JP3620706B2 - Manufacturing method of organic EL panel - Google Patents

Manufacturing method of organic EL panel Download PDF

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JP3620706B2
JP3620706B2 JP2000117193A JP2000117193A JP3620706B2 JP 3620706 B2 JP3620706 B2 JP 3620706B2 JP 2000117193 A JP2000117193 A JP 2000117193A JP 2000117193 A JP2000117193 A JP 2000117193A JP 3620706 B2 JP3620706 B2 JP 3620706B2
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organic
cutting
substrate
recess
sealing substrate
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JP2001297878A (en
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仁資 若井
和哉 内藤
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、少なくとも一方が透光性の一対の電極により挟持され所定の発光をなす有機ＥＬ素子（有機エレクトロルミネッセンス素子）を備えた有機ＥＬパネルの製造方法に関するものである。
【０００２】
【従来の技術】
有機ＥＬパネルの構造を図３，図４を用いて説明する。有機ＥＬパネル１は、ガラス基板２上にＩＴＯ（ｉｎｄｉｕｍ ｔｉｎ ｏｘｉｄｅ）等によって透明電極（陽極）３を形成し、透明電極３上に正孔注入層，正孔輸送層，発光層及び電子輸送層を順次積層形成してなる有機層４を形成し、この有機層４上にアルミ（Ａｌ）等の背面電極（陰極）５を形成し、透明電極３，有機層４及び背面電極５を覆うようにガラス材料からなる凹部形状の封止キャップ６を支持基板２上に紫外線硬化型の接着剤７を介し気密的に配設することで構成されるもので、有機ＥＬパネル１は、透明電極３と背面電極５との間に、直流電圧を印加することによって前記発光層が所定の発光をなすものである。また、有機ＥＬパネル１は、発光領域の輪郭を鮮明に表示するため、または透明電極３と背面電極５との絶縁を確保するために、ポリイミド系等の絶縁層８が透明電極３の周縁部に若干重なるようにガラス基板２上に形成されている。
【０００３】
また有機ＥＬパネル１は、透明電極３及び背面電極５から延長形成された電極群９が、長方形形状からなるガラス基板２の一辺に集中配設されるとともに、このガラス基板２における電極部９の形成領域１０が封止キャップ６から露出するように構成されている。
【０００４】
【発明が解決しようとする課題】
かかる有機ＥＬパネル１の製造方法としては、ガラス基板２となる支持基板上の複数箇所に、透明電極３，絶縁層８，有機層４及び背面電極５を適宜方法によって順次形成して有機ＥＬ素子を得て、前記各有機ＥＬ素子を個々に用意した封止キャップ６で覆った後、前記支持基板２をスクライブ法によって切断して個々の有機ＥＬパネル１を得るようにしている。
【０００５】
即ち、電極群９の形成領域１０が封止キャップ６の外側に露出するように、個々の前記有機ＥＬ素子に封止キャップ６を配設する必要があるため、生産性が悪く有機ＥＬパネル１の製造コストを高くしてしまうといった問題点を有している。また、個々の封止キャップ６を得る場合に、大型のガラス基板によるマルチ取りが一般的であるため、封止キャップ６の製造工程において、封止キャップ６専用に切断工程後の面取り工程や洗浄工程が必要となり、製造工程が煩雑になってしまうといった問題点を有している。
【０００６】
そこで、本発明は、前述した問題点に着目し、製造工程を簡素化することで生産性を高め、有機ＥＬ素子の製造コストを低減することが可能な有機ＥＬパネルの製造方法を提供するものである。
【０００７】
【課題を解決するための手段】
本発明は、前記課題を解決するため、透光性の支持基板上に、少なくとも発光層を含む有機層を一対の電極により挟持してなる有機ＥＬ素子を複数箇所に形成する有機ＥＬ素子形成工程と、前記有機ＥＬ素子の数に応じた第１，第２の凹部を備える封止基板を用意し、前記第１の凹部が前記有機ＥＬ素子を収納可能な凹部形状の収納空間からなり、前記第２の凹部が前記一対の電極と電気的に接続される電極部の形成領域に対応した大きさからなり、前記有機ＥＬ素子と前記第１の凹部とが対向し、前記電極部と前記第２の凹部とが対向するように前記支持基板上に前記封止基板を配設するとともに、前記支持基板と前記封止基板とを接着する有機ＥＬ素子封止工程と、前記第２の凹部の底面の幅に対応する前記封止基板の表面二箇所に切断溝を形成し、これら二箇所に形成した前記封止基板の切断溝のうち外側に位置する前記封止基板の切断溝に対応する前記支持基板の表面箇所に切断溝を形成する切断溝形成工程と、前記各切断溝のうち前記支持基板側に設けた前記切断溝箇所及びこれに対応する前記外側に位置する前記封止基板の切断溝箇所を切断し、個々の有機ＥＬパネルを得る第１切断工程と、前記第２の凹部の底面の幅に対応する箇所を切断し前記電極部を露出させる第２切断工程と、を含む有機ＥＬパネルの製造方法である。
【０００８】
また、前記封止基板をガラス材料から構成し、前記第１，第２の凹部をサンドブラスト法，切削及びエッチング法の何れかにより形成してなるものである。
【００１０】
【発明の実施の形態】
以下、本発明の実施の形態を添付図面に基づき説明するが、従来例と同一もしくは相当箇所には同一符号を付してその詳細な説明は省略する。
【００１１】
図１において、有機ＥＬパネル１は、ガラス基板２，透明電極３，絶縁層８，有機層４，背面電極５及び封止キャップ６から構成されている。
【００１２】
ガラス基板２は、長方形形状からなる平板部材である。
【００１３】
透明電極３は、ガラス基板２上にＩＴＯ等の導電性材料によって構成され、日の字型の表示セグメント部１１と、個々のセグメントからそれぞれ引き出し形成されたリード部１２と、リード部１２の終端部に設けられる電極部（引き出し部）１３とを備えている。電極部１３は、ガラス基板２の一辺に集中的に配設される。
【００１４】
絶縁層８は、ポリイミド系等の絶縁材料からなり、表示セグメント部１１に対応した窓部１４と、背面電極５の後述する電極部に対応する切り欠き部１５とを有し、発光領域の輪郭を鮮明に表示するため、透明電極３の表示セグメント部１１の周縁部と若干重なるように窓部１４が形成され、また、透明電極３と背面電極５との絶縁を確保するためにリード部１２上を覆うように配設される。
【００１５】
有機層４は、少なくとも発光層を有するものであれば良いが、本発明の実施の形態においては正孔注入層，正孔輸送層，発光層及び電子輸送層を順次積層形成してなるものである。有機層４は、絶縁層８における窓部１４の形成箇所に所定の大きさをもって配設される。
【００１６】
背面電極５は、アルミ等の非透光性の導電性材料から構成され、有機層４上に配設される。背面電極５は、透明電極３における各電極部１３が形成されるガラス基板２の一辺に設けられるリード部１６と電気的に接続される。尚、リード部１６の終端部には、電極部（引き出し部）１７が設けられ、リード部１６及び電極部１７は透明電極３と同材料により形成される。
【００１７】
封止キャップ６は、透明電極３，絶縁層８，有機層４及び背面電極５からなる有機ＥＬ素子１８を収納するための凹部形状の収納空間Ｓを有し、透明電極３の電極部１３及び背面電極５の電極部１７が露出するようにガラス基板２よりも若干小さ目に構成されている。封止キャップ６は、ガラス基板２上に紫外線硬化型の接着剤７によって気密的に配設される。
【００１８】
以上の各部によって有機ＥＬパネル１が構成される。
【００１９】
次に、図２を用いて有機ＥＬパネル１の製造方法を説明する。尚、図２において、絶縁層８は省略し図示しないものとする。
【００２０】
先ず、透明電極３，絶縁層８，有機層４及び背面電極５からなる有機ＥＬ素子１８を、ガラス基板２となる支持基板１９上の複数箇所に蒸着もしくはスパッタリング法等の手段により形成する「有機ＥＬ素子形成工程，図２（ａ）」。
【００２１】
そして、サンドブラスト法，切削及びエッチング法の何れかにより、有機ＥＬ素子１８の大きさに対応し収納空間Ｓとなる第１の凹部２０と、第１の凹部２０と同等な方法により形成され、透明電極３及び背面電極５の各電極部１３，１７の形成領域１０の大きさに対応する第２の凹部２１とを備えた封止基板２２を用意する「図２（ａ）」。
【００２２】
次に、封止基板２２における支持基板１９との当接面２３に接着剤７を塗布し、第１の凹部２０が有機ＥＬ素子１８に対応し、また第２の凹部２１が形成領域１０に対応するように、封止基板２２を支持基板１９上に接着固定することで有機ＥＬパネル１を複数有するマルチ基板２４が得られる「有機ＥＬ素子封止工程，図２（ｂ）」。
【００２３】
次に、第２の凹部２１の底面２５の幅Ｗに対応する箇所の封止基板２２の表面と、有機ＥＬパネル１の区画領域に応じた支持基板１９及び封止基板２２の表面とに、スクライバによって切断溝２６を形成する「図２（ｂ）」。
【００２４】
次に、マルチ基板２４において、第２の凹部２１における外側に位置する切断溝２６と、有機ＥＬパネル１の区画領域に応じた切断溝２６との形成位置を切断し、マルチ基板２４を個々の有機ＥＬパネル１に分割する「第１切断工程，図２（ｃ）」。
【００２５】
前述した切断工程により個々に分割された有機ＥＬパネル１は、第２の凹部２１の形成箇所において、底面２５が片持ち状態にて存在する構成であるため、第２の凹部２１における内側に位置する切断溝２６の形成位置を切断する「第２の切断工程，図２（ｄ）」。
【００２６】
従って、底面２５が除去されることで、各電極部１３，１７の形成領域１０が露出する有機ＥＬパネル１が得られることになる「第２の切断工程，図２（ｅ）」。
【００２７】
かかる有機ＥＬパネル１の製造方法は、透光性の支持基板１９上に、透明電極３，絶縁層８，有機層４及び背面電極５からなる有機ＥＬ素子１８を複数箇所に形成する有機ＥＬ素子形成工程と、有機ＥＬ素子１８と対応した数の第１，第２の凹部２０，２１を備える透光性の封止基板２２を用意し、有機ＥＬ素子１８と第１の凹部２０とが対向し、また透明電極３及び背面電極５の引き出し部となる各電極部１３，１７と第２の凹部２１とが対向するように支持基板１９上に封止基板２２を配設するとともに、支持基板１９と封止基板２２とを接着する有機ＥＬ素子封止工程と、支持基板１９及び封止基板２２を切断し、個々の有機ＥＬパネル１を得る第１切断工程と、第２の凹部２１に対応する箇所を切断し各電極部１３，１７を露出させる第２切断工程とを含むものであり、個々の封止キャップを有機ＥＬ素子に合わせて配設した従来の製造方法に比べ、第２の凹部２１に対応する箇所を切断するといった簡単な製造方法によって、各電極部１３，１７が外部に露出する有機ＥＬパネル１を得ることが可能となる。また、マルチ基板２４からの切断工程のみで個々の有機ＥＬパネル１を得ることができることから、生産性を向上させるとともに、製造コストを低減させることが可能となる。
【００２８】
また、本発明の有機ＥＬパネル１の製造方法では、従来の製造工程のように封止キャップ６を形成する場合に生じる切断工程後の面取り工程や洗浄工程が不要となる。また有機ＥＬパネル１の切断部分における面取り及び洗浄工程を第２切断工程後にまとめて行うことができることから、作業効率を向上させることが可能である。
【００２９】
また、封止基板２２をガラス材料から構成し、第１，第２の凹部２０，２１をサンドブラスト法，切削及びエッチング法の何れかにより形成することで、大量生産に優れ、安価に封止キャップ６を得ることが可能となる。
【００３０】
また、第１，第２の切断工程は、スクライブ法による切断工程を採用することで、高価な設備を使用しなくとも、個々の有機ＥＬパネル１を得ることが可能となり、製造コストの低減を更に可能とする。
【００３１】
尚、本発明の実施の形態では、日の字型の表示形態を例に挙げているが、例えば１つの有機ＥＬ素子を単に発光させる有機ＥＬパネルの製造方法であっても有効であり、本発明は前述した表示形態に限定されるものではない。
【００３２】
【発明の効果】
本発明は、透光性の支持基板上に、少なくとも発光層を含む有機層を一対の電極により挟持してなる有機ＥＬ素子を複数箇所に形成する有機ＥＬ素子形成工程と、前記有機ＥＬ素子の数に応じた第１，第２の凹部を備える封止基板を用意し、前記第１の凹部が前記有機ＥＬ素子を収納可能な凹部形状の収納空間からなり、前記第２の凹部が前記一対の電極と電気的に接続される電極部の形成領域に対応した大きさからなり、前記有機ＥＬ素子と前記第１の凹部とが対向し、前記電極部と前記第２の凹部とが対向するように前記支持基板上に前記封止基板を配設するとともに、前記支持基板と前記封止基板とを接着する有機ＥＬ素子封止工程と、前記第２の凹部の底面の幅に対応する前記封止基板の表面二箇所に切断溝を形成し、これら二箇所に形成した前記封止基板の切断溝のうち外側に位置する前記封止基板の切断溝に対応する前記支持基板の表面箇所に切断溝を形成する切断溝形成工程と、前記各切断溝のうち前記支持基板側に設けた前記切断溝箇所及びこれに対応する前記外側に位置する前記封止基板の切断溝箇所を切断し、個々の有機ＥＬパネルを得る第１切断工程と、前記第２の凹部の底面の幅に対応する箇所を切断し前記電極部を露出させる第２切断工程と、を含むものであり、生産性に優れ、製造コストを低減させることが可能な有機ＥＬパネルの製造方法を提供する。
【００３３】
また、前記封止基板はガラス材料から構成し、前記第１，第２の凹部をサンドブラスト法，切削及びエッチング法の何れかにより形成してなるものであり、大量生産に優れ、安価に封止キャップを得ることが可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態における有機ＥＬパネルを示す斜視図。
【図２】同上実施の形態の有機ＥＬパネルの製造方法を示す図。
【図３】従来の有機ＥＬパネルを示す要部部分断面図。
【図４】従来の有機ＥＬパネルを示す平面図。
【符号の説明】
１ 有機ＥＬパネル
２ ガラス基板
３ 透明電極
４ 有機層
５ 背面電極
７ 接着剤
１３，１７ 電極部（引き出し部）
１８ 有機ＥＬ素子
１９ 支持基板
２０ 第１の凹部
２１ 第２の凹部
２２ 封止基板
２５ 底面
２６ 切断溝[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an organic EL panel including an organic EL element (organic electroluminescence element) that emits predetermined light while being sandwiched between a pair of translucent electrodes.
[0002]
[Prior art]
The structure of the organic EL panel will be described with reference to FIGS. The organic EL panel 1 has a transparent electrode (anode) 3 formed on a glass substrate 2 by ITO (indium tin oxide) or the like, and a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer on the transparent electrode 3 The organic layer 4 is formed by sequentially laminating and forming a back electrode (cathode) 5 such as aluminum (Al) on the organic layer 4 so as to cover the transparent electrode 3, the organic layer 4 and the back electrode 5. The organic EL panel 1 includes a transparent electrode 3, which is formed by airtightly disposing a concave sealing cap 6 made of a glass material on a support substrate 2 via an ultraviolet curable adhesive 7. The light emitting layer emits predetermined light by applying a DC voltage between the back electrode 5 and the back electrode 5. Further, the organic EL panel 1 has a polyimide-based insulating layer 8 formed on the periphery of the transparent electrode 3 in order to clearly display the outline of the light emitting region or to ensure insulation between the transparent electrode 3 and the back electrode 5. Are formed on the glass substrate 2 so as to slightly overlap.
[0003]
Further, in the organic EL panel 1, an electrode group 9 extended from the transparent electrode 3 and the back electrode 5 is concentrated on one side of the rectangular glass substrate 2, and the electrode portion 9 of the glass substrate 2 is arranged. The formation region 10 is configured to be exposed from the sealing cap 6.
[0004]
[Problems to be solved by the invention]
As a method for producing such an organic EL panel 1, a transparent electrode 3, an insulating layer 8, an organic layer 4 and a back electrode 5 are sequentially formed by a suitable method at a plurality of locations on a support substrate to be a glass substrate 2, and an organic EL element After each of the organic EL elements is covered with a sealing cap 6 prepared individually, the support substrate 2 is cut by a scribing method to obtain individual organic EL panels 1.
[0005]
That is, since it is necessary to dispose the sealing cap 6 in each organic EL element so that the formation region 10 of the electrode group 9 is exposed to the outside of the sealing cap 6, the organic EL panel 1 has poor productivity. There is a problem of increasing the manufacturing cost of the. Further, when individual sealing caps 6 are obtained, multi-sizing with a large glass substrate is generally used. Therefore, in the manufacturing process of the sealing cap 6, a chamfering process and a cleaning process after the cutting process are performed exclusively for the sealing cap 6. There is a problem that a process is required and the manufacturing process becomes complicated.
[0006]
Therefore, the present invention provides an organic EL panel manufacturing method capable of improving productivity by reducing the manufacturing process by simplifying the manufacturing process and reducing the manufacturing cost of the organic EL element. It is.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides an organic EL element forming step in which an organic EL element formed by sandwiching an organic layer including at least a light emitting layer between a pair of electrodes on a translucent support substrate is formed at a plurality of locations. And preparing a sealing substrate having first and second recesses corresponding to the number of the organic EL elements, wherein the first recess comprises a recess-shaped storage space capable of storing the organic EL elements, The second recess has a size corresponding to a formation region of an electrode portion electrically connected to the pair of electrodes, the organic EL element and the first recess face each other, and the electrode portion and the first The sealing substrate is disposed on the support substrate so that the two recesses face each other, an organic EL element sealing step for bonding the support substrate and the sealing substrate, and the second recess Cut into two places on the surface of the sealing substrate corresponding to the width of the bottom A cutting groove forming step of forming a cutting groove at a surface portion of the support substrate corresponding to the cutting groove of the sealing substrate located outside of the cutting grooves of the sealing substrate formed at these two locations; 1st cutting which cut | disconnects the said cutting groove location provided in the said support substrate side among each said cutting groove, and the cutting groove location of the said sealing substrate located in the said outer side corresponding to this, and obtains each organic EL panel And a second cutting step of cutting a portion corresponding to the width of the bottom surface of the second recess to expose the electrode portion .
[0008]
Further, the sealing substrate is made of a glass material, and the first and second recesses are formed by any one of a sandblasting method, a cutting and an etching method.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the same reference numerals are given to the same or corresponding parts as in the conventional example, and detailed description thereof will be omitted.
[0011]
In FIG. 1, the organic EL panel 1 includes a glass substrate 2, a transparent electrode 3, an insulating layer 8, an organic layer 4, a back electrode 5, and a sealing cap 6.
[0012]
The glass substrate 2 is a flat plate member having a rectangular shape.
[0013]
The transparent electrode 3 is made of a conductive material such as ITO on the glass substrate 2, and is formed of a sun-shaped display segment portion 11, a lead portion 12 that is drawn out from each segment, and a terminal end of the lead portion 12. And an electrode part (lead-out part) 13 provided in the part. The electrode unit 13 is concentrated on one side of the glass substrate 2.
[0014]
The insulating layer 8 is made of an insulating material such as polyimide and has a window portion 14 corresponding to the display segment portion 11 and a notch portion 15 corresponding to an electrode portion described later of the back electrode 5, and has a contour of the light emitting region. In order to display the image clearly, the window portion 14 is formed so as to slightly overlap the peripheral edge portion of the display segment portion 11 of the transparent electrode 3, and the lead portion 12 is used to ensure insulation between the transparent electrode 3 and the back electrode 5. It is arranged so as to cover the top.
[0015]
The organic layer 4 may have at least a light emitting layer, but in the embodiment of the present invention, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially laminated. is there. The organic layer 4 is disposed with a predetermined size in the insulating layer 8 where the window portion 14 is formed.
[0016]
The back electrode 5 is made of a non-translucent conductive material such as aluminum and is disposed on the organic layer 4. The back electrode 5 is electrically connected to a lead portion 16 provided on one side of the glass substrate 2 on which each electrode portion 13 in the transparent electrode 3 is formed. Note that an electrode portion (leading portion) 17 is provided at the terminal portion of the lead portion 16, and the lead portion 16 and the electrode portion 17 are formed of the same material as the transparent electrode 3.
[0017]
The sealing cap 6 has a recessed storage space S for storing the organic EL element 18 composed of the transparent electrode 3, the insulating layer 8, the organic layer 4, and the back electrode 5. It is configured to be slightly smaller than the glass substrate 2 so that the electrode portion 17 of the back electrode 5 is exposed. The sealing cap 6 is airtightly disposed on the glass substrate 2 by an ultraviolet curable adhesive 7.
[0018]
The organic EL panel 1 is configured by the above-described units.
[0019]
Next, a method for manufacturing the organic EL panel 1 will be described with reference to FIG. In FIG. 2, the insulating layer 8 is omitted and not shown.
[0020]
First, an organic EL element 18 composed of a transparent electrode 3, an insulating layer 8, an organic layer 4, and a back electrode 5 is formed at a plurality of locations on a support substrate 19 serving as a glass substrate 2 by means such as vapor deposition or sputtering. EL element forming step, FIG.
[0021]
Then, by any one of the sandblasting method, the cutting and the etching method, the first concave portion 20 corresponding to the size of the organic EL element 18 and serving as the storage space S is formed by a method equivalent to the first concave portion 20 and is transparent. A sealing substrate 22 having a second recess 21 corresponding to the size of the formation region 10 of the electrode portions 13 and 17 of the electrode 3 and the back electrode 5 is prepared (FIG. 2A).
[0022]
Next, the adhesive 7 is applied to the contact surface 23 of the sealing substrate 22 with the support substrate 19, the first recess 20 corresponds to the organic EL element 18, and the second recess 21 is formed in the formation region 10. Correspondingly, a multi-substrate 24 having a plurality of organic EL panels 1 is obtained by bonding and fixing the sealing substrate 22 on the support substrate 19 “organic EL element sealing step, FIG. 2B”.
[0023]
Next, on the surface of the sealing substrate 22 corresponding to the width W of the bottom surface 25 of the second recess 21 and the surface of the support substrate 19 and the sealing substrate 22 corresponding to the partition region of the organic EL panel 1, A cutting groove 26 is formed by a scriber (FIG. 2B).
[0024]
Next, in the multi-substrate 24, the formation positions of the cutting grooves 26 located outside the second recesses 21 and the cutting grooves 26 corresponding to the partition regions of the organic EL panel 1 are cut, and the multi-substrates 24 are separated into individual substrates. “First cutting step, FIG. 2 (c)” for dividing the organic EL panel 1.
[0025]
The organic EL panel 1 individually divided by the cutting process described above has a configuration in which the bottom surface 25 exists in a cantilevered state at the position where the second recess 21 is formed, and therefore is positioned inside the second recess 21. The formation position of the cutting groove 26 to be cut is cut “second cutting step, FIG. 2D”.
[0026]
Therefore, by removing the bottom surface 25, the organic EL panel 1 in which the formation regions 10 of the electrode portions 13 and 17 are exposed is obtained "second cutting step, FIG. 2 (e)".
[0027]
The organic EL panel 1 is manufactured by forming an organic EL element 18 including a transparent electrode 3, an insulating layer 8, an organic layer 4 and a back electrode 5 on a translucent support substrate 19 at a plurality of locations. A translucent sealing substrate 22 having a number of first and second recesses 20 and 21 corresponding to the formation step and the organic EL element 18 is prepared, and the organic EL element 18 and the first recess 20 face each other. In addition, a sealing substrate 22 is disposed on the support substrate 19 so that the electrode portions 13 and 17 serving as lead portions of the transparent electrode 3 and the back electrode 5 and the second recess 21 face each other. An organic EL element sealing step for bonding 19 and the sealing substrate 22, a first cutting step for cutting the support substrate 19 and the sealing substrate 22 to obtain individual organic EL panels 1, and a second recess 21. Cut the corresponding part and expose each electrode 13 and 17 A simple manufacturing method that includes a second cutting step and cuts a portion corresponding to the second recess 21 as compared with a conventional manufacturing method in which individual sealing caps are arranged in accordance with the organic EL elements. Thus, it is possible to obtain the organic EL panel 1 in which the electrode portions 13 and 17 are exposed to the outside. Moreover, since each organic EL panel 1 can be obtained only by the cutting process from the multi-substrate 24, it is possible to improve productivity and reduce manufacturing costs.
[0028]
Moreover, in the manufacturing method of the organic electroluminescent panel 1 of this invention, the chamfering process and washing | cleaning process after the cutting process produced when forming the sealing cap 6 like the conventional manufacturing process become unnecessary. In addition, since the chamfering and cleaning process at the cut portion of the organic EL panel 1 can be performed collectively after the second cutting process, the work efficiency can be improved.
[0029]
Further, the sealing substrate 22 is made of a glass material, and the first and second recesses 20 and 21 are formed by any one of the sand blasting method, the cutting and the etching method, so that the sealing cap is excellent in mass production and inexpensive. 6 can be obtained.
[0030]
In addition, by adopting a scribing method for the first and second cutting steps, it becomes possible to obtain the individual organic EL panels 1 without using expensive equipment, thereby reducing the manufacturing cost. Furthermore, it is possible.
[0031]
In the embodiment of the present invention, a Japanese character type display form is taken as an example. However, for example, an organic EL panel manufacturing method in which one organic EL element simply emits light is also effective. The invention is not limited to the display form described above.
[0032]
【The invention's effect】
The present invention provides an organic EL element forming step in which an organic EL element formed by sandwiching an organic layer including at least a light emitting layer between a pair of electrodes on a translucent support substrate is formed at a plurality of locations; A sealing substrate having first and second recesses corresponding to the number is prepared, the first recess comprises a recess-shaped storage space capable of storing the organic EL element, and the second recess is the pair. The organic EL element and the first concave portion are opposed to each other, and the electrode portion and the second concave portion are opposed to each other. The sealing substrate is disposed on the support substrate, the organic EL element sealing step for bonding the support substrate and the sealing substrate, and the width corresponding to the width of the bottom surface of the second recess Cut grooves are formed in two places on the surface of the sealing substrate, and these two places A cutting groove forming step of forming a cutting groove in a surface portion of the support substrate corresponding to the cutting groove of the sealing substrate located outside the cutting groove of the sealing substrate formed, and the cutting groove among the cutting grooves A first cutting step of cutting each of the cut groove portions provided on the support substrate side and the corresponding cut groove portions of the sealing substrate located on the outside to obtain individual organic EL panels; and the second recesses A method of manufacturing an organic EL panel that includes a second cutting step that exposes the electrode portion by cutting a portion corresponding to the width of the bottom surface of the substrate, and is excellent in productivity and capable of reducing manufacturing costs. provide.
[0033]
The sealing substrate is made of a glass material, and the first and second recesses are formed by any one of the sand blasting method, the cutting and the etching method, and is excellent in mass production and inexpensively sealed. A cap can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an organic EL panel according to an embodiment of the present invention.
FIG. 2 is a view showing a method for manufacturing the organic EL panel of the embodiment.
FIG. 3 is a partial cross-sectional view showing a main part of a conventional organic EL panel.
FIG. 4 is a plan view showing a conventional organic EL panel.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Organic electroluminescent panel 2 Glass substrate 3 Transparent electrode 4 Organic layer 5 Back electrode 7 Adhesives 13 and 17 Electrode part (drawing part)
18 Organic EL element 19 Support substrate 20 First recess 21 Second recess 22 Sealing substrate 25 Bottom surface 26 Cutting groove

Claims (2)

透光性の支持基板上に、少なくとも発光層を含む有機層を一対の電極により挟持してなる有機ＥＬ素子を複数箇所に形成する有機ＥＬ素子形成工程と、
前記有機ＥＬ素子の数に応じた第１，第２の凹部を備える封止基板を用意し、前記第１の凹部が前記有機ＥＬ素子を収納可能な凹部形状の収納空間からなり、前記第２の凹部が前記一対の電極と電気的に接続される電極部の形成領域に対応した大きさからなり、前記有機ＥＬ素子と前記第１の凹部とが対向し、前記電極部と前記第２の凹部とが対向するように前記支持基板上に前記封止基板を配設するとともに、前記支持基板と前記封止基板とを接着する有機ＥＬ素子封止工程と、
前記第２の凹部の底面の幅に対応する前記封止基板の表面二箇所に切断溝を形成し、これら二箇所に形成した前記封止基板の切断溝のうち外側に位置する前記封止基板の切断溝に対応する前記支持基板の表面箇所に切断溝を形成する切断溝形成工程と、
前記各切断溝のうち前記支持基板側に設けた前記切断溝箇所及びこれに対応する前記外側に位置する前記封止基板の切断溝箇所を切断し、個々の有機ＥＬパネルを得る第１切断工程と、
前記第２の凹部の底面の幅に対応する箇所を切断し前記電極部を露出させる第２切断工程と、を含む有機ＥＬパネルの製造方法。An organic EL element forming step of forming, on a translucent support substrate, an organic EL element in which an organic layer including at least a light emitting layer is sandwiched between a pair of electrodes at a plurality of locations;
A sealing substrate having first and second recesses corresponding to the number of the organic EL elements is prepared, and the first recess includes a recess-shaped storage space in which the organic EL elements can be stored. Of the organic EL element and the first concave portion are opposed to each other, and the electrode portion and the second concave portion are opposed to each other. An organic EL element sealing step of disposing the sealing substrate on the support substrate so as to face the recess, and bonding the support substrate and the sealing substrate;
Cutting grooves are formed at two locations on the surface of the sealing substrate corresponding to the width of the bottom surface of the second recess, and the sealing substrate is located outside of the cutting grooves of the sealing substrate formed at these two locations. A cutting groove forming step of forming a cutting groove on the surface portion of the support substrate corresponding to the cutting groove;
The 1st cutting process of cut | disconnecting the said cutting groove location provided in the said support substrate side among each said cutting groove, and the cutting groove location of the said sealing substrate located in the said outer side corresponding to this, and obtaining each organic EL panel When,
A second cutting step of cutting a portion corresponding to the width of the bottom surface of the second recess to expose the electrode portion . 前記封止基板をガラス材料から構成し、前記第１，第２の凹部をサンドブラスト法，切削及びエッチング法の何れかにより形成してなることを特徴とする請求項１に記載の有機ＥＬパネルの製造方法。2. The organic EL panel according to claim 1, wherein the sealing substrate is made of a glass material, and the first and second recesses are formed by any one of a sand blast method, a cutting method, and an etching method. Production method.
JP2000117193A 2000-04-13 2000-04-13 Manufacturing method of organic EL panel Expired - Fee Related JP3620706B2 (en)

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