JP3579216B2

JP3579216B2 - Substrate dividing device

Info

Publication number: JP3579216B2
Application number: JP18061697A
Authority: JP
Inventors: 明男野々山
Original assignee: アライドシステム株式会社
Priority date: 1997-06-19
Filing date: 1997-06-19
Publication date: 2004-10-20
Anticipated expiration: 2017-06-19
Also published as: JPH1111967A

Description

【０００１】
【発明の属する技術分野】
本発明はセラミックあるいはガラス等の基板を所定の大きさに分割する基板分割装置に関する。
【０００２】
【従来の技術】
ハイブリッドＩＣ等の回路形成を終えたセラミック基板等をチップに分割する際には、焼成前に金型等によって予め基板Ｍの表面に図７（Ａ）に示すように縦横に形成したｘ，ｙの分割線に沿って所定の大きさに割る。この分割作業は従来人手で行われているが、作業効率が悪い上に、近年の回路実装面積の増大に伴って基板Ｍ周縁の掴み代が減少しているため、分割作業自体が困難になっている。
【０００３】
そこで、例えば特開平５−１２１４０３１号公報には、分割線を形成したセラミック基板の片側を把持する一対のチャックを設けて、一方のチャックを他方のチャックに対して揺動させることにより、セラミック基板を分割線に沿って自動分割する方法が提案されている。
【０００４】
【発明が解決しようとする課題】
上記提案の方法は、セラミック基板の片側を人手に代えてチャックで強力に把持することにより、基板周縁の掴み代の減少に対応するものである。しかし、基板の損傷を防止しつつこれを確実に把持するためには、掴み代をある程度大きく確保することは避けられないとともに、基板を強力に把持する毎に、チャック面に設けた弾性樹脂体に大きな繰り返し応力が生じてその寿命が低下する懸念がある。また、分割線に沿って基板が割れる際に、把持されていない基板分割片の他端側が大きく振れて基板本体や他部材等と干渉し、破損するおそれがあった。
【０００５】
そこで、本発明はこのような課題を解決するもので、基板分割時の掴み代を小さくして基板の回路実装率を向上させることができるとともに、装置寿命が長くかつ基板損傷のおそれもない基板分割装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
上記目的を達成するため、本発明の基板分割装置では、分割線（ｘ，ｙ）を形成した基板（Ｍ）の、分割線（ｘ，ｙ）と交差する両側縁（Ｓ１，Ｓ２）を受け入れて案内する案内溝（１１）をそれぞれ形成して平行に配設された一対の固定側案内部材（１Ａ，１Ｂ）と、案内溝（１１）の延長線上に位置する案内溝（２１）をそれぞれ有するとともに、固定側案内部材（１Ａ，１Ｂ）との間の中間点を中心に上方ないし下方へ揺動可能な一対の可動側案内部材（２Ａ，２Ｂ）と、基板（Ｍ）を固定側案内部材（１Ａ，１Ｂ）から可動側案内部材（２Ａ，２Ｂ）へ送り込んで、その分割線（ｘ，ｙ）が上記中間点を通るように基板（Ｍ）を位置決めする位置決め手段（３，４）と、基板（Ｍ）を位置決めした状態で一方の可動側案内部材（２Ａ）を揺動させる揺動駆動手段（２５，２６）と、一方の可動側案内部材（２Ａ）と他方の可動側案内部材（２Ｂ）の揺動相対変位に応じた揺動力を一方の可動側案内部材（２Ａ）から他方の可動側案内部材（２Ｂ）へ伝達する揺動力伝達手段（６）とを具備している。ここで、駆動力伝達手段は、所定の捩じれおよび曲げ変形を生じる金属バー等で構成することができ、この金属バーで両可動側案内部材を結合する。なお、上記各手段のカッコ内の符号は、後述する実施例記載の具体的手段との対応関係を示すものである。
【０００７】
本発明においては、各一対の固定側案内部材と可動側案内部材の案内溝内に基板の両側縁を受け入れて保持するようにしているから、従来のように基板の片側のみをチャッキングするのに比して、掴み代を小さくしても基板を安定に保持できる。したがって、基板上の回路実装面積を増大させることができるとともに、基板の片側を強力にチャックする必要がないから、チャック面に設けた弾性樹脂体が疲労する等の問題はなく、装置寿命が長い。また、基板の両側縁を案内溝で規制しているから、分割線に沿って割れる際に基板分割片の他端が大きく振れて損傷する等の問題も生じない。そして、揺動力伝達手段により、他方の可動側案内部材へは両可動側案内部材の揺動相対変位に応じた揺動力を一方の可動側案内部材から伝達するようにしているから、基板の「割れ」は常に、一方の可動側案内部材に保持された分割線の一端側から他端側へ向かって進行させられ、この結果、分割線を大きく外れた「割れ」が基板に生じることが防止される。
【０００８】
【発明の実施の形態】
図１には分割装置の正面図を示す。分割装置はフロアＦ上に据えつけられた架台７を有し、架台７上にはその左右位置にガイドレール７１が設けられて、図２に示すように、架台７の長手方向へ一定長で延びている。これらガイドレール７１上にはスライダ７２を介して移動基台７３が設けられており、移動基台７３は架台７上に設けた駆動シリンダ７４のロッド７４１に結合されている。これにより、駆動シリンダ７４のロッド７４１の伸縮に伴って移動基台７３が前後方向（図２の左右方向）の所定位置へ移動させられる。
【０００９】
移動基台７３の左右両端には支持台７５（図１）が立設され、各支持台７５の上半部にはこれを貫通してそれぞれ軸体２２，２３が設けられている。各軸体２２，２３はその軸心回りに回転可能かつ軸方向へ移動可能に支持台７５に支持されている。各軸体２２，２３の先端には揺動板２４が設けられている。左右の揺動板２４は同一形状で、図２に示すように、矩形の本体部２４１と、これより下方へ突出する略台形の連結部２４２とよりなり、本体部２４１の板面には案内溝２１を形成した可動側案内部材２Ａ，２Ｂ（図１）が設けられている。
【００１０】
可動側案内部材２Ａ，２Ｂは軸体２２，２３の軸心から水平方向へ延びる矩形のブロック体で、その端面中央に水平に延びる上記案内溝２１が形成されている。図１において、軸体２２には駆動板２５が設けられている。この駆動板２５は、図３に示すように、上端部が相対回転可能に軸体２２に嵌装されるとともに下端部は二股状になって、その凹所内に、駆動シリンダ２６から突出するロッド２６１先端の駆動ピン２６２が位置している。したがって、図３の退入位置からロッド２６１が進出すると、図の鎖線で示すように駆動板２５が揺動させられる。
【００１１】
駆動板２５の板面中間位置には、揺動力伝達手段としての金属バー６の一端が嵌着固定されており、この金属バー６は、図１に示すように、各軸体２２，２３に設けた揺動板２４の下端部を隙を有して貫通して、軸体２３に設けた従動板２７の下端部に嵌着固定されている。この従動板２７の上端部は相対回転可能に軸体２３に嵌装されている。
【００１２】
図１において、架台７上には、図略の支持体に支持されて、左右位置を平行に延びる固定側案内部材１Ａ，１Ｂが設けられている。固定側案内部材１Ｂは図２に示すように架台７の長手方向へ延び、下側に位置する主案内部材１２と上側に位置する副案内部材１３，１４より構成されている。左右の主案内部材１２上の副案内部材１３は対向方向の外方へ一定量逃げており、左右の主案内部材１２上には、ロボットアーム等によって、基板Ｍがその分割線ｘ（図７参照）と直交する両側縁Ｓ１，Ｓ２にて載置される。主案内部材１２上の前端（図２の右端）に位置する副案内部材１４は主案内部材１２と面一に位置するとともに（図１）主案内部材１２との間に案内溝１１を形成しており、これら案内溝１１内に基板Ｍの上記両側縁Ｓ１，Ｓ２が受け入れられる。なお、上記軸体２２，２３（図１）はその基端が連結板２２１，２３１により駆動シリンダ２８，２９のロッド２８１，２９１先端と結合されており、各ロッド２８１，２９１が図１の進出状態から退入すると、これに伴って各軸体２２，２３が対向方向へ進出して、その先端に設けた各可動側案内部材２Ａ，２Ｂの案内溝２１が左右の固定側案内部材１Ａ，１Ｂの案内溝１１の延長線上に至る。
【００１３】
図２において、架台７上にはさらに、その長手方向へ延びるガイドレール７６が設けられており、このガイドレール７６上にはスライダ７７を介して略Ｕ字形の支持体７８が載置されている。スライダ７７はロッドレスシリンダ７９によりガイドレール７６上を移動させられる。上記支持体７８の前後の立壁間にはスライドシャフト７８１が水平姿勢で架設されており、このスライドシャフト７８１に摺動可能にプッシャ３の基体３１が装着されている。基体３１の前端上面からはＬ字状に屈曲したプッシャ腕３２が突出し、その先端には樹脂ブロックの押圧体３３が固定されて、固定側案内部材１Ｂと同一高さに位置している。なお、基体３１は、これと支持体７８の後壁との間に設けたバネ部材３４により前方（図２の右方）へ付勢されている。また、基体３１の後端上面からは支持体７８の後壁に向けて遮光板３５が延びており、基体３１がスライドシャフト７８１上を一定量後方へ移動すると、遮光板３５の先端が、後壁に設けたホトセンサ（図示略）の光を遮ってセンサ信号が発せられる。
【００１４】
支持台７を介して上記プッシャ３とは反対位置にストッパ４が設けられており、そのストッパ腕４１は上記プッシャ腕３２の方向へ向く同形のＬ字状をなして、その先端に樹脂ブロックの押圧体４２が固定されている。この押圧体４２は可動側案内部材２Ａ，２Ｂや固定側案内部材１Ａ，１Ｂと同一高さに位置している。なお、ストッパ腕４１は図１に示すように、Ｌ字状に屈曲した基体４３の水平部上に支持されて、左右の固定側案内部材１Ａ，１Ｂの中間に位置している。基体４３はその垂直部が図略のボールネジ機構に結合されており、サーボモータによって、前後方向（図２の左右方向）の所定位置へ移動させられる。
【００１５】
このような構造の分割装置において、左右の固定側案内部材１Ａ，１Ｂの主案内部材１２上に基板Ｍの両側縁Ｓ１，Ｓ２を載置した後、軸体２２，２３を対向方向へ進出させて、その先端に設けた各可動側案内部材２Ａ，２Ｂの案内溝２１を、固定側案内部材１Ａ，１Ｂの案内溝１１の延長線上に一致させる。同時に、支持台７５を後退移動（図２の左方）させて、各可動側案内部材２Ａ，２Ｂの後端を固定側案内部材１Ａ，１Ｂの前端に近接させる（図４の状態）。この時、ストッパ４も固定側案内部材１Ａ，１Ｂに向けて後退移動させられて、その押圧体４２が、固定側案内部材１Ａ，１Ｂの前端に対して所定位置に位置決めされる。この状態で、プッシャ３をストッパ４の方向へ前進移動させると、移動過程でその押圧体３３が基板Ｍの後端面に当接し、基板Ｍを、図４に示すように、固定側案内部材１Ａ，１Ｂの案内溝１１を経て、その前端面が押圧体４２に当接するまで可動側案内部材２Ａ，２Ｂの案内溝２１内へ押し込む。
【００１６】
基板Ｍがストッパ４の押圧体４２に当たると、プッシャ３はバネ部材３４のバネ力に抗して後退し、その遮光板３５によりホトセンサの光が遮られてセンサ信号が発せられる。この結果、支持体７８が戻り後退させられる。これにより、基板Ｍが過度な力でストッパ４に押しつけられるのが防止される。ストッパ４によって位置決めされた基板Ｍは、図５に示すように、その分割線ｘが固定側案内部材１Ａ，１Ｂ（一方のみ図示）と可動側案内部材２Ａ，２Ｂの間に来るとともに、分割線ｘの直下の基板Ｍ下面位置がほぼ軸体２３の軸心Ｏに一致する。
【００１７】
上記のように基板Ｍを位置決めした後、ストッパ４を原位置へ後退させ、続いて、駆動シリンダ２６（図３）のロッド２６１を進出させると、駆動板２５および金属バー６を介して左右の揺動片２４およびこれらに設けた可動側案内部材２Ａ，２Ｂが図４の鎖線で示すように軸体２２，２３の軸心Ｏ（図５）回りに下方へ揺動し、これに伴って基板Ｍが分割線ｘに沿って分割される。この時、可動側案内部材２Ｂの揺動力は、介在する金属バー６が捩じれおよび曲げ変形することにより、可動側案内部材２Ａとの揺動相対変位に応じたものとなる。すなわち、可動側案内部材２Ａが揺動を開始してその案内溝２１が基板Ｍの表面に当たり、その揺動力によって基板Ｍの分割線ｘの一端で「割れ」が生じ始めても、可動側案内部材２Ｂには未だ十分な揺動力が生じず、分割線ｘの他端では「割れ」は生じない。可動側案内部材２Ａがさらに揺動し、分割線ｘの一端での「割れ」が他端に向かって伝達し始めると、この時の両可動側案内部材２Ａ，２Ｂの揺動相対変位が大きくなるため、金属バー６を介した可動側案内部材２Ｂの揺動力は大きくなり、この結果、分割線ｘにおける「割れ」は急速に他端に向かって伝達する。このように、基板Ｍの「割れ」が常に分割線ｘの一端から他端へ向かって進行させられる結果、上記「割れ」は確実に分割線ｘ上を進行し、分割線ｘから大きく外れることはない。
【００１８】
基板Ｍを分割すると、駆動シリンダ２６のロッド２６１が後退して可動側案内部材２Ａ，２Ｂは傾斜姿勢から再び水平姿勢に戻るが、この間、分割線ｘで基板Ｍから分離された分割片Ｍ１（図７（Ｂ）参照）は摩擦力で可動側案内部材２Ａ，２Ｂの案内溝２１内に留まり、脱落することはない。可動側案内部材２Ａ，２Ｂが水平姿勢に戻ると、駆動シリンダ７４により支持体７５が後退移動させられ、可動側案内部材２Ａ，２Ｂが固定側連結部材１Ａ，１Ｂから離れる（図２の状態）。この状態で、上記分割片Ｍ１の長辺をロボットアーム等で掴んだ後、駆動シリンダ２８，２９によって各可動側案内部材２Ａ，２Ｂを互いに離間する方向へ後退させると（図１の状態）、分割片Ｍ１の両端縁が案内溝２１から脱し、分割片Ｍ１をロボットアーム等により次工程へ搬送することが可能となる。
【００１９】
なお、本実施形態では、図６に示すように、基板Ｍの側縁Ｓ１，Ｓ２（一方のみ図示）外周と案内溝１１の内周面との間に基板厚さの１／１０程度の隙Ｌを形成してある。このようにした方が、基板Ｍの製造誤差を吸収してプッシャ３による送りをスムーズに行うことができる。
【００２０】
このような分割装置を２台設ければ、図７（Ａ）から（Ｂ）に示すように最初にｘ分割線に沿った分割を行い、続いて方向を変えて図７（Ｃ）から（Ｄ）に示すようにｙ分割線に沿った分割を行うことができる。
【００２１】
なお、上記実施形態では、可動側案内部材２Ａ，２Ｂを軸体２２，２３の軸心を中心に下方へ揺動させたが、分割線が基板Ｍの下面に形成されている場合には、軸心Ｏを基板Ｍの上面に位置させて可動側案内部材２Ａ，２Ｂを上方へ揺動させる。
【００２２】
【発明の効果】
以上のように、本発明の基板分割装置によれば、基板分割時の掴み代を小さくして基板の回路実装率を向上させることができるとともに、装置寿命を長くでき、かつ基板損傷のおそれもない。
【図面の簡単な説明】
【図１】基板分割装置の部分断面正面図である。
【図２】図１のＩＩ−ＩＩ線に沿う、基板分割装置の部分断面側面図である。
【図３】図１のＩＩＩ −ＩＩＩ線に沿う、駆動板設置部の部分断面側面図である。
【図４】固定側案内部材に接近した揺動板の正面図である。
【図５】図４のＡ部拡大断面図である。
【図６】案内溝内に受け入れられた基板側縁の拡大断面図である。
【図７】基板の分割工程を示す平面図である。
【符号の説明】
１Ａ，１Ｂ…固定側案内部材、１１…案内溝、２Ａ，２Ｂ…可動側案内部材、２１…案内溝、２５…揺動板（揺動駆動手段）、２６…駆動シリンダ（揺動駆動手段）、３…プッシャ（位置決め手段）、４…ストッパ（位置決め手段）、６…金属バー（揺動力伝達手段）、Ｍ…基板、側縁…Ｓ１，Ｓ２、ｘ，ｙ…分割線。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate dividing apparatus for dividing a substrate made of ceramic or glass into a predetermined size.
[0002]
[Prior art]
When a ceramic substrate or the like on which a circuit such as a hybrid IC or the like has been formed is divided into chips, x and y are vertically and horizontally formed as shown in FIG. Along a dividing line of a predetermined size. Conventionally, this division work is performed manually, but the work efficiency is poor, and in addition to the recent increase in the circuit mounting area, the margin for grasping the periphery of the substrate M has been reduced, making the division work itself difficult. ing.
[0003]
Therefore, for example, Japanese Patent Application Laid-Open No. 5-1214031 discloses a method in which a pair of chucks for holding one side of a ceramic substrate on which a dividing line is formed are provided, and one of the chucks is swung with respect to the other chuck. Has been proposed to automatically divide a line along a dividing line.
[0004]
[Problems to be solved by the invention]
The above-mentioned proposed method corresponds to a reduction in the margin of the peripheral edge of the ceramic substrate by firmly gripping one side of the ceramic substrate with a chuck instead of manually. However, in order to securely grip the substrate while preventing damage to the substrate, it is inevitable to secure a large allowance for the gripping, and the elastic resin body provided on the chuck surface every time the substrate is strongly gripped. There is a concern that a large repetitive stress is generated in the steel sheet to shorten its life. In addition, when the substrate is split along the division line, the other end of the substrate division piece that is not gripped swings greatly and interferes with the substrate main body or other members, and may be damaged.
[0005]
Accordingly, the present invention is to solve such a problem, and it is possible to improve the circuit mounting ratio of the substrate by reducing the gripping margin at the time of dividing the substrate, and to increase the device life and eliminate the possibility of substrate damage. It is an object to provide a splitting device.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the substrate dividing apparatus of the present invention accepts both side edges (S1, S2) of a substrate (M) on which a dividing line (x, y) is formed, which crosses the dividing line (x, y). A pair of fixed side guide members (1A, 1B) which are formed in parallel with each other to form guide grooves (11) for guiding each other, and a guide groove (21) located on an extension of the guide groove (11), respectively. A pair of movable guide members (2A, 2B) that can swing upward or downward about an intermediate point between the fixed guide members (1A, 1B) and the fixed guide member (1A, 1B); Positioning means (3, 4) for feeding the movable side guide members (2A, 2B) from the members (1A, 1B) and positioning the substrate (M) so that the division line (x, y) passes through the intermediate point. And one movable guide member (2A) with the substrate (M) positioned. Drive means (25, 26) for swinging the first and second movable guides (2A) and (2B). And a swinging power transmission means (6) for transmitting from the member (2A) to the other movable side guide member (2B). Here, the driving force transmitting means can be constituted by a metal bar or the like which causes a predetermined twist and bending deformation, and the two movable side guide members are connected by this metal bar. In addition, the code | symbol in parenthesis of the said each means shows the correspondence with the concrete means of the Example described later.
[0007]
In the present invention, since both side edges of the substrate are received and held in the guide grooves of the pair of fixed-side guide members and movable-side guide members, only one side of the substrate is chucked as in the related art. As compared with the above, the substrate can be stably held even if the gripping margin is reduced. Therefore, the circuit mounting area on the substrate can be increased, and it is not necessary to strongly chuck one side of the substrate. Therefore, there is no problem such as fatigue of the elastic resin body provided on the chuck surface, and the device life is long. . Further, since the both side edges of the substrate are regulated by the guide grooves, there is no problem that the other end of the substrate divided piece is largely shaken and damaged when the substrate is split along the dividing line. The swinging power transmitting means transmits the swinging power corresponding to the swinging relative displacement of the two movable-side guide members to the other movable-side guide member from one of the movable-side guide members. The “crack” is always advanced from one end of the dividing line held by one movable-side guide member toward the other end, and as a result, a “crack” that greatly deviates from the dividing line is prevented from being generated on the substrate. Is done.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows a front view of the dividing device. The dividing device has a gantry 7 mounted on a floor F, and guide rails 71 are provided on the gantry 7 at left and right positions thereof, as shown in FIG. Extending. A moving base 73 is provided on these guide rails 71 via a slider 72, and the moving base 73 is connected to a rod 741 of a drive cylinder 74 provided on the gantry 7. Accordingly, the moving base 73 is moved to a predetermined position in the front-rear direction (the left-right direction in FIG. 2) as the rod 741 of the drive cylinder 74 expands and contracts.
[0009]
Support bases 75 (FIG. 1) are erected on both left and right ends of the movable base 73, and shaft bodies 22 and 23 are provided through the upper half of each support base 75, respectively. Each of the shaft bodies 22 and 23 is supported by a support base 75 so as to be rotatable around its axis and movable in the axial direction. A swing plate 24 is provided at the tip of each of the shaft bodies 22 and 23. The left and right rocking plates 24 have the same shape and, as shown in FIG. 2, include a rectangular main body 241 and a substantially trapezoidal connecting part 242 protruding downward therefrom. Movable guide members 2A and 2B (FIG. 1) having grooves 21 are provided.
[0010]
The movable side guide members 2A, 2B are rectangular block bodies extending in the horizontal direction from the axis of the shaft bodies 22, 23, and the guide grooves 21 extending horizontally are formed in the center of the end surfaces thereof. In FIG. 1, a driving plate 25 is provided on the shaft body 22. As shown in FIG. 3, the drive plate 25 has an upper end fitted to the shaft body 22 so as to be relatively rotatable and a lower end formed into a forked shape, and a rod protruding from the drive cylinder 26 in the recess. The drive pin 262 at the tip of the 261 is located. Therefore, when the rod 261 advances from the retreat position in FIG. 3, the drive plate 25 is swung as indicated by a chain line in the figure.
[0011]
One end of a metal bar 6 as a swinging power transmission means is fitted and fixed at an intermediate position on the plate surface of the drive plate 25, and this metal bar 6 is attached to each of the shafts 22, 23 as shown in FIG. The lower end of the provided swing plate 24 penetrates with a gap, and is fitted and fixed to the lower end of a driven plate 27 provided on the shaft 23. The upper end of the driven plate 27 is fitted to the shaft 23 so as to be relatively rotatable.
[0012]
In FIG. 1, fixed side guide members 1A and 1B are provided on a gantry 7 and supported by a support (not shown) and extend in the left and right positions in parallel. As shown in FIG. 2, the fixed guide member 1B extends in the longitudinal direction of the gantry 7 and includes a lower main guide member 12 and upper sub guide members 13 and 14. The sub guide members 13 on the left and right main guide members 12 have escaped outward by a certain amount in the facing direction. On the left and right main guide members 12, a substrate M is divided by a robot arm or the like into a dividing line x (FIG. 7). ) At both side edges S1 and S2 orthogonal to the side. The sub guide member 14 located at the front end (the right end in FIG. 2) on the main guide member 12 is flush with the main guide member 12 (FIG. 1) and forms a guide groove 11 between the main guide member 12 and the main guide member 12. The side edges S1 and S2 of the substrate M are received in the guide grooves 11. The shafts 22, 23 (FIG. 1) have their base ends connected to the distal ends of the rods 281, 291 of the drive cylinders 28, 29 by connecting plates 221, 231, respectively. When retreating from the state, the respective shaft bodies 22 and 23 advance in the opposite direction with this, and the guide grooves 21 of the movable side guide members 2A and 2B provided at the distal ends thereof move the left and right fixed side guide members 1A and 1A. It reaches the extension of the guide groove 11 of 1B.
[0013]
In FIG. 2, a guide rail 76 extending in the longitudinal direction is further provided on the gantry 7, and a substantially U-shaped support 78 is placed on the guide rail 76 via a slider 77. . The slider 77 is moved on a guide rail 76 by a rodless cylinder 79. A slide shaft 781 is installed in a horizontal posture between the front and rear walls of the support 78, and the base 31 of the pusher 3 is slidably mounted on the slide shaft 781. An L-shaped pusher arm 32 protrudes from the upper surface of the front end of the base 31, and a pressing body 33 of a resin block is fixed to the tip of the pusher arm 32, and is located at the same height as the fixed-side guide member 1B. The base 31 is urged forward (to the right in FIG. 2) by a spring member 34 provided between the base 31 and the rear wall of the support 78. The light-shielding plate 35 extends from the upper surface of the rear end of the base 31 toward the rear wall of the support 78. When the base 31 moves a predetermined amount backward on the slide shaft 781, the front end of the light-shielding plate 35 is moved backward. A sensor signal is emitted by blocking light from a photosensor (not shown) provided on the wall.
[0014]
A stopper 4 is provided at a position opposite to the pusher 3 via a support 7, and the stopper arm 41 has an L-shape of the same shape facing the pusher arm 32. The pressing body 42 is fixed. The pressing body 42 is located at the same height as the movable-side guide members 2A and 2B and the fixed-side guide members 1A and 1B. As shown in FIG. 1, the stopper arm 41 is supported on a horizontal portion of the base 43 bent in an L-shape, and is located in the middle of the left and right fixed guide members 1A and 1B. The vertical portion of the base 43 is connected to a ball screw mechanism (not shown), and is moved to a predetermined position in the front-rear direction (the left-right direction in FIG. 2) by a servomotor.
[0015]
In the dividing device having such a structure, after placing both side edges S1 and S2 of the substrate M on the main guide members 12 of the left and right fixed side guide members 1A and 1B, the shaft bodies 22 and 23 are advanced in the opposite direction. Then, the guide grooves 21 of the movable side guide members 2A, 2B provided at the tips thereof are made to coincide with the extension of the guide grooves 11 of the fixed side guide members 1A, 1B. At the same time, the support base 75 is moved backward (to the left in FIG. 2) so that the rear ends of the movable-side guide members 2A and 2B approach the front ends of the fixed-side guide members 1A and 1B (state in FIG. 4). At this time, the stopper 4 is also moved backward toward the fixed-side guide members 1A and 1B, and the pressing body 42 is positioned at a predetermined position with respect to the front ends of the fixed-side guide members 1A and 1B. When the pusher 3 is moved forward in the direction of the stopper 4 in this state, the pressing body 33 comes into contact with the rear end surface of the substrate M in the moving process, and the substrate M is moved to the fixed guide member 1A as shown in FIG. , 1B, and is pushed into the guide grooves 21 of the movable-side guide members 2A, 2B until the front end surface thereof comes into contact with the pressing body 42.
[0016]
When the substrate M comes into contact with the pressing body 42 of the stopper 4, the pusher 3 retreats against the spring force of the spring member 34, and the light from the photosensor is blocked by the light shielding plate 35, and a sensor signal is generated. As a result, the support 78 is returned and retracted. This prevents the substrate M from being pressed against the stopper 4 by an excessive force. As shown in FIG. 5, the substrate M positioned by the stopper 4 has a dividing line x between the fixed-side guide members 1A and 1B (only one is shown) and the movable-side guide members 2A and 2B. The position of the lower surface of the substrate M immediately below x substantially coincides with the axis O of the shaft body 23.
[0017]
After positioning the substrate M as described above, the stopper 4 is retracted to the original position, and then the rod 261 of the drive cylinder 26 (FIG. 3) is advanced. The swinging pieces 24 and the movable-side guide members 2A and 2B provided on the swinging pieces 24 swing downward around the axis O (FIG. 5) of the shaft bodies 22 and 23 as shown by a chain line in FIG. The substrate M is divided along the division line x. At this time, the swinging power of the movable-side guide member 2B depends on the swing relative displacement with the movable-side guide member 2A due to the intervening metal bar 6 being twisted and bent. That is, even if the movable side guide member 2A starts swinging and its guide groove 21 hits the surface of the substrate M, and the swinging power starts to cause a "crack" at one end of the dividing line x of the substrate M, the movable side guide member Sufficient oscillating power is not yet generated in 2B, and no "crack" occurs at the other end of the dividing line x. When the movable-side guide member 2A further swings and the "crack" at one end of the dividing line x starts to be transmitted toward the other end, the swinging relative displacement of both movable-side guide members 2A and 2B at this time becomes large. Therefore, the swinging power of the movable-side guide member 2B via the metal bar 6 is increased, and as a result, the "crack" at the division line x is rapidly transmitted to the other end. Thus, as a result of the “crack” of the substrate M always progressing from one end to the other end of the division line x, the “crack” reliably proceeds on the division line x and largely deviates from the division line x. There is no.
[0018]
When the substrate M is divided, the rod 261 of the drive cylinder 26 retreats, and the movable guide members 2A and 2B return from the inclined posture to the horizontal posture again. During this time, the divided piece M1 ( FIG. 7 (B) shows that it stays in the guide groove 21 of the movable side guide members 2A and 2B due to frictional force and does not fall off. When the movable side guide members 2A, 2B return to the horizontal position, the support 75 is moved backward by the drive cylinder 74, and the movable side guide members 2A, 2B separate from the fixed side connection members 1A, 1B (the state of FIG. 2). . In this state, if the long side of the divided piece M1 is gripped by a robot arm or the like, and the movable guide members 2A, 2B are retracted by the drive cylinders 28, 29 in a direction away from each other (the state of FIG. 1), Both end edges of the divided piece M1 are removed from the guide grooves 21, and the divided piece M1 can be transported to the next process by a robot arm or the like.
[0019]
In the present embodiment, as shown in FIG. 6, a gap of about 1/10 of the substrate thickness is provided between the outer periphery of the side edges S1 and S2 (only one is shown) of the substrate M and the inner periphery of the guide groove 11. L is formed. By doing so, the manufacturing error of the substrate M can be absorbed and the feeding by the pusher 3 can be performed smoothly.
[0020]
If two such dividing devices are provided, first, as shown in FIGS. 7A and 7B, division is performed along the x division line, and then the direction is changed to change the direction from FIGS. As shown in D), division along the y division line can be performed.
[0021]
In the above-described embodiment, the movable guide members 2A and 2B are pivoted downward about the axes of the shaft members 22 and 23. However, when the dividing line is formed on the lower surface of the substrate M, With the axis O positioned on the upper surface of the substrate M, the movable guide members 2A and 2B are swung upward.
[0022]
【The invention's effect】
As described above, according to the substrate dividing device of the present invention, the gripping margin at the time of dividing the substrate can be reduced to improve the circuit mounting rate of the substrate, and the device life can be prolonged, and there is a possibility that the substrate may be damaged. Absent.
[Brief description of the drawings]
FIG. 1 is a partial sectional front view of a substrate dividing apparatus.
FIG. 2 is a partial cross-sectional side view of the substrate dividing device taken along the line II-II of FIG.
FIG. 3 is a partial cross-sectional side view of a driving plate installation section, taken along line III-III in FIG. 1;
FIG. 4 is a front view of the swing plate approaching a fixed-side guide member.
FIG. 5 is an enlarged sectional view of a portion A in FIG. 4;
FIG. 6 is an enlarged cross-sectional view of a substrate side edge received in a guide groove.
FIG. 7 is a plan view showing a substrate dividing step.
[Explanation of symbols]
1A, 1B: fixed side guide member, 11: guide groove, 2A, 2B: movable side guide member, 21: guide groove, 25: rocking plate (rocking drive means), 26: drive cylinder (rocking drive means) Reference numeral 3 represents a pusher (positioning means), 4 represents a stopper (positioning means), 6 represents a metal bar (oscillating power transmission means), M represents a substrate, and a side edge represents S1, S2, x, y represents a dividing line.

Claims

A pair of fixed-side guide members arranged in parallel by forming guide grooves for receiving and guiding both side edges intersecting with the division line of the substrate on which the division line is formed,
A pair of movable guide members, each having a guide groove positioned on an extension of the guide groove, and capable of swinging upward or downward around an intermediate point between the fixed guide member,
Positioning means for feeding the substrate from the fixed-side guide member to the movable-side guide member, and positioning the substrate so that the dividing line passes through an intermediate point.
Swing drive means for swinging one of the movable side guide members in a state where the substrate is positioned,
Swinging power transmitting means for transmitting a swinging power according to a swinging relative displacement of the one movable side guide member and the other movable side guide member from the one movable side guide member to the other movable side guide member. Substrate dividing device.