JP2010152662A - Rfid tag, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel RFID tag having high reliability of environmental resistance, and capable of reducing influence of disturbance on a built-in component of the RFID tag such as an IC chip, and to provide a method of manufacturing the same. <P>SOLUTION: This RFIC tag includes a tag inlet constituted of an antenna and the IC chip, the first resin cover formed in one main face side of the tag inlet, a plurality of protrusions forming an annular pattern surrounding the tag inlet or a protrusion forming a spiral pattern surrounding the tag inlet, formed on a face opposed to the tag inlet of the first resin cover, in an outside of the tag inlet, and the second resin cover formed on the other main face side of the tag inlet, and the plurality of protrusions or the protrusion is joined with an outer circumferential edge part formed on a face opposed to the tag inlet of the second resin cover, in the outside of the tag inlet. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an RFID tag that requires environmental resistance and a method for manufacturing the RFID tag, and in particular, accommodates a tag inlet (substrate) composed of an antenna and an IC chip, and places the tag inlet between resin covers. The present invention relates to an RFID tag having a sealed structure capable of protecting a housed component from disturbances such as high temperature and high humidity and salt damage environment during use, and a method for manufacturing the RFID tag.

  An RFID tag including an IC chip performs wireless communication with an RFID reader / writer. RFID tags include a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from a reader / writer and drives it as a power source. The active tag has a battery compared to the passive type, so it has advantages in terms of communication distance and communication stability, but has a complicated structure and disadvantages such as an increase in size and cost. There is also. Passive tags are being used in a wide range of fields by extending communication distance and improving communication stability.

  In the electromagnetic induction method applied to the RFID tag of the long wave band and the short wave band, a voltage is induced in the RFID tag due to the electromagnetic induction action between the transmission antenna coil of the reader / writer and the antenna coil of the RFID tag. The IC chip is activated by voltage to enable communication. Therefore, since the RFID tag operates only in the induction electromagnetic field by the RFID reader / writer, the communication distance is about several tens of centimeters. In addition, in radio frequency RFID tags such as UHF band and microwave band, the radio wave system is applied and power is supplied to the IC chip of the RFID tag by radio waves, so the communication distance is about 1 to 8 m. It has improved significantly. As described above, the RFID tag can be used in a wide variety of applications by appropriately selecting a communication method according to the scene and application to be used, and the usage environment is also wide. For this reason, there are increasing cases where the RFID tag needs to have environmental resistance.

  Conventionally, as an RFID tag manufacturing method that incorporates electronic components such as antennas and IC chips and transmits information in a non-contact manner, it is composed of an antenna and an IC chip using injection molding in which a resin is injected into a mold. There is known a method in which a resin cover is formed on the top and bottom of a tag inlet (substrate) and the tag inlet is molded (see, for example, Patent Documents 1 and 2). In addition, in a method for manufacturing an RFID tag in which a tag inlet using a mold is molded, an uneven part is formed on a mold in order to arrange electronic components such as an antenna and an IC chip (for example, Patent Documents 3 and 4). See also).

  In addition to the method of sealing the tag inlet with a resin mold, as an RFID tag manufacturing method, resin covers are arranged on the front and back surfaces of a tag inlet (substrate) composed of an antenna and an IC chip, respectively. The tag inlet (substrate) is a smooth outer peripheral edge of the resin cover, that is, outside the tag inlet (substrate), the portion where the resin covers are in direct contact with each other as a welding allowance, and that portion is ultrasonically welded. There is also a known method (see, for example, Patent Document 5).

  Also, in the RFID tag manufacturing method by ultrasonic welding, one surface of the outer peripheral edge, which is a portion where the resin covers are in direct contact with each other, is smoothed and the other surface is made convex so that the convexity of the resin cover is obtained. Concentrate ultrasonic waves on the shaped part to ensure ultrasonic welding, and after ultrasonic welding, the contact part of the outer peripheral edge, which is the part where the resin covers are in direct contact with each other (for example, patents) (Refer to Document 6), or by forming one surface of the outer peripheral edge, which is a portion where the resin covers are in direct contact, with a concave shape and the other surface with a convex shape (mountain shape), The ultrasonic wave is concentrated on the part of the mold) to ensure ultrasonic welding, and after the ultrasonic welding, a part of the contact portion of the outer peripheral edge part where the resin covers are in direct contact with each other becomes uneven. The thing is also known (for example, refer patent document 7).

  Some ultrasonic weldings connect a microchip substrate having a groove and a microchip substrate having a protrusion. Specifically, the width of the groove portion becomes the maximum width on the outermost surface of the microchip substrate, and gradually becomes narrower in the depth direction of the groove (valley type). The width of the protruding portion in the width direction of the groove portion is gradually narrowed in the height direction of the protruding portion (mountain shape). Further, the depth of the groove and the height of the protrusion are substantially equal. In addition, there exists a groove part and a projection part used for position alignment of a board | substrate when joining microchip board | substrates (for example, refer patent document 8).

JP-A-8-276458 (FIGS. 1 to 4) Japanese Patent Laying-Open No. 2005-332116 (FIGS. 1 and 3) Japanese Patent Laid-Open No. 2003-36431 (FIGS. 1 and 2) Japanese Unexamined Patent Publication No. 2007-133617 (FIGS. 1 to 6) JP 2003-67696 A (FIGS. 1 to 5) JP 2003-89154 A (FIGS. 1 to 11) Japanese Patent Laid-Open No. 7-206002 (FIGS. 2 to 5) JP 2008-224431 A (FIG. 2, paragraph numbers 0036 to 0052)

  However, in the above-described technology, the IC chip of the RFID tag, the resin film on which the IC chip is mounted, or the bonding surface of the resin layer that seals the substrate is configured only by smoothness, or the bonding surface is smooth. Because the portion occupies the majority, the resin layers are bonded together by heat fixation or ultrasonic welding, but sufficient sealability is secured for use in high-temperature, high-humidity, salt damage areas, etc. In addition, there is a problem that it is difficult to withstand external forces such as vibration because a crack-like shape may be formed on the joint surface.

  The present invention has been made to solve the above-described problems, and reduces the influence of disturbance on the built-in components of an RFID tag such as an IC chip, and is highly reliable with respect to environmental resistance. An object is to provide an RFID tag and a manufacturing method thereof.

  An RFID tag according to a first aspect of the present invention includes a tag inlet including an antenna and an IC chip, a first resin cover formed on one main surface side of the tag inlet, and an outside of the tag inlet. A plurality of convex portions forming an annular pattern surrounding the tag inlet or a spiral pattern surrounding the tag inlet, formed on a surface of the first resin cover facing the tag inlet, A second resin cover formed on the other main surface side of the tag inlet, and an outer surface formed outside the tag inlet and facing the tag inlet of the second resin cover. A peripheral portion and the plurality of convex portions or the convex portions are joined.

  An RFID tag according to a second aspect of the invention includes a tag inlet including an antenna and an IC chip, a first resin cover formed on one main surface side of the tag inlet, and an outside of the tag inlet. A plurality of convex portions formed in a surface facing the tag inlet of the first resin cover, forming an annular pattern surrounding the tag inlet, and a second main surface formed on the other main surface side of the tag inlet. A plurality of convex portions formed on a surface of the second resin cover that is outside the tag inlet and facing the tag inlet, forming an annular pattern surrounding the tag inlet. And a plurality of concave portions joined to each other.

  An RFID tag according to a third aspect of the invention includes a tag inlet composed of an antenna and an IC chip, a first resin cover formed on one main surface side of the tag inlet, and an outside of the tag inlet. A convex portion formed on a surface of the first resin cover facing the tag inlet, forming a spiral pattern surrounding the tag inlet, and a second surface formed on the other main surface side of the tag inlet. A resin cover and an outer surface of the tag inlet, formed on a surface facing the tag inlet of the second resin cover, forming a spiral pattern surrounding the tag inlet, and fitted with the convex portion And having a bonded concave portion.

  The RFID tag according to a fourth aspect of the present invention is the RFID tag according to any one of the first to third aspects, wherein the plurality of convex portions or the convex portions are mountain-shaped.

  An RFID tag according to a fifth aspect of the present invention is the RFID tag according to any one of the first to fourth aspects, wherein the first resin cover and the second resin cover are joined by ultrasonic welding or injection molding. is there.

  According to a sixth aspect of the present invention, there is provided an RFID tag manufacturing method in which a tag inlet composed of an antenna and an IC chip is sealed between resin covers. A first resin cover forming step of forming a first resin cover having a plurality of convex portions forming an annular pattern or a convex portion forming a spiral pattern on the outer peripheral edge portion, and the outer peripheral edge portion by injection molding. A second resin cover forming step of forming a second resin cover, and the tag inlet is disposed between the first resin cover and the second resin cover, and the annular periphery is disposed on the outer peripheral edge. A plurality of convex portions or outer peripheral edge portions forming a pattern are brought into contact with a convex portion forming a spiral pattern and an outer peripheral edge portion of the second resin cover, and the first resin cover and the second resin cover, The super sound It is characterized in that it comprises an ultrasonic welding step of joining by welding.

  According to a seventh aspect of the present invention, there is provided an RFID tag manufacturing method in which a tag inlet including an antenna and an IC chip is sealed between resin covers. A first resin cover forming step of forming a first resin cover having a plurality of convex portions forming an annular pattern or a convex portion forming a spiral pattern on the outer peripheral edge portion, and an outer peripheral edge portion by injection molding A second resin cover forming step of forming a second resin cover having a plurality of concave portions forming an annular pattern or a concave portion forming a spiral pattern at an outer peripheral edge; and the first resin cover and the second resin cover The tag inlet is disposed between the resin cover, and a plurality of convex portions forming the annular pattern on the outer peripheral edge portion and a plurality of concave portions forming the annular pattern on the outer peripheral edge portion, or the front A joining step of bringing the first resin cover and the second resin cover into contact with each other by bringing a convex portion forming a spiral pattern in the outer peripheral edge portion into contact with a concave portion forming a spiral pattern in the outer peripheral edge portion; It is characterized by comprising.

  An RFID tag manufacturing method according to an invention of claim 8 is the RFID tag manufacturing method according to claim 7, wherein the joining step joins the first resin cover and the second resin cover by ultrasonic welding.

  The RFID tag manufacturing method according to the invention of claim 9 is the method according to claim 7, wherein the first resin cover forming step or the second resin cover forming step is performed simultaneously with the joining step.

  An RFID tag manufacturing method according to a tenth aspect of the present invention is the RFID tag manufacturing method in which a tag inlet including an antenna and an IC chip is sealed between resin covers. A first mold resin injection step of injecting a resin into a first mold having a plurality of concave shapes or a concave shape having a spiral pattern on the outer peripheral edge, and the first mold resin injection step A first resin cover forming and taking out a first resin cover having a plurality of convex portions forming an annular pattern on the outer peripheral edge portion or a convex portion forming a spiral pattern on the outer peripheral edge portion from the first mold later. And a second mold resin injecting step of injecting a resin into a second mold having a plurality of convex shapes forming an annular pattern on the outer peripheral edge portion or a convex shape forming a spiral pattern on the outer peripheral edge portion; This second mold resin A second resin cover forming and taking out a second resin cover having a plurality of concave portions forming an annular pattern on the outer peripheral edge portion or a concave pattern forming a spiral pattern on the outer peripheral edge portion from the second mold after the inserting step A plurality of protrusions forming an annular pattern on the outer peripheral edge and an annular pattern on the outer peripheral edge, wherein the tag inlet is disposed between the first resin cover and the second resin cover; Or a plurality of concave portions forming a spiral pattern in the outer peripheral edge portion and a concave portion forming a spiral pattern in the outer peripheral edge portion, and the first resin cover and the first And an ultrasonic welding process for joining the two resin covers by ultrasonic welding.

  An RFID tag manufacturing method according to an invention of claim 11 is an RFID tag manufacturing method in which a tag inlet composed of an antenna and an IC chip is sealed between resin covers. A first mold resin injection step of injecting a resin into a first mold having a plurality of concave shapes or a concave shape having a spiral pattern on the outer peripheral edge, and the first mold resin injection step A first resin cover forming and taking out a first resin cover having a plurality of convex portions forming an annular pattern on the outer peripheral edge portion or a convex portion forming a spiral pattern on the outer peripheral edge portion from the first mold later. A tag inlet in which the tag inlet is disposed on an inner side of an outer peripheral edge portion of the first resin cover and on a surface side of the first resin cover on which the plurality of convex portions or the convex portions are formed. An arrangement step, a first resin cover arrangement step in which a surface opposite to the surface on which the plurality of convex portions or the convex portions are formed in the first resin cover is brought into contact with a third mold, and this After the first resin cover arranging step and the tag inlet arranging step, a third mold resin injecting and joining step for injecting resin into the third die is provided. .

  The RFID tag manufacturing method according to a twelfth aspect of the present invention is the method according to any one of the sixth to eleventh aspects, wherein the plurality of convex portions or the convex portions in the first resin cover are mountain-shaped. .

  An RFID tag manufacturing method according to a thirteenth aspect of the present invention is the RFID tag manufacturing method in which a tag inlet including an antenna and an IC chip is sealed between resin covers. A second mold resin injecting step for injecting a resin into a second mold having a plurality of convex shapes or a convex shape having a spiral pattern on the outer peripheral edge, and the second mold resin injecting step. A second resin cover forming and taking out step of taking out a second resin cover having a plurality of concave portions that form an annular pattern on the outer peripheral edge portion or a concave portion that forms a spiral pattern on the outer peripheral edge portion from the second mold later; A tag inlet disposed inside the outer peripheral edge of the second resin cover, wherein the tag inlet is disposed on the surface of the second resin cover on which the plurality of recesses or the recesses are formed. An arrangement step, a second resin cover arrangement step in which a surface opposite to the surface on which the plurality of recesses or the recesses are formed in the second resin cover is brought into contact with a third mold, and the second After the resin cover arranging step and the tag inlet arranging step, a third mold resin injecting and joining step for injecting resin into the third die is provided.

  According to a fourteenth aspect of the present invention, there is provided the RFID tag manufacturing method according to the thirteenth aspect, wherein the plurality of recesses or the recesses in the second resin cover are valley-shaped.

  As described above, according to the inventions according to claims 1 to 5, a plurality of convex portions forming an annular pattern or a convex portion forming a spiral pattern is formed outside the tag inlet of the first resin cover. Since it is formed and joined to the second resin cover, the first resin cover and the second resin cover are firmly joined, and an RFID tag having high reliability with respect to environmental resistance is provided. Obtainable.

  According to the invention which concerns on Claims 6-12, the convex part which comprises the some convex part which comprises a cyclic | annular pattern, or the spiral pattern in the welding margin (margin) of joining to the outer periphery part of the 1st resin cover. Since it is formed and joined to the outer peripheral edge of the second resin cover, it is possible to obtain an RFID tag manufacturing method capable of firmly joining the first resin cover and the second resin cover.

  According to the invention which concerns on Claim 13 and 14, the recessed part which comprises the some recessed part which comprises a cyclic | annular pattern, or the spiral pattern is formed in the welding margin of the outer periphery part of the 2nd resin cover. Since it is joined to the outer peripheral edge of the first resin cover, it is possible to obtain an RFID tag manufacturing method capable of firmly joining the first resin cover and the second resin cover.

  In the present embodiment, it is referred to as a tag inlet (generally also called a tag inlay) composed of an antenna and an IC chip, and a final molded product in which the tag inlet is sealed is an RFID tag (generally, IC tag, wireless IC tag, ID tag, wireless ID tag, wireless tag, information carrier, etc.). In addition, when the already sealed tag inlet is sealed again by the RFID tag manufacturing method according to the present invention, the state before sealing again is not the RFID tag but the tag inlet.

Embodiment 1 (Description of structure and configuration of RFID tag)
Embodiment 1 of the present invention will be described below with reference to FIGS. FIG. 1 is a configuration diagram of a first resin cover for sealing the RFID tag according to Embodiment 1, FIG. 1 (a) is a top view of the first resin cover, and FIG. 1 (b) is FIG. ) Is a cross-sectional view of the first resin cover taken along one-dot chain line AA, FIG. 1C is a cross-sectional view of the first resin cover taken along one-dot chain line A′-A ′ in FIG. FIG. 2A is a top view of the first resin cover for sealing the RFID tag according to the first embodiment, FIG. 2B is a one-dot chain line in FIG. 2A is a cross-sectional view of the first resin cover taken along the line AA, FIG. 2C is a cross-sectional view of the first resin cover taken along the alternate long and short dash line A′-A ′ of FIG. It is an outer peripheral part enlarged view of the 1st resin cover which seals the RFID tag which concerns, and is an enlarged view of the part enclosed by the dotted line B of FIG.1 (b) or FIG.2 (b). 4 is a cross-sectional view of the RFID tag according to Embodiment 1, FIG. 5 is a flowchart showing a method of manufacturing the RFID tag according to the present invention, FIG. 5 (a) is an injection molding flowchart, and FIG. 5 (b) is ultrasonic welding. 6 is an explanatory diagram of the RFID tag manufacturing method according to the first embodiment, FIG. 6E is an enlarged view of a portion surrounded by a dotted line C in FIG. 6D, and FIG. FIG. 7A is a top view of the second resin cover, and FIG. 7B is an alternate long and short dash line A- in FIG. 7A. FIG. 7C is a cross-sectional view of the first resin cover taken along the alternate long and short dash line A′-A ′ of FIG. 7A.

  1 to 7, reference numeral 1 denotes a tag inlet composed of an antenna and an IC chip. The antenna used for the tag inlet 1 is used in an antenna coil used in the HF band, UHF band, and microwave band. A dipole antenna, a patch antenna, or the like can be considered, and a composite antenna of them may be used. The tag inlet 1 may be a resin film or dielectric substrate mounted with an antenna and an IC chip, or a resin film or dielectric substrate already mounted with an antenna and an IC chip may be sealed. Furthermore, it goes without saying that the tag inlet 1 may be mounted with circuits and elements other than the antenna and the IC chip. 2 is a first resin cover (FIG. 4) formed on one main surface (front surface) side of the tag inlet 1, and 3 is a recess for placing the tag inlet formed on the first resin cover 2. The depression of the depression 3 is determined by the dimension of the tag inlet 1. Reference numeral 4 denotes an outside of the tag inlet 1 (FIG. 4), which is a convex portion formed in a surface facing the tag inlet 1 of the first resin cover 2 and forming an annular pattern surrounding the tag inlet 1, In Embodiments 1 to 3, description will be made using a mountain shape.

  1-7, 5 is the 2nd resin cover (FIG. 4) formed in the other main surface (back surface) side of the tag inlet 2, 6 is the tag inlet 1 formed in the 2nd resin cover 5. In FIG. It is a hollow part to be placed, and the hollow of the hollow part 6 is determined by the dimension of the tag inlet 1. 7 is the outside of the tag inlet 1 (FIG. 4), is formed on the surface of the second resin cover 5 facing the tag inlet 1, forms an annular pattern surrounding the tag inlet 1, and is fitted with the convex portion 4. In the first to third embodiments, description will be made using a valley type. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  In the RFID tag shown in FIG. 4, the tag inlet 1 is sealed or accommodated in a space formed by the recess 3 and the recess 6, but the first resin cover 2 and the second resin cover 2 In the state before the resin cover 5 is joined, the space formed by the recessed portion 3 and the recessed portion 6 does not need to be dimensioned so as to seal or close the tag inlet 1, and the tag inlet It is sufficient that the dimensions are such that 1 can be placed. Moreover, when either one of the hollow part 3 and the hollow part 6 is a flat surface without being hollow, for example, when the hollow part 6 is flat, if the tag inlet 1 is stored in the hollow part 3 Good. When it is necessary to fix the tag inlet 1 to the dent 3 or the dent 6, it may be performed with an adhesive or a double-sided tape as long as it does not significantly affect the electrical characteristics. When the structure such as the depression 3 that supports the tag inlet 1 is not formed on the first resin cover 2, it is necessary to select and apply as appropriate, but only a few points are fixed for the purpose of fixing the position. Therefore, for example, by forming a resin-made pin for supporting or fixing the tag inlet 1 on the first resin cover 2 or by making the first resin cover 2 and the second resin cover 5 face each other, It is conceivable that the resin pins formed on both support or fix the tag inlet 1.

  Furthermore, in the case where the first resin cover 2 and the second resin cover 5 are joined by ultrasonic welding using an ultrasonic welding jig, which will be described in detail in the second embodiment, the recess 6 is flat. In this case, if most of the tag inlet 1 is accommodated in the recess 3, the outer peripheral edge 10 and the outer peripheral edge around the jig contact of the ultrasonic welding jig (where ultrasonic welding is actually performed). 10 is melted and the first resin cover 2 and the second resin cover 5 are joined together at the outer peripheral edge (the outer peripheral edge 10 and the outer peripheral edge 11). A recess 6 is formed in the bottom.

  1 to 7, reference numeral 8 denotes an outer portion of the tag inlet 1, which is a convex portion formed on a surface of the first resin cover 2 facing the tag inlet 1 and forming a spiral pattern surrounding the tag inlet 1. In the first to third embodiments, a mountain-shaped configuration will be used. 9 is the outside of the tag inlet 1, formed on the surface of the second resin cover 5 facing the tag inlet 1, forming a spiral pattern surrounding the tag inlet 1, and fitted with the convex portion 8, In the first to third embodiments, description will be made using a valley-shaped concave portion. 10 is an outer peripheral edge portion of the first resin cover 2 on which a plurality of annular patterns or spiral patterns are formed, and 11 is a second edge on which a plurality of annular patterns or spiral patterns are formed. The outer peripheral edge portion of the resin cover 5 (however, the second resin cover 5 on which a spiral pattern is formed, the outer peripheral edge portion 11 and the concave portion 9 are not shown for simplification of description). Among them, the same reference numerals indicate the same or corresponding parts, and detailed descriptions thereof are omitted.

  1 to 7, reference numeral 12 denotes a third mold that imitates the final molded product of the RFID tag according to the present invention inside (inside the cavity), and clamps the lower mold 12a and the upper mold 12b. The inlet 12c is formed in the upper mold 12b. However, the inlet 12c may be formed in the lower mold 12a, or grooves are formed in both the lower mold 12a and the upper mold 12b. However, the inlet 12c may be formed by clamping. Reference numeral 13 denotes a molten resin that is injected from the injection port 12c into the third mold 12 (inside the cavity). In addition, you may use the molten resin 13 as resin inject | poured into a 1st metal mold | die and a 2nd metal mold | die. Although the first mold and the second mold are not shown, the shape (inside (inside the cavity)) is similar to the outer shape of the first resin cover 2 in the first mold. Needless to say, the second mold is similar to the outer shape of the second resin cover 5. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  The RFID tag described in FIG. 4 is manufactured by the RFID tag manufacturing method according to the present invention. The first resin cover 2 and the second resin cover 5 constituting the RFID tag are used to ensure the sealing property of the tag inlet 1 and the adhesion between the first resin cover 2 and the second resin cover 5. The first resin cover 2 is preferably manufactured by injection molding of the outer peripheral edge portion 10 having the convex portions 4 or the convex portions 8 and portions other than the outer peripheral edge portion 10 at the same time. Similarly, it is desirable that the second resin cover 5 is also manufactured by injection molding of the outer peripheral edge portion 11 having the concave portion 7 or the concave portion 9 and a portion other than the outer peripheral edge portion 11 simultaneously.

  In addition, the thickness of the hollow portion 3 that is a storage portion on which the tag inlet 1 of the first resin cover 2 that is a primary molded product is placed has a thickness and structure that satisfies the electrical characteristics of the RFID tag. The outer peripheral edge 11 may be the same or different. Further, as shown in FIG. 3, as the convex portion 4 (mountain shape), for example, an equilateral triangular convex portion (mountain shape) having an angle of 30 ° with respect to the first resin cover 2 is formed on the outer peripheral edge portion. However, the present invention is not limited to this, and the angle can be changed for the purpose of softening the convex portion (mountain shape) or improving the efficiency of melting. When the convex part 4 (mountain shape) and the convex part 8 (mountain shape) described above are viewed from the vertical upper surface of the first resin cover 2, a plurality of annular patterns are formed on the outer peripheral edge without interruption. A plurality of spiral patterns are formed around the circumference. 1 and 2 show a shape without interruption. Whether there is no interruption will be described later. The annular pattern and the spiral pattern are formed in several rows so that the mountain shape is a series of mountain shapes when the cover is viewed from the side. The RFID tag according to the present invention is an RFID tag that is a final molded product, in which the tag inlet 1 is sealed with a first resin cover 2 (second resin cover 5) that is a primary molded product. Hereinafter, the structure and configuration of the RFID tag according to the present invention will be described with reference to FIGS.

  The first resin cover 2 shown in FIG. 1 has a recess 3 at the center, and an outer peripheral edge 10 around the recess 3. Three convex portions 4, which are annular patterns surrounding the periphery of the recess 3, are formed in order from the vicinity of the recess 3 of the outer peripheral edge 10 toward the outside. Ideally, as shown in FIG. 1 (a), it is better that there is no interruption, that is, the convex portion 4 that is an annular pattern is not interrupted, but there may be an interruption, that is, the annular pattern is There may be parts that are partially interrupted. However, even in this case, when the first resin cover 2 is viewed from the cross-section as shown in FIGS. There is a possibility that the sealing property and adhesion when bonded to the resin cover 5 and the sealing property of the tag inlet 1 are impaired.

  The first resin cover 2 shown in FIG. 2 has a recess 3 at the center, and an outer peripheral edge 10 around the recess 3. The convex part 8 which is a spiral pattern surrounding the periphery of the hollow part 3 is formed three times counterclockwise in order from the vicinity of the hollow part 3 of the outer peripheral edge part 10 toward the outside. Ideally, as shown in FIG. 2 (a), the convex portion 8 that is a spiral pattern should not be interrupted in the middle, but may be interrupted. There may be a part where the spiral pattern is partially interrupted. However, even in this case, when the first resin cover 2 is viewed from the cross section as shown in FIGS. Similarly to the first resin cover 2, a second resin cover described later (a “second resin cover having a concave portion 9 that is a spiral pattern” that is a pair of the first resin cover 2 described in FIG. 2). Is omitted)) and the sealing property of the tag inlet 1 may be impaired. In addition, unlike the circular pattern, the spiral pattern has an end portion (starting point and end point of the winding) instead of the annular shape, and the convex portion 8 that is the spiral pattern is interrupted at the end portion. become.

  The second resin cover 5 illustrated in FIG. 7 is paired with the first resin cover 2 illustrated in FIG. 1, and a recess portion 6 is formed at the center, and an outer peripheral edge around the recess portion 6. Part 11 is formed. Three recesses 7, which are annular patterns surrounding the periphery of the recess 6, are formed in order from the vicinity of the recess 6 of the outer peripheral edge 11 toward the outside. Ideally, as shown in FIG. 7A, it is preferable that the concave portion 7 that is an annular pattern is not interrupted, but there may be a portion where the annular pattern is partially interrupted. However, even in this case, when the second resin cover 5 is seen from the cross section as shown in FIGS. 7B and 7C, if there are portions where the three recesses 7 are all flat, the first resin cover 2 There is a possibility that the sealing property and the adhesiveness when bonded together and the sealing property of the tag inlet 1 are impaired.

  The plurality of convex portions 4 forming the annular pattern formed on the first resin cover 2 are described in this specification using three (three rows when viewed from the cross section), If it is two or more, an effect is acquired. Similarly, in the present specification, the convex portions 8 having a spiral pattern formed on the first resin cover 2 are described using three rounds (three rows when viewed from the cross section). The effect is obtained if it is greater than or equal to the lap. Further, in the present specification and drawings, the convex portions 4 and 7 are described using a mountain shape, and the concave portions 7 and 9 are described using a valley shape. Since a plurality of rows of mountains exist, a valley is formed between the mountains, but the convex portions 4 and 7 are referred to as mountain shapes for convenience. Similarly, since there are a plurality of rows of valleys in the recesses 7 and 9, there is a mountain between the valleys. However, for convenience, the recesses 7 and 9 are referred to as valleys. Further, it is not necessary to flatten the surfaces constituting the convex portions 4 and 7 and the concave portions 7 and 9.

  As shown in FIG. 5, an RFID tag having a structure in which a tag inlet composed of an antenna and an IC chip according to the present invention is sealed between resin covers has two types of “injection molding” and “ultrasonic welding”. It is conceivable to manufacture by various methods. The ultrasonic welding is a bonding method in which a resin is melted and bonded by ultrasonic vibration and pressure, and the first resin cover 2 and the second resin cover are fitted to each other by ultrasonic vibration. The internal heat of the resin rises due to the friction between the contact surfaces and the compression of the resin itself constituting the first resin cover 2 and the second resin cover, and the temperature rises. Further, the resin softens due to the ultrasonic pressure, It is melted and welded. An RFID tag manufacturing method by “injection molding” in the first embodiment and an RFID tag manufacturing method by “ultrasonic welding” in the second embodiment will be described.

  The basic steps necessary for manufacturing the RFID tag according to the present invention are as follows. First, in the first resin cover forming step, a first resin having a plurality of convex portions 4 forming an annular pattern on the outer peripheral edge portion 10 or a convex portion 8 forming a spiral pattern on the outer peripheral edge portion by injection molding. Form a cover. Similarly, in the second resin cover forming step, a second resin cover having a plurality of concave portions forming an annular pattern on the outer peripheral edge portion or a concave portion forming a spiral pattern on the outer peripheral edge portion is formed by injection molding. In the joining step, the tag inlet 1 is disposed between the first resin cover 2 and the second resin cover 5, and the plurality of convex portions 4 and the outer peripheral edge portion 11 form an annular pattern on the outer peripheral edge portion 10. A plurality of concave portions 7 having an annular pattern, or a convex portion 7 having a spiral pattern on the outer peripheral edge portion 10 and a concave portion 9 having a spiral pattern on the outer peripheral edge portion 11 are brought into contact with each other. The resin cover and the second resin cover are joined together. Here, regarding the RFID tag manufacturing method, it has been described that it is possible to manufacture by two types of methods of “injection molding” and “ultrasonic welding”. Refers to a process.

  That is, the injection molding used in the first resin cover forming process and the second resin cover forming process for manufacturing the first resin cover 2 and the second resin cover 5 and the injection molding used in the joining process. Refers to different injection molding. However, as will be described in detail later, when injection molding is used in the joining process, an RFID tag is formed by injecting resin into the first resin cover 2 or the second resin cover 5 on which the tag inlet 1 is placed. Since it is completed, it can be said that the second resin cover forming step or the first resin cover forming step is performed at the same time as the joining step, but not another injection molding. Of course, when ultrasonic welding is used in the joining process, the first resin cover 2 and the second resin cover 5 are manufactured by the first resin cover forming process and the second resin cover forming process. Since it joins, it can be said that it is another injection molding as mentioned above.

Embodiment 1 (Injection molding)
The manufacturing method described in FIG. 5A is an injection molding flowchart in which the joining step is executed by injection molding in the RFID tag manufacturing method according to the present invention. A description of the flowchart and a more detailed description than the flowchart will be given below. In FIG. 5A, the first resin cover 2 is molded as a primary molded product to form an RFID tag as a final molded product (as a result, the second resin cover 5 is formed simultaneously with the molding of the RFID tag. Forming (integrated injection molding)). Although not shown, the second resin cover 5 is molded as a primary molded product to form an RFID tag as a final molded product (as a result, the first resin cover 2 is formed simultaneously with the molding of the RFID tag). (Integrated injection molding)) may be performed. In this case, in the following process description, the process in parentheses corresponds to it. Further, in FIG. 5A, “first mold fabrication” → “first mold fabrication”, “first resin cover fabrication” → “second resin cover fabrication”, “second mold fabrication” Replacement of the process of “integral injection molding (joining) of resin cover” → “integrated injection molding (joining) of first resin cover” is established.

1,
A first mold manufacturing step for manufacturing a first mold having a plurality of concave shapes forming an annular pattern on the outer peripheral edge portion or a concave shape forming a spiral pattern on the outer peripheral edge portion (an annular shape is formed on the outer peripheral edge portion). A second mold manufacturing step of manufacturing a second mold having a plurality of convex shapes forming a pattern or a convex shape forming a spiral pattern on the outer peripheral edge portion).

2,
First mold resin injection step of injecting molten resin 13 into the first mold (second mold resin injection step of injecting molten resin 13 into the second mold).

3,
1st resin which has the convex part 8 which forms the some convex part 4 which comprises a cyclic | annular pattern from the 1st metal mold | die to the outer peripheral part 10 after the 1st metal mold | die injection | pouring process, or the outer peripheral part. A first resin cover forming and removing step for removing the cover 2 (after the second mold resin injecting step, a plurality of recesses 7 forming an annular pattern from the second mold to the outer peripheral edge portion 11 or a spiral shape in the outer peripheral edge portion 11 (2nd resin cover formation taking-out process which takes out the 2nd resin cover 5 which has the recessed part 9 which comprises this pattern).

4,
Tag inlet arrangement in which the tag inlet 1 is arranged on the inner side of the outer peripheral edge portion 10 of the first resin cover 2 and on the side of the first resin cover 2 on which the plurality of convex portions 4 or the convex portions 8 are formed. Step (Tag inlet arrangement in which the tag inlet 1 is arranged on the inner side of the outer peripheral edge portion 11 of the second resin cover 5 and on the side of the second resin cover 5 where the plurality of recesses 7 or recesses 9 are formed. Process).

5,
A third mold manufacturing process for manufacturing a third mold 12 simulating the outer shape of the RFID tag (FIG. 4), which is the final molded product.

6,
The 1st resin cover arrangement | positioning process which makes the surface opposite to the surface in which the several convex part 4 or the convex part 8 in the 1st resin cover 2 was formed contact the 3rd metal mold | die 12 (lower metal mold | die 12a). (Second resin cover placement step in which the opposite surface of the second resin cover 5 with respect to the surface on which the plurality of recesses 7 or recesses 9 are formed is brought into contact with the third mold 12 (lower mold 12a)). .

7,
A third mold resin injecting and joining step for injecting molten resin 13 into the third mold 12 after the first resin cover arranging step (second resin cover arranging step) and the tag inlet arranging step.

  Although the injection molding is composed of the above seven main processes, which of the first resin cover 2 having the convex portions 4 and 8 and the second resin cover 5 having the concave portions 7 and 9 is manufactured first? As a result, the process and order are slightly changed. Next, further details will be described with reference to FIG. In addition, although the manufacturing method at the time of using the 1st resin cover 2 which has the convex part 4 is demonstrated, when the 1st resin cover 2 which has the convex part 4 is used, the 2nd resin cover which has the recessed part 7 Needless to say, when the second resin cover 2 having the concave portion 9 is used, the same can be done when the second resin cover 2 is used.

  The first resin cover 2 taken out from the first mold in the first resin cover formation taking-out step is placed in the lower mold 12a of the third mold 12 in advance, and the tag inlet 1 is placed in the first resin. Place in the recess 3 of the cover, or place the tag inlet 1 in the recess 3 of the first resin cover, and place the first resin cover 2 in the lower mold 12a of the third mold 12. (FIG. 6A). After the upper mold 12b is overlaid on the lower mold 12a and clamped, and the third mold 12 is closed, the molten resin 13 is injected into the formed cavity through the injection port 12c (FIG. 6B). (C)). After the molten resin 13 is solidified, the mold clamping between the lower mold 12a and the upper mold 12b is released, and the RFID tag shown in FIG. 6 (d) is taken out. At this time, if a protrusion due to the molten resin 13 (solidification) remaining in the injection port 12c is on the surface of the RFID tag, the protrusion is removed.

  Here, if the hollow part 3 is formed so as to support its position in accordance with the structure of the tag inlet 1 to be placed, it does not move when the molten resin 13 is injected. Even if the first resin cover 2 is provided with a structure for supporting the tag inlet 1, as long as it does not significantly affect the electrical characteristics such as an adhesive or double-sided tape having better heat resistance than the resin softening temperature. Can be used. In addition, when the structure that supports the tag inlet 1 is not formed on the first resin cover 2, it is necessary to select and apply it appropriately, but only a few points are fixed for the purpose of fixing the position. Therefore, as long as the heat resistance temperature is satisfied with respect to the molding temperature, it can be generally used. For example, as described above, by forming a resin pin for supporting or fixing the tag inlet 1 on the first resin cover 2 or by making the first resin cover 2 and the second resin cover 5 face each other, It is conceivable that the resin pins formed on both support or fix the tag inlet 1.

  FIG. 6E is a conceptual diagram at the time of welding the convex portion (mountain shape) 4 in the outer peripheral edge portion 10. At the time of injection molding, the inside of the third mold 12 flows evenly into the convex portion (mountain shape) of the first resin cover 2 by the injected resin pressure, ensuring adhesion and improving the sealing performance. Further, since this chevron is thinner than other parts of the first resin cover 2, it is easy to melt, and this property promotes mixing with the molten resin 13 during molding of the second resin cover 5, thereby providing adhesion and sealing properties. It contributes to the improvement.

  As an injection molding material (molten resin 13) for the first resin cover 2 and the second resin cover 5 as described above, an olefin resin ER140 (Nippon Yushi), which is a thermoplastic resin having excellent mechanical and electrical characteristics. Or a cycloolefin-based resin ZEONEX RS420 (manufactured by Nippon Zeon Co., Ltd.). In addition, by changing the plate thickness of the first resin cover 2 and the second resin cover 5 according to the required electrical performance, other thermoplastic resins such as PET resin, ABS resin and LCP resin can also be applied. .

  Since the normal injection molding time is generally as short as 20 to 30 seconds, when the second resin cover 5 is manufactured by injection molding, the tag inlet 1 placed on the first resin cover 2 is an RFID tag. Since the structure is simpler than that of the first, the material of the tag inlet 1 is appropriately selected, and the surface on which the electronic circuit (IC chip or the like) on which the electronic components of the tag inlet 1 are mounted is formed on the first resin cover 2. By making it contact, possibility that the molten resin 13 will not be directly heated and destroyed by heat can be significantly reduced. In addition, the polyimide resin excellent in general heat resistance is mentioned to a suitable thing as tag inlet 1 material. In addition, other materials can be applied as long as they satisfy the mechanical and electrical characteristics.

Embodiment 2 (ultrasonic welding)
FIG. 8 is an explanatory diagram of the RFID tag manufacturing method according to the second embodiment, FIG. 8 (e) is an enlarged view of a portion surrounded by a dotted line C in FIG. 8 (d), and in FIG. It is a welding jig. The major difference from the RFID tag manufacturing method according to the first embodiment is the joining process, and the configuration of the RFID tag as the final molded product is the first and second embodiments except for the differences caused by the joining process. Both are common. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. The manufacturing method described in FIG. 5B is an ultrasonic welding flowchart in which the joining step is executed by ultrasonic welding in the RFID tag manufacturing method according to the present invention. A description of the flowchart and a more detailed description than the flowchart will be given below.

1,
An ultrasonic welding jig manufacturing process for manufacturing an ultrasonic welding jig for ultrasonic welding of the first resin cover 2 and the second resin cover 5.

2,
1st metal mold | die manufacturing process which manufactures the 1st metal mold | die which has the some concave shape which comprises a cyclic | annular pattern in an outer peripheral part, or the concave shape which forms a spiral pattern in an outer peripheral part.

3,
A first mold resin injection step of injecting molten resin 13 into the first mold;

4,
A first mold having a plurality of convex portions 4 forming an annular pattern from the first mold to the outer peripheral edge portion 10 or a convex portion 8 forming a spiral pattern on the outer peripheral edge portion 11 after the first mold resin injecting step. A first resin cover forming / extracting step for extracting the resin cover 2.

5,
A second mold manufacturing step of manufacturing a second mold having a plurality of convex shapes forming an annular pattern on the outer peripheral edge or a convex shape forming a spiral pattern on the outer peripheral edge.

6,
A second mold resin injection step of injecting molten resin 13 into the second mold;

7,
A second resin cover having a plurality of recesses 7 forming an annular pattern from the second mold to the outer peripheral edge 11 or a recess 9 forming a spiral pattern at the outer peripheral edge 11 after the second mold resin injection step 2nd resin cover formation taking-out process which takes out 5;

8,
The tag inlet 1 is arranged between the first resin cover 2 and the second resin cover 5, and a plurality of convex portions 4 forming an annular pattern on the outer peripheral edge portion 10 and an annular pattern on the outer peripheral edge portion 11 are formed. A plurality of concave portions 7 or a convex portion 8 forming a spiral pattern on the outer peripheral edge portion 10 and a concave portion 9 forming a spiral pattern on the outer peripheral edge portion 11 are brought into contact with each other, and the first resin cover 2 and the above-mentioned Ultrasonic welding process for joining the second resin cover 5 by ultrasonic welding (joining process)

  Ultrasonic welding is composed of the above eight main steps, but depending on whether the first resin cover 2 having a convex portion or the second resin cover 2 having a concave portion is manufactured first, The order is changed. Next, further details will be described with reference to FIGS. In addition, although the manufacturing method at the time of using the case where the 1st resin cover 2 which has the convex part 4 and the 2nd resin cover 2 which has the recessed part 7 is used is demonstrated, 1st resin which has the convex part 8 It goes without saying that the same can be done when the second resin cover 2 having the cover 2 and the recess 9 is used.

  As shown in FIG. 1, the first resin cover 2 that is a primary molded product and the second resin cover 5 that is a primary molded product as shown in FIG. 7 have a dent 3 and a dent for placing the tag inlet 1. The outer peripheral edge 10 and the outer peripheral edge 11 used for joining with the part 6 are molded. The indented portion 3 is formed to have a thickness and a structure that satisfy electric characteristics, and may be the same as or different from that of the outer peripheral edge portion 10. Further, a convex portion 4 (mountain shape) is formed on the outer peripheral edge portion 10 at the time of molding the first resin cover 2 in order to ensure adhesion and sealing performance. The recess 6 is formed so as to have a thickness and a structure that satisfy electric characteristics, and may be the same as or different from that of the outer peripheral edge 11. Further, a concave portion 7 (valley type) 3 is formed in the outer peripheral edge portion 11 at the time of molding the second resin cover 5 in order to ensure adhesion and sealing performance. As such a convex part 4 (mountain shape), for example, as shown in FIG. 3, a regular triangular convex part 4 (mountain shape) having an angle of 30 ° from the perpendicular to the resin cover 2 can be considered. Without limitation, the angle can be changed for the purpose of improving the efficiency of welding.

  As shown in FIG. 8, the tag inlet 1 is placed in the depressions 3 and 6, and the resin-molded first resin cover 2 and second resin cover 5 are placed on the ultrasonic welding jig 5 (FIG. 8). 8 (a)-(c)). Or the 1st resin cover 2 and the 2nd resin cover 5 which were resin-molded are installed in the ultrasonic welding jig | tool 5, and the tag inlet 1 is mounted in the hollow parts 3 and 6. FIG. Thereafter, the ultrasonic welding jig 14 is closed. After the ultrasonic welding jig 14 is closed (FIG. 5C), the first resin cover 2 and the second resin cover 5 are welded by ultrasonic waves. After the ultrasonic welding is completed, the RFID tag is taken out from the ultrasonic welding jig 14 (FIG. 5D).

Since the recessed parts 3 and 6 are shape | molded according to the structure and shape of the tag inlet 1 to mount, they do not move in the case of welding. Even when the first resin cover 2 is provided with a structure for supporting the tag inlet 1, the first resin cover 2 can be used as long as it does not significantly affect electrical characteristics such as an adhesive or a double-sided tape. In addition, when the structure that supports the tag inlet 1 is not formed on the first resin cover 2, it is necessary to select and apply it appropriately, but only a few points are fixed for the purpose of fixing the position. Therefore, it can be generally used. The convex portion 4 of the first resin cover 2 and the concave portion of the second resin cover 5 are also adjusted when installed on the jig so as to mesh with each other when fixed to the ultrasonic welding jig 14.

  FIG. 8E is a conceptual diagram at the time of welding the convex portion 4 (mountain shape) in the outer peripheral edge portion. By ultrasonic welding, the convex part 4 (mountain shape) of the first resin cover 2 and the concave part 7 (valley type) of the second resin cover 5 contribute to fusion bonding by friction, ensuring adhesion and improving sealing performance. Let In addition, “projecting portions 4 (mountain shapes) into the first resin cover 2 and recesses 7 (valley shapes) into the second resin cover 5, which are used as fitting surfaces or contact surfaces” and “ By forming the concave portion 7 (valley shape) as a groove in which the convex portion 4 (mountain shape) melts and diffuses, it becomes possible to manufacture an excellent RFID tag that promotes improvement in adhesion and sealing performance.

  As an injection molding material for the first resin cover 2 and the second resin cover 5, an olefin resin ER140 (manufactured by NOF Corporation), which is a thermoplastic resin having excellent mechanical and electrical characteristics, Or cycloolefin type resin ZEONEX RS420 (made by Nippon Zeon Co., Ltd.) is mentioned. In addition, by changing the plate thickness of the first resin cover 2 and the second resin cover 5 in accordance with the required electrical performance, other thermoplastic resins such as PET resin, ABS resin and LCP resin may be applied. it can.

  Since the normal ultrasonic welding time is generally very short, 1 second or less, the tag inlet 1 placed inside (indentations 3 and 6) at the time of welding is compared with the RFID tag of the final molded product. Since the structure is simple, the possibility of destruction can be significantly reduced by appropriately selecting the material of the tag inlet 1. Moreover, since the shape which mounts the tag inlet 1 is formed in the 1st resin cover 2, it does not become a structure with a 2nd resin cover 5 and a large contact pressure. In the first place, since the focus of the ultrasonic wave is focused on the joining target part in the ultrasonic welding, when securing the internal space for mounting the tag inlet 1 and fixing only the outer peripheral part as in the present invention, The probability that the inlet 1 will be damaged is extremely low. In addition, a general polyimide resin is mentioned as a suitable material for the tag inlet 1. In addition, other tag inlet 1 materials can be applied as long as they satisfy the mechanical and electrical characteristics.

  Moreover, if the convex part 4 (mountain shape) is formed in the outer peripheral part 10 of the 1st resin cover 2, the recessed part 7 (valley type) will not be formed in the outer peripheral part 11 of the 2nd resin cover 5. May be. This is because when two resins are joined by ultrasonic welding, a convex portion 4 (mountain shape) is formed on one surface, and a groove (valley-shaped concave portion) for receiving it is not formed on the other surface. This is because the two resins are joined by melting the convex portion 4 (mountain shape). For this reason, even when a mountain-shaped convex portion and a valley-shaped concave portion are formed, the coincidence / mismatch of both numbers does not matter. Furthermore, when the two resin to be joined are formed with a convex portion and a concave portion having a valley shape on the joint surface, the angles do not have to be the same. If one of the resin (resin cover) is provided with a valley-shaped recess for melting during welding, is the volume of the recess the same as the volume of the other protrusion (mountain)? It is desirable to make it lower.

  In the above case, ultrasonic welding is composed of the following three main processes. 1. First resin for forming a first resin cover 2 having a plurality of convex portions 4 forming an annular pattern on the outer peripheral edge portion 10 or a convex portion 8 forming a spiral pattern on the outer peripheral edge portion by injection molding. Cover formation process. 2. A second resin cover forming step of forming the second resin cover 5 having the outer peripheral edge portion 11 by injection molding. 3. The tag inlet 1 is arranged between the first resin cover 2 and the second resin cover 5, and a plurality of convex portions 4 forming an annular pattern on the outer peripheral edge 10 or a spiral pattern on the outer peripheral edge. An ultrasonic welding process (joining process) in which the convex part 8 forming the outer periphery and the outer peripheral edge part 11 of the second resin cover 5 are brought into contact with each other and the first resin cover 2 and the second resin cover 5 are joined by ultrasonic welding. ). In addition, if the process which produces a metal mold | die is added, ultrasonic welding will be comprised from the following eight main processes.

1,
An ultrasonic welding jig manufacturing process for manufacturing an ultrasonic welding jig for ultrasonic welding of the first resin cover 2 and the second resin cover 5.

2,
1st metal mold | die manufacturing process which manufactures the 1st metal mold | die which has the some concave shape which comprises a cyclic | annular pattern in an outer peripheral part, or the concave shape which forms a spiral pattern in an outer peripheral part.

3,
A first mold resin injection step of injecting molten resin 13 into the first mold;

4,
1st resin which has the convex part 8 which forms the some convex part 4 which comprises a cyclic | annular pattern from the 1st metal mold | die to the outer peripheral part 10 after the 1st metal mold | die injection | pouring process, or the outer peripheral part. A first resin cover forming and removing step of removing the cover 2;

5,
A second mold manufacturing process for manufacturing a second mold having an outer peripheral edge.

6,
A second mold resin injection step of injecting molten resin 13 into the second mold;

7,
A second resin cover forming and taking out step of taking out the second resin cover 5 having the outer peripheral edge portion 11 from the second die after the second mold resin injecting step.

8,
The tag inlet 1 is disposed between the first resin cover 2 and the second resin cover 5, and a plurality of convex portions and the outer peripheral edge portion 11 forming an annular pattern on the outer peripheral edge portion 10, or the outer peripheral edge. The ultrasonic welding process (joining process) which makes the convex part and outer peripheral part 11 which comprise a spiral pattern contact the part 10, and joins the 1st resin cover 2 and the 2nd resin cover 5 by ultrasonic welding. .

  In this way, several rows are formed so that the peaks are a series of peaks when the covers 2 and 5 are viewed from the side (in this specification, three rows are adopted). A portion where the first resin cover 2 and the second resin cover 5 are in contact with each other only between the flat surface and the flat surface so as to protect the tag inlet 1 does not exist in the mountain shape (valley shape). Due to the presence of the convex portion (mountain shape) or concave portion (valley type) of the outer peripheral edge portion of the first resin cover 2 and the second resin cover 5 and the structure of the recess portion 3 and the recess portion 6 that are the storage portions of the tag inlet. The engagement is ensured only in one form, and no deviation occurs.

Embodiment 3
In the first and second embodiments, the basic configuration of the RFID tag according to the present invention and the configuration of the ID tag have been described. In the third embodiment, the features of the RFID tag according to the first and second embodiments are described. An application example that made use of it will be described. This will be described with reference to FIG. FIG. 9 is a configuration diagram of a first resin cover for sealing the RFID tag according to the third embodiment. In FIG. 9, 15 to 17 are the first resin sheets, and 18 is the first resin sheet 15. The formed RFID tag fixing or locking hole portion 19 is an RFID tag fixing or locking hole portion formed in the first resin sheet 16. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. In addition, as for the RFID tag that is the final molded product and the second resin sheet that is the primary molded product in the same manner as the first resin sheets 15 to 17, and further, the first resin sheet that has a spiral convex portion, Since it is only necessary to use the manufacturing method described in Embodiments 1 and 2 so as to correspond to the first resin sheets 15 to 17, illustration is omitted.

  In the RFID tag according to the first and second embodiments, the sealing property of the tag inlet 1 and the adhesion with the first resin cover 2 and the second resin cover 5 are obtained by the annular pattern of the plurality of recesses 4. The degree of freedom in the shape and configuration of the annular pattern of the plurality of recesses 4 is also increased. That is, since the tag inlet 1 is sealed to the outer side of the tag inlet 1 from the annular pattern of the plurality of recesses 4 in the RFID tag according to the first and second embodiments, a free processing and shape can be selected. become.

  The RFID tag shown in FIG. 9 (a) has a first resin sheet 15 with respect to the tag inlet 1 rather than the annular pattern of the plurality of recesses 4, as compared with the RFID tag according to the first and second embodiments. Has two holes 18 for fixing or locking in the extended part, and can be easily fixed and locked to articles or living bodies that are easily controlled with bolts or pins. Yes. Of course, like the RFID tag shown in FIG. 9B, only one hole 19 may be formed in the RFID tag. Further, as in the RFID tag shown in FIG. 19C, the first resin sheet 17 is simply extended outward from the annular pattern of the plurality of recesses 4 with respect to the tag inlet 1 to be managed. The tag inlet 1 having an antenna pattern or IC chip may be kept away from the article or living body.

It is a 1st resin cover block diagram for sealing the RFID tag which concerns on Embodiment 1 of this invention. It is a 1st resin cover block diagram for sealing the RFID tag which concerns on Embodiment 1 of this invention. It is an outer peripheral part enlarged view of the 1st resin cover which seals the RFID tag which concerns on Embodiment 1 of this invention. It is sectional drawing of the RFID tag which concerns on Embodiment 1 of this invention. It is a flowchart which shows the manufacturing method of the RFID tag which concerns on this invention. It is explanatory drawing of the manufacturing method of the RFID tag which concerns on Embodiment 1 of this invention. It is a 1st resin cover block diagram for sealing the RFID tag which concerns on Embodiment 1 and 2 of this invention. It is explanatory drawing of the manufacturing method of the RFID tag which concerns on Embodiment 2 of this invention. It is a 1st resin cover block diagram for sealing the RFID tag which concerns on Embodiment 3 of this invention.

Explanation of symbols

1 .. Tag inlet, 2.. 1st resin cover 3..
5 .. Second resin cover, 6 .. Recessed portion, 7 .. Recessed portion, 8 .. Recessed portion, 9 .. Recessed portion,
10..Outer peripheral edge part, 11 .... Outer peripheral edge part, 12..Third mold, 13 .... Molded resin,
14. Ultrasonic welding jig, 15-17. First resin cover, 18. Hole,
19 .. Hole.

Claims (14)

A tag inlet including an antenna and an IC chip; a first resin cover formed on one main surface side of the tag inlet; and the tag of the first resin cover outside the tag inlet A plurality of convex portions forming an annular pattern surrounding the tag inlet or a spiral pattern surrounding the tag inlet and formed on the other main surface side of the tag inlet. An outer peripheral edge portion formed on a surface of the second resin cover facing the tag inlet and the plurality of convex portions or the convex portions. RFID tag joined with the part. A tag inlet including an antenna and an IC chip; a first resin cover formed on one main surface side of the tag inlet; and the tag of the first resin cover outside the tag inlet A plurality of convex portions formed in an annular pattern surrounding the tag inlet, formed on a surface facing the inlet, a second resin cover formed on the other main surface side of the tag inlet, and the outside of the tag inlet A plurality of recesses formed on a surface of the second resin cover facing the tag inlet, forming an annular pattern surrounding the tag inlet, and fitted and joined to the plurality of protrusions. RFID tag provided with. A tag inlet including an antenna and an IC chip; a first resin cover formed on one main surface side of the tag inlet; and the tag of the first resin cover outside the tag inlet A convex portion formed on a surface facing the inlet, forming a spiral pattern surrounding the tag inlet, a second resin cover formed on the other main surface side of the tag inlet, and outside the tag inlet A spiral pattern surrounding the tag inlet, formed on a surface of the second resin cover facing the tag inlet, fitted with the convex portion, and provided with a concave portion joined. RFID tag. The RFID tag according to claim 1, wherein the plurality of convex portions or the convex portions are mountain-shaped. The RFID tag according to claim 1, wherein the first resin cover and the second resin cover are joined by ultrasonic welding or injection molding. In a method of manufacturing an RFID tag having a structure in which a tag inlet including an antenna and an IC chip is sealed between resin covers, a plurality of convex portions or outer peripheral portions forming an annular pattern on the outer peripheral portion by injection molding A first resin cover forming step of forming a first resin cover having a convex portion forming a spiral pattern, and a second resin cover forming a second resin cover having an outer peripheral edge by injection molding The tag inlet is disposed between the forming step and the first resin cover and the second resin cover, and a plurality of convex portions or outer peripheral portions forming the annular pattern on the outer peripheral portion are spirally formed. And an ultrasonic welding step of bringing the first resin cover and the second resin cover into contact with each other by bringing the convex portion forming the pattern and the outer peripheral edge of the second resin cover into contact with each other. R Method of manufacturing the ID tag. In a method of manufacturing an RFID tag having a structure in which a tag inlet including an antenna and an IC chip is sealed between resin covers, a plurality of convex portions or outer peripheral portions forming an annular pattern on the outer peripheral portion by injection molding A first resin cover forming step of forming a first resin cover having a convex portion forming a spiral pattern, and a plurality of concave portions or an outer peripheral portion forming an annular pattern on the outer peripheral edge by injection molding. A second resin cover forming step of forming a second resin cover having a concave portion forming a pattern, and the tag inlet is disposed between the first resin cover and the second resin cover, A plurality of convex portions forming the annular pattern on the outer peripheral edge portion and a plurality of concave portions forming the annular pattern on the outer peripheral edge portion, or a convex portion forming a spiral pattern on the outer peripheral edge portion and the outer Contacting the recess forming a spiral pattern on the edge, a manufacturing method of an RFID tag and a bonding step of bonding said first resin cover and said second resin cover. The RFID tag manufacturing method according to claim 7, wherein in the joining step, the first resin cover and the second resin cover are joined by ultrasonic welding. 8. The RFID tag manufacturing method according to claim 7, wherein the first resin cover forming step or the second resin cover forming step is performed simultaneously with the joining step. In a method of manufacturing an RFID tag having a structure in which a tag inlet composed of an antenna and an IC chip is sealed between resin covers, a plurality of concave shapes that form an annular pattern on the outer peripheral edge or a spiral shape on the outer peripheral edge A first mold resin injection step of injecting resin into a first mold having a concave shape forming a pattern, and an annular ring from the first die to the outer peripheral edge after the first mold resin injection step A first resin cover forming and taking out step of taking out a first resin cover having a plurality of convex portions forming a pattern or a convex portion forming a spiral pattern at the outer peripheral edge portion; and a plurality of forming an annular pattern at the outer peripheral edge portion A second mold resin injection step for injecting resin into a second mold having a convex shape or a convex shape having a spiral pattern on the outer peripheral edge, and the second mold resin injection step after the second mold resin injection step. An annular pad from the metal mold to the outer periphery A second resin cover forming and taking out step of taking out a second resin cover having a plurality of concave portions forming a loop or a concave portion forming a spiral pattern on the outer peripheral edge, and the first resin cover and the second resin The tag inlet is arranged between the cover and a plurality of convex portions forming an annular pattern on the outer peripheral edge portion and a plurality of concave portions forming an annular pattern on the outer peripheral edge portion, or on the outer peripheral edge portion. Ultrasonic welding in which a convex portion forming a spiral pattern and a concave portion forming a spiral pattern are brought into contact with the outer peripheral edge portion, and the first resin cover and the second resin cover are joined by ultrasonic welding. An RFID tag manufacturing method comprising the steps. In a method of manufacturing an RFID tag having a structure in which a tag inlet composed of an antenna and an IC chip is sealed between resin covers, a plurality of concave shapes that form an annular pattern on the outer peripheral edge or a spiral shape on the outer peripheral edge A first mold resin injection step of injecting resin into a first mold having a concave shape forming a pattern, and an annular ring from the first die to the outer peripheral edge after the first mold resin injection step From a first resin cover forming and taking-out step of taking out a first resin cover having a plurality of convex portions or a convex portion forming a spiral pattern on the outer peripheral edge portion, and an outer peripheral edge portion of the first resin cover A plurality of convex portions in the first resin cover, or a tag inlet arranging step of arranging the tag inlet on a surface side on which the convex portions are formed, and the plurality of convex portions in the first resin cover. A first resin cover arranging step of bringing the third mold into contact with the convex portion of the first portion or the surface on which the convex portion is formed, and the first resin cover arranging step and the tag inlet arranging step. And a third mold resin injection and joining step for injecting resin into the third mold. The method of manufacturing an RFID tag according to claim 6, wherein the plurality of convex portions or the convex portions in the first resin cover are mountain-shaped. In a method of manufacturing an RFID tag having a structure in which a tag inlet composed of an antenna and an IC chip is sealed between resin covers, a plurality of convex shapes that form an annular pattern on the outer peripheral edge or a spiral shape on the outer peripheral edge A second mold resin injection step of injecting resin into a second mold having a convex shape forming a pattern, and an annular ring from the second die to the outer peripheral edge after the second mold resin injection step A second resin cover forming and taking out step of taking out a second resin cover having a plurality of concave portions forming a pattern or a concave portion forming a spiral pattern in the outer peripheral edge portion, and inside the outer peripheral edge portion of the second resin cover; A plurality of recesses in the second resin cover, or a tag inlet arranging step for arranging the tag inlet on a surface side where the recesses are formed, and the plurality of recesses in the second resin cover. A second resin cover placement step of bringing the concave portion of the first portion or a surface opposite to the surface on which the concave portion is formed into contact with the third mold, and the second resin cover placement step and the tag inlet placement step. A method for manufacturing an RFID tag, comprising: a third mold resin injection and bonding step for injecting a resin into the third mold. The RFID tag manufacturing method according to claim 13, wherein the plurality of recesses or the recesses in the second resin cover have a valley shape.

Images