JP2004193469A

JP2004193469A - Coil component and manufacturing method therefor

Info

Publication number: JP2004193469A
Application number: JP2002362036A
Authority: JP
Inventors: Michihisa Oba; 美智央大庭; Akihiko Ibata; 昭彦井端
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2002-12-13
Filing date: 2002-12-13
Publication date: 2004-07-08

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reliability-improved coil component whose coil has low electric resistance and which neither short-circuits nor generates resistance loss etc., even if a large current is supplied. <P>SOLUTION: The coil 6 is constituted by placing a mold which has a spiral uneven part over the top surface of an insulating prime body 2 and pressing it against the top part (corresponding to an insulating layer 3) of the insulating prime body 2 to form a spiral gap 4 on the insulating prime body 2, and then plating the gap 4. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、各種電子機器等に用いるコイル部品及びその製造方法に関するものである。
【０００２】
【従来の技術】
以下、従来のコイル部品について図面を参照しながら説明する。
【０００３】
図７（ａ）〜（ｄ）は従来のコイル部品の製造工程を示す工程図である。
【０００４】
図７（ａ）〜（ｄ）において、従来のコイル部品は、セラミック素体２１と、このセラミック素体２１上に空隙部２２を有する絶縁層２３を形成し、この空隙部２２に配置されるようにセラミック素体２１上に導体層２４を形成している。この絶縁層２３は一般的に用いるフォトレジスト法によりセラミック素体２１上に形成している。
【０００５】
また、空隙部２２は螺旋状としており、この空隙部２２に導体層２４を配置して導体層２４を螺旋状導体からなるコイル部２５としている。さらに、コイル部２５は電極部２６と電気的接続し、外装部２７で被覆している。
【０００６】
なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。
【０００７】
【特許文献１】
特開２００２−１４１２３５号公報
【０００８】
【発明が解決しようとする課題】
上記従来の構成では、フォトレジスト法によって、絶縁層２３をセラミック素体２１上に形成するので、一般的には、絶縁層２３の厚さを厚くすることができない。すなわち、空隙部２２に配置する導体層２４もこの絶縁層２３と同程度の厚さしか形成することができず、導体層２４から形成される螺旋状導体からなるコイル部２５の厚さも厚くできない。よって、螺旋状導体からなるコイル部２５の電気抵抗が高い、あるいは大電流を通電すると、短絡や抵抗損失が生じる等信頼性が低下するという問題点を有していた。
【０００９】
本発明は上記問題点を解決し、コイル部の電気抵抗が低く、また、大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上したコイル部品及びその製造方法を提供することを目的としている。
【００１０】
【課題を解決するための手段】
上記目的を達成するために本発明は以下の構成を有する。
【００１１】
本発明の請求項１記載の発明は、特に、絶縁素体の上部に螺旋状の空隙部を形成する空隙部形成工程と、前記空隙部に少なくとも導体層を形成する導体層形成工程と、前記導体層に螺旋状導体からなるコイル部を形成するコイル部形成工程とを備えた構成である。
【００１２】
上記構成により、アスペクト比の高い、断面積の大きなコイルを作製することができ、コイル部の電気抵抗が低く、また、大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００１３】
本発明の請求項２記載の発明は、特に、絶縁素体は絶縁芯部に絶縁層を被覆して形成し、前記絶縁素体の上部に相当する部分を前記絶縁層とした構成である。
【００１４】
上記構成により、絶縁素体の上部に螺旋状の空隙部を形成する際、絶縁素体の上部に相当する部分には、絶縁芯部に被覆して形成した絶縁層を設けているので、空隙部の形成時に生じやすい絶縁素体への歪みや撓み等を、絶縁層によって吸収させることができ、絶縁芯部への影響を抑制して、絶縁素体の歪みや撓み等に起因した特性劣化を防止することができる。
【００１５】
本発明の請求項３記載の発明は、特に、空隙部形成工程では、螺旋状の凹凸部を有する型を絶縁素体の上面に重ねるとともに上部に向かって押圧して、螺旋状の空隙部を形成する工程とした構成である。
【００１６】
上記構成により、レーザ加工、機械加工やフォトリソ加工等に比べ、螺旋状の凹凸部を有する型を絶縁素体の上面に重ねるとともに上部に向かって押圧するだけで、螺旋状の空隙部を形成できるので、形成が簡単で容易である。
【００１７】
本発明の請求項４記載の発明は、特に、空隙部形成工程後、絶縁素体を焼成する焼成工程を設けた構成である。
【００１８】
上記構成により、特に、低周波数領域で磁気特性の高いフェライト材料等を使用することができ、インダクタンス値の高いコイル部品を得ることができる。
【００１９】
本発明の請求項５記載の発明は、特に、導体層形成工程は、絶縁素体の上部に形成した空隙部及び絶縁素体の上面に導体層を形成する工程とし、コイル部形成工程は、前記絶縁素体の上面に形成した前記導体層を前記絶縁素体の上面まで研磨し、前記導体層に螺旋状導体からなるコイル部を形成する工程とした構成である。
【００２０】
上記構成により、絶縁素体の上面に形成した導体層を絶縁素体の上面まで研磨して形成するので、寸法精度が良く、平坦精度の良いコイル部を安価で簡単に形成することができる。
【００２１】
本発明の請求項６記載の発明は、特に、導体層形成工程は、メッキ工法により、導体層を形成する工程とした構成である。
【００２２】
上記構成により、電気的に導通しない絶縁素体に対しても、スパッタ法や蒸着法よりも容易に厚みの厚い導体層を形成することができる。
【００２３】
本発明の請求項７記載の発明は、特に、コイル部形成工程後、コイル部を形成した絶縁素体上に、新たな絶縁素体を積層する積層工程と、新たな前記絶縁素体に、空隙部形成工程を施すとともに、新たな前記絶縁素体を貫通するスルーホールを形成する工程と、空隙部及びスルーホールを形成した新たな絶縁素体に導体層形成工程及びコイル部形成工程を施すとともに、前記スルーホールに導体層を形成する工程とを設け、前記スルーホールに形成した前記導体層を介して、上下に積層した前記絶縁素体のコイル部を電気的に導通させた構成である。
【００２４】
上記構成により、多層にコイル部を形成することができ、インダクタ値を高くすることができる。
【００２５】
本発明の請求項８記載の発明は、特に、導体層形成工程前に、絶縁素体を貫通するスルーホールを形成する工程を設けるとともに、導体層形成工程において、前記スルーホールに導体層を形成する工程を設け、コイル部を形成した絶縁素体を上下に積層するとともに、前記スルーホールに形成した前記導体層を介して、上下に積層した前記絶縁素体のコイル部を電気的に導通させた構成である。
【００２６】
上記構成により、多層にコイル部を形成することができ、インダクタ値を高くすることができる。
【００２７】
本発明の請求項９記載の発明は、特に、絶縁素体は、有機物材料または無機物材料からなる構成である。
【００２８】
上記構成により、有機物材料を用いれば高周波特性を改善でき、無機物材料を用いれば低周波特性を改善できる。
【００２９】
本発明の請求項１０記載の発明は、特に、絶縁芯部は、有機物材料または無機物材料からなる構成である。
【００３０】
上記構成により、有機物材料を用いれば高周波特性を改善でき、無機物材料を用いれば低周波特性を改善できる。
【００３１】
本発明の請求項１１記載の発明は、特に、絶縁層は、有機物材料または無機物材料からなる構成である。
【００３２】
上記構成により、有機物材料を用いれば高周波特性を改善でき、無機物材料を用いれば低周波特性を改善できる。
【００３３】
本発明の請求項１２記載の発明は、特に、螺旋状の凹凸部を有する型は、金属材料または有機材料からなる構成である。
【００３４】
上記構成により、金属材料を用いれば、絶縁素体が無機物材料であっても、耐磨耗性を向上できるとともに熱膨張を抑制して寸法精度を向上でき、有機材料を用いれば、離型性を向上することができる。
【００３５】
特に、金属材料の表面に有機材料を被覆したものにおいては、上記の両方の特性を兼ね備えることができる。
【００３６】
本発明の請求項１３記載の発明は、特に、空隙部は螺旋状の凹凸部を有する型を絶縁素体の上面に重ねるとともに上部に向かって押圧して形成し、コイル部は螺旋状の前記空隙部に少なくとも導体層をメッキして形成した構成である。
【００３７】
上記構成により、アスペクト比の高い、断面積の大きなコイルを作製することができ、コイル部の電気抵抗が低く、また、大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００３８】
【発明の実施の形態】
以下、本発明の一実施の形態におけるコイル部品の製造方法について図面を参照しながら説明する。
【００３９】
図１は本発明の一実施の形態におけるコイル部品の製造工程を示す工程図、図２は同コイル部品の斜視図、図３は同コイル部品の断面図である。
【００４０】
図１〜図３において、本発明の一実施の形態におけるコイル部品の製造方法は、次の通りである。
【００４１】
第１に、絶縁芯部１に絶縁層３を被覆して絶縁素体２を形成する（絶縁素体形成工程）（図１（ａ））。
【００４２】
第２に、螺旋状の凹凸部を有する型を絶縁素体２の上面に重ねるとともに絶縁素体２の上部（絶縁層３に相当する部分）に向かって押圧して、この絶縁素体２の上部に螺旋状の空隙部４を形成する（空隙部形成工程）（図１（ｂ））。
【００４３】
第３に、この絶縁素体２の上部に形成した空隙部４及び絶縁素体２の上面には、無電解メッキを施した後、電解メッキを施して導体層５を形成する（導体層形成工程）（図１（ｃ））。
【００４４】
第４に、絶縁素体２の上面に形成した導体層５を絶縁素体２の上面まで研磨し、この研磨によって、導体層５に螺旋状導体からなるコイル部６を形成する（コイル部形成工程）（図１（ｄ））。
【００４５】
第５に、このコイル部６を形成した絶縁素体２の上面に、絶縁素体形成工程（図１（ａ））、空隙部形成工程（図１（ｂ））を繰り返し施し、かつ上層の絶縁素体２の空隙部４の内周端と下層の絶縁素体２の空隙部４に形成したコイル部６の内周端とを導通するためのスルーホール７を絶縁素体２に形成する（スルーホール形成工程）（図１（ｅ））。
【００４６】
第６に、上層の絶縁素体２に、再度、導体層形成工程（図１（ｃ））及びコイル部形成工程（図１（ｄ））を施すとともに、スルーホール７に導体層５を形成して、このスルーホール７に形成した導体層５を介して、上下に積層した絶縁素体２のコイル部６を電気的に導通する（スルーホール導通工程）（図１（ｆ））。
【００４７】
第７に、コイル部６を形成した上層の絶縁素体２の上面に、再度、絶縁素体形成工程（図１（ａ））を施し、コイル部６を複数積層したコイル部品を完成する（完成工程）（図１（ｇ））。
【００４８】
これによって、絶縁芯部１を絶縁層３で被覆した絶縁素体２と、この絶縁素体２の上部（絶縁層３に相当する部分）に形成した螺旋状の空隙部４と、この螺旋状の空隙部４に形成した螺旋状導体からなるコイル部６とを備え、空隙部４は螺旋状の凹凸部を有する型を絶縁素体２の上面に重ねるとともに絶縁素体２の上部に向かって押圧して形成し、コイル部６は螺旋状の空隙部４に導体層５をメッキして形成したコイル部品を製造することができる。
【００４９】
上記構成によって、アスペクト比の高い、断面積の大きなコイルを作製することができ、コイル部６の電気抵抗が低く、また、大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００５０】
また、絶縁素体２の上部に螺旋状の空隙部４を形成する際、絶縁素体２の上部に相当する部分には、絶縁芯部１に被覆して形成した絶縁層３を設けているので、空隙部４の形成時に生じやすい絶縁素体２への歪みや撓み等を、絶縁層３によって吸収させることができ、絶縁芯部１への影響を抑制して、絶縁素体２の歪みや撓み等に起因した特性劣化を防止することができる。
【００５１】
特に、レーザ加工、機械加工やフォトリソ加工等に比べ、螺旋状の凹凸部を有する型を絶縁素体２の上面に重ねるとともに上部に向かって押圧するだけで、螺旋状の空隙部４を形成できるので、形成が簡単で容易である。
【００５２】
さらに、絶縁素体２の上面に形成した導体層５を絶縁素体２の上面まで研磨して形成するので、寸法精度が良く、平坦精度の良いコイル部６を安価で簡単に形成することができるとともに、無電解メッキ工法により、導体層５を形成するので、電気的に導通しない絶縁素体２に対しても、スパッタ法や蒸着法よりも容易に厚みの厚い導体層５を形成することができる。
【００５３】
そして、このようなコイル部６を形成した絶縁素体２を積層することも容易である。
【００５４】
材料については、絶縁素体２、絶縁芯部１、絶縁層３として有機物材料を用いれば高周波特性を改善でき、無機物材料を用いれば低周波特性を改善できる。
【００５５】
螺旋状の凹凸部を有する型として金属材料を用いれば、絶縁素体２が無機物材料であっても、耐磨耗性を向上できるとともに熱膨張を抑制して寸法精度を向上でき、有機材料を用いれば、離型性を向上することができる。
【００５６】
特に、金属材料の表面に有機材料を被覆したものにおいては、上記の両方の特性を兼ね備えることができる。
【００５７】
このように本発明の実施の形態によれば、アスペクト比の高い、断面積の大きなコイルを作製することができ、コイル部６の電気抵抗が低く、また大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上することができる。
【００５８】
また、図４〜図６に示すように、コイル部６を形成した絶縁素体２を積層する場合は、一方の絶縁素体２に対しては、絶縁素体形成工程（図４（ａ））、空隙部形成工程（図４（ｂ））、導体層形成工程（図４（ｃ））、コイル部形成工程（図４（ｄ））と、図１と同様な製造工程を途中まで施す。
【００５９】
他方の絶縁素体２に対しては、まず、絶縁素体形成工程（図５（ａ））、空隙部形成工程（図５（ｂ））を施す。次に、絶縁素体２を貫通するようにスルーホール７を形成する（スルーホール形成工程）（図５（ｃ））。そして、空隙部４、絶縁素体２の上面、スルーホール７に無電解メッキを施した後、電解メッキを施して導体層５を形成する（導体層形成工程）（図５（ｄ））。最後に、絶縁素体２の上面に形成した導体層５を絶縁素体２の上面まで研磨し、この研磨によって、導体層５に螺旋状導体からなるコイル部６を形成する（コイル部形成工程）（図５（ｅ））。
【００６０】
そして、コイル部６を形成した一方の絶縁素体２の上に、コイル部６を形成した他方の絶縁素体２を積層するとともに、他方の絶縁素体２のスルーホール７に形成した導体層５を介して、上下に積層した一方と他方の絶縁素体２のコイル部６を電気的に導通させる（スルーホール導通工程）（図６（ａ））。この際、一方と他方の絶縁素体２は、互いに貼り合わせることによって、容易に積層することができる。
【００６１】
最後に、コイル部６を形成した上層の絶縁素体２の上面に、絶縁素体形成工程を施し、コイル部６を複数積層したコイル部品を完成する（完成工程）（図６（ｂ））。
【００６２】
なお、未焼成の絶縁素体２を用いてもよく、この場合、空隙部形成工程後、絶縁素体２を焼成する焼成工程を設ければ、特に、低周波数領域で磁気特性の高いフェライト材料等を使用することができ、インダクタンス値の高いコイル部品を得ることができる。
【００６３】
【発明の効果】
以上のように本発明によれば、コイル部の電気抵抗が低く、また、大電流を通電しても短絡や抵抗損失等が生じず、信頼性を向上したコイル部品及びその製造方法を提供することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態におけるコイル部品の製造工程を示す工程図
【図２】同コイル部品の斜視図
【図３】同コイル部品の断面図
【図４】他の実施の形態におけるコイル部品の製造工程の一部を示す工程図
【図５】同コイル部品の製造工程の一部を示す工程図
【図６】同コイル部品の製造工程の一部を示す工程図
【図７】従来のコイル部品の製造工程を示す工程図
【符号の説明】
１絶縁芯部
２絶縁素体
３絶縁層
４空隙部
５導体層
６コイル部
７スルーホール[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a coil component used for various electronic devices and the like, and a method for manufacturing the same.
[0002]
[Prior art]
Hereinafter, a conventional coil component will be described with reference to the drawings.
[0003]
7A to 7D are process diagrams showing a conventional coil component manufacturing process.
[0004]
7A to 7D, a conventional coil component is formed by forming a ceramic body 21 and an insulating layer 23 having a cavity 22 on the ceramic body 21 and disposing the insulating layer 23 in the cavity 22. The conductor layer 24 is formed on the ceramic body 21 as described above. The insulating layer 23 is formed on the ceramic body 21 by a generally used photoresist method.
[0005]
The gap 22 has a spiral shape, and the conductor layer 24 is disposed in the gap 22 to form a coil 25 made of a spiral conductor. Further, the coil part 25 is electrically connected to the electrode part 26 and is covered with the exterior part 27.
[0006]
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
[0007]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2002-141235
[Problems to be solved by the invention]
In the above-described conventional configuration, since the insulating layer 23 is formed on the ceramic body 21 by a photoresist method, generally, the thickness of the insulating layer 23 cannot be increased. In other words, the conductor layer 24 disposed in the gap 22 can be formed only as thick as the insulating layer 23, and the coil portion 25 formed of the spiral conductor formed from the conductor layer 24 cannot be thickened. . Therefore, when the electric resistance of the coil portion 25 made of the spiral conductor is high or a large current is applied, there is a problem that reliability is reduced, such as short circuit and resistance loss.
[0009]
The present invention solves the above problems, and provides a coil component with improved reliability, in which the electric resistance of the coil portion is low, short-circuit and resistance loss do not occur even when a large current is applied, and a method of manufacturing the same. It is aimed at.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0011]
In particular, the invention according to claim 1 of the present invention includes a step of forming a helical gap above the insulating body, a step of forming a conductor layer at least in the gap, and a step of forming a conductor layer. And a coil part forming step of forming a coil part made of a spiral conductor on the conductor layer.
[0012]
With the above configuration, a coil having a high aspect ratio and a large cross-sectional area can be manufactured, the electric resistance of the coil portion is low, and short-circuiting and resistance loss do not occur even when a large current is applied, thereby improving reliability. Can be improved.
[0013]
The invention according to claim 2 of the present invention is particularly configured such that the insulating element is formed by covering an insulating core with an insulating layer, and a portion corresponding to an upper portion of the insulating element is used as the insulating layer.
[0014]
According to the above configuration, when forming a spiral void in the upper part of the insulating body, a portion corresponding to the upper part of the insulating body is provided with an insulating layer formed by covering the insulating core. The insulating layer can absorb the distortion or bending of the insulator that is likely to occur during the formation of the portion, and suppresses the influence on the insulating core, thereby deteriorating the characteristics due to the distortion or bending of the insulator. Can be prevented.
[0015]
In the invention according to claim 3 of the present invention, in particular, in the gap forming step, a mold having a spiral uneven portion is superimposed on the upper surface of the insulating body and pressed upward to form the spiral gap. This is a configuration in which a forming process is performed.
[0016]
With the above-described configuration, a spiral gap can be formed by simply stacking a mold having a spiral uneven portion on the upper surface of the insulating body and pressing the mold upward, as compared with laser processing, mechanical processing, photolithography, or the like. Therefore, the formation is simple and easy.
[0017]
The invention according to claim 4 of the present invention has a structure in which a firing step of firing the insulating body is provided after the step of forming the voids.
[0018]
With the above configuration, a ferrite material or the like having high magnetic characteristics in a low frequency region can be used, and a coil component having a high inductance value can be obtained.
[0019]
In the invention according to claim 5 of the present invention, in particular, the conductor layer forming step is a step of forming a conductor layer on a gap formed in an upper part of the insulator and an upper surface of the insulator, and the coil part forming step is: The conductor layer formed on the upper surface of the insulator may be polished to the upper surface of the insulator to form a coil portion made of a spiral conductor on the conductor layer.
[0020]
According to the above configuration, since the conductor layer formed on the upper surface of the insulator is polished to the upper surface of the insulator, the coil portion having good dimensional accuracy and high flatness accuracy can be easily formed at low cost.
[0021]
The invention according to claim 6 of the present invention is particularly configured such that the conductor layer forming step is a step of forming a conductor layer by a plating method.
[0022]
With the above structure, a thick conductor layer can be easily formed even on an insulating body that is not electrically conductive, as compared with a sputtering method or a vapor deposition method.
[0023]
In particular, the invention according to claim 7 of the present invention provides a laminating step of laminating a new insulating element on the insulating element on which the coil section is formed, after the coil section forming step, Performing a gap forming step, forming a new through-hole penetrating the insulating body, and performing a conductor layer forming step and a coil forming step on the new insulating body having the gap and the through-hole formed therein And a step of forming a conductor layer in the through hole, wherein the coil portions of the insulating element stacked vertically are electrically connected via the conductor layer formed in the through hole. .
[0024]
According to the above configuration, the coil portion can be formed in multiple layers, and the inductor value can be increased.
[0025]
The invention according to claim 8 of the present invention provides, in particular, a step of forming a through-hole penetrating the insulator before forming the conductor layer, and forming a conductor layer in the through-hole in the conductor layer forming step. And a step of stacking the insulating element formed with the coil part vertically, and electrically connecting the coil part of the insulating element stacked vertically through the conductor layer formed in the through hole. Configuration.
[0026]
According to the above configuration, the coil portion can be formed in multiple layers, and the inductor value can be increased.
[0027]
The invention according to claim 9 of the present invention is particularly configured such that the insulator is made of an organic material or an inorganic material.
[0028]
With the above configuration, high frequency characteristics can be improved by using an organic material, and low frequency characteristics can be improved by using an inorganic material.
[0029]
The invention according to claim 10 of the present invention is particularly configured such that the insulating core portion is made of an organic material or an inorganic material.
[0030]
With the above configuration, high frequency characteristics can be improved by using an organic material, and low frequency characteristics can be improved by using an inorganic material.
[0031]
The invention according to claim 11 of the present invention is particularly configured such that the insulating layer is made of an organic material or an inorganic material.
[0032]
With the above configuration, high frequency characteristics can be improved by using an organic material, and low frequency characteristics can be improved by using an inorganic material.
[0033]
In the invention according to claim 12 of the present invention, in particular, the mold having the helical unevenness is formed of a metal material or an organic material.
[0034]
According to the above configuration, when a metal material is used, even if the insulating body is an inorganic material, it is possible to improve abrasion resistance and suppress thermal expansion, thereby improving dimensional accuracy. Can be improved.
[0035]
In particular, in the case where the surface of a metal material is coated with an organic material, both of the above characteristics can be provided.
[0036]
In the invention according to claim 13 of the present invention, in particular, the void portion is formed by stacking a mold having a spiral uneven portion on the upper surface of the insulating body and pressing the mold upward, and the coil portion is formed in a spiral shape. This is a configuration in which at least the conductor layer is formed by plating the gap.
[0037]
With the above configuration, a coil having a high aspect ratio and a large cross-sectional area can be manufactured, the electric resistance of the coil portion is low, and short-circuiting and resistance loss do not occur even when a large current is applied, thereby improving reliability. Can be improved.
[0038]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a method for manufacturing a coil component according to an embodiment of the present invention will be described with reference to the drawings.
[0039]
FIG. 1 is a process diagram showing a manufacturing process of a coil component in one embodiment of the present invention, FIG. 2 is a perspective view of the coil component, and FIG. 3 is a sectional view of the coil component.
[0040]
1 to 3, a method for manufacturing a coil component according to an embodiment of the present invention is as follows.
[0041]
First, the insulating core 2 is formed by covering the insulating core 1 with the insulating layer 3 (insulating body forming step) (FIG. 1A).
[0042]
Second, a mold having a helical uneven portion is overlapped on the upper surface of the insulating body 2 and pressed toward the upper portion (a portion corresponding to the insulating layer 3) of the insulating body 2 to form the insulating body 2 A spiral gap 4 is formed in the upper part (gap formation step) (FIG. 1B).
[0043]
Third, the conductor layer 5 is formed by applying electroless plating to the void 4 formed on the upper part of the insulator 2 and the upper surface of the insulator 2 and then performing electrolytic plating. Step) (FIG. 1 (c)).
[0044]
Fourth, the conductor layer 5 formed on the upper surface of the insulating body 2 is polished to the upper surface of the insulating body 2, and the coil portion 6 made of a spiral conductor is formed on the conductor layer 5 by this polishing. Step) (FIG. 1 (d)).
[0045]
Fifth, an insulating element forming step (FIG. 1A) and a void forming step (FIG. 1B) are repeatedly performed on the upper surface of the insulating element 2 on which the coil portion 6 is formed, and an upper layer is formed. A through-hole 7 is formed in the insulating element 2 for conducting between the inner peripheral end of the gap 4 of the insulating element 2 and the inner peripheral end of the coil 6 formed in the gap 4 of the lower insulating element 2. (Through hole forming step) (FIG. 1E).
[0046]
Sixth, the conductor layer forming step (FIG. 1 (c)) and the coil part forming step (FIG. 1 (d)) are performed again on the upper insulating body 2, and the conductor layer 5 is formed in the through hole 7. Then, through the conductor layer 5 formed in the through hole 7, the coil portion 6 of the insulating body 2 stacked vertically is electrically conducted (through hole conduction step) (FIG. 1 (f)).
[0047]
Seventh, the upper surface of the upper insulating body 2 on which the coil portions 6 are formed is subjected to the insulating body forming step (FIG. 1A) again to complete a coil component in which a plurality of the coil portions 6 are laminated (FIG. 1A). Completion process) (FIG. 1 (g)).
[0048]
As a result, the insulating element 2 in which the insulating core 1 is covered with the insulating layer 3, the spiral gap 4 formed in the upper part of the insulating element 2 (a portion corresponding to the insulating layer 3), and the spiral element 4 And a coil portion 6 formed of a spiral conductor formed in the void portion 4 of the semiconductor device. The void portion 4 is formed by stacking a mold having a spiral uneven portion on the upper surface of the insulating body 2 and facing the upper portion of the insulating body 2 The coil part 6 is formed by pressing, and the coil part 6 can be manufactured by plating the conductor layer 5 in the spiral gap 4.
[0049]
According to the above configuration, a coil having a high aspect ratio and a large cross-sectional area can be manufactured, the electric resistance of the coil portion 6 is low, and short-circuiting and resistance loss do not occur even when a large current is applied. Can be improved.
[0050]
Further, when forming the spiral void portion 4 on the upper part of the insulating body 2, the insulating layer 3 formed by covering the insulating core 1 is provided in a portion corresponding to the upper part of the insulating body 2. Therefore, distortion or bending of the insulating body 2 that is likely to be generated when the voids 4 are formed can be absorbed by the insulating layer 3, and the influence on the insulating core 1 can be suppressed, and the deformation of the insulating body 2 can be suppressed. It is possible to prevent characteristic deterioration due to bending or bending.
[0051]
In particular, as compared with laser processing, mechanical processing, photolithographic processing, or the like, the spiral gap portion 4 can be formed only by overlapping a mold having a spiral uneven portion on the upper surface of the insulating body 2 and pressing the mold upward. Therefore, the formation is simple and easy.
[0052]
Furthermore, since the conductor layer 5 formed on the upper surface of the insulating body 2 is formed by polishing to the upper surface of the insulating body 2, the coil portion 6 having good dimensional accuracy and good flatness can be easily formed at low cost. In addition, since the conductor layer 5 is formed by the electroless plating method, the thick conductor layer 5 can be easily formed on the non-electrically conductive insulator 2 by the sputtering method or the vapor deposition method. Can be.
[0053]
Then, it is easy to stack the insulating element 2 on which such a coil portion 6 is formed.
[0054]
As for the materials, high frequency characteristics can be improved by using an organic material for the insulating body 2, the insulating core 1, and the insulating layer 3, and low frequency characteristics can be improved by using an inorganic material.
[0055]
If a metal material is used as a mold having a spiral uneven portion, even if the insulating element 2 is an inorganic material, it is possible to improve abrasion resistance and suppress thermal expansion to improve dimensional accuracy. If used, the releasability can be improved.
[0056]
In particular, in the case where the surface of a metal material is coated with an organic material, both of the above characteristics can be provided.
[0057]
As described above, according to the embodiment of the present invention, a coil having a high aspect ratio and a large cross-sectional area can be manufactured, and the electric resistance of the coil portion 6 is low. Loss does not occur, and the reliability can be improved.
[0058]
In addition, as shown in FIGS. 4 to 6, in a case where the insulators 2 on which the coil portions 6 are formed are laminated, one insulator 2 is subjected to an insulator formation step (FIG. 4A). ), A void forming step (FIG. 4 (b)), a conductor layer forming step (FIG. 4 (c)), a coil part forming step (FIG. 4 (d)), and the same manufacturing steps as in FIG. .
[0059]
First, an insulating element forming step (FIG. 5A) and a void forming step (FIG. 5B) are performed on the other insulating element 2. Next, a through hole 7 is formed so as to penetrate the insulating body 2 (through hole forming step) (FIG. 5C). Then, after electroless plating is performed on the void portion 4, the upper surface of the insulating body 2, and the through hole 7, electrolytic plating is performed to form the conductor layer 5 (conductor layer forming step) (FIG. 5D). Finally, the conductor layer 5 formed on the upper surface of the insulating body 2 is polished to the upper surface of the insulating body 2, and by this polishing, a coil portion 6 made of a spiral conductor is formed on the conductor layer 5. ) (FIG. 5 (e)).
[0060]
Then, the other insulating element 2 having the coil 6 formed thereon is laminated on the one insulating element 2 having the coil 6 formed therein, and the conductor layer formed in the through hole 7 of the other insulating element 2 is provided. The coil portions 6 of the one and the other insulators 2 stacked one above the other are electrically connected through the through hole 5 (through-hole conduction step) (FIG. 6A). At this time, the one and the other insulating element bodies 2 can be easily laminated by pasting each other.
[0061]
Finally, an upper surface of the upper insulating element 2 on which the coil section 6 is formed is subjected to an insulating element forming step to complete a coil component in which a plurality of the coil sections 6 are laminated (completion step) (FIG. 6B). .
[0062]
In addition, an unfired insulating element 2 may be used. In this case, if a firing step of firing the insulating element 2 after the void forming step is provided, particularly, a ferrite material having high magnetic characteristics in a low frequency region is provided. Can be used, and a coil component having a high inductance value can be obtained.
[0063]
【The invention's effect】
As described above, according to the present invention, there is provided a coil component having improved reliability, in which the electric resistance of the coil portion is low, short-circuit and resistance loss do not occur even when a large current is applied, and a method of manufacturing the same. be able to.
[Brief description of the drawings]
FIG. 1 is a process diagram showing a manufacturing process of a coil component according to an embodiment of the present invention. FIG. 2 is a perspective view of the coil component. FIG. 3 is a cross-sectional view of the coil component. FIG. 5 is a process diagram showing a part of the manufacturing process of the coil component in FIG. 5 FIG. 5 is a process diagram showing a part of the manufacturing process of the coil component FIG. 6 is a process diagram showing a part of the manufacturing process of the coil component Process diagram showing the process of manufacturing a conventional coil component.
DESCRIPTION OF SYMBOLS 1 Insulating core part 2 Insulating element 3 Insulating layer 4 Void part 5 Conductive layer 6 Coil part 7 Through hole

Claims

A step of forming a spiral gap in the upper part of the insulating body, a step of forming at least a conductor layer in the gap, and a step of forming a coil made of a spiral conductor in the conductor layer A method for manufacturing a coil component, comprising: a step of forming a coil portion.

The method for manufacturing a coil component according to claim 1, wherein the insulating body is formed by covering an insulating core with an insulating layer, and a portion corresponding to an upper part of the insulating body is the insulating layer.

2. The coil component according to claim 1, wherein the step of forming a void portion includes the step of forming a spiral void portion by overlapping a mold having a spiral uneven portion on the upper surface of the insulating body and pressing the mold upward. Production method.

The method for manufacturing a coil component according to claim 1, further comprising a firing step of firing the insulating body after the step of forming the gap.

The conductor layer forming step is a step of forming a conductor layer on the upper surface of the insulator and the void formed in the upper part of the insulator, and the coil part forming step is a step of forming the conductor layer formed on the upper surface of the insulator. 2. The method for manufacturing a coil component according to claim 1, wherein a step of polishing the upper surface of the insulating body to form a coil portion made of a spiral conductor on the conductor layer.

The method for manufacturing a coil component according to claim 1, wherein the conductor layer forming step is a step of forming the conductor layer by a plating method.

After the coil part forming step, a laminating step of laminating a new insulating element on the insulating element on which the coil part is formed, and performing a void forming step on the new insulating element, Forming a through hole penetrating the body, performing a conductor layer forming step and a coil part forming step on the new insulating body having the void portion and the through hole formed therein, and forming a conductor layer on the through hole. 2. The method for manufacturing a coil component according to claim 1, wherein a coil portion of the insulating body stacked vertically is electrically connected via the conductor layer formed in the through hole.

Before the conductor layer forming step, a step of forming a through-hole penetrating the insulating body is provided, and in the conductor layer forming step, a step of forming a conductor layer in the through-hole is provided, and the coil body is formed. 2. The method of manufacturing a coil component according to claim 1, wherein the coil portions of the insulating element body stacked vertically are electrically connected to each other via the conductor layer formed in the through hole. 3.

The method for manufacturing a coil component according to claim 1, wherein the insulator is made of an organic material or an inorganic material.

3. The method for manufacturing a coil component according to claim 2, wherein the insulating core is made of an organic material or an inorganic material.

The method for manufacturing a coil component according to claim 2, wherein the insulating layer is made of an organic material or an inorganic material.

4. The method for manufacturing a coil component according to claim 3, wherein the mold having the spiral uneven portion is made of a metal material or an organic material.

An insulating element body having an insulating core covered with an insulating layer, a spiral gap formed in the upper part of the insulating element, and a coil part formed of a spiral conductor formed in the spiral gap, The gap is formed by pressing a mold having a spiral uneven portion on the upper surface of the insulating body and pressing the mold upward, and the coil portion is formed by plating at least a conductor layer in the spiral gap. Formed coil parts.