JP3802119B2 - Wafer transfer device - Google Patents

Wafer transfer device Download PDF

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Publication number
JP3802119B2
JP3802119B2 JP4071496A JP4071496A JP3802119B2 JP 3802119 B2 JP3802119 B2 JP 3802119B2 JP 4071496 A JP4071496 A JP 4071496A JP 4071496 A JP4071496 A JP 4071496A JP 3802119 B2 JP3802119 B2 JP 3802119B2
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Japan
Prior art keywords
fork
wafer
arm
transfer
wafer transfer
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Expired - Fee Related
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JP4071496A
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Japanese (ja)
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JPH09213768A (en
Inventor
春樹 矢原
忠隆 野口
政彦 龍
健一 立花
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Priority to JP4071496A priority Critical patent/JP3802119B2/en
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【０００１】
【発明の属する技術分野】
本発明は、半導体ウェハをウェハカセットから取り出し、収納するウエハ搬送装置に関するものである。
【０００２】
【従来の技術】
従来のウェハ搬送装置は、図５に示すように構成されている。
図において、２１はウェハ搬送室で、このウェハ搬送室の底板２２にウェハ搬送ロボット２３を取付けてある。前記ウェハ搬送ロボツト２３はモータ軸に一端を取付けられた第１のアーム２４が設けられ、この第１のアーム２４の先端に第２のアーム２５を旋回可能に取付けてある。前記第２のアーム２５の先端には第３のアーム２６が旋回可能に取付けられ、第３のアーム２６の先端には搬送フォーク２７を固定してある。前記モータの回転により搬送フォーク２７が前進、後退し、ウェハカセット２８内のウェハ２９を搬送フォーク上に載置して、ウェハカセット２８からウェハ２９を搬出入する。
【０００３】
【発明が解決しようとする課題】
ところが、従来のウェハ搬送装置は、ウェハ搬送ロボット２３の第３アーム２６の先端に搬送フォーク２７を固定しており、搬送フォーク２７がウェハ２９に対して傾いていると、ウェハカセット２８に搬送フォーク２７が入るときウェハカセット２８内のウェハ２９に搬送フォーク２７が当たりウェハ２９を損傷していた。このためウェハ搬送ロボット２３とウェハ搬送室２１の底板２２との間にライナを入れてウェハ搬送ロボット２３の傾きを調整していた。このため、ウェハ搬送室の狭い場所での作業となり、調整作業が煩雑となる欠点があった。
本発明は、ウエハ搬送ロボットのアーム先端の搬送フォークの調整作業を簡単にすることを目的とする。
【０００４】
【課題を解決するための手段】
本発明は上記問題点を解決するために、ウェハカセットに収納されたウェハを、ウェハ搬送ロボットのアームに取付けた搬送フォークに載置して搬送するウェハ搬送装置において、前記ウェハ搬送ロボットのアームの先端に、両側に脚部を設けた凹部を設け、前記搬送フォークの根元に、前記搬送フォークの長手方向に垂直に交わる軸を中心にして回転するθ方向に回動可能に支持具を設けるとともに、前記支持具に、前記凹部に嵌め込む凸部を設け、前記搬送フォークに設けた支持具の凸部を、前記アームの凹部に嵌め込んで、前記搬送フォークの幅方向に垂直に交わる軸を中心にして回転するα方向に回動可能に取付け、前記アームの先端の上部に、端部が前記支持具の上に突出する調整板を固定し、前記調整板に、前記搬送フォークのθ方向の傾きを調整する調整ボルトと、前記搬送フォークのα方向の傾きを調整する調整ボルトとを設けるようにしている。
【０００５】
【発明の実施の形態】
以下、本発明の実施例を図を用いて詳細に説明する。
図１は本発明の第１の実施例を示すウェハ搬送装置の要部側断面図、図２は図１におけるウェハ搬送フォークの要部を断面した平面図、図３は搬送フォークの要部を断面した側面図である。
１はウェハ室で、このウェハ室の底板２にウエハ搬送ロボット３が取付けてある。このウェハ搬送ロボット３は、ロボット内のモータの軸に一端を取付けた第１のアーム４を有し、この第１のアーム４の先端に第２のアーム５を旋回可能に取付け、かつ、この第２のアーム５の先端に第３のアーム６を旋回可能に設けて、この第３のアーム６の先端が直線方向に前進、後退できるように構成してある。７は第３のアーム６の先端の凹部両側に設けた脚部、８は後端部に凸部を有する支持具で、この凸部を前記第３のアーム６の凹部に嵌め込んである。９はピンで、第３のアーム６の脚部７と支持具８の凸部とに設け、このピン９を中心に支持具８が脚部７に対しα方向に回動しうるように構成してある。ここで、前記α方向とは、図２に示すように、前記搬送フォーク１１の長手方向に垂直に交わる軸を中心にして回転する方向を示している。１０は固定ボルトで、前記第３のアーム６の脚部７の側面に設けた図示しない長穴に通して支持具８を前記脚部７に固定するようにしてある。１１は搬送フォークで、先端を二股したウェハの載置面１２が設けられ、根元を支持具に植設したピン１３に嵌め込み、搬送フォーク１１がピン１３を中心にθ方向に回動しうるようにしてある。ここで、前記θ方向とは、図２に示すように、前記搬送フォーク１１の幅方向に垂直に交わる軸を中心にして回転する方向を示している。１４は固定ボルトで、前記支持具８の側面に設けた図示しない長穴に通して搬送フォークを前記支持具８に固定するようにしてある。１５は第３のアーム６の先端に固定した調整板で、その端部を支持具８の上に突出させ、その突出した板面に調整ボルト１６が設けられている。固定ボルト１０を緩めて、前記調整ボルト１６を進退させることにより支持具８をα方向に回動させるようにしてある。１７は調整板の板面に設けた調整ボルトで、固定ボルト１４を緩めて、前記調整ボルト１７を進退させることにより前記搬送フォーク１１をピン１３を中心にθ方向に回動させるようにしてある。１８、１９は搬送フォークの載置面に対向させて設けた検出器で、ウェハ搬送室に取り付けてある。
このように構成した搬送フォークの調整は、ウェハ搬送ロボットを駆動して第１、第２、第３のアームを屈伸して搬送フォークが検出器１８の下の位置に移動する。搬送フォークの二股のウェハ載置面のそれぞれに対向する検出器１８により搬送フォークのθ方向の傾きを検出し、調整ボルト１７を進退させて搬送フォークのθ方向の傾きを調整して、固定ボルト１４を締めて搬送フォーク１１を支持具８に固定する。つぎに、搬送フォークの二股のウェハ載置面１２に対向する検出器１９と検出器１８により搬送フォークのウェハ搬送フォークのα方向の傾きを検出し、調整ボルト１６を進退させて搬送フォーク１１のα方向の傾きを調整して、固定ボルト１０を締めて支持具８を第３のアーム６に固定する。
図４は、本発明の第２の実施例を示す搬送フォークの要部を断面した側面図で、調整板１５に圧電素子２０を取り付け、この圧電素子２０を動作させて支持具８あるいは搬送フォーク１１を回動させて調整するようにしてある。
【０００６】
【発明の効果】
以上述べたように本発明によれば、フォークを支持具に対してθ方向に回動可能に取付けるとともに、支持具をアームに対してα方向に回動可能に取付け、かつ、前記フォークのθ方向およびα方向の傾き調整を、前記アームの先端上部に固定した調整板上の調整ボルトで行う構成にしているので、ウェハ室のウェハ搬送ロボットに取り付けた搬送フォーク自体の傾きを簡単に調整でき、ウェハカセット内に搬送フォークが挿入しても搬送フォークがウェハを損傷することがない。
【図面の簡単な説明】
【図１】 本発明の第１の実施例を示すウェハ搬送装置の要部側断面図である。
【図２】 本発明の搬送フォークの要部を断面した平面図である。
【図３】 本発明の搬送フォークの要部を断面した側面図である。
【図４】 本発明の第２の実施例を示す搬送フォークの要部を断面した側面図である。
【図５】 従来のウェハ搬送装置の要部側断面図である。
【符号の説明】
１ ウェハ室、 ２ 床板、 ３ウェハ搬送ロボット、
４ 第１のアーム、５ 第２のアーム、 ６ 第３のアーム、
７ 脚部、 ８ 支持具、 ９ ピン、 １０ 固定ボルト、
１１ 搬送フォーク、 １２ ウェハ載置面、 １３ ピン、
１４ 固定ボルト、 １５ 調整板、 １６ 調整ボルト、
１７ 調整ボルト、 １８ 検出器、 １９ 検出器、
２０ 検出器[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wafer transfer apparatus for taking out and storing a semiconductor wafer from a wafer cassette.
[0002]
[Prior art]
A conventional wafer transfer apparatus is configured as shown in FIG.
In the figure, reference numeral 21 denotes a wafer transfer chamber, and a wafer transfer robot 23 is attached to a bottom plate 22 of the wafer transfer chamber. The wafer transfer robot 23 is provided with a first arm 24 having one end attached to a motor shaft, and a second arm 25 is pivotally attached to the tip of the first arm 24. A third arm 26 is pivotably attached to the tip of the second arm 25, and a transport fork 27 is fixed to the tip of the third arm 26. The conveyance fork 27 moves forward and backward by the rotation of the motor, the wafer 29 in the wafer cassette 28 is placed on the conveyance fork, and the wafer 29 is carried in and out of the wafer cassette 28.
[0003]
[Problems to be solved by the invention]
However, in the conventional wafer transfer apparatus, the transfer fork 27 is fixed to the tip of the third arm 26 of the wafer transfer robot 23, and when the transfer fork 27 is inclined with respect to the wafer 29, the transfer fork is transferred to the wafer cassette 28. When 27 enters, the transfer fork 27 hits the wafer 29 in the wafer cassette 28 and damages the wafer 29. For this reason, a liner is inserted between the wafer transfer robot 23 and the bottom plate 22 of the wafer transfer chamber 21 to adjust the tilt of the wafer transfer robot 23. For this reason, there is a drawback that the work is performed in a narrow place in the wafer transfer chamber and the adjustment work becomes complicated.
An object of the present invention is to simplify the adjustment work of a transfer fork at the tip of an arm of a wafer transfer robot.
[0004]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides a wafer transfer apparatus for transferring a wafer stored in a wafer cassette on a transfer fork attached to an arm of the wafer transfer robot. The tip is provided with a recess provided with legs on both sides, and a support is provided at the base of the transport fork so as to be rotatable in the θ direction that rotates about an axis perpendicular to the longitudinal direction of the transport fork. The support tool is provided with a convex portion that fits into the concave portion, and the convex portion of the support tool provided on the transport fork is fitted into the concave portion of the arm, and an axis that intersects the transport fork in the width direction perpendicularly pivotally attached to α direction rotating around the upper portion of the tip of the arm to secure the adjustment plate where the end portion projects over the support, the adjusting plate, the conveying fork θ An adjusting bolt for adjusting the inclination of the direction, so that provided the adjusting bolt for adjusting the α direction of inclination of the conveying fork.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a sectional side view of a main part of a wafer transfer apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view of a main part of the wafer transfer fork in FIG. 1, and FIG. It is the side view which carried out the cross section.
Reference numeral 1 denotes a wafer chamber, and a wafer transfer robot 3 is attached to a bottom plate 2 of the wafer chamber. The wafer transfer robot 3 has a first arm 4 having one end attached to the shaft of a motor in the robot, and a second arm 5 is attached to the tip of the first arm 4 so as to be pivotable. A third arm 6 is pivotably provided at the tip of the second arm 5 so that the tip of the third arm 6 can move forward and backward in a linear direction. 7 is a leg provided on both sides of the concave portion at the front end of the third arm 6, and 8 is a support member having a convex portion at the rear end portion. The convex portion is fitted into the concave portion of the third arm 6. Reference numeral 9 denotes a pin, which is provided on the leg 7 of the third arm 6 and the convex part of the support 8, and is configured so that the support 8 can rotate in the α direction with respect to the leg 7 around the pin 9. It is. Here, the α direction indicates a direction of rotation about an axis perpendicular to the longitudinal direction of the transport fork 11, as shown in FIG. Reference numeral 10 denotes a fixing bolt for fixing the support 8 to the leg portion 7 through a long hole (not shown) provided on the side surface of the leg portion 7 of the third arm 6. Reference numeral 11 denotes a transfer fork, which is provided with a wafer mounting surface 12 having a bifurcated tip. The base is fitted into a pin 13 implanted in a support so that the transfer fork 11 can rotate in the θ direction about the pin 13. It is. Here, the θ direction indicates a direction of rotation about an axis perpendicular to the width direction of the transport fork 11 as shown in FIG. Reference numeral 14 denotes a fixing bolt which is configured to pass through a long hole (not shown) provided on the side surface of the support 8 to fix the transport fork to the support 8. Reference numeral 15 denotes an adjustment plate fixed to the tip of the third arm 6, and its end protrudes above the support 8, and an adjustment bolt 16 is provided on the protruding plate surface. The support 8 is rotated in the α direction by loosening the fixing bolt 10 and moving the adjusting bolt 16 forward and backward. An adjustment bolt 17 is provided on the plate surface of the adjustment plate. The fixing bolt 14 is loosened, and the adjustment bolt 17 is advanced and retracted to rotate the transport fork 11 about the pin 13 in the θ direction. . Reference numerals 18 and 19 denote detectors provided to face the mounting surface of the transfer fork and are attached to the wafer transfer chamber.
The transport fork thus configured is adjusted by driving the wafer transport robot to bend and extend the first, second, and third arms and move the transport fork to a position below the detector 18. The detector 18 facing each of the forked wafer mounting surfaces of the transfer fork detects the inclination of the transfer fork in the θ direction, and moves the adjustment bolt 17 forward and backward to adjust the inclination of the transfer fork in the θ direction, thereby fixing the fixing bolt. 14 is tightened to fix the transport fork 11 to the support 8. Next, the detector 19 and the detector 18 facing the bifurcated wafer mounting surface 12 of the transfer fork detect the inclination of the transfer fork in the α direction of the wafer transfer fork, and the adjustment bolt 16 is advanced and retracted to move the transfer fork 11. By adjusting the inclination in the α direction, the fixing bolt 10 is tightened to fix the support 8 to the third arm 6.
FIG. 4 is a side view of the main part of the transport fork showing the second embodiment of the present invention. The piezoelectric element 20 is attached to the adjustment plate 15, and the piezoelectric element 20 is operated to support the support 8 or the transport fork. 11 is rotated for adjustment.
[0006]
【The invention's effect】
As described above, according to the present invention, the fork is attached to the support so as to be rotatable in the θ direction, and the support is attached to the arm so as to be rotatable in the α direction. The tilt of the transfer fork attached to the wafer transfer robot in the wafer chamber can be easily adjusted because the adjustment bolt on the adjustment plate fixed to the upper end of the arm is used to adjust the tilt in the direction and α. Even if the transfer fork is inserted into the wafer cassette, the transfer fork does not damage the wafer.
[Brief description of the drawings]
FIG. 1 is a side sectional view of an essential part of a wafer conveyance device showing a first embodiment of the present invention.
FIG. 2 is a plan view showing a cross-section of the main part of the transport fork of the present invention.
FIG. 3 is a cross-sectional side view of a main part of the transport fork of the present invention.
FIG. 4 is a cross-sectional side view of a main part of a transport fork showing a second embodiment of the present invention.
FIG. 5 is a sectional side view of a main part of a conventional wafer transfer apparatus.
[Explanation of symbols]
1 wafer chamber, 2 floor board, 3 wafer transfer robot,
4 first arm, 5 second arm, 6 third arm,
7 legs, 8 supports, 9 pins, 10 fixing bolts,
11 Transport fork, 12 Wafer mounting surface, 13 pins,
14 fixing bolt, 15 adjusting plate, 16 adjusting bolt,
17 adjustment bolts, 18 detectors, 19 detectors,
20 Detector

Claims (1)

ウェハカセットに収納されたウェハを、ウェハ搬送ロボットのアームに取付けた搬送フォークに載置して搬送するウェハ搬送装置において、
前記ウェハ搬送ロボットのアームの先端に、両側に脚部を設けた凹部を設け、
前記搬送フォークの根元に、前記搬送フォークの長手方向に垂直に交わる軸を中心にして回転するθ方向に回動可能に支持具を設けるとともに、前記支持具に、前記凹部に嵌め込む凸部を設け、
前記搬送フォークに設けた支持具の凸部を、前記アームの凹部に嵌め込んで、前記搬送フォークの幅方向に垂直に交わる軸を中心にして回転するα方向に回動可能に取付け、
前記アームの先端の上部に、端部が前記支持具の上に突出する調整板を固定し、
前記調整板に、前記搬送フォークのθ方向の傾きを調整する調整ボルトと、前記搬送フォークのα方向の傾きを調整する調整ボルトとを設けたことを特徴とするウェハ搬送装置。In a wafer transfer apparatus for transferring a wafer stored in a wafer cassette by placing it on a transfer fork attached to an arm of a wafer transfer robot,
Provided with a recess provided with legs on both sides at the tip of the arm of the wafer transfer robot,
A support tool is provided at the base of the transport fork so as to be rotatable in a θ direction that rotates about an axis perpendicular to the longitudinal direction of the transport fork, and a convex portion that fits into the recess is provided on the support tool. Provided,
The convex portion of the support provided on the transport fork is fitted into the concave portion of the arm, and is attached so as to be rotatable in the α direction that rotates about an axis perpendicular to the width direction of the transport fork .
At the top of the tip of the arm, an adjustment plate whose end protrudes above the support is fixed,
A wafer transfer apparatus comprising: an adjustment bolt for adjusting the inclination of the transfer fork in the θ direction; and an adjustment bolt for adjusting the inclination of the transfer fork in the α direction.
JP4071496A 1996-02-02 1996-02-02 Wafer transfer device Expired - Fee Related JP3802119B2 (en)

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JP4071496A JP3802119B2 (en) 1996-02-02 1996-02-02 Wafer transfer device

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JP3802119B2 true JP3802119B2 (en) 2006-07-26

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JP7412208B2 (en) 2020-02-17 2024-01-12 東京エレクトロン株式会社 Conveyance device, processing system and conveyance method
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