JP3648699B2 - ウエハの一括検査装置及びウエハの一括検査方法 - Google Patents

ウエハの一括検査装置及びウエハの一括検査方法 Download PDF

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Publication number
JP3648699B2
JP3648699B2 JP03436897A JP3436897A JP3648699B2 JP 3648699 B2 JP3648699 B2 JP 3648699B2 JP 03436897 A JP03436897 A JP 03436897A JP 3436897 A JP3436897 A JP 3436897A JP 3648699 B2 JP3648699 B2 JP 3648699B2
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Japan
Prior art keywords
contactor
wafer
semiconductor wafer
ring
chamber
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Expired - Lifetime
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JP03436897A
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English (en)
Japanese (ja)
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JPH10223704A5 (cg-RX-API-DMAC10.html
JPH10223704A (ja
Inventor
伸治 飯野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP03436897A priority Critical patent/JP3648699B2/ja
Publication of JPH10223704A publication Critical patent/JPH10223704A/ja
Publication of JPH10223704A5 publication Critical patent/JPH10223704A5/ja
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Publication of JP3648699B2 publication Critical patent/JP3648699B2/ja
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP03436897A 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法 Expired - Lifetime JP3648699B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03436897A JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03436897A JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

Publications (3)

Publication Number Publication Date
JPH10223704A JPH10223704A (ja) 1998-08-21
JPH10223704A5 JPH10223704A5 (cg-RX-API-DMAC10.html) 2004-12-24
JP3648699B2 true JP3648699B2 (ja) 2005-05-18

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JP03436897A Expired - Lifetime JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

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JP (1) JP3648699B2 (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6498504B2 (en) 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP3921163B2 (ja) * 2000-09-26 2007-05-30 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
KR100702021B1 (ko) 2001-04-04 2007-04-06 후지쯔 가부시끼가이샤 반도체 장치용 컨택터 장치 및 반도체 장치의 시험 방법
AU2002361863A1 (en) * 2001-12-27 2003-07-24 Formfactor, Inc. Cooling assembly with direct cooling of active electronic components
US7064953B2 (en) 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6842029B2 (en) * 2002-04-11 2005-01-11 Solid State Measurements, Inc. Non-invasive electrical measurement of semiconductor wafers
JP4563700B2 (ja) * 2004-03-16 2010-10-13 東京エレクトロン株式会社 真空プローブ装置及び真空プローブ方法
JP5539033B2 (ja) * 2010-05-31 2014-07-02 株式会社日本マイクロニクス 半導体測定装置及び測定方法
JP5675239B2 (ja) * 2010-09-15 2015-02-25 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
TWI644109B (zh) * 2017-05-18 2018-12-11 漢民科技股份有限公司 半導體測試裝置
CN116654624B (zh) * 2023-05-06 2023-12-05 大可精密齿轮(浙江)有限公司 一种包括曳引驱动减速器的晶圆输送装置

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Publication number Publication date
JPH10223704A (ja) 1998-08-21

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