JP3709541B2 - Inspection method and apparatus for photoelectric conversion element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement in an inspection apparatus for photoelectric conversion elements, and is an invention developed mainly with a focus on a contact method of an inspection probe in an inspection apparatus.
[0002]
[Prior art]
The measurement items in the inspection device for light-emitting elements such as photoelectric conversion elements, particularly chip LEDs, require inspection of luminance and color tone in addition to diode characteristics, so that the upper surface side light emitting section (reference numeral 31 in FIGS. 6 and 7) As shown in FIG. 6, generally, the substrate surface 2 of the chip LED 1 is sucked and transported by the suction nozzle 3 and the inspection probes 4 and 5 are brought into contact with the electrode section 6 from the side. Alternatively, the chip LED is clamped from the side and conveyed, and an inspection probe is inserted from the lower surface side.
[0003]
However, in the method in which the substrate surface 2 of the chip LED 1 is sucked and held by the suction nozzle 3 and the inspection probes 4 and 5 are inserted from the side, the electrode portion 6 (plating portion) on the front side of the contact portion of the inspection probe 5 is placed. The disconnection part 7 and the defective part could not be detected, and there was a risk of mounting the non-energized chip LED 1 having the disconnection part 7 on the substrate 8 as shown in FIG.
[0004]
In order to solve this problem, there is a system in which the chip LED is clamped from the side and conveyed, and an inspection probe is inserted from the lower surface. However, in this system, an external force is applied to the chip LED as a work, and the substrate of the chip LED There is a problem that the part is damaged or the electrode part (plated part) is scratched. In particular, since chip LEDs have been miniaturized in recent years, this is a big problem.
[0005]
[Problems to be solved by the invention]
The present invention intends to provide an inspection device for a photoelectric conversion element that can detect a disconnection defect of an electrode portion without causing damage to a chip LED even if a probe for inspection (a current-carrying member) is inserted from the lower surface side. It is.
[0006]
[Means for Solving the Problems]
In order to solve the above-described problem, a first invention is a photoelectric conversion element that performs an inspection by bringing a current-carrying member into contact with an electrode of a photoelectric conversion element that includes an electrode on a lower surface side and a light-emitting portion or a light-receiving portion on an upper surface side. In the inspection method, the current-carrying member is brought into contact with the electrode on the lower surface side of the element whose side surface is adsorbed and held, and a contact member having translucency is brought into contact with the upper surface side, and the element is sandwiched between the current-carrying member and the contact member. It is an object of the present invention to provide a photoelectric conversion element inspection method characterized by
[0007]
A second invention is an invention relating to an inspection apparatus for carrying out the invention of the above inspection method, in which a photoelectric conversion element having an electrode on the lower surface side and a light emitting portion on the upper surface side is energized to emit light from the light emitting portion. An inspection device for a photoelectric conversion element that receives light by a light receiving means and inspects a light emission state, comprising: a holding means that sucks and holds a side surface of the element; a translucent contact member that contacts the upper surface side of the element; A current-carrying member that contacts and energizes the electrode on the lower surface side, and a moving mechanism that contacts and separates at least one of the contact member and the current-carrying member with respect to the element, and sandwiches the element between the current-carrying member and the contact member A photoelectric conversion element inspection apparatus characterized by performing inspection in a state.
[0008]
In the third invention, contrary to the second invention, the light receiving portion of the photoelectric conversion element having the electrode on the lower surface side and the light receiving portion on the upper surface side receives the light from the light emitting means to inspect the energized state. An inspection device for a photoelectric conversion element, comprising: a holding unit that sucks and holds a side surface of the element; a translucent contact member that contacts the upper surface side of the element; and an energization member that contacts an electrode on the lower surface side of the element A photoelectric conversion element inspection comprising: a moving mechanism that contacts and separates at least one of the contact member and the energization member with respect to the element, and inspecting the element between the energization member and the contact member Device.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. FIG. 5 is an explanatory plan view of the inspection apparatus 12. The inspection apparatus 12 includes a parts feeder 9, a transport rail 10, and a pick and place 11 as accessory devices.
[0010]
The chip LEDs 1 are put into the parts feeder 9, aligned front and back in a row, transported to the transport rail 10, and delivered from the transport rail 10 to the inspection device 12 one by one by the pick and place 11.
[0011]
The chip LED 1 to be inspected is shown in FIGS. 6 and 7 and has a rectangular shape (rectangular shape) in plan view with the light emitting portion 31 on the upper surface side and the electrode portion 6 on the lower surface side. In the embodiment, the chip LED 1 is an inspection object as a light emitting element, but the present invention is not limited to this.
[0012]
In the inspection apparatus 12, holding portions 14 that adsorb and hold the side surface of the chip LED 1 on the outer periphery of the rotating body 13 are arranged at eight equally spaced locations. As shown in FIG. 2, the holding portion 14 is provided with a vacuum hole 30 in the horizontal direction and directly sucks and holds the chip LED 1, and has a conveying system without an outer peripheral guide and a lower surface rail.
[0013]
The rotator 13 rotates intermittently, receives the chip LED 1 at the supply position 15, performs an inspection at the inspection position 16, and sends the inspected chip LED 1 to the discharge chute 18 at the discharge position 17. Classified according to results. The present invention is characterized by the configuration of the inspection position 16 of the inspection apparatus 12.
[0014]
FIG. 1 is a side view of the main part showing the details of the inspection position 16 of the inspection device 12. An inspection camera 19 as a light receiving means is disposed on the upper side of the holding portion 14 at the inspection position 16 toward the chip LED1. The inspection probes 4 and 5 are disposed below the holding portion 14. When the chip LED 1 is inverted to the holding unit 14 and the electrode unit 6 is held upward, the inspection probes 4 and 5 are positioned above the chip LED 1 and the inspection camera 19 is below the chip LED 1. Be placed.
[0015]
The inspection probes 4 and 5 are used as energization members that are energized in contact with the electrode portion 6 on the lower surface side of the chip LED 1. As a contact / separation moving mechanism of the inspection probes 4 and 5 with respect to the chip LED 1, a cylinder 20 is used as shown in FIG. Is placed upwards.
[0016]
In this embodiment, a sapphire glass 22 as a transparent contact member that contacts the upper surface side of the chip LED 1 exists between the inspection camera 19 and the chip LED 1. The sapphire glass 22 is optimal as a contact member because of its low refractive index and high hardness. However, in the present invention, the sapphire glass 22 has translucency and has a hardness capable of sandwiching the chip LED 1 with the inspection probes 4 and 5. Other materials may be used.
[0017]
The cylinder 23 is also used as a moving mechanism for moving the sapphire glass 22 toward and away from the chip LED 1. A sapphire glass 22 is suspended and held by using a suspending tool 25 on a slide member 24 that slides up and down in a cylinder 23. The suspending tool 25 has openings 26 and 27 so as not to block the light beam at the time of inspection.
[0018]
At the inspection position 16, while the movement of the holding member 14 is stopped, the inspection probes 4 and 5 are raised from the lower surface, the sapphire glass 22 is lowered from the upper surface, and the chip LED 1 held by the holding portion 14 by both of them. Inspection is performed in a state in which the element is sandwiched between the contact member and the current-carrying member (a dotted line portion in FIG. 2 indicates this state).
[0019]
Since the chip LED 1 is held between the inspection probes 4 and 5 and the sapphire glass 22 as described above, the chip LED 1 can be pressed even if the inspection probes 4 and 5 are pressed against the electrode portion 6 while the chip LED 1 is held on the side surface. Without being blown, it can be in a state in which current can be reliably supplied. That is, it is possible to surely inspect the chip LED 1 without strongly holding the side surface. The inspection is performed by energizing the inspection probes 4 and 5 and inspecting the emitted chip LED 1 with the inspection camera 19 through the sapphire glass 22.
[0020]
In this embodiment, the photoelectric conversion element inspection apparatus includes both a moving mechanism for moving the contact member to and from the element and a moving mechanism for moving the energizing member to and from the element. One moving mechanism is sufficient.
[0021]
FIG. 3 shows another embodiment in which only the inspection probes 4 and 5 that are current-carrying members are moved. A mounting surface made of sapphire glass 22 is formed on the rotating body 13, and the mounting surface is in an inverted state. The chip LED 1 is placed and sucked and held, and only the inspection probes 4 and 5 are advanced and retracted from above, so that the chip LED 1 is sandwiched between the inspection probes 4 and 5 and the sapphire glass 22.
[0022]
On the other hand, FIG. 4 shows another embodiment in which only the sapphire glass 22 that is a contact member is moved. A mounting surface having a current-carrying member 4 ′ is formed on the rotating body 13, and the mounting surface is in an upright state. The chip LED1 is mounted and sucked and held, and only the sapphire glass 22 is advanced and retracted from above, and the chip LED1 is sandwiched between the mounting surface having the current-carrying member 4 'and the sapphire glass 22. Of course, the positional relationship between the mounting surface having the energizing member 4 ′ and the sapphire glass 22 may be reversed.
[0023]
In any case, since the chip LED 1 is sandwiched and held between the mounting surface having the inspection probes 4 and 5 and the current-carrying member 4 ′ and the sapphire glass 22, the chip LED 1 is inspected while being held on the side surface. Even if the probes 4, 5, etc. are pressed against the electrode part 6, the chip LED 1 is not blown off, and it is possible to make it possible to reliably energize.
[0024]
Although not shown as another embodiment, as an embodiment corresponding to the third invention, contrary to the second invention, a light emitting means is provided on the upper surface side of a light receiving element (for example, a photodiode) having a light receiving portion on the upper surface. Even in the case of an inspection device that inspects the energized state by receiving light from the light emitting means, it is possible to perform inspection with the same configuration by replacing the inspection camera 19 with light emitting means such as an infrared light. It becomes.
[0025]
In the case of this inspection device, the side surface of the light receiving element is adsorbed and held, the chip LED 1 is sandwiched between the sapphire glass 22 on the upper surface side and the inspection probes 4 and 5 on the lower surface side, and the chip LED 1 is irradiated with infrared rays. In this way, it is inspected whether or not an energized state is established, and it is possible to reliably establish an energized state.
[0026]
【The invention's effect】
Since the present invention is configured and inspected as described above, it has become a safe and reliable photoelectric conversion element inspection apparatus capable of detecting a disconnection failure of an electrode portion without causing damage to the photoelectric conversion element.
[Brief description of the drawings]
FIG. 1 is a side view of an essential part showing a first embodiment of an inspection apparatus. FIG. 2 is an enlarged explanatory view of the same. FIG. 3 is an enlarged explanatory view of an essential part of a second embodiment. Enlarged explanatory diagram [Fig. 5] Planar explanatory diagram of the inspection apparatus [Fig. 6] An explanatory diagram showing a conventional inspection apparatus [Fig. 7] An explanatory diagram showing problems of the conventional inspection [Explanation of symbols]
1. . . . . Chip LED
2. . . . . 2. Substrate surface . . . . Suction nozzle 4,5. . . 5. Probe for inspection . . . . Electrode part 7. . . . . Disconnected portion 8. . . . . Substrate 9. . . . . Parts feeder10. . . . Transport rail 11. . . . Pick and place12. . . . Inspection device 13. . . . Rotating body 14. . . . Holding unit 15. . . . Supply position 16. . . . Inspection position 17. . . . Ejection position 18. . . . Discharge chute 19. . . . Inspection camera 20, 23. Cylinders 21, 24. Slide member 22. . . . Sapphire glass 25. . . . Suspension tool 26,27. Opening 30. . . . Vacuum hole 31. . . . Light emitting part

Claims (3)

In a photoelectric conversion element inspection method in which a current-carrying member is brought into contact with an electrode of a photoelectric conversion element having an electrode on the lower surface side and a light emitting portion or a light receiving portion on the upper surface side, the lower surface of the element whose side surface is held by suction A method for inspecting a photoelectric conversion element, comprising: bringing a current-carrying member into contact with the electrode on the side, contacting a translucent contact member on the upper surface side, and inspecting the element between the current-carrying member and the contact member. In a photoelectric conversion element inspection apparatus in which a photoelectric conversion element having an electrode on the lower surface side and a light emitting section on the upper surface side is energized, and the light from the light emission section is received by the light receiving means to inspect the light emission state. A holding means for sucking and holding; a translucent contact member that contacts the upper surface side of the element; and an energizing member that energizes by contacting the electrode on the lower surface side of the element, and at least one of the contact member and the energizing member An inspection apparatus for a photoelectric conversion element, comprising: a moving mechanism for contacting or separating one of the elements with respect to the element, and inspecting the element with the current-carrying member and the contact member sandwiched between the elements. In a photoelectric conversion element inspection apparatus that inspects the energization state by receiving light from the light emitting means on the light receiving portion of a photoelectric conversion element having an electrode on the lower surface side and a light receiving portion on the upper surface side, holding the side surface of the element by suction Means, a translucent contact member that contacts the upper surface side of the element, and an energization member that contacts the electrode on the lower surface side of the element, and at least one of the contact member and the energization member is attached to the element An inspection apparatus for a photoelectric conversion element, comprising a moving mechanism for contacting and separating, wherein the inspection is performed with an element sandwiched between an energizing member and a contact member.

Images