JP3460909B2 - Substrate processing system - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a series of processes (for example, resist coating process) on a thin plate-like substrate (hereinafter referred to as "substrate") such as a semiconductor substrate or a liquid crystal glass substrate.
The present invention relates to a substrate processing system in which a plurality of substrate processing apparatuses for performing exposure processing, development processing, etc. are arranged.

[0002]

2. Description of the Related Art As is well known, various surface treatments such as resist coating, exposure and development are performed on the above substrate. Generally, these processes are performed by a substrate processing apparatus including a processing unit for performing processing such as resist coating processing and development processing, an exposure processing unit for performing exposure processing, and an interface connecting the two units. .

FIG. 9 is a plan view showing the structure of a conventional substrate processing apparatus 200. The substrate processing apparatus 200 includes an exposure processing unit STP, an interface IF2, and a processing unit 201. Note that an XYZ orthogonal coordinate system is attached to FIG. 9 for ease of explanation.

The exposure processing unit STP is a unit for performing exposure processing on a substrate on which a resist has been applied, and is integrally formed with an exposure device and a robot for loading and unloading the substrate. Further, the exposure processing unit STP includes a controller rack CO that accommodates a control controller that controls the exposure processing, an operation rack OP that accommodates an operation panel, and an excimer laser oscillator that emits excimer laser light that is an exposure light source. It is connected to LA.

The processing unit 201 is a unit for processing a substrate before and after exposure.
In 01, resist coating processing, developing processing, heat treatment, etc. are performed. The processing unit 201 includes a processing section column 230, a processing section column 240, and an indexer ID. The indexer ID is a processing device that carries out and carries in a substrate. The indexer ID includes a substrate transfer device 225, and a carrier 220 capable of accommodating substrates in multiple stages is detachably mounted. The substrate transfer device 225 is movable not only in the Y-axis direction in the drawing but also in the Z-axis direction, takes out the unprocessed substrate stored in the carrier 220, and transfers it to the substrate transfer device TR described later. It has a function of transferring and receiving a processed substrate from the substrate transfer apparatus TR and storing it in the carrier 220.

The processing section array 230 includes a heat processing section 210 and edge exposure apparatuses EE1 and EE2. The heat treatment unit 210 includes a hot plate that heats the substrate and a cool plate that cools the substrate. In addition, the transport path R
2, a processing unit row 240 is formed at a position facing the processing unit row 230, and the processing unit row 240 is
Spin coater (rotary resist coating device) SC1, SC
2 and spin developer (rotary developing device) SD1, SD
2 and. Further, the substrate transfer device TR is movable in the X-axis direction along the transfer path R2, and is also capable of moving and rotating in the Z-axis direction.
0 and the processing section array 240 is configured to transfer the substrate between the respective processing sections provided in each.

The board issued from the indexer ID is
A resist coating process is performed in the spin coater SC1 or SC2, an edge exposure process is performed in the edge exposure device EE1 or EE2, and a heating process and a cooling process are performed in the heat treatment unit 210. Then, the transfer between these processing parts is performed by the substrate transfer device TR, and the substrate after the resist coating process is also transferred by the substrate transfer device TR and passed to the interface IF2 through the opening P2.

The interface IF2 includes a substrate transfer device 270, a buffer section 260, a substrate loading section 255, and
And a substrate unloading section 250. Substrate transfer device 270
Has a configuration similar to that of the substrate transfer device TR of the processing unit 201, is movable in the Y-axis direction, and can be moved and rotated in the Z-axis direction. When a resist-coated board is passed to the interface IF2,
The substrate transfer device 270 receives the substrate and the substrate loading unit 2
Place it on 55. The substrate placed on the substrate loading unit 255 is loaded by the loading / unloading robot of the exposure processing unit STP and then subjected to the exposure process.

The substrate after the exposure processing is placed on the substrate unloading section 250 again by the loading / unloading robot. Then, the substrate placed on the substrate unloading section 250 receives the substrate transfer device 270.
Taken out by the processing unit 2 through the opening P2.
No. 01 is transferred to the substrate transfer device TR.

The exposed substrate which has been returned to the processing unit 201 is carried into the spin developer SD1 or SD2 by the substrate transfer device TR and subjected to a development process, and then returned to the indexer ID by the substrate transfer device TR again. .

As described above, a series of processes in the substrate processing apparatus 200 is completed, and the developed substrate is stored in the carrier 220 and carried out of the apparatus.

The substrate processing apparatus as described above is usually used in a clean room, and a plurality of substrate processing apparatuses are often installed in one clean room.

FIG. 10 is a diagram showing a layout in a clean room in which a plurality of conventional substrate processing apparatuses 200 are arranged. In FIG. 10, an XYZ orthogonal coordinate system is attached for ease of explanation. As shown, in this layout, four substrate processing apparatuses 200 are arranged. Although two of the four substrate processing apparatuses 200 shown in FIG. 10 (upper right and lower left in FIG. 10) are symmetrical with the substrate processing apparatus 200 shown in FIG. 9 in the figure. ,
Even in this case, since the substrate processing apparatus 200 shown in FIG. 9 has the same function and performs the same operation, they are treated as the same apparatus in this specification.

As shown in FIG. 10, in the clean room, an automatic transfer device AGV for loading an unprocessed substrate into the substrate processing apparatus 200 and unloading the processed substrate from the substrate processing apparatus 200 is provided. The automatic carrier AGV travels along the Y-axis direction in the figure. Then, the four substrate processing apparatuses 200 have the indexer ID
Are arranged so as to face the traveling route of the automatic carrier AGV. With this arrangement, the automatic carrier AGV
Can transfer the substrates to and from the four substrate processing apparatuses 200 only by traveling linearly along the Y-axis direction.

[0015]

By the way, in recent years, the planar size of a substrate such as a semiconductor substrate has been increased, and along with this, each substrate processing unit (spin coater, spin developer, etc.) has also been increased in size. . Then, as each substrate processing unit becomes large-sized, the processing unit also becomes large, and in particular, it becomes large in the direction in which a plurality of processing units are arranged. For example, in the processing unit 201 shown in FIG. 9, four processing units of the spin coaters SC1 and SC2 and the spin developers SD1 and SD2 are arranged in the X-axis direction in the figure, so that the processing unit 201 becomes long in the X-axis direction.

As a result of arranging the substrate processing apparatus 200 incorporating the elongated processing unit 201 in the clean room, an unused space PL1 is produced as shown in FIG.

As is well known, in a clean room, suspended particles are removed, and a clean environment is maintained by forming an air flow (downflow) in which the temperature and humidity are controlled to be constant. There is. To maintain such a clean environment, expenses such as a filter and a temperature controller are required. Therefore, it is not desirable to generate the unused space PL1 as described above.

In particular, as shown in FIG. 10, the space PL1 as described above increases with an increase in the number of substrate processing apparatuses 200 arranged in the clean room. It will be.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing system capable of effectively utilizing a space in a clean room or the like without waste.

[0020]

In order to solve the above-mentioned problems, the invention according to claim 1 is a substrate processing system in which a plurality of substrate processing devices are arranged in a matrix form. a) Rotate the substrate to process
Rotation processing unit for processing and indexer for loading and unloading substrates
A rectangular first processing unit having: and (b) a rectangular second processing unit which is installed at a distance from the first processing unit and performs exposure processing on the substrate, (c)
Said first and provided in the spacing between the second processing unit, and a interface to pass the substrate between each other of the first and second processing units, rectangular first processing unit short side and the second rectangular shorter sides of the processing unit is arranged between the said first processing unit to be substantially collinear second processing unit, said Yi
Interface door and the second processing unit door
They are arranged on the same straight line .

According to a second aspect of the invention, in the substrate processing system according to the first aspect of the invention, the indexer is
Multiple carriers that can accommodate boards in multiple stages are detachably mounted
Can be placed on the indexer along the same straight line.
It has multiple carriers.

The invention according to claim 3 is for processing a plurality of substrates.
For a substrate processing system in which the devices are arranged in a matrix.
Then, in each of the plurality of substrate processing apparatuses, (a) substrate
Rotation processing unit that rotates and performs processing
A rectangular first processing unit having an indexer to perform,
(b) Installed at a distance from the first processing unit.
And a rectangular second processing unit that performs an exposure process on the substrate.
Between the knit and (c) the first and second processing units.
Of the first and second processing units provided at the interval
An interface for exchanging boards between each other,
The direction of the short side of the rectangle of the first processing unit and the second processing direction.
The direction of the short side of the rectangle of the processing unit is substantially the same direction.
So that the first processing unit and the second processing unit
With multiple storage shelves on the interface.
Buffer unit, the first processing unit, and the second processing
Transfers the board between the unit and the buffer section
It has a transfer robot. The invention of claim 4
Is a substrate according to any one of claims 1 to 3.
In the processing system, the rotation processing unit includes the first processing.
The plurality of substrates formed along the long side of the rectangle of the unit
Each of the processing devices, before the rotation processing unit is formed
Note that the long side of the rectangle of the first processing unit corresponds to that of another substrate processing apparatus.
Of the first processing unit of one of the substrate processing apparatuses
Of the long sides of the shape,
Are arranged facing each other with a space therebetween.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

The substrate processing system according to the present invention comprises a plurality of substrate processing devices arranged in a matrix. In this specification, first, a substrate processing apparatus constituting the substrate processing system will be described, and then an arrangement of the entire substrate processing system will be described.

FIG. 1 is a plan view of a substrate processing apparatus 100 which constitutes a substrate processing system according to the present invention. In addition, in FIGS. 1 to 4, an XYZ orthogonal coordinate system is attached to clarify the directional relationship. The substrate processing apparatus 100 is configured by arranging a rectangular exposure processing unit STP and a rectangular processing unit 101 so as to sandwich the interface IFB.

Here, referring to FIG. 1, terms used in this specification will be defined. The processing unit 101 and the exposure processing unit STP of the substrate processing apparatus 100 shown in FIG. 1 are both rectangular (but not square) in shape and each have a width and a depth. The width and depth of the processing unit 101 are the width (length in the X-axis direction) and the depth (length in the Y-axis direction) viewed from the indexer ID side, respectively.
And the width and depth of the exposure processing unit STP are
The width (length in the X-axis direction) and the depth (length in the Y-axis direction) viewed from the side of the maintenance door 51, which will be described later, respectively.
In the illustrated substrate processing apparatus 100, the width of both the processing unit 101 and the exposure processing unit STP is shorter than the depth. In this case, the processing unit 10
1. In both the exposure processing unit STP, the side of the rectangle corresponding to the width is the short side, and the side of the rectangle corresponding to the depth is the long side. Then, the processing unit 101 and the exposure processing unit S
In both TP, the length of the short side is the width, and the direction of the short side is the X-axis direction. Similarly, the length of the long side is the depth, and the direction of the long side is the Y-axis direction. When the depth of the unit is shorter than the width, the side of the rectangle corresponding to the width is the long side and the side of the rectangle corresponding to the depth is the short side, contrary to the above.

As shown in FIG. 1, in the substrate processing apparatus 100 constituting the substrate processing system according to the present invention, the long side of the processing unit 101 and the long side of the exposure processing unit STP face each other via the interface IFB. While
The direction of the short side of the processing unit 101 and the exposure processing unit S
The direction of the short side of TP is the same.

The processing unit 101 is a rectangular unit for performing resist coating processing on an unprocessed substrate and developing processing for the substrate W after the exposure processing. The processing unit 101 has an indexer ID for loading / unloading the substrate W. , Processing unit row 120
, A processing unit array 130, and substrate transfer devices TR1 and TR2.

The indexer ID is the substrate transfer device 15 and
A substrate transfer table 16 is provided. Also, indexer I
D has four carriers 10 that can accommodate substrates W in multiple stages.
Is detachably mounted. Note that the number of carriers 10 is not limited to four, and one or more carriers 10 may be placed. Further, the carrier 10 containing the unprocessed substrate
Is passed to the indexer ID from the automatic transfer device AGV that travels in the vicinity of the substrate processing apparatus 100 in the X-axis direction, and conversely, the carrier 10 storing the processed substrate is the automatic transfer device A.
The GV takes out the indexer ID and carries it.

The substrate transfer device 15 is movable in the X-axis direction (width direction of the processing unit 101), and is also capable of moving and rotating in the Z-axis direction (height direction).
The substrate transfer device 15 takes out the substrate W from the carrier 10 placed on the indexer ID, conveys it in the X-axis direction, and places the substrate W on the substrate delivery table 16. Further, when the processed substrate W is placed on the substrate transfer table 16, the substrate transfer device 15 takes out the substrate W and stores it in the carrier 10.

The processing unit 101 has two processing section rows and two transport paths, and among these, the processing section row 12
Reference numeral 0 is a rotation processing unit formed along the long side of the processing unit 101. That is, the processing unit row 120 is configured to operate the substrate W
Spin coater SC1 that spins to apply resist
SC2 and spin developer SD that performs rotational development processing
1, equipped with SD2. Further, the processing section array 130 is configured to include edge exposure apparatuses EE1 and EE2 that perform edge exposure processing and a heat treatment section 105. The transport path R1 is provided along the long side of the processing unit 101,
The transport path R2 is provided between the processing unit row 120 and the processing unit row 130. Substrate transfer devices TR1 and TR2 are respectively arranged on the two transfer paths R1 and R2.

The board transfer devices TR1 and TR2 are configured to transfer the transfer paths R1 and R2 by means of ball screw external screws (not shown) provided in the transfer paths R1 and R2, a motor for rotating the external screws, and a guide rail. It is configured to be movable in the Y-axis direction in FIG. In addition, the substrate transfer devices TR1 and TR2 are configured to be rotatable and vertically movable, and an arm (not shown) that is movable back and forth.
have. When the substrate transfer devices TR1 and TR2 transfer the substrate W, the substrate W is transferred or received by the forward / backward movement and vertical movement of the arm.

Next, the heat treatment section 105 of the processing section array 130 will be described. FIG. 2 is a cross-sectional view of the heat treatment section 105 taken along the YZ plane. As shown, the heat treatment unit 10
Reference numeral 5 has a laminated structure of a hot plate HP for heating the substrate, a cool plate CP for cooling the substrate, and a substrate transfer part IFW. In addition, in FIG. 2, the laminated structure is formed in three rows, but it is not limited to three rows, and it is sufficient if one or more rows are formed. Further, the laminated structure itself is not limited to the form as shown in FIG. 2, and for example, a part of the upper three hot plates HP may be replaced with a spare cool plate CP.

FIG. 3 is a sectional view of the processing unit 101 taken along the line VV. However, this drawing illustrates a case where the substrate transfer devices TR1 and TR2 are present on the line V-V. As shown in the drawing, the substrate entrance / exit to the hot plate HP is provided only on the transport path R1 side, whereas the cool plate CP and the substrate transfer part IFW are provided.
Substrate entrances and exits are provided on both sides of the transport path R1 and the transport path R2. By doing so, the heat of the hot plate HP is not radiated to the transport path R1, so that the spin developer SD1 facing the transport path R1,
Thermally stable processing is performed in SD2 and spin coaters SC1 and SC2. Also, spin developer SD
1, the arm of the substrate transfer device TR2 that accesses the SD2 and the spin coaters SC1 and SC2 does not come into direct contact with the heated substrate W, so that thermally stable processing is performed in the rotation processing unit.

Substrate transfer device TR1 and substrate transfer device TR2
When the substrate W is transferred to and from the substrate, it is performed via the cool plate CP and the substrate transfer section IFW. That is, when the substrate transport device TR1 transfers the substrate W to the substrate transport device TR2, the substrate transport device TR1 once places the substrate W on the cool plate CP, and then the substrate transport device TR2 receives the substrate W. Conversely, when the substrate transfer device TR2 transfers the substrate W to the substrate transfer device TR1, after the substrate transfer device TR2 places the substrate W on the substrate transfer part IFW,
The substrate transport device TR1 receives the substrate W.

In the processing unit 101 described above, the substrate W dispensed from the indexer ID is subjected to heat treatment and resist coating treatment in the heat treatment section 105 and the spin coater SC1 or SC2, respectively, and is passed to the interface IFB by the substrate transfer device TR1. Be done. In addition, from the interface IFB to the substrate transfer device T
The exposure-processed substrate W delivered to R 1 is processed by the heat treatment unit 10.
5 and spin developer SD1 or SD2 after heat treatment and development treatment respectively, and then indexer ID
Returned to.

Next, FIG. 4 is a side view of the interface IFB viewed from the exposure processing unit STP side. The interface IFB is installed between the long side of the processing unit 101 and the long side of the exposure processing unit STP.
This interface IFB is used for the substrate transfer robot 20.
The substrate transfer robot 21, the buffer unit 25, the substrate loading table 31, the substrate unloading table 32, the table tables 26, 2
7 and 7.

The substrate transfer robot 20 has a main body portion 20.
The motor b is movable in the Z-axis direction (vertical direction) by the motor 20e and the male screw 20d, and is also rotatable by the motor 20c. That is, the main body 20
The support shaft 20g of b is screwed into the male screw 20d, and the male screw 20d connected to the motor 20e rotates in the forward and reverse directions, whereby the main body portion 20b moves up and down. Further, with the rotation of the motor 20c connected to the main body portion 20b in the forward and reverse directions, the main body portion 20b rotates.

An arm 20a and a substrate support pin (not shown) are provided on the upper surface of the main body 20b. And
The arm 2 is driven by the drive mechanism built in the main body 20b.
It is configured to be able to move back and forth for 0a. Therefore,
The arm 20a can move up and down and rotate as the body 20b moves up and down, and can also move back and forth by the drive mechanism of the body 20b. Further, the substrate support pins are also configured to be able to move up and down by a drive mechanism built in the main body 20b.

The substrate W for which the resist coating process has been completed in the processing unit 101 is transferred from the substrate transfer device TR1 to the substrate transfer robot 20 of the interface IFB.
On the contrary, the substrate W that has undergone the exposure process is transferred to the substrate transfer robot
From 0 to the substrate transfer device TR1. An opening P1 for this operation is provided on the side of the substrate transfer robot 20 at the connecting portion between the interface IFB and the processing unit 101.

When the substrate W is transferred from the substrate transfer device TR1 to the substrate transfer robot 20, the substrate W is once placed on the substrate support pin and then the substrate support pin descends to the arm 20a. Will be passed. Further, when the substrate W is transferred from the substrate transfer robot 20 to the substrate transfer device TR1, contrary to the above, the substrate W is taken out from the arm 20a by raising the substrate support pin, and then the substrate W is removed. The arm of the substrate transfer device TR1 receives it.

The substrate transfer robot 21 is a robot that transfers the substrate W between the buffer unit 25 and the substrate loading table 31 or the substrate unloading table 32. The substrate transfer robot 21 is different from the substrate transfer robot 20 in that the substrate transfer robot 21 can be moved in the horizontal direction (Y-axis direction) by a motor 21e, a male screw 21c and a guide rail 21d. The main body portion 21b is not provided with a substrate support pin that moves up and down, and the other points are similar to those of the substrate transfer robot 20. That is, the lower end of the vertical movement mechanism 21f of the substrate transfer robot 21 is screwed into the male screw 21c, and the guide rail 2
It is slidably fitted to 1d. And the male screw 21
The substrate transfer robot 21 moves forward or backward in the Y-axis direction by the motor 21e connected to c rotating in the forward or reverse direction. Further, an arm 21a that can be moved back and forth by a drive mechanism inside the main body 21b of the substrate transfer robot 21 is provided on the upper surface of the main body 21b.

Substrate W before exposure processing (after resist coating)
Is transferred from the substrate transfer robot 20 to the substrate transfer robot 21, and the substrate W after the exposure processing is transferred from the substrate transfer robot 21 to the substrate transfer robot 20. These deliveries are performed via the buffer unit 25. The buffer unit 25 is configured by stacking a plurality of storage shelves that support the peripheral end of the substrate W. That is, the arm of one robot temporarily stores the substrate W in the storage rack, and the arm of the other robot takes out the substrate W to transfer the substrate W between the transfer robots. At this time,
Since multiple storage shelves are provided, interface I
FB and processing unit 101 or exposure processing unit ST
The substrate W can be temporarily stored in the buffer unit 25 even when the transfer timing of the substrate W with respect to P is not good.

Next, the substrate loading table 31 and the substrate loading table 3
2 are provided with pins 31a and 32a, respectively, and these pins 31a and 3a are used for placing the substrate W on the substrate loading table 31 and removing the substrate W from the substrate loading table 32, respectively.
2a. That is, when the substrate W is placed on the substrate loading table 31, the arm 21 a moves the substrate loading table 31.
After moving above, the substrate W is lowered, and the substrate W is placed on the pins 31a. Then, the arm 21a retracts to complete the placement. The substrate W placed on the pins 31a is taken into the exposure processing unit STP and subjected to the exposure processing.

The substrate W after the exposure processing is placed on the pins 32a of the substrate unloading table 32. Then, the substrate unloading table 3
When the substrate W is taken out from the substrate 2, the arm 21a moves below the substrate W placed on the pin 32a and then moves upward, and the substrate W is placed on the arm 21a. Then, the arm 21a retracts and the taking out of the substrate W is completed.

Further, the interface IFB is provided with table bases 26 and 27. This table stand 2
It is possible to mount cassettes 26a and 27a storing one or a plurality of substrates on 6 and 27, respectively.
If you want to perform a trial exposure process on the substrate W,
When it is desired to perform special processing other than that performed by the processing unit 101 before and after the exposure processing, the substrate W is set to the cassette 26.
It is stored in a and 27a and placed on the table bases 26 and 27. In addition, this mounting operation is performed by the interface IFB.
This is performed by the operator opening the door 35 (see FIG. 1) provided on the. The substrates W stored in the cassettes 26a and 27a mounted on the table bases 26 and 27 are taken out by the substrate transfer robot 21 and loaded into the substrate loading base 31, and then subjected to the exposure process. In addition, the substrate unloading table 3
The substrate W after the exposure processing that has been carried out to the substrate 2 is taken out by the substrate transfer robot 21, and is transferred to the cassette 26a or 27
The substrate W of a is stored in the original position where it was stored.

The exposure processing unit STP is an apparatus for performing exposure processing on the substrate W on which the resist has been applied, and is arranged on the opposite side of the processing unit 101 with the interface IFB sandwiched therebetween. This exposure processing unit STP is
The exposure apparatus and a robot for loading and unloading the substrate are included. The robot has an interface IFB
The substrate W placed on the substrate carry-in table 31 is taken in and set in the exposure machine, or the exposed substrate W is carried out to the substrate carry-out table 32. In addition, the exposure processing unit STP includes
A controller rack CO that accommodates a control controller that controls the exposure process, an operation rack OP that accommodates an operation panel, and an excimer laser oscillator LA that emits excimer laser light that is an exposure light source are connected. Further, the exposure processing unit STP is provided with a maintenance door 51, and an operator opens the maintenance door 51 to perform maintenance work on the robot and the like.

Next, the arrangement of the entire substrate processing system in the clean room will be described. FIG. 5 is a diagram showing an example in which a plurality of substrate processing apparatuses 100 are arranged in a clean room.

As shown in the figure, in this clean room,
Eight substrate processing apparatuses 100 are arranged in a matrix. It should be noted that four of the eight substrate processing apparatuses 100 are arranged symmetrically with respect to the substrate processing apparatus 100 shown in FIG. 1 (line symmetry about the X axis in the drawing). Since they have the same function and perform the same operation, they are treated as the same device here.

In the arrangement shown in FIG. 5, the automatic carrier AGV
Is traveling in the X-axis direction. Then, each substrate processing apparatus 1
00 is arranged so that its indexer ID faces the traveling route of the automatic transport apparatus AGV. Since the transfer of the substrate W is performed between the automatic transfer apparatus AGV and the indexer ID, the arrangement as described above simplifies the traveling procedure of the automatic transfer apparatus AGV and improves the processing efficiency of the entire substrate processing system. improves.

Of the long sides of the processing units 101 included in each substrate processing apparatus 100, the long side on which the processing section array 120 is formed is the long side of the processing unit 101 included in another substrate processing apparatus 100. Among them, the long sides on which the processing unit rows 120 are formed are arranged to face each other with a space therebetween. For example, the processing unit row 120 of the first substrate processing apparatus 100 from the upper left side in FIG. 5 faces the processing unit row 120 of the second substrate processing apparatus 100 from the upper left side at an interval. As described above, the processing unit array 120 includes the spin coaters SC1 and SC2 and the spin developers SD1 and SD2.
Is a processing unit array including a rotation processing unit such as the above, and is a processing unit array that requires an operator to perform maintenance such as the rotation mechanism and the nozzle. Therefore, according to the above, it is possible to perform maintenance on the rotation processing units of the two substrate processing apparatuses at one working location without the operator frequently moving.

Further, comparing the arrangement of the substrate processing apparatus 100 in the substrate processing system according to the present invention shown in FIG. 5 with the arrangement of the conventional substrate processing apparatus 200 shown in FIG. Substrate processing apparatus 10
Since the direction of the short side of the processing unit 101 of 0 and the direction of the short side of the exposure processing unit STP are the same, the unused space (for example, FIG.
The space PL1) in 0 does not occur, and the space in the clean room can be effectively used without waste.

The arrangement of the substrate processing apparatus 100 is not limited to the above example, but may be the arrangement shown in FIG. 6, for example. In this arrangement, two automatic transfer apparatuses AGV travel in the Y-axis direction, and four indexer IDs of the substrate processing apparatuses 100 face each traveling path. Other points are the same as the arrangement shown in FIG. Even in this case, the same effect as that of the substrate processing system shown in FIG. 5 can be obtained.

The substrate processing apparatus constituting the substrate processing system according to the present invention is the substrate processing apparatus 100 as described above.
However, the present invention is not limited to this, as long as the long sides of the two processing units face each other via the interface and the short sides of the two processing units have the same direction.

FIG. 7 is a plan view showing another example of the substrate processing apparatus constituting the substrate processing system according to the present invention. In the substrate processing apparatus 300 shown in FIG. 7, the interface I
The FB and the exposure processing unit STP are displaced to the left side in the figure as compared with the substrate processing apparatus 100 described above. That is,
In the substrate processing apparatus 100, the short side on one side of the processing unit 101 and the short side on one side of the exposure processing unit STP are arranged on a straight line, but these do not have to be arranged on a straight line, and as shown in FIG. As in the substrate processing apparatus 300 shown, the long side of the processing unit 101 and the long side of the exposure processing unit STP are opposed to each other via the interface IFB, and the direction of the short side of the processing unit 101 and the exposure processing unit ST.
If the direction of the short side of P is parallel, the unused space does not occur, and the space in the clean room can be effectively used without waste. Further, in the substrate processing apparatus 300 shown in FIG. 7, the maintenance door 51 of the exposure processing unit STP and the automatic transfer apparatus AGV are used.
The exposure processing unit ST
It does not hinder the traveling of the automatic carrier AGV during the maintenance work of P.

Further, the substrate processing apparatus constituting the substrate processing system according to the present invention may be as follows. FIG. 8 is a plan view showing another example of the substrate processing apparatus constituting the substrate processing system according to the present invention. In this substrate processing apparatus 400, the processing unit 401 has one transfer path R2.
And two processing unit rows 420 sandwiching the transport path R2,
And 430. The processing unit row 420 includes a rotation processing unit such as a spin coater SC1 and a spin developer SD1 and an edge exposure apparatus EE1.
It is formed along the long side of 1. Also, the processing unit row 43
Reference numeral 0 includes a heat treatment unit 105 and a substrate transfer robot TR4. Further, the interface IF3 includes the substrate transfer device TR3, the buffer unit BU, and the substrate loading table 31.
And a substrate unloading table 32. In the substrate processing apparatus 400, when the substrate W is transferred between the processing unit 401 and the interface IF3, it is performed via the substrate transfer robot TR4.

Also in the substrate processing apparatus 400, both the processing unit 401 and the exposure processing unit STP are rectangular, and the long side of the processing unit 401 and the exposure processing unit S.
Since the long side of TP opposes each other via the interface IF3 and the direction of the short side of the processing unit 401 and the direction of the short side of the exposure processing unit STP are configured to be parallel, there is an unused space. Therefore, the space in the clean room can be effectively used without waste.

[0058]

Effect of the Invention] As described above, according to the invention of claim 1 and claim 2, the short side of the rectangle of short sides and a second processing unit of the rectangle of the first processing unit of a substrate processing apparatus Since the first processing unit and the second processing unit are arranged so as to be substantially on the same straight line , an unused space does not occur and the space in the clean room can be effectively used without waste. You can Also,
According to the invention of claim 3, the first processing unit of the substrate processing apparatus.
Direction of the short side of the rectangle of the unit and the short side of the rectangle of the second processing unit
The first processing unit is set so that the direction of the side is substantially the same direction.
Is used because the unit and the second processing unit are arranged.
Clean space with no unoccupied space
The space in the system can be used effectively without waste.
It

According to the invention of claim 4 , the long side of the rectangle of the first processing unit in which the rotation processing unit is formed is the rectangle of the first processing unit of one of the other substrate processing apparatuses. Since the long sides of the long sides, on which the rotation processing unit is formed, are arranged to face each other with a space therebetween, the two substrates can be placed at one work location without frequent movement of the operator. The rotation processing unit of the processing device can be maintained.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate processing apparatus constituting a substrate processing system according to the present invention.

2 is a cross-sectional view of a heat treatment section of the substrate processing apparatus of FIG. 1 taken along the YZ plane.

FIG. 3 is a cross-sectional view of the processing unit of FIG. 1 taken along line VV.

FIG. 4 is a side view of the interface of FIG. 1 viewed from the exposure processing unit side.

FIG. 5 is a diagram showing an example in which a plurality of substrate processing apparatuses are arranged in a clean room.

FIG. 6 is a diagram showing another example in which a plurality of substrate processing apparatuses are arranged in a clean room.

FIG. 7 is a plan view showing another example of the substrate processing apparatus constituting the substrate processing system according to the present invention.

FIG. 8 is a plan view showing another example of the substrate processing apparatus which constitutes the substrate processing system according to the present invention.

FIG. 9 is a plan view showing the configuration of a conventional substrate processing apparatus.

10 is a diagram showing a layout in a clean room in which a plurality of substrate processing apparatuses of FIG. 9 are arranged.

[Explanation of symbols]

100 substrate processing equipment 101 processing unit IFB interface STP exposure processing unit W board

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kaoru Aoki Kaoru Aoki 322, Hazushishi Furukawacho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Rakusai Plant (72) Masami Ohtani 322, Hazushishi Furukawacho, Fushimi-ku, Kyoto Japan Screen Mfg. Co., Ltd. Rakusai Plant (56) Reference JP-A-9-1007012 (JP, A) JP-A-60-84819 (JP, A) JP-A-9-330971 (JP, A) JP-A 9-92702 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/027 H01L 21/68

Claims (4)

(57) [Claims] 1. A substrate processing system in which a plurality of substrate processing apparatuses are arranged in a matrix, wherein each of the plurality of substrate processing apparatuses includes: (a) a rotation processing unit that rotates a substrate to perform processing;
A rectangular first processing unit having an indexer for carrying in and out; and (b) a rectangular second processing unit which is installed at a distance from the first processing unit and which performs exposure processing on the substrate. (C) an interface which is provided at the interval between the first and second processing units and transfers the substrate between the first and second processing units, The first processing unit and the second processing unit are arranged so that the short side of the rectangle of the processing unit and the short side of the rectangle of the second processing unit are substantially on the same straight line, and the door of the interface is arranged. And the second processing unit
A substrate processing system wherein the doors of the door are arranged on the same straight line . 2. The substrate processing system according to claim 1, wherein the indexer has a plurality of capacities capable of accommodating substrates in multiple stages.
The rear is detachably mountable, and multiple carriers can be attached to the indexer along the same straight line.
Substrate processing system characterized by mounting a . 3. A plurality of substrate processing devices arranged in a matrix.
In the arranged substrate processing system, each of the plurality of substrate processing apparatuses includes (a) a rotation processing unit that rotates a substrate to perform processing, and
Rectangular first processing unit having indexer for carrying in and out
And (b) is installed at a distance from the first processing unit.
And a rectangular second processing unit that performs an exposure process on the substrate.
A knit, and (c) the space between the first and second processing units.
Is provided between the first and second processing units.
And a interface to pass the plate, the second processing to the direction of the short side of the rectangle of the first processing unit
The direction of the short side of the rectangle of the processing unit is substantially the same direction.
So that the first processing unit and the second processing unit
With multiple storage shelves on the interface.
Buffer unit, the first processing unit, and the second processing
Transfers the board between the unit and the buffer section
And a transfer robot.
Stem. 4. The method according to any one of claims 1 to 3.
In the substrate processing system, the rotation processing unit is provided on the long side of the rectangle of the first processing unit.
Along are formed, wherein each of the substrate processing apparatus, rectangular of the rotation the processing unit is formed first processing unit
The long side of the shape is one of the other substrate processing apparatuses.
Of the long side of the rectangle of the first processing unit
The long side where the processing part is formed faces each other with a space between each other.
A substrate processing system characterized by being arranged as follows.