JP3774057B2 - IC test equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC test apparatus for testing various semiconductor integrated circuit elements, particularly a semiconductor integrated circuit element (hereinafter referred to as an IC) incorporating a logic circuit or an analog circuit.
[0002]
[Prior art]
FIG. 2 shows an example of the configuration of an IC test apparatus targeted by the present invention. This type of IC test apparatus automatically includes a main frame MIN in which the test apparatus is stored, a test head TSH connected to the tip of the cable KB drawn from the main frame MIN, and an IC under test on the test head TSH. A handler HAND is mounted and executes an operation of discharging from the test head after the test is completed.
[0003]
The handler HAND is mainly composed of an IC transport device that sucks an IC by a vacuum suction head and travels freely in the X and Y directions to transport the IC to an arbitrary position. This IC transport device is a thermostat TEP. It is mounted inside, and a test is performed by applying thermal stress at a predetermined temperature to the IC under test.
The test head TSH has an IC socket SK on the upper surface, and the IC socket SK is arranged facing the opening WIN formed in the thermostat TEP. The handler HAND places the IC under test on the IC socket SK through the opening WIN. Attach and discharge.
[0004]
FIG. 3 shows the detailed structure of the IC socket portion. At the top of the IC socket SK, when the handler HAND carries the IC into the IC socket SK, a socket guide SKG for guiding the position of the vacuum suction head (not shown in particular) and mounting the IC on the IC socket SK accurately is provided. It is done. That is, the socket guide SKG is provided with a guide pin PN protruding upward, and a part of the vacuum suction head of the IC transfer device is engaged with the guide pin PN, so that the IC sucked by the vacuum suction head is connected to the IC socket. Guide to the SK position.
[0005]
The terminal TAN of the IC socket SK passes through the bottom plate of the IC socket SK and the insulating plate of the electric wiring board PB, is formed on the back side of the electric wiring board PB, and is soldered to the printed wiring conductor PL.
[0006]
[Problems to be solved by the invention]
As shown in FIG. 3, the terminal TAN of the IC socket SK is connected to the back side of the electric wiring board PB constituting the test head TSH. Since the inside of the test head TSH is at room temperature, heat is radiated at this portion, and the terminal TAN becomes a temperature lower than the temperature of the thermostat TEP. For this reason, when the IC heated and carried in the thermostat TEP contacts the terminal TAN of the IC socket SK, there arises a disadvantage that the temperature of the IC starts to decrease. In particular, since the time required for testing tends to increase as the size of the IC under test increases, there is a risk that the temperature of the IC will greatly decrease at the end of the test, resulting in inconvenience that the test conditions are not met. is there.
[0007]
Therefore, conventionally, as shown in FIG. 3, the heater HE and the temperature sensor ST are mounted on the socket guide SKG, and the socket guide SKG is controlled so that the temperature of the socket guide SKG is constant by the detection signal of the temperature sensor ST. The structure is such that the temperature of the IC mounted on the IC socket SK is prevented from being lowered by heating the guide SKG.
[0008]
[Problems to be solved by the invention]
The socket guide SKG must be prepared for each IC shape, that is, for each IC shape to be tested for each product type. For this reason, if a structure is provided in which the heater HE and the temperature sensor ST are mounted on the socket guide SKG as in the prior art, each socket guide SKG prepared for each product type is expensive, increasing the economic burden on the user. There are drawbacks.
[0009]
The object of the present invention is to provide a socket guide at a low cost by removing the temperature sensor from the heater guide that must be prepared for each type of IC while maintaining the function of preventing the temperature drop of the IC mounted on the IC socket. The present invention proposes an IC test apparatus having a structure that can be used.
[0010]
[Means for Solving the Problems]
In the present invention, a test head for electrically connecting an IC under test to a test apparatus, an electric wiring board mounted on the top of the test head, and an insulating board having an electric wiring board mounted on the upper surface of the electric wiring board. And an IC socket connected to the electrical wiring formed on the back surface of the electrical wiring board, and a constant temperature bath containing an IC carrying device for carrying the IC in a state in which the IC socket is placed in the opening and applying thermal stress to the IC socket. And a socket guide that surrounds and is mounted on the IC socket and guides the IC conveyance device to the IC socket, a frame formed of a heat conductor on the periphery of the opening of the thermostat A heater and temperature sensor are attached to the frame body, and the temperature of the IC mounted on the IC socket is reduced by thermally coupling the frame body to the socket guide. It proposes a IC test apparatus was structured to stop.
[0011]
According to the configuration of the present invention, the frame attached to the opening of the thermostatic chamber is heated to a constant temperature by the heater, and this heat is transmitted to the socket guide, so that the socket guide is maintained at a temperature close to the temperature of the frame. Therefore, it is possible to obtain a temperature distribution equivalent to mounting a heater on the socket guide. Therefore, although the heater is not attached to the socket guide, it is possible to prevent the temperature of the IC attached to the IC socket from being lowered, and the socket guide can be provided at low cost.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an embodiment of the present invention. Parts corresponding to those in FIG. 3 are denoted by the same reference numerals. In the present invention, a frame 11 made of a material having a high thermal conductivity such as iron or aluminum is attached to the edge of the opening portion WIN of the thermostat TEP. The frame body 11 is fitted into an opening portion formed in a wall member 12 formed of a heat insulating material that constitutes the thermostatic bath TEP, and the inner periphery of the frame body 11 constitutes an opening portion WIN of the thermostatic bath TEP.
[0013]
A heater HE and a temperature sensor ST are attached to the frame body 11, and the frame body 11 is heated to a predetermined temperature.
A socket guide SKG is brought into contact with the frame body 11 through a buffer material 13 made of an elastic body having a high thermal conductivity, and heat is transferred from the frame body 11 to the socket guide SKG. Therefore, the socket guide SKG is heated to a temperature substantially close to the temperature of the frame 11 even though the heater is not attached.
[0014]
【The invention's effect】
As described above, according to the present invention, since the socket heats the id SKG through the frame 11, it is not necessary to mount the heater and the temperature sensor on the socket guide SKG. Therefore, each socket guide that must be prepared for each type of IC can be provided at low cost, and an advantage of reducing the economic burden on the user can be obtained.
[Brief description of the drawings]
FIG. 1 is an enlarged cross-sectional view for explaining a configuration of a main part of an IC test apparatus according to the present invention.
FIG. 2 is a side view for explaining an outline of a preferred IC test apparatus to which the present invention is applied.
FIG. 3 is an enlarged cross-sectional view for explaining a conventional technique.
[Explanation of symbols]
MIN main frame TSH test head HAND handler TEP constant temperature bath WIN opening portion SK IC socket SKG socket guide TAN terminal PB electric wiring board HE heater ST temperature sensor 11 frame 12 wall member

Claims (1)

A test head for electrically connecting the IC under test to the test apparatus, an electric wiring board disposed on the top of the test head, and terminals mounted on the upper surface of the electric wiring board through the insulating plate of the electric wiring board An IC socket connected to the electrical wiring formed on the back surface of the wiring board, and a constant temperature bath having an IC conveying device for placing the IC socket in the opening and carrying the IC in a state where thermal stress is applied to the IC socket. And an IC testing device comprising a socket guide that surrounds and is mounted on the IC socket and guides the IC transport device to the IC socket.
A frame formed of a heat conductor is mounted on the periphery of the opening of the thermostatic chamber, a heater and a temperature sensor are mounted on the frame, and the frame is thermally coupled to the socket guide. An IC test apparatus characterized by having a structure for preventing a temperature drop of an IC mounted on an IC socket.

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