JP3621298B2 - Cooling device for power converter - Google Patents

Cooling device for power converter Download PDF

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JP3621298B2
JP3621298B2 JP19111299A JP19111299A JP3621298B2 JP 3621298 B2 JP3621298 B2 JP 3621298B2 JP 19111299 A JP19111299 A JP 19111299A JP 19111299 A JP19111299 A JP 19111299A JP 3621298 B2 JP3621298 B2 JP 3621298B2
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heat
wind tunnel
power converter
wind
radiating fins
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JP2001025254A (en
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伸一 田中
隆 橋本
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Toshiba Corp
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Toshiba Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、電力変換装置の半導体素子より発生する熱を強制的に大気へ放散するようにした電力変換装置の冷却装置に関する。
【０００２】
【従来の技術】
例えば、鉄道車両床下には、鉄道車両の駆動用あるいは補助電源用の電力を供給するための電力変換装置が取り付けられている。このような電力変換装置では、電力変換装置を構成する半導体素子から発生する熱を強制的に大気へ放散するようにしている。すなわち、半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、風洞内の電動送風機により強制的に空気を流して、放熱フィンから熱を大気へ放散するようにしている。
【０００３】
図６は、そのような鉄道車両床下に取り付けられた電力変換装置の風洞部の概略断面図である。電力変換装置１の内部には冷却装置が形成されている。冷却装置は、外気からの冷却風を流す風洞２、風洞２内に強制的に風を流すための電動送風機３、風洞２内に設けられた放熱フィン４、半導体素子６が取り付けられた受熱板５から構成されている。
【０００４】
図７は、図６のＸ−Ｘ線での概略断面図である。電力変換装置１は鉄道車両７の床下に設けられ、冷却装置の風洞２には複数個の放熱フィン４が収められ、複数個の放熱フィン４は受熱板５に取り付けられている。この受熱板５は、風洞２の壁の一部分となるよう取り付けられ、風洞２の内外を仕切る構成となっている。
【０００５】
受熱板５の放熱フィン４が取り付けられた反対面には電力変換回路に使われる複数個の半導体素子６が取り付けられる。鉄道車両で使われる大容量の電力変換回路では、インバータ回路又はコンバータ回路といった電力変換回路であり、通常、３相分のうちの１相分を１個の受熱板５に取り付けて冷却するようにしている。例えば、電力変換回路が３相インバータ回路である場合には、１相分の半導体素子６を取り付けた受熱板５を３個用いることになるが、その３個の受熱板５に取り付けられた放熱フィン４を、風洞２に冷却風の流れの方向に直列に配置して冷却することになる。放熱フィン４は所定のピッチで受熱板５に垂直に形成され、この放熱フィン４間を冷却風が強制的に流れるような向きで、受熱板５に取り付けられる。
【０００６】
【発明が解決しようとする課題】
ところが、このような冷却装置では、風洞２内の冷却風の流れに対し３個の受熱板５が直列に配置されているので、風下側の放熱フィン４では、その風上側の放熱フィン４からの放熱の影響を受け入風温度が高くなる。
【０００７】
放熱フィン４から放熱される熱量は風洞２内の冷却風との間で熱交換され、冷却風を温度上昇させることになる。つまり、最風上側の放熱フィン４では、放熱フィン４の入風温度は外気温であるが、この放熱フィン４を通過した冷却風は放熱フィン４から放熱された熱量により温度が上がっている。従って、２段目の放熱フィン４の入風温度は外気温よりもこの分だけ高くなっており、３段目（最風下側）の放熱フィン４の入風温度は２段目の放熱フィン４の放熱量により、さらに温度が上昇している。
【０００８】
３段並んだ放熱フィン４は、通常、同一の冷却能力を有しており、何れも１相分の半導体素子６が取り付けられているので発熱量も同じである。しかし、放熱フィン４への入風温度が異なるため、最風下の放熱フィン４が最も温度が高くなり、当然、半導体素子６もその部位に取付くものが最も高い温度となる。
【０００９】
この最風下に取付く半導体素子６の温度を許容温度以下で抑えるように設定すると、他の放熱フィン４では許容温度に対し充分余裕があることになり、３段の放熱フィン４のうち、風上側の放熱フィン４では、最適な冷却能力となっていないことになる。電力変換装置１の全体の最適化による小形軽量化等のためには、それぞれの半導体素子６が一様に温度上昇し、バランスがとれていることが重要である。
【００１０】
本発明の目的は、電力変換装置の半導体素子の温度上昇値が平準化され効率よく冷却できる電力変換装置の冷却装置を提供することである。
【００１１】
【課題を解決するための手段】
請求項１に係る発明は、電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、風の通路の大きさが風上側から風下側にいくにつれて絞られて形成された風洞と、前記風洞内に風上側から風下側に直列に配置された複数個の放熱フィンと、前記風上側に配置される少なくとも１個目の放熱フィンをバイパスして空気を流す案内板と、各々の前記放熱フィン毎に設けられ前記電力変換装置の半導体素子より発生する熱をそれぞれの放熱フィンに伝達する複数個の受熱板とを備えたことを特徴とするものである。
【００１２】
請求項２に係る発明は、電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、 風の通路の大きさが風上側から風下側に向かって同じに形成された風洞と、前記風洞内に風上側から風下側に向かって形成され前記風洞内の風の流れの方向に熱輸送を行うヒートパイプが取り付けられ各相を冷却する共通の放熱フィンと、各々の前記放熱フィンに設けられ前記電力変換装置のＵ相、Ｖ相、Ｗ相の半導体が取り付けられ、各相の半導体素子より発生する熱を前記共通の放熱フィンに伝達する共通の受熱板とを備えたことを特徴とするものである。
【００１３】
請求項３に係る発明は、電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、風の通路の大きさが風上側から風下側に向かって同じに形成された風洞と、前記風洞内に風上側から風下側に直列に配置された複数個の放熱フィンと、各々の前記放熱フィンに共通に設けられ前記風洞内の風の流れの方向に熱輸送を行うヒートパイプを有した熱輸送板と、前記熱輸送板に取り付けられると共に、前記電力変換装置のＵ相、Ｖ相、Ｗ相の半導体が取り付けられ、各相の半導体素子より発生する熱を前記熱輸送板を介して前記放熱フィンに伝達する共通の受熱板とを備えたことを特徴とするものである。
【００２７】
【発明の実施の形態】
以下、本発明の実施の形態を説明する。図１は本発明の第１の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【００２８】
電力変換装置１内に設けられた風洞２内には、複数個の放熱フィン４ａ、４ｂ、４ｃが直列に配置され、この複数個の放熱フィン４ａ、４ｂ、４ｃは各々の受熱板５ａ、５ｂ、５ｃに取り付けられている。この受熱板５ａ、５ｂ、５ｃは、風洞２の壁の一部分となるよう取り付けられ、風洞２の内外を仕切っている。一方、受熱板５ａ、５ｂ、５ｃの放熱フィン４ａ、４ｂ、４ｃが取り付けられた反対面には複数個の半導体素子６が取り付けられる。図１では、１個の受熱板５に電力変換装置１の３相分のうちの１相分の半導体素子６が取り付けられている。
【００２９】
風洞２の断面形状は、風の通路の大きさが風上側から風下側にいくにつれて絞られて形成されている。すなわち、図１の下部の風上側では、電動送風機３により取り込まれる冷却風が、１個目の放熱フィン４ａおよび２個目の放熱フィン４ｂ以外にも流れるように放熱フィン４ａ、４ｂの大きさよりも大きく形成されている。そして、放熱フィン４ａ、４ｂより大きく形成された電力変換装置１の風入口部には、ほぼ１個目の放熱フィン４ａを覆う範囲に案内板８を設けて風洞２を仕切った構成としている。
【００３０】
このように、風洞２内の風の通路が風上側から風下側にいくにつれて絞られて形成され、各々の放熱フィン４ａ、４ｂ、４ｃからの放熱量が等しくなるようにしている。
【００３１】
半導体素子６により発生する熱は各々の受熱板５ａ、５ｂ、５ｃに伝わり、さらに風洞２内の放熱フィン４ａ、４ｂ、４ｃに熱伝達し、風洞２内を流れる電動送風機３により取り込まれた冷却風が放熱フィン４ａ、４ｂ、４ｃ間を通過する。その際、放熱フィン４ａ、４ｂ、４ｃの表面から大気へ熱伝達させることにより冷却を行う。
【００３２】
この場合、風上側の１個目の放熱フィン４ａで暖められた空気は２個目の放熱フィン４ｂに直接流入するが、案内板８で仕切られて１個目の放熱フィン４ａをバイパスした空気の一部が２個目の放熱フィン４ｂの側面から流入する。従って、２個目の放熱フィン４ｂでは１個目の放熱フィン４ａと同等の放熱量が確保できる。また、３個目の放熱フィン４ｃについても、１個目および２個目の放熱フィン４ａ、４ｂで暖められた空気が流入するが、案内板８で仕切られて１個目の放熱フィン４ａをバイパスした空気の一部が流入するので、３個目の放熱フィン４ｃでも１個目の放熱フィン４ａと同等の放熱量が確保できる。
【００３３】
このように、風洞２を風の通路が風上側から風下側にいくにつれて絞って形成しているので、１個目の放熱フィン４ａで熱交換しなかった空気が２個目の放熱フィン４ｂおよび３個目の放熱フィン４ｃに流入する。従って、風洞２内に放熱フィン４ａ、４ｂ、４ｃを直列に配置しても、ほぼ均等に冷却できる。これにより、冷却風の温度の違いによる風上側の放熱フィン４ａと風下側の放熱フィン４ｃとの放熱量を均等にできるので、電力変換装置１の各相の半導体素子６の温度上昇値の差は低減される。
【００３４】
また、風洞２の形状が風上側から風下側に行くにつれて絞り込まれる形状としているため、風上側に比べ風下側の方が冷却風の風速を上げることが可能となる。これにより、放熱フィン４ａ、４ｂ、４ｃ間の空気流速は風下側の放熱フィン４ｃの方が速くなり、放熱フィン４ｃの表面からの熱伝達がより向上する。従って、冷却風の温度が高くなっても冷却効果が向上できるので、同一の冷却フィン４ａ、４ｂ、４ｃを用いても風上側および風下側で同等の冷却性能が達成でき、放熱フィン４ａ、４ｂ、４ｃの小形軽量化が図られる。つまり、電力変換装置１の小形軽量化を達成することが可能となる。
【００３５】
次に、本発明の第２の実施の形態を説明する。図２は本発明の第２の実施の形態に係わる電力変換装置の冷却装置の概略断面図である。この第２の実施の形態は、図１に示した第１の実施の形態に対し、風の通路の大きさが風上側から風下側にいくにつれて絞られて形成された風洞２に代えて、風洞２の大きさは風上側から風下側に向かって同じに形成し、放熱フィン４ａ、４ｂ、４ｃの大きさを、風上側から風下側に向かって階段状に大きく形成したものである。その他の構成は、図１に示す第１の実施の形態と同一であるので、同一要素には同一符号を付し重複する記載は省略する。
【００３６】
図２において、風洞２に直列に配置される放熱フィン４ａ、４ｂ、４ｃは、その大きさが風上側から風下側に行くにつれて大きく形成されている。各々の放熱フィンの大きさは、各々の放熱フィン４ａ、４ｂ、４ｃからの放熱量が等しくなるように形成される。
【００３７】
風洞２に電動送風機３により取り込まれる冷却風は、１個目の放熱フィン４ａを通る。この場合、１個目の放熱フィン４ａは２個目の放熱フィン４ｂより相対的に小さく形成されているので、１個目の放熱フィン４ａで熱交換しなかった空気が２個目の放熱フィン４ｂに流入する。同様に、２個目の放熱フィン４ｂは３個目の放熱フィン４ｃより相対的に小さく形成されているので、２個目の放熱フィン４ａで熱交換しなかった空気が３個目の放熱フィン４ｃに流入する。従って、風洞２内に放熱フィン４ａ、４ｂ、４ｃを直列に配置しても、ほぼ均等に冷却できる。
【００３８】
これにより、冷却風の温度の違いによる風上側の放熱フィン４ａと風下側の放熱フィン４ｃとの放熱量を均等にできるので、電力変換装置１の各相の半導体素子６の温度上昇値の差は低減される。すなわち、それぞれの放熱フィン４ａ、４ｂ、４ｃに対する入風温度の温度差を小さくし、冷却性能を向上させている。
【００３９】
次に、本発明の第３の実施の形態を説明する。図３は本発明の第３の実施の形態に係わる電力変換装置の冷却装置の概略断面図である。この第３の実施の形態は、図１に示した第１の実施の形態に対し、風の通路の大きさが風上側から風下側にいくにつれて絞られて形成された風洞２に代えて、風の通路の大きさが風上側から風下側に向かって階段状に段差がつけられて形成された風洞２を設けたものである。その他の構成は、図１に示す第１の実施の形態と同一であるので、同一要素には同一符号を付し重複する記載は省略する。
【００４０】
図３において、電力変換装置１内に配置される風洞２の形状は、風上側から風下側に行くほど小さくなる階段状に形成されている。すなわち、風洞２は各々の放熱フィン４ａ、４ｂ、４ｃからの放熱量が等しくなるように、風上側から風下側に向かって階段状に段差がつけられて形成される。
【００４１】
風洞２に電動送風機３により取り込まれる冷却風は、１個目の放熱フィン４ａを通る。この場合、１個目の放熱フィン４ａが取り付けられた風洞２の段差部分は、２個目の放熱フィン４ｂが取り付けられた風洞２の段差部分より大きいので、１個目の放熱フィン４ａで熱交換しなかった空気が２個目の放熱フィン４ｂに流入する。同様に、２個目の放熱フィン４ｂが取り付けられた風洞２の段差部分は、３個目の放熱フィン４ｃが取り付けられた風洞２の段差部分より大きいので、２個目の放熱フィン４ａで熱交換しなかった空気が３個目の放熱フィン４ｃに流入する。従って、風洞２内に放熱フィン４ａ、４ｂ、４ｃを直列に配置しても、ほぼ均等に冷却できる。
【００４２】
これにより、風洞２に電動送風機３により取り込まれる冷却風のそれぞれの放熱フィン４ａ、４ｂ、４ｃに対する入風温度の温度差を小さくでき、風速を上げることができる。従って、それぞれの放熱フィン４ａ、４ｂ、４ｃの冷却性能の差を無くし効率よく冷却できる。
【００４３】
次に、本発明の第４の実施の形態を説明する。図４は本発明の第４の実施の形態に係わる電力変換装置の冷却装置の概略断面図である。この第４の実施の形態は、図１に示した第１の実施の形態に対し、風の通路の大きさが風上側から風下側にいくにつれて絞られて形成された風洞２に代えて、風洞２の大きさは風上側から風下側に向かって同じに形成し、共通の放熱フィン４および共通の受熱板５を設け、放熱フィン４には風洞２内の風の流れの方向に熱輸送を行うヒートパイプを取り付けたものである。その他の構成は、図１に示す第１の実施の形態と同一であるので、同一要素には同一符号を付し重複する記載は省略する。
【００４４】
図４において、電力変換装置１の各相の半導体素子６を共通の受熱板５に取り付け、その共通の受熱板５に対し共通の放熱フィン４を設ける。そして、放熱フィン４には、風洞２内の冷却風の流れる方向に相互に熱輸送が可能なヒートパイプ９を設ける。
【００４５】
ヒートパイプ９は、熱伝導率が極めて高いもので、その両端に温度差がある場合に、温度の高い方から低い方へ短時間のうちに熱を輸送する。従って、風上側と風下側との温度差はヒートパイプ９の作用によりほとんどなくなり、風上側および風下側での放熱効果はほぼ均一化される。
【００４６】
これにより、風洞内２を流れる冷却風の温度差に関係なく最適な冷却効率を得ることが可能となる。また、電力変換装置１に配置される風洞２の形状も簡素化される。
【００４７】
次に、本発明の第５の実施の形態を説明する。図５は本発明の第５の実施の形態に係わる電力変換装置の冷却装置の概略断面図である。この第５の実施の形態は、図４に示した第４の実施の形態に対し、共通の放熱フィン４に代えて、各々の放熱フィン４ａ、４ｂ、４ｃを設け、各々の放熱フィン４ａ、４ｂ、４ｃと受熱板５との間に、風洞２内の風の流れの方向に熱輸送を行うヒートパイプ９を有した熱輸送板１０を設けたものである。その他の構成は、図１に示す第１の実施の形態と同一であるので、同一要素には同一符号を付し重複する記載は省略する。
【００４８】
図５において、電力変換装置１の各相の半導体素子６を受熱板５に取り付け、その受熱板５に対し熱輸送板１０を介して複数個の放熱フィン４ａ、４ｂ、４ｃを設ける。熱輸送板１０には、風洞２内の冷却風の流れる方向に相互に熱輸送が可能なヒートパイプ９が設けられている。この熱輸送板１０のヒートパイプ９により、風上側と風下側との温度差はほとんどなくなり、風上側および風下側での放熱効果はほぼ均一化される。
【００４９】
これにより、風洞内２を流れる冷却風の温度差に関係なく最適な冷却効率を得ることが可能となる。また、電力変換装置１に配置される風洞２の形状も簡素化され、ヒートパイプ９の数も少なくできることから低コスト化が可能であり、電力変換装置１の最適化が図れる。
【００５０】
【発明の効果】
以上述べたように、本発明によれば、電力変換装置内に設けられる風洞内を流れる冷却風の温度差を少なくするので、風洞内に直列に配置される放熱フィンの冷却性能の均一化が可能となる。また、各々の放熱フィンでの冷却性能の均一化が図れることから、受熱仮に収付られている半導体素子の温度上昇値の平準化が可能となり、半導体素子に加わる負担を軽減することができる。
【図面の簡単な説明】
【図１】図１は、本発明の第１の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【図２】図２は、本発明の第２の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【図３】図３は、本発明の第３の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【図４】図４は、本発明の第４の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【図５】図５は、本発明の第５の実施の形態に係わる電力変換装置の冷却装置における風洞部の概略断面図である。
【図６】図６は、従来の電力変換装置の風洞部の概略断面図である。
【図７】図７は、図６のＸ−Ｘ線での概略断面図である。
【符号の説明】
１ 電力変換装置
２ 風洞
３ 電動送風機
４ 放熱フィン
５ 受熱板
６ 半導体素子
７ 鉄道車両
８ 案内板
９ ヒートパイプ
１０ 熱輸送板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling device for a power conversion device that forcibly dissipates heat generated from a semiconductor element of the power conversion device to the atmosphere.
[0002]
[Prior art]
For example, a power converter for supplying electric power for driving or auxiliary power of the railway vehicle is attached below the floor of the railway vehicle. In such a power converter, heat generated from the semiconductor elements constituting the power converter is forcibly dissipated to the atmosphere. That is, heat generated from the semiconductor element is transmitted to the heat radiating fins provided in the wind tunnel through the heat receiving plate, and air is forced to flow by the electric blower in the wind tunnel so that heat is dissipated from the heat radiating fins to the atmosphere. ing.
[0003]
FIG. 6 is a schematic cross-sectional view of the wind tunnel portion of the power conversion device attached under such a railway vehicle floor. A cooling device is formed inside the power conversion device 1. The cooling device includes a wind tunnel 2 for flowing cooling air from outside air, an electric blower 3 for forcing air to flow in the wind tunnel 2, heat radiation fins 4 provided in the wind tunnel 2, and a heat receiving plate on which semiconductor elements 6 are attached. It is composed of five.
[0004]
FIG. 7 is a schematic sectional view taken along line XX of FIG. The power conversion device 1 is provided under the floor of the railway vehicle 7, and a plurality of heat radiation fins 4 are housed in the wind tunnel 2 of the cooling device, and the plurality of heat radiation fins 4 are attached to the heat receiving plate 5. The heat receiving plate 5 is attached so as to become a part of the wall of the wind tunnel 2 and is configured to partition the inside and outside of the wind tunnel 2.
[0005]
A plurality of semiconductor elements 6 used in the power conversion circuit are attached to the opposite surface of the heat receiving plate 5 to which the radiation fins 4 are attached. A large-capacity power conversion circuit used in a railway vehicle is a power conversion circuit such as an inverter circuit or a converter circuit. Normally, one of three phases is attached to one heat receiving plate 5 to be cooled. ing. For example, when the power conversion circuit is a three-phase inverter circuit, three heat receiving plates 5 to which the semiconductor elements 6 for one phase are attached are used, and the heat radiation attached to the three heat receiving plates 5 is used. The fins 4 are arranged in series in the direction of the cooling air flow in the wind tunnel 2 to be cooled. The radiating fins 4 are formed perpendicular to the heat receiving plate 5 at a predetermined pitch, and are attached to the heat receiving plate 5 in such a direction that the cooling air is forced to flow between the radiating fins 4.
[0006]
[Problems to be solved by the invention]
However, in such a cooling device, since the three heat receiving plates 5 are arranged in series with respect to the flow of the cooling air in the wind tunnel 2, the leeward radiating fins 4 are separated from the leeward radiating fins 4. The wind temperature rises due to the heat radiation.
[0007]
The amount of heat radiated from the radiating fins 4 is exchanged with the cooling air in the wind tunnel 2 to raise the temperature of the cooling air. That is, in the radiating fin 4 on the uppermost wind side, the inlet temperature of the radiating fin 4 is the outside air temperature, but the temperature of the cooling air that has passed through the radiating fin 4 is increased by the amount of heat radiated from the radiating fin 4. Therefore, the inlet air temperature of the second stage radiating fin 4 is higher than the outside air temperature by this amount, and the inlet temperature of the third stage (lowermost wind side) radiating fin 4 is the second stage radiating fin 4. The temperature further increases due to the amount of heat released.
[0008]
The radiating fins 4 arranged in three stages usually have the same cooling ability, and all of them have the same amount of heat generation because the semiconductor elements 6 for one phase are attached. However, since the temperature of the incoming air to the radiating fins 4 is different, the temperature of the radiating fins 4 located at the bottom is the highest, and naturally, the semiconductor element 6 attached to that part is the highest temperature.
[0009]
If the temperature of the semiconductor element 6 mounted at the lowest wind is set so as to be kept below the allowable temperature, the other radiating fins 4 have a sufficient margin with respect to the allowable temperature. The upper radiating fin 4 does not have an optimum cooling capacity. In order to reduce the size and weight by optimizing the entire power converter 1, it is important that the temperature of each semiconductor element 6 rises uniformly and is balanced.
[0010]
The objective of this invention is providing the cooling device of the power converter device which the temperature rise value of the semiconductor element of a power converter device is equalized and can cool efficiently.
[0011]
[Means for Solving the Problems]
In the invention according to claim 1, heat generated from the semiconductor element of the power conversion device is transmitted to the heat radiating fins provided in the wind tunnel via the heat receiving plate, and the air is forced to flow by the electric blower in the wind tunnel, In the cooling device for a power converter configured to dissipate heat from the radiating fins to the atmosphere, a wind tunnel in which the size of the wind passage is narrowed as it goes from the windward side to the leeward side, and Provided for each of the heat radiating fins, a plurality of heat radiating fins arranged in series from the upper side to the leeward side, a guide plate for bypassing at least the first heat radiating fin arranged on the windward side And a plurality of heat receiving plates for transmitting heat generated from the semiconductor elements of the power conversion device to the heat radiating fins.
[0012]
The invention according to claim 2 transmits heat generated from the semiconductor element of the power conversion device to the heat radiating fin provided in the wind tunnel via the heat receiving plate, and forcibly flows air by the electric blower in the wind tunnel, In the cooling device for a power converter configured to dissipate heat from the radiating fins to the atmosphere, a wind tunnel in which the size of the wind passage is the same from the windward side toward the leeward side, and the windward side in the wind tunnel A heat radiating fin which is formed toward the leeward side and which heat-transports in the direction of the wind flow in the wind tunnel is attached and cools each phase, and the power conversion device provided in each of the radiating fins The U-phase, V-phase, and W-phase semiconductors are attached, and a common heat receiving plate that transmits heat generated from the semiconductor elements of the respective phases to the common radiating fins is provided.
[0013]
The invention according to claim 3 transmits heat generated from the semiconductor element of the power conversion device to the heat radiating fin provided in the wind tunnel via the heat receiving plate, and forcibly flows air by the electric blower in the wind tunnel, In the cooling device for a power converter configured to dissipate heat from the radiating fins to the atmosphere, a wind tunnel in which the size of the wind passage is the same from the windward side toward the leeward side, and the windward side in the wind tunnel A plurality of heat dissipating fins arranged in series on the leeward side, a heat transport plate having a heat pipe provided in common to each of the heat dissipating fins and performing heat transport in the direction of the wind flow in the wind tunnel, Attached to the heat transport plate, U-phase, V-phase, and W-phase semiconductors of the power converter are attached, and heat generated from the semiconductor elements of each phase is transmitted to the heat radiating fins through the heat transport plate. With a common heat receiving plate It is characterized in that it comprises.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below. FIG. 1 is a schematic sectional view of a wind tunnel portion in a cooling device for a power converter according to a first embodiment of the present invention.
[0028]
A plurality of radiating fins 4a, 4b, 4c are arranged in series in a wind tunnel 2 provided in the power converter 1, and the plurality of radiating fins 4a, 4b, 4c are respectively connected to the heat receiving plates 5a, 5b. 5c. The heat receiving plates 5a, 5b, and 5c are attached to be a part of the wall of the wind tunnel 2 and partition the inside and outside of the wind tunnel 2. On the other hand, a plurality of semiconductor elements 6 are attached to the opposite surfaces of the heat receiving plates 5a, 5b, 5c to which the radiation fins 4a, 4b, 4c are attached. In FIG. 1, the semiconductor element 6 for one phase of the three phases of the power conversion device 1 is attached to one heat receiving plate 5.
[0029]
The cross-sectional shape of the wind tunnel 2 is formed such that the size of the wind passage is narrowed as it goes from the windward side to the leeward side. That is, on the windward side in the lower part of FIG. 1, the cooling air taken in by the electric blower 3 flows from the size of the radiation fins 4a and 4b so that the cooling air flows in addition to the first radiation fin 4a and the second radiation fin 4b. Is also formed large. And the guide plate 8 is provided in the range which covers the 1st radiation fin 4a in the wind inlet part of the power converter device 1 formed larger than the radiation fins 4a and 4b, and it has the structure which partitioned off the wind tunnel 2. As shown in FIG.
[0030]
In this way, the wind passage in the wind tunnel 2 is formed to be narrowed from the windward side to the leeward side so that the heat radiation amount from each of the radiation fins 4a, 4b, 4c becomes equal.
[0031]
The heat generated by the semiconductor element 6 is transmitted to each of the heat receiving plates 5a, 5b, 5c, further transferred to the heat radiating fins 4a, 4b, 4c in the wind tunnel 2 and cooled by the electric blower 3 flowing in the wind tunnel 2. The wind passes between the radiation fins 4a, 4b, 4c. At that time, cooling is performed by transferring heat from the surfaces of the radiation fins 4a, 4b, and 4c to the atmosphere.
[0032]
In this case, the air warmed by the first radiating fin 4a on the windward side directly flows into the second radiating fin 4b, but is divided by the guide plate 8 and bypasses the first radiating fin 4a. Part flows in from the side surface of the second radiation fin 4b. Therefore, the second heat radiating fin 4b can secure a heat radiation amount equivalent to that of the first heat radiating fin 4a. In addition, air warmed by the first and second radiating fins 4a and 4b also flows into the third radiating fin 4c, but is partitioned by the guide plate 8 so that the first radiating fin 4a is Since a part of the bypassed air flows, the third heat radiating fin 4c can secure a heat radiation amount equivalent to that of the first heat radiating fin 4a.
[0033]
Thus, since the wind tunnel 2 is formed by narrowing the wind passage from the windward side to the leeward side, the air that has not been heat-exchanged by the first heat radiation fin 4a becomes the second heat radiation fin 4b and It flows into the third radiating fin 4c. Therefore, even if the radiation fins 4a, 4b, and 4c are arranged in series in the wind tunnel 2, the cooling can be performed almost uniformly. Thereby, the amount of heat radiation between the radiating fins 4a on the windward side and the radiating fins 4c on the leeward side due to the difference in the temperature of the cooling air can be made uniform. Is reduced.
[0034]
Further, since the shape of the wind tunnel 2 is narrowed down from the windward side toward the leeward side, it is possible to increase the cooling wind speed on the leeward side compared to the windward side. Thereby, the air flow velocity between the radiation fins 4a, 4b, and 4c is faster in the radiant fin 4c, and heat transfer from the surface of the radiation fin 4c is further improved. Therefore, since the cooling effect can be improved even when the temperature of the cooling air becomes high, even if the same cooling fins 4a, 4b and 4c are used, the same cooling performance can be achieved on the windward side and the leeward side, and the radiation fins 4a and 4b. 4c can be reduced in size and weight. That is, it is possible to achieve a reduction in size and weight of the power conversion device 1.
[0035]
Next, a second embodiment of the present invention will be described. FIG. 2 is a schematic sectional view of a cooling device for a power converter according to the second embodiment of the present invention. This second embodiment is different from the first embodiment shown in FIG. 1 in place of the wind tunnel 2 formed by reducing the size of the wind passage from the windward side to the leeward side, The size of the wind tunnel 2 is the same from the windward side to the leeward side, and the size of the radiation fins 4a, 4b, 4c is increased stepwise from the windward side to the leeward side. Since the other configuration is the same as that of the first embodiment shown in FIG. 1, the same reference numerals are given to the same elements, and duplicate descriptions are omitted.
[0036]
In FIG. 2, the radiating fins 4a, 4b, 4c arranged in series in the wind tunnel 2 are formed to increase in size from the leeward side to the leeward side. The size of each radiation fin is formed so that the amount of heat radiation from each radiation fin 4a, 4b, 4c becomes equal.
[0037]
Cooling air taken into the wind tunnel 2 by the electric blower 3 passes through the first radiation fin 4a. In this case, since the first radiating fin 4a is formed to be relatively smaller than the second radiating fin 4b, the air that has not been heat-exchanged by the first radiating fin 4a becomes the second radiating fin. Flows into 4b. Similarly, since the second radiating fin 4b is formed to be relatively smaller than the third radiating fin 4c, the air that has not been heat-exchanged by the second radiating fin 4a becomes the third radiating fin. Flows into 4c. Therefore, even if the radiation fins 4a, 4b, and 4c are arranged in series in the wind tunnel 2, the cooling can be performed almost uniformly.
[0038]
Thereby, the amount of heat radiation between the radiating fins 4a on the windward side and the radiating fins 4c on the leeward side due to the difference in the temperature of the cooling air can be made uniform. Is reduced. That is, the temperature difference of the inlet temperature with respect to each radiation fin 4a, 4b, 4c is made small, and the cooling performance is improved.
[0039]
Next, a third embodiment of the present invention will be described. FIG. 3 is a schematic cross-sectional view of a cooling device for a power conversion device according to the third embodiment of the present invention. This third embodiment is different from the first embodiment shown in FIG. 1 in place of the wind tunnel 2 formed by reducing the size of the wind passage from the windward side to the leeward side, A wind tunnel 2 is provided in which the size of the wind passage is stepped in steps from the windward side toward the leeward side. Since the other configuration is the same as that of the first embodiment shown in FIG. 1, the same reference numerals are given to the same elements, and duplicate descriptions are omitted.
[0040]
In FIG. 3, the shape of the wind tunnel 2 disposed in the power conversion device 1 is formed in a stepped shape that decreases from the windward side toward the leeward side. That is, the wind tunnel 2 is formed with steps in a stepped manner from the leeward side to the leeward side so that the heat radiation amount from each of the radiating fins 4a, 4b, and 4c becomes equal.
[0041]
Cooling air taken into the wind tunnel 2 by the electric blower 3 passes through the first radiation fin 4a. In this case, the step portion of the wind tunnel 2 to which the first radiating fin 4a is attached is larger than the step portion of the wind tunnel 2 to which the second radiating fin 4b is attached. The air that has not been exchanged flows into the second radiation fin 4b. Similarly, the step portion of the wind tunnel 2 to which the second radiating fin 4b is attached is larger than the step portion of the wind tunnel 2 to which the third radiating fin 4c is attached. The air that has not been exchanged flows into the third radiating fin 4c. Therefore, even if the radiation fins 4a, 4b, and 4c are arranged in series in the wind tunnel 2, the cooling can be performed almost uniformly.
[0042]
Thereby, the temperature difference of the inlet temperature with respect to each radiation fin 4a, 4b, 4c of the cooling wind taken in by the electric blower 3 to the wind tunnel 2 can be made small, and a wind speed can be raised. Therefore, it is possible to efficiently cool the cooling fins 4a, 4b, and 4c with no difference in cooling performance.
[0043]
Next, a fourth embodiment of the present invention will be described. FIG. 4 is a schematic cross-sectional view of a cooling device for a power conversion device according to the fourth embodiment of the present invention. In the fourth embodiment, in contrast to the first embodiment shown in FIG. 1, instead of the wind tunnel 2 formed by narrowing the size of the wind passage from the windward side to the leeward side, The size of the wind tunnel 2 is the same from the windward side toward the leeward side, and a common radiating fin 4 and a common heat receiving plate 5 are provided. The radiating fin 4 is transported in the direction of the wind flow in the wind tunnel 2. The heat pipe which performs is attached. Since the other configuration is the same as that of the first embodiment shown in FIG. 1, the same reference numerals are given to the same elements, and duplicate descriptions are omitted.
[0044]
In FIG. 4, the semiconductor elements 6 of the respective phases of the power conversion device 1 are attached to a common heat receiving plate 5, and a common heat radiation fin 4 is provided for the common heat receiving plate 5. The heat radiating fins 4 are provided with heat pipes 9 capable of mutually transporting heat in the direction in which the cooling air in the wind tunnel 2 flows.
[0045]
The heat pipe 9 has a very high thermal conductivity, and when there is a temperature difference between both ends, the heat pipe 9 transports heat from the higher temperature to the lower temperature in a short time. Therefore, the temperature difference between the windward side and the leeward side is almost eliminated by the action of the heat pipe 9, and the heat dissipation effect on the windward side and the leeward side is almost uniformized.
[0046]
Thereby, it becomes possible to obtain optimal cooling efficiency irrespective of the temperature difference of the cooling air flowing through the wind tunnel 2. Moreover, the shape of the wind tunnel 2 arrange | positioned at the power converter device 1 is also simplified.
[0047]
Next, a fifth embodiment of the present invention will be described. FIG. 5 is a schematic cross-sectional view of a cooling device for a power converter according to a fifth embodiment of the present invention. This fifth embodiment is different from the fourth embodiment shown in FIG. 4 in that each radiating fin 4a, 4b, 4c is provided instead of the common radiating fin 4, and each radiating fin 4a, Between 4b and 4c and the heat receiving plate 5, a heat transport plate 10 having a heat pipe 9 for transporting heat in the direction of the wind flow in the wind tunnel 2 is provided. Since the other configuration is the same as that of the first embodiment shown in FIG. 1, the same reference numerals are given to the same elements, and duplicate descriptions are omitted.
[0048]
In FIG. 5, the semiconductor element 6 of each phase of the power conversion device 1 is attached to the heat receiving plate 5, and a plurality of radiating fins 4 a, 4 b, 4 c are provided on the heat receiving plate 5 via the heat transport plate 10. The heat transport plate 10 is provided with a heat pipe 9 capable of mutual heat transport in the direction in which the cooling air in the wind tunnel 2 flows. Due to the heat pipe 9 of the heat transport plate 10, the temperature difference between the windward side and the leeward side is almost eliminated, and the heat dissipation effect on the windward side and the leeward side is almost uniformized.
[0049]
Thereby, it becomes possible to obtain optimal cooling efficiency irrespective of the temperature difference of the cooling air flowing through the wind tunnel 2. Moreover, since the shape of the wind tunnel 2 arranged in the power converter 1 is simplified and the number of heat pipes 9 can be reduced, the cost can be reduced and the power converter 1 can be optimized.
[0050]
【The invention's effect】
As described above, according to the present invention, since the temperature difference of the cooling air flowing in the wind tunnel provided in the power conversion device is reduced, the cooling performance of the radiating fins arranged in series in the wind tunnel can be made uniform. It becomes possible. In addition, since the cooling performance of each radiating fin can be made uniform, it is possible to level the temperature rise values of the semiconductor elements temporarily received by the heat receiving, and the burden on the semiconductor elements can be reduced.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a wind tunnel portion in a cooling device for a power conversion device according to a first embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of a wind tunnel portion in a cooling device for a power converter according to a second embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view of a wind tunnel portion in a cooling device for a power converter according to a third embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view of a wind tunnel portion in a cooling device for a power conversion device according to a fourth embodiment of the present invention.
FIG. 5 is a schematic sectional view of a wind tunnel portion in a cooling device for a power converter according to a fifth embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view of a wind tunnel portion of a conventional power converter.
7 is a schematic cross-sectional view taken along line XX of FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Power converter 2 Wind tunnel 3 Electric blower 4 Radiation fin 5 Heat receiving plate 6 Semiconductor element 7 Railway vehicle 8 Guide plate 9 Heat pipe 10 Heat transport plate

Claims (3)

電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、
風の通路の大きさが風上側から風下側にいくにつれて絞られて形成された風洞と、
前記風洞内に風上側から風下側に直列に配置された複数個の放熱フィンと、
前記風上側に配置される少なくとも１個目の放熱フィンをバイパスして空気を流す案内板と、
各々の前記放熱フィン毎に設けられ前記電力変換装置の半導体素子より発生する熱をそれぞれの放熱フィンに伝達する複数個の受熱板とを備えたことを特徴とする電力変換装置の冷却装置。Heat generated from the semiconductor element of the power converter is transmitted to the heat radiating fins provided in the wind tunnel via the heat receiving plate, and the air is forced to flow by the electric blower in the wind tunnel, and the heat is transferred from the radiating fins to the atmosphere. In the cooling device of the power converter designed to dissipate,
A wind tunnel formed by narrowing the size of the wind passage from the windward side to the leeward side,
A plurality of radiating fins arranged in series from the windward side to the leeward side in the wind tunnel;
A guide plate that allows air to flow by bypassing at least the first heat dissipating fin disposed on the windward side;
A cooling device for a power conversion device, comprising: a plurality of heat receiving plates that are provided for each of the heat dissipation fins and transmit heat generated from the semiconductor elements of the power conversion device to the heat dissipation fins. 電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、
風の通路の大きさが風上側から風下側に向かって同じに形成された風洞と、
前記風洞内に風上側から風下側に向かって形成され前記風洞内の風の流れの方向に熱輸送を行うヒートパイプが取り付けられ各相を冷却する共通の放熱フィンと、
各々の前記放熱フィンに設けられ前記電力変換装置のＵ相、Ｖ相、Ｗ相の半導体が取り付けられ、各相の半導体素子より発生する熱を前記共通の放熱フィンに伝達する共通の受熱板とを備えたことを特徴とする電力変換装置の冷却装置。Heat generated from the semiconductor element of the power converter is transmitted to the heat radiating fins provided in the wind tunnel via the heat receiving plate, and the air is forced to flow by the electric blower in the wind tunnel, and the heat is transferred from the radiating fins to the atmosphere. In the cooling device of the power converter designed to dissipate,
A wind tunnel in which the size of the wind passage is the same from the windward side toward the leeward side,
A common radiating fin that cools each phase by attaching a heat pipe that is formed in the wind tunnel from the windward side toward the leeward side and that performs heat transport in the direction of the wind flow in the wind tunnel,
A common heat receiving plate that is provided in each of the heat dissipating fins and to which the U-phase, V-phase, and W-phase semiconductors of the power converter are attached and that transfers heat generated from the semiconductor elements of each phase to the common heat dissipating fin A cooling device for a power converter, comprising: 電力変換装置の半導体素子より発生する熱を受熱板を介して風洞に設けられた放熱フィンに伝達し、前記風洞内の電動送風機により強制的に空気を流して、前記放熱フィンから熱を大気へ放散するようにした電力変換器の冷却装置において、
風の通路の大きさが風上側から風下側に向かって同じに形成された風洞と、
前記風洞内に風上側から風下側に直列に配置された複数個の放熱フィンと、
各々の前記放熱フィンに共通に設けられ前記風洞内の風の流れの方向に熱輸送を行うヒートパイプを有した熱輸送板と、
前記熱輸送板に取り付けられると共に、前記電力変換装置のＵ相、Ｖ相、Ｗ相の半導体が取り付けられ、各相の半導体素子より発生する熱を前記熱輸送板を介して前記放熱フィンに伝達する共通の受熱板とを備えたことを特徴とする電力変換装置の冷却装置。Heat generated from the semiconductor element of the power converter is transmitted to the heat radiating fins provided in the wind tunnel via the heat receiving plate, and the air is forced to flow by the electric blower in the wind tunnel, and the heat is transferred from the radiating fins to the atmosphere. In the cooling device of the power converter designed to dissipate,
A wind tunnel in which the size of the wind passage is the same from the windward side toward the leeward side,
A plurality of radiating fins arranged in series from the windward side to the leeward side in the wind tunnel;
A heat transport plate having a heat pipe that is provided in common to each of the radiating fins and performs heat transport in the direction of the flow of wind in the wind tunnel;
Attached to the heat transport plate, U-phase, V-phase, and W-phase semiconductors of the power converter are attached, and heat generated from the semiconductor elements of each phase is transmitted to the heat radiating fins through the heat transport plate. A cooling device for a power converter, comprising: a common heat receiving plate.
JP19111299A 1999-07-06 1999-07-06 Cooling device for power converter Expired - Fee Related JP3621298B2 (en)

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