JP3683640B2 - Transfer aid for flat plate member and transfer method using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention is used for storing a flat member such as a wafer.one ofStoragePlaceOtherDirectionTransfer aid used when transferring a flat plate-like member to the storage deviceAnd transfer method using the sameAbout.
[0002]
[Prior art]
Conventionally, for example, in order to process a semiconductor wafer as desired, the wafer is stored in a storage device and processed. As a storage device for storing the wafer, for example, those shown in FIGS. 14 to 16 are generally used. In FIG. 14, the conventional storage device has a box-shaped storage device body 2, and a rectangular opening 4 is defined on one side surface of the storage device body 2. As shown in FIG. 15, a receiving member 10 is provided on the inner surfaces of the pair of opposing side walls 6 and 8 of the storage device main body 2. A plurality of receiving members 10 are provided in the vertical direction in FIG. 15 (in the direction from the lower left to the upper right in FIG. 14) with a predetermined interval, and a groove 12 is defined between adjacent receiving members 10.
[0003]
The receiving member 10 extends in the insertion direction of the wafer 14 (FIG. 14) as a flat plate member, and therefore the groove 12 also extends linearly in this direction. Both ends of the wafer 14 are guided by the opposing grooves 12 and are placed and supported on the upper surface of the receiving member 10 located on the lower side of the adjacent receiving members 12 (see FIG. 16).
[0004]
For example, such a storage device is immersed in an etching solution while the wafer is stored in the storage device when the wafer is etched. In order to perform the etching process as desired, during this process, the storage device is swung or the processing liquid is agitated while the wafer is stored.
[0005]
In some cases, the wafer processed as described above in a state of being stored in a carrier is transferred to another storage device, for example. In such a case, when the size of the wafer is constant, the transfer operation can be performed relatively easily. However, when the sizes of the wafers are different, there is a risk that a relatively small wafer may come off from the groove between the receiving members and be damaged. Therefore, conventionally, at this time, an operator uses a work such as tweezers for each piece. We are moving.
[0006]
[Problems to be solved by the invention]
The conventional storage device described above has the following problems to be solved. Referring mainly to FIG. 16, the receiving member 10 that supports the wafer 14 is for supporting the wafer 14 so as not to overlap. In order for the wafer 14 to be supported between the receiving members 10 facing each other (facing in the left-right direction in FIG. 15) as required, it is necessary to configure as follows. That is, in order for the wafer 14 to be supported between the receiving members 10 facing each other, the diameter of the largest diameter wafer 14A is adjacent to the other side from the bottom of the groove 12 defined between the adjacent receiving members 10 on one side. It is set to a value that is substantially equal to or slightly smaller than the distance L to the bottom of the groove 12 defined between the receiving members 10. On the other hand, the diameter of the smallest diameter wafer 14 </ b> B is set to a value (L−H) obtained by subtracting the length H of the receiving member 10 from the distance L from the bottom of one groove 12 to the bottom of the other groove 12.
[0007]
Therefore, in order to be able to store the wafers 14 having greatly different diameters in the storage device, it is necessary to increase the length H of the receiving member 10 as easily understood. However, when the length H of the receiving member 10 is increased, for example, during the etching process, the leading end of the receiving member 10 covers both surfaces of the wafer 14, so that the receiving member 10 in the wafer 14 is covered. There is a problem in that the state of the etching process is changed between the broken area and the area not covered with the receiving member 10, and a wide range of areas in which substantially uniform processing cannot be performed occurs. In order to prevent such etching unevenness, the length H of the receiving member 10 may be shortened. However, if the length is shortened, the diameter of the wafer 14 that can be stored is greatly limited, and the applicable size range of the wafer is narrowed. Problems arise.
[0008]
Further, in such a storage device, for example, if an operator performs the transfer operation of wafers 14 of different sizes by hand, the operation becomes very complicated and time is required.
[0011]
  The present inventionEyesThe targetone ofOther flat plate members stored in the storage deviceDirectionIn storage deviceWith relatively easy workCan be transferred reliablyFlat plateTransfer aidAnd transfer method using the sameIs to provide.
[0016]
[Means for Solving the Problems]
  BookThe invention is interposed between one storage device in which a flat member is stored and the other storage device in which no flat member is stored.Flat plateA transfer aid,
  flatA frame structure that defines a moving space in which the plate-like member moves;
  ThisA plurality of guide bodies provided at predetermined intervals in the movement space of the frame structure;
  PreviousLocated on one side of the frame structureSaidThe flat plate member stored in one storage device is positioned on the other side of the frame structure through adjacent guide bodies.SaidIt is stored in the other storage device.Flat plateIt is a transfer aid.
  According to the present invention, since the guide body provided in the frame structure guides the flat plate member from one storage device to the other storage device, the transfer of the flat plate member is relatively easy and reliable. It can be carried out.
[0017]
In the invention, it is preferable that the frame structure includes a first frame body and a second frame body which is mounted on the first frame body so as to be pivotable between a transfer position and a retracted position. The frame is provided with the plurality of guide bodies.
According to the present invention, since the second frame can freely pivot between the transfer position and the retracted position, the second frame can be obtained without damaging the flat plate member stored in one storage device. Can be easily positioned between the wafers.
[0018]
  According to the present invention, the first frame is detachably attached to the one storage device, and the second frame is detachably attached to the other storage device. When the body is positioned at the transfer position, a part of the guide plate is positioned in the one storage device to guide the flat plate member stored in the one storage device.
  According to the present invention, the storage device in which the flat plate member is stored and the empty storage device can be easily attached to the frame structure, and the transfer operation of the flat plate member becomes easy.
  In the present invention, the one storage device and the other storage device are
  A storage device main body having an opening for storing a flat plate member is provided, and a plurality of receiving members extending in the insertion direction of the flat plate member are provided on opposite side walls of the storage device main body, and between adjacent receiving members Each of the receiving members includes a first receiving portion that protrudes relatively small inward at an opening of the storage device body, and a bottom portion of the storage device body. And a second receiving portion that protrudes relatively large inward.
  According to the present invention, the first receiving portion of the receiving member allows guide support of a relatively large flat plate member, and the second receiving portion of the receiving member allows guide support of a relatively small flat plate member. . Therefore, even flat plate members of different sizes can be reliably guided and supported, and even when a relatively large flat plate member is accommodated, the area covered by the receiving member is small, and the unevenness of processing during etching processing and the like is reduced.
  According to the present invention, the first receiving portion of the receiving member extends from the opening of the storage device main body toward the bottom thereof, and the second receiving portion of the receiving member extends from the bottom of the storage device main body toward the opening thereof. The third receiving portion existing between the first receiving portion and the second receiving portion is characterized in that the amount of protrusion gradually increases inward in the insertion direction of the flat plate member. .
  According to the present invention, the third receiving portion allows the guide support of the medium flat plate member, and reliably supports the medium flat plate member while keeping the area covered by the reception member small. Can do.
  Further, according to the present invention, the second receiving portion of the receiving member has a center of gravity of the minimum flat plate member located in the region of the second receiving portion when the minimum flat plate member stored in the storage device main body is stored. The third receiving portion of the receiving member is configured such that the center of gravity of the largest flat plate member is located in the region of the third receiving portion when the largest flat plate member stored in the storage device body is stored. It is set so that it may be located.
  According to the present invention, when the flat plate member is stored in the storage device main body, the center of the smallest flat plate member that can be stored is located in the region of the second receiving portion, and the maximum flat plate member that can be stored. Since the center of gravity is located in the region of the third receiving portion, these various flat members can be supported without being detached from the receiving member.
  In the present invention, a transfer assisting tool is interposed between the one storage device in which the flat member is stored and the other storage device in which the flat member is not stored,
  The one and the other storage devices are:
  A storage device main body having an opening for storing a flat plate member is provided, and a plurality of receiving members extending in the insertion direction of the flat plate member are provided on opposite side walls of the storage device main body. Each of the receiving members includes a first receiving portion that protrudes relatively small inwardly at an opening of the storage device main body, and a bottom portion of the storage device main body. A second receiving portion that protrudes relatively large inward,
  The transfer aid is
  A frame structure that defines a moving space in which the flat plate member moves;
  A plurality of guide bodies provided at predetermined intervals in the moving space of the frame structure,
  The flat plate member stored in the one storage device located on one side of the frame structure is transferred to the other storage device located on the other side of the frame structure through adjacent guide bodies. Aids,
  The one storage device, the other storage device, and the transfer assisting tool are integrally rotated so that the one storage device is located above the other storage device from above, and the flat plate member ,That The flat member transfer method is characterized in that the guide member is guided and transferred from one storage device to the other storage device by its own weight.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view showing a flat member storage apparatus according to an embodiment of the present invention, and the storage apparatus can be applied as a carrier for a semiconductor wafer, for example. In FIG. 1, the illustrated carrier includes a box-shaped carrier body 22 as a storage device body. The carrier body 22 has a rectangular bottom wall 24 and four side walls 26, 28, 30, 32 (see FIG. 2 to FIG. 4 for the side walls 32) extending perpendicularly from the bottom wall 24. Reference numerals 28, 30 and 32 define a rectangular opening 34 on the upper surface of the carrier body 22.
[0020]
The opening of the carrier body 22 is provided with flanges 36, 38, 40, 42 protruding outward. These flanges 36, 38, 40, 42 facilitate attachment to a transfer aid described later. In the embodiment, circular positioning holes 44 are provided in the corners of the flanges 36 and 38 and the corners of the flanges 38 and 40, respectively. Further, positioning pins 46 are provided at the corners of the flanges 40 and 42 and the corners of the flanges 36 and 42, respectively. These holes 44 and pins 46 are provided for positioning both when mounting on the transfer aid. As a positioning function, a combination of recesses and protrusions having various shapes can be used instead of the combination of the hole 44 and the pin 46.
[0021]
A plurality of receiving members 48 and 50 are provided at predetermined intervals on the inner surfaces of the opposing side walls 28 and 32 of the carrier body 22. 2 to 4 showing the receiving members 48 and 50, in the illustrated embodiment, the receiving members 48 and 50 are integrally provided on the inner surfaces of the side walls 28 and 32, respectively. The receiving member 48 attached to the side wall 28 and the receiving member 50 attached to the other side wall 32 are provided correspondingly at substantially the same interval. The carrier body 22 and the receiving members 48 and 50 can be formed by integral molding of synthetic resin such as Teflon, for example.
[0022]
The receiving members 48 and 50 have substantially the same configuration. In the embodiment, the receiving members 48 and 50 include first receiving portions 48a and 50a, second receiving portions 48b and 50b, and third receiving portions 48c and 50c. Yes. The first receiving portions 48a and 50a are located at the opening of the carrier body 22, and extend from the opening 34 toward the bottom in the wafer insertion direction indicated by the arrow 60 (FIG. 2). The second receiving portions 48 b and 50 b are located at the bottom of the carrier main body 22 and extend from the bottom toward the opening 34. Further, the third receiving portions 48c and 50c are located between the first receiving portions 48a and 50a and the second receiving portions 48b and 50b.
[0023]
The first receiving portions 48a and 50a protrude relatively small toward the inside (that is, the opposing receiving portions), and the second receiving portions 48b and 50b protrude relatively large toward the inside. The second receiving portions 48b and 50b protrude sharply toward the tip in a wedge shape, and define a relatively deep V-shaped deep groove portion between the adjacent second receiving portions 48b and 50b. The first receiving portions 48a and 50a have a shape obtained by removing most of the tip side of the second receiving portions 48b and 50b, and are relatively shallow V-shaped between the adjacent first receiving portions 48a and 50a. Define the shallow groove. In the illustrated form, the protrusions of the third receiving portions 48c and 50c gradually increase in the wafer insertion direction indicated by the arrow 60, and therefore, between the adjacent third receiving portions 48c and 50c. The V-shaped intermediate groove defined is gradually increased in depth in the insertion direction. The grooves defined by the receiving members 48, 50, in the embodiment, the shallow groove portion, the intermediate groove portion, and the deep groove portion are grooves 62 for guiding and supporting a wafer that extends substantially continuously in a straight line toward the insertion direction of the wafer. Is specified. In order to guide and support a circular or substantially circular wafer as desired, for example, the shapes of the receiving members 48 and 50 can be set as follows. That is, in order to smoothly insert and remove the applicable maximum diameter wafer 64A (FIG. 3) from the carrier body 22 as shown in FIG. 3, the wafer 64A faces the bottom of the groove 62 defined by the receiving member 48. The distance L1 to the bottom of the groove 62 defined by the receiving member 50 is set to be about 2 mm larger than the diameter D of the largest diameter wafer 64A (L1 = D + 2). Further, in order to prevent the wafer 64A having the maximum diameter from separating from the shallow groove portion, the protruding amount L2 of the first receiving portions 48a and 50a can be set to about 3 mm (L2 = 3) (therefore, accordingly). In the first receiving portions 48a and 50a, even if the wafer 64A is shifted to one side, it is overlapped with the receiving portion by about 1 mm on the other side). The protrusion amount L3 of the second receiving portions 48b and 50b is set to the minimum diameter from the diameter D of the maximum diameter wafer 64A so that the applicable minimum diameter wafer 64B (FIG. 3) does not leave the deep groove portion. It can be set to a value (D−d + 4) obtained by adding about 4 mm to the value obtained by subtracting the diameter d of the wafer. Further, the depth L4 of the second receiving portions 48b and 50b can be set to a value {(d / 2) +2} obtained by adding about 2 mm to a value half the diameter d of the minimum diameter wafer 64b. By setting the depth L4 of the second receiving portions 48b and 50b, the minimum diameter wafer 64B is stored in the carrier body 22 as required as shown in FIG. It is located in the region 66 (region between the second receiving portions 48b and 50b facing each other). Therefore, the wafer 64B is reliably supported by the second receiving portions 48b and 50b and does not come off the deep groove portion of the groove 62. Furthermore, the total depth L5 of the second receiving portions 48b and 50b and the third receiving portions 48c and 50c is about 2 mm from the radius {(D−L2 + 1) / 2} of the largest diameter wafer that can be directly transferred. It can be set to be {2+ (D−L2 + 1)} which is increased to some extent. Thus, when the wafer 64A having the maximum diameter is accommodated in the carrier body 22 as required, the center of gravity thereof is the area 68 of the third receiving portions 48c and 50c (between the opposing third receiving portions 48c and 50c). Therefore, the wafer 64A is securely supported by the third receiving portions 48c and 50c and does not separate from the intermediate groove portion of the groove 62. And in connection with being comprised in this way, the front-end | tip of 3rd receiving part 48c, 50c is straight toward the front-end | tip of 2nd receiving part 48b, 50b from the front-end | tip of 1st receiving part 48a, 50a. Extends up. Therefore, when the intermediate-sized wafer is stored in the carrier body 22 as required, the center of gravity is substantially located in the region 48 of the third receiving portion and does not deviate from the intermediate groove portion of the groove 62.
[0024]
When a relatively large wafer is accommodated in the receiving members 48 and 50 having such a configuration, a part of the area is covered by the second receiving portions 48b and 50b and the third receiving portions 48c and 50c. Most of the area is not covered by the receiving members 48 and 50, and therefore, uniform processing can be performed in a wide area of the wafer. This is the same when a relatively small wafer is stored.
[0025]
Next, a transfer aid that can be advantageously applied to a storage device such as the carrier described above with reference to FIGS. FIG. 5 is a perspective view showing a transfer assisting tool according to one embodiment of the present invention, FIG. 6 is a first frame of the assisting tool, and FIG. 7 is a second frame of the assisting tool. Is shown.
[0026]
5 to 7, the illustrated auxiliary tool 102 includes a frame structure 103. The frame structure 102 includes a rectangular first frame body 104 and a second frame body 106. The first frame 104 is composed of four frames 108, 110, 112, 114. The first frame 104 composed of these frames has the shape of the carrier flanges 36, 38, 40, 42 shown in FIG. It corresponds. Accordingly, the first movement space defined by the first frame body 104 corresponds to the opening 34 of the carrier body 22. As shown in FIG. 6, circular positioning holes 116 are formed in the corners of the frames 108 and 110 and the corners of the frames 108 and 114 in the first frame 104. The positioning holes 116 correspond to the positioning pins 46 of the carrier body 22 respectively. In addition, positioning pins 118 are provided at corners of the frames 110 and 112 and corners of the frames 112 and 114, respectively. Such positioning pins 118 correspond to the positioning pins 46 of the carrier body 22. The first frame 104 can be formed by, for example, synthetic resin integral molding.
[0027]
The second frame 106 has substantially the same structure as the first frame 104, and is composed of four frames 120, 122, 124, 126. The shape of the flanges 36, 38, 40, 42 of the carrier in FIG. It corresponds to. The second movement space defined by the second frame 106 is substantially the same as the first movement space, and corresponds to the opening 34 of the carrier body 22. As shown in FIG. 7, circular positioning holes 128 are formed in the corners of the frames 122 and 124 and the corners of the frames 124 and 126 in the second frame 106, respectively. The positioning holes 128 respectively correspond to the positioning pins 46 of the carrier body 22. In addition, positioning pins 130 are provided at corners of the frames 120 and 122 and corners of the frames 120 and 126, respectively. The positioning pin 130 corresponds to the positioning pin 46 of the carrier body 22. The second frame 106 can also be formed by, for example, synthetic resin integral molding.
[0028]
The 1st frame 104 and the 2nd frame 106 are connected so that turning is possible. In the embodiment, the frame 112 of the first frame body 104 and the frame 124 of the second frame body 106 are connected by a pair of hinges 132, and therefore the second frame body 106 is in the retracted position (shown in FIG. 8). And the transfer position (the position shown in FIG. 10, where the second frame 106 is largely retracted from the first frame 104), and the second frame 106. It is possible to turn between the positions where the 106 overlaps.
[0029]
The second frame body 106 is provided with a plurality of guide bodies 134 at predetermined intervals. Each guide body 134 is plate-shaped, and includes connection portions 136 and 138 corresponding to the sizes of the frames 122 and 126, a first guide portion 140 extending toward the first frame body 104 at the center portion, and a center portion. A second guide part 142 extending in a direction opposite to the first guide part 140 is provided. The first guide part 140 and the second guide part 142 have substantially the same structure, and a corner part of the tip part is cut off and tapered. Therefore, as described later, even if the second frame body 106 is turned toward the transfer position, the tip end portion of the first guide portion 140 does not contact a part of the carrier body 22. The shape of the guide body 134 may be a triangular shape or a semi-elliptical shape. One connecting portion 136 of the guide body 134 is fixed to the frame 120, and the other connecting portion 138 is fixed to the frame 138. The guide body 134 corresponds to the distance between the carrier receiving members 48 and 50 in FIG. Arranged. The guide body 134 can be formed of a material having excellent rust prevention properties, such as vinyl chloride, aluminum, or an alloy thereof. The guide body 134 can also be formed by integral molding with the second frame body 106.
[0030]
The auxiliary tool having the above-described configuration can be used as follows, for example. 8 to 13, when transferring the wafer 200 from the carrier 202 in which the wafer 200 is accommodated to the empty carrier 204 (FIG. 12), first, as shown in FIG. In the standing state, the carrier 202 is detachably attached to the first frame 104 of the auxiliary tool 102. At the time of mounting, as shown in FIG. 9, the hole 44 provided in the carrier 202 and the pin 118 provided in the first frame 104 of the auxiliary tool 102 are engaged, and the pin 46 of the carrier 202 and the first pin are provided. What is necessary is just to engage the hole 116 of the one frame 104. Thus, the carrier 202 and the auxiliary tool 102 are held in a predetermined positional relationship, and the auxiliary tool 102 is positioned in the opening of the carrier 202. As shown in FIG. 8, it is desirable that such mounting be performed with the second frame 106 held in the retracted position. That is, in the state where the second frame body 106 is held at the retracted position, the guide body 134 of the auxiliary tool 102 does not enter the carrier 202 even when the first frame body 104 is mounted on the carrier 202. In this mounting, the guide body 134 does not contact or come into contact with the wafer 200 in the carrier 202, and damage to the wafer 200 is reliably prevented.
[0031]
Next, as shown in FIG. 10, in a state where the auxiliary tool 102 is mounted on the carrier 202, the second frame 106 is turned and positioned at the transfer position. When the second frame 106 is positioned at the transfer position, the carrier 202 and the auxiliary tool 102 are held in a predetermined positional relationship, so that the guide body 134 of the auxiliary tool 102 is attached to the receiving members 48 and 50 of the carrier 202. There is no contact or contact with the held wafer 200. When the second frame 106 is positioned at the transfer position, as shown in FIG. 11, the guide body 134 is located between the pair of wafers 200 (specifically, on the line connecting the tips of the receiving members 48 and 50 of the carrier body 22). And the first guide portion 140 is positioned to the vicinity of the middle portion of the third receiving portions 48c and 50c of the receiving members 48 and 50 of the carrier 202.
[0032]
Next, as shown in FIG. 12, an empty carrier 204 is detachably attached to the second frame 106 of the auxiliary tool 102. The empty carrier 204 preferably has substantially the same structure as that shown in FIG. As is easily understood, the mounting of the carrier 204 includes the holes 44 provided in the carrier 204 and the pins 130 provided in the second frame 106 of the auxiliary tool 102 in the same manner as the carrier 202 containing the wafer 200. In addition to the engagement, the pin 46 of the carrier 204 and the hole 128 of the second frame 106 may be engaged. Thus, the carrier 204 and the auxiliary tool 102 are held in a predetermined positional relationship, and the auxiliary tool 102 is positioned in the opening of the carrier 204. When mounted in this manner, the guide body 134 of the auxiliary tool 102 is positioned between the corresponding receiving members 48 and 50 in the carrier 204 (specifically, on the line connecting the tips of the receiving members 48 and 50 of the carrier main body 22). The second guide portion 142 is positioned up to the vicinity of the middle portion of the third receiving portions 48c and 50c of the receiving members 48 and 50 of the carrier 204.
[0033]
Thereafter, as shown in FIG. 13, the carrier 202 containing the wafer 200 is gently moved so as to be lowered, and then the carriers 202 and 204 and the auxiliary tool 102 are integrated so that the carrier 202 is raised. Rotate slowly in the direction indicated by arrow 206. Thus, the wafer 200 moves from the carrier 202 to the carrier 204 due to its own weight as it rotates, and is transferred to the carrier 204 at a time. When the wafer 200 moves, the first guide portion 140 of the guide body 134 of the auxiliary tool 102 extends into the carrier 202 and the second guide portion 142 extends into the other carrier 204. Is moved in the movement space of the auxiliary tool 102 while being guided by the guide body 134 and transferred to the other carrier 204. In the illustrated embodiment, since the first guide part 140 and the second guide part 142 extend to the vicinity of the middle part of the third receiving parts 48c and 50c of the carrier body 22, one of the smallest applicable wafers can be used. Can be reliably transferred from one carrier 202 to the other carrier.
[0034]
After transferring the wafer 200 as described above, the auxiliary tool 102 and the carrier 202 may be detached from the carrier 204. In order to detach the auxiliary tool 102 from the carrier 204, the auxiliary tool 102 may be gently moved away from the carrier 202 to release the engagement between the pins 46 and 118 and the holes 44 and 116. Further, in order to detach the carrier 202 from the assisting tool 102, the carrier 202 may be moved away from the assisting tool 102 to release the engagement between the pins 46 and 130 and the holes 44 and 128.
[0035]
Note that the guide body 134 of the auxiliary tool 102 may have a rod shape or the like as long as it can reliably guide the wafer 200. Further, the holes 116 and 128 and the pins 118 and 130 provided in the auxiliary tool 102 may be a combination of a concave portion and a protrusion having an appropriate shape corresponding to the positioning structure provided in the carrier body 22. Furthermore, the carrier and the auxiliary tool having the above-described structure are not limited to semiconductor wafers, and can be used for housing flat members such as CD-ROM disks and MD disks.
[0039]
【The invention's effect】
  BookAccording to the invention, since the guide body provided in the frame structure of the transfer assisting tool guides the flat plate member from the one storage device to the other storage device, the transfer of the flat plate member is relatively easy. This can be done reliably and reliably.
[0040]
According to the present invention, since the second frame can freely pivot between the transfer position and the retracted position, the second frame can be obtained without damaging the flat plate member stored in one storage device. The guide body can be easily positioned between the flat plate members stored in the storage device.
[0041]
  According to the present invention, the storage device in which the flat plate member is stored and the empty storage device can be easily attached to the frame structure, and the transfer operation of the flat plate member is remarkably facilitated.
  According to the present invention, the first receiving portion of the receiving member allows guide support of a relatively large flat plate member, and the second receiving portion of the receiving member allows guide support of a relatively small flat plate member. Therefore, even flat plate members having different sizes can be reliably guided and supported. In addition, even when a relatively large flat plate member is accommodated, the area of the flat plate member that is covered by the receiving member is small, and the unevenness of the processing during the etching process or the like can be reduced.
  Further, according to the present invention, the third receiving portion allows the medium flat plate member to be guided and supported, and reliably supports the medium flat plate member while keeping the area covered by the receiving member small. be able to.
  According to the present invention, when the flat plate member is stored in the storage device main body, the center of the minimum flat plate member that can be stored is located in the region of the second receiving portion, and the maximum flat plate shape that can be stored. Since the center of gravity of the member is located in the region of the third receiving portion, the flat plate members of various sizes can be supported without being detached from the receiving member.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a carrier as a flat member storage device according to an embodiment of the present invention.
2 is a cross-sectional view showing a part of the receiving member of the carrier of FIG.
FIG. 3 is a cross-sectional view taken along line OO in FIG.
4 is a cross-sectional view taken along line PP in FIG.
FIG. 5 is a perspective view showing a transfer aid that is an embodiment of the present invention.
6 is a front view showing a first frame body of the auxiliary tool in FIG. 5. FIG.
7 is a front view showing a second frame body of the auxiliary tool in FIG. 5; FIG.
FIG. 8 is a perspective view showing a state where an auxiliary tool is mounted on a carrier in which a wafer is stored.
FIG. 9 is a perspective view partially cut away for explaining a positioning mechanism provided on the carrier and the first frame of the auxiliary tool.
FIG. 10 is a perspective view showing a state where the second frame is positioned at the transfer position in a state where the auxiliary tool is mounted on the carrier.
FIG. 11 is a cross-sectional view for explaining the positional relationship between the wafer and the guide for the auxiliary tool when the second frame is positioned at the transfer position.
FIG. 12 is a perspective view showing a state where both carriers are mounted on the auxiliary tool.
FIG. 13 is a perspective view for explaining an operation when the wafer is moved from the carrier in which the wafer is stored to an empty carrier.
FIG. 14 is a perspective view showing a conventional storage device in a state where a wafer is stored.
15 is a cross-sectional view showing a receiving member in the storage device of FIG. 14;
FIG. 16 is a cross-sectional view for explaining the relationship between a receiving member of a conventional storage device and wafers of different sizes.
[Explanation of symbols]
22 Carrier body
34 Opening
48, 50 receiving member
48a, 50a first receiving part
48b, 50b 2nd receiving part
48c, 50c 3rd receiving part
62 Groove
64A maximum diameter wafer
64B Minimum diameter wafer
66 Second receiving area
68 Third receiving area
102 Transfer aid
103 Frame structure
104 first frame
106 second frame
134 Guide
140 First guide
142 Second Guide
200 wafers
202, 204 carriers

Claims (7)

A transfer aid for a flat plate member interposed between one storage device in which the flat plate member is stored and the other storage device in which the flat plate member is not stored,
A frame structure flat plate-like member defines a movement space to move,
Comprising a plurality of guide members which are provided at predetermined intervals in the moving space of this frame structure,
Before SL frame structure plate member wherein it is housed in one of the storage device located on one side of it is housed in the other housing unit located on the other side of the frame structure through between the guide body adjacent A transfer aid for a flat member characterized by the above. The frame structure includes a first frame and a second frame that is pivotally mounted between the first frame and a transfer position and a retracted position, and the second frame includes the second frame transfer aid of the flat plate-like member according to claim 1, wherein the plurality of guide members are provided. The first frame is detachably attached to the one storage device, the second frame is detachably attached to the other storage device, and the second frame is transferred to the other storage device. 3. A flat plate member according to claim 2, wherein a part of the guide plate is positioned in the one storage device when positioned to guide the flat plate member stored in the one storage device. transfer aid. The one and the other storage devices are:
A storage device main body having an opening for storing a flat plate member is provided, and a plurality of receiving members extending in the insertion direction of the flat plate member are provided on opposite side walls of the storage device main body, and between adjacent receiving members a storage device of the tabular member having a groove defined in each of said receiving member has a first receiving portion projecting relatively small inward at the opening of the storage device main body, a bottom portion of the storage device main body The flat plate member transfer assisting device according to claim 1, further comprising a second receiving portion that protrudes relatively large inward. The first receiving portion of the receiving member extends from the opening of the storage device main body toward the bottom thereof, and the second receiving portion of the receiving member extends from the bottom of the storage device main body toward the opening of the first receiving portion. parts and third receiving portion existing between the second receiving portion, according to claim 4, wherein the amount of projection toward the insertion direction of the flat plate-like member is gradually increased inwardly Transfer aid for flat plate members. The second receiving portion of the receiving member is set so that the center of gravity of the minimum flat plate member is positioned in the region of the second receiving portion when the minimum flat plate member stored in the storage device body is stored. The third receiving portion of the receiving member is set so that the center of gravity of the largest flat plate member is located in the region of the third receiving portion when the largest flat plate member stored in the storage device body is stored. 6. The flat plate member transfer assisting tool according to claim 5 , wherein the transfer assisting tool is a flat plate member. A transfer assisting tool is interposed between one storage device in which the flat plate member is stored and the other storage device in which the flat plate member is not stored;
The one and the other storage devices are:
A storage device main body having an opening for storing a flat plate member is provided, and a plurality of receiving members extending in the insertion direction of the flat plate member are provided on opposite side walls of the storage device main body. Each of the receiving members includes a first receiving portion that protrudes relatively small inwardly at an opening of the storage device main body, and a bottom portion of the storage device main body. A second receiving portion that protrudes relatively large inward,
The transfer aid is
A frame structure that defines a moving space in which the flat plate member moves;
A plurality of guide bodies provided at predetermined intervals in the moving space of the frame structure,
The plate-like member stored in the one storage device located on one side of the frame structure is transferred to the other storage device located on the other side of the frame structure through adjacent guide bodies. Aids,
The one storage device, the other storage device, and the transfer assisting tool are integrally rotated so that the one storage device is located above the other storage device from above, and the flat plate member A method of transferring a flat plate member, wherein the flat plate member is transferred by being guided between the guide bodies from the one storage device to the other storage device by its own weight.

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