JP3566239B2 - Chip spacer and manufacturing method thereof - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a chip spacer and a method for manufacturing the same.
[0002]
[Prior art]
The present applicant has previously proposed a TAB (Tape Automated Bonding) carrier tape that can be suitably used when the carrier tape is wound around a reel (see Japanese Patent Publication No. 8-1916).
The carrier tape for TAB is such that semiconductor chips such as LSIs are arranged at predetermined intervals along a longitudinal direction of a tape-shaped carrier tape body (hereinafter, referred to as “flexible base material”) formed of a flexible material. The inner leads and the outer leads are bonded to test pads provided around individual semiconductor chips.
[0003]
Note that there is a COF (chip-on flexible print circuit) or the like similar in principle (different in shape) to such a TAB carrier tape, and the present application can be applied to this COF and the like. In the present specification, these are hereinafter collectively referred to as a “chip carrier”.
This type of chip carrier is superimposed when wound onto a reel as described above, but if this polymerization is performed directly by the chip carrier alone, the semiconductor chips may come into contact with each other. Therefore, there is a possibility that the semiconductor chip itself may be damaged and the bonding portions such as the test pads, the inner leads, and the outer leads may be damaged.
[0004]
Therefore, in order to avoid such inconveniences, the TAB spacer tape described above is sandwiched between the overlapping portions of the chip carrier to prevent the semiconductor chips from abutting each other.
By the way, this TAB spacer tape has a protrusion for spacer provided integrally with a resin tape main body by injection molding. That is, in this injection molding, holes are previously arranged in rows at both sides in the width direction of the tape main body at regular intervals along the longitudinal direction of the tape main body. By injecting the resin individually, spacer projections are attached to the front and back surfaces of the tape body through the holes.
[0005]
[Problems to be solved by the invention]
In order to perform the injection molding as described above, a hole must be formed in the tape body in advance. This is to secure the fixing force of the spacer projection to the tape body. However, it goes without saying that the drilling process is complicated, and that each injection must be performed while precisely matching the positions of these holes. In some cases, it was necessary to accurately control the amount of resin injected by one injection.
[0006]
Therefore, these have become bottlenecks, and it has been difficult to increase the manufacturing efficiency of the TAB spacer tape.
Not only that, since the manufacturing procedure as described above is a technical background, for example, the pitch for arranging spacer projections on the tape body is different, or spacer projections are provided only on one surface of the tape body. It was difficult to respond flexibly to such situations.
The present invention has been made in view of the above circumstances, and has various chip spacers (which can also be applied to COF and the like) including a TAB spacer tape. It is an object of the present invention to provide a chip spacer and a method of manufacturing the same, which can increase the manufacturing cost and reduce the manufacturing cost, and can flexibly cope with various design changes.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has taken the following measures.
That is, the chip spacer according to the present invention is applicable to TAB, COF, and the like, and causes the above-described chip carriers (ones in which semiconductor chips are held in a predetermined position on a flexible base material) to be superimposed on each other. Sometimes, it is used interposed between the polymerizations.
The chip spacer has a flexible base material and a spacer projection protruding from at least one surface of the base material.
[0008]
The base material corresponds to a tape main body in a conventional TAB spacer tape.
The spacer projection is positioned so as not to interfere with the semiconductor chip of the chip carrier with respect to the base material, and has a projection amount exceeding the semiconductor chip.
In the present invention, the base material and the spacer projection are separately manufactured and then fixed to each other.
[0009]
In this way, if the spacer projections are manufactured separately from the base material and are fixed to each other, there is no need to arrange the holes in the base material. For this reason, the positioning of the spacer projection with respect to the base material is not restricted by the hole position at all, and is arbitrary.
With a chip spacer having such a configuration, for example, it is possible to easily provide a spacer projection on only one surface of the base material, or to make the positioning mismatch between both surfaces of the base material. Become.
[0010]
As is clear from the above description, the method of manufacturing a chip spacer according to the present invention employs a procedure in which a base material and a spacer projection are separately manufactured in advance, and these are fixed to each other.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
3 to 5 show a first embodiment of the chip spacer 1 according to the present invention. 1 and 2 show one step in the method of manufacturing the chip spacer 1.
The chip spacer 1 has a base member 2 and a spacer projection 3 provided on the base member 2.
[0012]
As shown in FIG. 5, the chip spacer 1 of the first embodiment is used when the chip carrier 5 is a TAB carrier tape and the chip carrier 5 is wound and held on a reel 6. It is assumed.
Therefore, as is clear from FIG. 3, the base material 2 is formed in a tape shape like the flexible base material 7 of the chip carrier 5. The spacer projections 3 are provided on both sides in the width direction of the base member 2 and are arranged at regular intervals along the longitudinal direction of the base member 2.
[0013]
Further, the spacer projections 3 protrude on both the front and back surfaces of the base material 2, and the arrangement of the spacer projections 3 on both the front and back surfaces coincides in both the longitudinal direction and the width direction of the chip carrier 5. I have.
The base member 2 and the spacer projections 3 are manufactured through separate and independent manufacturing steps.
Here, the width of the base member 2 is formed to be substantially the same as the width of the chip carrier 5 (see FIG. 5). The base member 2 (at the stage before the spacer projections 3 are provided) does not need to be provided with a hole at a position where the spacer projections 3 are to be provided.
[0014]
The base material 2 is formed of a flexible synthetic resin such as polyethylene terephthalate, polyester imide, and polyimide. Of course, it can also be formed using other resin materials.
On the other hand, the height dimension of each spacer projection 3 is formed so as to exceed the thickness dimension at which the semiconductor chip 8 swells at least on the front and back surfaces of the chip carrier 5. .
The planar size M (see FIG. 4) of the protruding end of the spacer projection 3 along the longitudinal direction of the base material 2 is larger than the mutual interval (gap) L of the spacer projection 3 in the longitudinal direction of the base material 2. (Refer to Japanese Patent Publication No. 8-1916).
[0015]
The shape and the forming material of such a spacer projection 3 and the manufacturing method thereof are not limited at all.
For example, the shape of the spacer projections 3 may be a trapezoidal shape, a triangular shape, a semicircular shape, a square shape, or the like in a side view, and may be a circular shape, a square shape, or the like in a plan view. The spacer projection 3 may have a solid structure or a hollow structure.
In addition, as a method of manufacturing the spacer projections 3, it may be formed into a small sphere by various granulation methods such as injection (including squeezing and dropping) and cutting out from a rod-shaped molded product. Things.
[0016]
As a material for forming the spacer projections 3, a synthetic resin having heat resistance and chemical resistance such as polypropylene, polyacetal, and polyethylene can be used. Of course, it can also be formed using other resin materials.
As a method of fixing the base material 2 and the spacer projection 3 manufactured separately in this way to each other, bonding using an adhesive or an organic solvent, ultrasonic bonding, heat fusion (welding), or the like is performed. Good.
The pitch W between the spacer protrusions 3 in the width direction of the base material 2 (see FIG. 5) is determined by bonding the semiconductor chip 8 provided on the chip carrier 5 to the inner leads and the outer leads around the semiconductor chip 8. The dimensions are held so as to straddle the test pads 10 provided via the portion 9.
[0017]
The chip spacer 1 formed by fixing the base material 2 and the spacer projection 3 to each other is used when the chip carrier 5 (TAB carrier tape) is wound and held on the reel 6 during stacking of the chip carrier 5. The semiconductor chip 8 is used so as to prevent the semiconductor chips 8 from being held in contact with each other.
FIG. 6 shows a second embodiment of the chip spacer 1 according to the present invention.
The difference between the chip spacer 1 of the second embodiment and the first embodiment described above is that a spacer projection 3 is provided on only one surface of the base material 2.
[0018]
As described above, in the manufacturing method of the present invention, since the holes for providing the spacer projections 3 are not formed in the base material 2, the provision of the spacer projections 3 as in the second embodiment is not performed. It is also easy to deal with.
Note that the other configuration, operation, and effect are substantially the same as those of the first embodiment, and a detailed description thereof will be omitted.
FIG. 7 shows a third embodiment of the chip spacer 1 according to the present invention.
In the third embodiment, as in the first embodiment, spacer projections 3 are provided on the front and back surfaces of the base material 2. However, the positioning of the spacer projections 3 between the front and back surfaces of the base material 2 is shifted by a half pitch.
[0019]
Note that the other configuration, operation, and effect are substantially the same as those of the first embodiment, and a detailed description thereof will be omitted.
As is clear from the above description of the first to third embodiments, in the present invention, the base member 2 and the spacer projections 3 are separately manufactured, and then the two are fixed to each other. Since this is a manufacturing method, the positioning of the spacer projections 3 can be arbitrarily changed.
Therefore, in addition to the above embodiments, for example, if the spacer projections 3 are provided only on one side in the width direction of the base material 2 or if the arrangement pitch of the spacer projections 3 is different in the middle of the base material 2 in the longitudinal direction. It is also possible to randomly arrange the spacer projections 3 as a whole.
[0020]
In addition to the above, the present invention can be appropriately modified according to the embodiment.
For example, it is not limited that the base material 2 is formed in a tape shape.
[0021]
【The invention's effect】
As is clear from the above description, in the chip spacer and the method of manufacturing the same according to the present invention, the manufacturing is easy, the manufacturing efficiency is increased, and the manufacturing cost is reduced. Further, it is possible to flexibly cope with various design changes.
[Brief description of the drawings]
FIG. 1 is a side view showing one step in a method for manufacturing a chip spacer according to the present invention.
FIG. 2 is a side view showing a process procedure following FIG. 1;
FIG. 3 is a perspective view showing a first embodiment of a chip spacer according to the present invention.
FIG. 4 is a side view corresponding to FIG.
FIG. 5 is a front sectional view showing a use state of the chip spacer of the first embodiment.
FIG. 6 is a side view showing a second embodiment of the chip spacer according to the present invention.
FIG. 7 is a side view showing a third embodiment of the chip spacer according to the present invention.
[Explanation of symbols]
1 Chip spacer 2 Base material 3 Spacer projection.
5 Chip carrier 7 Flexible base material 8 Semiconductor chip

Claims (4)

A chip spacer used when the chip carriers (5) each having a semiconductor chip (8) held in a predetermined arrangement on a flexible base material are superimposed on each other and interposed between the superposition of the chip carriers (5). hand,
It has a flexible base material (2) and a spacer projection (3) protruding from at least one surface of the base material (2), and the plurality of spacer projections (3) are arranged with respect to the base material (2). The spacer projections (3) have a base plane on the base material (2) side and a protruding end plane on the chip carrier (5) side. The base surface is tapered so that the base plane is large and the head end plane is small, and the spacer projection (3) is gradually tapered from the base plane side to the head end plane side. In a chip spacer arranged so as not to interfere with the semiconductor chip (8) of the chip carrier (5) and having a projection amount exceeding the thickness of the semiconductor chip (8) ,
The base material (2) and the spacer projection (3) are separately manufactured and then fixed to each other , and the base plane side of the tapered spacer projection (3) overlaps with the base material (2). A chip spacer , wherein the spacer projection (3) is fixed to the base material (2) on the side of the superposed base end plane . The chip spacer according to claim 1, wherein the spacer projection (3) is provided only on one surface of the base material (2). The spacer projections (3) are provided on both surfaces of the base material (2), and the spacer projections (3) on both surfaces of the base material (2) are arranged so as to be displaced from each other in the longitudinal direction of the base material (2). chip spacer of claim 1, wherein the are. It is a manufacturing method of the chip spacer of Claim 1, Comprising:
The base material (2) and the tapered spacer projection (3) are separately manufactured in advance, and thereafter, the semiconductor chip (8) of the chip carrier (5) is placed on the base material (2). ) to a position which does not interfere, producing the chips spacer characterized that you polymerized fixed thickness protrusion amount and are allowed while projecting spacers exceeding the (3) in its base plane side of the semiconductor chip (8) Method.

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