JP2003068802A - Chip spacer and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that the manufacturing efficiency of a TAB spacer tape cannot be improved since a hole is previously formed in a tape body and injection is performed by accurately matching it with the positioning of the hole and a spacer projection is formed as injection molding is performed for manufacturing the TAB spacer tape. SOLUTION: The tape body 2 and the spacer projection 3 are separately manufactured, they are mutually fixed and the TAB spacer tape 1 is manufactured. Consequently, it is not necessary to make holes in the tape body 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip spacer and its manufacturing method.

[0002]

2. Description of the Related Art The present applicant has proposed a TAB spacer tape which can be suitably used when a TAB (tape automated mating) carrier tape is wound and held on a reel (Japanese Patent Publication No. 8-1916). (See the official gazette). The TAB carrier tape is a tape-shaped carrier tape body (hereinafter referred to as "flexible base material") formed of a flexible material, in which semiconductor chips such as LSI are arranged at predetermined intervals along the longitudinal direction. An inner lead and an outer lead are bonded to a test pad provided around each semiconductor chip.

Incidentally, there is a COF (chip-on flexible printed circuit) or the like that is similar in principle to the TAB carrier tape (the shape is different).
Since the present application is also applicable to this COF and the like, in the present specification, these are collectively referred to as "chip carrier". This type of chip carrier is put into a superposed state when it is wound around the reel as described above. However, if this superposition is carried out directly by the chip carrier alone, semiconductor chips may come into contact with each other. Therefore, the semiconductor chip itself may be damaged, or the bonding parts such as the test pad, the inner lead, and the outer lead may be damaged.

Therefore, in order to avoid such inconvenience, the above-mentioned TAB spacer tape is sandwiched between the mutual superpositions of the chip carriers to prevent the semiconductor chips from contacting each other. By the way, in this TAB spacer tape, protrusions for spacers are integrally provided on a resin tape body by injection molding. That is, this injection molding is
Holes are provided in advance on both sides of the tape body in the width direction at regular intervals along the longitudinal direction of the tape body, and each of these holes is used as a target to individually inject the resin that will be the material for the spacer protrusions. Then, spacer protrusions are attached and formed on both front and back surfaces of the tape body through the holes.

[0005]

In order to carry out injection molding as described above, it is necessary to form holes in the tape body in advance. This is to secure the fixing force of the spacer projections to the tape body. However, along with this, it goes without saying that the hole-drilling process becomes troublesome, and that it is necessary to carry out injection once at a time exactly in accordance with the positioning of these holes, or even once. There was a case where the amount of resin ejected by one injection had to be accurately controlled.

Therefore, these things become a bottleneck, and T
It has been difficult to improve the manufacturing efficiency of the AB spacer tape. In addition, since the manufacturing procedure as described above is the technical background, for example, the pitch for arranging the spacer protrusions on the tape body is different, or the spacer protrusions are provided only on one surface of the tape body. It was difficult to take a flexible response to such a situation. The present invention has been made in view of the above circumstances, and various chip spacers including TAB spacer tapes (also applicable to COF and the like).
As a result, the manufacturing efficiency can be improved by facilitating the manufacturing, and the manufacturing cost can be reduced.
Further, it is an object of the present invention to provide a chip spacer and a manufacturing method thereof that can flexibly cope with various design changes.

[0007]

In order to achieve the above object, the present invention takes the following means. That is, the chip spacer according to the present invention is applicable to TAB, COF, etc., and the above-described chip carrier (a semiconductor chip held on a flexible base material in a predetermined arrangement) is polymerized with each other. It is sometimes used by interposing it during the polymerization. The chip spacer has a flexible base material and spacer projections protruding from at least one surface of the base material.

The base material corresponds to the tape main body in the conventional TAB spacer tape. The spacer projection is positioned with respect to the base material so as not to interfere with the semiconductor chip of the chip carrier, and has a protrusion amount beyond the semiconductor chip. In the present invention, the base material and the spacer projections are separately manufactured and then fixed to each other.

As described above, if the spacer projections are manufactured separately from the base material and are fixed to each other, it is not necessary to form holes in the base material.
Therefore, the positioning of the spacer projections with respect to the base material is not limited by the position of the hole and is arbitrary. With the chip spacer having such a configuration, for example, it is possible to easily provide the spacer protrusion only on one surface of the base material or to make the positioning mismatch between both surfaces of the base material. Become.

As is apparent from the above description, in the method of manufacturing the chip spacer according to the present invention, the base material and the spacer projection are separately manufactured in advance, and the two are fixed to each other. is there.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 3 to 5 show a first embodiment of the chip spacer 1 according to the present invention. See also FIG.
2A and 2B show one step in the method for manufacturing the chip spacer 1. The chip spacer 1 includes a base material 2 and spacer projections 3 provided on the base material 2.
And have.

As shown in FIG. 5, in the chip spacer 1 of the first embodiment, the chip carrier 5 is a TAB carrier tape, and the chip carrier 5 is wound around a reel 6 and held. It is supposed to be used for. Therefore, as is clear from FIG. 3, the base material 2 is formed in a tape shape like the flexible base material 7 of the chip carrier 5. Further, the spacer protrusions 3 are provided on both sides of the base material 2 in the width direction, and are arranged in rows along the longitudinal direction of the base material 2 at regular intervals.

Further, the spacer protrusions 3 are projected on both front and back surfaces of the base material 2, and the spacer protrusions 3 are arranged on both front and back surfaces in the longitudinal direction and the width direction of the chip carrier 5. Has become. The base material 2 and the spacer protrusions 3 are manufactured through separate and independent manufacturing processes. Here, the width dimension of the base material 2 is formed to be substantially the same as the width dimension of the chip carrier 5 (FIG. 5).
reference). The base material 2 (which is in a stage before the spacer protrusion 3 is provided) does not need to be provided with a hole at a position where the spacer protrusion 3 is to be provided.

The base material 2 is formed of a flexible synthetic resin such as polyethylene terephthalate, polyester imide or polyimide. Of course,
It can also be formed using other resin materials. On the other hand, the height of each of the spacer projections 3 is formed so as to exceed at least the thickness of the semiconductor chip 8 bulging on the front and back surfaces of the chip carrier 5. . In addition, the protrusion end plane size M (see FIG. 4) of the spacer projections 3 along the longitudinal direction of the base material 2 is larger than the mutual interval (gap) L of the spacer projections 3 in the longitudinal direction of the base material 2. It may be formed as described above (see Japanese Patent Publication No. 8-1916).

The shape and forming material of the spacer protrusions 3 and the manufacturing method thereof are not limited in any way. For example, the shape of the spacer protrusions 3 may be trapezoidal, triangular, semicircular, angular, or the like in a side view, and may be circular or angular in a plan view.
The spacer protrusion 3 may have a solid structure or a hollow structure. As a method of manufacturing the spacer protrusions 3, small particles may be formed by various granulation methods such as injection (including squeezing and dropping) and cutting out from a rod-shaped molded product. It is a thing.

A synthetic resin having heat resistance and chemical resistance such as polypropylene, polyacetal, polyethylene or the like can be used as a material for forming the spacer protrusions 3. Of course, it can also be formed using other resin materials. As a method of fixing the base material 2 and the spacer protrusions 3 separately manufactured in this way to each other, adhesion using an adhesive or an organic solvent, ultrasonic bonding, heat fusion (welding), etc. may be performed. Good. The mutual pitch W (see FIG. 5) of the spacer protrusions 3 with respect to the width direction of the base material 2 is determined by the semiconductor chip 8 provided on the chip carrier 5 and the bonding of the inner lead and the outer lead around the semiconductor chip 8. Test pad 1 provided via the section 9
The size is held across the 0 group.

The chip spacer 1 formed by fixing the base material 2 and the spacer projection 3 to each other is a chip carrier 5.
When the (TAB carrier tape) is wound and held on the reel 6, the TAB carrier tape is used by being sandwiched between the superposed chip carrier bodies 5 to prevent the semiconductor chips 8 from contacting each other. FIG. 6 shows a second embodiment of the chip spacer 1 according to the present invention. The chip spacer 1 of the second embodiment is different from that of the first embodiment described above in that the spacer projection 3 is provided only on one surface of the base material 2.

As described above, according to the manufacturing method of the present invention, the holes for forming the spacer protrusions 3 are not formed in the base material 2. Therefore, the spacer protrusions of the second embodiment are not formed. It is also possible to easily provide the method of providing 3. Since the other configurations, functions and effects are substantially the same as those of the first embodiment, detailed description thereof is omitted here. FIG. 7 shows a third embodiment of the chip spacer 1 according to the present invention. In the third embodiment, similarly to the case of the first embodiment, the spacer projections 3 are provided on both front and back surfaces of the base material 2. However,
The positioning of the spacer protrusions 3 between the front and back surfaces of the base material 2 is shifted by a half pitch.

The other constructions and effects are as follows.
Since it is substantially the same as the embodiment, detailed description thereof will be omitted. As is apparent from the above description of the first to third embodiments, in the present invention, the base member 2 and the spacer protrusion 3 are separately manufactured, and then the two members are fixed to each other. Since this is a manufacturing method, the positioning of the spacer protrusions 3 can be arbitrarily changed.
Therefore, in addition to the above-described respective embodiments, for example, the spacer projections 3 may be provided only on one side in the width direction of the base material 2, or the arrangement pitch of the spacer projections 3 may be different in the longitudinal direction of the base material 2. It is also possible to make the spacer projections 3 randomly arranged as a whole.

In addition to the above, the present invention can be appropriately modified according to the embodiment. For example, the base material 2 is not limited to be formed in a tape shape.

[0021]

As is apparent from the above description, the chip spacer and the method for manufacturing the same according to the present invention are easy to manufacture, the manufacturing efficiency is improved, and the manufacturing cost is reduced. Moreover, it is possible to flexibly deal with various design changes.

[Brief description of drawings]

FIG. 1 is a side view showing one step in a method for manufacturing a chip spacer according to the present invention.

FIG. 2 is a side view showing a process procedure following FIG.

FIG. 3 is a perspective view showing a first embodiment of a chip spacer according to the present invention.

FIG. 4 is a side view corresponding to FIG.

FIG. 5 is a front sectional view showing a usage state of the chip spacer according to the first embodiment.

FIG. 6 is a side view showing a second embodiment of the chip spacer according to the present invention.

FIG. 7 is a side view showing a third embodiment of the chip spacer according to the present invention.

[Explanation of symbols]

1 chip spacer 2 base materials 3 Spacer protrusion. 5 chip carrier 7 Flexible base material 8 semiconductor chips

Claims (4)

[Claims] 1. A chip carrier (5) comprising a semiconductor substrate (8) held on a flexible substrate (7) in a predetermined arrangement.
A chip spacer to be used by interposing between the chip carriers (5) when they are polymerized with each other, the flexible base member (2) and at least one surface of the base member (2) protruding. And the spacer projections (3) formed so that the spacer projections (3) do not interfere with the semiconductor chip (8) of the chip carrier (5) with respect to the base material (2). A chip spacer characterized in that the protrusion amount exceeds the wall thickness of (8), and the base material (2) and the spacer protrusion (3) are separately manufactured and then fixed to each other. . 2. The chip spacer according to claim 1, wherein the spacer protrusion (3) is provided only on one surface of the base material (2). 3. The chip spacer according to claim 1, wherein the spacer projections (3) are not aligned in position on both sides of the base material (2). 4. A chip carrier (5) comprising a semiconductor substrate (8) held on a flexible substrate (7) in a predetermined arrangement.
A method for producing a chip spacer used by interposing between the chip carriers (5) when they are mutually polymerized, comprising a flexible base material (2) and the base material (2). And a spacer projection (3) to be projected on at least one surface of the chip are prepared in advance, and then the semiconductor chip (8) of the chip carrier (5) and the base material (2) are prepared. Is a method of manufacturing a chip spacer, characterized in that the spacer protrusion (3) is fixed to a position where it does not interfere with the protrusion amount exceeding the wall thickness of the semiconductor chip (8).