JP2008204029A - Ic tag and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-coated IC tag with a built-in IC tag core capable of being produced without damaging the appearance and the quality thereof. <P>SOLUTION: The IC tag includes an IC tag core 3, a tray part 4 on which the IC tag core is placed, and a lid part 6 to cover the IC tag core placed on the tray part. At least one of the tray part 4 and the lid part 6 has a protruding part 5 shaped to be fitted to the inner peripheral part of an antenna coil. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact IC tag capable of recording data or transmitting recorded data by communication.

  Non-contact IC tags often have a structure in which an IC tag core is covered with a resin in order to obtain a desired shape, strength, weight, communication characteristics, and the like.

  FIG. 11 is a diagram for explaining a conventional IC tag. FIG. 11A is a cross-sectional view of the IC tag core, and FIG. 11B is a cross-sectional view illustrating a process of covering the IC tag core shown in FIG.

  Protrusions 19 set to a height corresponding to the thickness of the coating resin 22 are formed on the upper and lower surfaces of the IC tag core 18 formed by arranging the antenna coil and the IC chip on the substrate. The protrusions 19 are formed simultaneously with the formation of the molded body 21 made of a high specific gravity resin material.

  Subsequently, the IC tag core 18 having the protrusions 19 is loaded into the cavity 24 of the mold 23 and the coating resin 22 is injected. At this time, the protrusion 19 serves as a support for the IC tag core 18 and enables injection molding, and the height of the protrusion 19 becomes the thickness of the coating resin 22, thereby ensuring the thickness.

  FIG. 12 is a diagram for explaining another IC tag. FIG. 12A is a diagram showing a built-in component of the IC tag, and FIG. 12B is a cross-sectional view for explaining a process of covering the built-in component shown in FIG. FIG. 12C illustrates the appearance of the finished product.

  A coin 9 with an IC tag, which is a finished product, is composed of a synthetic resin coin body 10 that forms an outer shell, an IC tag 11 embedded in the coin body 10, and an antenna 12.

  The IC tag 11 is attached to a non-metallic substrate (not shown) made of an IC mounting film or the like, and the antenna 12 is connected to the IC tag 11 and disposed throughout the coin body 10.

  The IC tag 11 and the antenna 12 are placed on a molding die 14 and are resin-molded to be built in the coin main body 10. At the time of resin molding, a support base 13 is provided between the IC tag 11 placed in the mold 14 and the lower mold 15 of the mold 14 to support the IC tag 11 and the IC tag 11 and the antenna. 12 is positioned.

  The support 13 is formed of a material that melts to some extent when the synthetic resin is injected into the mold 14 and is integrated with the synthetic resin while supporting the IC tag 11.

  The aforementioned IC tag is disclosed in, for example, Patent Document 1 and Patent Document 2.

JP-A-2002-7789 JP2004-147925

  In the case of the conventional IC tag illustrated in FIG. 11, since the injection port of the coating resin 22 is located at substantially the center of one surface of the IC tag core 18, the injected coating resin 22 is sufficiently distributed to the other surface of the IC tag core 18. There may be no cases. For the same reason, unfilling or swelling of the coating resin 22 may occur at the center of the other surface due to the gas remaining in the mold.

  Further, the IC tag core 18 may be displaced by being pushed by the coating resin 22. In this case as well, the coating resin 22 is not filled or blistered, and the IC tag core 18 protrudes from the coating resin 22.

  Furthermore, the portion immediately below the injection port of the IC tag core 18 may be distorted by the injection pressure. FIG. 13 is a view for explaining distortion of the IC tag core 18 at the time of injection molding.

  Furthermore, since the protrusion 19 is formed at a height corresponding to the thickness of the coating resin 22, a difference in boundary line or resin color between the protrusion 19 and the coating resin 22 appears on the surface of the final product. It can be detrimental.

  The conventional IC tag illustrated in FIG. 12 has the following drawbacks. That is, the IC tag 11 is located between the concentric antennas, and even if only the IC tag 11 is supported by the support base 13, the position of the support base 13 deviates from the center of gravity of the whole combined body of the IC tag 11 and the antenna 12. In some cases, the antenna 12 tilts in the mold 14 and the antenna 12 protrudes from the synthetic resin after the synthetic resin is injected.

  Even if the IC tag 11 is arranged so as to be positioned at the center of the antenna 12, if the IC tag 11 is supported only directly under the IC tag 11, the antenna 12 is tilted by the injection pressure of the synthetic resin, the antenna 12 is disconnected, the synthetic resin of the antenna 12 The protrusion to the surface occurs.

  In addition, a difference in boundary line or resin color between the support base 13 and the synthetic resin to be injected may appear on the surface of the final product, which may impair the appearance.

  Accordingly, an object of the present invention is to provide an IC tag having a built-in IC tag core and resin-coated, which can be manufactured without impairing the appearance and quality.

  The present invention is an IC tag in which an IC tag core composed of an IC module and an antenna coil is covered with a resin outer shell, and the IC tag core, which is a built-in object, can be easily and reliably positioned. It is a tag.

  The outer shell covering the IC tag core is composed of a dish portion on which the IC tag core is placed and a lid portion covering the placed IC tag core, and the dish portion and the lid portion are formed so as to be integrated by bonding or injection molding.

  At least one of the plate part or the cover part has a convex part shaped to fit to the inner peripheral part surrounded by the closed loop of the antenna coil wound substantially concentrically as a whole so as to constitute a closed loop. Have. The IC tag core is placed on the dish part or the lid part with the convex part fitted in the inner peripheral part of the antenna coil. By forming, it is built in the outer shell.

  As a method of joining the dish part and the lid part, a method of welding the boundary between the dish part and the lid part by heating or pressurizing, a method of fusing using, for example, ultrasonic waves, a method of adhering using an adhesive Is preferred.

  In addition, after either one of the plate part or the lid part is prepared in advance, the IC tag core is positioned and placed using the convex part, and then the injection is performed to inject the resin from the immediate vicinity of the gap for forming the remaining part of the outer shell A method of forming by molding is preferred.

  The IC tag core is positioned by the convex portion, and an IC tag without a protrusion of a built-in object can be obtained without causing a positional shift due to an external force at the time of joining or a flow of molding resin by injection molding.

  The convex portion may have any shape as long as the convex portion is fitted to the inner peripheral portion of the antenna coil of the IC tag core. One or more columnar bodies and one or more protrusions that have a smaller diameter than the inner peripheral portion of the antenna coil of the IC tag core and are arranged so as not to cause positional deviation of the antenna are preferable in terms of design and manufacture. When supporting and fixing with a plurality of convex portions, the convex portions are arranged at arbitrary intervals in the inner peripheral portion of the antenna coil, that is, in the closed loop of the antenna coil, so that the antenna coil is not displaced as a whole. preferable.

  It is preferable to use the same resin for the dish part and the lid part from the viewpoint of securing the bonding strength and the appearance.

  According to the present invention, there is provided an IC tag in which an IC tag core having a closed loop antenna coil and an IC module is covered with a resin outer shell, wherein the outer shell has a plate portion and a lid portion, and at least the plate portion. Alternatively, either one of the lid portions has an convex portion that fits with a portion surrounded by the inner circumference of the closed loop of the antenna coil to position the antenna coil.

  According to the present invention, there is provided an IC tag in which an IC tag core having a closed loop antenna coil and an IC module is covered with a resin outer shell, wherein the outer shell has a plate portion and a lid portion, and at least the plate portion. Alternatively, either one of the lid portions has a plurality of convex portions for positioning the antenna coil by fitting with a portion surrounded by the closed loop inner periphery of the antenna coil.

  According to this invention, the said tag part and cover part are joined by the means of welding, melt | fusion, adhesion | attachment, and fitting, and the manufacturing method of the said IC tag characterized by the above-mentioned is obtained.

  According to the present invention, the plate portion or the lid portion on which the IC tag core is placed is molded so that the convex portion of the plate portion or the lid portion and the portion surrounded by the inner periphery of the closed loop of the antenna coil are fitted together. An IC tag manufacturing method is obtained, which is housed in a mold, injecting molding resin into the IC tag core, and forming the lid portion or the dish portion by injection molding.

  According to the present invention, it is possible to provide an IC tag having the following effects.

  In other words, by fitting the antenna coil to the convex portion provided on the outer shell, the positional deviation of the IC tag core with respect to the outer shell can be reduced, and an IC tag without damage to the IC tag core can be provided.

  By fitting the antenna coil into the convex portion provided on the outer shell, the positional deviation of the IC tag core with respect to the outer shell is reduced, and it is possible to provide an IC tag that does not protrude from the outer surface of the IC tag core.

  The IC tag core is not damaged when the antenna coil is fitted into the convex part provided on the dish part or lid part, and the lid part or dish part is formed by injection molding, thereby reducing the positional deviation of the IC tag core with respect to the outer shell. It became possible to provide tags.

  When inserting the antenna coil into the convex part provided on the dish part or the lid part, and forming the lid part or dish part by injection molding, the positional deviation of the IC tag core with respect to the outer shell is reduced, the resin is not filled or blistered, It has become possible to provide an IC tag in which the IC tag core does not protrude from the resin surface.

  Insert the antenna coil into the convex part provided in the dish part or lid part, and when forming the lid part or dish part by injection molding, the boundary line between the dish part and the lid part should be located on the side of the IC tag It has become possible to design and provide an IC tag that does not impair the appearance.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view for explaining an IC tag according to the present invention. FIG. 2 is a cross-sectional view illustrating an IC tag according to the present invention. FIG. 3 is a diagram illustrating an IC tag core of an IC tag according to the present invention. The IC tag core 3 includes an IC module 1 and an antenna coil 2 and has a function of recording data by communication and transmitting recording data.

  The dish part 4 is provided with a cylindrical convex part 5. The convex part 5 has a diameter smaller than the diameter of the inner peripheral part of the antenna coil 2, and the dish part 4 so that the IC tag core 3 composed of the IC module 1 and the antenna coil 2 is arranged on the outer periphery of the convex part 5. The IC tag is configured by mounting the lid portion 6 so as to cover the IC tag core 3.

  Since the IC coil core 3 has the antenna coil 2 fitted in the convex portion 5, the IC tag core 3 is less likely to be displaced with respect to the outer shell composed of the dish portion 4 and the lid portion 6. Therefore, when joining the plate | board part 4 and the cover part 6, the damage by the pinching of the IC tag core 3 to the outline and the protrusion to the outline surface can be avoided.

  FIG. 5 is a view for explaining injection molding of an IC tag according to the present invention. The plate part 4 on which the IC tag core 3 is placed is housed in a molding die 7, a resin is poured from the position of the arrow, and injection molding is performed to form the lid part 6.

  Since the lower part of the outer shell, i.e., the dish portion 4, is formed in advance, the resin to be injected only needs to form the upper portion of the outer shell, i.e., the lid 6, so that the resin can be easily filled. Accordingly, resin unfilling and blistering are unlikely to occur.

  Further, since the IC tag core 3 is fitted into the convex portion 5 and supported and fixed, even if a horizontal force due to the flow of resin is applied to the IC tag core 3, the IC tag core 3 is not displaced by the convex portion 5. . Therefore, it is possible to avoid unfilling of the resin, blistering, and protrusion of the IC tag core 3 to the outer surface.

  Further, the boundary line between the plate part 4 and the lid part 6 can be designed to be located on the side surface of the IC tag, and the appearance of the front and back surfaces of the IC tag on which characters and pictures are written is not impaired.

  As a method for joining the lid, for example, welding by heating and pressurization, ultrasonic fusion, adhesion with an adhesive, or the like is preferable.

  The shape of the convex portion need not be limited as long as it is a structure that suppresses the displacement of the antenna coil. Accordingly, the cross-sectional shape may be any shape such as a circle, an ellipse, or a polygon, but it is preferable in terms of manufacturing design to match the inner peripheral shape of the antenna coil.

  Further, the number of convex portions is not necessarily limited to one, and a plurality of convex portions may be provided. FIG. 4 is a diagram for explaining an IC tag according to the present invention, and shows an IC tag having three convex portions. The convex portions 5 are disposed so as to be in contact with the inner peripheral portion of the antenna coil 2. By arranging a plurality of the convex portions 5 in this manner, it contributes to the weight adjustment of the IC tag, the flexible response to the routing route of the antenna coil 2, and the improvement of the efficiency of the work of fitting the antenna coil 2 into the convex portion 5. .

  For the same reason as described above, the convex portion may be on both the plate portion and the lid portion. FIG. 6 is a cross-sectional view illustrating the IC tag of the present invention, and shows the IC tag having convex portions on both the lid portion and the dish portion. In order to arrange the IC module 1 on the inner peripheral part of the antenna coil 2 for the purpose of reducing the size of the IC tag, for example, the convex part 5 of the dish part 4 and the convex part of the cover part 6 are selected according to the size of the IC module 1 A space is formed by changing the shape of the part 5, and the IC module 1 is arranged in the space.

  In addition, you may change the shape of a tray part and a cover part according to a use purpose and a use. That is, the external appearance is not limited to a substantially disk shape, and may be a polygonal plate or any other shape. Further, the cross-sectional shape excluding the convex portion in the direction perpendicular to the IC tag core mounting surface of the plate portion and the lid portion may be U-shaped, I-shaped, or any other shape.

  Hereinafter, embodiments of the present invention will be described in detail using examples.

  FIG. 7 is a diagram for explaining an IC tag according to the present invention, and shows a state where an IC tag core 3 composed of an IC module 1 and an antenna coil 2 is placed on a platen portion 4. FIG. 8 is a cross-sectional view for explaining the IC tag of the present invention, and shows an IC tag constituted by using the members shown in FIG.

  The antenna coil 2 was produced using a heat-sealed copper wire and joined to the IC module 1 by soldering to obtain an IC tag core 3. The plate part 4 and the cover part 6 which comprise an outer shell were produced using ABS resin. The plate portion 4 is provided with four convex portions 5, arranged so that the antenna coil 2 of the IC module 1 is located on the outer peripheral portion of the convex portion 5, and the IC tag core 3 is disposed between any two convex portions 5. . The lid portion 6 is provided with a concave portion 8 at a portion facing the convex portion 5 of the plate portion 4 so that the plate portion 4 and the lid portion 6 can be easily aligned. The dish part 4 and the cover part 6 were joined by ultrasonic fusion.

  When 100 IC tags were manufactured, there was no one in which the IC tag core 3 was displaced during manufacturing and the antenna coil 2 was disconnected by being sandwiched between the joining portions of the dish portion 4 and the lid portion 6. Further, there was no IC tag core 3 that protruded from the outer shell and damaged the appearance.

  In addition, although 50 products with different coloring lots of pellets used for the manufacture of the plate part 4 and the lid part 6 were mixed, there was a slight difference in the color of the dish part 4 and the lid part 6. Since the boundary line was formed on the side surface of the IC tag core, it could not be sorted out unless it was watched, and there was nothing that impaired the appearance.

  FIG. 9 is a diagram for explaining an IC tag according to the present invention, and shows a state in which an IC tag core 3 composed of an IC module 1 and an antenna coil 2 is placed on a dish part 4. FIG. 10 is a cross-sectional view for explaining an IC tag of the present invention, and shows an IC tag configured using the members shown in FIG.

  The antenna coil 2 was produced using a heat-sealed copper wire and joined to the IC module 1 by soldering to obtain an IC tag core 3. In addition, the thickness of the said coil was 0.7 mm, the thickness of the plate part 4 was 0.9 mm, and the height of the convex part 5 was 0.7 mm.

  In order to produce the outer shell using glass-filled ABS resin, a colored glass-filled ABS pellet is prepared, a dish portion 4 having a convex portion 5 is injection-molded, and the IC tag core 3 shown in FIG. Fitted. Next, the dish part 4 fitted with the IC tag core 3 is accommodated in a molding die, and the lid part 6 is formed by injection molding using the pellets. The finished dimension is an IC tag having a diameter of 30 mm and a thickness of 2.5 mm. Got.

  When 100 IC tags were manufactured, the antenna coil 2 was not disconnected during the manufacturing. Further, no unfilled resin, no blistering, and no protrusion of the IC tag core 3 occurred.

  In addition, although 50 products with different coloring lots of pellets used for the manufacture of the plate part 4 and the lid part 6 were mixed, there was a slight difference in the color of the dish part 4 and the lid part 6. Since the boundary line was formed on the side surface of the IC tag core with a thickness of only 2.5 mm, it could not be sorted out unless it was watched, and there was nothing that impaired the appearance.

  The embodiments of the present invention have been described above using the embodiments. However, the present invention is not limited to these embodiments, and the present invention is not limited to the scope of the present invention. Included in the invention. That is, various changes and modifications that can be naturally made by those skilled in the art are also included in the present invention.

  By using the IC tag of the present invention, various management systems applicable to product tags, amusement tools, entry / exit keys, etc. can be easily constructed.

The perspective view explaining the IC tag by the present invention. Sectional drawing explaining the IC tag by this invention. The figure explaining the IC tag core of the IC tag by this invention. FIG. 6 illustrates an IC tag of the present invention. The figure explaining the injection molding of the IC tag by this invention. Sectional drawing explaining the IC tag of this invention. FIG. 6 illustrates an IC tag of the present invention. Sectional drawing explaining the IC tag of this invention. The figure explaining the IC tag by this invention. Sectional drawing explaining the IC tag of this invention. FIG. 11A is a cross-sectional view of an IC tag core, and FIG. 11B is a cross-sectional view illustrating a process of covering the IC tag core shown in FIG. FIGS. 12A and 12B are diagrams illustrating a conventional IC tag. FIG. 12A is a diagram illustrating a built-in component of the IC tag, and FIG. 12B is a cross-sectional view illustrating a process of covering the built-in component illustrated in FIG. FIG. 12C illustrates the appearance of the finished product. The figure explaining distortion of the IC tag core at the time of injection molding.

Explanation of symbols

1 IC module
2 Antenna coil
3 IC tag core
4 dishes
5 Convex
6 Lid
7 Mold
8 recess
9 Coin with IC tag
10 Coin body
11 IC tag
12 Antenna
13 Support stand
14 Mold
15 Lower mold
16 Upper mold
17 Injection hole
18 IC tag core
19 Protrusion
20 High specific gravity resin material
21 Molded body
22 Coating resin
23 Mold
24 cavity

Claims (4)

  An IC tag in which an IC tag core having a closed loop antenna coil and an IC module is covered with a resin outer shell, the outer shell having a tray portion and a lid portion, and at least one of the tray portion and the lid portion. One of the IC tags has a convex portion for positioning the antenna coil by fitting with a portion surrounded by the inner periphery of the closed loop of the antenna coil.   An IC tag in which an IC tag core having a closed loop antenna coil and an IC module is covered with a resin outer shell, the outer shell having a tray portion and a lid portion, and at least one of the tray portion and the lid portion. One of the IC tags has a plurality of convex portions that are positioned on the antenna coil so as to be fitted to a portion surrounded by the inner periphery of the closed loop.   3. The method of manufacturing an IC tag according to claim 1, wherein the dish part and the lid part are joined by any one of welding, fusion, adhesion, and fitting.   The dish portion or the lid portion on which the IC tag core is placed so that the convex portion of the dish portion or the lid portion and the portion surrounded by the inner periphery of the closed loop of the antenna coil fit together is housed in a molding die, The method for manufacturing an IC tag according to claim 1 or 2, wherein a molding resin is injected into the IC tag core, and the lid or the dish is formed by injection molding.

Images