JP3543963B2 - Heat treatment equipment - Google Patents

Heat treatment equipment Download PDF

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Publication number
JP3543963B2
JP3543963B2 JP2001142881A JP2001142881A JP3543963B2 JP 3543963 B2 JP3543963 B2 JP 3543963B2 JP 2001142881 A JP2001142881 A JP 2001142881A JP 2001142881 A JP2001142881 A JP 2001142881A JP 3543963 B2 JP3543963 B2 JP 3543963B2
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Japan
Prior art keywords
valve
heat treatment
main
pipe
main body
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Expired - Fee Related
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JP2001142881A
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Japanese (ja)
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JP2002343781A (en
Inventor
廣行 松浦
悟 小池
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2001142881A priority Critical patent/JP3543963B2/en
Priority to TW91133065A priority patent/TWI265571B/en
Priority to PCT/JP2002/011802 priority patent/WO2004044969A1/en
Priority to CNB028059387A priority patent/CN100397577C/en
Publication of JP2002343781A publication Critical patent/JP2002343781A/en
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/14Control of fluid pressure with auxiliary non-electric power
    • G05D16/16Control of fluid pressure with auxiliary non-electric power derived from the controlled fluid
    • G05D16/166Control of fluid pressure with auxiliary non-electric power derived from the controlled fluid using pistons within the main valve

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Chemical Vapour Deposition (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、熱処理装置に関する。
【0002】
【従来の技術】
半導体デバイスの製造プロセスにおいては、被処理体例えば半導体ウエハに例えばCVD(化学気相成長)等の熱処理を施すために、熱処理装置が使用されている。この熱処理装置は、被処理体を収容する熱処理炉と、その炉内に処理ガス等のガスを供給するガス供給系と、炉内を減圧排気する排気系とを備えている。この排気系は、例えば先ず炉内を真空置換し、その際にパーティクルを巻き上げないようにスローバキュームを行い、次いで炉内を所定の処理圧力にするというような圧力制御を行うために次のような構成が採用されている。
【0003】
図6に示すように、前記排気系12は所定の管径例えば3インチの配管13を有し、この配管13には例えばアングル弁からなる主弁(主開閉弁)18、バタフライ弁からなる主圧力制御弁19および減圧ポンプ17が順に設けられている(図示省略)。また、前記配管13には主弁18をバイパスする小管径例えば1/4インチのバイパス管60が接続され、このバイパス管60には第1の補助弁61および第2の補助弁62が並列に設けられると共に第2の補助弁62側に直列に流量調整用のニードル弁63が設けられている。
【0004】
炉内を大気圧の状態から所定の処理圧力に減圧する場合には、先ずスローバキュームを行うために主弁18および第1の補助弁61を閉じ、第2の補助弁62を開けてニードル弁63にて設定した微少流量で真空引きを開始し、次に第1の補助弁62、主弁61を順に開けて行き目標の最終圧力まで真空引きすればよい。
【0005】
【発明が解決しようとする課題】
しかしながら、前記従来の熱処理装置においては、排気系12にバイパス管60を接続して第1,第2の補助弁61,62等を設けていたので、広いスペースSaを要するだけでなく、配管13回りが煩雑になって保守作業性が悪いという問題があった。また、主弁18を固定するために主弁18の前後の配管を装置の躯体14に固定金具70を介して固定する必要が有り、これが配管回りを更に煩雑にしているだけでなく、加温配管の場合、その固定金具70から熱が逃げるので配管内に反応副生成物が発生する問題があった。
【0006】
本発明は、前記事情を考慮してなされたもので、排気系の配管回りを簡素化でき、保守作業性の向上が図れる熱処理装置を提供することを目的とする。また、本発明の目的は、主弁を装置の躯体に直接固定できて配管回りを更に簡素化できる熱処理装置を提供することにある。
【0007】
【課題を解決するための手段】
本発明のうち、請求項1の発明は、躯体内に熱処理炉を設置し、躯体内から躯体外に配管した熱処理炉の排気系の配管に主弁、第1の補助弁および第2の補助弁を並列に備えた熱処理装置であって、前記主弁の外郭を形成する本体に入口側と出口側を連通するバイパス通路を2本形成し、前記主弁の本体に一方のバイパス通路を開閉する第1の補助弁と、他方のバイパス通路を開閉する第2の補助弁とを設け、前記主弁の本体には自立用の固定板が設けられ、該固定板を介して主弁の本体が前記躯体に固定されていることを特徴とする。
【0008】
請求項2の発明は、請求項1記載の熱処理装置において、前記第2の補助弁が流量調整可能に構成されていることを特徴とする。
【0009】
請求項3の発明は、請求項1記載の熱処理装置において、前記躯体にブラケットを取付け、該ブラケットに前記固定板を固定していることを特徴とする。
【0010】
【発明の実施の形態】
以下に、本発明の実施の形態を添付図面に基いて詳述する。
【0011】
熱処理装置の概略的構成を示す図1において、1は被処理体例えば半導体ウエハwを収容して所定の熱処理例えばCVD処理を行う熱処理炉で、例えば図示例のようなバッチ式の縦型炉が採用されている。この熱処理炉1は、石英製の処理容器(反応管)2と、この処理容器2の周囲にこれを囲繞するように設けられた円筒状のヒータ3とを備えている。
【0012】
前記処理容器2は、図示例では内管2aと外管2bの二重管構造とされているが、一重管構造であっても良い。処理容器2の下端は開口され、処理容器2の下端には処理容器2内に処理ガス等のガスを導入するガス導入管部4と、処理容器2内の雰囲気を排気する排気管部5とを有する円環状のマニホールド6が気密に接続されている。マニホールド6の下端は炉口7として開口され、その下方には炉口7を気密に閉塞する蓋体8が昇降機構9を介して開閉自在に設けられている。
【0013】
前記蓋体8上には、多数枚例えば150枚程度のウエハwを上下方向に所定間隔で多段に搭載保持する保持具である石英製のボート10が炉口断熱手段例えば保温筒11を介して載置されている。前記ボート10は、前記昇降機構9によって炉1内すなわち処理容器2内に対する搬入(ロード)と搬出(アンロード)が行われる。
【0014】
前記ガス導入管部4にはガス供給源に通じる図示しないガス供給系の配管が接続され、排気管部5には排気系12の配管(排気管ともいう)13が接続されている。前記熱処理炉1は熱処理装置の外郭を形成する躯体(筐体ともいう)14内に設置されている(図5参照)。躯体14内には処理容器2が下方から挿通可能な開口を有するベースプレート15が設けられ、このベースプレート15にマニホールド6が取付金具を介して取付けられ、ベースプレート15上に前記ヒータ3が設置されている。また、ベースプレート15よりも下方にはボート10をアンロードするための作業領域であるローディングエリア16が設けられている。
【0015】
前記排気系12の配管13は躯体14内から躯体14外に配管されて下方の減圧ポンプ17に接続されている。排気系12の配管13には、例えばアングル弁からなる主弁18、例えばバタフライ弁からなる圧力制御弁19および副生成物を捕捉するトラップ20が上流側から順に設けられている。従って、前記排気系12は、配管13およびこの配管13に設けられた主弁18、圧力制御弁19、減圧ポンプ17およびトラップ20により構成されている。
【0016】
図2は主弁の斜視図、図3は主弁の要部断面図、図4は第2の補助弁の拡大断面図である。この主弁18は、その外郭を形成するボディ(弁箱ともいう)である本体21と、この本体21の内部に設けられた弁体26とを有し、本体21の側部と下部にフランジ接続用の開口22,23が形成され、一方の開口22が例えば流体の入口とされ、他方の開口23が出口とされている。これら入口と出口は、図6の場合のように逆であっても良い。本体21内には、両開口22,23を連通する流路24が形成され、この流路24の下部の開口23側に弁座25が設けられ、この弁座25に対して弁体26が着座されて閉弁されるようになっている。
【0017】
本体21の上部には、弁棒27を介して弁体26を上方もしくは下方に移動操作し、主弁18の開閉を行うアクチュエータ(駆動部)28が設けられている。弁体21と本体21との間には弁棒27を囲繞するようにベローズ29が設けられている。一般的には排気系12に主弁18と第1の補助弁30および第2の補助弁31が並列に接続されるのであるが、本実施の形態では主弁18の本体21に一方の開口(入口)22側と他方の開口(出口)23側を連通するバイパス通路32,33が2本形成され、本体21の側部にはその一方のバイパス通路32を開閉する第1の補助弁30と、他方のバイパス通路33を開閉する第2の補助弁31とが設けられている。
【0018】
第1および第2のバイパス通路32,33の途中は、それぞれ本体21の側部に開口するように形成され、その開口端が弁座34,35として形成されている。前記第1の補助弁30は、弁座34と連通するように本体21の側部に設けられた弁箱36と、該弁箱36内に設けられ図示しないバネにより閉弁方向(弁座に着座する方向)に付勢された弁体37とを有し、弁箱36には弁体37をバネの付勢力に抗して開弁方向(弁座から離反する方向)に駆動操作すべく圧縮空気を供給するための空気圧供給系の配管38が接続されている。
【0019】
第1の補助弁30は、空気圧を供給しない場合には弁体37を弁座34に着座(当接)させて第1のバイパス通路32を遮断した閉弁状態にあり、圧縮空気を供給すると弁体37が弁座34から離間して第1のバイパス通路32を開通させた開弁状態となる。第1の補助弁30は、いわゆる固定流量バルブになっている。
【0020】
第2の補助弁31は、弁座35と連通するように本体21の側部に設けられた弁箱39と、該弁箱39内に設けられバネ40により閉弁方向(弁座に着座する方向)に付勢された弁体41とを有し、弁箱39には弁体41をバネ40の付勢力に抗して開弁方向(弁座から離反する方向)に駆動操作すべく圧縮空気を供給するための空気圧供給系の配管42が接続されている。すなわち、弁体41には弁棒43を介してピストン44が連結され、このピストン44が弁箱39に形成されたシリンダ45内に摺動可能に嵌挿されている。シリンダ室45内の一端にはピストン44を閉弁方向に付勢する前記バネ40が内蔵され、シリンダ室45内の他端には圧縮空気によってピストン44を開弁方向に駆動するための圧力室46が形成されている。弁箱39およびピストン44には前記空気圧供給系の配管42から圧縮空気を前記圧力室46に導入するための導入通路47が略軸心に沿って形成されている。この構成は前記第1の補助弁も同様である(図示省略)。
【0021】
第2の補助弁31は、第1の補助弁30と同様、空気圧を供給しない場合には弁体41を弁座35に着座(当接)させて第2のバイパス通路33を遮断した閉弁状態にあり、圧縮空気を供給すると弁体41が弁座35から離間して第2のバイパス通路33を開通させた開弁状態となる。第2の補助弁31が第1の補助弁30と異なる点は流量調整可能、具体的には微少流量調整可能に構成され、可変流量調整バルブになっていることである。
【0022】
すなわち、第2の補助弁31の弁箱39の後端部には可変流量ハンドル48が設けられている。この可変流量ハンドル48は袋ねじ状に形成されていて、弁箱39の後端部に形成した雄ねじ部49に螺合されてている。また、可変流量ハンドル48にはピストン44の移動範囲(すなわち弁体のリフト量)dを規制するスリーブ50が軸心に沿って突設され、このスリーブ50内にはピンストン44の後部に突設した軸部51が摺動可能に嵌挿されている。
【0023】
従って、可変流量ハンドル48を締め込む方向に回転すると弁体41のリフト量dが小さくなり、逆に可変流量ハンドル48を緩める方向に回転すると弁体41のリフト量dが大きくなり、このように可変流量ハンドル48を回転操作することにより第2のバイパス通路33を流れる流体例えば熱処理炉1からの排気の流量を調節できるようになっている。なお、排気系12の配管13における主弁18よりも上流には配管13内の圧力を検出する圧力センサ52が設けられ、その検出信号はコントローラ53に入力され、コントローラ53は予め設定されたプログラムに基いて排気系12の圧力制御を行うべく主弁18、圧力制御弁19および第1,第2の補助弁30,31の開閉制御を行うようになっている。
【0024】
一方、前記主弁18の本体21には自立用の固定板54が設けられ、この固定板54を介して主弁18の本体21が装置の躯体14に固定されている。固定板54は、主弁18の本体21に例えばネジ55で取付けられている。固定板54にはこれをブラケット等に例えばボルトとナットで連結するための孔部56が設けられている。例えば図5に示すように、装置の躯体14にブラケット57を取付け、このブラケット57に主弁18の本体21の固定板54をボルトとナットで固定すれば良く、これにより装置の躯体14に主弁18を確実に固定することができる。
【0025】
次に、以上の構成からなる熱処理装置の作用を述べる。熱処理炉1内を大気圧の状態から所定の処理圧力に減圧する場合には、処理容器2内における反応副生成物の舞い上がりおよびボート10上での半導体ウエハwのズレを防止するため、先ず減圧ポンプ17を駆動し、スローバキュームを行うために主弁18および第1の補助弁30を閉じ、第2の補助弁31を開け、その可変流量ハンドル48にて設定した微少流量で炉内の真空引きを開始する。炉内の雰囲気は排気管部5および排気系12の配管13を通り、更に主弁18の第2のバイパス通路33を通って微少流量で排気される。
【0026】
炉内が予めプログラミングされた第1段階の圧力に達したなら、次に第1の補助弁30を開け、第1および第2のバイパス通路32,33を通して前記よりも多い流量で真空引きを行ない、炉内が予めプログラミングされた第2段階の圧力に達したなら、主弁18を開け、第1,第2のバイパス通路32,33および主弁18の流路24を通して大流量で真空引きを行い、目標の最終圧力まで真空引きすればよい。
【0027】
このように前記熱処理装置よれば、熱処理炉1の排気系12に設けられた主弁18の本体21にその入口22側と出口23側を連通するバイパス通路32,33を2本形成し、前記本体21に一方のバイパス通路32を開閉する第1の補助弁30と、他方のバイパス通路33を開閉する第2の補助弁31とを設けているため、排気系12の配管13回りを簡素化でき、省スペース化Sbおよび保守作業性の向上が図れる。前記第2の補助弁31が流量調整機能を備えているため、別途ニードル弁等を必要とせず、配管回りを更に簡素化できる。
【0028】
また、前記主弁18の本体21には自立用の固定板54が設けられ、この固定板54を介して主弁18の本体21が装置の躯体14に固定されているため、主弁18を装置の躯体14に固定でき、主弁18の前後の配管を固定金具で固定する必要がなく、配管回りを更に簡素化できる。配管13の固定金具を使用しないため、加温配管の場合でも、熱が逃げることがなく、配管13内の反応副生成物の発生を抑制できる。
【0029】
以上、本発明の実施の形態を図面により詳述してきたが、本発明は前記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲での種々の設計変更等が可能である。例えば、熱処理炉としては、縦型に限定されず、横型であってもよく、またバッチ式に限定されず、枚葉式であってもよい。熱処理としては、CVD以外に、酸化、拡散、アニール等であってもよい。被処理体としては、半導体ウエハ以外に、例えばガラス基板やLCD基板等であってもよい。
【0030】
【発明の効果】
以上要するに本発明によれば、次のような効果を奏することができる。
【0031】
(1)請求項1の発明によれば、躯体内に熱処理炉を設置し、躯体内から躯体外に配管した熱処理炉の排気系配管に主弁、第1の補助弁および第2の補助弁を並列に備えた熱処理装置であって、前記主弁の外郭を形成する本体に入口側と出口側を連通するバイパス通路を2本形成し、前記主弁の本体に一方のバイパス通路を開閉する第1の補助弁と、他方のバイパス通路を開閉する第2の補助弁とを設けているため、排気系の配管回りを簡素化でき、保守作業性の向上が図れる。また、前記主弁の本体には自立用の固定板が設けられ、該固定板を介して主弁の本体が前記躯体に固定されているため、主弁を装置の躯体に直接固定できて配管回りを更に簡素化でき、配管の固定金具を使用しないため、加温配管の場合でも、配管の固定金具から熱が逃げるということがなく、配管内の反応副生成物の発生を抑制できる。
【0032】
(2)請求項2の発明によれば、前記第2の補助弁が流量調整可能に構成されているため、別途ニードル弁を必要とせず、配管回りを更に簡素化できる。
【0033】
(3)請求項3の発明によれば、前記躯体にブラケットを取付け、該ブラケットに前記固定板を固定しているため、躯体に主弁を確実に固定することができる。
【図面の簡単な説明】
【図1】本発明の実施の形態である熱処理装置の概略的構成を示す図である。
【図2】主弁の斜視図である。
【図3】主弁の要部断面図である。
【図4】第2の補助弁の拡大断面図である。
【図5】主弁の取付構造を示す図で、(a)は側面図、(b)は平面図である。
【図6】従来の主弁の取付構造を示す図で、(a)は側面図、(b)は平面図である。
【符号の説明】
1 熱処理炉
12 排気系
13 排気系の配管
14 躯体
18 主弁
21 本体
22 開口(入口)
23 開口(出口)
30 第1の補助弁
31 第2の補助弁
32,33 バイパス通路
54 固定板
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat treatment apparatus.
[0002]
[Prior art]
2. Description of the Related Art In a semiconductor device manufacturing process, a heat treatment apparatus is used for subjecting an object to be processed, for example, a semiconductor wafer to a heat treatment such as a CVD (Chemical Vapor Deposition). This heat treatment apparatus includes a heat treatment furnace for accommodating the object to be processed, a gas supply system for supplying a gas such as a processing gas into the furnace, and an exhaust system for depressurizing and exhausting the inside of the furnace. This exhaust system is, for example, first vacuum-replaced in the furnace, performs slow vacuum so as not to wind up particles at that time, and then performs pressure control such that the inside of the furnace is set to a predetermined processing pressure as follows. Configuration is adopted.
[0003]
As shown in FIG. 6, the exhaust system 12 has a pipe 13 having a predetermined pipe diameter of, for example, 3 inches. The pipe 13 has a main valve (main open / close valve) 18 composed of, for example, an angle valve and a main valve composed of a butterfly valve. A pressure control valve 19 and a pressure reducing pump 17 are provided in order (not shown). A small pipe diameter, for example, a 1/4 inch bypass pipe 60 that bypasses the main valve 18 is connected to the pipe 13, and a first auxiliary valve 61 and a second auxiliary valve 62 are connected in parallel to the bypass pipe 60. And a needle valve 63 for adjusting the flow rate is provided in series on the second auxiliary valve 62 side.
[0004]
When the pressure in the furnace is reduced from the atmospheric pressure to a predetermined processing pressure, first, the main valve 18 and the first auxiliary valve 61 are closed, the second auxiliary valve 62 is opened, and the needle valve is opened to perform slow vacuum. Vacuum evacuation is started at the minute flow rate set at 63, and then the first auxiliary valve 62 and the main valve 61 are opened in order to evacuate to the target final pressure.
[0005]
[Problems to be solved by the invention]
However, in the conventional heat treatment apparatus, since the bypass pipe 60 is connected to the exhaust system 12 and the first and second auxiliary valves 61 and 62 are provided, not only the large space Sa is required but also the piping 13 There has been a problem that the surroundings are complicated and maintenance workability is poor. Further, in order to fix the main valve 18, it is necessary to fix the pipes before and after the main valve 18 to the frame 14 of the apparatus via the fixing bracket 70, which not only makes the piping area more complicated, but also increases the heating. In the case of piping, there is a problem in that heat escapes from the fixture 70 and reaction by-products are generated in the piping.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat treatment apparatus that can simplify the piping around an exhaust system and improve maintenance workability. Another object of the present invention is to provide a heat treatment apparatus in which the main valve can be directly fixed to the frame of the apparatus, and the area around the piping can be further simplified.
[0007]
[Means for Solving the Problems]
Among the present invention, the invention of claim 1 provides a main valve, a first auxiliary valve, and a second auxiliary valve in a piping of an exhaust system of a heat treatment furnace which is provided with a heat treatment furnace inside a skeleton and which is piped from the skeleton to outside the skeleton. A heat treatment apparatus provided with a valve in parallel, wherein two bypass passages communicating an inlet side and an outlet side are formed in a main body forming an outer shell of the main valve, and one bypass passage is opened and closed in the main valve body. And a second auxiliary valve for opening and closing the other bypass passage. A main body of the main valve is provided with a self-standing fixing plate, and a main body of the main valve is provided via the fixing plate. Are fixed to the frame .
[0008]
According to a second aspect of the present invention, in the heat treatment apparatus according to the first aspect, the second auxiliary valve is configured to be capable of adjusting a flow rate.
[0009]
According to a third aspect of the present invention, in the heat treatment apparatus according to the first aspect , a bracket is attached to the frame, and the fixing plate is fixed to the bracket .
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0011]
In FIG. 1 which shows a schematic configuration of a heat treatment apparatus, reference numeral 1 denotes a heat treatment furnace which accommodates an object to be processed, for example, a semiconductor wafer w, and performs a predetermined heat treatment, for example, a CVD process. Has been adopted. The heat treatment furnace 1 includes a processing vessel (reaction tube) 2 made of quartz, and a cylindrical heater 3 provided around the processing vessel 2 so as to surround the processing vessel 2.
[0012]
Although the processing vessel 2 has a double pipe structure of the inner pipe 2a and the outer pipe 2b in the illustrated example, it may have a single pipe structure. A lower end of the processing vessel 2 is opened, and a gas introduction pipe section 4 for introducing a gas such as a processing gas into the processing vessel 2 and an exhaust pipe section 5 for exhausting an atmosphere in the processing vessel 2 are provided at a lower end of the processing vessel 2. An annular manifold 6 having an airtight connection is hermetically connected. The lower end of the manifold 6 is opened as a furnace port 7, and a lid 8 for hermetically closing the furnace port 7 is provided below the furnace port 7 via an elevating mechanism 9 so as to be freely opened and closed.
[0013]
On the lid 8, a quartz boat 10, which is a holder for mounting and holding a large number of, for example, about 150 wafers w at predetermined intervals in a vertical direction, is provided via a furnace port heat insulating means, for example, a heat retaining cylinder 11. It is placed. The boat 10 is loaded (unloaded) and unloaded (unloaded) into the furnace 1, that is, into the processing vessel 2, by the lifting mechanism 9.
[0014]
A gas supply pipe (not shown) leading to a gas supply source is connected to the gas introduction pipe 4, and a pipe (also referred to as an exhaust pipe) 13 of an exhaust system 12 is connected to the exhaust pipe 5. The heat treatment furnace 1 is installed in a frame (also referred to as a housing) 14 that forms an outer shell of the heat treatment apparatus (see FIG. 5). A base plate 15 having an opening through which the processing vessel 2 can be inserted from below is provided in the frame 14, and the manifold 6 is mounted on the base plate 15 via a mounting bracket, and the heater 3 is mounted on the base plate 15. . Further, below the base plate 15, a loading area 16 which is a work area for unloading the boat 10 is provided.
[0015]
The pipe 13 of the exhaust system 12 is piped from the inside of the frame 14 to the outside of the frame 14, and is connected to a pressure reducing pump 17 below. In the pipe 13 of the exhaust system 12, a main valve 18 composed of, for example, an angle valve, a pressure control valve 19 composed of, for example, a butterfly valve, and a trap 20 for trapping by-products are provided in this order from the upstream side. Therefore, the exhaust system 12 includes a pipe 13 and a main valve 18, a pressure control valve 19, a pressure reducing pump 17, and a trap 20 provided in the pipe 13.
[0016]
2 is a perspective view of the main valve, FIG. 3 is a sectional view of a main part of the main valve, and FIG. 4 is an enlarged sectional view of the second auxiliary valve. The main valve 18 has a main body 21 which is a body (also referred to as a valve box) forming an outer shell thereof, and a valve body 26 provided inside the main body 21. Openings 22 and 23 for connection are formed, and one opening 22 serves as, for example, a fluid inlet, and the other opening 23 serves as an outlet. These inlets and outlets may be reversed as in FIG. In the main body 21, a flow path 24 communicating between the openings 22 and 23 is formed, and a valve seat 25 is provided on the lower opening 23 side of the flow path 24, and a valve body 26 is provided for the valve seat 25. It is seated and closed.
[0017]
An actuator (drive unit) 28 for opening and closing the main valve 18 by moving the valve body 26 upward or downward via a valve rod 27 is provided at an upper portion of the main body 21. A bellows 29 is provided between the valve body 21 and the main body 21 so as to surround the valve rod 27. Generally, the main valve 18, the first auxiliary valve 30, and the second auxiliary valve 31 are connected in parallel to the exhaust system 12, but in the present embodiment, one opening is formed in the main body 21 of the main valve 18. Two bypass passages 32 and 33 are formed to communicate between the (inlet) 22 side and the other opening (outlet) 23 side, and a first auxiliary valve 30 that opens and closes one of the bypass passages 32 is formed on the side of the main body 21. And a second auxiliary valve 31 that opens and closes the other bypass passage 33.
[0018]
The first and second bypass passages 32 and 33 are formed so as to open to the sides of the main body 21, respectively, and the open ends thereof are formed as valve seats 34 and 35. The first auxiliary valve 30 has a valve box 36 provided on a side portion of the main body 21 so as to communicate with the valve seat 34, and a valve closing direction (in the valve seat direction) provided by a spring (not shown) provided in the valve box 36. A valve body 37 urged in a seating direction) to drive the valve body 37 in a valve opening direction (a direction away from the valve seat) against the urging force of a spring. A pipe 38 of an air pressure supply system for supplying compressed air is connected.
[0019]
When the air pressure is not supplied, the first auxiliary valve 30 is in a closed state in which the valve body 37 is seated (abutted) on the valve seat 34 and the first bypass passage 32 is shut off. The valve body 37 is separated from the valve seat 34 to be in an open state in which the first bypass passage 32 is opened. The first auxiliary valve 30 is a so-called fixed flow valve.
[0020]
The second auxiliary valve 31 has a valve box 39 provided on a side portion of the main body 21 so as to communicate with the valve seat 35, and a valve closing direction (seated on the valve seat) by a spring 40 provided in the valve box 39. The valve body 41 is urged in the valve opening direction (the direction away from the valve seat) against the urging force of the spring 40. A pipe 42 of an air pressure supply system for supplying air is connected. That is, a piston 44 is connected to the valve element 41 via the valve rod 43, and the piston 44 is slidably fitted into a cylinder 45 formed in the valve box 39. At one end in the cylinder chamber 45, the spring 40 for biasing the piston 44 in the valve closing direction is incorporated, and at the other end in the cylinder chamber 45, a pressure chamber for driving the piston 44 in the valve opening direction by compressed air. 46 are formed. In the valve box 39 and the piston 44, an introduction passage 47 for introducing compressed air from the piping 42 of the air pressure supply system into the pressure chamber 46 is formed substantially along the axis. This configuration is the same for the first auxiliary valve (not shown).
[0021]
Like the first auxiliary valve 30, the second auxiliary valve 31 closes the second bypass passage 33 when the air pressure is not supplied by seating (contacting) the valve body 41 on the valve seat 35. In this state, when the compressed air is supplied, the valve body 41 is separated from the valve seat 35 to be in an open state in which the second bypass passage 33 is opened. The second auxiliary valve 31 is different from the first auxiliary valve 30 in that a flow rate can be adjusted, specifically, a minute flow rate can be adjusted, and the second auxiliary valve 31 is a variable flow rate adjustment valve.
[0022]
That is, a variable flow handle 48 is provided at the rear end of the valve box 39 of the second auxiliary valve 31. The variable flow rate handle 48 is formed in a blind screw shape, and is screwed into a male screw portion 49 formed at the rear end of the valve box 39. Further, a sleeve 50 for regulating the moving range (ie, the lift amount of the valve body) d of the piston 44 is provided on the variable flow handle 48 along the axis thereof. The inserted shaft portion 51 is slidably fitted.
[0023]
Therefore, when the variable flow handle 48 is rotated in the tightening direction, the lift amount d of the valve body 41 decreases, and when the variable flow handle 48 is rotated in the loosening direction, the lift amount d of the valve body 41 increases. By rotating the variable flow rate handle 48, the flow rate of the fluid flowing through the second bypass passage 33, for example, the flow rate of the exhaust gas from the heat treatment furnace 1 can be adjusted. A pressure sensor 52 for detecting the pressure in the pipe 13 is provided upstream of the main valve 18 in the pipe 13 of the exhaust system 12, and a detection signal is input to a controller 53. The opening and closing control of the main valve 18, the pressure control valve 19, and the first and second auxiliary valves 30, 31 is performed in order to control the pressure of the exhaust system 12 based on the above.
[0024]
On the other hand, a self-standing fixing plate 54 is provided on the main body 21 of the main valve 18, and the main body 21 of the main valve 18 is fixed to the frame 14 of the apparatus via the fixing plate 54. The fixing plate 54 is attached to the main body 21 of the main valve 18 with, for example, a screw 55. The fixing plate 54 is provided with a hole 56 for connecting the fixing plate 54 to a bracket or the like with a bolt and a nut, for example. For example, as shown in FIG. 5, a bracket 57 may be attached to the frame 14 of the apparatus, and the fixing plate 54 of the main body 21 of the main valve 18 may be fixed to the bracket 57 with bolts and nuts. The valve 18 can be securely fixed.
[0025]
Next, the operation of the heat treatment apparatus having the above configuration will be described. When the pressure in the heat treatment furnace 1 is reduced from the atmospheric pressure to a predetermined processing pressure, the pressure is first reduced in order to prevent the reaction by-product in the processing vessel 2 from rising and the semiconductor wafer w from being displaced on the boat 10. The main valve 18 and the first auxiliary valve 30 are closed and the second auxiliary valve 31 is opened in order to drive the pump 17 and perform slow vacuum. Start pulling. The atmosphere in the furnace passes through the exhaust pipe section 5 and the pipe 13 of the exhaust system 12, and is further exhausted at a very small flow rate through the second bypass passage 33 of the main valve 18.
[0026]
When the pre-programmed first stage pressure has been reached in the furnace, the first auxiliary valve 30 is then opened and a vacuum is drawn through the first and second bypass passages 32, 33 at a higher flow rate. When the pressure in the furnace reaches the pre-programmed second stage pressure, the main valve 18 is opened, and the evacuation is performed at a large flow rate through the first and second bypass passages 32 and 33 and the flow passage 24 of the main valve 18. Then, vacuum may be drawn to the target final pressure.
[0027]
As described above, according to the heat treatment apparatus, the main body 21 of the main valve 18 provided in the exhaust system 12 of the heat treatment furnace 1 is formed with two bypass passages 32 and 33 communicating the inlet 22 side and the outlet 23 side. Since the main body 21 is provided with the first auxiliary valve 30 that opens and closes one bypass passage 32 and the second auxiliary valve 31 that opens and closes the other bypass passage 33, the area around the pipe 13 of the exhaust system 12 is simplified. Thus, space saving Sb and maintenance workability can be improved. Since the second auxiliary valve 31 has a flow rate adjusting function, the necessity of a separate needle valve or the like is not required, and the circumference of the pipe can be further simplified.
[0028]
The main body 21 of the main valve 18 is provided with a self-standing fixing plate 54. The main body 21 of the main valve 18 is fixed to the frame 14 of the apparatus via the fixing plate 54. It can be fixed to the frame 14 of the device, and there is no need to fix the pipes before and after the main valve 18 with fixing fittings, so that the area around the pipes can be further simplified. Since the fixture for the pipe 13 is not used, even in the case of a heated pipe, heat does not escape, and the generation of reaction by-products in the pipe 13 can be suppressed.
[0029]
As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to the above embodiments, and various design changes and the like can be made without departing from the gist of the present invention. is there. For example, the heat treatment furnace is not limited to a vertical type and may be a horizontal type, and is not limited to a batch type and may be a single wafer type. The heat treatment may be oxidation, diffusion, annealing, or the like, in addition to CVD. The object to be processed may be, for example, a glass substrate or an LCD substrate other than the semiconductor wafer.
[0030]
【The invention's effect】
In short, according to the present invention, the following effects can be obtained.
[0031]
(1) According to the first aspect of the present invention, a main valve, a first auxiliary valve, and a second auxiliary valve are provided in an exhaust system pipe of a heat treatment furnace in which a heat treatment furnace is installed in a skeleton and is piped from the skeleton to outside the skeleton. Wherein two bypass passages communicating the inlet side and the outlet side are formed in a main body forming an outer shell of the main valve, and one of the bypass passages is opened and closed in the main valve main body. Since the first auxiliary valve and the second auxiliary valve that opens and closes the other bypass passage are provided, the area around the exhaust system piping can be simplified, and maintenance workability can be improved. In addition, the main valve body is provided with a self-standing fixing plate, and the main valve main body is fixed to the skeleton through the fixing plate. Since the surroundings can be further simplified and no fixture for the pipe is used, even in the case of a heated pipe, heat does not escape from the fixture for the pipe, and the generation of reaction by-products in the pipe can be suppressed.
[0032]
(2) According to the second aspect of the present invention, since the second auxiliary valve is configured to be capable of adjusting the flow rate, the necessity of a separate needle valve is eliminated, and the circumference of the pipe can be further simplified.
[0033]
(3) According to the third aspect of the present invention, since the bracket is attached to the frame and the fixing plate is fixed to the bracket, the main valve can be securely fixed to the frame .
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of a main valve.
FIG. 3 is a sectional view of a main part of a main valve.
FIG. 4 is an enlarged sectional view of a second auxiliary valve.
5A and 5B are diagrams showing a mounting structure of a main valve, wherein FIG. 5A is a side view and FIG. 5B is a plan view.
6A and 6B are diagrams showing a conventional main valve mounting structure, in which FIG. 6A is a side view and FIG. 6B is a plan view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heat treatment furnace 12 Exhaust system 13 Exhaust system piping 14 Body 18 Main valve 21 Main body 22 Opening (inlet)
23 opening (exit)
30 first auxiliary valve 31 second auxiliary valve 32, 33 bypass passage 54 fixing plate

Claims (3)

躯体内に熱処理炉を設置し、躯体内から躯体外に配管した熱処理炉の排気系の配管に主弁、第1の補助弁および第2の補助弁を並列に備えた熱処理装置であって、前記主弁の外郭を形成する本体に入口側と出口側を連通するバイパス通路を2本形成し、前記主弁の本体に一方のバイパス通路を開閉する第1の補助弁と、他方のバイパス通路を開閉する第2の補助弁とを設け、前記主弁の本体には自立用の固定板が設けられ、該固定板を介して主弁の本体が前記躯体に固定されていることを特徴とする熱処理装置。A heat treatment apparatus in which a heat treatment furnace is installed in a skeleton , and a main valve, a first auxiliary valve, and a second auxiliary valve are provided in parallel in a pipe of an exhaust system of the heat treatment furnace which is piped from the skeleton to outside the skeleton , A first auxiliary valve that opens and closes one bypass passage in a main body of the main valve, wherein two bypass passages communicating an inlet side and an outlet side are formed in a main body forming an outer shell of the main valve; A main body of the main valve is provided with a self-standing fixing plate, and the main valve main body is fixed to the frame via the fixing plate. Heat treatment equipment. 前記第2の補助弁が流量調整可能に構成されていることを特徴とする請求項1記載の熱処理装置。The heat treatment apparatus according to claim 1, wherein the second auxiliary valve is configured to be capable of adjusting a flow rate. 前記躯体にブラケットを取付け、該ブラケットに前記固定板を固定していることを特徴とする請求項1記載の熱処理装置。The heat treatment apparatus according to claim 1 , wherein a bracket is attached to the frame, and the fixing plate is fixed to the bracket .
JP2001142881A 2001-05-14 2001-05-14 Heat treatment equipment Expired - Fee Related JP3543963B2 (en)

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JP2001142881A JP3543963B2 (en) 2001-05-14 2001-05-14 Heat treatment equipment
TW91133065A TWI265571B (en) 2001-05-14 2002-11-11 Valve device and heat-treating device
PCT/JP2002/011802 WO2004044969A1 (en) 2001-05-14 2002-11-12 Valve unit and heat treatment system
CNB028059387A CN100397577C (en) 2001-05-14 2002-11-12 Valve unit and heat treatment system

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JP2001142881A JP3543963B2 (en) 2001-05-14 2001-05-14 Heat treatment equipment
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DE102006008346B4 (en) * 2006-02-21 2008-06-19 J. Eberspächer GmbH & Co. KG Throttle arrangement and exhaust system equipped with it
JP4816215B2 (en) * 2006-04-14 2011-11-16 株式会社島津製作所 Vacuum processing equipment
JP4806615B2 (en) * 2006-09-28 2011-11-02 株式会社アルバック Exhaust device and exhaust method
CN106051172B (en) * 2016-07-20 2018-08-14 广东万家乐燃气具有限公司 There are two types of the solenoid valves of gas flow state for a kind of tool
CN110600394B (en) * 2018-06-12 2021-12-17 北京北方华创微电子装备有限公司 Exhaust system for semiconductor heat treatment equipment and semiconductor heat treatment equipment
CN108825825B (en) * 2018-06-29 2019-12-03 苏州超磁半导体科技有限公司 A kind of mounting tool of vacuum seal disk

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