JP3703788B2 - Discharge method for capacitor parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for discharging a capacitor component.
[0002]
When a capacitor component is mounted on a printed wiring board together with other components (semiconductor chip, IC chip, etc.), if a closed circuit including the capacitor component and other components is formed, the capacitor component is charged in advance for some reason. In such a case, the charge energy may cause destruction of other parts through the pattern, and a countermeasure is desired.
[0003]
Here, “to mount” means to mount a component on a printed wiring board and perform soldering (including reflow in surface mounting). “Mounting” refers to mounting a surface-mounted component on a printed wiring board so that its terminals are in contact with a predetermined pattern on the printed wiring board, In the case of a component having a lead terminal, it means that the position of the component is determined in a state where the lead terminal is inserted into the hole of the printed wiring board.
[0004]
[Prior art]
Conventionally, as a capacitor component to be mounted on a printed wiring board by soldering, it is electrically connected to a component main body in which first and second electrodes in which a capacitance is generated is embedded, and to the first and second electrodes, respectively. A device having first and second terminals exposed to the outside of the component main body is known.
[0005]
An aluminum electrolytic capacitor in which aluminum is used as the material of the first and second electrodes and these are separated by an electrolyte can easily be increased in capacity. If a large-capacity aluminum electrolytic capacitor is shipped from a capacitor component manufacturer in a charged state, there is a risk of electric shock when the terminal is touched by mistake, and the manufacturer may discharge. This discharge is performed by connecting a load resistor between the first and second terminals. Further, when shipping from a capacitor component manufacturer, the first and second terminals of the aluminum electrolytic capacitor may be short-circuited with a wire or a short bar.
[0006]
As other capacitor parts, a sintered tantalum rod is used as an anode (first or second electrode), and the tantalum capacitor is immersed in an acidic electrolyte, or a dielectric that is interposed between the first and second electrodes. A ceramic capacitor using ceramic is known. Since these capacitor parts generally have a smaller capacity than aluminum electrolytic capacitors, the fact is that no consideration is given to the discharge.
[0007]
[Problems to be solved by the invention]
In recent years, the breakdown voltage of semiconductor components tends to decrease. In the background,
(1) Transition of the driving voltage of semiconductor components from 5V to 3.3V,
(2) Thinning of insulating film due to high integration of semiconductor parts,
(3) There is a gap miniaturization in an in-chip pattern or the like.
[0008]
If such a low breakdown voltage component is mounted on a printed wiring board together with a capacitor component that does not take discharge into consideration, a closed circuit including a low breakdown voltage component and a capacitor component is formed, and the low breakdown voltage component is destroyed. There is a fear.
[0009]
Therefore, an object of the present invention is to make it easy to discharge capacitor components. Other objects of the present invention will become clear from the following description.
[0010]
[Means for Solving the Problems]
According to the present invention, a method for discharging a capacitor component is provided. The capacitor component includes a component main body in which first and second electrodes in which capacitance is generated is built-in, and first and second terminals that are electrically connected to the first and second electrodes, respectively. . First, the capacitor component is mounted on the printed wiring board so that the first and second terminals are in contact with the first and second patterns formed independently of each other on the printed wiring board. Next, a discharge jig that contacts the first and second patterns to short-circuit the first and second patterns is mounted on the printed wiring board. A load component that forms a closed circuit with the capacitor component is mounted on the printed wiring board via the first and second patterns. Finally, the discharge jig is removed from the printed wiring board.
[0011]
According to another aspect of the invention, another method of discharging a capacitor component is provided. This method is applicable to the capacitor component defined as described above. First, capacitor parts are mounted on a printed wiring board having first and second patterns formed independently of each other and a dummy pattern for short-circuiting the first and second patterns, and the first and second terminals are respectively connected to the printed circuit board. Contact is made with the first and second patterns. Next, a load component that forms a closed circuit with the capacitor component is mounted on the printed wiring board via the first and second patterns. Then, the dummy pattern is cut.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0013]
First, prior to the description of the embodiment of the present invention, a process and a mechanism in which when a capacitor component is mounted or mounted on a printed wiring board together with other components, the other components are destroyed.
[0014]
FIG. 1 is a flow chart showing a process of other component destruction occurrence. Capacitor parts manufactured in step 101 are discharged to the assembly maker after receiving the discharge in the capacitor part maker in step 102 (step 103), or shipped to the assembly maker without being discharged (step 103). Step 104).
[0015]
Capacitor parts shipped without being discharged may cause other parts to be destroyed just after the part mounting step 105 in the assembly process of the assembly manufacturer (step 120). In some cases, the closed circuit including the above is not formed, and other components are destroyed through the subsequent soldering step 106 (step 120).
[0016]
Even capacitor parts shipped after being discharged may be destroyed by assembly manufacturers. That is, when the capacitor part is charged up (self-charge-up, static electricity, etc.) in step 107 and the capacitor part is charged, and no subsequent discharge is received in step 108, the component mounting step 109 or the soldering step Other parts are destroyed after 110 (step 120).
[0017]
The only condition that does not cause other components to be destroyed is that charge-up does not occur in step 107 or even if it occurs, it is discharged in step 108. In this case, there is no fear of destroying other components even after the component mounting step 111 and the soldering step 112 (step 113).
[0018]
Next, the mechanism of the destruction of other components will be described with reference to FIGS. 2A and 2B. As shown in FIG. 2A, when the capacitor component 204 and the other component 205 are mounted on the printed wiring board 203 having the conductor patterns 201 and 202 independent of each other, the capacitor component 204 and the other component 205 have the pattern 201 and 202 is in a semi-connected state.
[0019]
Even in the semi-connected state, a closed circuit including the capacitor component 204 and the other component 205 may be formed through the patterns 201 and 202. In this case, as shown in FIG. The current IA based on the charge charges in the capacitor component 204 flows to the other component 205, and the other component 205 may be destroyed.
[0020]
Even when the closed circuit is not formed in the half-connected state, the closed circuit may be formed by subsequent soldering, and the other component 205 may be destroyed.
[0021]
FIGS. 3A and 3B are a side view and a bottom view, respectively, showing the first embodiment of the capacitor component of the present invention. This capacitor component has a component body 6 in which a pair of counter electrodes 2 and 4 are built. A dielectric (not shown) is interposed between the electrodes 2 and 4, whereby a capacitance is generated between the electrodes 2 and 4.
[0022]
The component main body 6 has a substantially rectangular parallelepiped shape having an upper surface 6A and a bottom surface 6B, and is formed from, for example, a resin mold. Terminals 8 and 10 are formed with appropriate widths so as to cover both ends of the component body 6. The terminals 8 and 10 are electrically connected to the electrodes 2 and 4 inside the component main body 6, respectively. The terminals 8 and 10 are metal films, and the material thereof is preferably formed from a solder material in order to improve the solderability in surface mounting.
[0023]
This capacitor component is characterized by having a thin-film short-circuit member 12 on the bottom surface 6B of the component body. The short-circuit member 12 is made of a low melting point metal such as a solder material, and its melting temperature is set equal to or lower than the soldering temperature for surface mounting.
[0024]
The central portion 12A of the short-circuit member 12 is formed thin to facilitate cutting by heating. When the short-circuit member 12 is heated and melted, a tensile force acts on the central portion 12A due to the surface tension acting on the molten metal, and therefore the short-circuit member can be cut only by heating.
[0025]
The short-circuit member 12 having such a shape can be obtained, for example, by bringing the bottom surface 6B of the component main body 6 into contact with the molten liquid surface of the low melting point metal. Since the molten metal is hardly adapted to the component body 6 and is well adapted to the terminals 8 and 10, the short-circuit member 12 having a shape as shown in FIG. 3B is formed by the surface tension acting on the molten metal. Obtainable.
[0026]
On the upper surface 6A of the component body 6, a mark (not shown) for displaying the capacitance of the capacitor component and other matters may be printed. When this capacitor component is automatically mounted on the printed wiring board, the upper surface 6A of the component main body is positioned on the mounter machine head side, and the bottom surface 6B is positioned on the printed wiring board side.
[0027]
In the present embodiment, since the short-circuit member 12 electrically connects the terminals 8 and 10, the capacitor component is always discharged. Therefore, when this capacitor component is mounted or mounted on a printed wiring board together with other components, the other components are prevented from being destroyed by an overcurrent flowing in a closed circuit including the capacitor components and the other components.
[0028]
The reason why the short-circuit member 12 is formed in a thin film is to allow the capacitor component to be directly mounted on the printed wiring board during surface mounting. Desirably, the thickness of the short-circuit member 12 is set to be equal to or smaller than the protruding height of the terminals 8 and 10 from the bottom surface 6B of the component body.
[0029]
The cross-sectional area of the narrow central portion 12A of the short-circuit member 12 is set according to the capacitance of the capacitor component. In other words, this cross-sectional area is set large enough not to be cut in discharging the capacitor parts and small enough to be easily cut by heating during mounting.
[0030]
As the material of the short-circuit member 12, cream solder which is a mixture of powdered solder and flux material can be employed. In this case, comb solder of a predetermined shape can be easily applied onto the bottom surface 6B of the component body 6 by a normal printing technique.
[0031]
Still another material for the short-circuit member 12 is a conductive resin. Also by adopting a conductive resin, it is possible to easily create a short-circuit member having a predetermined shape.
[0032]
4A, 4B, and 4C are diagrams showing a process of mounting the capacitor component of FIG. As shown in FIG. 4A, patterns 16 and 18 to which both terminals of the capacitor component are to be connected are formed on the printed wiring board 14. First, cream solders 20 and 22 are applied to positions corresponding to both terminals of the capacitor parts on the patterns 16 and 18, respectively.
[0033]
Next, as shown in FIG. 4B, the capacitor component is mounted on the printed wiring board 14 so that the terminals 8 and 10 are in contact with the cream solders 20 and 22, respectively. At this time, the position of the capacitor component is determined to some extent by the adhesive strength of the cream solders 20 and 22, but when the adhesive strength is insufficient, the capacitor component is fixed to the printed wiring board 14 with an adhesive (not shown).
[0034]
The printed wiring board 14 on which the capacitor component is mounted is heated, for example, in a reflow furnace, and soldering is thereby performed. That is, at high temperature, the flux material of the cream solders 20 and 22 evaporates and the powder solder melts, and at the same time, the short-circuit member 12 also melts.
[0035]
FIG. 4C shows a state where the printed wiring board 14 is cooled to room temperature after the soldering is completed. The powder solder of the cream solder 20 and a part of the short-circuit member 12 are re-solidified to form a soldering portion 24, and the powder solder of the cream solder 22 and a part of the short-circuit member 12 are re-solidified to a soldering portion 26. It has become. Thereby, mechanical and electrical connection between the terminal 8 and the pattern 16 and between the terminal 10 and the pattern 18 is made.
[0036]
As described above, according to the present embodiment, since the capacitor component itself has a discharge function, other components are not destroyed, and the short-circuit member is heated by soldering when the capacitor component is mounted on the printed wiring board. Since it is disconnected, the mounting process is not complicated.
[0037]
FIGS. 5A and 5B are a side view and a bottom view, respectively, showing a second embodiment of the capacitor component of the present invention. This capacitor component is characterized in that a part thereof has a short-circuit member 28 that is melted and cut by heating.
[0038]
The short-circuit member 28 includes a trapezoidal metal thin film 30 that widens toward the both sides of the terminal 8 from a substantially central portion on the bottom surface 6 </ b> B of the component body 6, and another metal formed at a position symmetrical to the metal thin film 30. It consists of a thin film 32 and a cream solder film 34 provided between the metal thin films 30 and 32.
[0039]
The short-circuit member 28 is formed on a thin film on the bottom surface 6B of the component body, and electrically connects the terminals 8 and 10.
[0040]
According to this configuration, since the capacitor component is always discharged by the short-circuit member 28, it is avoided that the other component is destroyed when the capacitor component is mounted or mounted on the printed wiring board together with the other component. Further, by increasing the surface activity of the metal thin films 30 and 32 for soldering, the solder component of the cream solder film 34 is on the metal thin films 30 and 32 when soldering the capacitor component on the printed wiring board. Therefore, the electrical connection between the terminals 8 and 10 is cut off, and a predetermined capacitance can be generated between the terminals 8 and 10.
[0041]
FIGS. 6A and 6B are a side view and a bottom view, respectively, showing a third embodiment of the capacitor component of the present invention. The electrodes 2 and 4 that cause the capacitance are built in a component body 36 having a substantially cylindrical shape.
[0042]
Lead terminals 38 and 40 are provided on the bottom surface of the component body 36 so as to protrude. Lead terminals 38 and 40 are electrically connected to electrodes 2 and 4, respectively. The lead terminals 38 and 40 are inserted into insertion holes formed in a printed wiring board, for example, and used for soldering.
[0043]
A short-circuit member 42 is provided in the vicinity of the component main body 36 of the lead terminals 38 and 40, so that the lead terminals 38 and 40 can be connected to perform discharge at all times.
[0044]
The reason why the short-circuit member 42 is provided in the vicinity of the component main body 36 is to secure the length of the protruding portions of the lead terminals 38 and 40 necessary for mounting the capacitor component on the printed wiring board. The distance between the short-circuit member 42 and the bottom surface of the component main body 36 determines the mounting height when the capacitor component is mounted on the printed wiring board.
[0045]
The short-circuit member 42 is made of a low melting point metal such as solder, and the melting temperature thereof is set equal to or lower than the temperature of soldering the capacitor component to the printed wiring board.
[0046]
For example, the short-circuit member 42 has a shape such that the central portion thereof is thinned so as to be melted and cut only by being heated.
[0047]
FIGS. 7A, 7B and 7C are views showing a mounting process of the capacitor component shown in FIGS. 6A and 6B.
[0048]
As shown in FIG. 7A, independent patterns 44 and 46 to which the lead terminals 38 and 40 are to be connected are formed on the lower surface of the printed wiring board 14, respectively. The printed wiring board 14 has insertion holes 48 and 50 corresponding to the lead terminals 38 and 40, respectively.
[0049]
The pattern 44 is connected to a circular pad 54 formed on the upper surface of the printed wiring board 14 via a pattern 52 formed on the wall surface of the insertion hole 48, and the pattern 46 is formed on the wall surface of the insertion hole 50. It is also connected to a circular pad 58 via a pattern 56.
[0050]
As shown in FIG. 7B, the lead terminals 38 and 40 are inserted into the insertion holes 48 and 50, respectively, until the short-circuit member 42 contacts the pads 54 and 58, and the capacitor component is mounted on the printed wiring board 14. .
[0051]
In this state, an appropriate flux material (not shown) is applied to a portion to be soldered, and the lower surface of the printed wiring board 14 is brought into contact with the liquid surface of the molten solder in a molten solder bath (not shown). Soldering to the patterns 44 and 46 is performed.
[0052]
FIG. 7C shows a state in which the printed wiring board 14 that has been soldered is cooled to room temperature. Reference numeral 60 denotes a soldered portion between the lead terminal 38 and the pattern 44, and reference numeral 62 denotes a soldered portion between the lead terminal 40 and the pattern 46. Reference numerals 64 and 66 denote a part of the short-circuit member resolidified on the pads 54 and 58, respectively.
[0053]
At the time of soldering, the heat of the molten solder is transmitted to the short-circuit member 42 via the lead terminals 38 and 40 and the like, so that the short-circuit member 42 is melted and the portion corresponding to the pad 54 and the portion corresponding to the pad 58 by the surface tension. Is separated.
[0054]
Depending on the heating conditions, the portion indicated by reference numeral 60 (62) and the portion indicated by reference numeral 64 (66) may be integrated in the insertion hole 48 (50). It does not affect the mounting at all, but is preferable for increasing the mechanical strength.
[0055]
FIG. 8 is a perspective view of the mounter machine head of the present invention. This mounter machine head can be used when surface mounting a capacitor component having no discharge function, for example, a capacitor component excluding the short-circuit member 12 from the configuration shown in FIG.
[0056]
This mounter machine head includes a substantially cylindrical vacuum head 68 having an opening end 68A, and a conductive pad 70 made of metal or the like provided at the opening end 68A of the vacuum head.
[0057]
The vacuum head 68 is given a negative pressure for sucking and adsorbing the capacitor components by a vacuum pump (not shown) that is operatively connected to the opposite side of the opening end 68A via a flexible tube (not shown). .
[0058]
The conductive pad 70 is integrally formed of a flange portion 70A having a through hole into which the opening end 68A of the vacuum head 68 is inserted and fixed, and a pair of arm portions 70B and 70C protruding on opposite sides of the flange portion 70A. ing.
[0059]
The lower surface of the conductive pad 70 is flat, and the inner diameter of the open end 68A of the vacuum head 68 is smaller than the width and length of the chip component. Therefore, when the vacuum head 68 has a negative pressure and the capacitor component is sucked and adsorbed to the mounter machine head, the conductive pad arms 70B and 70C are brought into contact with the capacitor component terminals 8 and 10, respectively. Parts can be discharged.
[0060]
A mounter machine to which this mounter machine head is applied is an XY table on which a printed wiring board on which a capacitor component is to be surface-mounted can be placed at a predetermined position, and the mounter machine head is moved in three axis directions of XYZ. And a controller for controlling the XY table and the robot arm according to a program.
[0061]
When a capacitor component is mounted on a printed wiring board using this mounter machine head, the capacitor component has already been discharged as described above prior to its operation. Parts are prevented from breaking.
[0062]
FIGS. 9A and 9B are front views of other mounter machine heads of the present invention.
[0063]
The mounter machine head shown in FIG. 9A is characterized in that a conductive pad 70 ′ provided at the opening end 68 (A) of the vacuum head 68 is formed of an elastic body. As the elastic body, conductive rubber or conductive resin can be used.
[0064]
Adoption of the conductive pad 70 'made of an elastic body makes it easy to suck and suck capacitor parts having irregularities, and sucks and sucks capacitor parts to a mounter machine head or mounts them on a printed wiring board. At this time, the impact generated on the mounter machine head, the capacitor component, and the printed wiring board can be reduced.
[0065]
As shown in FIG. 9B, a conductive pad 70 ″ having a structure in which a portion 72 made of metal and a portion 74 made of a conductive elastic body are laminated can also be used. As described above, by forming at least a portion of the conductive pad that contacts the terminal pair of the capacitor component from the elastic body, the impact can be minimized.
[0066]
The capacitor component discharging method of the present invention can be applied to a capacitor component that does not have a discharge function, as in the embodiment of FIG. Specifically, it is as follows.
[0067]
FIGS. 10A, 10B and 10C are views showing a first embodiment of the discharging method of the present invention for capacitor parts.
[0068]
As shown in FIG. 10A, patterns 16 and 18 are formed on the printed wiring board 14 independently of each other. The printed wiring board 14 has a tongue piece portion 14A protruding from the edge thereof.
[0069]
The pattern 16 includes a pad portion 16A to be connected to the capacitor component, a component 16B to be connected to another component such as an IC chip, and a contact portion 16C extending on the tongue piece portion 14A of the printed wiring board. Including. The pattern 18 includes pad portions 18A and 18B and a contact portion 18C corresponding to the pattern portions 16A and 16B and the contact portion 16C, respectively.
[0070]
First, as shown in FIG. 10A, a capacitor component 78 having a component body 6 and terminals 8 and 10 is mounted on the printed wiring board 14. The terminals 8 and 10 of the capacitor component 78 are in contact with the pad portions 16A and 18A via cream solder (not shown), respectively, whereby the position of the capacitor component 78 is maintained.
[0071]
Next, as shown in FIG. 10B, the discharge jig 80 is attached to the tongue piece portion 14 </ b> A of the printed wiring board 14. The discharge jig 80 has a groove for accommodating the tongue piece 14A, and a probe pin 82 made of a substantially C-shaped conductor is provided at the back of the groove.
[0072]
When the discharge jig 80 is attached to the tongue piece portion 14A, both ends of the probe pin 82 come into contact with the contact portions 16C and 18C of the patterns 16 and 18, and the patterns 16 and 18 are short-circuited. As a result, a closed circuit composed of the capacitor component 78, the patterns 16 and 18, and the probe pin 82 is formed, and the capacitor component 78 is discharged.
[0073]
Subsequently, as shown in FIG. 10C, a load component 84 such as an IC chip is mounted on the printed wiring board 14. At this time, a closed circuit composed of the load component 84, the patterns 16 and 18, and the capacitor component 78 is formed. However, since the capacitor component 78 has already been discharged, there is no possibility that the load component 84 is destroyed.
[0074]
After the capacitor component 78 and the load component 84 are mounted on the printed wiring board 14, the printed wiring board 14 is placed in a reflow furnace, and soldering is performed. When soldering is performed with the discharge jig 80 mounted on the printed wiring board 14, the discharge jig 80 is required to have good heat resistance.
[0075]
Soldering may be performed after the discharge jig 80 is removed.
Alternatively, the capacitor component 78 may be mounted on the printed wiring board 14 after the discharge jig 80 is mounted on the printed wiring board 14.
[0076]
The printed wiring board unit is completed by removing the discharge jig after mounting or mounting the capacitor parts 78, the load parts 84, and other necessary parts (not shown) on the printed wiring board 14. The tongue piece 14A can be used for connector connection when the unit is put to practical use.
[0077]
Since the breakdown voltage of a semiconductor component such as an IC chip is generally low, the discharge method of the present invention is effective when a semiconductor component is used as a load component.
[0078]
FIGS. 11A, 11B, and 11C are views for explaining a second embodiment of the discharge method of the present invention for capacitor parts.
[0079]
This discharge method is characterized in that a dummy pattern is formed on the printed wiring board 14 as shown in FIG.
[0080]
The dummy pattern 86 is for short-circuiting the patterns 16 and 18, and is provided, for example, in the vicinity of the tongue piece portion 14A of the printed wiring board 14. In this embodiment, the dummy pattern 86 is a copper thin film formed by the same process as the patterns 16 and 18.
[0081]
First, as shown in FIG. 11B, the capacitor component 78 is mounted on the printed wiring board 14, and the terminals 8 and 10 of the capacitor component 78 are brought into contact with the pad portions 16A and 18A, respectively. Thus, a closed circuit including the capacitor component 78, the patterns 16 and 18, and the dummy pattern 86 is formed, and the capacitor component 78 is discharged.
[0082]
Subsequently, after mounting a load component 84 such as an IC chip on the printed wiring board 14 and soldering the capacitor component 78 and the load component 84, a dummy pattern 86 is formed as shown in FIG. Cut at its central part and separate into two parts 86A and 86B.
[0083]
As described above, according to the present embodiment, the capacitor component can be easily discharged.
[0084]
(A), (B), and (C) of FIG. 12 are diagrams showing other examples of dummy patterns.
[0085]
In the example shown in FIG. 12A, the dummy pattern 86 is directly connected to the pads 16A and 18A corresponding to the position where the capacitor component is mounted. By providing such a dummy pattern in all capacitor component mounting portions, it is possible to completely prevent other components from being destroyed.
[0086]
The dummy pattern 86 shown in FIG. 12B is characterized in that it is made of a low-melting-point metal such as solder and has a thin central portion. The dummy pattern 86 also directly connects the pads 16A and 18A.
[0087]
When the capacitor component is mounted, the dummy pattern 86 is discharged, and when the printed wiring board 14 is heated during soldering, the dummy pattern 86 melts and is cut at the center thereof, so that the dummy pattern is formed from a copper thin film. Manufacturing workability is improved as compared with the case where it is performed.
[0088]
The example shown in FIG. 12C is for a dummy pattern suitable for mounting a capacitor component having a lead terminal. The dummy pattern 86 connects between the pad 16A ′ and the pad 18A ′ formed so as to be adapted to the lead terminal.
[0089]
Thus, the discharge method of the present invention can be applied not only to surface mount capacitor parts but also to capacitor parts having lead terminals.
[0090]
In the present invention, the discharge current can be set to an appropriate value by making the means (short-circuit member, conductive pad and dummy pattern) for short-circuiting the terminals of the capacitor component have a certain resistance value. The destruction of the capacitor component itself due to overcurrent can be prevented.
[0091]
The present invention is particularly effective for relatively low-capacity tantalum capacitors and ceramic capacitors, for which discharge has not been considered at all in the past, but of course can also be applied to aluminum electrolytic capacitors suitable for large capacity. is there.
[0092]
The present invention includes the following supplementary notes.
[0093]
(Additional remark 1) It has the component main body in which the 1st and 2nd electrode which a capacitance produces in the meantime is incorporated, and the 1st and 2nd terminal electrically connected to the said 1st and 2nd electrode, respectively A method for discharging a capacitor component comprising:
(A) mounting the capacitor component on the printed wiring board so that the first and second terminals are in contact with first and second patterns formed independently of each other on the printed wiring board; ,
(B) mounting a discharge jig on the printed wiring board that contacts the first and second patterns to short-circuit the first and second patterns;
(C) mounting a load component that forms a closed circuit with the capacitor component via the first and second patterns on the printed wiring board;
(D) A method of discharging a capacitor component comprising the step of removing the discharge jig from the printed wiring board.
[0094]
(Supplementary note 2) The capacitor component discharging method according to supplementary note 1, wherein the load component is a semiconductor chip.
[0095]
(Additional remark 3) The said printed wiring board has a tongue piece part which protrudes from the edge,
The first and second patterns extend to the tongue piece,
The method of discharging a capacitor component according to appendix 1, wherein the discharge jig is attached to the tongue piece.
[0096]
(Supplementary Note 4) A component main body in which first and second electrodes in which capacitance is generated is built-in, and first and second terminals electrically connected to the first and second electrodes, respectively. A method for discharging a capacitor component comprising:
(A) mounting the capacitor component on a printed wiring board having first and second patterns formed independently of each other and a dummy pattern for short-circuiting the first and second patterns; Contacting each of the terminals with the first and second patterns, respectively,
(B) mounting a load component that forms a closed circuit together with the capacitor component on the printed wiring board via the first and second patterns;
(C) A method of discharging a capacitor component comprising the step of cutting the dummy pattern.
[0097]
(Supplementary Note 5) The dummy pattern includes a portion made of a low melting point metal,
The method of discharging a capacitor component according to appendix 4, wherein the dummy pattern is cut by melting the low melting point metal by heating.
[0098]
(Appendix 6) The dummy pattern is made of a low melting point metal,
5. The method of discharging a capacitor component according to appendix 4, wherein the dummy pattern is formed so that a central portion thereof is narrowed.
[0099]
(Additional remark 7) The said dummy pattern is the discharge method of the capacitor components of Additional remark 4 which consists of cream solder which is a mixture of powdery solder and a flux material.
[0100]
(Supplementary note 8) The capacitor component discharging method according to supplementary note 4, wherein the dummy pattern is connected to the first and second patterns in the vicinity of a position where the capacitor component is to be mounted.
[0101]
(Supplementary note 9) The capacitor component discharging method according to supplementary note 4, wherein the load component is a semiconductor chip.
[0102]
【The invention's effect】
As described above, according to the present invention, there is an effect that the capacitor component can be easily discharged. That is, according to the present invention, a simple discharge method for capacitor components is provided.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a process of occurrence of destruction of other parts.
FIG. 2 is an explanatory diagram of a mechanism of occurrence of destruction of other parts.
FIG. 3 is a diagram showing a first embodiment of a capacitor component of the present invention.
4 is a diagram showing a mounting process of the capacitor component of FIG. 3; FIG.
FIG. 5 is a diagram showing a second embodiment of the capacitor component of the present invention.
FIG. 6 is a view showing a third embodiment of the capacitor component of the present invention.
7 is a diagram showing a mounting process of the capacitor component of FIG. 6; FIG.
FIG. 8 is a perspective view showing an embodiment of a mounter machine head of the present invention.
FIG. 9 is a front view showing another embodiment of the mounter machine head of the present invention.
FIG. 10 is an explanatory diagram of a first embodiment of a discharging method of the present invention for capacitor parts.
FIG. 11 is an explanatory diagram of a second embodiment of the discharging method of the present invention for capacitor parts.
FIG. 12 is a diagram showing another example of a dummy pattern.
[Explanation of symbols]
2,4 electrodes
6,36 parts body
8,10 terminals
12, 28, 42 Short-circuit member
38, 40 Lead terminal
68 Vacuum Head
70, 70 ', 70 "conductive pad
78 Capacitor parts
80 Discharge jig
84 Load parts
86 Dummy pattern

Claims (9)

A capacitor component including a component main body in which first and second electrodes in which a capacitance is generated is incorporated, and first and second terminals electrically connected to the first and second electrodes, respectively. A discharge method,
(A) mounting the capacitor component on the printed wiring board so that the first and second terminals are in contact with first and second patterns formed independently of each other on the printed wiring board; ,
(B) mounting a discharge jig on the printed wiring board that contacts the first and second patterns to short-circuit the first and second patterns;
(C) mounting a load component that forms a closed circuit with the capacitor component via the first and second patterns on the printed wiring board;
(D) A method of discharging a capacitor component comprising the step of removing the discharge jig from the printed wiring board. 2. The method of discharging a capacitor component according to claim 1, wherein the load component is a semiconductor chip. The printed wiring board has a tongue portion protruding from the edge thereof,
The first and second patterns extend to the tongue piece,
The method of discharging a capacitor component according to claim 1, wherein the discharge jig is attached to the tongue piece. A capacitor component including a component main body in which first and second electrodes in which a capacitance is generated is incorporated, and first and second terminals electrically connected to the first and second electrodes, respectively. A discharge method,
(A) mounting the capacitor component on a printed wiring board having first and second patterns formed independently of each other and a dummy pattern for short-circuiting the first and second patterns; Contacting each of the terminals with the first and second patterns, respectively,
(B) mounting a load component that forms a closed circuit together with the capacitor component on the printed wiring board via the first and second patterns;
(C) A method of discharging a capacitor component comprising the step of cutting the dummy pattern. The dummy pattern includes a portion made of a low melting point metal,
5. The method of discharging a capacitor component according to claim 4, wherein the dummy pattern is cut by melting the low melting point metal by heating. The dummy pattern is made of a low melting point metal,
5. The method of discharging a capacitor component according to claim 4, wherein the dummy pattern is formed so that a central portion thereof is narrowed. 5. The method of discharging a capacitor component according to claim 4, wherein the dummy pattern is made of cream solder which is a mixture of powdered solder and a flux material. 5. The method of discharging a capacitor component according to claim 4, wherein the dummy pattern is connected to the first and second patterns in the vicinity of a position where the capacitor component is to be mounted. 5. The method of discharging a capacitor component according to claim 4, wherein the load component is a semiconductor chip.

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