JP3729047B2 - 発光ダイオード - Google Patents

発光ダイオード Download PDF

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Publication number
JP3729047B2
JP3729047B2 JP2000267852A JP2000267852A JP3729047B2 JP 3729047 B2 JP3729047 B2 JP 3729047B2 JP 2000267852 A JP2000267852 A JP 2000267852A JP 2000267852 A JP2000267852 A JP 2000267852A JP 3729047 B2 JP3729047 B2 JP 3729047B2
Authority
JP
Japan
Prior art keywords
light
emitting diode
light emitting
semiconductor
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000267852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001119075A (ja
JP2001119075A5 (enExample
Inventor
義則 清水
元量 山田
顕正 阪野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP35025496A external-priority patent/JPH10190066A/ja
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2000267852A priority Critical patent/JP3729047B2/ja
Publication of JP2001119075A publication Critical patent/JP2001119075A/ja
Publication of JP2001119075A5 publication Critical patent/JP2001119075A5/ja
Application granted granted Critical
Publication of JP3729047B2 publication Critical patent/JP3729047B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2000267852A 1996-12-27 2000-09-04 発光ダイオード Expired - Fee Related JP3729047B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000267852A JP3729047B2 (ja) 1996-12-27 2000-09-04 発光ダイオード

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35025496A JPH10190066A (ja) 1996-12-27 1996-12-27 発光ダイオード及びそれを用いたｌｅｄ表示装置
JP2000267852A JP3729047B2 (ja) 1996-12-27 2000-09-04 発光ダイオード

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP35025496A Division JPH10190066A (ja) 1996-12-27 1996-12-27 発光ダイオード及びそれを用いたｌｅｄ表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005150211A Division JP2005244259A (ja) 2005-05-23 2005-05-23 発光ダイオード

Publications (3)

Publication Number Publication Date
JP2001119075A JP2001119075A (ja) 2001-04-27
JP2001119075A5 JP2001119075A5 (enExample) 2004-12-16
JP3729047B2 true JP3729047B2 (ja) 2005-12-21

Family

ID=18754695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000267852A Expired - Fee Related JP3729047B2 (ja) 1996-12-27 2000-09-04 発光ダイオード

Country Status (1)

Country Link
JP (1) JP3729047B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101078A (ja) * 2001-09-25 2003-04-04 Toyoda Gosei Co Ltd 発光装置
EP1675437A4 (en) * 2003-10-01 2008-08-06 Idemitsu Kosan Co PAINT-SHAPING LAYER AND LIGHT-EMITTING COMPONENT
JP2005244259A (ja) * 2005-05-23 2005-09-08 Nichia Chem Ind Ltd 発光ダイオード
JP5068472B2 (ja) * 2006-04-12 2012-11-07 昭和電工株式会社 発光装置の製造方法
EP3444231A4 (en) 2016-04-15 2019-11-13 Koito Manufacturing Co., Ltd. NANO COMPOSITE AND NANOCOMPOSITE PRODUCTION METHOD

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE364160B (enExample) * 1969-05-26 1974-02-11 Western Electric Co
JPS5043913A (enExample) * 1973-08-20 1975-04-21
JPS5079379U (enExample) * 1973-11-24 1975-07-09
JPS5950455U (ja) * 1982-09-24 1984-04-03 三洋電機株式会社 発光ダイオ−ド装置
NL8502025A (nl) * 1985-07-15 1987-02-02 Philips Nv Lagedrukkwikdampontladingslamp.
JP2666228B2 (ja) * 1991-10-30 1997-10-22 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
JPH05152609A (ja) * 1991-11-25 1993-06-18 Nichia Chem Ind Ltd 発光ダイオード
JPH0669546A (ja) * 1992-08-21 1994-03-11 Asahi Chem Ind Co Ltd 発光ダイオード
ES2127243T3 (es) * 1992-09-23 1999-04-16 Koninkl Philips Electronics Nv Lampara de descarga en mercurio a baja presion.
JPH0799345A (ja) * 1993-09-28 1995-04-11 Nichia Chem Ind Ltd 発光ダイオード
JP3116727B2 (ja) * 1994-06-17 2000-12-11 日亜化学工業株式会社 面状光源
JP3494765B2 (ja) * 1994-08-01 2004-02-09 東京エレクトロン株式会社 洗浄処理装置およびその制御方法
JP3326545B2 (ja) * 1994-09-30 2002-09-24 ローム株式会社 半導体発光素子

Also Published As

Publication number Publication date
JP2001119075A (ja) 2001-04-27

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