JP3686115B2 - Substrate surface treatment equipment - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a substrate surface treatment apparatus used for surface treatment of a substrate such as a semiconductor wafer or a glass substrate in a semiconductor device manufacturing process, a liquid crystal display device manufacturing process, or the like.
[0002]
[Prior art]
Substrate surface treatment apparatus, for example, a semiconductor device that applies a photoresist solution to the surface of a semiconductor wafer to deposit and form a photoresist film, and exposes and develops the photoresist film formed on the surface of the semiconductor wafer In a manufacturing apparatus, it is required to keep the surrounding environment where processing is performed clean and in a constant state. For this reason, these devices are provided in a so-called clean room that is air-conditioned under a predetermined condition. However, a more strictly controlled environment may be required. In such a case, for example, as shown in FIGS. 5A and 5B, a schematic plan view and a schematic front view, respectively, a substrate processing unit 1 provided with a rotation processing device such as a spin coater or a spin developer. An indexer unit 2 which is disposed adjacent to the substrate processing unit 1 and carries an unprocessed substrate into the substrate processing unit 1 and receives a processed substrate from the substrate processing unit 1; a substrate processing unit 1 and an exposure device 4; A clean bench 5 is interposed between the substrate processing unit 1 and the interface unit 3 for transferring the substrate between the substrate processing unit 1 and the exposure unit 4 so as to cover the entire upper space. Arranged. Then, clean air (clean air) is blown downward from the clean bench 5 to the substrate processing unit 1, the indexer unit 2 and the interface unit 3, respectively, and the substrate surface treatment is performed by this downflow. The surrounding environment where transfer, temporary storage, and transportation are performed is maintained in a clean and constant state.
[0003]
As shown in FIG. 5, in an apparatus in which the interface unit 3 is provided adjacent to the substrate processing unit 1 provided with the spinner and the substrate processing unit 1 and the exposure machine 4 are inlined, the exposure stage of the exposure machine 4 When the maintenance of the light source, electrical parts, etc. is performed, the work is often performed from the substrate transfer surface side (the surface facing the substrate processing unit 1). For this reason, a two-dot chain line in FIG. As shown, the interface unit 3 can be moved to the front side (or rear side) in the direction orthogonal to the inline direction .
[0004]
[Problems to be solved by the invention]
However, in the conventional apparatus, the clean bench 5 is fixed above them so as to cover the entire substrate processing unit 1, the indexer unit 2 and the interface unit 3. Therefore, when moving the interface unit 3 for maintenance of the exposure apparatus 4, i is the interface section 3 above not supplied with down flow from the clean bench 5, clean the surrounding environment is constant state There is a concern that it will not be kept. At the time of maintenance of the exposure apparatus 4, even when retracted to move the interface section 3, are preventing maintenance clean bench 5 is in the way, there is a problem that.
[0005]
The present invention is intended has been made in view of the circumstances as described above, in the apparatus in-line arrangement of the substrates processing section interposed an interface portion between the two kinds of substrate processing unit, the interface unit when so moved performing maintenance of the device is also, along with the surrounding environment of the interface unit to be kept clean in and constant, surface treatment of the substrate blowing portion of the clean air is never such hinder maintenance work An object is to provide an apparatus.
[0006]
[Means for Solving the Problems]
In the invention according to claim 1, divides the error Ah blowoff unit, part of the divided air blowing portion is configured to be able to move together with the interface unit. That is, according to the first aspect of the present invention, a first substrate processing unit that performs surface processing on a substrate and a second substrate processing unit that performs surface processing different from the surface processing in the first substrate processing unit on the substrate. And between the first substrate processing unit and the second substrate processing unit so as to be adjacent to the respective substrate processing units, and between the first substrate processing unit and the second substrate processing unit An interface unit that delivers the substrate between the first substrate processing unit and the interface unit, and is arranged to cover the upper space of the first substrate processing unit and the interface unit, and blows clean air downward to the first substrate processing unit and the interface unit In the substrate surface treatment apparatus provided with the blowing unit, the interface blowing unit for blowing clean air to the interface unit is made independent from other parts, and the interface unit is Each of the first and second substrate processing units can be moved between a normal operation position where substrate surface treatment is performed and a retreat position during maintenance, and the interface blowing unit is moved integrally with the interface unit. It is characterized by providing a moving means that can be used.
[0008]
[Action]
In the substrate surface processing apparatus according to the first aspect of the present invention, as shown in FIGS. 4A and 4B, a schematic plan view and a schematic front view, respectively, a first substrate processing unit (substrate processing unit) 1 and An air blowing part (clean bench) arranged so as to cover the upper space of the interface part 3 is directed downward with respect to the interface part 3 and the part 6 for blowing clean air downward with respect to the first substrate processing part 1. It is divided into an interface blowing unit 7 for blowing out clean air, and the interface blowing unit 7 is independent from other parts 6, and during the maintenance of the second substrate processing unit (exposure machine) 4, FIG. When the interface unit 3 is moved to the retracted position by the moving means as shown by a two-dot chain line in FIG. Moves together. Therefore, even during maintenance, clean air is blown downward from the interface blowing portion 7 to the interface portion 3, and the surrounding environment is kept clean and constant. Further, since the interface blowing unit 7 moves to the retracted position together with the interface unit 3, the air blowing unit does not hinder the work during the maintenance of the second substrate processing unit 3.
[0010]
【Example】
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0011]
FIGS. 1 to 3 show an embodiment of the present invention. FIG. 1 is a schematic plan view of a substrate surface processing apparatus in which a substrate processing unit provided with a rotation processing unit and an exposure machine are configured in-line. 2 is a schematic front view thereof, and FIG. 3 is a front view showing a part (interface portion) of the apparatus. However, FIG. 1 shows a state in which the clean bench has been removed, and FIG. 3 shows a state in which the front door of the interface unit is opened, and the illustration of the clean bench above the interface unit is omitted. ing.
[0012]
This substrate surface processing apparatus is disposed adjacent to one side of the substrate processing unit 10, which includes a spin coater 18, a spin developer 20, a hot plate 22, a cooling plate 24, a transfer robot 25, and the like. Then, the unprocessed substrate is carried into the substrate processing unit 10, the indexer unit 12 that receives the processed substrate from the substrate processing unit 10, and the interface unit 14 disposed adjacent to the other side surface of the substrate processing unit 10. In addition, the substrate processing unit 10 includes an exposure machine 16 that performs exposure and printing processes on a substrate having a photoresist film deposited on the surface thereof. The substrate processing unit 10, the indexer unit 12, and the interface unit 14 are configured to be continuous and integrated with each other. The exposure unit 16 is adjacent to the interface unit 14 on the interface unit 14 side of the substrate processing unit 10. The substrate is transferred between the substrate processing unit 10 and the exposure device 16 via the interface unit 14. A plurality of hot plates 22 and cooling plates 24 are stacked in the vertical direction. Further, the substrate surface processing step in the substrate processing unit 10 and the operations such as transfer and temporary storage of the substrate in the indexer unit 12 and the interface unit 14 are not related to the gist of the present invention, and thus detailed description thereof is omitted. To do.
[0013]
In this apparatus, a clean bench 26 is disposed so as to cover the upper space of the substrate processing unit 10 and the indexer unit 12, and a clean bench 28 dedicated to the indexer unit is disposed so as to cover the upper space of the interface unit 14. It is installed. Both clean benches 26 and 28 are independent of each other, and one clean bench 26 is supported on the substrate processing unit 10 and the indexer unit 12 by a support 30 fixed to the upper surface of the substrate processing unit 10, and the other clean bench 26 The bench 28 is supported on the interface unit 14 by a column 32 fixed to the upper surface of the interface unit 14. Then, clean air is blown downward from one clean bench 26 to the substrate processing unit 10 and the indexer unit 12, and clean air is blown downward from the other clean bench 28 to the interface unit 14, Each surrounding environment is kept clean and constant. The blower fans may be individually provided on each of the clean benches 26 and 28, or the blower fan is provided only on one of the clean benches 26, and the one clean bench 26 is passed through a duct or the like. A part of the clean air may be introduced into the other clean bench 28.
[0014]
The interface unit 14 is connected to the substrate processing unit 10 so as to be movable in the front-rear direction. That is, as shown in FIG. 3, casters 34 are attached to the lower surface of the interface unit 14, and a plurality of substrate processing units 10 and interface units 14 are attached to the substrate processing unit 10 side. They are connected to each other via a grooved roller 36 and a guide bar 38 that is attached to the interface portion 14 and engaged with the grooved roller 36. The interface unit 14 can be pulled forward from the position during steady operation shown by the solid line in FIG. 1 and moved to the retracted position during maintenance as shown by the broken line in FIG. Yes. Further, when the interface unit 14 is pushed backward from the retracted position for maintenance and returned to the position for steady operation, the interface unit 14 is accurately positioned and fixed with respect to the substrate processing unit 10 in the front-rear direction. A screw-in type positioning pin 40 that is locked to a locking portion 42 provided on the substrate processing unit 10 side is attached to the portion 14. The entire apparatus shown in FIGS. 1 and 2 is installed in a so-called clean room.
[0015]
In this apparatus having the above-described configuration, when the interface unit 14 is pulled out to the front retracted position during maintenance of the exposure machine 16, the clean bench 28 supported on the interface unit 14 is also integrated with the interface unit 14. Moving. Accordingly, the clean bench 28 does not interfere with the maintenance work, and clean air is blown downward from the clean bench 28 to the interface unit 14 during the maintenance work, and the interface is generated by the downflow. The surrounding environment of the part 14 is maintained in a certain clean state. Each device or interface unit 14 in the substrate processing unit 10 has side walls 44 on the four side surfaces thereof, and clean air sent from the clean benches 26 and 28 to the inside of each device is surrounded by the side walls 44. It flows downward in the space. In addition, since the transfer robot 25 delivers the substrate to and from each device, a slit-like opening (not shown) for taking in and out the substrate is formed on the side wall 44 on the transfer robot 25 side.
[0016]
In the apparatus having the above-described configuration, the interface unit 14 can be moved for maintenance of the exposure machine 16, and the clean bench 28 is moved integrally with the interface unit 14, but the maintenance of the substrate processing unit, etc. Therefore, the indexer unit can also be moved, and the clean bench that supplies clean air to the indexer unit can be made independent of the other parts, and the clean bench can move integrally with the indexer unit. .
[0017]
Note that the mechanism for movably connecting the interface unit to the substrate processing unit is not limited to a combination of a plurality of grooved rollers and guide rods as in the above-described embodiment, but various mechanisms can be used. Can be adopted. In addition, the configuration that enables the clean bench to be moved integrally with the interface unit is not limited to the configuration in which the clean bench is supported via a support on the interface unit as in the above-described embodiment. Is separated from the interface part, and the clean bench is supported on the floor so as to cover the space above the interface part with a support with casters, and when the interface part is moved for maintenance, a part of it is used as the support of the clean bench. It is good also as a structure which engages and a clean bench moves with an interface part .
[0018]
In the above-described embodiments, the substrate surface processing apparatus is exemplified by an in-line substrate processing unit provided with a spin coater and a spin developer and an exposure machine. However, as a type of substrate surface processing, a photoresist is used. The present invention is not limited to processing such as coating, exposure, and development, and may be, for example, a substrate heat treatment furnace, and the present invention can be applied to a substrate surface processing apparatus that performs various processing.
[0019]
【The invention's effect】
According to the first aspect of the present invention, in the apparatus in which the interface unit is interposed between the two types of substrate processing units and the both substrate processing units are configured in-line, the interface unit is retracted at the time of maintenance of the substrate processing unit. A substrate surface treatment device that keeps the environment around the interface clean and constant by blowing clean air, and does not obstruct maintenance work by blowing clean air. Can be provided.
[Brief description of the drawings]
1 is a schematic plan view showing a state in which a clean bench is removed from a substrate surface processing apparatus in which a substrate processing unit provided with a spinner and an exposure machine are configured in-line, showing an embodiment of the invention according to claim 1; FIG.
FIG. 2 is a schematic front view of the apparatus shown in FIG.
FIG. 3 is an enlarged front view showing a part (interface unit) of the apparatus shown in FIG. 1;
4A and 4B are diagrams for explaining the operation of the invention according to claim 1, wherein FIG. 4A is a schematic plan view, and FIG. 4B is a schematic front view.
5A and 5B show an example of the configuration of a conventional substrate surface treatment apparatus, where FIG. 5A is a schematic plan view, and FIG. 5B is a schematic front view.
[Explanation of symbols]
1, 10 Substrate processing unit 2, 12 Indexer unit 3, 14 Interface unit 4, 16 Exposure machine 6, 26 Clean bench 7, 28 for blowing clean air to substrate processing unit and indexer unit Clean air is supplied to interface unit Clean benches 30 and 32 to be blown out Posts 34 Casters 36 Rolled rollers 38 Guide bars 40 Screw-in positioning pins

Claims (1)

A first substrate processing unit for surface-treating the substrate;
A second substrate processing unit for applying a surface treatment to the substrate different from the surface treatment in the first substrate processing unit;
Between the first substrate processing unit and the second substrate processing unit, the first substrate processing unit is interposed between the first substrate processing unit and the second substrate processing unit. An interface section for delivering the board;
Surface treatment of a substrate provided with an air blowing unit that is disposed so as to cover the upper space of the first substrate processing unit and the interface unit and blows clean air downward with respect to the first substrate processing unit and the interface unit In the device
The air blowing part is divided so that the interface blowing part for blowing clean air to the interface part is made independent of the other parts, and the interface part is formed in each of the first and second substrate processing parts. It is possible to move between a position at the time of steady operation where the surface treatment is performed and a retreat position at the time of maintenance, and a moving means is provided to move the interface blowing part integrally with the interface part. Substrate surface treatment equipment.

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