JPH08274355A - Two-dimensional array-type optical element module - Google Patents

Abstract

PURPOSE: To obtain a two-dimensional array-type optical element module in which many optical channels can be handled with high density by a method wherein a plurality of optical elements which are parallel to the horizontal face of a base body and which comprise an incident optical axis or a radiant optical axis perpendicular to the vertical face are contained and one-dimensional optical element arrays are mounted respectively on respective steps of the base body. CONSTITUTION: In a two-dimensional array-type optical element module, one- dimensional optical element arrays 20 which contain a plurality of optical elements are mounted on respective horizontal faces of a base body 10 which comprises integrally molded step-shaped mounting faces. Light-emitting parts of the respective one-dimensional optical element arrays 20 are formed on faces which are parallel to the vertical face of the base body 10. Consequently, thermal conditions with reference to the respective one-dimensional optical element arrays 20 are nearly equal, and multichannel light signals can be handled equally. In addition, since the two-dimensional array-type optical element module can be manufactured extremely precisely and with good productivity, it can be applied to a multichannel optical connector or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a two-dimensional array type optical element module. More specifically, the present invention relates to an optical element module in which a plurality of optical elements are mounted, and particularly to a novel optical element module configuration that can be advantageously used in an optical interconnection device.

[0002]

2. Description of the Related Art In the field of application of various information devices, which are rapidly expanding in use in recent years, particularly in systems for handling images or video, parallel computers, etc., it is necessary to transmit an extremely large amount of data as compared with the conventional one. I have to. In addition, many of the large-scale systems used in such applications are manufactured individually by function or manufacturing unit from the viewpoint of both manufacturing and maintenance, and then combined by an interconnection device to complete the system. Has been done. Therefore, various technological developments are underway to construct a system of this kind by taking advantage of the characteristics of an optical fiber capable of non-induction and high-density signal transmission.

FIG. 9 is a diagram conceptually showing a typical configuration of a system including a conventional interconnection device using a metal wire.

As shown in the figure, this type of system
A large number of parallel boards 3 are housed in one housing 4, and these boards or other external devices are connected by an interconnection device on a specific surface (usually the back surface) of the housing. . In a conventional system using a metal cable, this interconnection device is composed of a connector provided on the board side and a flat cable 5 having connectors 5a at both ends.

When the interconnection device as described above is constructed by using an optical fiber, the flat cable 5 is replaced by an optical fiber. Further, since most of the signal processing on each board is handled by electric signals, electric / optical or optical / electric conversion is indispensable between the optical interconnection device and the electronic circuit. Therefore, actually, an optical module in which an optical element that performs optical / electrical conversion or electric / optical conversion and an optical fiber that is a transmission medium of an optical signal are integrated is produced. It is commonly used for interfaces. Further, a drive circuit, an amplifier circuit and the like, which are inevitably attached to the optical element, are also integrally provided in the optical module. By using such an optical module, steps such as optical axis alignment required when coupling an optical fiber and an optical element can be omitted at the device manufacturing site, and an optical system can be efficiently constructed. It will be possible.

However, since the above-mentioned optical module is used by directly mounting the optical element portion on the substrate, it cannot be easily attached / detached like the conventional interconnect device using a flat cable. . On the other hand, an optical connector to which an optical fiber can be detachably connected has already been put into practical use.
You can only connect one book at a time or at most a few. Considering the application to the new architecture such as the parallel processing computer, the number of channels of the interconnect device may exceed 1000, and it is extremely possible to realize the optical interconnect device using the conventional optical connector. It is impossible.

In response to such a situation, for example, an optical element array in which a plurality of optical elements are integrally packaged, or 1
In the book, a multi-core fiber including a plurality of cores has been developed. Also, an optical fiber cable with more than 1000 channels has been developed by incorporating many multicore fibers. In addition, the optical connector attached to the tip of the optical fiber also has a connection end face of a plurality of optical fibers with two
Many techniques are being developed, such as dimensionally arraying to improve the physical transmission density.

[0008]

On the other hand, the optical module, as described above, has a built-in electronic circuit such as a drive circuit of the optical element and an amplifier in addition to the optical element. Inevitably generates heat. Such heat is not a serious problem in a single optical module, but when a large number of optical modules are intensively mounted to form a multi-channel interconnect device,
The overall calorific value cannot be ignored.

In particular, the light emitting element and the light receiving element used in the optical module generally have temperature characteristics. Therefore, when used in a single optical module, natural cooling did not have a serious effect, but when a large number of optical modules were densely mounted, the initial characteristics could be maintained over time. Disappear. Particularly, in the two-dimensional array type optical module, the temperature condition of the optical module located inside is disadvantageous, so that the characteristics vary among the channels in one interconnection device.

Therefore, the present invention solves the above-mentioned problems of the prior art, makes it possible to handle a large number of optical channels at a high density, and realizes a novel two-dimensional array type optical element capable of realizing a multi-channel optical interconnection device. Its purpose is to provide a module.

[0011]

According to the present invention, a base having a stepped mounting surface in which horizontal planes and vertical planes perpendicular to each other are alternately formed, and a base parallel to the horizontal plane of the base and A two-dimensional array type optical element module including a one-dimensional optical element array including a plurality of optical elements having an incident optical axis or an outgoing optical axis perpendicular to a vertical surface and mounted on each stage of the substrate. Will be provided.

[0012]

In the two-dimensional array type optical element module according to the present invention, an optical element array formed by arranging a plurality of optical elements in a one-dimensional manner is further arranged in a so-called staircase form, and the optical element array is formed as a whole. Its main feature is that it constitutes a dimensional array.

That is, in the two-dimensional array type optical element module according to the present invention, each one-dimensional optical element array and the mounting board which is a main heat radiation destination are thermally individually mounted on the mounting board via the base. Be combined. In other words, no other one-dimensional optical element array is interposed between each one-dimensional optical element array and the mounting substrate. Therefore, the thermal conditions for each one-dimensional optical element array are equalized in the entire two-dimensional optical element array, and even when a multi-channel two-dimensional array is configured, there is no variation in the operating conditions of each channel.

Such a two-dimensional array type optical element module according to the present invention can be constructed by using a stepped base and mounting the one-dimensional optical element array on each horizontal surface or each vertical surface of the base. .

When the optical element array is mounted on such a stepped substrate, it is necessary to provide wiring for coupling an electric signal to each one-dimensional optical element array. That is, since the one-dimensional optical element array includes a plurality of optical elements and circuits for driving the optical elements, the one-dimensional optical element array converts electric power for driving these circuits and optical signals in the optical elements. It is necessary to provide a signal line or the like for transmitting a signal for each optical element. However, since the GND terminal and the like may be shared by a plurality of optical elements, for example, when a conductive material or a semiconductor material is used as the base, the base itself may be used as a common GND, as described later. Good.

The substrate of the two-dimensional array type optical element module according to the present invention as described above can be prepared by processing, for example, a Si single crystal. However, when a substrate having a stepped mounting surface is used from the beginning, the process of loading wiring on the substrate may be troublesome. Therefore, according to a preferred embodiment of the present invention, a two-dimensional array type optical element module according to the present invention is provided by preparing and stacking a plurality of small substrates each having a one-dimensional optical element array mounted thereon and wiring. Can be manufactured easily and efficiently.

Hereinafter, the optical interconnection device according to the present invention will be described more specifically with reference to the drawings. However, the following disclosure is only one embodiment of the present invention, and the technical scope of the present invention is not limited at all. Not something to do.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a specific configuration example of a two-dimensional array type optical element module according to the present invention.

As shown in the figure, here, a one-dimensional optical element array 20 including a plurality of optical elements is mounted on each of the horizontal surfaces of a substrate 10 having a stepwise mounting surface integrally formed. Has been done. The light emitting portion of each one-dimensional optical element array 20 is formed on a surface parallel to the vertical surface of the substrate.
When viewed from the front of the two-dimensional array type optical element module, the light emitting portions of each optical element are arranged in a matrix.

FIG. 2 is a view of the two-dimensional array type optical element module shown in FIG. 1 looking down from above.

As shown in the figure, each one-dimensional optical element array
20 is mounted near the front end of each horizontal surface of the base body 10,
The wiring 30 whose one end is connected to the one-dimensional optical element array 20 changes its direction on each horizontal plane and extends toward the side of the substrate 10. In practice, the wiring 30 can be coupled to the wiring on the surface of the mounting substrate on which the base 10 itself is mounted by extending the wiring 30 downward along the side surface of the base 10.

However, in this embodiment, since the area for loading the wiring 30 must be provided on each horizontal surface of the substrate 10, the mounting dimension of the two-dimensional array type optical element module becomes large as a whole.

FIG. 3 is a diagram showing another structural example of the two-dimensional array type optical element array according to the present invention.

As shown in the figure, the two-dimensional array type optical element module is constructed by laminating the one-dimensional optical element array 20 and the small substrates 11a to 11d loaded with the wirings 31a to 31d. There is. Here, each small board 11
The dimensions of a to 11d become shorter from the lower layer to the upper layer, and as will be described later, the one-dimensional optical element arrays are finally arranged in a staircase pattern. Also, in this aspect, the small substrate
Since the wirings 21a to 31d are loaded on each of the wirings 11a to 11d, the wiring density does not increase remarkably. Moreover, since the wirings 31a to 31d can be formed in the same process as that of a normal flat substrate, the manufacturing is easy.

FIG. 4 is a diagram showing one mode after completion of the two-dimensional array type optical element array shown in FIG.

As shown in the figure, in this two-dimensional array type optical element module, not only its front end but also its rear end is formed in a stepped shape. Therefore, at the rear end of the optical element module, the wirings 31a to 31d are exposed on each horizontal surface. Since the rear ends of the wirings 31a to 31d can be easily coupled to the wirings on the mounting board by using a normal bonding wire or the like, the handling is easy. However, the size of each of the small substrates 11a to 11d is different, which is disadvantageous in terms of productivity.

FIG. 5 is a diagram showing another mode after the two-dimensional array type optical element module shown in FIG. 3 is completed.

As shown in the figure, this optical element module is constructed by laminating small substrates 12 having the same dimensions. Here, each small board 12 is provided with wirings 32 and 33 on its upper surface and lower surface, respectively. In addition, a one-dimensional optical element array
20 is mounted in the vicinity of the front end of the small board 12 and is coupled to the wiring 32 on the upper surface.

In the two-dimensional array type optical element module configured as described above, the wiring 32 loaded on the upper surface of the lower small substrate 12 is replaced by the wiring 33 loaded on the lower surface of the small substrate 12 immediately above. Electrically coupled, the rear end of the downward wiring 33 is exposed downward at the rear end of each small board 12. In the uppermost small substrate, the wiring on the upper surface of the small substrate is directly exposed. However, in order to collectively connect the wirings of each layer by using a connecting member described later, in the example shown in FIG. Dummy small substrates on which the one-dimensional optical element array is not mounted (wiring is loaded) are laminated.

Here, a connection member 13 having a shape complementary to the rear end of this two-dimensional array type optical element module may be prepared to connect the wiring on the mounting substrate to the one-dimensional optical element array. it can. That is, in the example shown in FIG. 5, bumps 35 made of a conductive material are loaded on each horizontal surface of the connecting member 13 having a stepped end face, and by utilizing this, wiring on the connecting member and each The one-dimensional optical element array can be electrically coupled. This connection is relatively easy because electrical connection can be made at the rear end of each wiring 33.

FIG. 6 is a diagram showing a completely different configuration example of the two-dimensional array type optical element module according to the present invention.

As shown in the figure, this two-dimensional array type optical element module is constructed by arranging a plurality of small boards 14a to 14d arranged perpendicularly to the mounting board 40 adjacently. . Each of the small boards 14a to 14d is provided with a one-dimensional optical element array 20 and wirings 36a to 36d on the surface which becomes the front side when mounted.
Have been implemented respectively. Therefore, each of the small boards 14a-14
The configuration of d is very similar to that of the two-dimensional array type optical element module shown in FIG. However, in this optical element module, the light is emitted at a right angle to the mounting surface of the small boards 14a to 14d, that is, at a right angle to the extending direction of the wirings 36a to 36d on each of the small boards 14a to 14d. A three-dimensional optical element array 20 is mounted.

In this structure, since the wirings 36a to 36d coupled to the small boards 14a to 14d extend directly onto the mounting board 40, the two-dimensional array type optical element module itself can be mounted very easily. It can be mounted on the substrate 40. In addition, the heat generated in each one-dimensional optical element array 20 is
Since the light is evenly propagated to the mounting substrate 40 via each of the small substrates 14a to 14d, it becomes possible to operate each one-dimensional optical element array 20 under an equal temperature condition.

FIG. 7 is a diagram showing still another mode of the two-dimensional array type optical element module according to the present invention.

As shown in the figure, this two-dimensional array type optical element module is also constructed by arranging a plurality of small boards 14a to 14d arranged vertically to the mounting board 40 adjacently. . Also, the stepwise mounting surface for mounting the one-dimensional optical element array is formed by sequentially changing the sizes of the small substrates 15a to 15d, which is also common to the embodiment shown in FIG. . However, in this embodiment, each 1
The dimensional optical element array 20 is loaded on the horizontal end faces of the small substrates 15a to 15d. Further, a heat insulating layer 41 made of a material having a low thermal conductivity is inserted between each of the small substrates 15a to 15d.

With the above-described structure, the heat generated in each one-dimensional optical element array 20 is efficiently propagated to the small substrates 15a to 15d, and each one-dimensional optical element array 20 and the small substrate are also heated.
Since 15a to 15d are not thermally influenced by other adjacent arrays and small substrates, they are surely operated under the same conditions.

FIG. 8 is a diagram showing still another configuration example of the two-dimensional array type optical element module according to the present invention.

As shown in the figure, this two-dimensional array type optical element module includes a metal base 41 having a stepped mounting surface, and an insulating substrate 16 loaded on each horizontal surface of the description 41. , A one-dimensional optical element array 20 mounted on each insulating substrate 16 is mainly configured.

With the above-mentioned structure, since heat can be dissipated very efficiently through the metal base 41, each one-dimensional optical element array 20 can be operated under good temperature conditions. In addition, the one-dimensional optical element array 20 and the insulating substrate 16
Since they can be used in the same shape, the productivity is high. Needless to say, as the insulating substrate 16, for example, a semiconductor substrate having an oxide insulating film formed on its surface may be used. In addition, this metal base 41
Can also be used as a common GND terminal for each one-dimensional optical element array.

[0040]

As described in detail above, the two-dimensional array type optical element module according to the present invention can efficiently dissipate the heat generated in the optical element, the driving circuit, etc. due to its unique shape. . Further, since the thermal conditions for each one-dimensional optical element array are almost equal, it becomes possible to handle multi-channel optical signals evenly.

Further, since it can be manufactured extremely precisely and with high productivity by utilizing the semiconductor processing technology, it can be applied to a multi-channel optical connector or the like.

[Brief description of drawings]

FIG. 1 is a diagram showing a specific configuration example of a two-dimensional array type optical element module according to the present invention.

FIG. 2 is a diagram showing a loaded state of wiring in the two-dimensional array type optical element module shown in FIG.

FIG. 3 is a diagram showing the structure of another configuration example of the two-dimensional array type optical element module according to the present invention.

FIG. 4 is a diagram showing one mode of a two-dimensional array type optical element module having the structure shown in FIG.

5 is a diagram showing another mode of the two-dimensional array type optical element module having the structure shown in FIG.

FIG. 6 is a diagram showing the structure of another configuration example of the two-dimensional array type optical element module according to the present invention.

7 is a diagram showing another mode of the two-dimensional array type optical element module having the structure shown in FIG.

FIG. 8 is a diagram showing still another configuration example of the two-dimensional array type optical element module according to the present invention.

FIG. 9 is a diagram conceptually showing a typical configuration of a general interconnection device using a metal cable.

[Explanation of symbols]

3 ... Board, 4 ... Casing, 5 ... Connector, 6 ... Support member 10 ... Base, 11a-11d, 12, 14a-14d, 15a-15d ... Small board, 13 ... Connection member, 16 ... Insulating substrate, 20 ... One-dimensional optical element array, 30, 31a to 31d, 32, 33, 36a to 36d, 37a to 37d ...
・ Wiring, 35 ・ ・ ・ Bumps, 40 ・ ・ ・ Mounting board, 41 ・ ・ ・ Metal base

Claims (15)

[Claims] 1. A substrate having a stepwise mounting surface in which horizontal planes and vertical planes perpendicular to each other are alternately formed continuously, and an incident optical axis parallel to the horizontal plane of the substrate and perpendicular to the vertical plane. A two-dimensional array type optical element module comprising a one-dimensional optical element array including a plurality of optical elements each having an emission optical axis and mounted on each stage of the substrate. 2. The optical element module according to claim 1, wherein the wiring layer is a wiring layer loaded on the horizontal surface of the base body and a side surface of the base body. Array type optical element module. 3. The optical element module according to claim 1 or 2, wherein the base is an integral member formed by etching a semiconductor single crystal. Element module. 4. The optical element module according to claim 1 or 2, wherein the base has a region for mounting the optical element array near one end, and is connected to the optical element array. It is formed by stacking a plurality of small substrates loaded with the formed wiring layers.
Dimensional array type optical element module. 5. The optical element module according to claim 4, wherein the base body is formed by stacking small substrates parallel to a plane including an emission optical axis or an incident optical axis of the optical element. A two-dimensional array type optical element module characterized by: 6. The optical element module according to claim 5, wherein the bases are sequentially stacked with a shift corresponding to a depth of the optical element array. 7. The optical element module according to claim 5 or 6, wherein the base is such that the rear end surface of a lower small substrate is exposed by a predetermined length behind the base. Each of the small substrates is determined by sequentially stacking small substrates of different lengths, one end of each of the small substrates is connected to the optical element array, and the other end extends to the rear end of the small substrate. A two-dimensional array type optical element module, wherein an extending wiring layer is loaded. 8. The optical element module according to claim 5 or 6, wherein the base is formed by sequentially stacking small substrates having the same length, and each of the small substrates has one end. A first wiring layer connected to the optical element array, the other end of which extends rearward, and one end of which contacts the first wiring layer of an adjacent small substrate, and the other end extends to the rear end of the small substrate. A two-dimensional array type optical element module, comprising a second wiring layer loaded on the back surface of a small substrate with respect to the first wiring layer. 9. The optical element module according to claim 8, wherein the second wiring layer of each small substrate has a shape complementary to the rear end of the base and is exposed to the rear of the base. ,
A two-dimensional array type optical element module, further comprising a connecting member having a wiring for connecting with a mounting substrate on which the base is mounted. 10. The optical element module according to claim 4, wherein the base has a difference in length larger than a height when the optical element array is mounted, and an emission optical axis of the optical element array. Alternatively, the two-dimensional array type optical element module is configured by arranging small substrates adjacent to each other at right angles to the incident optical axis. 11. The optical element module according to claim 10, wherein each of the substrates has one end connected to the optical element array mounted on the respective substrate, and the other end connected to the mounting substrate. A two-dimensional array type optical element module comprising a wiring layer. 12. The optical element module according to claim 10, wherein each of the substrates is provided with a wiring layer on its front surface, one end of the wiring layer is connected to a mounting substrate, and the other end is
A two-dimensional array type optical element module, which is connected to the optical element array loaded on a substrate arranged in front of the substrate. 13. The optical element module according to any one of claims 10 to 12, wherein the substrates constituting the base body are thermally isolated from each other. Two-dimensional array type optical element module. 14. The optical element module according to claim 1 or 2, wherein a horizontal plane parallel to the surface of the mounting substrate and a vertical plane perpendicular to the surface of the mounting substrate are alternately and continuously formed. A two-dimensional array type including a metal base having a stepped mounting surface formed thereon and an optical element array mounted on each horizontal surface of the base via at least one insulating layer. Optical element module. 15. The optical element module according to any one of claims 1 to 14, wherein the optical element array is mounted on a substrate or base formed of Si, and the base or A two-dimensional array type optical element module in which a substrate is connected to a ground potential.