JP3672141B2 - Adhesive structure of transparent cover of solid-state image sensor device - Google Patents

Adhesive structure of transparent cover of solid-state image sensor device Download PDF

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Publication number
JP3672141B2
JP3672141B2 JP34739096A JP34739096A JP3672141B2 JP 3672141 B2 JP3672141 B2 JP 3672141B2 JP 34739096 A JP34739096 A JP 34739096A JP 34739096 A JP34739096 A JP 34739096A JP 3672141 B2 JP3672141 B2 JP 3672141B2
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transparent cover
adhesive
package
mold frame
image sensor
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JPH10189794A (en
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哲也 赤崎
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株式会社シチズン電子
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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Description

【０００１】
【発明の属する技術分野】
本発明は固体イメージセンサ装置に係り、特にパッケージと透明カバーとの接着部構造に関するものである。
【０００２】
【従来の技術】
本発明者は、表面実装型固体イメージセンサ装置として、図５及び図６に示したようなタイプのものを提案している（特願平８−１２９６９８号）。これは矩形状の底板２と、その上面に接着固定されたモールド枠３とで構成されるパッケージ１の内部に固体イメージセンサチップ（以下ＣＣＤという）４を配置し、パッケージ１の内部を封止するためにモールド枠２の上面全体に接着剤５を塗布し、その上に平板状の透明カバー６を載せ置いた後、キュア炉にて透明カバー６の上面側から加圧しながら接着剤５を熱硬化させ、モールド枠２と透明カバー６とを接着させて小型の固体イメージセンサ装置としたものである。
【０００３】
【発明が解決しようとする課題】
ところで、上記接着工程において、モールド枠２の上に透明カバー６を載せてキュア炉に通す際、温度が徐々に上がるにつれてパッケージ１の内部空気が温められて膨張し、内部圧力が次第に増大していく。一方、上記接着剤５は、一般にエポキシ系のものが使われるために、キュア炉の前半工程では硬化がまだ完全には終了していない。その結果、パッケージ１内で膨張した高圧の内部空気がパッケージ１の最も弱い接着部分から外部に逃げ出す。そして、逃げ出した箇所が接着剤５の熱硬化後には図６に示したような空気の抜穴痕７として残ってしまい、パッケージ１の内部封止が不完全となって、外部雰囲気の影響を受けるなど信頼性に欠けるおそれがあった。
【０００４】
そこで、本発明は、透明カバーによってパッケージの内部を封止する際に、接着剤が熱硬化した後も接着剤に空気の抜穴痕が残らないようにして、パッケージ内部の封止を完全に保つ固体イメージセンサ装置の透明カバー接着部構造を提供することを目的とする。
【０００５】
【課題を解決するための手段】
すなわち、上記課題を解決するために、本発明に係る固体イメージセンサ装置の透明カバー接着部構造は、固体イメージセンサ装置のパッケージを構成するモールド枠と、パッケージの内部を封止するためにモールド枠の上面に載置される透明カバーとを備え、該透明カバーが接着剤を介してモールド枠の上面に固定される固体イメージセンサ装置の透明カバー接着部構造において、前記モールド枠の上面もしくは透明カバーの接着面の少なくとも一方側に前記パッケージの内部から外部に連通する溝部が設けられると共に、この溝部がパッケージの内部側から外部側に向かって次第に溝幅を拡大して形成され、前記モールド枠の上面と透明カバーとの間に介する接着剤が前記溝部内に充填されることを特徴とする。このように、溝部内に接着剤を充填したことで接着剤の溜めを作り、パッケージ内で膨張した空気を積極的に溝部から逃がすようにする一方、溝部内に溜めてある接着剤によって空気の抜けた後の穴を塞ぐようにした。
【０００６】
【発明の実施の形態】
以下、添付図面に基づいて本発明に係る固体イメージセンサ装置の透明カバー接着部構造の実施例を詳細に説明する。図１乃至図３は本発明の接着部構造を適用した固体イメージセンサ装置１０の第１実施例を示したものである。この実施例において、固体イメージセンサ装置１０は、上記従来例と同様、矩形状の底板１２と、その上面に接着固定されたモールド枠１３とで箱形のパッケージ１１が構成されている。そして、底板１２上には細長い形状のＣＣＤ１４がダイボンドされ、更にモールド枠１３の上面に接着剤１５を介して透明カバー１６が載置されることでパッケージ１１の内部が封止されるが、従来例とは異なって、前記モールド枠１３の一方の短辺にパッケージ１１の内部から外部に連通する溝部１７が形成されている。
【０００７】
この溝部１７は、図３に示すように、パッケージ１１の内部側にあって溝幅の狭いストレート部１７ａと、このストレート部１７ａから外部に向かって溝幅が八の字状に拡大するテーパ部１７ｂとで略漏斗状に形成されている。また、溝部１７の深さは、図１及び図２に示したように、ストレート部１７ａ及びテーパ部１７ｂとも上面から一定の深さｈ１で形成されている。上記テーパ部１７ｂの大きさ及び深さｈ１は、パッケージ１１内で膨張した空気が溝部１７から逃げた後に残る空気の抜け穴を塞ぐのに必要な量の接着剤を溜めておくだけのスペースが確保される。それ故、溝部１７の形状は上記のものに限定されるものではなく、例えばストレート部１７ａを設けずに、直接パッケージ１１の内部側から外部側に向けてラッパ状に形成したり、テーパを設けることなく内部側に溝幅の狭い部分を、外部側に溝幅の広い部分を形成しただけのものであっても同様の作用効果がある。即ち、内部側より外部側に溝幅に広い部分を設けることで、内部空気の出口付近に接着剤の溜め量が多くなり、内部空気が外部に放出された後の空気の抜け穴を多量の接着剤が補充して塞ぎ易くなるからである。
【０００８】
従って、上述の構成からなるモールド枠１３の上面に透明カバー１６を接着する場合には、モールド枠１３の上面に液状のエポキシ系接着剤１５を塗布すると同時に溝部１７内にも同じ種類の接着剤１５ａを充填する。そして、モールド枠１３の上面に透明カバー１６を載せ置き、その上から圧力を加えながらキュア炉に入れると、上述したように、温度が徐々に上がるにつれてパッケージ１１の内部空気が温められて膨張し、内部圧力が次第に増大していく。そして、膨張した空気はパッケージ１１の弱い部分から逃げ出そうとするが、透明カバー１６には上から圧力が掛かっているので、モールド枠１３の上面と透明カバー１６との間に塗布された接着剤１５の部分より、上からの圧力が掛からない溝部１７内に充填された液状の接着剤１５ａの方が内部圧力に対して弱くなり、膨張した空気が溝部１７から逃げ易くなる。このように、内部空気を溝部１７から積極的に逃がすことで、透明カバー１６の他の接着部分からの内部空気の放出を防ぐことができる。
【０００９】
図４（ａ），（ｂ），（ｃ），（ｄ）は、上記パッケージ１１内の膨張空気が溝部１７を通って外部に逃げ出す様子を順を追って示したものである。先ず図４（ａ）に示したように、膨張空気の圧力によって溝部１７のストレート１７ａ部分の接着剤１５ａが押されて凹み１９ができる。そして次に、図４（ｂ）に示したように、凹み１９が次第に大きくなると接着剤１５ａの表面張力によって接着剤１５ａの中に気泡２０が形成される。この気泡２０は、図４（ｃ）に示したように、次々と発生して連なり、ストレート部１７ａ及びテーパ部１７ｂを通り抜けて外部に放出される。尚、気泡２０の直径は、溝部１７のストレート部１７ａの溝幅寸法Ｗによって制限を受ける。図４（ｄ）に示したように、パッケージ１１の内部の膨張空気が全て放出されて気泡２０の発生が止まると、テーパ部１７ｂに溜まっている多量の接着剤１５ａが表面張力によって接着剤１５ａ内にできていた気泡２０を潰して通路を塞いでしまい、最終的に溝部１７内に溜まっている接着剤１５ａが熱硬化した時にはパッケージ１１の内部と外部とを完全に遮断することができる。
【００１０】
このように、一時的に溝部１７内に形成された空気の抜け穴は、テーパ部１７ｂ内に充填された接着剤１５ａによって塞がれ、またモールド枠１３と透明カバー１６とは、その間に塗布された接着剤１５によって密着されているので、パッケージ内は外部から完全に遮断されることになり、内部封止が確実に保たれることになる。
【００１１】
なお、上記実施例ではモールド枠１３の一方の短辺に溝部１７を設けた場合について説明したが、他方側の短辺または長辺側に設けることも可能である。また、上記実施例では溝部１７を一箇所に設けた場合について説明したが、複数箇所に設けることも可能である。更に、上記実施例ではモールド枠１３に溝部１７を設けた場合について説明したが、この発明では透明カバー１６の裏面側もしくはモールド枠１３及び透明カバー１６の両方に設けることも可能である。
【００１２】
【発明の効果】
以上説明したように、本発明に係る固体イメージセンサ装置の透明カバー接着部構造によれば、モールド枠又は透明カバーの少なくとも一方にパッケージ内部から外部に連通する溝部を設け、この溝部内に接着剤を充填して接着剤の溜めを作ったので、キュア時にはパッケージ内で膨張した内部空気を溝部から積極的に逃がすことができる一方、溝部内に溜めてある接着剤によって空気の抜けた後の穴を確実に塞ぐことができるので、キュア後に接着剤が硬化した時にはパッケージ内部の封止が完全に保たれて信頼性の向上が図られることになる。
【００１３】
また、本発明における溝部は、パッケージの内部側より外部側に溝幅の広い部分を設けたので、パッケージ内部の膨張空気が外部に逃げる場合に、その出口付近で接着剤の溜め量が多くなるため、逃げた後の空気の抜け穴を多量の接着剤が補充して塞ぎ易くなる。
【図面の簡単な説明】
【図１】本発明に係る透明カバー接着部構造の一実施例を示す斜視図である。
【図２】上記図１のＡ−Ａ線断面図である。
【図３】本発明の透明カバー接着部構造の溝部の拡大平面図である。
【図４】溝部に充填された接着剤の作用を示す説明図である。
【図５】従来の固体イメージセンサ装置の透明カバー接着部構造を示す斜視図である。
【図６】上記図５のＢ−Ｂ線断面図である。
【符号の説明】
１０ 固体イメージセンサ装置
１１ パッケージ
１３ モールド枠
１５ 接着剤
１６ 透明カバー
１７ 溝部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state image sensor device, and more particularly to a structure of an adhesive portion between a package and a transparent cover.
[0002]
[Prior art]
The present inventor has proposed a surface mount type solid-state image sensor device of the type shown in FIGS. 5 and 6 (Japanese Patent Application No. 8-129698). In this case, a solid image sensor chip (hereinafter referred to as CCD) 4 is arranged inside a package 1 composed of a rectangular bottom plate 2 and a mold frame 3 adhered and fixed to the upper surface thereof, and the inside of the package 1 is sealed. In order to do this, the adhesive 5 is applied to the entire upper surface of the mold frame 2, and the flat transparent cover 6 is placed thereon, and then the adhesive 5 is applied while pressing from the upper surface side of the transparent cover 6 in a curing furnace. A small solid-state image sensor device is obtained by thermosetting and bonding the mold frame 2 and the transparent cover 6 together.
[0003]
[Problems to be solved by the invention]
By the way, in the bonding step, when the transparent cover 6 is placed on the mold frame 2 and passed through the curing furnace, the internal air of the package 1 is warmed and expanded as the temperature gradually increases, and the internal pressure gradually increases. Go. On the other hand, since the adhesive 5 is generally an epoxy-based adhesive, the curing has not been completely completed in the first half of the curing furnace. As a result, the high-pressure internal air expanded in the package 1 escapes from the weakest bonded portion of the package 1 to the outside. Then, the escaped portion remains as an air hole 7 as shown in FIG. 6 after the thermosetting of the adhesive 5, and the internal sealing of the package 1 becomes incomplete, and the influence of the external atmosphere is affected. There was a risk of lack of reliability.
[0004]
Therefore, when sealing the inside of the package with a transparent cover, the present invention completely seals the inside of the package by leaving no air holes in the adhesive even after the adhesive is thermally cured. An object of the present invention is to provide a transparent cover bonding portion structure of a solid image sensor device to be maintained.
[0005]
[Means for Solving the Problems]
That is, in order to solve the above-mentioned problem, the transparent cover bonding portion structure of the solid-state image sensor device according to the present invention includes a mold frame constituting the package of the solid-state image sensor device and a mold frame for sealing the inside of the package. A transparent cover mounted on the upper surface of the mold frame , wherein the transparent cover is fixed to the upper surface of the mold frame via an adhesive. A groove portion that communicates from the inside of the package to the outside is provided on at least one side of the adhesive surface, and the groove portion is formed by gradually increasing the groove width from the inside to the outside of the package. The groove is filled with an adhesive interposed between the upper surface and the transparent cover . As described above, the adhesive is stored in the groove by filling the groove with the adhesive, and the air expanded in the package is positively released from the groove. I tried to close the hole after coming out.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a transparent cover bonding portion structure of a solid-state image sensor device according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 3 show a first embodiment of a solid-state image sensor device 10 to which an adhesive portion structure of the present invention is applied. In this embodiment, the solid-state image sensor device 10 includes a box-shaped package 11 including a rectangular bottom plate 12 and a mold frame 13 bonded and fixed to the upper surface thereof, as in the conventional example. An elongated CCD 14 is die-bonded on the bottom plate 12, and the transparent cover 16 is placed on the upper surface of the mold frame 13 with an adhesive 15 to seal the inside of the package 11. Unlike the example, a groove 17 that communicates from the inside of the package 11 to the outside is formed on one short side of the mold frame 13.
[0007]
As shown in FIG. 3, the groove portion 17 includes a straight portion 17 a having a narrow groove width on the inner side of the package 11, and a taper portion in which the groove width increases from the straight portion 17 a to the outside in an eight-letter shape. 17b and a substantially funnel shape. Further, as shown in FIGS. 1 and 2, the depth of the groove portion 17 is formed at a constant depth h1 from the upper surface of both the straight portion 17a and the tapered portion 17b. The size and the depth h1 of the taper portion 17b ensure a space for storing an amount of adhesive necessary to close the air hole remaining after the air expanded in the package 11 escapes from the groove portion 17. Is done. Therefore, the shape of the groove portion 17 is not limited to the above-described one. For example, the straight portion 17a is not provided, and the groove portion 17 is directly formed in a trumpet shape from the inner side to the outer side of the package 11 or provided with a taper. A similar effect can be obtained even if the narrow groove portion is formed on the inner side and the wide groove portion is formed on the outer side. That is, by providing a wider groove width on the outer side than on the inner side, the amount of adhesive pooled near the outlet of the inner air is increased, and a large amount of air holes are released after the inner air is discharged to the outside. This is because the agent is easily replenished by replenishment.
[0008]
Therefore, when the transparent cover 16 is bonded to the upper surface of the mold frame 13 having the above-described configuration, the liquid epoxy adhesive 15 is applied to the upper surface of the mold frame 13 and at the same time, the same kind of adhesive is also provided in the groove portion 17. Fill 15a. Then, when the transparent cover 16 is placed on the upper surface of the mold frame 13 and put into a curing furnace while applying pressure from above, the internal air of the package 11 is warmed and expanded as the temperature gradually increases as described above. The internal pressure gradually increases. The expanded air tries to escape from the weak part of the package 11, but since the pressure is applied to the transparent cover 16 from above, the adhesive 15 applied between the upper surface of the mold frame 13 and the transparent cover 16. The liquid adhesive 15a filled in the groove portion 17 to which no pressure from above is applied is weaker than the internal pressure, and the expanded air easily escapes from the groove portion 17. In this way, by positively escaping the internal air from the groove portion 17, it is possible to prevent the internal air from being released from the other adhesive portions of the transparent cover 16.
[0009]
4 (a), 4 (b), 4 (c), and 4 (d) sequentially show how the expanded air in the package 11 escapes to the outside through the groove portion 17. FIG. First, as shown in FIG. 4A, the adhesive 15a in the straight 17a portion of the groove portion 17 is pushed by the pressure of the expansion air, so that a recess 19 is formed. Then, as shown in FIG. 4B, when the dent 19 is gradually increased, bubbles 20 are formed in the adhesive 15a by the surface tension of the adhesive 15a. As shown in FIG. 4 (c), the bubbles 20 are generated one after another and continue to pass through the straight portion 17a and the tapered portion 17b, and are discharged to the outside. The diameter of the bubble 20 is limited by the groove width dimension W of the straight portion 17 a of the groove portion 17. As shown in FIG. 4D, when all of the expanded air inside the package 11 is released and the generation of the bubbles 20 stops, a large amount of the adhesive 15a accumulated in the taper portion 17b is caused by the surface tension. When the bubble 20 formed inside is crushed and the passage is closed, and finally the adhesive 15a accumulated in the groove portion 17 is thermally cured, the inside and the outside of the package 11 can be completely blocked.
[0010]
Thus, the air passage hole temporarily formed in the groove portion 17 is closed by the adhesive 15a filled in the taper portion 17b, and the mold frame 13 and the transparent cover 16 are applied therebetween. Since the adhesive is in close contact with the adhesive 15, the inside of the package is completely blocked from the outside, and the internal sealing is reliably maintained.
[0011]
In addition, although the said Example demonstrated the case where the groove part 17 was provided in one short side of the mold frame 13, it is also possible to provide in the short side or long side of the other side. Moreover, although the said Example demonstrated the case where the groove part 17 was provided in one place, it is also possible to provide in several places. Furthermore, although the case where the groove part 17 was provided in the mold frame 13 was demonstrated in the said Example, in this invention, it is also possible to provide in both the back surface side of the transparent cover 16, or both the mold frame 13 and the transparent cover 16. FIG.
[0012]
【The invention's effect】
As described above, according to the transparent cover adhesive portion structure of the solid-state image sensor device according to the present invention, the groove portion that communicates from the inside of the package to the outside is provided in at least one of the mold frame and the transparent cover, and the adhesive is provided in the groove portion. The inside of the package that has expanded in the package can be actively released from the groove during the cure, while the hole after the air has been released by the adhesive stored in the groove. Therefore, when the adhesive is cured after curing, the inside of the package is completely sealed and the reliability is improved.
[0013]
In addition, since the groove portion in the present invention is provided with a portion having a wider groove width on the outer side than the inner side of the package, when the expansion air inside the package escapes to the outside, the amount of the adhesive accumulated near the outlet increases. Therefore, a large amount of adhesive supplements the air hole after the escape and becomes easy to close.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a transparent cover bonding portion structure according to the present invention.
FIG. 2 is a cross-sectional view taken along line AA in FIG.
FIG. 3 is an enlarged plan view of a groove portion of the transparent cover bonding portion structure of the present invention.
FIG. 4 is an explanatory view showing the action of an adhesive filled in a groove.
FIG. 5 is a perspective view showing a transparent cover bonding portion structure of a conventional solid-state image sensor device.
6 is a cross-sectional view taken along line BB in FIG.
[Explanation of symbols]
10 Solid Image Sensor Device 11 Package 13 Mold Frame 15 Adhesive 16 Transparent Cover 17 Groove

Claims (1)

固体イメージセンサ装置のパッケージを構成するモールド枠と、パッケージの内部を封止するためにモールド枠の上面に載置される透明カバーとを備え、該透明カバーが接着剤を介してモールド枠の上面に固定される固体イメージセンサ装置の透明カバー接着部構造において、
前記モールド枠の上面もしくは透明カバーの接着面の少なくとも一方側に前記パッケージの内部から外部に連通する溝部が設けられると共に、この溝部がパッケージの内部側から外部側に向かって次第に溝幅を拡大して形成され、前記モールド枠の上面と透明カバーとの間に介する接着剤が前記溝部内に充填されることを特徴とする固体イメージセンサ装置の透明カバー接着部構造。 A mold frame constituting a package of the solid-state image sensor device , and a transparent cover placed on the upper surface of the mold frame for sealing the inside of the package, the transparent cover being placed on the upper surface of the mold frame via an adhesive In the transparent cover adhesion part structure of the solid-state image sensor device fixed to
A groove portion communicating from the inside of the package to the outside is provided on at least one side of the upper surface of the mold frame or the adhesive surface of the transparent cover , and the groove portion gradually increases the groove width from the inside to the outside of the package. A transparent cover bonding part structure of a solid-state image sensor device, wherein the groove is filled with an adhesive formed between the upper surface of the mold frame and the transparent cover .
JP34739096A 1996-12-26 1996-12-26 Adhesive structure of transparent cover of solid-state image sensor device Expired - Fee Related JP3672141B2 (en)

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JP4409338B2 (en) * 2004-03-31 2010-02-03 パナソニック株式会社 Solid-state imaging device and manufacturing method thereof
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WO2009011140A1 (en) * 2007-07-19 2009-01-22 Fujikura Ltd. Semiconductor package and its manufacturing method
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