JP3780806B2 - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment Download PDF

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Publication number
JP3780806B2
JP3780806B2 JP2000061488A JP2000061488A JP3780806B2 JP 3780806 B2 JP3780806 B2 JP 3780806B2 JP 2000061488 A JP2000061488 A JP 2000061488A JP 2000061488 A JP2000061488 A JP 2000061488A JP 3780806 B2 JP3780806 B2 JP 3780806B2
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Japan
Prior art keywords
electronic component
substrate
ultraviolet light
mounting
substrate holding
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Expired - Fee Related
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JP2000061488A
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Japanese (ja)
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JP2001251045A (en
Inventor
智昭 中西
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、基板に樹脂接着剤によって電子部品を接合する電子部品の実装装置に関するものである。
【０００２】
【従来の技術】
電子部品を基板に実装する方法として、樹脂接着剤により電子部品を接合する方法が広く用いられる。この実装に際しては、予め樹脂接着剤が塗布された基板の実装位置に電子部品を搭載し、電子部品を実装ヘッドによって押圧する。そして樹脂接着剤が硬化することにより電子部品は基板に固着される。この樹脂接着剤の硬化を促進するために一般に実装過程において加熱することが行われるが、電子部品の種類によって加熱を嫌う特性の電子部品に対しては、硬化促進を熱ではなく紫外線照射によって行う場合がある。このような電子部品を実装対象とする電子部品の実装装置では、従来は実装ヘッドの周囲に電子部品と基板の接合部に照射方向を向けて紫外線照射装置を配置していた。
【０００３】
【発明が解決しようとする課題】
実装に必要な所要時間を短縮して実装作業を効率化するには樹脂接着剤の硬化をより短時間で行う必要がある。このためには、硬化過程で照射される紫外線の光量を所定量以上に確保することが求められる。しかしながら、上記従来の実装装置で紫外線の光量を増加させるために紫外線照射装置を大型化すると、実装ヘッドとの位置的な干渉を避けるためにある程度隔たった位置から紫外線を照射する必要がある。この結果装置スペースが増大するとともに、有害な紫外線の外部への漏光対策を必要とするなど、従来の電子部品実装では紫外線硬化型の樹脂接着剤を用いた場合に、実装作業の効率化と装置のコンパクト化・省エネルギー化を両立させることが困難であるという問題点があった。
【０００４】
そこで本発明は、実装作業の効率化と装置のコンパクト化・省エネルギー化を両立させることができる電子部品の実装装置を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１記載の電子部品の実装装置は、紫外線硬化型の樹脂接着剤により電子部品を基板に固着させて実装する電子部品の実装装置であって、前記基板を保持する基板保持部と、電子部品をピックアップして基板保持部上の基板に搭載する実装ヘッドと、前記基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置され紫外線を照射する紫外線光源部と、この紫外線光源部により照射された紫外線を基板と電子部品の接着部に塗布された樹脂接着剤に導く紫外線導光部とを備え、前記紫外線光源部は照射方向を上向きにして配設され、前記紫外線導光部は前記実装ヘッドに設けられ紫外線光源部から照射された紫外線を前記接着部に向けて反射する反射部である。
【０００７】
請求項２記載の電子部品の実装装置は、紫外線硬化型の樹脂接着剤により電子部品を基板に固着させて実装する電子部品の実装装置であって、前記基板を保持する基板保持部と、電子部品をピックアップして基板保持部上の基板に搭載する実装ヘッドと、前記基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置され紫外線を照射する紫外線光源部と、この紫外線光源部により照射された紫外線を基板と電子部品の接着部に塗布された樹脂接着剤に導く紫外線導光部とを備え、前記紫外線光源部は照射方向を水平にして配設され、前記紫外線導光部は前記基板保持部に沿って配設され紫外線光源部から照射された紫外線を導光体によって前記接着部に導く導光部である。
【０００９】
本発明によれば、基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置された紫外線光源部によって紫外線を照射し、この紫外線光源部により照射された紫外線を紫外線導光部によって基板と電子部品の接着部に塗布された樹脂接着剤に導くことにより、紫外線光源部を実装ヘッドとの位置的な干渉を避けて接着部と近接した位置に配置することができ、紫外線照射の効率を向上させて実装作業を効率化するとともに、実装装置のコンパクト化・省エネルギー化を図ることができる。
【００１０】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品の実装装置の正面図、図２、図３、図４は本発明の一実施の形態の電子部品の実装装置の部分正面図である。
【００１１】
まず図１を参照して電子部品の実装装置の構造について説明する。図１において、基板の位置決め部１はＸ軸テーブル２、Ｙ軸テーブル３より成る移動テーブル上に基板保持部４を載置して構成されている。基板保持部４上には、電子部品７が実装される基板５が保持されている。電子部品７の実装に際しては、基板５上に紫外線硬化型の樹脂接着剤が予め塗布され、この樹脂接着剤上に電子部品７を搭載した後に樹脂接着剤を硬化させて電子部品７を基板５に固着させる。
【００１２】
基板保持部４の両側方に近接して、紫外線光源部であるＵＶ照射装置６が配設されている。ＵＶ照射装置６は、紫外線照射面を略上向きにした姿勢で、基板保持部４の上面、すなわち基板の保持面のレベルよりも下方に配置されている。このような配置を採用することにより、電子部品の搭載動作において基板保持部４の上方にはフリーな空間が確保される。
【００１３】
位置決め部１の上方には、電子部品の実装部１０が配設されている。実装部１０は垂直なブラケット１０ａを備えており、ブラケット１０ａの前面に第１昇降ブロック１１及び第２昇降ブロック１２が上下方向にスライド自在に配設されている。ブラケット１０ａの上部にはモータ１５が垂直に配設されており、モータ１５を駆動して送りねじ１６を回転駆動することにより、送りねじ１６と螺合したナット１７に結合された第１昇降ブロック１１が上下動する。この上下動は、シリンダ１８を介して第２昇降ブロック１２に伝達される。すなわち、第２昇降ブロック１２はモータ１５によって上下動し、シリンダ１８によって所定の荷重で下方に押圧される。
【００１４】
第２昇降ブロックの下部には実装ヘッド１３が結合されている。実装ヘッド１３の下面には電子部品７を吸着して保持する吸着ノズル１４が装着されている。吸着ノズル１４は、中央部の下面に電子部品７を吸着して保持する吸着部１４ａを備えており、吸着部１４ａの周囲には外縁部に向かって傾斜した鏡面を有する反射部１４ｂが設けられている。この反射部１４ｂの傾斜角度と、ＵＶ照射装置６の配置角度を適切に設定することにより、ＵＶ照射装置６からの紫外線を基板保持部４上の所望の位置に導くことができる。従って、ここでは反射部１４ｂは紫外線導光部となっている。
【００１５】
この電子部品の実装装置は上記のように構成されており、以下この電子部品実装装置による電子部品の実装方法について図２を参照して説明する。この電子部品の実装方法は、加熱を嫌う特性を有する電子部品７を、紫外線硬化型の樹脂接着剤によって基板５に固着させるものである。
【００１６】
まず、実装に先立って基板５の実装位置には、樹脂接着剤８が塗布される。次いで、この基板５に対して電子部品７を吸着部１４ａに保持した実装ヘッド１３を下降させる。そして電子部品７を樹脂接着剤８上に搭載し基板５に対して所定荷重で押圧する。これにより図２に示すように樹脂接着剤８は、基板５の上面において電子部品７の外周から幾分はみ出した状態となる。そして樹脂接着剤８が硬化するまでこの状態を保持することにより、電子部品７は基板５に固着され実装される。
【００１７】
この樹脂接着剤８の硬化過程において、硬化を促進するためＵＶ照射装置６を点灯して紫外線を接着部に照射する。すなわち、ＵＶ照射装置６から上方に紫外線を照射し、吸着ノズル１４と一体的に設けられた反射部１４ｂによって中央部の斜め下方に反射させる。そして反射された紫外線を、電子部品７と基板５上面との接合部の樹脂接着剤８に対して照射する。この照射を所定時間継続することにより、樹脂接着剤８の硬化反応は紫外線によって促進され、従って実装時間を短縮して実装作業の効率化を図ることができる。
【００１８】
この紫外線照射において、ＵＶ照射装置６は基板保持部４の保持面のレベルよりも下方に配置されていることから、ＵＶ照射装置６と実装ヘッド１３との位置的な干渉が発生しない。したがって、ＵＶ照射装置６を照射対象の接合部に対して極力近接して配置することが可能となる。これにより、従来の紫外線硬化型の樹脂接着剤を用いた実装装置において、実装ヘッドの周囲の遠隔位置にＵＶ照射装置を配置して紫外線を照射する方法と比較して、小出力のＵＶ照射装置を用いて十分な紫外線照射効果を得ることができ、実装装置のコンパクト化・省エネルギー化が実現される。さらに、小出力のＵＶ照射装置を集中して配置するレイアウトとなることから、照射された紫外線の装置外部への漏光を最小に抑えることができ、漏光防止設備に多大のコストを費やすことなく作業環境を改善することができる。
【００１９】
なお、上記実施の形態では、ＵＶ照射装置６から照射された紫外光を吸着ノズル１４と一体的に設けられた反射部１４ｂによって下方に反射する構成を示しているが、図３（ａ）に示すように実装ヘッド１３に吸着ノズル１９と紫外線導光部としての反射部２０を別体で設けるようにしてもよい。この場合にも、図３（ｂ）に示すようにＵＶ照射装置６の照射方向と反射部２０の反射面の角度を適切に設定することにより、実装時においてＵＶ照射装置６からの紫外線を電子部品７と基板５の接合部に導くことができ、前述と同様の効果を得ることができる。
【００２０】
さらに、図４に示すように基板保持部４’の側方に配設されるＵＶ照射装置６を基板の保持面のレベルよりも下方に照射方向が水平となるような姿勢で配置してもよい。この場合には、図４（ａ）に示すように基板保持部４’の側面に沿って、光ファイバなどの光伝達性を有する導光体より成る導光部２１を配設する。これにより、電子部品７の接合部の樹脂接着剤硬化時には、図４（ｂ）に示すようにＵＶ照射装置６から照射された紫外線を導光部２１によって電子部品７の側方まで導き、接合部の樹脂接着剤に対して集中的に照射することができる。すなわち、この例では導光体より成る導光部２１が紫外線導光部となっている。このような構成によっても、前述と同様の効果を得ることができる。
【００２１】
【発明の効果】
本発明によれば、基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置された紫外線光源部によって紫外線を照射し、この紫外線光源部により照射された紫外線を紫外線導光部によって基板と電子部品の接着部に塗布された樹脂接着剤に導くようにしたので、紫外線光源部を実装ヘッドとの位置的な干渉を避けて接着部と近接した位置に配置することができ、紫外線照射の効率を向上させて実装作業を効率化するとともに、実装装置のコンパクト化・省エネルギー化を図ることができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品の実装装置の正面図
【図２】本発明の一実施の形態の電子部品の実装装置の部分正面図
【図３】本発明の一実施の形態の電子部品の実装装置の部分正面図
【図４】本発明の一実施の形態の電子部品の実装装置の部分正面図
【符号の説明】
１ 位置決め部
４ 基板保持部
５ 基板
６ ＵＶ照射装置
７ 電子部品
８ 樹脂接着剤
１０ 実装部
１３ 実装ヘッド
１４、１９ 吸着ノズル
１４ｂ、２０ 反射部
２１ 導光部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting equipment for electronic parts for bonding an electronic component to a substrate by a resin adhesive.
[0002]
[Prior art]
As a method for mounting the electronic component on the substrate, a method of joining the electronic component with a resin adhesive is widely used. At the time of mounting, an electronic component is mounted at a mounting position on a substrate to which a resin adhesive has been applied in advance, and the electronic component is pressed by a mounting head. When the resin adhesive is cured, the electronic component is fixed to the substrate. In order to accelerate the curing of the resin adhesive, heating is generally performed in the mounting process. However, for an electronic component having a characteristic that dislikes heating depending on the type of the electronic component, curing is accelerated not by heat but by irradiation with ultraviolet rays. There is a case. In an electronic component mounting apparatus that mounts such an electronic component, conventionally, an ultraviolet irradiation device is disposed around the mounting head so that the irradiation direction is directed to the joint between the electronic component and the substrate.
[0003]
[Problems to be solved by the invention]
In order to shorten the time required for mounting and make the mounting work more efficient, it is necessary to cure the resin adhesive in a shorter time. For this purpose, it is required to secure the amount of ultraviolet light irradiated in the curing process to a predetermined amount or more. However, if the size of the ultraviolet irradiation device is increased in order to increase the amount of ultraviolet light in the conventional mounting device, it is necessary to irradiate the ultraviolet rays from a position separated to some extent in order to avoid positional interference with the mounting head. As a result, the equipment space is increased and countermeasures against leakage of harmful ultraviolet rays to the outside are required. For example, when mounting UV curing resin adhesives in conventional electronic component mounting, the efficiency of the mounting work and the equipment are improved. There is a problem that it is difficult to achieve both compactness and energy saving.
[0004]
Accordingly, the present invention aims at providing a mounting equipment of electronic components it is possible to achieve both downsizing and energy saving of efficiency and device mounting work.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus that mounts an electronic component by fixing the electronic component to a substrate with an ultraviolet curable resin adhesive, and includes a substrate holding unit that holds the substrate, an electronic component A mounting head for picking up components and mounting them on the substrate on the substrate holding unit; an ultraviolet light source unit arranged on the side of the substrate holding unit and below the level of the holding surface of the substrate holding unit; An ultraviolet light guide unit that guides the ultraviolet light emitted from the ultraviolet light source unit to a resin adhesive applied to the adhesive part of the substrate and the electronic component, and the ultraviolet light source unit is disposed with the irradiation direction facing upward; The light guide part is a reflection part that is provided in the mounting head and reflects the ultraviolet light emitted from the ultraviolet light source part toward the adhesive part .
[0007]
The electronic component mounting apparatus according to claim 2 is an electronic component mounting apparatus that mounts an electronic component by fixing the electronic component to a substrate with an ultraviolet curable resin adhesive, and includes a substrate holding unit that holds the substrate, an electronic component A mounting head for picking up components and mounting them on the substrate on the substrate holding unit; an ultraviolet light source unit arranged on the side of the substrate holding unit and below the level of the holding surface of the substrate holding unit; An ultraviolet light guide unit that guides the ultraviolet light emitted from the ultraviolet light source unit to a substrate and a resin adhesive applied to an adhesive part of the electronic component, and the ultraviolet light source unit is disposed with the irradiation direction horizontal, The light guide unit is a light guide unit that is disposed along the substrate holding unit and guides the ultraviolet rays irradiated from the ultraviolet light source unit to the adhesive unit by a light guide.
[0009]
According to the present invention, ultraviolet rays are irradiated to the side of the substrate holding unit by the ultraviolet light source unit disposed below the level of the holding surface of the substrate holding unit, and the ultraviolet rays irradiated by the ultraviolet light source unit are guided to the ultraviolet ray. By guiding the resin adhesive applied to the bonding part between the board and the electronic component by the part, the ultraviolet light source part can be placed at a position close to the bonding part while avoiding positional interference with the mounting head. The efficiency of mounting can be improved by improving the irradiation efficiency, and the mounting apparatus can be made compact and energy-saving.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2, 3, and 4 are partial front views of the electronic component mounting apparatus according to an embodiment of the present invention.
[0011]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a substrate positioning unit 1 is configured by placing a substrate holding unit 4 on a moving table including an X-axis table 2 and a Y-axis table 3. A substrate 5 on which the electronic component 7 is mounted is held on the substrate holding unit 4. When mounting the electronic component 7, an ultraviolet curable resin adhesive is applied in advance on the substrate 5, and after mounting the electronic component 7 on the resin adhesive, the resin adhesive is cured to attach the electronic component 7 to the substrate 5. Secure to.
[0012]
In the vicinity of both sides of the substrate holding unit 4, a UV irradiation device 6 that is an ultraviolet light source unit is disposed. The UV irradiation device 6 is disposed below the upper surface of the substrate holding unit 4, that is, below the level of the substrate holding surface, with the ultraviolet irradiation surface substantially upward. By adopting such an arrangement, a free space is secured above the substrate holding part 4 in the mounting operation of the electronic component.
[0013]
An electronic component mounting unit 10 is disposed above the positioning unit 1. The mounting portion 10 includes a vertical bracket 10a, and a first elevating block 11 and a second elevating block 12 are disposed on the front surface of the bracket 10a so as to be slidable in the vertical direction. A motor 15 is vertically disposed above the bracket 10a, and a first elevating block coupled to a nut 17 screwed with the feed screw 16 by driving the motor 15 to rotationally drive the feed screw 16. 11 moves up and down. This vertical movement is transmitted to the second lifting block 12 via the cylinder 18. That is, the second elevating block 12 moves up and down by the motor 15 and is pressed downward by the cylinder 18 with a predetermined load.
[0014]
A mounting head 13 is coupled to the lower part of the second lifting block. A suction nozzle 14 that sucks and holds the electronic component 7 is mounted on the lower surface of the mounting head 13. The suction nozzle 14 includes a suction portion 14a that sucks and holds the electronic component 7 on the lower surface of the central portion, and a reflection portion 14b having a mirror surface inclined toward the outer edge portion is provided around the suction portion 14a. ing. By appropriately setting the inclination angle of the reflecting portion 14 b and the arrangement angle of the UV irradiation device 6, the ultraviolet rays from the UV irradiation device 6 can be guided to a desired position on the substrate holding unit 4. Therefore, the reflection part 14b is an ultraviolet light guide part here.
[0015]
The electronic component mounting apparatus is configured as described above. Hereinafter, a method of mounting an electronic component by the electronic component mounting apparatus will be described with reference to FIG. In this electronic component mounting method, an electronic component 7 having a property that dislikes heating is fixed to the substrate 5 with an ultraviolet curable resin adhesive.
[0016]
First, the resin adhesive 8 is applied to the mounting position of the substrate 5 prior to mounting. Next, the mounting head 13 holding the electronic component 7 on the suction portion 14 a is lowered with respect to the substrate 5. Then, the electronic component 7 is mounted on the resin adhesive 8 and pressed against the substrate 5 with a predetermined load. As a result, as shown in FIG. 2, the resin adhesive 8 slightly protrudes from the outer periphery of the electronic component 7 on the upper surface of the substrate 5. Then, by holding this state until the resin adhesive 8 is cured, the electronic component 7 is fixedly mounted on the substrate 5 and mounted.
[0017]
In the curing process of the resin adhesive 8, the UV irradiation device 6 is turned on to irradiate the adhesive part with ultraviolet rays in order to accelerate the curing. That is, ultraviolet rays are radiated upward from the UV irradiating device 6, and are reflected obliquely below the central portion by the reflecting portion 14 b provided integrally with the suction nozzle 14. Then, the reflected ultraviolet rays are applied to the resin adhesive 8 at the joint between the electronic component 7 and the upper surface of the substrate 5. By continuing this irradiation for a predetermined time, the curing reaction of the resin adhesive 8 is promoted by the ultraviolet rays, so that the mounting time can be shortened and the mounting work can be made more efficient.
[0018]
In this ultraviolet irradiation, since the UV irradiation device 6 is disposed below the level of the holding surface of the substrate holding unit 4, positional interference between the UV irradiation device 6 and the mounting head 13 does not occur. Therefore, it becomes possible to arrange the UV irradiation device 6 as close as possible to the junction to be irradiated. As a result, in a conventional mounting apparatus using an ultraviolet curable resin adhesive, a UV irradiation apparatus with a small output is provided in comparison with a method in which a UV irradiation apparatus is disposed at a remote position around the mounting head to irradiate ultraviolet rays. A sufficient ultraviolet irradiation effect can be obtained by using this, and the mounting device can be made compact and energy-saving. Furthermore, since the layout is such that small-output UV irradiation devices are concentrated, leakage of the irradiated ultraviolet rays to the outside of the device can be minimized, and work without spending a great deal of cost on light leakage prevention equipment. The environment can be improved.
[0019]
In the above embodiment, a configuration is shown in which ultraviolet light irradiated from the UV irradiation device 6 is reflected downward by the reflecting portion 14b provided integrally with the suction nozzle 14, but FIG. As shown, the mounting head 13 may be provided with a suction nozzle 19 and a reflection part 20 as an ultraviolet light guide part separately. Also in this case, as shown in FIG. 3 (b), by appropriately setting the irradiation direction of the UV irradiation device 6 and the angle of the reflection surface of the reflecting portion 20, the ultraviolet rays from the UV irradiation device 6 are converted into electrons during mounting. It can be led to the joint between the component 7 and the substrate 5, and the same effect as described above can be obtained.
[0020]
Further, as shown in FIG. 4, the UV irradiation device 6 disposed on the side of the substrate holding portion 4 ′ may be disposed in such a posture that the irradiation direction is horizontal below the level of the substrate holding surface. Good. In this case, as shown in FIG. 4A, a light guide portion 21 made of a light guide body having a light transmission property such as an optical fiber is disposed along the side surface of the substrate holding portion 4 ′. As a result, when the resin adhesive is cured at the joint of the electronic component 7, the ultraviolet light irradiated from the UV irradiation device 6 is guided to the side of the electronic component 7 by the light guide 21 as shown in FIG. Irradiation can be focused on the resin adhesive of the part. That is, in this example, the light guide 21 made of a light guide is an ultraviolet light guide. Even with such a configuration, the same effect as described above can be obtained.
[0021]
【The invention's effect】
According to the present invention, ultraviolet rays are irradiated to the side of the substrate holding unit by the ultraviolet light source unit disposed below the level of the holding surface of the substrate holding unit, and the ultraviolet rays irradiated by the ultraviolet light source unit are guided to the ultraviolet ray. Since it is guided to the resin adhesive applied to the adhesion part between the board and the electronic component by the part, the ultraviolet light source part can be placed in a position close to the adhesion part while avoiding positional interference with the mounting head. In addition to improving the efficiency of ultraviolet irradiation, the mounting work can be made more efficient, and the mounting apparatus can be made more compact and energy-saving.
[Brief description of the drawings]
FIG. 1 is a front view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a partial front view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a partial front view of an electronic component mounting apparatus according to an embodiment of the present invention.
DESCRIPTION OF SYMBOLS 1 Positioning part 4 Board | substrate holding part 5 Board | substrate 6 UV irradiation apparatus 7 Electronic component 8 Resin adhesive 10 Mounting part 13 Mounting head 14, 19 Suction nozzle 14b, 20 Reflecting part 21 Light guide part

Claims (2)

紫外線硬化型の樹脂接着剤により電子部品を基板に固着させて実装する電子部品の実装装置であって、前記基板を保持する基板保持部と、電子部品をピックアップして基板保持部上の基板に搭載する実装ヘッドと、前記基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置され紫外線を照射する紫外線光源部と、この紫外線光源部により照射された紫外線を基板と電子部品の接着部に塗布された樹脂接着剤に導く紫外線導光部とを備え、前記紫外線光源部は照射方向を上向きにして配設され、前記紫外線導光部は前記実装ヘッドに設けられ紫外線光源部から照射された紫外線を前記接着部に向けて反射する反射部であることを特徴とする電子部品の実装装置。 An electronic component mounting apparatus that mounts an electronic component fixed to a substrate with an ultraviolet curable resin adhesive, the substrate holding unit holding the substrate, and picking up the electronic component onto the substrate on the substrate holding unit A mounting head to be mounted; an ultraviolet light source unit that is disposed below the level of the holding surface of the substrate holding unit on the side of the substrate holding unit; and irradiates ultraviolet rays; An ultraviolet light guide that guides the resin adhesive applied to the adhesive part of the component, the ultraviolet light source is disposed with the irradiation direction facing upward, and the ultraviolet light guide is provided on the mounting head. mounting apparatus that electronic components to, wherein the ultraviolet light emitted from parts of a reflective portion for reflecting the adhesive portion. 紫外線硬化型の樹脂接着剤により電子部品を基板に固着させて実装する電子部品の実装装置であって、前記基板を保持する基板保持部と、電子部品をピックアップして基板保持部上の基板に搭載する実装ヘッドと、前記基板保持部の側方に基板保持部の保持面のレベルよりも下方に配置され紫外線を照射する紫外線光源部と、この紫外線光源部により照射された紫外線を基板と電子部品の接着部に塗布された樹脂接着剤に導く紫外線導光部とを備え、前記紫外線光源部は照射方向を水平にして配設され、前記紫外線導光部は前記基板保持部に沿って配設され紫外線光源部から照射された紫外線を導光体によって前記接着部に導く導光部であることを特徴とする電子部品の実装装置。 An electronic component mounting apparatus that mounts an electronic component fixed to a substrate with an ultraviolet curable resin adhesive, the substrate holding unit holding the substrate, and picking up the electronic component onto the substrate on the substrate holding unit A mounting head to be mounted; an ultraviolet light source unit that is disposed below the level of the holding surface of the substrate holding unit on the side of the substrate holding unit; and irradiates ultraviolet rays; An ultraviolet light guide that guides the resin adhesive applied to the adhesive part of the component, the ultraviolet light source is arranged with the irradiation direction horizontal, and the ultraviolet light guide is arranged along the substrate holding part. mounting apparatus that electronic components to being a light guide portion for guiding the ultraviolet rays emitted from the set ultraviolet light source unit to the bonding portion by the light guide.
JP2000061488A 2000-03-07 2000-03-07 Electronic component mounting equipment Expired - Fee Related JP3780806B2 (en)

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JP2014103378A (en) * 2012-07-06 2014-06-05 Hitachi Chemical Co Ltd Semiconductor device manufacturing method, semiconductor device and application device
JP2015065383A (en) * 2013-09-26 2015-04-09 パナソニックＩｐマネジメント株式会社 Component mounting apparatus
CN109073955B (en) 2016-04-28 2021-05-25 京瓷株式会社 Adhesive structure, imaging device, and vehicle-mounted camera
WO2019147640A1 (en) * 2018-01-25 2019-08-01 Kulicke And Soffa Industries, Inc. Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

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