The processing unit group 300 is configured in the same manner as the processing unit group 200. That is, the processing unit group 300 includes two hot plates HP31 and HP32 and a cool plate CP3. Further, the elevator EV3 that moves up and down between the first layer and the second layer, and the circulation that circulates and conveys the substrate between the rising end positions (dotted line positions in FIG. 14) of the hot plates HP31 and HP32, the cool plate CP3, and the elevator EV3. A sub-transport means is formed by the transport mechanism RM3. Then, after the elevator EV3 receives the substrate from the main transfer robot TM at the substrate transfer position ST7 and rises to the rising end position, the circulation transfer mechanism RM3 circulates and transfers the substrate between the hot plates HP31, HP32 and the cool plate CP3. Then, a baking process using the hot plates HP31 and HP32 and a cooling process using the cool plate CP3 are performed. Subsequently, the elevator EV3 receives the substrate from the arm AR of the circulation transport mechanism RM3 and descends to the first layer substrate delivery position ST7.
[0085]
The processing unit group 400 has the same configuration as the processing unit group 100 except that it has a unit processing unit configuration, that is, has three hot plates HP41, HP42, HP43 and a cool plate CP4. That is, the substrate is circulated between the elevator EV4 that moves up and down between the first layer and the third layer, and the hot plate HP41, HP42, HP43, the cool plate CP4, and the elevated end position of the elevator EV4 (dotted line position in FIG. 14). A sub-transport means is formed by the transport mechanism RM4 for transport. Then, after the elevator EV4 receives the substrate from the main transfer robot TM at the substrate transfer position ST9 and rises to the rising end position of the third layer, the circulation transfer mechanism RM4 is between the hot plates HP41, HP42, HP43 and the cool plate CP4. The substrate is circulated and conveyed, and a baking process using the hot plates HP41, HP42, and HP43 and a cooling process using the cool plate CP4 are performed. Subsequently, the elevator EV4 receives the substrate from the arm AR of the circulation transport mechanism RM4 and descends to the first layer substrate delivery position ST9.
[0086]
In this embodiment, the processing unit groups 200 and 300 are provided with two hot plates, whereas the processing unit group 400 is provided with three hot plates. This is due to the difference in the baking time required for each group, and the necessary number may be provided according to the baking time required for each processing group.
[0087]
The interface IF functions as a substrate mounting table for temporarily mounting the substrate to an external device such as a stepper. A robot (not shown) is provided near the interface IF and cooperates with the main transfer robot TM. Then, the substrate is transferred between the main transfer robot TM and the substrate at the substrate transfer position ST5.
[0088]
Note that the electrical configuration of the substrate processing apparatus according to the second embodiment is substantially the same as that of the first embodiment, and therefore the description of the configuration is omitted here.
[0089]
Further, a window W is provided as appropriate between the substrate transfer path, for example, between the main transfer robot TM and the elevator EV1, and a shutter mechanism is attached. As in the first embodiment, a command from the control unit 60 is provided. Open / close control is performed according to
[0090]
B-2. Operation of the apparatus according to the second embodiment Next, with respect to the operation of the substrate processing apparatus configured as described above, as in the case of the first embodiment, one substrate is transported and processed in any order. Focusing on whether or not to go, the operational characteristics of the apparatus will be described.
[0091]
FIG. 15 is a process flow diagram of the substrate processing apparatus according to the first embodiment. In the figure, “HP2” indicates a continuous baking process performed by the hot plates HP21 and HP22, “HP3” indicates a continuous baking process performed by the hot plates HP31 and HP32, and “HP4” indicates This shows a continuous baking process performed by the hot plates HP41, HP42 and HP43.
[0092]
(1) Board removal from indexer ID (Fig. 16)
First, one unprocessed substrate is taken out from the cassette CS and placed on one hand of the main transport robot TM located at the substrate delivery position ST1 (arrow R101 in the figure). In this embodiment, the robot TS1 and the main transfer robot TM cooperate to deliver the substrate.
[0093]
When the removal of the substrate from the indexer ID to the main transfer robot TM is completed in this way, the main transfer robot TM moves to the substrate delivery position ST2 with the substrate 1 still placed on the hand (arrow R102 in the figure). ).
[0094]
(2) Adhesion strengthening processing by the processing unit group 100 (FIG. 17)
Next, when an unprocessed substrate is transported to the substrate delivery position ST2 of the processing unit group 100, the hand of the main transport robot TM extends to the elevator EV1 side and places the substrate on the elevator EV1 (in the figure). Arrow R103). Then, after the elevator EV1 rises to the rising end position (dotted line position in the figure) with the substrate still placed (arrow R104 in the figure), one arm AR of the circulation transport mechanism RM1 receives the board. Subsequently, the circulation transport mechanism RM1 is driven to transport the substrate in the order of the adhesion enhancing portion AH and the cool plate CP1 (arrows R105 and R106 in the figure). Along with this substrate transport, an adhesion strengthening process is executed in the adhesion strengthening part AH, and then cooled to about room temperature by the cool plate CP1. Further, the circulation transport mechanism RM1 is driven (arrow R107 in the figure), and the substrate subjected to the processing in the processing unit group 100 returns to the original position (the rising end position of the elevator EV1: the dotted line position in the figure), and the elevator EV1 receives the substrate. Thereafter, the elevator EV1 moves to the substrate delivery position ST2 while holding the substrate (arrow R108 in the figure). In this way, the adhesion strengthening process can be performed on the substrate while circulating and transporting the substrate in the processing unit group 100.
[0095]
The main transfer robot TM receives the substrate from the elevator EV1 onto the hand at the substrate delivery position ST2 (arrow R109 in the figure), and further moves to the next substrate delivery position ST3 (arrow R110 in the figure).
[0096]
(3) Resist coating process at spin coater SC and baking process at processing unit group 200 (FIG. 18)
Next, at the substrate delivery position ST3, the main transport robot TM places the substrate on a spin chuck (not shown) of the spin coater SC (arrow R111 in the figure). Then, the spin coater SC operates to form a resist film on the surface of the substrate (resist coating process).
[0097]
When the resist coating process is completed, the main transfer robot TM extends again toward the spin coater SC and receives the substrate from the spin coater SC (arrow R112 in the figure), and then holds the substrate with the processing unit group 200. The substrate moves to the substrate delivery position ST4 where the substrate is delivered (arrow R113 in the figure).
[0098]
Then, baking processing by the hot plates HP21 and HP22 and cooling processing by the cool plate CP2 are performed while circulating and transporting the substrates transported in the same manner as the substrate transport procedure in the processing unit group 100. That is, the main transport robot TM and the sub transport means (elevator EV2 + circulation transport mechanism RM2) transport the substrate in the following procedure.
[0099]
-Placing the substrate from the main transfer robot TM to the elevator EV2 (arrow R114)
・ Elevator EV2 rise (arrow R115)
・ Transfer from elevator EV2 to hot plate HP21 (arrow R116)
・ Transfer from hot plate HP21 to hot plate HP22 (arrow R117)
・ Transfer from hot plate HP22 to cool plate CP2 (arrow R118)
・ Transfer from cool plate CP2 to elevator EV2 (arrow R119)
・ Descent of elevator EV2 (arrow R120)
・ Receiving the substrate from the elevator EV2 to the main transfer robot TM (arrow R121)
The main transfer robot TM that has received the substrate processed by the processing unit group 200 moves to the substrate transfer position ST5 in order to transfer the substrate to and from the interface IF (arrow R122 in the figure).
[0100]
(4) Board delivery at interface IF (Fig. 19)
At the substrate delivery position ST5, the hand of the main transfer robot TM extends to the interface IF side, and the substrate held by the hand is placed on the interface IF in cooperation with a robot (not shown) provided near the interface IF. (Arrow R123 in the figure).
[0101]
The substrate thus placed on the interface IF is transported to an external device (stepper) by another transport mechanism, subjected to an exposure process, and then returned to the interface IF. When the substrate on which the exposure processing has been completed is returned to the interface IF, the main transfer robot TM and the robot cooperate to transfer the substrate from the interface IF to the hand of the main transfer robot TM (arrow R124 in the figure).
[0102]
Subsequently, the main transport robot TM moves to the substrate delivery position ST6A while holding the substrate on which the exposure processing has been completed (arrow R125 in the figure). In this embodiment, as in the first embodiment, the edge exposure processing, which is the next processing, is alternately performed by the edge exposure units EEWA and EEWB, so that the edge exposure processing is performed on the next substrate. When performing the above, the substrate is moved to the other substrate delivery position ST6B.
[0103]
(5) Edge exposure processing by the edge exposure unit EEW and baking processing by the processing unit group 300 (FIG. 20)
At the substrate delivery position ST6A, the main transport robot TM extends its hand to the edge exposure unit EEWA and places the substrate (arrow R126 in the figure). Subsequently, the edge exposure unit EEWA operates to perform edge exposure processing on the substrate. The main transfer robot TM takes out the substrate thus subjected to the edge exposure processing from the edge exposure unit EEWA (arrow R127 in the figure).
[0104]
Next, the main transfer robot TM moves to the substrate delivery position ST7 while holding the substrate (arrow R128 in the figure). Then, baking processing by the hot plates HP31 and HP32 and cooling processing by the cool plate CP3 are performed while circulating and transporting the substrates transported in the same manner as the substrate transporting procedure in the processing unit groups 100 and 200. The transport procedure is as follows.
[0105]
-Placing the substrate from the main transfer robot TM to the elevator EV3 (arrow R129)
・ Elevator EV3 rise (arrow R130)
・ Transfer from elevator EV3 to hot plate HP31 (arrow R131)
・ Transfer from hot plate HP31 to hot plate HP32 (arrow R132)
・ Transfer from hot plate HP32 to cool plate CP3 (arrow R133)
・ Transfer from cool plate CP3 to elevator EV3 (arrow R134)
・ Descent of elevator EV3 (arrow R135)
・ Receiving the substrate from the elevator EV3 to the main transfer robot TM (arrow R136)
The main transport robot TM that has received the substrate processed by the processing unit group 300 moves to the substrate delivery position ST8A in order to perform the next development process (arrow R137 in the figure). In this embodiment as well, as in the first embodiment, since the development processing as the next processing is alternately performed by the spin developers SDA and SDB, the development processing is performed on the next substrate. Is moved to the other substrate delivery position ST8B.
[0106]
(6) Development processing by the spin developer SD, baking processing by the processing unit group 400, and carrying out the substrate to the indexer ID (FIG. 21)
At the substrate delivery position ST8A, the main transport robot TM places the substrate on the spin developer SDA (arrow R138 in the figure). Subsequently, the spin developer SDA is operated, and the development processing for the substrate is executed. The main transfer robot TM takes out the substrate thus developed from the spin developer SDA (arrow R139 in the figure).
[0107]
Next, the main transfer robot TM moves to the substrate delivery position ST9 while holding the substrate (arrow R140 in the figure). Then, baking processing by the hot plates HP41, HP42, HP43 and cooling processing by the cool plate CP4 are performed while circulating and transporting the substrates transported in the same manner as the substrate transporting procedure in the processing unit groups 100, 200, 300. The transport procedure is as follows.
[0108]
-Placing the substrate from the main transfer robot TM to the elevator EV4 (arrow R141)
-Elevator EV4 rise (arrow R142)
・ Transfer from elevator EV4 to hot plate HP41 (arrow R143)
・ Transfer from hot plate HP41 to hot plate HP42 (arrow R144)
・ Transfer from hot plate HP42 to hot plate HP43 (arrow R145)
・ Transfer from hot plate HP43 to cool plate CP4 (arrow R146)
・ Transfer from cool plate CP4 to elevator EV4 (arrow R147)
・ Descent of elevator EV4 (arrow R148)
・ Receiving the substrate from the elevator EV4 to the main transfer robot TM (arrow R149)
The main transfer robot TM that has received the substrate processed by the processing unit group 400 moves to the substrate delivery position ST1 (arrow R150 in the figure), and cooperates with the robot TS1 provided in the indexer ID to perform the above series of operations. The processed substrate is accommodated in the cassette CS (arrow R151 in the figure).
[0109]
Note that the substrate can be continuously processed by repeating the operations (1) to (6). In the description of this embodiment, the description has focused on only the order in which a single substrate is transported. However, when the apparatus is operating in a steady state, the main transport robot TM is configured to process each processing unit group or processing unit. On the other hand, the “exchange operation” of the substrates is repeated at each substrate delivery position, and a plurality of substrates are circulated and conveyed in order, and processed simultaneously.
[0110]
B-3. Effect of Apparatus of Second Embodiment In the second embodiment, among a plurality of processing units that execute a predetermined series of continuous process processes (continuous process processes in FIG. 24),
(1) The processing unit group 100 including the continuous adhesion reinforcing portion AH and the cool plate CP1
(2) After the resist coating process by the spin coater SC, the continuous hot plates HP21 and HP22 and the cool plate CP2 are grouped into a processing unit group 200.
(3) After the edge exposure processing by the edge exposure unit EEW, the continuous hot plates HP31, HP32 and the cool plate CP3 are grouped into the processing unit group 300.
(4) After the development processing by the spin developer SD, a continuous hot plate HP41, HP42, HP43 and cool plate CP4 are collectively formed to form a processing unit group 400, and an indexer ID, processing unit group 100, spin coater SC, edge The substrate is circulated and transferred by the main transfer robot TM between the exposure unit EEWA, the processing unit group 200, the edge exposure unit EEWB, the processing unit group 300, the spin developers SDA and SDB, the processing unit group 400, and the interface IF. In the groups 100, 200, 300, and 400, the continuous transport process similar to that shown in FIG. 24 is performed by circulating and transporting between the processing unit and the substrate transfer position by the sub-transport means configured by the elevator and the circulation transport mechanism. ing. For this reason, as in the first embodiment, the number of positions of the processing unit in charge of each transfer robot is greatly reduced, and the throughput of the apparatus can be improved as compared with the conventional example of FIG.
[0111]
Further, in this second embodiment, the heat treatment parts (adhesion strengthening part AH and hot plates HP21, HP22, HP31, HP32, HP41, HP42, HP43) for heat-treating the substrate are all arranged in the treatment part group. In addition, in the processing unit group, the substrate is heated to perform a predetermined process (adhesion strengthening process or baking process), and further cooled to room temperature by a cool plate (cooling processing unit) CP, and then the substrate delivery position. Therefore, the hand of the main transfer robot TM is always maintained at about room temperature, the thermal stability of the non-heating processing unit such as the spin coater SC is ensured, and a series of continuous process processing of the substrate can be performed stably. it can.
[0112]
Furthermore, in the second embodiment, the thermal history of the substrate is constant, so that the thermal stability can be further improved. This is because, when performing the same heat treatment as in the first embodiment or the conventional example, for example, the heat treatment using a different hot plate HP for each substrate when performing a baking process after the development process, a certain hot plate HP is used. Strictly speaking, the processing results may differ between the baking process and the baking process using another hot plate HP. On the other hand, as in the second embodiment, all the substrates are always heated by the same heating processing unit. In this case, the processing results are completely uniform for each substrate, and the thermal history applied to each substrate is completely constant.
[0113]
Also in this second embodiment, since the substrate delivery positions ST1 to ST9 are provided in substantially the same plane, the main transfer robot TM only needs to reciprocate substantially on a straight line, and the spin coater SC in the vertical direction. It is only necessary to raise and lower the substrate for delivery to and from the other. Therefore, a large drive mechanism for two-dimensional movement is unnecessary, and a part of the processing unit is arranged in a free space generated above and below the movement path of the main transport robot TM, or for storing and pumping chemicals. Therefore, the apparatus can be made compact.
[0114]
B-4. Modification of Second Embodiment The number of spin coaters SC is not limited to one, but a plurality of units are provided in the same manner as the edge exposure unit EEW and the spin developer SD, and the substrates that are transported sequentially are sequentially arranged. Alternatively, processing may be performed by distributing to a plurality of units. In this case, in consideration of processing efficiency, it is desirable to add a processing unit group 200 that performs a baking process after a resist coating process by the spin coater SC. Further, when adding the processing unit group 200, as shown in FIG. 22, the elevator EV2 and the cool plate CP2 can be shared to save the space of the apparatus. Further, only the elevator EV2 may be shared.
[0115]
The sharing of the elevator EV and the like is not limited to the processing unit group 200, and the same applies to the processing unit groups 100, 300, and 400.
[0116]
Further, in the first embodiment, the main transfer robot TM is a so-called double arm type transfer robot having two hands, but is a so-called single arm type transfer robot having only one hand. Also good.
[0117]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
[0118]
According to the first aspect of the present invention, the main transporting means transports the substrate between the indexer, the interface, and the substrate delivery position of the processing unit group, and the sub-transporting means constitutes a plurality of the substrate delivery position and the processing unit group. The substrate is transported to and from the processing section. For this reason, the number of processing units (number of positions) that each transport unit has to move is reduced, the time required for each transport unit to make a round is shortened, and as a result, the throughput can be improved.
[0119]
According to the invention of claim 2, a plurality of processing unit groups are provided, and in each processing unit group, a predetermined unit process is performed in the processing unit while the substrate is being transported between the processing unit and the substrate delivery position by the sub-transport means. Therefore, predetermined processing can be performed independently for each processing unit group, and the operating rate of the substrate processing apparatus can be improved.
[0120]
According to invention of Claim 3, the main conveyance means is comprised by the 1st conveyance part which conveys a board | substrate according to a 1st conveyance order, and the 2nd conveyance part which conveys a board | substrate according to a 2nd conveyance order. Therefore, the number of processing units that each transport unit moves is reduced, and throughput can be improved.
[0121]
According to the invention of claim 4, the first transport unit transports the substrate between the indexer, the substrate transfer position of the first processing unit group, and the interface, and the second transport unit is the indexer, the substrate of the second processing unit group. Since the substrate is transferred between the delivery position and the interface, the number of processing units to which each transfer unit moves is reduced, and the throughput can be improved.
[0122]
According to the invention of claim 5, since the transport paths of the first transport section and the second transport section are partitioned from each other, the atmosphere in the transport path of the first transport section is changed to the atmosphere in the transport path of the second transport section. The substrate can be transported in a desired atmosphere.
[0123]
According to the sixth aspect of the present invention, the first processing unit group includes the resist coating processing unit and the heat treatment unit, and the second processing unit group includes the development processing unit and the heat processing unit. The number is reduced and the throughput can be improved.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a first embodiment of a substrate processing apparatus according to the present invention.
FIG. 2 is a partially cutaway enlarged view of the substrate processing apparatus according to the first embodiment.
FIG. 3 is a conceptual plan layout view of the substrate processing apparatus according to the first embodiment.
4 is a cross-sectional view taken along line VV in FIG. 1. FIG.
FIG. 5 is a block diagram showing an electrical configuration of the substrate processing apparatus according to the first embodiment.
FIG. 6 is a process flow diagram of the substrate processing apparatus according to the first embodiment.
FIG. 7 is a diagram schematically showing the operation of the substrate processing apparatus according to the first embodiment.
FIG. 8 is a diagram schematically showing the operation of the substrate processing apparatus according to the first embodiment.
FIG. 9 is a diagram schematically showing the operation of the substrate processing apparatus according to the first embodiment.
FIG. 10 is a diagram schematically showing the operation of the substrate processing apparatus according to the first embodiment.
FIG. 11 is a diagram schematically showing the operation of the substrate processing apparatus according to the first embodiment.
FIG. 12 is an external perspective view of a second embodiment of the substrate processing apparatus according to the present invention.
FIG. 13 is a cross-sectional view of a substrate processing apparatus according to a second embodiment.
FIG. 14 is a conceptual plan layout view of a substrate processing apparatus according to a second embodiment.
FIG. 15 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 16 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 17 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 18 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 19 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 20 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 21 is a diagram schematically showing the operation of the substrate processing apparatus according to the second embodiment.
FIG. 22 is a diagram showing a modification of the substrate processing apparatus according to the second embodiment.
FIG. 23 is a view showing a conventional substrate processing apparatus.
FIG. 24 is a diagram showing an example of a procedure of continuous process processing by the substrate processing apparatus.
[Explanation of symbols]
1 Substrate 10, 30 Processing unit 20, 40, 50, 100, 200, 300, 400 Processing unit group AH Adhesion strengthening unit CP Cool plate CP1-CP4 Cool plate CP21, CP22, CP41, CP51 Cool plate EEW, EEWA, EEWB Edge Exposure unit EV1 to EV4 Elevator HP, HP21, HP22, HP41 to HP43, HP51 to HP53 Hot plate ID Indexer IF Interface RM1 to RM4 Circulation transport mechanism SC, SCA, SCB Spin coater SD, SDA, SDB Spin developer SPU, SPL Free space ST1 ~ ST5, ST6A, ST6B, ST7, ST8A, ST8B, ST9 Substrate delivery position TML Lower transfer section (first transfer section)
TMU Upper transfer unit (second transfer unit)
TM Main transfer robot TS2, TS4, TS5 Sub transfer robot

Claims (6)

A substrate processing apparatus that performs resist coating processing and development processing on a substrate by performing predetermined unit processing in each processing unit while conveying the substrate between a plurality of processing units in a predetermined order,
An indexer for taking out the untreated substrate and accommodating the substrate after the resist coating process and the development process ;
It comprises a plurality of processing units for executing a plurality of continuous unit processes constituting the resist coating process and the developing process , and has a substrate delivery position for delivering a substrate to the plurality of processing parts. A processing unit group;
An interface for transferring the substrate to and from an exposure apparatus that performs an exposure process between the resist coating process and the development process ;
Main conveying means for conveying the substrate only between the indexer, the substrate transfer position and the interfaces of the processing unit group,
Sub-transport means for transporting the substrate only between the plurality of processing sections constituting the processing section group and the substrate delivery position;
A substrate processing apparatus comprising:   The substrate processing apparatus of claim 1, comprising a plurality of the processing unit groups. The transport order of the substrates by the main transport means is divided into first and second transport orders,
The main transport means includes a first transport unit that transports substrates according to the first transport order and a second transport unit that transports substrates according to the second transport order. Item 3. The substrate processing apparatus according to Item 2. The plurality of processing unit groups include a first processing unit group in which a resist coating process is performed on a substrate and a second processing unit group in which a development process is performed on the substrate,
The first transport unit transports a substrate between the indexer, a substrate delivery position of the first processing unit group, and the interface,
The substrate processing apparatus according to claim 3, wherein the second transport unit transports a substrate between the indexer, a substrate delivery position of the second processing unit group, and the interface.   The substrate processing apparatus according to claim 3, wherein transport paths of the first transport unit and the second transport unit are partitioned from each other. The first processing unit group includes a resist coating processing unit and a heat treatment unit,
The substrate processing apparatus according to claim 4, wherein the second processing unit group includes a development processing unit and a heat treatment unit.

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