JP3617116B2 - Two-dimensional array type optical element module - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a two-dimensional array type optical element module. More specifically, the present invention relates to a configuration of a novel optical element module which is an optical element module on which a plurality of optical elements are mounted, and can be used advantageously in an optical interconnection device.
[0002]
[Prior art]
In the application fields of various information devices that have been rapidly used in recent years, especially in systems that handle images or videos, parallel computers, and the like, it is necessary to transmit a large amount of data compared to the prior art. Also, many large-scale systems used for such applications are completed as individual systems manufactured by function or manufacturing unit and combined by an interconnection device from the viewpoint of both manufacturing and maintenance. Has been. Accordingly, various technological developments are being made to construct this type of system by utilizing the characteristics of optical fibers capable of non-inductive and high-density signal transmission.
[0003]
FIG. 9 is a diagram conceptually showing a typical configuration of a system including a conventional interconnection device using metal wires.
[0004]
As shown in the figure, this type of system accommodates a large number of parallel substrates 3 in a single housing 4, and these substrates or other external devices are connected to a specific surface ( It is usually connected by an interconnection device on the back side. In a conventional system using a metal cable, this interconnection device is composed of a connector provided on the board side and a flat cable 5 having connectors 5a at both ends.
[0005]
When the interconnection device as described above is configured using an optical fiber, the flat cable 5 is replaced with an optical fiber. In addition, since most of the signal processing on each substrate is handled by electrical signals, electrical / optical or optical / electrical conversion is indispensable between the optical interconnection device and the electronic circuit. Therefore, an optical module in which an optical element that performs optical / electrical conversion or electrical / optical conversion and an optical fiber that is an optical signal transmission medium is integrated is actually produced. It is common to use for an interface. In addition, a drive circuit, an amplifier circuit, and the like that are inevitably associated with the optical element are integrally provided in the optical module. By using such an optical module, steps such as optical axis alignment necessary for coupling an optical fiber and an optical element can be omitted at the manufacturing site of the apparatus, and an optical system can be efficiently constructed. It becomes possible.
[0006]
However, since the optical module as described above is used by directly mounting the optical element portion on the substrate, it cannot be easily attached and detached like an interconnect device using a conventional flat cable. On the other hand, optical connectors capable of detachably connecting optical fibers have already been put into practical use, but this type of optical connector can only connect optical fibers one by one or at most several. In consideration of application to a new architecture such as the parallel processing computer described above, the number of channels of the interconnect device may exceed 1000, and it is impossible to realize an optical interconnect device using a conventional optical connector. Impossible.
[0007]
In response to such a situation, for example, an optical element array in which a plurality of optical elements are packaged together, a multi-core fiber having a plurality of cores, and the like have been developed. An optical fiber cable having more than 1000 channels by incorporating a large number of multi-core fibers is also being developed. In addition, many techniques are being developed for optical connectors attached to the tip of an optical fiber, such as two-dimensionally arranging connection end faces of a plurality of optical fibers to improve physical transmission density.
[0008]
[Problems to be solved by the invention]
On the other hand, as described above, the optical module includes electronic circuits such as an optical element driving circuit and an amplifier in addition to the optical element. These circuits inevitably generate heat during operation. Such heat is not a serious problem with a single optical module, but if a large number of optical modules are mounted intensively to form a multi-channel interconnect device, the total amount of heat generated Cannot be ignored.
[0009]
In particular, light emitting elements and light receiving elements used in optical modules generally have temperature characteristics. For this reason, when used in a single optical module, natural cooling did not have a serious effect, but when many optical modules were mounted at high density, the initial characteristics could be maintained over time. Disappear. In particular, in a two-dimensional array type optical module, the temperature condition of the optical module located inside becomes disadvantageous, so that variations in characteristics occur between channels in one interconnection device.
[0010]
Therefore, the present invention provides a novel two-dimensional array type optical element module that solves the above-mentioned problems of the prior art, makes it possible to handle a large number of optical channels with high density, and realizes a multi-channel optical interconnection device. Its purpose is to do.
[0011]
[Means for Solving the Problems]
According to the present invention, a substrate having a step-like mounting surface in which horizontal and vertical surfaces perpendicular to each other are continuously formed, and an incident optical axis parallel to the horizontal surface of the substrate and perpendicular to the vertical surface or A one-dimensional optical element array including a plurality of optical elements each having an output optical axis and mounted on each stage of the substrate, and the substrate includes a region for mounting the optical element array in the vicinity of one end. In addition, a two-dimensional array type optical element module is provided, which is formed by stacking a plurality of small substrates loaded with wiring layers connected to the optical element array .
[0012]
[Action]
In the two-dimensional array type optical element module according to the present invention, an optical element array formed by arranging a plurality of optical elements in a one-dimensional manner is further arranged in a staircase pattern, so that a two-dimensional array of optical elements is formed as a whole. The main feature is the composition.
[0013]
In other words, in the two-dimensional array type optical element module according to the present invention, each one-dimensional optical element array and the mounting substrate which is a main heat radiation destination are thermally coupled individually to the mounting substrate through the base. . In other words, no other one-dimensional optical element array is interposed between each one-dimensional optical element array and the mounting substrate. Therefore, the thermal conditions for each one-dimensional optical element array are equal throughout the two-dimensional optical element array, and even when a multi-channel two-dimensional array is configured, there is no variation in the operating conditions of each channel.
[0014]
Such a two-dimensional array type optical element module according to the present invention can be configured by mounting a one-dimensional optical element array on each horizontal plane or each vertical plane of the base using a stepped base.
[0015]
When an optical element array is mounted on such a stepped base, it is necessary to provide wiring for coupling an electric signal to each one-dimensional optical element array. That is, since the one-dimensional optical element array includes a plurality of optical elements and a circuit for driving each optical element, etc., the power for driving these circuits and the optical element converts it to an optical signal. It is necessary to provide a signal line or the like for transmitting a signal for each optical element. However, since the GND terminal or the like may be shared by a plurality of optical elements, for example, as will be described later, when a conductive material or a semiconductor material is used as the base, the base itself may be used as a common GND. Good.
[0016]
The base of the two-dimensional array type optical element module according to the present invention as described above can be produced by processing, for example, a Si single crystal. However, when a base having a stepped mounting surface is used from the beginning, the process of loading the wiring onto the base may be troublesome. Therefore, according to a preferred aspect of the present invention, a plurality of small substrates each mounted with a one-dimensional optical element array and loaded with wiring are prepared and stacked, whereby the two-dimensional array type optical element module according to the present invention described above is laminated. Can be manufactured easily and efficiently.
[0017]
Hereinafter, the optical interconnection device according to the present invention will be described in more detail with reference to the drawings. However, the following disclosure is only an example of the present invention and does not limit the technical scope of the present invention. Absent.
[0018]
【Example】
FIG. 1 is a diagram showing a specific configuration example of a two-dimensional array type optical element module according to the present invention.
[0019]
As shown in the figure, here, a one-dimensional optical element array 20 including a plurality of optical elements is mounted on each horizontal plane of a base 10 having a step-shaped mounting surface formed integrally. . The light-emitting portion of each one-dimensional optical element array 20 is formed on a plane parallel to the vertical surface of the substrate. Therefore, when viewed from the front of this two-dimensional array type optical element module, the light emission of each optical element The parts are arranged in a matrix.
[0020]
FIG. 2 is a view of the two-dimensional array type optical element module shown in FIG. 1 as viewed from above.
[0021]
As shown in the figure, each one-dimensional optical element array 20 is mounted in the vicinity of the front end of each horizontal plane of the substrate 10, and wiring 30 having one end connected to the one-dimensional optical element array 20 is arranged on each horizontal plane. The direction is changed and it extends toward the side of the base 10. Actually, the wiring 30 can be coupled to the wiring on the surface of the mounting substrate on which the base 10 itself is mounted by extending the wiring 30 downward along the side surface of the base 10.
[0022]
However, in this aspect, since a region for loading the wiring 30 must be taken on each horizontal plane of the base body 10, the mounting dimensions of the two-dimensional array type optical element module as a whole are increased.
[0023]
FIG. 3 is a diagram showing another configuration example of the two-dimensional array type optical element array according to the present invention.
[0024]
As shown in the figure, this two-dimensional array type optical element module is configured by stacking small substrates 11a to 11d loaded with a one-dimensional optical element array 20 and wirings 31a to 31d, respectively. Here, the dimensions of each of the small substrates 11a to 11d are shortened from the lower layer to the upper layer, and as will be described later, the one-dimensional optical element array is finally arranged stepwise. Further, in this aspect, since the wirings 21a to 31d are loaded on the small substrates 11a to 11d, the density of the wiring does not increase significantly. Further, since the wirings 31a to 31d can be formed in the same process as that of a normal flat substrate, the manufacture is easy.
[0025]
FIG. 4 is a diagram showing one embodiment after the two-dimensional array type optical element array shown in FIG. 3 is completed.
[0026]
As shown in the figure, in this two-dimensional array type optical element module, not only the front end of itself but also the rear end is configured in a step shape. Accordingly, the wirings 31a to 31d are exposed on the horizontal planes at the rear end of the optical element module. Such rear ends of the wirings 31a to 31d can be easily combined with the wirings on the mounting substrate using a normal bonding wire or the like, so that handling is easy. However, the dimensions are different for each of the small substrates 11a to 11d, which is disadvantageous in terms of productivity.
[0027]
FIG. 5 is a diagram showing another aspect after the two-dimensional array type optical element module shown in FIG. 3 is completed.
[0028]
As shown in the figure, this optical element module is configured by stacking small substrates 12 having the same dimensions. Here, each small substrate 12 includes wirings 32 and 33 on its upper and lower surfaces, respectively. The one-dimensional optical element array 20 is mounted near the front end of the small substrate 12 and is coupled to the wiring 32 on the upper surface.
[0029]
In the two-dimensional array type optical element module configured as described above, the wiring 32 loaded on the upper surface of the lower small substrate 12 is electrically connected to the wiring 33 loaded on the lower surface of the upper small substrate 12. After being coupled, the rear end of the downward wiring 33 is exposed downward at the rear end of each small substrate 12. In the uppermost small substrate, the wiring on the upper surface of the small substrate is directly exposed. However, in order to connect the wirings of each layer in a lump using a connecting member described later, in the example shown in FIG. A dummy small substrate on which the one-dimensional optical element array is not mounted (wiring is loaded) is stacked.
[0030]
Here, it is possible to prepare a connection member 13 having a shape complementary to the rear end of the two-dimensional array type optical element module and connect the wiring on the mounting substrate to the one-dimensional optical element array. That is, in the example shown in FIG. 5, bumps 35 made of a conductive material are loaded on each horizontal surface of the connection member 13 having a stepped end surface. The one-dimensional optical element array can be electrically coupled. This connection is relatively easy because it is only necessary to establish an electrical connection at the rear end of each wiring 33.
[0031]
FIG. 6 is a diagram showing a completely different configuration example of the two-dimensional array type optical element module according to the present invention.
[0032]
As shown in the figure, this two-dimensional array type optical element module is configured by arranging a plurality of small substrates 14 a to 14 d arranged perpendicular to the mounting substrate 40 adjacent to each other. Each of the small substrates 14a to 14d has the one-dimensional optical element array 20 and the wirings 36a to 36d mounted on the front surface when mounted. Therefore, the configuration of each of the small substrates 14a to 14d is very similar to that of the two-dimensional array type optical element module shown in FIG. However, in this optical element module, light is radiated at right angles to the mounting surfaces of the small boards 14a to 14d, that is, so that light is emitted at right angles to the extending direction of the wirings 36a to 36d on the small boards 14a to 14d. A two-dimensional optical element array 20 is mounted.
[0033]
In this configuration, since each of the wirings 36a to 36d coupled to the small substrates 14a to 14d is directly extended onto the mounting substrate 40, the two-dimensional array type optical element module itself can be very easily mounted on the mounting substrate 40. Can be implemented. In addition, since the heat generated in each one-dimensional optical element array 20 is equally transmitted to the mounting substrate 40 through the small substrates 14a to 14d, each one-dimensional optical element array 20 is operated under equal temperature conditions. Is possible.
[0034]
FIG. 7 is a view showing still another aspect of the two-dimensional array type optical element module according to the present invention.
[0035]
As shown in the figure, this two-dimensional array type optical element module is also configured by arranging a plurality of small substrates 14 a to 14 d arranged perpendicular to the mounting substrate 40 adjacent to each other. 6 is also common to the embodiment shown in FIG. 6 in that a stepped mounting surface for mounting the one-dimensional optical element array is formed by sequentially changing the dimensions of the small substrates 15a to 15d. . However, in this embodiment, each one-dimensional optical element array 20 is loaded on the horizontal end faces of the small substrates 15a to 15d. Further, a heat insulating layer 41 made of a material having low thermal conductivity is interposed between each of the small substrates 15a to 15d.
[0036]
In the configuration as described above, the heat generated in each one-dimensional optical element array 20 is efficiently propagated to the small substrates 15a to 15d, and the one-dimensional optical element array 20 and the small substrates 15a to 15d are adjacent to each other. Since it is not thermally affected by other arrays and small substrates, each operates reliably under the same conditions.
[0037]
FIG. 8 is a diagram showing still another configuration example of the two-dimensional array type optical element module according to the present invention.
[0038]
As shown in the figure, this two-dimensional array type optical element module includes a metal base 41 having a step-like mounting surface, an insulating substrate 16 loaded on each horizontal surface of this description 41, and each insulation. And the one-dimensional optical element array 20 mounted on the conductive substrate 16.
[0039]
With the above configuration, extremely efficient heat dissipation is possible through the metal base 41, so that each one-dimensional optical element array 20 can be operated under good temperature conditions. Further, since the one-dimensional optical element array 20 and the insulating substrate 16 can have the same shape, the productivity is high. Needless to say, as the insulating substrate 16, for example, a semiconductor substrate having an oxide insulating film formed on its surface may be used. Moreover, this metal base | substrate 41 can also be utilized as a common GND terminal of each one-dimensional optical element array.
[0040]
【The invention's effect】
As described above in detail, the two-dimensional array type optical element module according to the present invention can efficiently dissipate heat generated in the optical element, the drive circuit, etc. due to its unique shape. In addition, since the thermal conditions for each one-dimensional optical element array are substantially equal, it is possible to handle multi-channel optical signals equally.
[0041]
Furthermore, since it can be manufactured with high precision and high productivity using semiconductor processing technology, it can be applied to multi-channel optical connectors and the like.
[Brief description of the drawings]
FIG. 1 is a diagram showing a specific configuration example of a two-dimensional array type optical element module according to the present invention.
2 is a diagram illustrating a wiring loaded state in the two-dimensional array type optical element module illustrated in FIG. 1. FIG.
FIG. 3 is a diagram showing the structure of another configuration example of the two-dimensional array type optical element module according to the present invention.
4 is a diagram showing one mode of a two-dimensional array type optical element module having the structure shown in FIG. 3. FIG.
FIG. 5 is a diagram showing another aspect of the two-dimensional array type optical element module having the structure shown in FIG. 3;
FIG. 6 is a diagram showing the structure of another configuration example of the two-dimensional array type optical element module according to the present invention.
7 is a diagram showing another aspect of the two-dimensional array type optical element module having the structure shown in FIG. 6. FIG.
FIG. 8 is a diagram showing still another configuration example of the two-dimensional array type optical element module according to the present invention.
FIG. 9 is a diagram conceptually showing a typical configuration of a general interconnection device using a metal cable.
[Explanation of symbols]
3 ... substrate
4 ... Case,
5 ... Connector,
6 ... support member 10 ... base,
11a to 11d, 12, 14a to 14d, 15a to 15d ... small substrates,
13: Connecting member,
16 ... Insulating substrate,
20 ... one-dimensional optical element array,
30, 31a-31d, 32, 33, 36a-36d, 37a-37d ... wiring,
35 ... Bump,
40: mounting board,
41 ... Metal base

Claims (13)

A substrate having a step-like mounting surface in which horizontal and vertical surfaces perpendicular to each other are alternately and continuously formed;
A one-dimensional optical element array including a plurality of optical elements parallel to a horizontal plane of the substrate and having an incident optical axis or an outgoing optical axis perpendicular to the vertical plane and mounted on each stage of the substrate ,
The base is formed by stacking a plurality of small substrates each provided with a region for mounting the optical element array in the vicinity of one end and loaded with a wiring layer connected to the optical element array. A two-dimensional array type optical element module. 2. The two-dimensional array type optical element module according to claim 1, wherein the wiring layer is a wiring layer loaded on the horizontal surface of the substrate and on a side surface of the substrate. . 3. The optical element module according to claim 1, wherein the base is an integral member formed by etching a semiconductor single crystal. 4. The optical element module according to claim 1 , wherein the base is formed by laminating a small substrate parallel to a plane including the outgoing optical axis or the incident optical axis of the optical element. A two-dimensional array type optical element module characterized by being configured. 5. The optical element module according to claim 4 , wherein the substrates are sequentially stacked while being shifted by a length corresponding to the depth of the optical element array. In the optical element module according to claim 4 or 5 ,
The base is configured by sequentially stacking small substrates of different lengths so that the rear end surface of the lower-layer small substrate is exposed by a predetermined length behind the base. ,
Each of the small substrates is loaded with a wiring layer having one end connected to the optical element array and the other end extending to the rear end of the small substrate. . In the optical element module according to claim 4 or 5 ,
The base is configured by sequentially stacking small substrates of the same length,
Each of the small substrates has a first wiring layer having one end connected to the optical element array and the other end extending backward, and one end contacting the first wiring layer of an adjacent small substrate and the other end being the small wiring A two-dimensional array type optical element module comprising: a second wiring layer loaded on a back surface of a small substrate with respect to the first wiring layer extending to the rear end of the substrate. 8. The optical element module according to claim 7 , wherein the second wiring layer of each small board having a shape complementary to the rear end of the base and exposed behind the base is mounted on the base. A two-dimensional array type optical element module, further comprising a connection member provided with wiring for connecting to a mounted substrate. 9. The optical element module according to claim 1 , wherein the base has a difference in length larger than a height when the optical element array is mounted, and the optical element. 2. A two-dimensional array type optical element module comprising a small substrate adjacent to an outgoing optical axis or an incident optical axis of an array arranged adjacent to each other. 10. The optical element module according to claim 9 , wherein each of the substrates includes a wiring layer having one end connected to the optical element array mounted on the substrate and the other end connected to the mounting substrate. A two-dimensional array type optical element module. 10. The optical element module according to claim 9 , wherein each of the substrates includes a wiring layer on its front surface, one end of the wiring layer is connected to the mounting substrate, and the other end is disposed in front of the substrate. A two-dimensional array type optical element module, wherein the optical element module is connected to the optical element array loaded on the substrate. The optical element module according to any one of claims 9 to 11 , wherein each of the substrates constituting the base is thermally blocked. Element module. In the optical element module according to any one of claims 1 to 12, wherein the optical element array are mounted on a substrate or substrate formed of Si, the base body or substrate is ground potential A two-dimensional array type optical element module characterized by being connected.

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