JP3767310B2

JP3767310B2 - Workpiece positioning device, workpiece positioning method, and laser processing apparatus using the workpiece positioning device

Info

Publication number: JP3767310B2
Application number: JP2000063187A
Authority: JP
Inventors: 栄吉林; 建矢崎; 誉森
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2000-03-08
Filing date: 2000-03-08
Publication date: 2006-04-19
Anticipated expiration: 2020-03-08
Also published as: JP2001252842A

Description

【０００１】
【発明の属する技術分野】
基板をレーザ加工機に供給・回収する基板搬送装置において、レーザ加工機に供給する基板の位置決め装置及びこの位置決め装置を用いたレーザ加工装置に関するものである。
【０００２】
【従来の技術】
レーザによる基板加工装置は、例えば特開平１０−３２８８６３に示されているように、ストックされた基板を自動的にレーザ加工装置に搬送し、レーザ加工し、再び基板をストックするような一連の工程の自動化が考えられている。
図９は従来のレーザ加工装置の全体構成図、図１０は図９における位置決めステーションの平面図である。図において、１は後述する基板１３を積載しておく被加工物供給部としての基板積載供給部、２は基板１３をレーザにて加工するレーザ加工機、３はレーザ加工機２において加工された基板１３を回収し積載する被加工物回収部としての基板積載回収部、４は基板積載供給部１から基板１３をレーザ加工機２へ搬送する際に予め基板１３に対して粗い位置決めを行なう被加工物位置決め装置としての位置決めステーション、５ａは基板１３を基板積載供給部１、位置決めステーション４、後述するＸＹテーブル１２へ搬送する基板１３を運搬するローダ、５ｂは後述するＸＹテーブル１２から基板積載回収部３へ基板１３を搬送するアンローダ、６ａは基板積載供給部１に設けられ基板１３を積載する供給台車、６ｂは基板積載回収部３に設けられ基板１３を積載する回収台車、７はローダ５ａ及びアンローダ５ｂの移動の為の走行レール、８はローダ５ａ及びアンローダ５ｂのフレーム９に取り付けられた吸着パッド、１０はフレーム９の上下移動を行なう為のガイド付シリンダー、１１は走行レール７上をローダ５ａ若しくはアンローダ５ｂを駆動させる為の駆動装置、１２はレーザ加工機２に設けられ基板１３を載せてＸＹ方向に対し精度よく位置決めを行なうＸＹテーブル、１３はレーザ加工機２において加工される被加工物としての基板である。
また、１４ａ、１４ｂは位置決めステーション４の基板１３を位置決めを行なうため、ＸＹの直交する２辺を基準に設けられた第１及び第２の基板ストッパー、１５ａ、１５ｂは基板１３を移動させ第１及び第２の基板ストッパー１４ａ、１４ｂに押し当てて位置決めを行なう第１及び第２の位置決めピン、１６ａ、１６ｂは第１及び第２の位置決めピン１５ａ、１５ｂを動作させるための第１及び第２のロッドレスシリンダー、１７ａ、１７ｂは第１及び第２の基板ストッパー１４ａ、１４ｂに設けられ、基板１３の端面を検出する第１及び第２の位置検出センサー、１８は位置決めステーション４のステージである。
また、ΔＸ及びΔＹはＸ軸及びＹ軸方向の第１及び第２の位置決めピン１５ａ、１５ｂの移動量を示している。
【０００３】
次に動作について説明する。
まず、基板積載供給部１の供給台車６ａでは基板１３が積載されている。この供給台車６ａには、リフター機構（図示せず）と基板１３の最上段の高さを検出する検出機構（図示せず）が設けられており、この検出機構の検出結果に基づいてリフター機構により積載された基板１３を上下させ、常に基板１３の最上段の高さが変化しないようになっている。更に、供給台車６ａには積載された基板１３が荷崩れしないように基板１３のサイズに応じて移動可能なガイドバー（図示せず）等が準備されている。その為、供給台車６ａに基板１３が積載されたことにより、予め基板１３の大まかな位置決めが行われている。
【０００４】
次に、ローダ５ａのガイド付シリンダー１０の下降動作により吸着パッド８で供給台車６ａの最上段の基板１３を吸着し、次にガイド付シリンダー１０の上昇動作と走行駆動装置１１の走行レール７に沿った移動動作により吸着した基板１３を位置決めステーション４へ搬送する。
【０００５】
次に、位置決めステーション４において、ローダ５ａのガイド付シリンダー１０の下降動作により基板１３をステージ１８の上に下ろし、吸着パッド８の吸着を開放した後、第１及び第２のロッドレスシリンダー１６ａ、１６ｂの動作により、基板１３の２端面を第１及び第２の位置決めピン１５ａ、１５ｂでＸＹ方向へ押すことにより、第１及び第２の位置検出センサー１７ａ、１７ｂが基板１３の端面を検出するまで動作させ、第１及び第２の基板ストッパー１４ａ、１４ｂに押し当てて位置決めを行なう。
【０００６】
通常、加工される基板１３の寸法は厚さが０．４〜１．６ｍｍで、幅２５０×２５０ｍｍ〜幅５１０×６１０ｍｍ程度であり、また、このような基板１３を加工する為に第１若しくは第２のロッドレスシリンダー１６ａ、１６ｂのストロークは３００〜４００ｍｍ程度の構成となっている。
【０００７】
次に、位置決めステーション４にて予め位置決めが行われた基板１３は、前述の供給台車６ａから位置決めステーション４へ搬送されたと同様な動作で、位置決めステーション４からレーザ加工機２のＸＹテーブル１２上へ搬送され、ＸＹテーブル１２上で下部より吸着あるいは上部よりクランプ（図示せず）等の手段でテーブルに固定されレーザ加工が実施される。
【０００８】
次に、レーザ加工を終了した基板１３は、アンローダ５ｂにより、ＸＹテーブル１２上から基板積載回収部３の回収台車６ｂ上へ搬送移動され、一連の基板搬送動作が完了する。
【０００９】
回収台車６ｂでは供給台車６ａと同様なリフター機構（図示せず）が準備されており、基板１３の積載に応じて最上段の積載された基板１３の高さが変化しないような構成と動作が実施される。
このようにして上記一連の動作が連続して実施される事により自動基板加工及び搬送が実行動作される。
【００１０】
ここで、位置決めステーション４の必要性について説明する。
通常は、基板１３の加工精度を上げる為にＸＹテーブル１２上へ搬送された基板１３は、基板１３に付けられたアライメントマークをビジョンセンサにて読み取り、基板加工プログラムにより位置補正を行なう。
【００１１】
しかし、基板積載供給部１における供給台車６ａ上において基板１３が荷崩れをおこし、そのままレーザ加工機２のＸＹテーブル１２上へ搬送すると、ＸＹテーブル１２上の基板１３の位置に大きなバラツキが生じてしまい、基板加工プログラムによる位置補正では補正ができず、基板１３の加工精度が下がってしまう。
【００１２】
よって、予めＸＹテーブル１２に基板１３を搬送する前に、予め位置決めステーション４において基板加工プログラムによる位置補正ができるくらいの粗い位置決めを行なう必要がある。
【００１３】
【発明が解決しようとする課題】
従来のレーザ加工用基板搬送装置は上記のように構成されているので、長いロッドレスシリンダーを用いるため高価であった。
また、特に小さい基板を加工する場合、第１及び第２の位置決めピン１５ａ、１５ｂの移動量ΔＸ、ΔＹが大きくなり、即ちロッドレスシリンダーの移動時間が長くなる。その為、レーザ加工時間が短時間の場合には、位置決め後の搬送が間に合わなくなり、その為加工時間を含めた装置全体のタクトタイムが長くなり、その結果生産性が悪かった。
【００１４】
また、最近では、レーザ加工の対象となる基板の厚さが薄くなる傾向にあり、例えば厚さ０．０８〜０．２ｍｍ程度の極薄板基板では、位置決め用の駆動装置側の摺動抵抗（静止摩擦力）が基板の座屈応力を上回る為に基板が反ってしまい、位置決めが困難であった。また、この場合において位置決め機構に送りネジやサーボモータ等を採用する方法もあるが、装置自体が高価なものとなる等の問題点があった。更には、基板ストッパーと位置決めピンとで挟み込む力より基板の剛性が低い場合は基板が撓んでしまい、正確な位置決めを行なうことが困難であった。
【００１５】
本発明は、上記従来の技術の問題点に鑑み、その欠点を解消するためになされたもので、安価で、位置決め時間の短い（生産性の高い）、極薄板基板も位置決め可能なレーザ加工用基板搬送装置を提供するにある。
【００１６】
【課題を解決するための手段】
この発明に係る被加工物位置決め装置は、被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるものである。
【００１７】
また、被加工物を載せるステージと、前記被加工物と接触し、当該被加工物を移動させて、当該被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記被加工物の内、前記被加工物位置決め手段と接触する部分以外の部分を開放させた状態で位置決めするものである。
【００１８】
また、前記被加工物位置決め手段は、前記被加工物を所定の位置まで移動させるものである。
【００１９】
また、前記被加工物位置決め手段の前記被加工物への接触を検出する検出手段を備え、前記検出手段による検出結果に応じて前記被加工物移動手段を用いて前記被加工物を前記被加工物位置決め手段に近づける方向に移動させるものである。
【００２０】
また、この発明に係る被加工物位置決め方法は、被加工物の一部が食み出すように前記被加工物をステージに載せるステップと、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の外にある場合には前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させるステップと、前記ステージと被加工物位置決め手段とを相対的に互いに接近する方向に移動させながら、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるステップとを備える。
【００２１】
また、被加工物をステージに載せるステップと、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の外にある場合には前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させるステップと、前記被加工物の位置決めを行なう被加工物位置決め手段と前記被加工物とを接触させて当該被加工物を移動させるステップと、前記被加工物の内、被加工物位置決め手段と接触する部分以外の部分を開放させた状態で前記被加工物位置決め手段によって被加工物の位置決めを行なうステップとを備える。
【００２２】
また、この発明に係る被加工物位置決め装置は、被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう第１の被加工物位置決め手段と、前記被加工物の位置決めを行なう第２の被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記第１の被加工物位置決め手段及び前記第２の被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記第１の被加工物位置決め手段及び前記第２の被加工物位置決め手段とを夫々異なる接点で接触させて前記ステージ上の前記被加工物を移動させるものである。
【００２３】
さらに、この発明に係るレーザ加工装置は、被加工物を供給する被加工物供給部と、前記被加工物供給部から供給された前記被加工物をレーザにて加工するレーザ加工機と、前記レーザ加工機にて加工された前記被加工物を回収する被加工物回収部と、前記被加工物供給部から前記被加工物を前記レーザ加工機へ搬送する際に前記被加工物の位置決めを行なう被加工物位置決め装置とを備えたレーザ加工装置において、前記被加工物位置決め装置は、前記被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるものである。
【００２４】
【発明の実施の形態】
実施の形態１．
本実施の形態において、従来の技術と同一の符号を付した箇所は同一または相当部分を示す。また、基板積載供給部１から基板１３を位置決めステーション４に搬送し、位置決めステーション４において基板１３の粗い位置決めを行なった後、ＸＹテーブル１２へ搬送してレーザ加工を施し、基板積載回収部３に積載する一連の流れは従来の技術と同様であり、位置決めステーション４における基板１３の粗い位置決めに関してのみ説明する。
【００２５】
図１は本実施の形態１におけるレーザ加工装置の位置決めステーションの平面図で基板の位置決めを行なう前の状態を示し、図２は本実施の形態１におけるレーザ加工装置の位置決めステーションの平面図で基板の位置決めを行なった後の状態を示し、図３は図２におけるＩＩ−ＩＩ断面図、図４は図２におけるＩＩＩ−ＩＩＩ断面図である。これらの図において、１３はレーザ加工機２において加工される被加工物としての基板、１７ａ、１７ｂは夫々後述する第１及び第２の基板位置決め板１９ａ、１９ｂに設けられ基板１３の端を検出する検出手段としての第１及び第２の位置検出センサー、１９ａ、１９ｂは夫々後述する第１及び第２のガイド付シリンダー２０ａ、２０ｂのシリンダーロッド先端に取り付けられ基板１３の直交する２辺を基準にＸ軸方向及びＹ軸方向に対して基板１３を夫々移動動作させる被加工物位置決め手段としての第１及び第２の基板位置決め板、２０ａ、２０ｂは後述するステージ１８の裏に取り付けられた第１及び第２のガイド付シリンダー、１８はジュラコン、ウルモラ、テフロン等の樹脂板から構成され、位置決めステーション４に設けられ、ローダ５ａにより一旦基板１３を載せるためのステージ、２１は直交する２辺の交点近傍に設けられ、基板１３の端を挟持し、基板１３を第１及び第２の基板位置決め板１９ａ、１９ｂに近づける方向に移動させる被加工物移動手段としての挟持手段、２２はステージ１８の裏に取付られ、挟持手段２１を直交する２辺に対して略４５°傾いた方向に移動動作させるガイド付シリンダーである。
尚、ステージ１８は上述した樹脂板に限定されるものではなく、金属製等のような他の材質製のものでも構わない。
尚、Ｌｘ及びＬｙはステージ１８上で位置決めを行なう際に夫々第１及び第２の基板位置決め板１９ａ、１９ｂと接触する辺を示している。
【００２６】
次に、図１、図２、図３、図４により動作について説明する。
まず、基板積載供給部１から搬送されてきた基板１３をローダ５ａのガイド付シリンダー１０の下降動作により位置決めステーション４のステージ１８の上に下ろし、吸着パッド８の吸着を開放した後、一旦上昇動作を行いローダ５ａはその位置で待機する。この際、図１に示すように基板１３は基板１３の一部がＸＹ方向共にステージ１８から食み出すようにして載せることとする。
【００２７】
次に、第１及び第２のガイド付シリンダー２０ａ、２０ｂの動作により第１及び第２の基板位置決め板１９ａ、１９ｂは夫々ＸＹ方向からステージ１８上の基板１３を側面から押動しながら移動し、ステージ１８上の基板１３は本来あるべき位置、即ち所定の位置まで移動させられる。つまり、第１及び第２の基板位置決め板１９ａ、１９ｂが移動した後の位置、即ち第１及び第２の基板位置決め板１９ａ、１９ｂの移動端によって基板１３を位置決めを行なっていることであり、この第１及び第２の基板位置決め板１９ａ、１９ｂの移動量、即ち第１及び第２のガイド付シリンダー２０ａ、２０ｂのストローク量は予め設定しておく。
【００２８】
また、被加工物としての基板１３の内、第１及び第２の基板位置決め板１９ａ、１９ｂと接触する部分以外の部分を開放させた状態で位置決めを行なっている。即ち、この基板１３の移動は第１及び第２の基板位置決め板１９ａ、１９ｂのみによって行われるため、位置決め動作の終始にわたり基板１３の各々の辺は第１及び第２の基板位置決め板１９ａ、１９ｂの接触部分以外は全て開放されていることとなる。ここで、開放されているということは、基板１３の各々の辺が第１及び第２の基板位置決め板１９ａ、１９ｂ以外に接触していないことを意味している。よって、本実施の形態においては従来の技術のように被加工物としての基板１３を挟み込むことなく位置決めを行なっている。
【００２９】
ここで、第１及び第２の基板位置決め板１９ａ、１９ｂの位置として、移動前及び移動後の夫々の移動端をＸ０、Ｘ１、Ｙ０、Ｙ１とし、第１及び第２の基板位置決め板１９ａ、１９ｂの移動量（第１及び第２のガイド付シリンダー２０ａ、２０ｂのストローク量）を夫々ΔＸ、ΔＹとすると、ΔＸ＝Ｘ１−Ｘ０、ΔＹ＝Ｙ１−Ｙ０のようになる。即ち、位置決めステーション４へ搬送される基板１３は従来の技術と同様、予め基板積載供給部１の供給台車６ａ上で大まかに位置決めが行われているが、少なくともローダ５ａによって基板１３を位置決めステーション４のステージ１８上に載せる位置は基板１３の２辺端面Ｌｘ、Ｌｙが夫々上述した寸法のΔＸ、ΔＹの間で無ければ位置決めステーション４において基板１３の位置決めが行なえない。
【００３０】
よって、従来の技術の動作で説明したように、供給台車６ａでの基板１３の荷崩れが生じた場合等、予め想定しうる荷崩れ時の基板１３の移動量を十分に吸収し得るよう前述のΔＸ、ΔＹ寸法等の設計仕様緒元を決定する。
【００３１】
次に、第１及び第２の基板位置決め板１９ａ、１９ｂが基板１３を押動しながら移動したかの判断をする為、第１及び第２の基板位置決め板１９ａ、１９ｂに設けられた第１及び第２の位置検出センサ１７ａ、１７ｂによって第１及び第２の基板位置決め板１９ａ、１９ｂの側面に基板１３が接触しているか否かを検出する。その結果、図２に示すように基板１３が第１及び第２の基板位置決め板１９ａ、１９ｂの側面に接触していることが検出された場合には位置決め動作は終了する。
【００３２】
一方、基板１３が第１及び第２の基板位置決め板１９ａ、１９ｂの側面に接触していることが検出されなかった場合は、位置決めが失敗したことを意味する。即ち、何らかの状況で、ローダ５ａが基板１３を位置決めステーション４のステージ１８上に載せる際に、基板１３の２辺端面Ｌｘ、Ｌｙが夫々ΔＸ、ΔＹの寸法の間に入らない場合が生じ、基板１３の位置決めを必要とする２辺端面Ｌｘ、Ｌｙが夫々第１及び第２の基板位置決め板１９ａ、１９ｂに接触しない状態となり、第１及び第２の位置検出センサ１７ａ、１７ｂで基板１３を検出できなかったことを意味する。
【００３３】
この場合は、まず一旦第１及び第２のガイド付シリンダー２０ａ、２０ｂを動作させ、元の位置に戻し、第１及び第２の基板位置決め板１９ａ、１９ｂを基板１３の端から待避させる。
次に、挟持手段２１とガイド付シリンダー２２を動作させ、基板１３の直交する２辺の交点近傍、つまり基板１３の端を挟持手段２１により挟持し、ＸＹの直交する第１及び第２の基板位置決め板１９ａ、１９ｂの２辺に対して略４５°傾いた方向にガイド付シリンダー２２でステージ１８上の基板１３を引張動作させる。即ち、基板１３を第１及び第２の基板位置決め板１９ａ、１９ｂの近づく方向に移動させ基板１３の２辺端面Ｌｘ、Ｌｙが夫々ΔＸ、ΔＹの寸法の間に入るようする。
【００３４】
次に、再び上述したように第１及び第２のガイド付シリンダー２０ａ、２０ｂを動作させ基板１３の位置決め動作を実行する。
このようなリトライ動作は、例えば回数設定による制御方式や第１及び第２の位置検出センサ１７ａ、１７ｂが検出するまで実施するようにする等、適宜設計することが可能である。
【００３５】
次に、ローダ５ａのガイド付シリンダー１０の下降動作により吸着パッド８でステージ１８上の位置決めが完了した基板１３を吸着し、ガイド付シリンダー１０の上昇動作と走行駆動装置１１の走行レール７に沿った移動動作により吸着した基板１３をレーザ加工機２のＸＹテーブル１２上へ搬送する。
【００３６】
これ以降の動作は、従来の技術と同様に、ＸＹテーブル１２上においてローダ５ａのガイド付シリンダー１０の下降動作により基板１３を下ろし、ＸＹテーブル１２上で下部よりの吸着あるいは上部よりクランプ（図示せず）等の手段でテーブルに基板１３が固定されレーザ加工が実施される。
このようにして上記一連の動作が連続して実施される事により自動基板加工及び搬送が実行動作される。
【００３７】
尚、位置決め動作時における第１及び第２のガイド付シリンダー２０ａ、２０ｂの移動動作速度は必要以上に早くすると、基板１３と第１及び第２の基板位置決め板１９ａ、１９ｂとが接触する際に、第１及び第２の基板位置決め板１９ａ、１９ｂが基板１３を飛ばしてしまう可能性がある。更に、第１及び第２のガイド付シリンダー２０ａ、２０ｂの動作停止後に基板１３が慣性で第１及び第２の基板位置決め板１９ａ、１９ｂから離れてしまう可能性がある。
よって、上述した可能性を否定する速度以下で動作させなければならない。尚、５〜１０ｍｍ／ｓｅｃ程度以下が良好な位置決め動作ができる。勿論、基板１３の材質等により適宜変更することは可能である。
【００３８】
また、上述の動作説明において記載のＸ０、Ｘ１、Ｙ０、Ｙ１、ΔＸ、ΔＹ等の具体的な値は詳細設計時の適宜決定事項である。
また、第１及び第２の基板位置決め板１９ａ、１９ｂの移動手段や、挟持手段２１の移動手段はガイド付シリンダー２２に限定されるものでは無く、例えばロッドレスシリンダーの様なものでも構わない。即ち、水平移動可能なものであれば構造は特に問わない。
【００３９】
また、挟持手段２１は詳細な構造に言及していないが、図４に断面図を示すように、基板１３を挟持可能な構造であれば良く、例えばはさみ機構にばねとエアーシリンダーを組み合わせた構成等にて容易に実現できる。
【００４０】
尚、第１及び第２の位置検出センサー１７ａ、１７ｂは詳細な構造に言及していないが、図３に断面図を示したように第１及び第２の基板位置決め板１９ａ、１９ｂと基板１３とが正しく接触している状態を検出できればどのようなものでもよい。但し、本実施の形態のように基板１３の位置決めの妨げにならないように、基板１３に非接触なタイプの光電式の透過型センサー等が有利である。この場合、基板１３の上下動作との干渉回避のため、第１及び第２の位置検出センサ１７ａ、１７ｂの待避機構を設ける必要があるが、小型シリンダーを取り付ける構成等にて容易に実現できる。
【００４１】
また、本実施の形態では基板積載供給部１には供給台車６ａ、基板積載回収部３には回収台車６ｂを有する形式のもので説明をしているが、台車では無くカセットやトレイの形態でも良い。
【００４２】
また、基板積載供給部１、レーザ加工機２、位置決めステーション４、基板積載回収部３を直線的に配列し、１本の走行レール７で基板移載装置のローダ５ａとアンローダ５ｂを支持する構成となっているが、上記構成に限定されるものではない。例えば、レーザ加工機２は、基板１３の保持と移動のためＸＹテーブル１２を有する構成になっているが、固定テーブルで加工ヘッドが移動するタイプでも良く、いずれの構成にしても本実施の形態によるレーザ加工用基板搬送装置と同様な効果を奏することができる。
【００４３】
尚、挟持手段２１を移動させるガイド付シリンダー２２は直交する２辺に対して略４５°に限定されるものではなく、基板１３の形状によって異なるものである。詳しくは、挟持手段２１を移動させる方向は、基板１３の重心の点と挟持手段２１による基板１３を挟持する点とを結ぶ方向である。何故なら、挟持手段２１によって移動させる際にトルクを生じさせないからである。例えば、基板１３が正方形ならば４５°方向が効率的であることは言うまでもない。
【００４４】
このように、本実施の形態では第１及び第２の基板位置決め板１９ａ、１９ｂが基板１３を押動しながら移動し、基板１３の位置決めを行なう為、従来の技術のように第１及び第２の基板ストッパー１４ａ、１４ｂと第1及び第２の位置決めピン１５ａ、１５ｂとで基板を挟まずに位置決めを行なうものなので、厚さが薄い基板でも、例えば厚さが０．０５ｍｍ程度の基板でも撓むことなく容易に位置決めを行なうことができ、加工の精度が向上し、装置の信頼性が向上する。また、基板に限らず薄いもの、例えば紙、セロハンや銅箔等でも加工でき、被加工物の範囲が広がった。また、位置決め機構に送りネジやサーボモータ等を採用していない為にコストを抑えることができる。
【００４５】
また、高価な長いロッドレスシリンダーを用いることなく構成したので、装置のコストを抑えることができる。
また、小さい基板の場合でも位置決めの為の第１及び第２の位置決め板の移動量を少なくしたので、基板の位置決め時間が短縮でき、生産性が向上する。同時に、第１及び第２の位置決め板を移動させるガイド付きシリンダが短いものを採用することができ、コスト削減となる。
また、基板１３が大幅なずれをもってステージ１８上に載せられた場合に、挟持手段２１により基板１３を第１及び第２の基板位置決め板１９ａ、１９ｂの近づく方向に移動させるので、より正確に位置決めを行なうことができる。
【００４６】
実施の形態２．
本実施の形態において、従来の技術と同一の符号を付した箇所は同一または相当部分を示す。また、実施の形態１と同様、位置決めステーション４における基板１３の粗い位置決めに関してのみ説明する。
【００４７】
図５は本実施の形態１におけるレーザ加工装置の位置決めステーションの平面図で基板の位置決めを行なう前の状態を示し、図６はおけるレーザ加工装置の位置決めステーションの平面図で基板の位置決めを行なった後の状態を示し、図７は図６におけるＶＩＩ−ＶＩＩ断面図、図８は図６におけるＶＩＩＩ−ＶＩＩＩ断面図である。図において、１７ａ、１７ｂは後述する第１及び第２の基板止め２５ａ、２５ｂに設けられ、基板１３の端を検出する第１及び第２の位置検出センサー、１８は位置決めステーション４に設けられ、基板１３を位置決め為に、ローダ５ａにより一旦基板１３を載せるためのステージ、２３はステージ１８の裏面に取り付けられたボス、２４は本体が位置決めステーション４に取り付けられ、シリンダーロッド先端がボス２３に連結されたシリンダー、２５ａ、２５ｂは位置決めステーション４に取り付けられ、ＸＹ方向に直交する２辺を基準に基板１３の位置決めを行なう為の被加工物位置決め手段としての第１及び第２の基板止め、２６はステージ１８の裏面に取り付けられたガイドナット、２７は位置決めステーション４に取り付けらたガイドレールである。
【００４８】
尚、ガイドナット２６、ガイドレール２７、シリンダー２４は、図示したように直交する第１及び第２の基板止め２５ａ、２５ｂに対して略４５°傾いた方向に取り付けられている。
尚、ガイドナット２６はガイドレール２７上を水平方向に移動が可能である為、シリンダ２４の動作によりステージ１８が第１及び第２の基板止め２５ａ、２５ｂに対して略４５°方向にで水平方向に移動可能な構成となっている。
尚、吸着パッド８は真空発生装置（図示しない）へ配管がされている。
【００４９】
次に、図５、図６、図７、図８を用いて動作について説明する。
まず、ステージ１８は図５の右上移動端に位置している。即ち、シリンダ２４を伸ばし、ステージ１８を第１及び第２の基板止め２５ａ、２５ｂから遠ざけた位置に待機させる。
次に、ローダ５ａのガイド付シリンダー１０の下降動作により基板１３をステージ１８の上に下ろし、吸着パッド８の吸着を開放した後、一旦上昇動作を行いローダ５ａはその位置で待機する。この際、図５に示すように基板１３は基板１３の一部がＸＹ方向共にステージ１８から食み出すようにして載せることとする。
【００５０】
次に、シリンダー２４の動作により、ステージ１８の上に載せられた基板１３を第１及び第２の基板止め２５ａ、２５ｂの略交点（略４５°）方向へ予め設定された移動量分だけ水平移動動作させる。このステージ１８の水平移動の際、ステージ１８上の基板１３は第１及び第２の基板止め２５ａ、２５ｂに押し当てられることになり、基板１３はステージ１８上をステージ１８の移動方向とは逆の方向に移動することとなる。
【００５１】
ここで、シリンダー２４のストローク量、即ちステージ１８の移動量をΔＸＹ、これに伴うステージ１８のＸ軸方向及びＹ軸方向における移動量をΔＸ及びΔＹとすると、実施の形態１で述べたように、基板１３の２辺端面Ｌｘ、Ｌｙが夫々上述した寸法のΔＸ、ΔＹの間で無ければ位置決めが行なえない。よって、供給台車６ａでの基板１３の荷崩れが生じた場合等、予め想定しうる荷崩れ時の基板１３のＸＹ方向の移動量に対してΔＸ及びΔＹ、即ちステージ１８の移動方向に対してΔＸＹを付加した以上のストローク量を設計仕様緒元として決定すれば良い。
【００５２】
また、実施の形態１と同様にして、被加工物としての基板１３の内、第１及び第２の基板止め２５ａ、２５ｂと接触する部分以外の部分を開放させた状態で位置決めを行なっている。即ち、本実施の形態においては従来の技術のように被加工物としての基板１３を挟み込むことなく位置決めを行なっている。
【００５３】
次に、ステージ１８が水平移動し終えると基板１３の両端面が第１及び第２の基板止め２５ａ、２５ｂに接触しているか否かは第１及び第２の位置検出センサー１７ａ、１７ｂにて検出する。その結果、図６に示すように基板１３が第１及び第２の基板止め２５ａ、２５ｂに接触していることが検出されると位置決めは終了する。
【００５４】
一方、基板１３が第１及び第２の基板止め２５ａ、２５ｂに接触していることが検出されなかった場合は、位置決めが失敗したことを意味する。即ち、何らかの状況で基板１３の位置決めを必要とする２辺端面Ｌｘ、Ｌｙが夫々第１及び第２の基板止め２５ａ、２５ｂに接触しなかった状態であり、第１及び第２の位置検出センサ１７ａ、１７ｂで基板１３を検出できない場合である。
【００５５】
この場合は、まず一旦ローダ５ａにより基板１３を吸着し上昇させてステージ１８上に待避させる。
次に、シリンダー２４の動作により、ステージ１８を位置決め前の待機位置まで戻す。
次に、再びローダ５ａの動作により基板１３をステージ１８上に下ろした後、上述した位置決めと同様な動作を実施させる。
【００５６】
このようなリトライ動作は、例えば回数設定による制御方式や第１及び第２の位置検出センサー１７ａ、１７ｂが検出するまで実施するようにする等、適宜設計することができる。
【００５７】
次に、ローダ５ａのガイド付シリンダー１０の下降動作により吸着パッド８でステージ１８上の位置決めの完了した基板１３を吸着し、ガイド付シリンダー１０の上昇動作と走行駆動装置１１の走行レール７に沿った移動動作により吸着した基板１３をレーザ加工機２のＸＹテーブル１２上へ搬送する。
【００５８】
これ以降の動作は、従来の技術と同様に、ＸＹテーブル１２上においてローダ５ａのガイド付シリンダー１０の下降動作により基板１３を下ろし、ＸＹテーブル１２上で下部よりの吸着あるいは上部よりクランプ（図示せず）等の手段でテーブルに基板１３が固定されレーザ加工が実施される。
このようにして上記一連の動作が連続して実施される事により自動基板加工及び搬送が実行動作される。
【００５９】
尚、位置決め動作時におけるシリンダー２４の移動動作速度を必要以上に早くすると、基板１３は慣性の法則に従いそのままの位置を保持し、ステージ１８と共に移動しない可能性がある。よって、このような可能性を否定する速度以下で動作させなければならない。尚、実施の形態１と同様に、５〜１０ｍｍ／ｓｅｃ程度以下が良好な位置決め動作ができる。勿論、基板１３の材質等により適宜変更は可能である。
【００６０】
尚、上述したようにΔＸＹ寸法等の具体的な値は詳細設計時の適宜決定事項であり、ステージ１８の移動手段はシリンダー２４に限定されるものでは無く、例えばロッドレスシリンダーの様なものでも構わない。即ち、水平移動可能なものであれば構造は特に問わない。
【００６１】
尚、ステージ１８を移動させる方向は直交する２辺に対して略４５°に限定されるものではなく、基板１３の形状によって異なるものである。例えば、基板１３が正方形であるならば対角線方向である４５°がより効率的である。
【００６２】
このように、本実施の形態では基板１３を載せたステージ１８を第１及び第２の基板止め２５ａ、２５ｂの略交点方向へ予め設定された移動量分だけ水平移動させることにより、基板１３を第１及び第２の基板止め２５ａ、２５ｂに押し当て、基板１３の位置決めを行なう為、従来の技術のように第１及び第２の基板ストッパー１４ａ、１４ｂと第１及び第２の位置決めピン１５ａ、１５ｂとで基板を挟まずに位置決めを行なうことができる。その為、厚さが薄い基板でも、例えば厚さが０．０５ｍｍ程度の基板でも撓むことなく容易に位置決めを行なうことができ、加工の精度が向上し、装置の信頼性が向上する。また、基板に限らず薄いもの、例えば紙、セロハンや銅箔等でも加工でき、被加工物の範囲が広がった。また、位置決め機構に送りネジやサーボモータ等を採用していない為にコストを抑えることができる。
【００６３】
また、高価な長いロッドレスシリンダーを用いることなく構成したので、装置のコストを抑えることができる。
また、小さい基板の場合でも位置決めの為の第１及び第２の位置決め板の移動量を少なくしたので、基板の位置決め時間が短縮でき、生産性が向上する。同時に、第１及び第２の位置決め板を移動させるガイド付きシリンダが短いものを採用することができ、コスト削減となる。
また、基板１３を載せたステージ１８を第１及び第２の基板止め２５ａ、２５ｂに対して略４５°の角度でもって近づけ、基板１３を第１及び第２の基板止め２５ａ、２５ｂに対して押し当てて基板１３の位置決めを行なうので、ＸＹ方向の位置決めを同時に行なうことができ、位置決めの時間が短縮できる。
【００６４】
【発明の効果】
この発明に係る被加工物位置決め装置は、被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるので、厚さが薄い基板でも撓むことなく容易に位置決めを行なうことができる。
【００６５】
また、被加工物を載せるステージと、前記被加工物と接触し、当該被加工物を移動させて、当該被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記被加工物の内、前記被加工物位置決め手段と接触する部分以外の部分を開放させた状態で位置決めするので、厚さが薄い基板でも撓むことなく容易に位置決めを行なうことができる。
【００６６】
また、前記被加工物位置決め手段は、前記被加工物を所定の位置まで移動させるので、厚さが薄い基板でも撓むことなく容易に位置決めを行なうことができる。
【００６７】
また、前記被加工物位置決め手段の前記被加工物への接触を検出する検出手段を備え、前記検出手段による検出結果に応じて前記被加工物移動手段を用いて前記被加工物を前記被加工物位置決め手段に近づける方向に移動ので、より正確に位置決めを行なうことができる。
【００６８】
また、この発明に係る被加工物位置決め方法は、被加工物の一部が食み出すように前記被加工物をステージに載せるステップと、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の外にある場合には前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させるステップと、前記ステージと被加工物位置決め手段とを相対的に互いに接近する方向に移動させながら、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるステップとを備えたので、厚さが薄い基板でも撓むことなく容易に位置決めを行なうことができる。
【００６９】
また、被加工物をステージに載せるステップと、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の外にある場合には前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させるステップと、前記被加工物の位置決めを行なう被加工物位置決め手段と前記被加工物とを接触させて当該被加工物を移動させるステップと、前記被加工物の内、被加工物位置決め手段と接触する部分以外の部分を開放させた状態で前記被加工物位置決め手段によって被加工物の位置決めを行なうステップとを備えたので、厚さが薄い基板でも撓むことなく容易に位置決めを行なうことができる。
【００７０】
また、この発明に係る被加工物位置決め装置は、被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう第１の被加工物位置決め手段と、前記被加工物の位置決めを行なう第２の被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記第１の被加工物位置決め手段及び前記第２の被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記第１の被加工物位置決め手段及び前記第２の被加工物位置決め手段とを夫々異なる接点で接触させて前記ステージ上の前記被加工物を移動させるので、ＸＹ方向の位置決めを同時に行なうことができ、位置決めの時間が短縮できる。
【００７１】
さらに、この発明に係るレーザ加工装置は、被加工物を供給する被加工物供給部と、前記被加工物供給部から供給された前記被加工物をレーザにて加工するレーザ加工機と、前記レーザ加工機にて加工された前記被加工物を回収する被加工物回収部と、前記被加工物供給部から前記被加工物を前記レーザ加工機へ搬送する際に前記被加工物の位置決めを行なう被加工物位置決め装置とを備えたレーザ加工装置において、前記被加工物位置決め装置は、前記被加工物の一部が食み出すように前記被加工物を載せるステージと、前記被加工物の位置決めを行なう被加工物位置決め手段と、前記被加工物の端面が前記被加工物位置決め手段の所定の移動寸法の間に入るよう移動させる被加工物移動手段とを備え、前記ステージと前記被加工物位置決め手段とが相対的に互いに接近する方向に動き、前記被加工物の前記ステージから食み出した部分と前記被加工物位置決め手段とを接触させて前記ステージ上の前記被加工物を移動させるので、厚さが薄い基板でも容易にレーザ加工が行なえる。
【図面の簡単な説明】
【図１】本発明の実施の形態１におけるレーザ加工装置の位置決めステーションの平面図（位置決め前）。
【図２】本発明の実施の形態１におけるレーザ加工装置の位置決めステーションの平面図（位置決め後）。
【図３】図２におけるＩＩＩ−ＩＩＩ断面図。
【図４】図２におけるＩＶ−ＩＶ断面図。
【図５】本発明の実施の形態２におけるレーザ加工装置の位置決めステーションの平面図（位置決め前）。
【図６】本発明の実施の形態２におけるレーザ加工装置の位置決めステーションの平面図（位置決め後）。
【図７】図６におけるＶＩＩ−ＶＩＩ断面図。
【図８】図６におけるＶＩＩＩ−ＶＩＩＩ断面図。
【図９】従来のレーザ加工装置における全体図。
【図１０】従来のレーザ加工装置における位置決めステーションを示す図。
【符号の説明】
１基板積載供給部、２レーザ加工機、３基板積載回収部、４位置決めステーション、５ａローダ、５ｂアンローダ、６ａ供給台車、６ｂ回収台車、７走行レール、８吸着パッド、９フレーム、１０ガイド付シリンダー、１１走行駆動装置、１２ＸＹテーブル、１３基板、１４ａ第１の基板ストッパー、１４ｂ第２の基板ストッパー、１５ａ第１の位置決めピン、１５ｂ第２の位置決めピン、１６ａ第１のロッドレスシリンダー、１６ｂ第２のロッドレスシリンダー、１７ａ第１の位置検出センサー、１７ｂ第２の位置検出センサー、１８ステージ、１９ａ第１の基板位置決め板、１９ｂ第２の基板位置決め板、２０ａ第１のガイド付シリンダー、２０ｂ第２のガイド付シリンダー、２１挟持手段、２２ガイド付シリンダー、２３ボス、２４シリンダー、２５ａ第１の基板止め２５ｂ第２の基板止め、２６ガイドナット、２７ガイドレール。[0001]
BACKGROUND OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate positioning apparatus that supplies and recovers a substrate to a laser processing machine, and a laser processing apparatus that uses this positioning apparatus.
[0002]
[Prior art]
A substrate processing apparatus using a laser, for example, as shown in Japanese Patent Laid-Open No. 10-328863, is a series of processes for automatically transporting a stocked substrate to a laser processing apparatus, laser processing, and stocking the substrate again. Automation is considered.
FIG. 9 is an overall configuration diagram of a conventional laser processing apparatus, and FIG. 10 is a plan view of a positioning station in FIG. In the figure, reference numeral 1 denotes a substrate stacking supply unit as a workpiece supply unit on which a substrate 13 to be described later is loaded, 2 is a laser processing machine that processes the substrate 13 with a laser, and 3 is processed by the laser processing machine 2. A substrate loading / recovering unit 4 as a workpiece collecting unit for collecting and loading the substrate 13, 4 is a substrate that performs rough positioning with respect to the substrate 13 in advance when the substrate 13 is transferred from the substrate loading / supplying unit 1 to the laser processing machine 2. Positioning station 5a as a workpiece positioning device, 5a is a loader for transporting the substrate 13 to the substrate stacking supply unit 1, positioning station 4, and XY table 12 to be described later, and 5b is a substrate stacking recovery from the XY table 12 to be described later. An unloader 6 for transporting the substrate 13 to the unit 3, a supply truck 6 a provided in the substrate stacking supply unit 1 for loading the substrate 13, and 6 b installed in the substrate stacking and collecting unit 3. A recovery cart for loading the substrate 13, 7 is a traveling rail for moving the loader 5 a and unloader 5 b, 8 is a suction pad attached to the frame 9 of the loader 5 a and unloader 5 b, and 10 is for moving the frame 9 up and down. A cylinder with a guide 11 for driving the loader 5a or unloader 5b on the traveling rail 7, 12 is provided in the laser processing machine 2 and places the substrate 13 on the XY direction for accurate positioning. A table 13 is a substrate as a workpiece to be processed by the laser processing machine 2.
Further, 14a and 14b position the substrate 13 of the positioning station 4, so that the first and second substrate stoppers provided on the basis of the two orthogonal sides of XY are moved to move the substrate 13 to the first. The first and second positioning pins 16a and 16b are positioned by pressing against the second substrate stoppers 14a and 14b, and the first and second positioning pins 15a and 15b are used to operate the first and second positioning pins 15a and 15b. The rodless cylinders 17a and 17b are provided on the first and second substrate stoppers 14a and 14b, and are first and second position detection sensors for detecting the end face of the substrate 13, and 18 is a stage of the positioning station 4. .
ΔX and ΔY indicate the amounts of movement of the first and second positioning pins 15a and 15b in the X-axis and Y-axis directions.
[0003]
Next, the operation will be described.
First, the substrate 13 is loaded on the supply carriage 6a of the substrate loading / supplying unit 1. The supply carriage 6a is provided with a lifter mechanism (not shown) and a detection mechanism (not shown) for detecting the uppermost height of the substrate 13. The lifter mechanism is based on the detection result of the detection mechanism. Thus, the stacked substrate 13 is moved up and down so that the uppermost height of the substrate 13 does not always change. Further, a guide bar (not shown) that can move according to the size of the substrate 13 is prepared in the supply carriage 6a so that the loaded substrate 13 does not collapse. Therefore, when the substrate 13 is loaded on the supply carriage 6a, the substrate 13 is roughly positioned in advance.
[0004]
Next, the lowermost substrate 13 of the supply carriage 6a is sucked by the suction pad 8 by the lowering operation of the cylinder 10 with the guide of the loader 5a, and then the lifting operation of the cylinder 10 with the guide and the travel rail 7 of the travel drive device 11 are sucked. The substrate 13 adsorbed by the moving operation along is transferred to the positioning station 4.
[0005]
Next, in the positioning station 4, the substrate 13 is lowered onto the stage 18 by the lowering operation of the guided cylinder 10 of the loader 5a to release the suction of the suction pad 8, and then the first and second rodless cylinders 16a, By the operation of 16b, the first and second position detection sensors 17a and 17b detect the end surface of the substrate 13 by pushing the two end surfaces of the substrate 13 in the XY direction with the first and second positioning pins 15a and 15b. Until the first and second substrate stoppers 14a and 14b are pressed against each other.
[0006]
In general, the substrate 13 to be processed has a thickness of 0.4 to 1.6 mm and a width of about 250 × 250 mm to a width of 510 × 610 mm. The strokes of the second rodless cylinders 16a and 16b are about 300 to 400 mm.
[0007]
Next, the substrate 13 which has been previously positioned in the positioning station 4 is moved from the positioning station 4 onto the XY table 12 of the laser processing machine 2 by the same operation as that carried from the supply carriage 6a to the positioning station 4. It is conveyed, and is fixed to the table by means such as suction on the XY table 12 from the lower part or clamping (not shown) from the upper part, and laser processing is performed.
[0008]
Next, the substrate 13 for which laser processing has been completed is transported and moved from the XY table 12 to the collection carriage 6b of the substrate stacking and collecting unit 3 by the unloader 5b, and a series of substrate transport operations is completed.
[0009]
The recovery carriage 6b is provided with a lifter mechanism (not shown) similar to that of the supply carriage 6a, and has a configuration and operation so that the height of the uppermost stacked board 13 does not change according to the loading of the board 13. To be implemented.
In this way, the above-described series of operations are continuously performed, whereby automatic substrate processing and conveyance are performed.
[0010]
Here, the necessity of the positioning station 4 will be described.
Normally, the substrate 13 transferred onto the XY table 12 in order to increase the processing accuracy of the substrate 13 reads an alignment mark attached to the substrate 13 with a vision sensor and corrects the position by a substrate processing program.
[0011]
However, if the substrate 13 collapses on the supply carriage 6a in the substrate stacking supply unit 1 and is transported as it is onto the XY table 12 of the laser processing machine 2, a large variation occurs in the position of the substrate 13 on the XY table 12. Therefore, the position correction by the substrate processing program cannot be performed and the processing accuracy of the substrate 13 is lowered.
[0012]
Therefore, before the substrate 13 is transported to the XY table 12 in advance, it is necessary to perform positioning so that the position can be corrected by the substrate processing program in the positioning station 4 in advance.
[0013]
[Problems to be solved by the invention]
Since the conventional laser processing substrate transfer apparatus is configured as described above, it is expensive because a long rodless cylinder is used.
Further, when processing a particularly small substrate, the movement amounts ΔX and ΔY of the first and second positioning pins 15a and 15b become large, that is, the movement time of the rodless cylinder becomes long. For this reason, when the laser processing time is short, the conveyance after positioning is not in time, so that the takt time of the entire apparatus including the processing time becomes long, resulting in poor productivity.
[0014]
In recent years, the thickness of a substrate to be laser processed tends to be reduced. For example, in the case of an ultra-thin plate substrate having a thickness of about 0.08 to 0.2 mm, the sliding resistance on the driving device side for positioning ( Since the static friction force) exceeds the buckling stress of the substrate, the substrate warps and positioning is difficult. In this case, there is a method of using a feed screw, a servo motor or the like for the positioning mechanism, but there is a problem that the apparatus itself is expensive. Furthermore, when the rigidity of the substrate is lower than the force sandwiched between the substrate stopper and the positioning pin, the substrate is bent and it is difficult to perform accurate positioning.
[0015]
The present invention has been made in view of the above-described problems of the prior art, and has been made to solve the drawbacks. It is inexpensive, has a short positioning time (high productivity), and is capable of positioning an ultra-thin plate substrate. To provide a substrate transfer apparatus.
[0016]
[Means for Solving the Problems]
Workpiece positioning apparatus according to the present invention, A stage on which the workpiece is placed so that a part of the workpiece protrudes, and a workpiece positioning means for positioning the workpiece A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage and the workpiece positioning means move in a direction relatively approaching each other, and a portion of the workpiece protruding from the stage and the workpiece positioning means are brought into contact with each other The workpiece on the stage is moved.
[0017]
Also, A stage on which the workpiece is placed, and a workpiece positioning means that contacts the workpiece and moves the workpiece to position the workpiece. A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; And positioning is performed in a state in which a part other than a part in contact with the workpiece positioning means is opened.
[0018]
Also, The workpiece positioning means moves the workpiece to a predetermined position.
[0019]
Also, Detection means for detecting contact of the workpiece positioning means with the workpiece, and positioning the workpiece using the workpiece movement means according to a detection result by the detection means. It is moved in a direction approaching the means.
[0020]
In addition, the workpiece positioning method according to the present invention includes: Place the work piece on the stage so that part of the work piece protrudes. And if the end surface of the workpiece is outside a predetermined movement dimension of the workpiece positioning means, the end surface of the workpiece enters between the predetermined movement dimensions of the workpiece positioning means. Step to move, and While moving the stage and the workpiece positioning means in a direction relatively close to each other, the portion of the workpiece that protrudes from the stage and the workpiece positioning means are brought into contact with each other on the stage. Of the workpiece Step to move With.
[0021]
Also, Place the workpiece on the stage And if the end surface of the workpiece is outside a predetermined movement dimension of the workpiece positioning means, the end surface of the workpiece enters between the predetermined movement dimensions of the workpiece positioning means. Step to move, and The workpiece positioning means for positioning the workpiece and the workpiece are brought into contact with each other to place the workpiece. Step to move And the workpiece positioning means opens the part other than the part that comes into contact with the workpiece positioning means. Steps for positioning With.
[0022]
In addition, the workpiece positioning device according to the present invention includes: A stage on which the workpiece is placed so that a part of the workpiece is projected, a first workpiece positioning means for positioning the workpiece, and a second for positioning the workpiece. Workpiece positioning means A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage, the first workpiece positioning means, and the second workpiece positioning means move in a direction in which they are relatively close to each other, and protrude from the stage of the workpiece. And the first workpiece positioning means and the second workpiece positioning means are brought into contact with each other at different contacts to move the workpiece on the stage.
[0023]
Furthermore, the laser processing apparatus according to the present invention provides: A workpiece supply unit for supplying a workpiece, a laser processing machine for processing the workpiece supplied from the workpiece supply unit with a laser, and the workpiece processed by the laser processing machine A laser comprising: a workpiece recovery unit that recovers a workpiece; and a workpiece positioning device that positions the workpiece when the workpiece is conveyed from the workpiece supply unit to the laser processing machine. In the processing apparatus, the workpiece positioning device includes a stage on which the workpiece is placed so that a part of the workpiece protrudes, and a workpiece positioning means for positioning the workpiece. A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage and the workpiece positioning means move in a direction relatively approaching each other, and a portion of the workpiece protruding from the stage and the workpiece positioning means are brought into contact with each other The workpiece on the stage is moved.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
In the present embodiment, the portions denoted by the same reference numerals as those in the prior art indicate the same or corresponding portions. Further, the substrate 13 is transported from the substrate stacking supply unit 1 to the positioning station 4, and after the substrate 13 is roughly positioned in the positioning station 4, it is transported to the XY table 12 and subjected to laser processing, so that the substrate stacking recovery unit 3 A series of the flow of loading is the same as in the prior art, and only the rough positioning of the substrate 13 in the positioning station 4 will be described.
[0025]
FIG. 1 is a plan view of the positioning station of the laser processing apparatus according to the first embodiment and shows a state before the substrate is positioned. FIG. 2 is a plan view of the positioning station of the laser processing apparatus according to the first embodiment. FIG. 3 shows the state after the positioning of FIG. II-II FIG. 4 is a cross-sectional view of FIG. III-III It is sectional drawing. In these drawings, reference numeral 13 denotes a substrate as a workpiece to be processed by the laser processing machine 2, and 17a and 17b are provided on first and second substrate positioning plates 19a and 19b, respectively, to detect the end of the substrate 13. The first and second position detection sensors 19a and 19b serving as detecting means are attached to the tips of cylinder rods of first and second guided cylinders 20a and 20b, which will be described later, and are based on two orthogonal sides of the substrate 13. First and second substrate positioning plates 20a and 20b as workpiece positioning means for moving the substrate 13 in the X-axis direction and the Y-axis direction, respectively, are attached to the back of the stage 18 to be described later. The first and second guide cylinders 18 are made of resin plates such as Duracon, Urmora, and Teflon, and are provided in the positioning station 4. A stage 21 for temporarily placing the substrate 13 by the loader 5a is provided in the vicinity of the intersection of two orthogonal sides, sandwiches the end of the substrate 13, and brings the substrate 13 closer to the first and second substrate positioning plates 19a and 19b. A clamping means 22 as a workpiece moving means for moving in a direction is attached to the back of the stage 18 and is a guided cylinder for moving the clamping means 21 in a direction inclined by approximately 45 ° with respect to two orthogonal sides. .
The stage 18 is not limited to the above-described resin plate, but may be made of other materials such as metal.
Note that Lx and Ly indicate sides that come into contact with the first and second substrate positioning plates 19a and 19b when positioning on the stage 18, respectively.
[0026]
Next, the operation will be described with reference to FIG. 1, FIG. 2, FIG. 3, and FIG.
First, the substrate 13 conveyed from the substrate stacking / supplying unit 1 is lowered onto the stage 18 of the positioning station 4 by the lowering operation of the cylinder 10 with a guide of the loader 5a to release the suction of the suction pad 8, and then once lifted. The loader 5a waits at that position. At this time, as shown in FIG. 1, the substrate 13 is placed such that a part of the substrate 13 protrudes from the stage 18 in the XY directions.
[0027]
Next, the first and second substrate positioning plates 19a and 19b are moved while pushing the substrate 13 on the stage 18 from the side surfaces in the XY directions by the operations of the first and second guide cylinders 20a and 20b. The substrate 13 on the stage 18 is moved to the original position, that is, a predetermined position. That is, the substrate 13 is positioned by the position after the first and second substrate positioning plates 19a and 19b are moved, that is, by the moving ends of the first and second substrate positioning plates 19a and 19b. The movement amounts of the first and second substrate positioning plates 19a and 19b, that is, the stroke amounts of the first and second cylinders with guides 20a and 20b are set in advance.
[0028]
In addition, positioning is performed in a state in which a portion other than the portions in contact with the first and second substrate positioning plates 19a and 19b is opened in the substrate 13 as a workpiece. That is, since the movement of the substrate 13 is performed only by the first and second substrate positioning plates 19a and 19b, each side of the substrate 13 remains at the first and second substrate positioning plates 19a and 19b throughout the positioning operation. All the parts other than the contact part are open. Here, being open means that each side of the substrate 13 is not in contact with other than the first and second substrate positioning plates 19a and 19b. Therefore, in the present embodiment, positioning is performed without sandwiching the substrate 13 as a workpiece as in the prior art.
[0029]
Here, as the positions of the first and second substrate positioning plates 19a and 19b, the moving ends before and after the movement are X0, X1, Y0, and Y1, respectively, and the first and second substrate positioning plates 19a, Assuming that the movement amount 19b (the stroke amounts of the first and second cylinders 20a and 20b with guide) is ΔX and ΔY, respectively, ΔX = X1−X0 and ΔY = Y1−Y0. That is, the substrate 13 transported to the positioning station 4 is roughly positioned in advance on the supply carriage 6a of the substrate stacking and supplying unit 1 as in the prior art, but at least the loader 5a causes the substrate 13 to be positioned at the positioning station 4. If the two side end faces Lx and Ly of the substrate 13 are not between ΔX and ΔY of the above-described dimensions, the substrate 13 cannot be positioned in the positioning station 4.
[0030]
Therefore, as described in the operation of the prior art, when the load collapse of the substrate 13 in the supply carriage 6a occurs, the above-described movement amount of the substrate 13 at the time of the load collapse can be sufficiently absorbed. Design specifications such as ΔX and ΔY dimensions are determined.
[0031]
Next, in order to determine whether or not the first and second substrate positioning plates 19a and 19b have moved while pushing the substrate 13, the first and second substrate positioning plates 19a and 19b provided on the first substrate positioning plates 19a and 19b. The second position detection sensors 17a and 17b detect whether or not the substrate 13 is in contact with the side surfaces of the first and second substrate positioning plates 19a and 19b. As a result, as shown in FIG. 2, when it is detected that the substrate 13 is in contact with the side surfaces of the first and second substrate positioning plates 19a and 19b, the positioning operation ends.
[0032]
On the other hand, if it is not detected that the substrate 13 is in contact with the side surfaces of the first and second substrate positioning plates 19a and 19b, it means that the positioning has failed. That is, when the loader 5a places the substrate 13 on the stage 18 of the positioning station 4 under some circumstances, the two side end faces Lx and Ly of the substrate 13 may not fall between the dimensions of ΔX and ΔY, respectively. The two side end faces Lx and Ly that require positioning 13 are not in contact with the first and second substrate positioning plates 19a and 19b, respectively, and the first and second position detection sensors 17a and 17b detect the substrate 13. It means that it was not possible.
[0033]
In this case, first, the first and second guided cylinders 20a and 20b are first operated to of Returning to the position, the first and second substrate positioning plates 19 a and 19 b are retracted from the end of the substrate 13.
Next, the clamping means 21 and the guided cylinder 22 are operated, the vicinity of the intersection of the two orthogonal sides of the substrate 13, that is, the end of the substrate 13 is clamped by the clamping means 21, and the XY orthogonal first and second substrates The substrate 13 on the stage 18 is pulled by the guided cylinder 22 in a direction inclined by approximately 45 ° with respect to the two sides of the positioning plates 19a and 19b. That is, the substrate 13 is moved in the direction in which the first and second substrate positioning plates 19a and 19b approach each other so that the two side end faces Lx and Ly of the substrate 13 are in the dimensions of ΔX and ΔY, respectively.
[0034]
Next, as described above, the first and second guided cylinders 20a and 20b are operated to perform the positioning operation of the substrate 13.
Such a retry operation can be appropriately designed, for example, by performing a control method by setting the number of times or until the first and second position detection sensors 17a and 17b detect.
[0035]
Next, the substrate 13 that has been positioned on the stage 18 is sucked by the suction pad 8 by the lowering operation of the guided cylinder 10 of the loader 5a, and the lifting operation of the guided cylinder 10 and along the traveling rail 7 of the traveling drive device 11 are performed. The substrate 13 sucked by the moving operation is transferred onto the XY table 12 of the laser processing machine 2.
[0036]
In the subsequent operation, as in the prior art, the substrate 13 is lowered by the lowering operation of the cylinder 10 with the guide of the loader 5a on the XY table 12, and the lower portion of the XY table 12 is sucked or clamped from the upper portion (not shown). And the like, and the substrate 13 is fixed to the table by means of the above and the like, and laser processing is performed.
In this way, the above-described series of operations are continuously performed, whereby automatic substrate processing and conveyance are performed.
[0037]
If the moving speed of the first and second guided cylinders 20a and 20b is higher than necessary during the positioning operation, the substrate 13 and the first and second substrate positioning plates 19a and 19b come into contact with each other. There is a possibility that the first and second substrate positioning plates 19a and 19b may skip the substrate 13. Furthermore, there is a possibility that the substrate 13 may be separated from the first and second substrate positioning plates 19a and 19b due to inertia after the operation of the first and second guided cylinders 20a and 20b is stopped.
Therefore, it is necessary to operate at a speed below the possibility described above. In addition, about 5-10 mm / sec or less can perform favorable positioning operation. Of course, it can be appropriately changed depending on the material of the substrate 13 or the like.
[0038]
In addition, specific values such as X0, X1, Y0, Y1, ΔX, and ΔY described in the above description of the operation are items that are appropriately determined during detailed design.
Further, the moving means of the first and second substrate positioning plates 19a, 19b and the moving means of the clamping means 21 are not limited to the guide-equipped cylinder 22, but may be, for example, a rodless cylinder. That is, the structure is not particularly limited as long as it can move horizontally.
[0039]
Further, the clamping means 21 does not refer to a detailed structure, but as shown in a sectional view in FIG. 4, it may be any structure as long as the substrate 13 can be clamped. For example, a structure in which a spring and an air cylinder are combined with a scissor mechanism. Etc. can be easily realized.
[0040]
Although the first and second position detection sensors 17a and 17b do not refer to the detailed structure, the first and second substrate positioning plates 19a and 19b and the substrate 13 are shown in a sectional view in FIG. Any device can be used as long as it can detect a state where the and are in contact with each other. However, a photoelectric transmission type sensor that is not in contact with the substrate 13 is advantageous so as not to hinder the positioning of the substrate 13 as in the present embodiment. In this case, in order to avoid interference with the vertical movement of the substrate 13, it is necessary to provide a retracting mechanism for the first and second position detection sensors 17a and 17b, but this can be easily realized by a configuration in which a small cylinder is attached.
[0041]
In the present embodiment, the substrate loading and supplying unit 1 is described as having a supply cart 6a and the substrate loading and collecting unit 3 has a collecting cart 6b. However, in the form of a cassette or tray instead of the cart. good.
[0042]
In addition, the substrate stacking supply unit 1, the laser processing machine 2, the positioning station 4, and the substrate stacking / collecting unit 3 are linearly arranged, and the loader 5a and the unloader 5b of the substrate transfer device are supported by one traveling rail 7. However, it is not limited to the above configuration. For example, the laser processing machine 2 is configured to have the XY table 12 for holding and moving the substrate 13, but the type in which the processing head is moved by a fixed table may be used. The same effects as those of the laser processing substrate transfer apparatus according to the above can be obtained.
[0043]
The guided cylinder 22 for moving the clamping means 21 is not limited to approximately 45 ° with respect to two orthogonal sides, but varies depending on the shape of the substrate 13. Specifically, the direction in which the holding means 21 is moved is a direction that connects the point of the center of gravity of the substrate 13 and the point at which the holding means 21 holds the substrate 13. This is because no torque is generated when the clamping means 21 is moved. For example, if the substrate 13 is square, it goes without saying that the 45 ° direction is efficient.
[0044]
As described above, in the present embodiment, the first and second substrate positioning plates 19a and 19b move while pushing the substrate 13, and the substrate 13 is positioned. The two substrate stoppers 14a and 14b and the first and second positioning pins 15a and 15b are used for positioning without sandwiching the substrate, so that even a thin substrate, for example, a substrate having a thickness of about 0.05 mm may be used. Positioning can be easily performed without bending, processing accuracy is improved, and reliability of the apparatus is improved. In addition, not only substrates but also thin materials such as paper, cellophane, copper foil, etc. can be processed, and the range of workpieces has been expanded. Further, since no feed screw, servo motor or the like is used for the positioning mechanism, the cost can be reduced.
[0045]
Moreover, since it comprised without using an expensive long rodless cylinder, the cost of an apparatus can be held down.
In addition, since the amount of movement of the first and second positioning plates for positioning is reduced even in the case of a small substrate, the positioning time of the substrate can be shortened and productivity is improved. At the same time, a short guided cylinder for moving the first and second positioning plates can be adopted, which leads to cost reduction.
Further, when the substrate 13 is placed on the stage 18 with a large deviation, the substrate 13 is moved in the direction approaching the first and second substrate positioning plates 19a and 19b by the clamping means 21, so that the positioning can be performed more accurately. Can be performed.
[0046]
Embodiment 2. FIG.
In the present embodiment, the portions denoted by the same reference numerals as those in the prior art indicate the same or corresponding portions. As in the first embodiment, only the rough positioning of the substrate 13 in the positioning station 4 will be described.
[0047]
FIG. 5 is a plan view of the positioning station of the laser processing apparatus according to the first embodiment and shows a state before the substrate is positioned. FIG. 6 is a plan view of the positioning station of the laser processing apparatus in FIG. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 6, and FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. In the figure, 17a and 17b are provided in first and second substrate stoppers 25a and 25b, which will be described later, first and second position detection sensors for detecting the end of the substrate 13, and 18 is provided in the positioning station 4. A stage on which the substrate 13 is temporarily placed by the loader 5a for positioning the substrate 13, 23 is a boss attached to the back surface of the stage 18, 24 is a body attached to the positioning station 4, and the tip of the cylinder rod is connected to the boss 23. The cylinders 25a and 25b attached to the positioning station 4 are first and second substrate stoppers 26 as workpiece positioning means for positioning the substrate 13 with reference to two sides orthogonal to the XY direction. Is a guide nut attached to the back surface of the stage 18, and 27 is attached to the positioning station 4. Is Idoreru.
[0048]
The guide nut 26, the guide rail 27, and the cylinder 24 are attached in a direction inclined by approximately 45 ° with respect to the first and second substrate stoppers 25a and 25b orthogonal to each other as shown in the figure.
Since the guide nut 26 can move in the horizontal direction on the guide rail 27, the stage 18 moves horizontally in the direction of about 45 ° with respect to the first and second substrate stoppers 25a and 25b by the operation of the cylinder 24. It is configured to be movable in the direction.
The suction pad 8 is connected to a vacuum generator (not shown).
[0049]
Next, the operation will be described with reference to FIG. 5, FIG. 6, FIG. 7, and FIG.
First, the stage 18 is located at the upper right moving end in FIG. That is, the cylinder 24 is extended, and the stage 18 is put on standby at a position away from the first and second substrate stoppers 25a and 25b.
Next, the substrate 13 is lowered onto the stage 18 by the lowering operation of the guided cylinder 10 of the loader 5a, the suction of the suction pad 8 is released, and then the lifting operation is once performed and the loader 5a stands by at that position. At this time, as shown in FIG. 5, the substrate 13 is placed so that a part of the substrate 13 protrudes from the stage 18 in the XY directions.
[0050]
Next, by the operation of the cylinder 24, the substrate 13 placed on the stage 18 is leveled by a preset amount of movement in the direction of the approximate intersection (approximately 45 °) of the first and second substrate stoppers 25a and 25b. Move it. During the horizontal movement of the stage 18, the substrate 13 on the stage 18 is pressed against the first and second substrate stoppers 25 a and 25 b, and the substrate 13 is opposite to the moving direction of the stage 18 on the stage 18. Will move in the direction of.
[0051]
As described in the first embodiment, the stroke amount of the cylinder 24, that is, the movement amount of the stage 18 is ΔXY, and the movement amounts of the stage 18 in the X axis direction and the Y axis direction are ΔX and ΔY. If the two side end faces Lx and Ly of the substrate 13 are not between ΔX and ΔY having the above-described dimensions, positioning cannot be performed. Therefore, when the load collapse of the substrate 13 in the supply carriage 6a occurs, ΔX and ΔY with respect to the movement amount of the substrate 13 in the XY direction when the load collapse can be assumed in advance, that is, with respect to the movement direction of the stage 18. What is necessary is just to determine the stroke amount more than adding ΔXY as a design specification specification.
[0052]
Further, in the same manner as in the first embodiment, positioning is performed in a state in which a portion other than the portions contacting the first and second substrate stoppers 25a and 25b is opened in the substrate 13 as a workpiece. . That is, in the present embodiment, positioning is performed without sandwiching the substrate 13 as a workpiece as in the prior art.
[0053]
Next, when the stage 18 finishes moving horizontally, the first and second position detection sensors 17a and 17b determine whether or not both end surfaces of the substrate 13 are in contact with the first and second substrate stoppers 25a and 25b. To detect. As a result, as shown in FIG. 6, when it is detected that the substrate 13 is in contact with the first and second substrate stoppers 25a and 25b, the positioning is completed.
[0054]
On the other hand, if it is not detected that the substrate 13 is in contact with the first and second substrate stops 25a and 25b, it means that positioning has failed. That is, the two side end faces Lx and Ly that require positioning of the substrate 13 in some situation are not in contact with the first and second substrate stops 25a and 25b, respectively, and the first and second position detection sensors. This is a case where the substrate 13 cannot be detected by 17a and 17b.
[0055]
In this case, the substrate 13 is first sucked and lifted by the loader 5a and retracted on the stage 18.
Next, the stage 18 is returned to the standby position before positioning by the operation of the cylinder 24.
Next, after the substrate 13 is lowered onto the stage 18 again by the operation of the loader 5a, the same operation as the positioning described above is performed.
[0056]
Such a retry operation can be appropriately designed, for example, by performing control until the first and second position detection sensors 17a and 17b detect the control method by setting the number of times.
[0057]
Next, the substrate 13 that has been positioned on the stage 18 is sucked by the suction pad 8 by the lowering operation of the guided cylinder 10 of the loader 5a, and the lifting operation of the guided cylinder 10 and along the traveling rail 7 of the traveling drive device 11 are performed. The substrate 13 sucked by the moving operation is transferred onto the XY table 12 of the laser processing machine 2.
[0058]
In the subsequent operation, as in the prior art, the substrate 13 is lowered by the lowering operation of the cylinder 10 with the guide of the loader 5a on the XY table 12, and the lower portion of the XY table 12 is sucked or clamped from the upper portion (not shown). And the like, and the substrate 13 is fixed to the table by means of the above and the like, and laser processing is performed.
In this way, the above-described series of operations are continuously performed, whereby automatic substrate processing and conveyance are performed.
[0059]
Note that if the moving speed of the cylinder 24 during the positioning operation is increased more than necessary, the substrate 13 may maintain its position according to the law of inertia and may not move with the stage 18. Therefore, it must be operated at a speed below the possibility of denying such a possibility. As in the first embodiment, a favorable positioning operation can be performed at about 5 to 10 mm / sec or less. Of course, it can be appropriately changed depending on the material of the substrate 13 or the like.
[0060]
As described above, specific values such as the ΔXY dimension are appropriately determined at the time of detailed design, and the moving means of the stage 18 is not limited to the cylinder 24, and may be a rodless cylinder, for example. I do not care. That is, the structure is not particularly limited as long as it can move horizontally.
[0061]
Note that the direction in which the stage 18 is moved is not limited to approximately 45 ° with respect to two orthogonal sides, but varies depending on the shape of the substrate 13. For example, if the substrate 13 is a square, the diagonal direction of 45 ° is more efficient.
[0062]
Thus, in this embodiment, the stage 13 on which the substrate 13 is placed is horizontally moved by a predetermined amount of movement in the direction substantially intersecting the first and second substrate stoppers 25a and 25b, whereby the substrate 13 is moved. In order to position the substrate 13 by pressing against the first and second substrate stoppers 25a and 25b, the first and second substrate stoppers 14a and 14b and the first and second positioning pins 15a are used as in the prior art. 15b can be positioned without sandwiching the substrate. Therefore, even a thin substrate, for example, a substrate having a thickness of about 0.05 mm, can be positioned easily without being bent, the processing accuracy is improved, and the reliability of the apparatus is improved. In addition, not only substrates but also thin materials such as paper, cellophane, copper foil, etc. can be processed, and the range of workpieces has been expanded. Further, since no feed screw, servo motor or the like is used for the positioning mechanism, the cost can be reduced.
[0063]
Moreover, since it comprised without using an expensive long rodless cylinder, the cost of an apparatus can be held down.
In addition, since the amount of movement of the first and second positioning plates for positioning is reduced even in the case of a small substrate, the positioning time of the substrate can be shortened and productivity is improved. At the same time, a short guided cylinder for moving the first and second positioning plates can be adopted, which leads to cost reduction.
Further, the stage 18 on which the substrate 13 is placed is brought close to the first and second substrate stops 25a and 25b by an angle of about 45 °, and the substrate 13 is brought closer to the first and second substrate stops 25a and 25b. Since the substrate 13 is positioned by pressing, the positioning in the XY directions can be performed simultaneously, and the positioning time can be shortened.
[0064]
【The invention's effect】
Workpiece positioning apparatus according to the present invention, A stage on which the workpiece is placed so that a part of the workpiece protrudes, and a workpiece positioning means for positioning the workpiece A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage and the workpiece positioning means move in a direction relatively approaching each other, and a portion of the workpiece protruding from the stage and the workpiece positioning means are brought into contact with each other Since the workpiece on the stage is moved, positioning can be easily performed without bending even a thin substrate.
[0065]
Also, A stage on which the workpiece is placed, and a workpiece positioning means that contacts the workpiece and moves the workpiece to position the workpiece. A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; And positioning in a state in which a portion other than the portion that contacts the workpiece positioning means is opened in the workpiece, so that positioning can be easily performed without bending even on a thin substrate. it can.
[0066]
Also, Since the workpiece positioning means moves the workpiece to a predetermined position, positioning can be easily performed without bending even a thin substrate.
[0067]
Also, Detection means for detecting contact of the workpiece positioning means with the workpiece, and positioning the workpiece using the workpiece movement means according to a detection result by the detection means. Since it moves in a direction closer to the means, positioning can be performed more accurately.
[0068]
In addition, the workpiece positioning method according to the present invention includes: Place the work piece on the stage so that part of the work piece protrudes. And if the end surface of the workpiece is outside a predetermined movement dimension of the workpiece positioning means, the end surface of the workpiece enters between the predetermined movement dimensions of the workpiece positioning means. Step to move, and While moving the stage and the workpiece positioning means in a direction relatively close to each other, the portion of the workpiece that protrudes from the stage and the workpiece positioning means are brought into contact with each other on the stage. Of the workpiece Step to move Therefore, even a thin substrate can be easily positioned without bending.
[0069]
Also, Place the workpiece on the stage And if the end surface of the workpiece is outside a predetermined movement dimension of the workpiece positioning means, the end surface of the workpiece enters between the predetermined movement dimensions of the workpiece positioning means. Step to move, and The workpiece positioning means for positioning the workpiece and the workpiece are brought into contact with each other to place the workpiece. Step to move And the workpiece positioning means opens the part other than the part that comes into contact with the workpiece positioning means. Steps for positioning Therefore, even a thin substrate can be easily positioned without bending.
[0070]
In addition, the workpiece positioning device according to the present invention includes: A stage on which the workpiece is placed so that a part of the workpiece is projected, a first workpiece positioning means for positioning the workpiece, and a second for positioning the workpiece. Workpiece positioning means A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage, the first workpiece positioning means, and the second workpiece positioning means move in a direction in which they are relatively close to each other, and protrude from the stage of the workpiece. And the first workpiece positioning means and the second workpiece positioning means are brought into contact with different contact points to move the workpiece on the stage, so that positioning in the XY directions is performed simultaneously. The positioning time can be shortened.
[0071]
Furthermore, the laser processing apparatus according to the present invention provides: A workpiece supply unit for supplying a workpiece, a laser processing machine for processing the workpiece supplied from the workpiece supply unit with a laser, and the workpiece processed by the laser processing machine A laser comprising: a workpiece recovery unit that recovers a workpiece; and a workpiece positioning device that positions the workpiece when the workpiece is conveyed from the workpiece supply unit to the laser processing machine. In the processing apparatus, the workpiece positioning device includes a stage on which the workpiece is placed so that a part of the workpiece protrudes, and a workpiece positioning means for positioning the workpiece. A workpiece moving means for moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means; The stage and the workpiece positioning means move in a direction relatively approaching each other, and a portion of the workpiece protruding from the stage and the workpiece positioning means are brought into contact with each other Since the workpiece on the stage is moved, laser processing can be easily performed even on a thin substrate.
[Brief description of the drawings]
FIG. 1 is a plan view (before positioning) of a positioning station of a laser processing apparatus in Embodiment 1 of the present invention.
FIG. 2 is a plan view (after positioning) of a positioning station of the laser processing apparatus according to Embodiment 1 of the present invention.
3 is a cross-sectional view taken along line III-III in FIG.
4 is a cross-sectional view taken along the line IV-IV in FIG.
FIG. 5 is a plan view (before positioning) of a positioning station of a laser processing apparatus in Embodiment 2 of the present invention.
FIG. 6 is a plan view (after positioning) of a positioning station of a laser processing apparatus in Embodiment 2 of the present invention.
7 is a sectional view taken along line VII-VII in FIG.
8 is a cross-sectional view taken along line VIII-VIII in FIG.
FIG. 9 is an overall view of a conventional laser processing apparatus.
FIG. 10 is a view showing a positioning station in a conventional laser processing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate loading supply part, 2 Laser processing machine, 3 Board | substrate loading collection | recovery part, 4 Positioning station, 5a Loader, 5b Unloader, 6a Supply cart, 6b Collection cart, 7 Travel rail, 8 Suction pad, 9 Frame, 10 Guide cylinder , 11 travel drive device, 12 XY table, 13 substrate, 14a first substrate stopper, 14b second substrate stopper, 15a first positioning pin, 15b second positioning pin, 16a first rodless cylinder, 16b Second rodless cylinder, 17a first position detection sensor, 17b second position detection sensor, 18 stage, 19a first substrate positioning plate, 19b second substrate positioning plate, 20a first guided cylinder, 20b Cylinder with second guide, 21 Clamping means, 22 Cylinder with guide , 23 bosses, 24 cylinders, 25a stop the first substrate stopper 25b second substrate, 26 guide the nut, 27 guide rail.

Claims

A stage on which the workpiece is placed so that a part of the workpiece protrudes; workpiece positioning means for positioning the workpiece; and an end surface of the workpiece of the workpiece positioning means. A workpiece moving means for moving the workpiece so as to fall within a predetermined movement dimension, the stage and the workpiece positioning means move in a direction relatively close to each other, and the workpiece moves from the stage. An apparatus for positioning a workpiece, wherein the protruding portion and the workpiece positioning means are brought into contact with each other to move the workpiece on the stage.

A stage on which the workpiece is placed, a workpiece positioning means for positioning the workpiece by moving the workpiece in contact with the workpiece, and an end surface of the workpiece being the workpiece A workpiece moving means for moving the workpiece positioning means so as to fall within a predetermined movement dimension, and in a state where a portion other than a portion in contact with the workpiece positioning means is opened in the workpiece. A workpiece positioning device for positioning.

The workpiece positioning device according to claim 2, wherein the workpiece positioning means moves the workpiece to a predetermined position.

Detection means for detecting contact of the workpiece positioning means with the workpiece, and positioning the workpiece using the workpiece movement means according to a detection result by the detection means. 3. The workpiece positioning device according to claim 1 , wherein the workpiece positioning device is moved in a direction approaching the means.

Placing the work piece on the stage so that a part of the work piece protrudes; and if the end surface of the work piece is outside a predetermined movement dimension of the work piece positioning means, Moving the end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means, and moving the stage and the workpiece positioning means in a direction relatively approaching each other, A workpiece positioning method comprising: bringing a portion of a workpiece protruding from the stage into contact with the workpiece positioning means and moving the workpiece on the stage.

A step of placing the workpiece on a stage; and when the end surface of the workpiece is outside a predetermined movement dimension of the workpiece positioning means, the end surface of the workpiece is a predetermined position of the workpiece positioning means. Moving the workpiece so as to fall between the moving dimensions of the workpiece, bringing the workpiece into contact with the workpiece positioning means for positioning the workpiece, and moving the workpiece; the method of workpiece positioning, characterized in that a step for positioning the workpiece by said workpiece positioning means in a state of being opened except a portion contacting the workpiece positioning means .

A stage on which the workpiece is placed so that a part of the workpiece is projected, a first workpiece positioning means for positioning the workpiece, and a second for positioning the workpiece. A workpiece positioning means; and a workpiece moving means for moving an end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means , the stage and the first workpiece. The workpiece positioning means and the second workpiece positioning means move in a direction relatively approaching each other, and the portion of the workpiece protruding from the stage, the first workpiece positioning means, and the A workpiece positioning apparatus for moving the workpiece on the stage by bringing the second workpiece positioning means into contact with different contact points.

A workpiece supply unit for supplying a workpiece, a laser processing machine for processing the workpiece supplied from the workpiece supply unit with a laser, and the workpiece processed by the laser processing machine A laser comprising: a workpiece recovery unit that recovers a workpiece; and a workpiece positioning device that positions the workpiece when the workpiece is conveyed from the workpiece supply unit to the laser processing machine. In the processing apparatus, the workpiece positioning device includes a stage on which the workpiece is placed so that a part of the workpiece protrudes, a workpiece positioning means for positioning the workpiece , A workpiece moving means for moving an end surface of the workpiece so as to fall within a predetermined movement dimension of the workpiece positioning means, and the stage and the workpiece positioning means are relatively close to each other. Move in direction A laser machining apparatus characterized by moving said workpiece on said said stage from protruded portion and is brought into contact with said workpiece locating means stage of the workpiece.