JP3725257B2 - Mounting component cooling structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure for mounted components mounted on a control board or the like built in an electronic device.
2. Description of the Related Art In recent years, with the increase in functionality of electronic devices, high-density mounting of control boards used and higher integration of mounted semiconductor devices and the like have been advanced. As the number of pins increases due to high integration of semiconductor devices, the terminal strength decreases and the amount of heat generation tends to increase. When the amount of generated heat increases, a heat sink (a heat radiator such as a cooling fan or a cooling cold plate) is required for cooling, and it is directly attached to a mounted component. Therefore, there is a demand for a structure that performs effective cooling while relaxing the load on the mounted component.
[0002]
[Prior art]
FIG. 9 shows a configuration diagram of a conventional cooling structure. 9A is a side view of the main part, and FIG. 9B is a plan view of the main part. In the cooling structure 11 shown in FIGS. 9A and 9B, the semiconductor element 13 is mounted on the printed circuit board 12 by soldering the input / output terminals 13a, and the heat sink 14 is heated on the semiconductor element 13. It is positioned with the conductive member 15 interposed.
[0003]
The heat sink 14 is a water-cooled cold plate, and a flow path 14a is formed therein, and a refrigerant is supplied from the piping ports 14b ₁ and 14b ₂ and circulated. The high thermal conductive member 15 is for efficiently transferring the heat of the semiconductor element 13 to the heat sink 14, and is fixed as an adhesive or sandwiched as a thermal compound or a thermal sheet, and the heat sink 14 is mechanically connected by a spring or the like. And pressurizing and fixing to.
[0004]
[Problems to be solved by the invention]
However, as described above, the heat sink 14 has a structure in which only the semiconductor element 13 is loaded, and the heat sink 14 is large due to an increase in the amount of heat generated by the semiconductor element 13 being increased in speed, function, and MCM (multichip module). As a result, the weight increases and the bonding strength increases, and the strength of the terminal decreases with an increase in the number of pins, which makes it impossible to cope with an increase in load caused by the bonding, and cooling cannot be performed efficiently.
[0005]
Further, when the heat sink 14 is bonded and fixed on the semiconductor element 13 with an adhesive, the package material of the semiconductor element 13 (many of which has a low thermal expansion coefficient such as ceramic) and the material of the heat sink 14 (thermal conductivity of copper, aluminum, etc.) The need to absorb the difference in thermal expansion (temperature increase during use since bonding) is limited by the heat sink structure such as subdividing the bonding surface on the heat sink side. In addition, since the heat sink 14 cannot be enlarged due to workability when repairing or replacing the semiconductor element 13, the cooling performance is limited, or it is necessary to heat the heat sink 14 at the time of melting and removing. There is a problem that the mounting components are deteriorated by the increase.
[0006]
Accordingly, the present invention has been made in view of the above-mentioned problems, and it is possible to improve the cooling performance by strengthening the bonding with the heat sink while relaxing the load on the mounting component, and also for the mounting component that facilitates element replacement and the like. An object is to provide a cooling structure.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problem, in claim 1, in a cooling structure for a mounting component provided with a cooling means for cooling a predetermined number of elements mounted on a substrate, the cooling means is attached to the elements. A first pressing unit that presses and fixes the substrate in the vertical direction on the substrate side, and a second pressing unit that presses and fixes the cooling unit in a horizontal direction against the element , and The second pressing means is characterized in that a projection formed on any one of the fixed members planted on the substrate presses the element in the horizontal direction. is there.
[0008]
According to a second aspect of the present invention, in the mounting component cooling structure according to the first aspect, the first pressing means presses the element in the vertical direction by an elastic member fixed to the fixing member.
[0009]
According to a third aspect of the present invention, in the mounting component cooling structure according to the second aspect, the first pressing means is provided with an adjusting means for adjusting a pressing force applied to the element by the elastic member.
According to a fourth aspect of the present invention, in the mounting component cooling structure according to the first aspect, the fixing member is implanted in the substrate via a reinforcing member that reinforces the substrate with respect to the mounting of the fixing member.
[0010]
According to a fifth aspect of the present invention, in the mounting component cooling structure according to the first aspect, the cooling means is provided with an element separating member for removing the element to be contacted.
According to a sixth aspect of the present invention, in the cooling structure for a mounted component according to the first or fifth aspect, the cooling means is formed with a predetermined number of grooves on the contact surface with the element.
[0011]
The mounting component cooling structure according to claim 1, wherein the second pressing unit presses the horizontal direction against at least a plurality of adjacent cooling units corresponding to the plurality of elements. Do it. As described above, in the first aspect of the invention, the cooling means provided in the element mounted on the substrate is pressed in the vertical direction on the element side by the first pressing means, and pressed in the horizontal direction by the second pressing means. And fix. As a result, the external force applied to the cooling means is received by the first and second pressing means, the load on the mounting component is reduced, and the bonding between the mounting component and the cooling means is strengthened to improve the cooling performance. It becomes possible to plan.
[0012]
In the first, fourth, or seventh aspect of the invention, the second pressing means includes a fixing member that is appropriately implanted in the substrate via a reinforcing member, and a cooling means corresponding to the formed protrusion or an appropriate adjacent cooling means. Press against any one of them. As a result, it is possible to easily and reliably fix the cooling means in the horizontal direction, and the influence of external force can be mitigated to improve the cooling performance.
[0013]
In the invention of claim 2 or 3 , the first pressing means attaches the elastic member to the fixed member so that the pressing force can be adjusted appropriately by the adjusting means, and presses the cooling means in the vertical direction. As a result, it is possible to easily and reliably fix the cooling means in the vertical direction while relaxing the load on the mounted component, and the influence of external force is mitigated, and the cooling performance can be improved.
[0014]
In the invention of claim 5 or 6 , the element separating means is provided in the cooling means to remove the element, and a predetermined number of grooves are appropriately formed on the element contact surface. As a result, when a heat conducting member is interposed between the element and the cooling means, an extra heat conducting member is wrapped in the groove to make the thermal resistance uniform and improve the cooling performance. It becomes possible to remove the cooling means in close contact with the heat conducting member without applying unnecessary force to the mounted component.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a configuration diagram of an embodiment of the present invention. FIG. 1A is a side view of a mounting component cooling structure 21 according to the present invention, and FIG. 1B is a main part partial side view of FIG. 1A and 1B, a semiconductor element 23 is mounted on a printed circuit board 22 as an example of a mounted component by soldering an input / output terminal 23a.
[0016]
Further, fixing pins 24 _{1 to} 24 ₄ (24 ₃ and 24 ₄ are not shown, refer to FIG. 2) as fixing members are provided on the printed circuit board 22 around the semiconductor element 23 and corresponding to the four corners. Fixed and planted. Further, as shown in FIGS. 1A and 1B, the corresponding leaf springs 25 ₁ and 25 ₂ are screwed to the fixing pins 24 ₁ and 24 _{2. The} leaf springs 25 ₁ and 25 ₂ Are bent and formed as protrusions. The fixing pins 24 _{1 to} 24 ₄ and the leaf springs 25 ₁ and 25 ₂ constitute second pressing means.
[0017]
On the other hand, a heat sink 27 as a cooling means is disposed in close contact with the semiconductor element 23 via a high thermal conductive member 26 such as a thermal compound. The heat sink 27 is urged in a direction facing each other by the leaf springs 25 _{1 to} 25 ₄ of the fixing pins 24 _{1 to} 24 ₄ , and is pressed against the semiconductor element 23 in the horizontal direction and fixed. The heat sink 27 is a water-cooled cold plate as described above, and has a flow path communicating with the inside through the pipes 27a and 27b. The refrigerant is supplied from the pipes 27a and 27b and is circulated through the flow path. Thus, the semiconductor element 23 is cooled.
[0018]
Further, the upper end of the fixed pin 24 _{1-24 4,} the mounting portion 28a ₁ ～28A ₄ of the elastic member 28 is a first pressing means is attached by a screw. This elastic member 28 is provided with extending portions 28a _{1 to} 28a ₄ (28a ₃ and 28a ₄ are not shown in the figure) that are bent from the four corners of the pressing portion 28b. Press in the vertical direction on the semiconductor element 23 side.
[0019]
Here, FIG. 2 shows an explanatory diagram of a state of pressing the heat sink of FIG. FIG. 2A shows the pressing state of the heat sink 27 by the fixing pins 24 _{1 to} 24 ₄ , and the heat sink 27 has four cut-out surfaces 27 _{1 to} 27 ₄ on the plane, while the fixing pins 24 ₃ , An abutting surface is formed in which 24 ₄ abuts against the notched surfaces 27 _{1 to} 27 ₄ . Then, the notch surfaces 27 ₁ and 27 ₂ of the heat sink 27 are pressed in the direction of the arrow by the leaf springs 25 ₁ and 25 ₂ of the fixing pins 24 ₁ and 24 ₂ , so that the notch surfaces 27 ₃ and 27 ₄ are fixed to the fixing pins 24 ₃ and 27 ₂ . Press against 24 ₄ contact surface.
[0020]
As a result, the horizontal external force (gravity, vibration / impact load, reaction force from the piping, etc.) of the semiconductor element 23 applied to the heat sink 27 is mainly received by the fixing pins 24 _{1 to} 24 ₄ . The input / output terminal 23a can be mechanically protected, and the reliability of terminal connection can be improved. Further, since the necessary strength of the semiconductor element 23 to the input / output terminal 23a can be reduced, the terminal can be further finely densified.
[0021]
Further, as shown in FIG. 2 (B), the first elastic member 28 is attached portion 28a ₁ ~28a ₄ to Ryakudan Sajo from four corners of the plate-like pressing portion 28b constituting the pressing means integrally extending is, the tip of the mounting portion 28a ₁ ~28a ₄ are fixed respectively by screws 29 _{1-29 4} on the upper end of the fixing pin 24 _{1-24 4.} Note that the attachment portions 28a _{1 to} 28a ₄ are extended so as not to interfere with the pipes 27a and 27b of the heat sink 27.
[0022]
The elastic member 28 is fixed to the fixing pins 24 _{1 to} 24 ₄ by pressing the heat sink 27 in the vertical direction on the semiconductor element 23 side, and the external force is applied in the direction in which the heat sink 27 is separated from the semiconductor element 23. Even if is operated, the vertical pressure state is maintained.
[0023]
As a result, the heat sink 27 can be brought into good contact with the semiconductor element 23 via the high thermal conductive member 26, and stable cooling performance can be realized. Further, since it is not necessary to bond and fix the heat sink 27 to the semiconductor element 23, there is no structural restriction on the heat sink 27, and the weight limitation is relaxed in combination with pressing by the fixing pins 24 _{1 to} 24 ₄ . High performance and large size can be easily achieved, and even if the size is large, the semiconductor device 23 can be easily removed and repaired and replaced, thereby facilitating and shortening the time.
[0024]
Further, since the vertical pressing of the heat sink 27 to the semiconductor element 23 is fixed to the upper ends of the fixing pins 24 _{1 to} 24 ₄ , there is no need to attach it to the printed circuit board 22, and there is no wiring prohibited area around the semiconductor element 23. As a result, the number of signal layers on the substrate can be reduced and the cost can be reduced.
[0025]
Next, FIG. 3 shows an explanatory view of another fixing method of the fixing pin of FIG. 3A is a side view of the main part, FIG. 3B is a bottom view of the main part, and FIG. 3C is a partial perspective view. 1 shows the case where the fixing pins 24 _{1 to} 24 ₄ of FIG. 1 are directly attached to the printed circuit board 22, but FIGS. 3A to 3C show the fixing pins 24 _{1 to} 24 ₄ of the printed circuit board 22. It is attached to a frame-shaped reinforcing member 31 attached to the back surface with screws 30 ₁ to 30 ₄ .
[0026]
That is, through holes 22 _{1 to} 22 ₄ are formed in the printed circuit board 22 at portions corresponding to the fixing pins 24 _{1 to} 24 ₄ , and threaded portions 24 a are formed below the through holes 22 _{1 to} 22 _4. The fixing pins 24 _{1 to} 24 ₄ are penetrated. On the other hand, steps 31a for aligning the orientations of the fixing pins 24 _{1 to} 24 ₄ are formed at the four corners of the frame-shaped reinforcing member 31, and attachment holes 31b are formed at the respective steps 31a.
[0027]
Therefore, the fixing pins 24 _{1 to} 24 ₄ penetrating the through holes 22 _{1 to} 22 ₄ of the printed circuit board 22 are further aligned at the step 31a of the reinforcing member 31, and the threaded portion 24a passes through the through hole 31b. Then, the fixing pins 24 _{1 to} 24 ₄ are fixed by nuts 32 _{1 to} 32 ₄ from the back surface of the reinforcing member 31.
[0028]
As a result, the reinforcing member 31 has a structure that directly receives a lateral (horizontal) force acting on the side surfaces of the fixing pins 24 _{1 to} 24 ₄ when the heat sink 27 is mounted. The warpage deformation of the substrate 22 is prevented, and the reliability of the connection portion of the input / output terminal 23a of the semiconductor element 23 can be improved.
[0029]
Next, FIG. 4 shows an explanatory diagram of another structural example of the heat sink of FIG. The heat sink 27 shown in FIG. 1 shows a case of a water-cooled cold plate, and FIGS. 4A and 4B show the heat sinks 41 and 42 of air-cooled fins. A heat sink 41 shown in FIG. 4A is formed by integrally forming a predetermined number of fins 41b on an abutting portion 41a that abuts on the semiconductor element 23, and the fixing pins 24 _{1 to} 24 ₄ (partially) at four corners. are those notch 41c ₁ ~41c ₄ for abutting the leaf spring 25 _1, 25 ₂₎ is formed.
[0030]
Further, the heat sink 42 shown in FIG. 4B is formed by integrally forming a predetermined number of fins 42 on an abutting portion 42 a that abuts on the semiconductor element 23, and the fixing pins 24 _{1 to} 24 ₄ are provided at the four corners. Through holes 42c _{1 to} 42c ₄ are formed for penetration. In the state where the fixing pin 24 _{1-24 4} is through the through-hole 42c ₁ ～42C _4, the leaf spring 25 ₁ in the through hole 42c _1, 42c within _2, 25 ₂ are pressed against the horizontal direction, through-hole The other fixing pins 24 ₃ and 24 ₄ are pressed and fixed in 42c ₃ and 42c ₄ . Further, a fixing pin itself shown in FIG. 6 to be described later may be bent to form a protruding portion, and may be pressed and fixed by a pressing action of the protruding portion.
[0031]
The air-cooled heat sinks 41 and 42 are integrally formed of a high heat conductive metal such as aluminum.
Next, FIGS. 5 and 6 are explanatory views of another pressing method of FIG. 5 (A) and 6 (A) are side views of the main part, and FIGS. 5 (B) and 6 (B) are plan views of the main part of the pressing portion of the heat sink. FIG. 6C shows a configuration diagram of another elastic member.
[0032]
5A and 5B, notches 271a (272a to 274a) are formed at the four corners of the heat sink 27 (similar to the heat sink 41), and the outer periphery of the four corners of the semiconductor element 23 mounted on the printed board 22 is shown. The fixed pin 51 ₁ (51 _{2 to} 51 ₄ ) that is implanted is integrally formed with a middle thick pressing portion 51a as a protrusion at a position corresponding to the notch 271a (272a to 274a). Bolt portions 51b and 51c are formed at the upper and lower ends of the fixing pin 51 ₁ (51 _{2 to} 51 ₄ ), and a flange 51d positioned on the printed circuit board 22 is formed.
[0033]
On the other hand, through holes 22 ₁ (22 _{2 to} 22 ₄ ) are formed in the printed circuit board 22 at positions where fixing pins 51 ₁ (51 _{2 to} 51 ₄ ) are implanted, and fixed to the frame-shaped reinforcing member 31. A threaded portion 31a that is screwed into the bolt portion 51c of the pin 51 ₁ (51 _{2 to} 51 ₄ ) is formed. That is, the fixing pin 51 ₁ (51 _{2 to} 51 ₄ ) is fixed by being screwed and fixed to the threaded portion 31a of the reinforcing member 31 through the through hole 22 ₁ (22 _{2 to} 22 ₄ ) of the printed circuit board 22. The part 51a contacts the notch part 271a (272a to 274a) of the heat sink 27 and presses it in the horizontal direction.
[0034]
Further, the mounting hole 28a ₁ (28a _{2 to} 28a ₄ ) of the elastic member 28 is fitted into the bolt 51b above the fixing pin 51 ₁ (51 _{2 to} 51 ₄ ) to adjust the pressing force. The pressure adjusting screw 52 ₁ (52 _{2 to} 52 ₄ ) adjusts the pressing force in the vertical direction on the semiconductor element 23 side against the heat sink 27 by the elastic member 28.
[0035]
That is, the pressing in the horizontal direction to the heat sink 27 is performed by the elastic displacement of the fixing pins 51 ₁ (51 _{2 to} 51 ₄ ), and the pressing in the vertical direction to the heat sink is performed by the pressure adjusting screw 52 ₁ ( 52 _{2 to} 52 ₄ ).
As a result, the structure of the fixing pins 51 ₁ (51 _{2 to} 51 ₄ ) is simplified and the cost can be reduced. Further, since the fixing pins 51 ₁ (51 _{2 to} 51 ₄ ) are fixed to the reinforcing member 31, the fixing means on the printed circuit board 22 is reduced, thereby reducing the wiring prohibition area of the semiconductor element peripheral board. The number of signal layers can be reduced and the cost can be reduced.
[0036]
6A to 6C, through holes 271b (272b to 274b) are formed at four corners of the heat sink 27 (similar to the heat sink 42 of FIG. 4B). Fixing pins 53 ₁ (53 _{2 to} 53 ₄ ) planted on the outer periphery of the four corners of the mounted semiconductor element 23 are bent-shaped presses as projections at positions corresponding to the insides of the through holes 271b (272b to 274b). The part 53a is integrally formed. Further, a bolt portion 53b is formed at the upper end of the fixing pin 53 ₁ (53 _{2 to} 53 ₄ ), and a flange 53c that contacts the upper surface of the printed circuit board 22 is formed below.
[0037]
On the other hand, through holes 22 ₁ (22 _{2 to} 22 ₄ ) are formed in the printed board 22 at positions where the fixing pins 53 ₁ (53 _{2 to} 53 ₄ ) are implanted. That is, the fixing pin 53 ₁ (53 _{2 to} 53 ₄ ) passes through the through hole 22 ₁ (22 _{2 to} 22 ₄ ) for contacting the flange 53c on the printed circuit board 22, and is fixed by brazing on the front surface and the back surface. In this case, the pressing portion 53a comes into contact with the inside of the through hole 271b (272b to 274b) of the heat sink 27 and presses it in the horizontal direction.
[0038]
Further, the bolt portion 53b of the fixing pin 53 ₁ (53 ₂ to 53 ₄₎ is fitted with an elastic member 54 ₁ (54 ₂ to 54 ₄₎ of the center hole 52a of the first pressing means, and adjusting means The pressing force adjusting screw 52 ₁ (52 _{2 to} 52 ₄ ) adjusts the vertical pressing force on the semiconductor element side to the heat sink 27 by the elastic member 54 ₁ (54 _{2 to} 54 ₄ ).
[0039]
Here, the elastic member 54 ₁ (54 _{2 to} 54 ₄ ) is formed in a planar cross shape as shown in FIG. 6C, and a hole 54a is formed in the center, and each of the elastic members 54 ₁ (54 _{2 to} 54 ₄ ) is bent in the cross direction. The pressing portions 54b _{1 to} 54b ₄ are integrally formed.
That is, the horizontal direction pressing to the heat sink 27 is performed by the elastic force of the fixing pins 53 ₁ (53 _{2 to} 53 ₄ ) being bent by the pressing portion 53a, and the vertical pressing to the heat sink 27 is performed by the elastic member 54. ₁ (54 _{2 to} 54 ₄ ) is appropriately adjusted by a pressure adjusting screw 52 ₁ (52 _{2 to} 52 ₄ ). Thereby, the structure of the fixing pin 53 ₁ (53 _{2 to} 53 ₄ ) is simplified, and the cost can be reduced.
[0040]
Next, FIG. 7 shows an explanatory view of relevant parts in another embodiment of the present invention. FIG. 7A shows a cross-sectional view of the heat sink 27, in which a threaded portion 27d is formed on the side opposite to the contact surface with the semiconductor element 23, and, for example, four through holes 27e ₁ to 27e ₄ is formed. A lattice-shaped groove 27f is formed on the contact surface with the semiconductor element 23 as shown in the bottom view of FIG. In addition, 27c is a refrigerant | coolant flow path connected to piping.
[0041]
On the other hand, a pin pushing member 61 as an element separating member is prepared. The substantially at the center of the pin pushing member 61 through hole 61a is formed, a pin 61 _{1-61 4} a periphery of the through-hole 61a corresponding to the through-holes 27e ₁ ~27e ₄ of the heat sink 27 is implanted. A pin pressing screw 62 passes through the through hole 61a and is screwed into the threaded portion 27d of the heat sink 27.
[0042]
Therefore, when the heat sink 27 is brought into close contact with the semiconductor element 23 with a high heat conductive member 26 such as a thermal compound interposed, the excessive high heat conductive member 26 is driven out into the groove 27f, and is thin and uniform in thickness with a small pressure. The heat conductive layer is formed. That is, even when the contact area between the upper surface of the semiconductor element 23 and the heat sink 27 is wide, a good contact state with a uniform and low thermal resistance can be easily realized over the entire surface, and the cooling performance can be improved. It will be improved.
[0043]
The repair of the semiconductor device 23, when separating the heat sink 27 by replacement, pins 61 _{1-61 4} pin push member 61 is inserted into the through hole 27e ₁ ~27e ₂ of the heat sink 27, the pin pushes the pin screw 62 When the through hole 61 a of the push member 61 is passed through and screwed into the threaded portion 27 d of the heat sink 27 and screwed, the heat sink 27 is drawn toward the pin push member 61 and separated from the semiconductor element 23.
[0044]
Accordingly, the heat sink 27 can be reliably and easily separated without applying unnecessary force to the input / output terminal 23a of the semiconductor element 23, and the reliability of the semiconductor element 23 can be improved.
Next, FIG. 8 shows an explanatory diagram of an application example of the heat sink to a plurality of elements of the present invention. FIG. 8 shows a case where the heat sinks 27 _{A to} 27 _D shown in FIGS. 1 and 2 are provided in, for example, four semiconductor elements 23 mounted on the printed circuit board 22 in a 2 × 2 arrangement. The square cylindrical fixing pin 71 _{1-71 9} are arranged corresponding to the four corners of the heat sinks 27 _A ~ 27 _D.
[0045]
In this case, each one of the leaf spring 25 is attached to the fixing pin 71 _2, 71 _3, 71 _8, 71 _9, each two plate springs 25 is attached to the fixed pin 71 _5, 71 _6. Then, the heat sink 27 _A is pressed is pressed against the fixing pin _712, the fixing pin 71 in the plate spring 25 of the 71 _{5 1,} 71 ₄ in the horizontal direction, the heat sink 27 _B each plate of the fixing pin 71 _3, 71 ₆ The spring 25 is pressed against the fixing pins 71 ₂ and 71 ₅ and pressed in the horizontal direction. The heat sink 27 _C is pushed in the horizontal direction is pressed against the fixed pin 71 _4, 71 ₇ in the plate spring 25 of the fixing pin 71 _5, 71 _8, the heat sink 27 _D each plate of the fixing pin 71 _6, 71 ₉ is pressed horizontally pressed against the fixed pin 71 _5, 71 ₈ by a spring 25.
[0046]
That is, the fixing pin 71 _2, 71 _4, 71 _5, 71 _6, 71 ₈ performs a pressing horizontally is shared by a plurality of adjacent heat sinks 27 _A ~ 27 _D. Thereby, the number of fixed pins implanted in the printed circuit board 22 can be reduced, and the mounting / wiring area of the printed circuit board 22 can be expanded and the cost can be reduced.
[0047]
【The invention's effect】
As described above, according to the first aspect of the present invention, the cooling means provided in the element mounted on the substrate is pressed in the vertical direction on the element side by the first pressing means, and horizontally in the horizontal direction by the second pressing means. By pressing and fixing, the external force applied to the cooling means is received by the first and second pressing means, the load on the mounting component is reduced, and the bonding between the mounting component and the cooling means is strengthened. Thus, the cooling performance can be improved.
[0048]
According to the first, fourth, or seventh aspect of the present invention, the second pressing means is a cooling means corresponding to the protrusion formed by fixing the fixing member to the substrate via the reinforcing member as appropriate, or appropriately adjacent cooling. By pressing against any one of the means, the cooling means can be easily and reliably fixed in the horizontal direction, and the influence of external force can be mitigated to improve the cooling performance.
[0049]
According to the second or third aspect of the invention, the first pressing means attaches the elastic member to the fixed member so that the pressing force can be adjusted appropriately by the adjusting means, and presses the cooling means in the vertical direction so that the cooling means is mounted. It is possible to easily and surely fix in the vertical direction while relaxing the load on the surface, and the influence of external force is mitigated, and the cooling performance can be improved.
[0050]
According to the invention of claim 5 or 6 , the element separating means is provided in the cooling means, the element is removed, and a predetermined number of grooves are appropriately formed in the element contact surface, whereby a heat conducting member is provided between the element and the cooling means. When the heat transfer member is interposed, an extra heat conducting member is put in the groove to make the thermal resistance uniform and improve the cooling performance. This can be done without applying unnecessary force to the mounted components.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an embodiment of the present invention.
FIG. 2 is an explanatory diagram of a state of pressing against the heat sink of FIG.
FIG. 3 is an explanatory diagram of another fixing method of the fixing pin of FIG. 1;
4 is an explanatory diagram of another structural example of the heat sink of FIG. 1; FIG.
5 is an explanatory diagram (1) of another pressing method of FIG. 1. FIG.
6 is an explanatory diagram (2) of another pressing method of FIG. 1. FIG.
FIG. 7 is an explanatory diagram of a main part in another embodiment of the present invention.
FIG. 8 is an explanatory diagram of an application example of a heat sink for a plurality of elements of the present invention.
FIG. 9 is a configuration diagram of a conventional cooling structure.
[Explanation of symbols]
21 cooling structure 22 printed circuit board 23 semiconductor element 23a output terminals 24 _{1-24 4} 51 _{1-51 4} 53 _{1-53 4} 71 _{1-71 9} fixed pins 25 _1, 25 ₂ plate spring 26 high thermal conductivity member 27 , 41, 42 heat sink 28, 54 ₁ to 54 ₄ elastic member 31 reinforcing member 52 _{1-52 4} pressure adjusting screw 61 pin press member 62 pin set screw

Claims (7)

In the mounting component cooling structure provided with cooling means for cooling a predetermined number of elements mounted on the substrate,
First pressing means for pressing and fixing the cooling means in the vertical direction on the substrate side with respect to the element;
Second cooling means for pressing and fixing the cooling means in a horizontal direction with respect to the element ;
The second pressing means is formed by a protrusion formed on any one of the fixed members planted on the substrate pressing the element in the horizontal direction. Parts cooling structure. In the cooling structure of the mounting component according to claim 1,
The mounting component cooling structure according to claim 1, wherein the first pressing means presses the element in a vertical direction by an elastic member fixed to the fixing member . In the cooling structure of the mounting component according to claim 2,
The mounting part cooling structure according to claim 1, wherein the first pressing unit includes an adjusting unit that adjusts a pressing force of the elastic member against the element . In the cooling structure of the mounting component according to claim 1,
The mounting member cooling structure according to claim 1, wherein the fixing member is implanted in the substrate via a reinforcing member that reinforces the substrate with respect to the mounting of the fixing member . In the cooling structure of the mounting component according to claim 1,
A cooling structure for a mounting component, wherein the cooling means is provided with an element separating member for removing the element to be contacted . In the cooling structure of the mounting component according to claim 1 or 5,
A cooling structure for a mounting component, wherein the cooling means is formed with a predetermined number of grooves on a contact surface with the element . In the cooling structure of the mounting component according to claim 1 or 2,
The cooling structure for a mounting component, wherein the second pressing means presses in the horizontal direction against at least a plurality of adjacent cooling means corresponding to each of the plurality of elements .

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