JP3658188B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for performing predetermined processing on a thin plate substrate (hereinafter simply referred to as “substrate”) such as a semiconductor wafer or a glass substrate for a liquid crystal display device.
[0002]
[Prior art]
CMP (Chemical Mechanical Polishing), which performs planarization by mechanically scraping the surface of the substrate using a chemical abrasive or a pad in order to remove irregularities associated with the multilayer structure of the substrate surface during the substrate processing process The process called is being performed.
[0003]
Since polishing scraps and the like generated by polishing are attached to the surface of the substrate that has been subjected to the CMP process, a process of cleaning the substrate and removing the polishing scraps and the like is performed as a process for the substrate after the CMP process.
[0004]
FIG. 15 shows a conventional substrate processing apparatus 410 that performs substrate cleaning after such CMP processing. This conventional substrate processing apparatus 410 includes a loader 310, an unloader 390, a plurality of processing units 330, 350, 370, and a plurality of transfer robots 320, 340, 360, 380.
[0005]
The processing unit 330 performs a process of removing particles such as polishing dust adhering to the substrate by CMP by brushing both surfaces of the substrate using a front surface brush for cleaning the substrate surface and a back surface brush for cleaning the back surface of the substrate. The processing unit 350 performs a process of removing fine particles adhering to the substrate surface using a brush having a higher particle removal capability. In these processing units 330 and 350, in order to enhance the cleaning effect by the brush, a predetermined processing liquid is also discharged to the front surface or the back surface of the substrate. Further, in the processing unit 370, after the final rinse of the substrate using a rinse liquid such as pure water, the substrate is subjected to high-speed spin dry drying.
[0006]
In the loader 310, a cassette containing a plurality of substrates after CMP processing is immersed in water, and when the substrate is transferred to the processing unit 330, the cassette is pulled up from the water, and the transfer robot 320 takes out the substrate. It is configured to be able to. The reason why the cassette in which the substrate is stored in the loader 310 is immersed in water is that it is necessary not to dry the substrate until the cleaning process is completed in order to enhance the cleaning effect on the substrate after the CMP process.
[0007]
The transfer robot 320 takes out the substrate from the loader 310 and transfers it to the processing unit 330. The transfer robot 340 takes out the substrate that has undergone the double-sided cleaning process in the processing unit 330 and transfers the substrate to the processing unit 350. The transfer robot 360 takes out the substrate that has been subjected to the surface cleaning process in the processing unit 350 and transfers the substrate to the processing unit 370. Further, the transfer robot 380 takes out the substrate that has been subjected to the final rinse in the processing unit 370 and has been dried, and stores the substrate in a cassette provided in the unloader 390.
[0008]
[Problems to be solved by the invention]
In the conventional substrate processing apparatus 410 as described above, a dedicated transfer robot for transferring the substrate is provided between the processing units. Therefore, although there are three processing units for the substrate, four transfer robots are provided. It has been. Therefore, there is a problem that the footprint of the entire apparatus becomes large. This problem appears more prominently when the substrate processing apparatus 410 is in-line with the CMP apparatus.
[0009]
FIG. 16 is a schematic diagram showing a configuration when a conventional substrate processing apparatus 410 is in-line with an actual CMP apparatus. Since the conventional substrate processing apparatus 410 cannot directly transfer the substrate to and from the CMP apparatus 200, a conveyor 420 is provided. In addition, since the conventional substrate processing apparatus 410 includes only a loader for the cleaning process after the CMP process, an indexer 430 for delivering the substrate to be processed to the CMP apparatus is further provided and connected to the conveyor 420. The Rukoto. The substrate dispensed from the indexer 430 is transported to the CMP apparatus 200 by the conveyor 420, and the substrate after the CMP process is transported to the loader 310 of the substrate processing apparatus 410 by the conveyor 420 again.
[0010]
As described above, when the conventional substrate processing apparatus 410 is in-line with the CMP apparatus, the footprint is increased because the connection form is provided via the conveyor 420.
[0011]
In addition, since the conventional substrate processing apparatus 410 is provided with four transfer robots, it is necessary to control each transfer robot individually, which complicates the control mechanism and raises the cost of the apparatus. .
[0012]
The present invention has been made in view of the above problems, minimizes the footprint, simplifies the control mechanism when transporting between the processing units, and directly with an external device such as a CMP apparatus. It is an object of the present invention to provide a substrate processing apparatus that can be inlined.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, an invention according to claim 1 is provided on a substrate. Includes cleaning process A substrate processing apparatus for performing predetermined processing, wherein (a) a plurality of processing units arranged in a predetermined direction and performing predetermined processing on a substrate, and (b) arranged on one end side of the plurality of processing units A substrate mounting unit for temporarily mounting the substrate when the substrate is transported to the first processing unit disposed on one end side adjacent to the processed processing unit, and (c) a plurality of processing units are disposed. And a substrate storage part for arranging a container for storing a substrate, and (d) a plurality of processing units, a substrate mounting part, and a substrate storage part. A transport path for transporting the substrate, and (e) a container that is movable along the transport path, disposed in the substrate storage section, a substrate placement section, and one end side of the plurality of processing sections. Is a first transport mechanism for transporting a substrate to and from a second processing section disposed on a different other end, and (f) an adjacent process among a plurality of processing sections. A plurality of substrate holding units for transferring the substrates between them, and a second transfer mechanism for transferring the substrates between adjacent processing units by synchronizing the operations of the plurality of substrate holding units. .
[0014]
The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the substrate placement unit temporarily places the substrate when transporting the substrate from the first transport mechanism to the external device, and When the substrate from the external device is transferred to the first processing unit, the substrate is temporarily placed.
[0015]
According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, the substrate mounting unit is configured to (b-1) first substrate on which the substrate is temporarily mounted when the substrate is transferred to the external device. A placement unit; and (b-2) a second substrate placement unit that temporarily places the substrate when the substrate is transferred from the external device to the first processing unit.
[0016]
According to a fourth aspect of the present invention, in the substrate processing apparatus according to the third aspect, the first substrate mounting portion is disposed on the lower side and the second substrate mounting portion is disposed on the upper side. .
[0017]
According to a fifth aspect of the present invention, in the substrate processing apparatus according to the third or fourth aspect, the second substrate mounting unit keeps the substrate transported from the external device in a wet state.
[0018]
According to a sixth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fifth aspects, the second transport mechanism performs the operation of (f-1) holding the substrates of the plurality of substrate holding units. The substrate holding unit driving means provided for each substrate holding unit so as to be performed in synchronization, and (f-2) moving the plurality of substrate holding units and the substrate holding unit driving unit together in a predetermined direction And an inter-process transport means for transporting a substrate between adjacent processing sections.
[0019]
According to a seventh aspect of the present invention, in the substrate processing apparatus of the sixth aspect, the second transfer mechanism is further provided in parallel with (f-3) a predetermined direction, and a plurality of substrate holding portions are connected. And (f-4) a rotation driving means for rotating the plurality of substrate holders around the rotation axis by rotating the rotation axis.
[0020]
According to an eighth aspect of the present invention, in the substrate processing apparatus according to the sixth or seventh aspect, each of the plurality of substrate holding portions includes a pair of arms having a first arm and a second arm for holding the substrate. The substrate holding unit driving means includes (f-1-1) first arm driving means for simultaneously moving a plurality of first arms of the plurality of substrate holding units along a predetermined direction, and (f-1-2) ) A second arm driving means for simultaneously moving a plurality of second arms of the plurality of substrate holding portions along a predetermined direction.
[0021]
According to a ninth aspect of the present invention, in the substrate processing apparatus according to any one of the first to eighth aspects, the first transfer mechanism includes: (e-1) a container disposed in the substrate storage unit and a substrate mounting. A first transport means for transporting the substrate to and from the placement section; and (e-2) a second transport that is vertically movable and takes the substrate from the second processing section and transports the substrate to the first transport means. Means.
[0022]
According to a tenth aspect of the present invention, in the substrate processing apparatus according to any one of the first to ninth aspects, (g) the substrate processing apparatus is vertically movable, and a predetermined process is performed in a plurality of processing units. A cover that descends and covers the plurality of processing units is provided.
[0023]
According to an eleventh aspect of the present invention, in the substrate processing apparatus according to the tenth aspect, the cover includes (g-1) a plurality of cleaning liquid discharge nozzles for cleaning the plurality of substrate holding units.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
<A. First Embodiment>
a-1) Overall configuration of the substrate processing apparatus 100
A first embodiment of the present invention will be described. FIG. 1 is a plan view showing a substrate processing apparatus 100 according to the first embodiment. FIG. 2 is a schematic cross-sectional view in the YZ plane of the substrate processing apparatus 100 according to the first embodiment. Furthermore, FIG. 3 is a schematic sectional view in the ZX plane of the substrate processing apparatus 100 according to the first embodiment.
[0025]
In the substrate processing apparatus 100 of this embodiment, a pod (POD) 9 that stores a plurality of substrates is used as a container, and a plurality of substrates to be subjected to CMP processing are sealed in the pod 9. Arranged in the storage unit 7. A plurality of pods 9 are arranged in the X direction in the substrate storage unit 7.
[0026]
A plurality of processing units 30, 40, and 50 are provided with a conveyance path 15 provided along the X axis between the substrate storage unit 7 and the substrate storage unit 7. These processing units 30, 40, and 50 are also arranged along the X axis, and are adjacent to each other according to the processing order for the substrate W.
[0027]
As shown in FIG. 3, the processing unit 30 disposed on one end side of the plurality of processing units has a surface brush 31 that cleans the surface of the substrate while the support member 33 supports the substrate immediately after the CMP processing is completed. And a back surface brush 32 for cleaning the back surface of the substrate, and a processing unit that performs processing for removing particles such as polishing dust adhered to the substrate by CMP processing by brushing both surfaces of the substrate. In the processing unit 30, in order to enhance the cleaning effect of the front brush 31 and the back brush 32, a predetermined processing liquid such as an alkaline liquid is supplied to the front and back surfaces of the substrate from a nozzle (not shown).
[0028]
The processing unit 40 is a processing unit that removes fine particles adhering to the substrate surface using a brush 41 having a higher particle removal capability. In the processing unit 40, in order to enhance the cleaning effect of the brush 41, a predetermined processing liquid can be discharged from the nozzle 43 to the surface of the substrate W, and the rotating unit 42 rotates while holding the substrate W. Is also configured to be possible.
[0029]
Further, the processing unit 50 disposed on the other end side of the plurality of processing units is placed in a state in which the substrate W can be rotated by the rotating unit 52, and rinsed with pure water or the like from the nozzle 53 while rotating the substrate W. The processing unit performs the final rinsing of the substrate W by discharging the liquid toward the surface of the substrate W, and then stops the discharge of the rinsing liquid and performs high-speed spin dry drying of the substrate W.
[0030]
Note that a filter fan unit FFU is provided above the transport path 15 and the processing units 30, 40, 50 and the like in order to keep the atmosphere inside the substrate processing apparatus 100 clean. A clean air downflow is formed from the filter fan unit FFU toward the transport path 15, the processing units 30, 40, 50, and the like.
[0031]
In the substrate processing apparatus 100, as shown in FIG. 1, an adjacent portion on the X direction side of the processing unit 30 is configured as an interface portion with a CMP apparatus 200 that is an external device. A placement unit 20 is provided. As shown in FIG. 3, in the substrate platform 20, as the position where the substrate can be transferred to and from the transfer unit 210 provided in the CMP apparatus 200, two transfer positions La and Lb in the vertical direction are provided. Is set.
[0032]
The delivery position Lb is a position where the substrate is temporarily placed when the substrate W is delivered to the CMP apparatus 200 side. Then, the transport unit 210 of the CMP apparatus 200 accesses the delivery position Lb of the substrate platform 20, transports the substrate W to the CMP apparatus 200 side, and performs a predetermined polishing process.
[0033]
The delivery position La is a position where the substrate is temporarily placed when the transport unit 210 of the CMP apparatus 200 delivers the substrate after the CMP process to the substrate processing apparatus 100. The transport unit 210 of the CMP apparatus 200 accesses the transfer position La of the substrate platform 20 and places the substrate W on which the CMP process has been completed.
[0034]
The transfer path 15 provided between the processing units 30, 40, 50 and the substrate platform 20 and the substrate storage unit 7 is provided with a transfer robot 10 that can move along the X-axis direction. Yes. The transport robot 10 includes two arms 11 in the vertical direction, and transports the arm 11 while holding the substrate W. As shown in FIG. 2, a ball screw 13 provided in the X-axis direction is screwed onto the base portion 14, and the transfer robot 10 can move along the X-axis by rotating the ball screw 13. ing. In addition, the transfer robot 10 can transfer the substrate also in the Z-axis direction by elevating and lowering the elevating part 12, and can also rotate around the θ axis. Therefore, the transfer robot 10 can access the plurality of pods 9, the substrate placement unit 20, and the processing unit 50 arranged in the substrate storage unit 7, and can transfer a substrate between them. It is configured to be able to. A transport mechanism that can access the plurality of pods 9, the substrate placement unit 20, and the processing unit 50 and transport a substrate between them, as in the transport robot 10, is referred to as a first transport mechanism.
[0035]
Here, when the arm 11 of the transfer robot 10 accesses the pod 9, it is necessary to open the sealed pod 9 to make the arm 11 accessible. Therefore, the substrate processing apparatus 100 is provided with a pod opener 8 at each position where the pod 9 is placed. When the pod 9 is placed in the substrate storage portion 7 as in the state 1a shown in FIG. 2, the pod opener 8 extends the arm to unlock the lid of the pod 9. Then, as in the state 1b, the arm moves in the Y direction while holding the lid of the pod 9, and the pod 9 is released from the sealed state. Since the arm 11 of the transport robot 10 cannot access the pod 9 in the state 1b, the pod opener 8 lowers the arm holding the lid as in the state 1c. By such an operation, the sealed state of the pod 9 is released, and the arm 11 of the transfer robot 10 can access the substrate in the pod 9. The pod is sealed so as not to contaminate the substrate by keeping the substrate in a clean atmosphere isolated from the outside air, but the inside of the substrate processing apparatus 100 is as clean as the inside of the pod 9. In the opening operation of the pod 9, the lid is opened inside the substrate processing apparatus 100, so that there is no problem of contaminating the substrate W.
[0036]
Then, the transfer robot 10 extends the arm 11 toward the inside of the pod 9 and takes out one substrate W from the inside of the pod 9. Then, the transfer robot 10 moves in the X direction and the Z axis direction, and rotates about the θ axis, and places the substrate W taken out from the pod 9 on the delivery position Lb of the substrate platform 20. To do. Further, the transfer robot 10 accesses the processing unit 50 and takes out the substrate W for which all the processes are completed. Then, the transfer robot 10 moves in the X direction and moves in the Z axis direction, performs a rotation operation about the θ axis, accesses a predetermined position of the pod 9, and finishes the cleaning process after the CMP process. W is stored.
[0037]
Further, in the substrate processing apparatus 100, the substrate W after the CMP process placed on the substrate platform 20 is transported to the processing unit 30, and the substrate that has been processed in the processing unit 30 is transported to the processing unit 40. A shuttle transport robot 60 is provided to transport the substrate that has been processed by the processing unit 40 to the processing unit 50. As will be described later, the shuttle transport robot 60 is configured to be movable along the X axis, and the substrate W placed at the transfer position La of the substrate platform 20 is transferred to the processing unit 30 and processed. The substrate W that has been processed in the unit 30 is transferred to the processing unit 40, and the substrate W that has been processed in the processing unit 40 is transferred to the processing unit 50. It is configured to be performed simultaneously. The shuttle transfer robot 60 functions as a second transfer mechanism.
[0038]
Thus, in the substrate processing apparatus 100 of this embodiment, the transfer robot 10 performs a transfer operation from the pod 9 to the substrate platform 20, and the shuttle transfer robot 60 moves from the substrate platform 20 to the processing unit 30, Transport operation to 40 and 50 is performed. The transport robot 10 is again in charge of transport from the processing unit 50 to the pod 9.
[0039]
In addition, the substrate processing apparatus 100 according to this embodiment is provided with a cover 80 that can be moved up and down so that processing liquids and the like used in processing in each processing unit 30, 40, 50 are not scattered outside the processing unit. It has been. When the substrate is transferred between the processing units by the shuttle transfer robot 60, the cover 80 is lifted by a lifting / lowering driving unit such as a cylinder (not shown) and does not buffer the movement of the shuttle transfer robot 60 along the X axis. Thus, when the transfer between the processing units by the shuttle transfer robot 60 is completed and the cleaning process is performed in each processing unit, the cover 80 is lowered by the elevating drive means, and each processing unit 30, 40, 50 is moved. It is comprised so that the side surface etc. may be covered. Therefore, when processing is performed on the substrate in each processing unit, processing liquid and particles from other processing units are not attached, and normal processing can be performed.
[0040]
The overall configuration of the substrate processing apparatus 100 of this embodiment is as described above, and a plurality of processing units 30, 40, and 50 for processing a substrate are arranged adjacent to each other along the X axis. In addition, since the substrate can be transferred between the processing units by the single shuttle transfer robot 60, the footprint of the substrate processing apparatus 100 can be reduced. In addition, since the substrate placing unit 20 can be directly inlined with the CMP apparatus 200 which is an external apparatus, the footprint when the substrate processing apparatus 100 and the CMP apparatus 200 are inlined can be reduced. ing.
[0041]
a-2) Substrate placing part 20
Here, a detailed configuration of the substrate platform 20 will be described. FIG. 4 is a diagram showing a configuration of the substrate platform 20. 4A is a perspective view of the substrate platform 20, and FIG. 4B is a cross-sectional view in the YZ plane.
[0042]
As shown in FIG. 4, the substrate platform 20 has a two-stage configuration in which the portion on which the substrate W is to be placed. The lower first substrate placement unit 20B is a placement unit that temporarily places the substrate W when the substrate W to be subjected to the CMP process is transported to the CMP apparatus 200, and the upper second substrate placement unit 20B. Reference numeral 20A denotes a placement unit on which the substrate W that has been subjected to the polishing process in the CMP apparatus 200 is temporarily placed. Thus, by setting the substrate mounting part 20 in a two-stage configuration, the mounting position of the substrate W before and after the processing by the external apparatus such as the CMP apparatus 200 can be provided differently, and according to each before and after the processing. It becomes possible to handle the substrate. Further, in the substrate processing process, in order to reduce the possibility of particles and the like adhering to the substrate W after the CMP process, the substrate W is configured to be disposed above the substrate before the process. Generally, the substrate placement unit 20 of the substrate processing apparatus 100 has such a configuration.
[0043]
The first substrate platform 20B is provided with openings on the transport path 15 side of the substrate processing apparatus 100 and the CMP apparatus 200 side. Then, from the side of the transport path 15, the arm 11 of the transport robot 10 enters the first substrate platform 20 </ b> B while holding the substrate W, and the substrate W is placed on the pins 23. Further, the transport unit 210 of the CMP apparatus 200 enters from the CMP apparatus 200 side, and the substrate W placed on the pins 23 is taken out and transported into the CMP apparatus 200.
[0044]
The second substrate platform 20A is provided with an opening that allows the transfer unit 210 of the CMP apparatus 200 and the shuttle transfer robot 60 to access. From the CMP apparatus 200 side, the transfer unit 210 enters the substrate after the polishing process or the like is held, places the substrate on the pins 23, and then retreats from the inside of the second substrate placement unit 20A.
[0045]
In addition, the second substrate platform 20A is provided with a nozzle 21 as a moisture supply means, and a treatment liquid such as pure water is supplied from the nozzle 21 to keep the substrate W after CMP processing in a wet state. It is comprised so that it may discharge toward. Therefore, the substrate processing apparatus 100 does not require a loader for immersing the substrate in conventional water.
[0046]
The second substrate platform 20A is provided with a cup 22 so that a processing liquid such as pure water discharged from the nozzle 21 onto the substrate W does not flow down to the first substrate platform 20B. It is configured to collect and drain pure water that flows from W. With such a configuration, it becomes possible to always keep the substrate W after the CMP process in a wet state, and it is possible to enhance the cleaning effect of the cleaning process performed in the processing units 30, 40, and 50 thereafter.
[0047]
a-3) Shuttle transfer robot 60
Next, a detailed configuration of the shuttle transfer robot 60 will be described. FIG. 5 is a perspective view of the shuttle transfer robot 60.
[0048]
The shuttle transfer robot 60 is provided with a plurality (three in the figure) of substrate holding units 61 for holding the substrates when transferring the substrates between the processing units, and each substrate holding unit 61 has a first arm. 61a and a second arm 61b. The first arm 61a and the second arm 61b are provided with a holding member 62 for holding the substrate W at the periphery.
[0049]
A rotation shaft 66 supported by a support member 68 is fitted into the base end portions of the first arm 61a and the second arm 61b. The first arm 61 a and the second arm 61 b are configured to perform a rotating operation in the YZ plane as the rotating shaft 66 rotates.
[0050]
In addition, each first arm 61a of each substrate holding part 61 is coupled to the first rod 71a via a connecting member at the base end part. Therefore, when the first rod 71a moves in the X direction, the plurality of first arms 61a for each substrate holding part 61 move in the X direction in synchronization. Further, the first rod 71a and the cylinder rod of the cylinder 64a fixed to the base 63 are connected by a connecting member 72a. Since the cylinder 64a is arranged to extend and contract the cylinder rod along the X axis, driving the cylinder 64a causes the first rod 71a to move along the X axis. Each first arm 61a in the substrate holding unit 61 is configured to be able to operate in synchronization with the + X direction or the −X direction. That is, the cylinder 64a functions as first arm driving means.
[0051]
On the other hand, each 2nd arm 61b about each board | substrate holding | maintenance part 61 is similarly connected with the 2nd rod 71b via the connection member in the base end part. Therefore, when the second rod 71b moves in the X direction, the plurality of second arms 61b for each substrate holding portion 61 move in the X direction in synchronization. Further, the second rod 71b and the cylinder rod of the cylinder 64b fixed to the base 63 are connected by a connecting member 72b. Since the cylinder 64b is arranged to extend and contract the cylinder rod along the X axis, driving the cylinder 64b causes the second rod 71b to move along the X axis. Each of the second arms 61b in the substrate holding unit 61 is configured to be able to operate in synchronization with the −X direction or the + X direction. That is, the cylinder 64b functions as a second arm driving unit.
[0052]
The first arm driving means and the second arm driving means are provided in common to the substrate holding portions 61 so as to synchronize the operations of holding the substrates W of the plurality of substrate holding portions 61. It functions as a substrate holding part driving means.
[0053]
When a controller of the substrate processing apparatus 100 (not shown) sends a drive command to the cylinders 64a and 64b to contract the cylinder rods by a predetermined amount, the first arms 61a move in the −X direction, Each second arm 61b moves in the + X direction. By this operation, an operation of holding the substrate by the shuttle transport robot 60 (that is, a chucking operation) is performed. Since this chucking operation is an operation of sandwiching the substrate by the two arms of the first arm 61a and the second arm 61b, the chucking operation is carried to each processing unit as compared with the one that only supports the lower surface of the substrate. The position alignment of the substrate to be performed can be performed.
[0054]
Conversely, when the controller sends a drive command to each cylinder 64a, 64b to extend the cylinder rod by a predetermined amount, each first arm 61a moves in the + X direction, while each second arm 61b Move in the X direction. By this operation, the operation of releasing the substrate holding state of the shuttle transport robot 60 is performed.
[0055]
In addition, a motor 65 is fixed to the base 63, and a belt 67 is attached to the rotating shaft of the motor 65. The belt 67 is also attached to a belt attachment member 69 provided on the rotation shaft 66. Accordingly, by rotating the motor 65, the rotating shaft 66 can be rotated via the belt 67, and the plurality of substrate holding portions 61 are also rotated by driving the motor 65. By driving the motor 65 with the plurality of substrate holding portions 61 holding the substrate, the substrate also rotates in the YZ plane.
[0056]
Here, when the motor 65 is driven to give the rotation shaft 66 a slight amount of rotation in the α direction, the substrate holding unit 61 in the substrate holding state performs a slight amount of rotation in the α direction in that state. Accordingly, the substrate W placed on the pin 23 of the second substrate platform 20A of the substrate platform 20 is held by the substrate holder 61 and is detached from the pin 23 by rotating in the α direction. It becomes. Similarly, the substrates held by the processing units 30 and 40 are released from the holding state in the processing units 30 and 40 by being held by the substrate holding unit 61 and rotating in the α direction.
[0057]
A moving table 75 is connected to the lower portion of the base 63, and the ball screw 74 screwed to the moving table 75 is rotated by driving the motor 73, whereby the moving table 75 moves along the X axis. . Accordingly, by driving the motor 73, the base 63 also moves along the X axis, and at the same time, the plurality of substrate holders 61 also move along the X axis. That is, the motor 73 serves as an inter-processing unit transport unit for transporting the substrate between the processing units.
[0058]
As described above, the shuttle transport robot 60 holds the substrate by driving the cylinders 64a and 64b during the transport of the substrate between the processing units, and also places the placement surface in each processing unit by the rotational drive by the motor 65. Then, the substrate is lifted by rotating it in the α direction so that no buffering with each processing unit occurs, and then the motor 73 is driven to move the base 63 in the −X direction. To the processing section. Then, the motor 65 is driven to rotate the substrate in the -α direction, and the cylinders 64a and 64b are driven to release the substrate holding state so that the conveyed substrate is placed on each processing unit.
[0059]
The shuttle transport robot 60 shown in FIG. 5 is provided with three substrate holders 61. Of these, the substrate holder 61 provided closest to the + X direction is the substrate holder 20 to the processor 30. The substrate holding unit 61 provided in the center is in charge of transferring the substrate from the processing unit 30 to the processing unit 40, and the substrate holding unit 61 provided closest to the −X direction is a processing unit. Responsible for substrate transfer from the unit 40 to the processing unit 50. The state of this substrate conveyance will be described with reference to FIGS. FIGS. 6 and 7 are diagrams illustrating substrate conveyance between processing units.
[0060]
First, as shown in FIG. 6, the shuttle transport robot 60 is located on the side corresponding to the substrate platform 20 and the processing units 30 and 40. During the processing of the substrate W in the processing units 30 and 40, the three substrate holding units 61 are at positions indicated by alternate long and short dash lines in the drawing. When the substrate processing in the processing units 30 and 40 is completed, the above-described cylinders 64a and 64b are driven, so that each substrate holding unit 61 is moved to the position indicated by the solid line in FIG. The substrate W in the unit 30 and the processing unit 40 is held. Then, after each substrate W is raised by the rotation operation of the motor 65 described above, the shuttle transport robot 60 is moved in the −X direction by driving the motor 73, and is moved to the position shown in FIG.
[0061]
Then, after the substrate W transported to each processing unit 30, 40, 50 is lowered, the substrate holding unit 61 indicated by a solid line in the drawing is retracted to a position indicated by a one-dot chain line, whereby the substrate W is transferred to each processing unit. Complete the transfer operation. When the substrate holder 61 is retracted, it is retracted to a retract position 91 provided between the processing units.
[0062]
As described above, the shuttle transfer robot 60 of this embodiment is configured to simultaneously transfer the substrate W between the adjacent processing units, and thus realizes efficient transfer of the substrate W between the processing units. In addition, the transfer robot is individually used for substrate transfer from the substrate placement unit 20 to the processing unit 30, substrate transfer from the processing unit 30 to the processing unit 40, and substrate transfer from the processing unit 40 to the processing unit 50. There is no need to provide it, and the footprint of the substrate processing apparatus 100 can be reduced.
[0063]
In addition, it is comprised so that the conveyance robot 10 may take out the board | substrate W from the process part 50 as mentioned above.
[0064]
a-4) Cover 80
Next, the above-described cover 80 will be described. FIG. 8 is a perspective view of the cover 80. As shown in FIG. 8, the cover 80 is configured to cover each processing unit so that processing liquid or the like does not scatter during substrate processing in the processing units 30, 40, and 50. In addition, when the cover 80 is lowered, a recess 88 is provided at a position corresponding to each retreat position 91 so as not to be buffered by the substrate holding portion 61 of the shuttle transport robot 60 retreated to the retreat position 91. Therefore, when the substrate holding unit 61 of the shuttle transport robot 60 is retracted to the position indicated by the one-dot chain line in FIG. 7, if the cover 80 is lowered, the cover 80 does not contact the substrate holding unit 61 and each processing unit 30. , 40, 50 can be satisfactorily covered.
[0065]
Therefore, if the cover 80 is lowered immediately after the substrate holding part 61 of the shuttle transport robot 60 is retracted to the retracting position 91, the above-described substrate processing in each of the processing units 30, 40, 50 can be started.
[0066]
Further, the cover 80 is provided with a cleaning liquid discharge nozzle 82 so that the substrate holding part 61 at the retracted position 91 shown by a one-dot chain line in FIG. 7 can be cleaned. That is, a rinse liquid such as pure water is discharged from the cleaning liquid discharge nozzle 82 to the substrate holding portion 61 at the retreat position 91, so that the substrate holding portion 61 (particularly the holding member 62 is transported between the processing portions). It becomes possible to clean the dirt and the like adhering to ().
[0067]
a-5) Relationship between cover and transport between processing parts
Here, the relationship between the cover 80 and the shuttle transfer robot 60 will be described. FIG. 9 is a schematic side view showing the relationship between the cover 80 and the substrate holding unit 61 when the shuttle transfer robot 60 transfers the substrate W between the processing units. As shown in FIG. 9, the rotation shaft 66 of the shuttle transfer robot 60 rotates slightly in the α direction, and the substrate holding unit 61 carries the substrate W while the substrate W is lifted. At this time, the cover 80 is in a state of being lifted by lifting means (not shown) so as not to be buffered during the transport operation of the shuttle transport robot 60.
[0068]
By the way, when the transfer of the substrate W between the processing units is finished and the cover 80 is lowered and the substrate processing in each processing unit is started, the shuttle transfer robot 60 at the position corresponding to the processing units 30, 40, 50 is moved. In preparation for the next transfer between the processing units, it is performed in advance as needed to be moved to a position corresponding to the substrate mounting unit 20 and the processing units 30 and 40.
[0069]
However, since each processing unit is processing a substrate and the cover 80 is in a closed state, when the shuttle transport robot 60 is moved in the + X direction while the substrate holding unit 61 is in the retracted position 91, the cover 80 is moved. Collide with.
[0070]
Therefore, in the shuttle transfer robot 60 of this embodiment, as shown in FIG. 10, the substrate holding unit 61 is raised by rotating the rotation shaft 66 of the shuttle transfer robot 60 by about 90 degrees, and the cover 80 is viewed from the side. And a state in which the substrate holding part 61 does not overlap. Thus, even if the shuttle transport robot 60 moves in the X direction, the substrate holding unit 61 does not buffer the cover 80, and the shuttle transport robot 60 is moved to the substrate platform 20 during substrate processing in each processing unit. , It can be moved in advance to a position corresponding to the processing units 30 and 40. The above-described motor 65 serves as a drive source when the substrate holder 61 is raised, and the above-described motor 73 serves as a drive source when the shuttle transport robot 60 is moved in the X direction.
[0071]
Then, when the shuttle transport robot 60 moves in the X direction and reaches a position corresponding to the substrate placement unit 20 and the processing units 30 and 40, the motor 65 is driven in the reverse direction to move the substrate holding unit 61 in the standing state. Return to the almost horizontal state again.
[0072]
By such an operation, the substrate holding unit 61 indicated by the one-dot chain line in FIG. 7 can be moved to the position of the substrate holding unit 61 indicated by the one-dot chain line in FIG. 6 during the processing of the substrate in each processing unit. By waiting at that position until the substrate processing in the unit is completed, the next substrate W can be efficiently transferred between the processing units.
[0073]
When the substrate holder 61 is to be cleaned while waiting at the position of the substrate holder 61 indicated by the one-dot chain line in FIG. 6 during the processing of the substrate, the substrate holder is placed near the substrate holder 20. A nozzle (not shown) for discharging a rinsing liquid may be provided for the substrate holding unit 61 that chucks the substrate W in the substrate 20. The substrate holder 61 can be cleaned by discharging the rinse liquid from the nozzle provided in the vicinity of the substrate platform 20 and the cleaning liquid discharge nozzle 82 provided in the cover 80.
[0074]
As described above, the substrate processing apparatus 100 according to this embodiment arranges a plurality of processing units 30, 40, and 50 that process a substrate along the X axis according to the processing order of the substrates. In addition, since one shuttle transfer robot 60 having a plurality of substrate holding units 61 is configured to collectively transfer substrates between adjacent processing units, each of the processing units is independent of each other. It is not necessary to provide a transport robot, and the footprint can be minimized.
[0075]
Further, since the shuttle transport robot 60 uses a common drive source such as the cylinders 64a and 64b and the motor 65 when operating the plurality of substrate holding units 61, the shuttle transport robot 60 can transport the substrates between the processing units. Each of the substrate holding units 61 can be operated synchronously, and transported from the substrate platform 20 to the processing unit 30, transported from the processing unit 30 to the processing unit 40, and transferred from the processing unit 40 to the processing unit 50. In spite of being able to carry out conveyance simultaneously, the control mechanism in the case of conveyance can be comprised simply.
[0076]
Furthermore, since the substrate placement unit 20 that serves as an interface with an external device such as a CMP apparatus is provided at a position adjacent to the processing unit 30, direct inlining with the external device such as a CMP apparatus can be achieved. FIG. 11 is a diagram showing a configuration in which the substrate processing apparatus 100 of this embodiment is in-line with the CMP apparatus 200. As shown in FIG. 11, when the substrate processing apparatus 100 and the CMP apparatus 200 are made in-line, it is not necessary to provide a conveyor as in the conventional case, so that the footprint can be kept extremely small.
[0077]
Further, in the substrate platform 20, pure water or the like is discharged toward the substrate W from the nozzle 21 to keep the substrate in a wet state on the second substrate platform 20A on which the substrate after CMP processing is placed. It is comprised so that the cleaning effect of the cleaning process performed in each process part can be improved.
[0078]
<B. Second Embodiment>
In the configuration of the substrate processing apparatus 100 according to the first embodiment described above, piping for supplying a processing liquid or discharging the processing liquid is accommodated in the lower space of each processing unit 30, 40, 50.
[0079]
Therefore, the chemical cabinet for gas-liquid separation of the processing liquid and other processing, or for storing the processing liquid cannot be installed inside the substrate processing apparatus 100, and the first embodiment The substrate processing apparatus 100 must be placed in a different place. For this reason, the chemical cabinet has a certain amount of footprint separately from the substrate processing apparatus 100.
[0080]
Further, when the chemical solution cabinet is accommodated in the lower space of each processing unit 30, 40, 50 in the substrate processing apparatus 100 of the first embodiment, the height position of each processing unit is increased. However, since the transfer robot 10 shown in FIG. 2 does not have a stroke in the Z direction more than that for accessing the substrate stored in the pod 9 or the substrate of the processing unit 50, the transfer robot 10 is transferred when the height of the processing unit 50 becomes high. The robot 10 cannot access the substrate of the processing unit 50.
[0081]
Therefore, the substrate processing apparatus 100 according to the second embodiment is realized as a configuration in which the chemical solution cabinet is accommodated in the lower space of each processing unit without increasing the Z-direction stroke of the transfer robot 10.
[0082]
The second embodiment of the present invention will be described below. FIG. 12 is a plan view showing the substrate processing apparatus 100 according to the second embodiment. FIG. 13 is a schematic cross-sectional view in the YZ plane of the substrate processing apparatus 100 according to the second embodiment. Furthermore, FIG. 14 is a schematic cross-sectional view in the ZX plane of the substrate processing apparatus 100 according to the second embodiment. In FIG. 12 to FIG. 14, the same reference numerals are given to components having the same functions as those already described in the first embodiment.
[0083]
Also in the substrate processing apparatus 100 of this embodiment, the pod 9 is used as a storage device, and a plurality of substrates W to be subjected to CMP processing are disposed in the substrate storage portion 7 in a state of being sealed in the pod 9. In addition, a plurality of processing units 30, 40, and 50 similar to those in the first embodiment are provided with a conveyance path 15 provided along the X-axis interposed between the substrate storage unit 7 and the substrate storage unit 7.
[0084]
Also in this substrate processing apparatus 100, the adjacent part on the X direction side of the processing unit 30 is configured as an interface part with the CMP apparatus 200 which is an external apparatus, and the substrate platform 20 is provided in this part. ing. In the substrate platform 20 of this embodiment, as shown in FIG. 14, the first substrate platform 20B and the second substrate platform 20A are provided in a separated state.
[0085]
The first substrate platform 20B, which is a substrate transfer position when the transfer robot 10 takes out the substrate W from the pod 9 and transfers it to the CMP apparatus 200 side, is provided at a height position that the transfer robot 10 can access. Need to be done. Therefore, in the substrate processing apparatus 100 of this embodiment, the delivery position Lb of the first substrate platform 20B is set to be the same height position as in the first embodiment.
[0086]
On the other hand, below the processing units 30 of the substrate processing apparatus 100, pipes 94 and chemical liquid cabinets 95 are provided for supplying and draining processing liquids to the processing units and the like. Compared with the substrate processing apparatus 100 of the embodiment, the height positions of the processing units 30, 40, 50 are higher. When the above-described shuttle transport robot 60 transports substrates between the processing units, the second substrate mounting unit 20A on which the substrate W is mounted has the same height position as the processing units 30, 40, and 50. It is desirable that Therefore, in the substrate processing apparatus 100 of this embodiment, the position of the delivery position La in the second substrate platform 20A is set to a position where the shuttle transport robot 60 can access.
[0087]
Therefore, in the substrate processing apparatus 100 of this embodiment, the first substrate mounting unit 20B and the second substrate mounting unit 20A are provided in a state of being separated, and the chemical cabinet 95 is provided at the lower part of each processing unit. Even in the case of providing in a space, it is possible to satisfactorily perform the transfer operation of the substrate to the substrate platform 20 by the transfer robot 10 and the transfer operation between the processing units by the shuttle transfer robot 60.
[0088]
Then, the transport unit 210 on the CMP apparatus 200 side takes out the substrate W placed at the delivery position Lb of the first substrate platform 20B and transports it to the inside of the CMP apparatus 200, and the substrate W for which the CMP process has been completed. Is placed at the delivery position La of the second substrate platform 20A.
[0089]
Here, the internal structure of each of the first substrate platform 20B and the second substrate platform 20A is the same as that of the first substrate platform 20B and the second substrate platform 20A shown in FIG. The configuration is the same as the internal structure. Therefore, the second substrate platform 20A in this embodiment is also configured to maintain the wet state of the substrate after CMP processing placed inside.
[0090]
The shuttle transfer robot 60 described in the first embodiment transfers the substrate from the second substrate platform 20A to the processing unit 30, the substrate transfer from the processing unit 30 to the processing unit 40, and the processing unit 40. The substrate is transferred from the processing unit to the processing unit 50 at the same time. By the transfer between the processing units of the shuttle transfer robot 60, the cleaning processing of the substrate W that has been subjected to the CMP processing in the processing units 30, 40, and 50 can be sequentially performed.
[0091]
Incidentally, since the transfer robot 10 cannot directly take out the substrate after the final rinse process in the processing unit 50, the substrate processing apparatus 100 according to this embodiment performs the vertical transfer of the substrate along the Z axis. A vertical transfer robot 16 is provided, which is configured to take out the substrate inside the processing unit 50 and pass it to the transfer robot 10 provided in the transfer path 15.
[0092]
As shown in FIG. 13, the vertical transfer robot 16 can direct the arm 17 holding the substrate toward the processing unit 50 side and the transfer path 15 side, and a ball screw 18 provided in parallel with the Z axis is provided with a motor 19. It is configured to be movable up and down by rotating. Then, the vertical transfer robot 16 extends the arm 17 to the processing unit 50 side, takes out the substrate after the final rinse process in the processing unit 50, and then extends the arm 17 to the transfer path 15 side. Then, when the motor 19 is driven, the vertical transfer robot 16 is lowered, and the substrate W taken out from the processing unit 50 can be transferred to the arm 11 of the transfer robot 10 waiting at a position facing the processing unit 50.
[0093]
Since the vertical transfer robot 16 takes out the substrate W from the processing unit 50 and transfers the substrate W to the transfer robot 10, it has a partial function of the first transfer mechanism.
[0094]
Therefore, even when the chemical cabinet 95 is provided in the lower space of each processing unit 30, 40, 50, it is not necessary to provide the transfer robot 10 having a long stroke in the Z direction.
[0095]
In this embodiment, the cover 80 is also the same as that in the first embodiment. The cover 80 is raised when the transfer between the processing units is performed by the shuttle transfer robot 60, and the substrate is processed in each processing unit. Is configured to descend.
[0096]
As described above, since the substrate processing apparatus 100 according to this embodiment includes the upper and lower transfer robot 16 that transfers the substrate from the processing unit 50 to the transfer robot 10, regardless of the stroke of the transfer robot 10 in the Z direction, The height position of each processing unit 30, 40, 50 can be set high. Accordingly, the lower space of each processing unit 30, 40, 50 can be enlarged, and the chemical processing cabinet 95 that has to be placed separately when the height position of each processing unit 30, 40, 50 is low is the substrate processing apparatus. It becomes possible to install inside 100. As a result, it is possible to eliminate the footprint of the chemical liquid cabinet itself when the chemical liquid cabinet is placed separately.
[0097]
That is, according to the substrate processing apparatus 100 of this embodiment, in addition to the effects shown in the first embodiment, the footprint can be further reduced.
[0098]
<C. Modification>
In each of the above embodiments, the case where the external apparatus is a CMP apparatus has been described, but an apparatus other than the CMP apparatus may be used. Further, the processing units 30, 40, and 50 are not limited to processing units that perform cleaning after the CMP process.
[0099]
Further, the cover 80 is provided with the cleaning liquid discharge nozzle 82. However, from the viewpoint of cleaning the substrate holding portion 61 at the retracted position 91 shown by the one-dot chain line in FIG. It may be separated from the cover 80 and provided directly at the retracted position 91 so as not to buffer the operation of the substrate holding unit 61.
[0100]
【The invention's effect】
As described above, according to the first aspect of the present invention, the plurality of processing units are arranged in a predetermined direction, and the plurality of processing units are arranged across the conveyance path along which the first conveyance mechanism moves. Since the substrate storage portion arranged in parallel with the direction is provided, the footprint of the substrate processing apparatus can be reduced. Moreover, it has several board | substrate holding parts for conveying a board | substrate between adjacent process parts among several process parts, and conveys a board | substrate between adjacent process parts synchronizing the operation | movement of several board | substrate holding parts, respectively. Since the second transport mechanism is provided, the substrate can be accurately transported to each of the plurality of processing units arranged in a predetermined direction.
[0101]
According to the second aspect of the present invention, the substrate platform temporarily places the substrate when the substrate from the first transport mechanism is transported to the external device, and the substrate from the external device is the first Since it is configured to place the substrate once when transported to the processing unit, the substrate mounting unit functions as an interface unit with the external device, and the external device can be directly inlined with the substrate processing device. It becomes possible.
[0102]
According to the third aspect of the present invention, the substrate mounting unit is configured to temporarily mount the substrate when the substrate is transferred to the external device, and the substrate from the external device to the first processing unit. And a second substrate placement unit for placing the substrate once, the substrate placement position before and after the processing by the external device can be provided differently, and before and after the processing by the external device. It becomes possible to handle the substrate according to the conditions.
[0103]
According to the fourth aspect of the present invention, since the first substrate mounting portion is disposed on the lower side and the second substrate mounting portion is disposed on the upper side, the particles are processed with respect to the substrate processed by the external device. The possibility of adhesion etc. decreases.
[0104]
According to the fifth aspect of the present invention, the second substrate mounting unit keeps the substrate transported from the external device in a wet state, so that the effect of the predetermined processing performed by the plurality of processing units can be enhanced. .
[0105]
According to the invention described in claim 6, the second transport mechanism includes a substrate holding unit driving unit provided for each substrate holding unit that performs the operation of holding the substrates of the plurality of substrate holding units in synchronization. Since the plurality of substrate holding units and the substrate holding unit driving unit are integrally moved along a predetermined direction and include inter-processing unit transfer units that transfer substrates between adjacent processing units, It is not necessary to provide an independent transport mechanism for each, the footprint can be minimized, and a control mechanism for transporting the substrate between the processing units can be easily configured.
[0106]
According to the seventh aspect of the present invention, the second transport mechanism is further provided in parallel with a predetermined direction, and a plurality of rotating shafts connected to the plurality of substrate holding units and a plurality of rotating shafts by rotating the rotating shafts. A rotation driving means for rotating the substrate holding portion about the rotation axis, so that the plurality of substrate holding portions can be lifted from each processing portion while holding the substrate, and the substrate is transferred between the processing portions. In this case, buffering with other components can be avoided.
[0107]
According to an eighth aspect of the present invention, each of the plurality of substrate holding units includes a pair of arms having a first arm and a second arm for holding the substrate, and the substrate holding unit driving means has the plurality of substrate holdings. First arm driving means for simultaneously moving a plurality of first arms for a plurality of parts along a predetermined direction, and second arm driving means for simultaneously moving a plurality of second arms for a plurality of substrate holding parts along a predetermined direction Therefore, the operation of holding the substrates in the plurality of processing units can be performed in synchronization with each other, and the mechanism for controlling the plurality of substrate holding units can be simplified. It is also possible to perform alignment of the substrate position during conveyance.
[0108]
According to the ninth aspect of the present invention, the first transport mechanism is movable up and down with the first transport means for transporting the substrate between the container disposed in the substrate storage section and the substrate mounting section. In addition, since the second transport unit that takes out the substrate from the second processing unit and transports the substrate to the substrate transport unit is provided, the height position of each processing unit can be set high. Accordingly, other members such as a chemical cabinet can be accommodated in the lower space of each processing unit, and the footprint can be further reduced.
[0109]
According to the tenth aspect of the present invention, since the apparatus includes a cover that can move up and down and falls when a predetermined process is performed in the plurality of processing units and covers the plurality of processing units, each processing unit is normal. Substrate processing can be performed. In addition, when the substrate is transferred between the processing units by the second transfer mechanism, the substrate can be lifted so as not to hinder the transfer.
[0110]
According to the eleventh aspect of the invention, since the cover includes the plurality of cleaning liquid discharge nozzles for cleaning the plurality of substrate holding units, the plurality of substrate holding units can be kept in a normal state.
[Brief description of the drawings]
FIG. 1 is a plan view showing a substrate processing apparatus in a first embodiment.
FIG. 2 is a schematic cross-sectional view in the YZ plane of the substrate processing apparatus in the first embodiment.
FIG. 3 is a schematic cross-sectional view in the ZX plane of the substrate processing apparatus in the first embodiment.
FIG. 4 is a diagram showing a configuration of a substrate platform.
FIG. 5 is a perspective view of a shuttle transfer robot.
FIG. 6 is an explanatory diagram illustrating a state of conveyance between processing units.
FIG. 7 is an explanatory diagram illustrating a state of conveyance between processing units.
FIG. 8 is a perspective view of a cover.
FIG. 9 is a schematic side view showing an operational relationship between a cover and a substrate holding unit.
FIG. 10 is a schematic side view showing an operational relationship between a cover and a substrate holding unit.
FIG. 11 is a diagram showing a configuration in which the substrate processing apparatus of this embodiment is in-line with a CMP apparatus.
FIG. 12 is a plan view showing a substrate processing apparatus in a second embodiment.
FIG. 13 is a schematic cross-sectional view in the YZ plane of the substrate processing apparatus according to the second embodiment.
FIG. 14 is a schematic cross-sectional view in the ZX plane of the substrate processing apparatus in the second embodiment.
FIG. 15 is a plan view showing a conventional substrate processing apparatus.
FIG. 16 is a schematic view showing a configuration in which a conventional substrate processing apparatus is in-line with a CMP apparatus.
[Explanation of symbols]
7 Board storage
9 Pods (containers)
10 Transfer robot
15 Transport path
16 Vertical transfer robot
20 Substrate placement part
20A Second substrate placement section
20B 1st substrate mounting part
30, 40, 50 processing section
60 Shuttle transfer robot (second transfer mechanism)
61 Substrate holder
80 cover
100 Substrate processing equipment
200 CMP machine
W substrate

Claims (11)

A substrate processing apparatus for performing predetermined processing on a substrate,
(a) a plurality of processing units arranged in a predetermined direction for performing a predetermined process including a cleaning process on the substrate;
(b) A substrate mounting on which a substrate is temporarily placed when the substrate is transported to a first processing unit that is adjacent to and disposed on one end side of the plurality of processing units. A placement unit;
(c) a substrate storage unit disposed in parallel with a direction in which the plurality of processing units are disposed, and a storage unit for storing a storage unit that stores the substrate;
(d) a transfer path disposed between the plurality of processing units and the substrate mounting unit and the substrate storage unit for transferring the substrate;
(e) moveable along the transport path, on the other end side different from the one end side among the storage unit disposed in the substrate storage unit, the substrate placement unit, and the plurality of processing units A first transport mechanism for transporting a substrate to and from the disposed second processing unit;
(f) a plurality of substrate holders for transporting a substrate between adjacent processing units among the plurality of processing units, and the operations of the plurality of substrate holding units are synchronized with each other between adjacent processing units. A second transport mechanism for transporting the substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate mounting part is
The substrate is temporarily placed when the substrate from the first transport mechanism is transported to the external device, and the substrate is temporarily placed when the substrate from the external device is transported to the first processing unit. A substrate processing apparatus. The substrate processing apparatus according to claim 2,
The substrate mounting part is
(b-1) a first substrate placement unit for placing the substrate once when the substrate is transported to the external device;
(b-2) a second substrate placement unit that temporarily places the substrate when the substrate is transferred from the external device to the first processing unit;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 3,
The substrate processing apparatus, wherein the first substrate platform is disposed on the lower side, and the second substrate platform is disposed on the upper side. In the substrate processing apparatus of Claim 3 or Claim 4,
The substrate processing apparatus, wherein the second substrate placement unit keeps a substrate transported from the external device in a wet state. The substrate processing apparatus according to claim 1, wherein:
The second transport mechanism is
(f-1) substrate holding unit driving means provided for each substrate holding unit so as to perform the operation of holding the substrates of the plurality of substrate holding units synchronously;
(f-2) The inter-processing unit transporting unit that moves the plurality of substrate holding units and the substrate holding unit driving unit as a unit along the predetermined direction, and transports the substrate between adjacent processing units;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 6,
The second transport mechanism further includes:
(f-3) a rotating shaft provided in parallel with the predetermined direction and connected to the plurality of substrate holding units;
(f-4) Rotation drive means for rotating the plurality of substrate holders around the rotation axis by rotating the rotation axis;
A substrate processing apparatus comprising: In the substrate processing apparatus of Claim 6 or Claim 7,
Each of the plurality of substrate holding units includes a pair of arms having a first arm and a second arm for holding the substrate,
The substrate holding unit driving means includes
(f-1-1) first arm driving means for simultaneously moving the plurality of first arms of the plurality of substrate holders along the predetermined direction;
(f-1-2) second arm driving means for simultaneously moving the plurality of second arms of the plurality of substrate holding portions along the predetermined direction;
A substrate processing apparatus comprising: The substrate processing apparatus according to any one of claims 1 to 8,
The first transport mechanism is
(e-1) first transport means for transporting a substrate between a container disposed in the substrate storage unit and the substrate mounting unit;
(e-2) a second transport unit that is movable up and down, takes out the substrate from the second processing unit, and transports the substrate to the first transport unit;
A substrate processing apparatus comprising: 10. The substrate processing apparatus according to claim 1, further comprising:
(g) a cover that is movable up and down and covers the plurality of processing units when the predetermined processing is performed in the plurality of processing units;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 10, wherein
The cover is
(g-1) A substrate processing apparatus comprising a plurality of cleaning liquid discharge nozzles for cleaning the plurality of substrate holders.

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