JP3714255B2

JP3714255B2 - Coil parts manufacturing method

Info

Publication number: JP3714255B2
Application number: JP2002004109A
Authority: JP
Inventors: 美智央大庭; 昭彦井端
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2002-01-11
Filing date: 2002-01-11
Publication date: 2005-11-09
Anticipated expiration: 2022-01-11
Also published as: JP2003209022A

Description

【０００１】
【発明の属する技術分野】
本発明は各種電子機器等に用いるコイル部品の製造方法に関するものである。
【０００２】
【従来の技術】
以下、従来のコイル部品について図面を参照しながら説明する。
【０００３】
図６（ａ）〜（ｄ）は従来のコイル部品の製造工程図である。
【０００４】
図６（ａ）〜（ｄ）において、従来のコイル部品は、セラミック素体２１と、このセラミック素体２１上に空隙部２２を有する絶縁層２３を形成し、この空隙部２２に配置されるようにセラミック素体２１上に導体層２４を形成している。この絶縁層２３は一般的に用いるフォトレジスト法によりセラミック素体２１上に形成している。
【０００５】
また、空隙部２２は螺旋状としており、この空隙部２２に導体層２４を配置して導体層２４を螺旋状導体からなるコイル部２５としている。さらに、コイル部２５は電極部２６と電気的接続し、外装部２７で被覆している。
【０００６】
【発明が解決しようとする課題】
上記従来の構成では、フォトレジスト法によって、絶縁層２３をセラミック素体２１上に形成するので、一般的には、絶縁層２３の厚さを厚くすることができない。すなわち、空隙部２２に配置する導体層２４もこの絶縁層２３と同程度の厚さしか形成することができず、導体層２４から形成される螺旋状導体からなるコイル部２５の厚さも厚くできない。よって、螺旋状導体からなるコイル部２５に大電流を通電すると、短絡や抵抗損失が生じる等信頼性が低下するという問題点を有していた。
【０００７】
本発明は上記問題点を解決し、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上したコイル部品の製造方法を提供することを目的としている。
【０００８】
【課題を解決するための手段】
上記目的を達成するために本発明の以下の方法を有する。
【０００９】
本発明の請求項１に記載の発明は、特に、絶縁層形成工程は、絶縁材料からなる充填物を充填し絶縁層の形状に対する位置に配置した凹部を有する基板を素体に重ねて前記凹部に充填した充填物を素体に転写して螺旋状の空隙部を有する前記絶縁層を前記素体上に形成する工程とした方法である。
【００１０】
上記方法により、絶縁層は凹版印刷法により凹部に充填した絶縁材料からなる充填物を素体に転写して設けているので、素体に対して絶縁層を厚く形成することができる。これにより、螺旋状の空隙部に配置する導体層も厚く形成できるので、この導体層により形成される螺旋状導体からなるコイル部の厚さも厚くできる。この結果、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００１１】
本発明の請求項２に記載の発明は、請求項１に記載の発明において、特に、絶縁層形成工程は、絶縁材料からなる充填物を充填し絶縁層形状に対応する位置に配置した凹部を有する基板を素体に重ね、前記基板の凹部間が空隙部になるように基板の表面を素体に接触させつつ凹部に充填した充填物を素体に転写して螺旋状の空隙部を有する絶縁層を素体上に形成する工程とした方法である。上記方法により、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上できるだけでなく、基板の表面を素体に接触させつつ、凹部に充填した充填物を素体に転写するので素体と基板との位置調整が容易になる。
【００１２】
本発明の請求項３に記載の発明は、請求項１に記載の発明において、特に、導体層形成工程では、空隙部に導体層が配置されるように素体上に導体層を形成するとともに、絶縁層上にも前記導体層を形成する工程を設け、前記導体層形成工程後絶縁層の上面まで導体層を研磨する研磨工程を設けた方法である。上記方法により、外装部とコイル部との接合性を向上できる。
【００１３】
本発明の請求項４に記載の発明は、請求項３に記載に発明において、特に、導体層形成工程は、無電解メッキ工程により空隙部に導体層が配置されるように素体上に導体層を形成するとともに、絶縁層上にも前記導体層を形成する工程とした方法である。上記方法により、導体層により形成される螺旋状導体からなるコイル部の厚さを厚くでき、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００１４】
本発明の請求項５に記載の発明は、請求項１に記載の発明において、特に、絶縁層形成工程前に導体からなる導体下地層を素体上に形成する工程を設け、絶縁層形成工程は、絶縁材料からなる充填物を充填し絶縁層の形状に対応する位置に配置した凹部を有する基板を導体下地層に重ねて凹部に充填した充填物を導体下地層に転写して螺旋状の空隙部を有する絶縁層を導体下地層に形成する工程とし、導体層形成工程は、前記空隙部に導体層が配置されるように導体下地層上に導体層を形成する工程とし、前記導体下地層を加熱処理して絶縁化する絶縁化工程を設けた方法である。上記方法により、導体層により形成される螺旋状導体からなるコイル部の厚さを厚くでき、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００１５】
特に、空隙部に設ける導体層は電解メッキを施して設けることができる。これにより、導体層から形成される螺旋状導体からなるコイル部は、均一で精度を向上でき、短絡や抵抗損失を低減することができる。
【００１６】
本発明の請求項６に記載の発明は、請求項５に記載の発明において、特に、導体層形成工程は、電解メッキ工程により空隙部に導体層が配置されるように導体下地層上に導体層を形成する工程とした方法である。上記方法により、空隙部に設ける導体層は、電解メッキを施して設けているので、導体層から形成される螺旋状導体からなるコイル部は均一で精度を向上でき、短絡や抵抗損失を低減し、信頼性を向上することができる。
【００１７】
本発明の請求項７に記載の発明は、請求項１に記載の発明において、特に、絶縁層形成工程は、絶縁材料からなる充填物を充填し絶縁層の形状に対応する位置に配置した凹部を有する基板を導体下地層に重ねて基板の凹部が空隙部になるように基板の表面を素体に接触させつつ凹部に充填した充填物を導体下地層に転写して螺旋状の空隙部を有する絶縁層を前記導体下地層に形成する工程とし、導体層形成工程とは、前記空隙部に導体層が配置されるように導体下地層上に導体層を形成する工程とし、前記導体下地層を加熱処理して絶縁化する絶縁化工程を設けた方法である。上記方法により、導体層により形成される螺旋状導体からなるコイル部の厚さを厚くでき、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００１８】
特に、空隙部に設ける導体層は、電解メッキを施して設けることができる。これにより、導体層から形成される螺旋状導体からなるコイル部は均一で精度を向上でき、短絡や抵抗損失を低減することができる。また、基板の表面を素体に接触させつつ凹部に充填した充填物を素体に転写するので、素体と基板との位置調整も容易である。
【００１９】
本発明の請求項８に記載の発明は、請求項７に記載の発明において、特に、導体層形成工程では、空隙部に導体層が配置されるように導体下地層上に導体層を形成するとともに、絶縁層上にも前記導体層を形成する工程を設け、前記導体層形成工程後絶縁層の上面まで前記導体層を研磨する研磨工程を設けた方法である。上記方法により、外装部とコイル部との接合性を向上できる。
【００２０】
本発明の請求項９に記載の発明は、請求項８に記載の発明において、特に、導体層形成工程は、無電解メッキ工程により空隙部に導体層が配置されるように素体上に導体層を形成するとともに、絶縁層上にも前記導体層を形成する工程とした方法である。上記方法により、絶縁層の空隙部には導体層の非形成部分が生じにくく、導体層を的確に配置して短絡や抵抗損失を低減できる。特に、絶縁層上の導体層上の導体層も研磨によって、容易に削除してコイル部として機能させることができる。
【００２１】
本発明の請求項１０に記載の発明は、請求項１に記載の発明において、特に、絶縁材料として有機物材料を用いる方法である。上記方法により、素体の表面に螺旋状導体を有する優れたコイル部品を得ることができる。
【００２２】
本発明の請求項１１に記載の発明は、請求項１に記載の発明において、特に、絶縁材料として無機物材料を用いる方法である。上記方法により、素体の表面に螺旋状導体を有する優れたコイル部品を得ることができる。
【００２３】
本発明の請求項１２に記載の発明は、請求項１に記載の発明において、特に、無機物材料として磁性材料を用いる方法である。上記方法により、素体の表面に螺旋状導体を有する優れたコイル部品を得ることができる。特に、螺旋状導体の周りに磁性材料が配置されることになるので、インダクタンスを大きくすることができる。
【００２４】
【発明の実施の形態】
以下、実施の形態を用いて本発明の全請求項に記載の発明において図面を参照しながら説明する。
【００２５】
図１は本発明の一実施の形態におけるコイル部品の断面図、図２は同コイル部品の斜視図、図３（ａ）〜（ｅ）は同コイル部品の製造工程図である。
【００２６】
図１，図２において、本発明の一実施の形態におけるコイル部品は、素体１と、この素体１上に形成した下地層２と、この下地層２上に形成し、螺旋状の空隙部３を有する絶縁層４と、この空隙部３に配置されるように素体１上に形成した導体層５とを備えている。
【００２７】
特に、導体層５はＡｇ系金属からなるＡｇ系金属層とし、絶縁層４と素体１との間および導体層５と素体１との間に介在する下地層２は、素体１側を第１層９とするとともに導体層５側を第２層１０とした２層からなり、導体を絶縁化した導体絶縁化層であって、第１層９はＮｉ系金属を絶縁化した絶縁化Ｎｉ系金属層とするとともに、第２層１０はＣｕ系金属を絶縁化した絶縁化Ｃｕ系金属層としている。
【００２８】
また、絶縁層４は凹版印刷法により絶縁材料からなる充填物を凹部に充填した基板を下地層２を介して素体１に重ねて基板の凹部間が螺旋状の空隙部３になるように凹部に充填した充填物を素体１に転写して設けており、導体層５は螺旋状導体からなるコイル部６として空隙部３に電解メッキを施して設けている。
【００２９】
さらに、コイル部６は電極部７と接続するとともに、外装材からなる外装部８で被覆している。
【００３０】
そして、素体１および外装材はフェライト磁性材料からなる磁性体としている。
【００３１】
このコイル部品の製造方法は、図３（ａ）〜（ｅ）において、次の通りである。
【００３２】
第１に、導体からなる下地層２を素体１上に形成する（下地層形成工程）（図３（ａ））。
【００３３】
また、下地層形成工程では、素体１側を第１層９とするとともに導体層５側を第２層１０とした２層からなり、第１層９はＮｉ系金属とする（第１層９はＣｕ系金属としてもよい）とともに、第２層１０はＣｕ系金属層としている。第１層９、第２層１０ともに電解メッキにより形成している。
【００３４】
第２に、螺旋状の空隙部３を有する絶縁層４を下地層２上に形成する（絶縁層形成工程）（図３（ｂ））。この絶縁層形成工程では、絶縁材料からなる充填物を充填し、絶縁層４の形状に対応する位置に配置した凹部を有する基板を素体１に重ね、基板の凹部間が空隙部３になるように、基板の表面を素体１に接触させつつ、凹部に充填した充填物を素体１に転写して螺旋状の空隙部３を有する絶縁層４を素体１上に形成する工程としている。このとき、絶縁材料はフェライト磁性材料からなる磁性体としている。
【００３５】
第３に、空隙部３に導体層５が配置されるように下地層２上に導体層５を形成する（導体層形成工程）（図３（ｃ））。導体層５はＡｇ系金属からなるＡｇ系金属層とし、下地層２上に電解メッキにより形成している。
【００３６】
第４に、この導体層５に螺旋状導体からなるコイル部６を形成する（コイル部形成工程）（図３（ｃ））。導体層５は螺旋状の空隙部３に配置するので、必然的に螺旋状導体からなるコイル部６として形成される。
【００３７】
第５に、コイル部６と電気的に接続するように電極部７を形成する（電極部形成工程）（図３（ｄ））。
【００３８】
第６に、下地層２を加熱処理して絶縁化する（絶縁化工程）。これにより、下地層２は導体を絶縁化した導体絶縁化層となり、第１層９はＮｉ系金属を絶縁化した絶縁化Ｎｉ系金属層になる（第１層９をＣｕ系金属とした場合は、絶縁化Ｃｕ系金属層になる）とともに、第２層１０はＣｕ系金属を絶縁化した絶縁化Ｃｕ系金属層となる。
【００３９】
第７に、コイル部６を外装材からなる外装部８で被覆する（被覆工程）（図３（ｅ））。この外装材はフェライト磁性材料からなる磁性体としている。
【００４０】
上記構成のコイル部品について、以下その動作を説明する。
【００４１】
上記構成により、絶縁層４は凹版印刷法により凹部に充填した絶縁材料からなる充填物を素体１に転写して設けているので、素体１に対して絶縁層４を厚く形成することができる。これにより、螺旋状の空隙部３に配置する導体層５も厚く形成できるので、この導体層５により形成される螺旋状導体からなるコイル部６の厚さも厚くできる。この結果、コイル部６に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００４２】
また、空隙部３に設ける導体層５は、電解メッキを施して設けているので、導体層５から形成される螺旋状導体からなるコイル部６は均一で精度を向上でき、短絡や抵抗損失を低減することができる。
【００４３】
特に、導体層５はＡｇ系金属からなるＡｇ系金属層とし、下地層２は素体１側を第１層９とするとともに導体層５側を第２層１０として、第１層９はＮｉ系金属を絶縁化した絶縁化Ｎｉ系金属層とするとともに、第２層１０はＣｕ系金属を絶縁化した絶縁化Ｃｕ系金属層としているので、下地層２を介して素体１と導体層５との付着性を向上できるとともに、下地層２および導体層５の整合性を向上できる。
【００４４】
さらに、素体１、絶縁材料、外装材はフェライト磁性材料からなる磁性体としているので、素体１の表面に螺旋状導体を有する優れたコイル部品を得ることができる。螺旋状導体の周りには磁性材料が配置されることになるので、インダクタンスを大きくすることもできる。
【００４５】
このように本発明の一実施の形態によれば、均一で精度を向上したコイル部６を形成でき、コイル部６に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。また、下地層２を介して素体１と導体層５との付着性を向上できるとともに、下地層２および導体層５の整合性を向上できる。さらに、螺旋状導体の周りには磁性材料が配置されることになるので、インダクタンスを大きくすることもできる。
【００４６】
なお、本発明の実施の形態では、素体１は平板状のものを用いて、外周面の１つの面に対してコイル部６を形成したが、図４，図５に示すように柱状の素体１を用い、柱状の素体１の側面および外周面に下地層２を設けるとともに、この下地層２上に導体層５を設け、外周面に対応する導体層５に螺旋状導体からなるコイル部６を形成してもよい。図４に示す素体１は、中央部が細くなった形状であり、図５に示す素体１は、直方体形状のものである。
【００４７】
また、本発明の実施の形態では、絶縁層４および導体層５には、外装部８と接触する接触面に研磨面を設けていないが、研磨面を設ければ外装部８とコイル部６との接合性を向上できる。
【００４８】
この場合、導体層形成工程では、空隙部３に導体層５が配置されるように下地層２上に導体層５を形成するとともに、絶縁層４上にも導体層５を形成する工程を設け、導体層形成工程後絶縁層４の上面まで導体層５を研磨する研磨工程を設ける必要がある。そして、導体層形成工程は、無電解メッキ工程により空隙部３に導体層５が配置されるように素体１上に導体層５を形成するとともに、絶縁層４上にも導体層５を形成する工程とすればよい。特に、研磨面に対して再度同様な工程を施すことにより多層のコイル部品を得ることもできる。
【００４９】
さらに、素体１および外装材は、コイル部品としての特性を考慮して様々な材質を選んでもよい。特に、外装材としてガラスとセラミックの混合体を用いれば、強度の優れたコイル部品を得ることができる。さらに、素体１としてＴｉＯ₂を含有した誘電体材料からなる誘電体を用いれば、コンデンサ機能を有するコイル部品を得ることができ、ガラスとセラミックの混合体を用いれば、高周波特性の優れたコイル部品を得ることができ、Ａｌ₂Ｏ₃を含有した絶縁材料からなる絶縁体を用いれば、高周波特性を向上でき、単なる樹脂材料や磁性粉末を含有した樹脂材料等でもよい。
【００５０】
【発明の効果】
以上のように本発明によれば、絶縁層は凹版印刷法により凹部に充填した絶縁材料からなる充填物を素体に転写して設けているので、素体に対して絶縁層を厚く形成することができる。これにより、螺旋状の空隙部に配置する導体層も厚く形成できるので、この導体層により形成される螺旋状導体からなるコイル部の厚さも厚くできる。この結果、コイル部に大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上したコイル部品を提供することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態におけるコイル部品の断面図
【図２】同コイル部品の一部透視斜視図
【図３】（ａ）〜（ｅ）同コイル部品の製造工程図
【図４】他のコイル部品の断面図
【図５】他のコイル部品の断面図
【図６】（ａ）〜（ｄ）従来のコイル部品の製造工程図
【符号の説明】
１素体
２下地層
３空隙部
４絶縁層
５導体層
６コイル部
７電極部
８外装部
９第１層
１０第２層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a coil component used in various electronic devices and the like.
[0002]
[Prior art]
Hereinafter, conventional coil components will be described with reference to the drawings.
[0003]
6A to 6D are manufacturing process diagrams of a conventional coil component.
[0004]
6A to 6D, the conventional coil component includes a ceramic body 21 and an insulating layer 23 having a gap 22 formed on the ceramic body 21, and is disposed in the gap 22. Thus, the conductor layer 24 is formed on the ceramic body 21. The insulating layer 23 is formed on the ceramic body 21 by a commonly used photoresist method.
[0005]
Further, the gap portion 22 has a spiral shape, and a conductor layer 24 is disposed in the gap portion 22 so that the conductor layer 24 is a coil portion 25 made of a spiral conductor. Further, the coil part 25 is electrically connected to the electrode part 26 and covered with an exterior part 27.
[0006]
[Problems to be solved by the invention]
In the above conventional configuration, since the insulating layer 23 is formed on the ceramic body 21 by the photoresist method, in general, the thickness of the insulating layer 23 cannot be increased. That is, the conductor layer 24 disposed in the gap portion 22 can be formed only as thick as the insulating layer 23, and the thickness of the coil portion 25 formed of the spiral conductor formed from the conductor layer 24 cannot be increased. . Therefore, when a large current is passed through the coil portion 25 made of a spiral conductor, there is a problem that reliability is lowered such as a short circuit or resistance loss.
[0007]
An object of the present invention is to solve the above problems and to provide a method of manufacturing a coil component with improved reliability without causing a short circuit or resistance loss even when a large current is applied to the coil portion.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following method.
[0009]
In the invention according to claim 1 of the present invention, in particular, in the insulating layer forming step, a substrate having a recess filled with a filler made of an insulating material and disposed at a position relative to the shape of the insulating layer is overlaid on the element body to form the recess. The filling material filled in is transferred to the element body, and the insulating layer having a spiral void is formed on the element body.
[0010]
By the above method, the insulating layer is provided by transferring the filling made of an insulating material filled in the recesses to the element body by intaglio printing, so that the insulating layer can be formed thick on the element body. Thereby, since the conductor layer arrange | positioned in a helical space | gap part can also be formed thickly, the thickness of the coil part which consists of a helical conductor formed with this conductor layer can also be made thick. As a result, even if a large current is applied to the coil portion, no short circuit or resistance loss occurs, and the reliability can be improved.
[0011]
The invention according to claim 2 of the present invention is the invention according to claim 1, and in particular, the insulating layer forming step includes a recess filled with a filler made of an insulating material and disposed at a position corresponding to the shape of the insulating layer. A substrate having a spiral void is formed by superimposing a substrate having a substrate and transferring the filling filled in the recess to the substrate while bringing the surface of the substrate into contact with the substrate so that a gap is formed between the recesses of the substrate. In this method, the insulating layer is formed on the element body. According to the above method, even if a large current is applied to the coil portion, short circuit and resistance loss do not occur, and not only can the reliability be improved, but also the filling material filled in the recess can be made while the substrate surface is in contact with the element body. Since it is transferred to the body, the position adjustment between the element body and the substrate becomes easy.
[0012]
In the invention according to claim 3 of the present invention, in the invention according to claim 1, in the conductor layer forming step, the conductor layer is formed on the element body so that the conductor layer is disposed in the gap. In this method, the step of forming the conductor layer is also provided on the insulating layer, and the step of polishing the conductor layer up to the upper surface of the insulating layer after the conductor layer forming step is provided. By the above method, the bondability between the exterior portion and the coil portion can be improved.
[0013]
According to a fourth aspect of the present invention, in the third aspect of the present invention, in particular, the conductor layer forming step includes a conductor on the element body so that the conductor layer is disposed in the gap portion by an electroless plating step. In this method, the conductive layer is formed on the insulating layer as well as forming the layer. By the above method, the thickness of the coil portion made of a spiral conductor formed by the conductor layer can be increased, and even if a large current is passed through the coil portion, no short circuit or resistance loss occurs, and reliability can be improved. it can.
[0014]
The invention according to claim 5 of the present invention is the process according to claim 1, in particular, provided with a step of forming a conductor base layer made of a conductor on the element body before the insulating layer forming step, and the insulating layer forming step The substrate having a recess filled with a filler made of an insulating material and disposed at a position corresponding to the shape of the insulating layer is superimposed on the conductor underlayer, and the filler filled in the recess is transferred to the conductor underlayer to form a spiral shape. An insulating layer having a gap is formed on the conductor underlayer, and the conductor layer forming step is a step of forming a conductor layer on the conductor underlayer so that the conductor layer is disposed in the gap. This is a method provided with an insulating process for heat-treating the formation. By the above method, the thickness of the coil portion made of a spiral conductor formed by the conductor layer can be increased, and even if a large current is passed through the coil portion, no short circuit or resistance loss occurs, and reliability can be improved. it can.
[0015]
In particular, the conductor layer provided in the gap can be provided by electrolytic plating. Thereby, the coil part which consists of a helical conductor formed from a conductor layer can be uniform and can improve a precision, and can reduce a short circuit and resistance loss.
[0016]
According to a sixth aspect of the present invention, in the fifth aspect of the present invention, in particular, in the conductor layer forming step, the conductor is formed on the conductor underlayer so that the conductor layer is disposed in the gap portion by the electrolytic plating step. This is a method of forming a layer. By the above method, the conductor layer provided in the gap portion is provided by electrolytic plating, so that the coil portion made of a spiral conductor formed from the conductor layer can be uniform and improve accuracy, and short circuit and resistance loss can be reduced. , Reliability can be improved.
[0017]
According to a seventh aspect of the present invention, in the first aspect of the present invention, in particular, in the insulating layer forming step, the concave portion is filled with a filler made of an insulating material and disposed at a position corresponding to the shape of the insulating layer. The substrate filled with the conductor is overlaid on the conductor underlayer, and the filler filled in the recess is transferred to the conductor underlayer while the substrate surface is in contact with the element body so that the concave portion of the substrate becomes a void. And forming a conductor layer on the conductor underlayer so that the conductor layer is disposed in the gap, and the conductor underlayer is formed by forming the insulating layer on the conductor underlayer. This is a method in which an insulating process is performed in which heat treatment is performed to insulate. By the above method, the thickness of the coil portion made of a spiral conductor formed by the conductor layer can be increased, and even if a large current is passed through the coil portion, no short circuit or resistance loss occurs, and reliability can be improved. it can.
[0018]
In particular, the conductor layer provided in the gap can be provided by electrolytic plating. Thereby, the coil part which consists of a helical conductor formed from a conductor layer is uniform, can improve a precision, and can reduce a short circuit and resistance loss. Further, since the filling material filled in the recesses is transferred to the element body while the surface of the substrate is in contact with the element body, the position adjustment between the element body and the substrate is easy.
[0019]
According to an eighth aspect of the present invention, in the invention according to the seventh aspect, in the conductor layer forming step, the conductor layer is formed on the conductor underlayer so that the conductor layer is disposed in the gap. In addition, there is a method in which a step of forming the conductor layer is also provided on the insulating layer, and a polishing step of polishing the conductor layer up to the upper surface of the insulating layer after the conductor layer forming step is provided. By the above method, the bondability between the exterior portion and the coil portion can be improved.
[0020]
The invention according to claim 9 of the present invention is the conductor according to claim 8, in particular, the conductor layer forming step includes a conductor on the element body so that the conductor layer is disposed in the gap by an electroless plating step. In this method, the conductive layer is formed on the insulating layer as well as forming the layer. By the above method, a non-formed portion of the conductor layer is hardly generated in the gap portion of the insulating layer, and the conductor layer can be accurately arranged to reduce short circuit and resistance loss. In particular, the conductor layer on the conductor layer on the insulating layer can also be easily removed by polishing to function as a coil portion.
[0021]
The invention described in claim 10 of the present invention is a method using an organic material as the insulating material in the invention described in claim 1 in particular. By the said method, the outstanding coil component which has a helical conductor on the surface of an element | base_body can be obtained.
[0022]
The invention described in claim 11 of the present invention is a method of using an inorganic material as the insulating material in the invention described in claim 1. By the said method, the outstanding coil component which has a helical conductor on the surface of an element | base_body can be obtained.
[0023]
The invention described in claim 12 of the present invention is a method of using a magnetic material as the inorganic material in the invention described in claim 1 in particular. By the said method, the outstanding coil component which has a helical conductor on the surface of an element | base_body can be obtained. In particular, since the magnetic material is disposed around the spiral conductor, the inductance can be increased.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings in all the claims of the present invention.
[0025]
FIG. 1 is a sectional view of a coil component according to an embodiment of the present invention, FIG. 2 is a perspective view of the coil component, and FIGS. 3A to 3E are manufacturing process diagrams of the coil component.
[0026]
1 and 2, a coil component according to an embodiment of the present invention includes an element body 1, an underlayer 2 formed on the element body 1, a spiral gap formed on the underlayer 2. An insulating layer 4 having a portion 3 and a conductor layer 5 formed on the element body 1 so as to be disposed in the gap portion 3 are provided.
[0027]
In particular, the conductor layer 5 is an Ag-based metal layer made of Ag-based metal, and the base layer 2 interposed between the insulating layer 4 and the element body 1 and between the conductor layer 5 and the element body 1 is the element body 1 side. Is a conductor insulation layer in which the conductor is insulated, and the first layer 9 is an insulation in which a Ni-based metal is insulated. The second layer 10 is an insulated Cu-based metal layer in which a Cu-based metal is insulated.
[0028]
The insulating layer 4 is formed so that a substrate filled with an insulating material filled with an insulating material by an intaglio printing method is stacked on the element body 1 through the base layer 2 so that a spiral gap 3 is formed between the recesses of the substrate. The filling material filled in the concave portion is transferred to the element body 1 and the conductor layer 5 is provided as a coil portion 6 made of a spiral conductor by electroplating the gap portion 3.
[0029]
Further, the coil portion 6 is connected to the electrode portion 7 and is covered with an exterior portion 8 made of an exterior material.
[0030]
The element body 1 and the exterior material are magnetic bodies made of a ferrite magnetic material.
[0031]
The manufacturing method of this coil component is as follows in Fig.3 (a)-(e).
[0032]
First, a base layer 2 made of a conductor is formed on the element body 1 (base layer forming step) (FIG. 3A).
[0033]
Further, in the base layer forming step, the base body 1 side is made of a first layer 9 and the conductor layer 5 side is made of a second layer 10, and the first layer 9 is made of a Ni-based metal (first layer). 9 may be a Cu-based metal), and the second layer 10 is a Cu-based metal layer. Both the first layer 9 and the second layer 10 are formed by electrolytic plating.
[0034]
Second, an insulating layer 4 having a spiral void 3 is formed on the base layer 2 (insulating layer forming step) (FIG. 3B). In this insulating layer forming step, a filling material made of an insulating material is filled, a substrate having a recess disposed at a position corresponding to the shape of the insulating layer 4 is overlaid on the element body 1, and a gap 3 is formed between the recesses of the substrate. As described above, as the process of forming the insulating layer 4 having the spiral voids 3 on the element body 1 by transferring the filling filled in the recesses to the element body 1 while bringing the surface of the substrate into contact with the element body 1. Yes. At this time, the insulating material is a magnetic body made of a ferrite magnetic material.
[0035]
Third, the conductor layer 5 is formed on the base layer 2 so that the conductor layer 5 is disposed in the gap 3 (conductor layer forming step) (FIG. 3C). The conductor layer 5 is an Ag-based metal layer made of an Ag-based metal, and is formed on the base layer 2 by electrolytic plating.
[0036]
Fourth, a coil portion 6 made of a spiral conductor is formed on the conductor layer 5 (coil portion forming step) (FIG. 3C). Since the conductor layer 5 is disposed in the spiral gap 3, the conductor layer 5 is inevitably formed as a coil portion 6 made of a spiral conductor.
[0037]
Fifth, the electrode part 7 is formed so as to be electrically connected to the coil part 6 (electrode part forming step) (FIG. 3D).
[0038]
Sixth, the base layer 2 is insulated by heat treatment (insulation process). Thereby, the underlayer 2 becomes a conductor insulation layer in which the conductor is insulated, and the first layer 9 becomes an insulated Ni-based metal layer in which the Ni-based metal is insulated (when the first layer 9 is a Cu-based metal) Becomes an insulated Cu-based metal layer), and the second layer 10 becomes an insulated Cu-based metal layer obtained by insulating a Cu-based metal.
[0039]
7thly, the coil part 6 is coat | covered with the exterior part 8 which consists of exterior materials (covering process) (FIG.3 (e)). The exterior material is a magnetic body made of a ferrite magnetic material.
[0040]
The operation of the coil component having the above configuration will be described below.
[0041]
With the above configuration, the insulating layer 4 is provided by transferring the filling made of an insulating material filled in the recesses by intaglio printing to the element body 1, so that the insulating layer 4 can be formed thicker than the element body 1. it can. Thereby, since the conductor layer 5 arrange | positioned in the helical space | gap part 3 can also be formed thickly, the thickness of the coil part 6 which consists of a helical conductor formed with this conductor layer 5 can also be made thick. As a result, even if a large current is passed through the coil section 6, no short circuit or resistance loss occurs, and the reliability can be improved.
[0042]
In addition, since the conductor layer 5 provided in the gap portion 3 is provided by electrolytic plating, the coil portion 6 formed of the spiral conductor formed from the conductor layer 5 can be uniform and can improve accuracy, and short circuit and resistance loss can be reduced. Can be reduced.
[0043]
In particular, the conductor layer 5 is an Ag-based metal layer made of an Ag-based metal, the base layer 2 is the first layer 9 on the element body 1 side, the second layer 10 is on the conductor layer 5 side, and the first layer 9 is Ni Since the second layer 10 is an insulated Cu-based metal layer in which the Cu-based metal is insulated, the element body 1 and the conductor layer are interposed via the base layer 2. 5 can be improved, and the matching between the underlayer 2 and the conductor layer 5 can be improved.
[0044]
Furthermore, since the element body 1, the insulating material, and the exterior material are magnetic bodies made of a ferrite magnetic material, an excellent coil component having a helical conductor on the surface of the element body 1 can be obtained. Since a magnetic material is disposed around the spiral conductor, the inductance can be increased.
[0045]
As described above, according to the embodiment of the present invention, it is possible to form the coil portion 6 that is uniform and improved in accuracy, and even if a large current is passed through the coil portion 6, no short circuit or resistance loss occurs and reliability is improved. Can be improved. In addition, the adhesion between the element body 1 and the conductor layer 5 can be improved via the underlayer 2, and the matching between the underlayer 2 and the conductor layer 5 can be improved. Furthermore, since a magnetic material is disposed around the spiral conductor, the inductance can be increased.
[0046]
In the embodiment of the present invention, the element body 1 is a flat plate and the coil portion 6 is formed on one surface of the outer peripheral surface. However, as shown in FIGS. Using the element body 1, the base layer 2 is provided on the side surface and the outer peripheral surface of the columnar element body 1, the conductor layer 5 is provided on the base layer 2, and the conductor layer 5 corresponding to the outer peripheral surface is formed of a spiral conductor. The coil part 6 may be formed. The element body 1 shown in FIG. 4 has a shape with a thin central portion, and the element body 1 shown in FIG. 5 has a rectangular parallelepiped shape.
[0047]
In the embodiment of the present invention, the insulating layer 4 and the conductor layer 5 are not provided with a polished surface on the contact surface in contact with the exterior portion 8, but if the polished surface is provided, the exterior portion 8 and the coil portion 6 are provided. Bondability can be improved.
[0048]
In this case, the conductor layer forming step includes a step of forming the conductor layer 5 on the base layer 2 so that the conductor layer 5 is disposed in the gap 3 and also forming the conductor layer 5 on the insulating layer 4. It is necessary to provide a polishing step for polishing the conductor layer 5 up to the upper surface of the insulating layer 4 after the conductor layer forming step. In the conductor layer forming step, the conductor layer 5 is formed on the element body 1 and the conductor layer 5 is also formed on the insulating layer 4 so that the conductor layer 5 is disposed in the gap 3 by the electroless plating step. What is necessary is just to make it a process to do. In particular, a multilayer coil component can be obtained by performing the same process again on the polished surface.
[0049]
Further, various materials may be selected for the element body 1 and the exterior material in consideration of characteristics as a coil component. In particular, if a mixture of glass and ceramic is used as the exterior material, a coil component with excellent strength can be obtained. Furthermore, if a dielectric made of a dielectric material containing TiO ₂ is used as the element body 1, a coil component having a capacitor function can be obtained. If a mixture of glass and ceramic is used, a coil having excellent high frequency characteristics can be obtained. If an insulator made of an insulating material containing Al ₂ O ₃ can be obtained, high-frequency characteristics can be improved, and a simple resin material or a resin material containing magnetic powder may be used.
[0050]
【The invention's effect】
As described above, according to the present invention, since the insulating layer is provided by transferring the filling made of the insulating material filled in the concave portion to the element body by the intaglio printing method, the insulating layer is formed thick on the element body. be able to. Thereby, since the conductor layer arrange | positioned in a helical space | gap part can also be formed thickly, the thickness of the coil part which consists of a helical conductor formed with this conductor layer can also be made thick. As a result, even if a large current is applied to the coil portion, no short circuit or resistance loss occurs, and a coil component with improved reliability can be provided.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a coil component according to an embodiment of the present invention. FIG. 2 is a partially transparent perspective view of the coil component. FIG. 3 (a) to (e) Manufacturing process diagrams of the coil component. 4] Cross-sectional view of other coil components [Fig. 5] Cross-sectional view of other coil components [Fig. 6] (a) to (d) Production process diagrams of conventional coil components [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Element body 2 Underlayer 3 Gap part 4 Insulating layer 5 Conductor layer 6 Coil part 7 Electrode part 8 Exterior part 9 1st layer 10 2nd layer

Claims

An insulating layer forming step of forming an insulating layer having a spiral gap on the element body; and a conductor layer forming step of forming a conductor layer on the element body so that the conductor layer is disposed in the gap part; A coil portion forming step of forming a coil portion made of a spiral conductor in the conductor layer, wherein the insulation forming step includes a recess filled with a filler made of an insulating material and disposed at a position corresponding to the shape of the insulating layer. A method of manufacturing a coil component comprising a step of forming an insulating layer having a spiral void on a base body by transferring a filling material filled in the recess by superimposing a substrate having the base body on the base body.

In the insulating layer forming step, the surface of the substrate is filled with a filling made of an insulating material, and a substrate having a recess disposed at a position corresponding to the shape of the insulating layer is stacked on the element body so that a gap is formed between the recesses of the substrate. 2. The coil according to claim 1, wherein the insulating layer having the spiral gap is formed on the element body by transferring the filler filled in the recesses to the element body while contacting the element with the element body. A manufacturing method for parts.

In the conductor layer forming step, a conductor layer is formed on the element body so that the conductor layer is disposed in the gap, and the conductor layer is also formed on the insulating layer, and the conductor layer is insulated after the conductor layer forming step. The manufacturing method of the coil components of Claim 1 which provided the grinding | polishing process which grind | polishes the said conductor layer to the upper surface of a layer.

The conductor layer forming step is a step of forming the conductor layer on the element body so that the conductor layer is disposed in the gap by an electroless plating step, and forming the conductor layer also on the insulating layer. The manufacturing method of the coil components as described in 2.

Before the insulating layer forming step, a step of forming a conductor base layer made of a conductor on the element body is provided, and the insulating layer forming step includes a recess filled with a filling made of an insulating material and disposed at a position corresponding to the shape of the insulating layer. A step of forming an insulating layer having a spiral void in the conductor underlayer by transferring a filling material in which the substrate is placed on the conductor underlayer and filling the recesses to the conductor underlayer, and the conductor layer forming step The coil component manufacturing method according to claim 1, wherein a conductor layer is formed on the conductor underlayer so that the conductor layer is disposed on the conductor underlayer, and an insulating step is provided for heat-insulating the conductor underlayer. Method.

6. The method of manufacturing a coil component according to claim 5, wherein the conductor layer forming step is a step of forming a conductor layer on the conductor base layer so that the conductor layer is disposed in the gap by an electrolytic plating step.

The insulating layer forming step includes filling a substrate made of an insulating material and placing a substrate having a recess disposed at a position corresponding to the shape of the insulating layer on the conductor underlayer so that the recess of the substrate becomes a void. And transferring the filler filled in the recesses while contacting the element body to the conductor underlayer to form an insulating layer having a spiral void in the conductor underlayer, and the conductor layer forming step The method of manufacturing a coil component according to claim 1, wherein a conductor layer is formed on the conductor underlayer so that the conductor layer is disposed, and an insulation step is provided for heat-insulating the conductor underlayer. .

In the conductor layer forming step, a conductor layer is formed on the conductor underlayer so that the conductor layer is disposed in the gap, and a conductor layer is also formed on the insulating layer, and the conductor layer is insulated after the conductor layer forming step. The manufacturing method of the coil component of Claim 7 which provided the grinding | polishing process which grind | polishes a conductor layer to the upper surface of a layer.

The conductor layer forming step is a step of forming the conductor layer on the insulating layer and forming the conductor layer on the insulating layer so that the conductor layer is disposed in the gap by an electroless plating step. Manufacturing method of coil parts.

The method for manufacturing a coil component according to claim 1, wherein an organic material is used as the insulating material.

The method for manufacturing a coil component according to claim 1, wherein an inorganic material is used as the insulating material.

The method for manufacturing a coil component according to claim 11, wherein a magnetic material is used as the inorganic material.