JP3540634B2 - Processing device using rotary positioning device and tool - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a rotary positioning device, and more particularly, to a rotary positioning device that controls the displacement and tilt of a tool, a measurement probe, or a work that is mounted on a rotating device and rotates with high accuracy.
In addition, the present invention has applied a rotary positioning device. Using tools It relates to a processing device.
[0002]
[Prior art]
For example, Japanese Unexamined Patent Publication No. Hei 6-210633 discloses a processing apparatus provided with a positioning device for positioning the displacement of a positioning object that makes a rotary motion together with a rotating unit. The configuration of a conventional positioning device and processing device will be described with reference to FIG. FIG. 12 shows a schematic configuration of a processing device provided with a conventional positioning device. The positioning device in the illustrated example is intended to provide a grinding device that realizes mirror surface grinding of a high-hardness material such as a cemented carbide or a hard brittle material such as ceramics or glass.
[0003]
The micro-positioning device 1 incorporates an actuator composed of a piezoelectric element having a rigidity of 20 kgf / μm or more. The micro-positioning device 1 has a grinding wheel spindle 2 mounted thereon, and the grinding wheel spindle 2 has a grinding wheel 3 attached thereto. I have. A machining force measuring device 4 is arranged below the micro-positioning device 1 to measure a reaction force during machining, and at the same time, the displacement amount measuring devices 5 and 6 measure the displacement of the micro-positioning device 1 and the grinding wheel spindle 2. Measured.
[0004]
The signals from the processing force measuring device 4 and the displacement amount measuring devices 5 and 6 are taken into the control device 10 through the amplifiers 7, 8 and 9, and based on the output signals from the processing force measuring device 4 and the displacement amount measuring devices 5 and 6, The cutting amount of the grinding wheel 3 is calculated in the control device 10. Then, a voltage command corresponding to the cut amount is given to the piezoelectric element driver 11, and the minute positioning device 1 is positioned with a resolution of submicron or less. As a result, the grinding wheel spindle 2 is moved with high accuracy, and the grinding wheel 3 to be positioned is finely and precisely cut into the workpiece.
[0005]
[Problems to be solved by the invention]
In the conventional example described above, the rotation device is mounted on the positioning device, and the rotation axis of the rotation device is installed offset from the drive shaft of the positioning device. Therefore, when positioning the displacement of the positioning target by the positioning device, an Abbe error due to the offset occurs in addition to the positioning accuracy of the positioning device, and the positioning of the grinding wheel 3 as the positioning target mounted on the rotating body is performed with high accuracy. There was a problem that it became difficult.
[0006]
On the other hand, in a grinding apparatus for performing high-precision mirror finishing of a silicon wafer, which is one of the application fields of the present invention, a relative displacement between a grinding wheel and a workpiece is minutely and accurately positioned, and the workpiece is positioned. It is necessary to cut the grindstone by a very small amount with submicron accuracy or less, and it is necessary to realize a process generally called ductile mode machining.In the above-mentioned conventional example, a grinding wheel spindle having a grinding wheel is mounted for this positioning. It is performed by a positioning device.
[0007]
However, in recent years, as the size of the silicon wafer to be processed increases in size, the grinding wheel and the grinding wheel spindle for processing the silicon wafer also increase in size, and their total weight reaches the order of several tens of kilograms. It has become. This is due to the non-linear factors such as stick-slip caused by increasing the effect of friction in the guide of the cutting shaft slide against the cutting shaft slide for cutting the silicon wafer with the grinding wheel spindle. Therefore, a positioning error of the cutting shaft slide is increased.
[0008]
In the above-mentioned grinding apparatus, the position of the cutting slide on which the grinding wheel spindle is mounted and the rotation speed of the grinding wheel spindle and the work spindle are controlled, but the grinding wheel spindle and the work spindle mounted on the cutting slide are controlled. There was no means to measure and control the deformation of. Therefore, when the grinding wheel spindle or the work spindle is deformed due to the processing reaction force, there is a problem that the amount of the deformation remains as a shape error of the silicon wafer.
[0009]
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a rotary positioning device capable of performing high-precision and high-speed fine positioning of a displacement / tilt of a positioning target mounted on a rotary unit and rotating with the rotary unit, and the rotary positioning Applied equipment Using tools It is an object to provide a processing device.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the configuration of the rotary positioning device of the present invention is configured such that the positioning target is held while being mounted and mounted on a rotating portion of the rotating device via a base while rotating together with the rotating portion, and the positioning target is held. A rotary displacement table for micro-displacement in a direction parallel to the rotation axis of the rotary unit, a diaphragm fixed to the base and holding and mounting the rotary displacement table, and a plurality of diaphragms provided in the circumferential direction of the base with respect to the base. A displacement measuring device for detecting relative displacement, and the displacement Measurement A controller for converting an output signal of the device into a locus drawn by a normal vector of the diaphragm on a virtual screen and displaying the locus in real time.
[0011]
In order to achieve the above object, a configuration of a processing apparatus using the tool of the present invention is such that a processing tool is mounted on a rotary displacement table of the rotary positioning apparatus according to claim 1 and positioned relative to a workpiece. It can be moved, and the displacement measuring device according to claim 1 To the base due to the load during processing Measure the slope in real time, and from the result When the processing tool is tilted from the desired state with respect to the base Machining with machining tools Bad And processing Bad And control means for determining the selection of the processing conditions and the necessity of correcting the processing tool according to the determination result.
[0012]
And a rotation displacement that holds and mounts the positioning target while rotating with the rotation unit, and minutely displaces the positioning target in a direction parallel to the rotation axis of the rotation unit. A table, a transmitting and receiving device capable of inputting and outputting power and signals required for driving the rotary displacement table in a rotating state by a minute displacement at a fixed portion side, and transmitting and receiving the displacement of the object to be positioned which performs a rotary motion. And a controller that controls the rotary displacement table, and a reinforcing member is provided on the base that holds the rotary displacement table.
[0013]
A base fixed to the rotating portion of the rotating device; a diaphragm fixed to the base for holding and mounting a positioning object; and a plurality of gaps provided in a circumferential direction of the base for detecting a relative displacement of the diaphragm with respect to the base. A sensor for converting a signal of the gap sensor into a locus drawn by a normal vector of the diaphragm on a virtual screen and displaying the locus in real time.
[0014]
In addition, a grindstone attitude measuring device provided on a grindstone spindle that can be positioned and moved relative to the workpiece to measure the inclination of the grindstone, and the inclination of the grindstone in real time according to the measurement information of the grindstone attitude measuring device. A control device is provided for monitoring and determining whether or not the processing is performed under appropriate processing conditions, and for selecting the processing conditions and determining whether or not dressing of the grindstone is necessary based on the determination result.
[0015]
When the rigidity of the base is improved by the reinforcing material and the rotation center axis of the rotary displacement table is horizontally arranged, the displacement error depending on the rotation angle of the rotary displacement table due to the base deformation due to its own weight (rotation angle dependent (Runout error) is suppressed. Thereby, for example, when the rotary positioning device is used for a grinding device for a hard and brittle material such as a silicon wafer, the rotation angle-dependent run-out error generated in the grinding wheel to be positioned is suppressed, and at the same time, a higher Accurate positioning becomes possible, and it is possible to cope with an increase in the size of the silicon wafer without deteriorating the positioning accuracy.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 shows an entire configuration of a rotary positioning device according to an embodiment of the present invention.
[0017]
The rotating device 21 includes a rotating unit 22, a bearing 23 (for example, an aerostatic bearing), and a rotation driving unit 24 (for example, a DC motor). The rotating unit 22 supported by the bearing 23 is rotated by the rotation driving unit 24. It can be rotated. A rotary displacement table 26 holding a positioning object 25 such as a tool, a measurement probe, or a work is mounted on the rotating unit 22. The rotary displacement table 26 rotates the positioning object 25 while rotating with the rotating unit 22. The positioning is performed minutely and with high precision in a direction parallel to the rotation axis of the part 22.
[0018]
At this time, the displacement of the rotary displacement table 26 is minutely driven, and power is supplied to an actuator (for example, a piezoelectric element) that is driven and rotated, and a displacement measuring device (for example, a capacitance type device) capable of measuring the displacement of the rotary displacement table 26 with high accuracy. The displacement output signal from the displacement meter is received via the transmission / reception device 27. The transmission / reception device 27 is configured by, for example, a slip ring capable of inputting / outputting a signal from the rotating body to a fixed outside.
[0019]
In this embodiment, the power supply and displacement output signal cable from the rotary displacement table 26 to the transmission / reception device 27 has a structure in which the rotating device 21 is hollow and passes therethrough.
[0020]
The displacement output signal output to the outside of the rotation device 21 via the transmission / reception device 27 is amplified by the displacement measurement device amplifier 28 and then taken into the controller 29. The controller 29 calculates the displacement to be moved by the rotational displacement table 26 based on the taken displacement output signal, calculates the command voltage to be input to the actuator, and outputs the result to the actuator amplifier 30. The actuator amplifier 30 amplifies the command voltage, and then outputs the amplified signal to the actuator as supply power via the transmission / reception device 27, whereby the displacement of the rotational displacement table 26 is finely and highly accurately positioned.
[0021]
The details of the rotational displacement table 26 will be described with reference to FIGS. FIG. 2 shows a cross-sectional side view of the rotary displacement table 26, and FIG.
[0022]
The rotational displacement table 26 has a movable part 31, an elastic guide mechanism 32, displacement measuring devices 33a, 33b, 33c, actuators 34a, 34b, 34c, and a base 35 as main components. The movable portion 31 is elastically supported by being disposed at the center of a thin disk-shaped (axially symmetric) elastic guide mechanism 32 whose outer periphery is fixed to the base 35. Between the movable part 31 and the base 35, three actuators 34a, 34b and 34c, one end of which is fixed to the base 35 and the other end of which is machined in a spherical shape, are arranged at 120 degrees with respect to the rotation axis. ing.
[0023]
The movable portion 31 is provided with three pressurized screws 38, and a square pyramid seat is formed on the lower surface of the pressurized screw 38. By dropping the spherical shape machined at the other end of the actuators 34a, 34b, 34c into the square pyramid seat of the pressurized screw 38, the actuators 34a, 34b, 34c are each held rotatably, and at the same time, the actuators 34a, 34b are held. , 34c can be adjusted. Thereby, the displacement of the actuators 34a, 34b, 34c can be transmitted to the movable portion 31 reliably.
[0024]
On the other hand, in order to independently measure the displacements of the three actuators 34a, 34b, 34c, three displacement amount measuring devices 33a, 33b, 33c are provided near the actuators 34a, 34b, 34c. The displacement measuring devices 33a, 33b, and 33c are fixed to the base 35, and the displacement of the movable portion 31 is measured by measuring the displacement of the lower surface of the target 61 disposed on the movable portion 31. Note that the pressurizing screw 38 and the target 61 are fixed to the movable portion 31 by lock nuts 62 and 63, respectively, to prevent loosening.
[0025]
The configuration of the base 35 will be described with reference to FIGS. FIG. 4 shows a front view of the base 35, and FIG. 5 shows a view taken along line VV in FIG.
[0026]
As shown in the drawing, twelve radial ribs 71a to 71l as reinforcing members are arranged inside the base 35 radially from the central axis and axially symmetrically and evenly. Further, inside the base 35, a circumferential rib 72 as a reinforcing material is disposed concentrically around the base 35. The radial ribs 71a to 71l and the circumferential rib 72 are integrally formed with the base 35 so as to prevent the rigidity from being reduced by using a separate component.
[0027]
FIG. 6 shows a control block of the controller 29 in the rotating device 21 described above.
[0028]
The displacement output signal from the displacement measuring device 33 incorporated in the rotational displacement table 26 is input to the displacement measuring device amplifier 28 via the transmission / reception device 27. The signal output from the displacement measuring device amplifier 28 is filtered by a noise filter 42 to remove high-frequency noise components, and then compared with a command voltage from a signal generator 44 by a comparator 43 to obtain an error signal. Thereafter, the error signal is subjected to signal processing by a gain adjuster 45, an integrator 46, and a notch filter 47, and is input to the actuator amplifier 30.
[0029]
Further, an output signal from the actuator amplifier 30 is input to the actuators 34a, 34b, and 34c via the transmission / reception device 27, whereby the displacement amounts of the actuators 34a, 34b, and 34c are feedback-controlled. That is, when the displacement output signal from the displacement measuring device 33 is larger than the command voltage, the controller 29 controls the actuators 34a, 34b, 34c to contract, and in the opposite case, extends the actuators 34a, 34b, 34c. By controlling as described above, the displacement of the movable portion 31 is adjusted via the target 61. At this time, since the movable portion 31 is supported by the elastic guide mechanism 32, the movable portion 31 can be finely and highly accurately positioned without being affected by the friction or the friction generated by the rolling guide and the sliding guide.
[0030]
That is, when the command voltages input to the actuators 34a, 34b, 34c are the same, the actuators 34a, 34b, 34c expand and contract by the same amount of displacement. Therefore, the movable part 31 with which the actuators 34a, 34b, and 34c come into contact moves minutely and with high precision in parallel with the rotation axis of the rotating part 22 (see FIG. 1). If the command voltages input to the actuators 34a, 34b, 34c have different values, the actuators 34a, 34b, 34c are independently displaced in accordance with the different command voltages. Therefore, the movable section 31 is slightly inclined with respect to the rotation axis of the rotating section 22 (see FIG. 1).
[0031]
In the embodiment described above, an example is described in which three actuators 34a, 34b, 34c and three displacement measurement devices 33a, 33b, 33c are used, but the number of actuators and displacement measurement devices is four. By using a book or more, it is possible to perform more uniform and accurate tilt control.
[0032]
On the other hand, since the radial ribs 71a to 71l and the circumferential rib 72 are integrally formed with the base 35 on the rotary displacement table 26 and the base 35, high rigidity is secured. That is, as a result of measuring a displacement error (rotation angle-dependent shake error) depending on the rotation angle of the rotation displacement table 26, the displacement amplitude falls within 50 nm as shown in FIG. 7, and the rotation angle-dependent shake error is suppressed. .
[0033]
Accordingly, when the rotation center axis of the rotation displacement table 26 is horizontally arranged, the rotation angle-dependent shake error of the rotation displacement table 26 due to the deformation of the base 35 due to its own weight is suppressed. Therefore, when the rotary positioning device is used, for example, in a grinding device for a hard and brittle material such as a silicon wafer, the rotation angle-dependent run-out error generated in the grinding wheel to be positioned is suppressed, and at the same time, higher accuracy is achieved. This makes it possible to perform accurate positioning, and to cope with an increase in the diameter of the silicon wafer without deteriorating the positioning accuracy.
[0034]
Next, another embodiment of the present invention will be described with reference to FIGS. 8 shows a cross section of a rotary type positioning apparatus according to another embodiment of the present invention, FIG. 9 shows a view taken along line IX-IX in FIG. 8, and FIG. 10 shows a concept for explaining a tool posture positioning method. is there. The present embodiment assumes a general machine on which a rotating tool, for example, a drill, an end mill, a milling cutter, a grindstone or the like is mounted.
[0035]
As shown in FIGS. 8 and 9, a base plate 82 as a base is fastened to a spindle 81 as a rotating portion of the rotating device, and a diaphragm 83 having a disk-shaped parallel leaf spring structure is mounted on the base plate 82 as an out support 84. The outer peripheral portion is fixed by this, and a tool 85 is attached to the diaphragm 83.
[0036]
Three cap sensors 86 are arranged on the base plate 82 at equal intervals on the circumference, and the gap sensor 86 measures the gap between the base plate 82 and the diaphragm 83. The signal from the gap sensor 86 is taken into an external signal processing device 88 via a rotary joint 87 attached to the rear end through the axis of the spindle 81.
[0037]
That is, the tool 85 is attached to the base plate 82 via the grindstone attitude measuring device 80 including the diaphragm 83, the out support 84, and the gap sensor 86.
[0038]
When a load 89 is applied to the tool 85 being processed, the diaphragm 83 is elastically deformed, so that a relative displacement occurs between the base plate 82 and the diaphragm 83. This relative displacement is measured by gap sensors 86 arranged at equal intervals, and transmitted to a signal processing device 88 via a rotary joint 87.
[0039]
As shown in FIG. 10, the signal processing device 88 receives the signals of the three gap sensors 86 and calculates a normal vector 90 on a diaphragm surface which is uniquely determined geometrically from the signals. Then, the inclination (posture) of the rotating tool 85 with respect to the base plate 82 can be detected by drawing this in real time as a trajectory when this is projected onto a virtually erected screen 91.
[0040]
Therefore, by detecting the inclination of the tool 85, it is possible to know that the tool 85 is blinded or clogged, to prevent defective cutting or abnormal vibration, and to determine whether the tool 85 is to be straightened or automatically replaced. Can be automated.
[0041]
Next, the rotary positioning device described above with reference to FIG. Using tools An example in which the present invention is applied to a (processing apparatus) will be described. FIG. 11 shows a plan view of a semiconductor wafer grinding apparatus.
[0042]
A work spindle 93 is mounted on a feed slide 92 that reciprocates in the X-axis direction in the figure, and a grindstone spindle 95 is mounted on a cutting slide 94 that reciprocates in the Z-axis direction in the figure. The work spindle 93 and the grindstone spindle 95 They are facing each other.
[0043]
The cutting slide 94 is fed and driven in the Z-axis direction in the figure by a cutting slide drive motor 96, and the movement of the cutting slide 94 is measured by a cutting slide position sensor 97. The measurement signal of the cutting slide position sensor 97 is fed back by the control device 98, and high-precision positioning control is executed. The feed slide 92 is fed in the X-axis direction in the figure by a feed slide drive motor 99, and the movement of the feed slide 92 is measured by a feed slide position sensor 100. The measurement signal of the feed slide position sensor 100 is fed back by the control device 98, and high-precision positioning control is executed. The number of rotations of the work spindle 93 and the grindstone spindle 95 is controlled by a control device 98.
[0044]
The grindstone 103 is attached to the grindstone spindle 95 via the grindstone posture measuring device 80 shown in FIGS. The work spindle 93 is provided with a wafer chuck device 101, and the wafer 102 is fixed to the wafer chuck device 101. The signals of the three gap sensors 86 of the grindstone attitude measuring device 80 are taken out to the outside via a rotary joint 87 arranged at the rear end of the grindstone spindle 95, and are taken into a signal processing device 88.
[0045]
In the semiconductor wafer grinding apparatus described above, first, the feed slide 92 is positioned so that the outer peripheral portion of the grindstone 103 is at the center of rotation of the wafer 102. Thereafter, the work spindle 93 and the grindstone spindle 95 are rotated at a predetermined rotation speed, and the cutting slide 94 is moved at a low speed in the Z-axis direction in the figure. After the grinding stone 103 and the wafer 102 come into contact with each other, the cutting slide 94 is advanced in the Z-axis direction by a predetermined amount, and then the cutting slide 94 is retracted (−Z-axis direction in the drawing). When the tool 103 and the wafer 102 are completely separated, the cutting slide 94, the grindstone spindle 95, and the work spindle 93 are stopped, and the processing of the wafer 102 is completed.
[0046]
The grindstone 103 and the grindstone spindle 95 during the processing rotate while receiving a processing reaction force in the −Z-axis direction and the X-axis direction in the drawing. This inclination is measured by the gap sensor 86 of the grindstone attitude measuring device 80, and is displayed in real time as a locus drawn by the normal vector 90 of the grindstone 103 by the signal processing device 88 by the method shown in FIGS.
[0047]
Therefore, by detecting the inclination of the grindstone 103, it is possible to know whether the grindstone 103 is blinded or clogged, etc., to determine the necessity of selecting the processing conditions and the dressing of the grindstone 103, and to prevent cutting failure and abnormal vibration. Can be prevented. At this time, the inclination can be automatically corrected by adding a controller, an actuator, and the like.
[0048]
The above-described rotary positioning device is mounted and mounted on a rotating portion of the rotating device via a base, holds the positioning target while rotating with the rotating portion, and moves the positioning target in a direction parallel to the rotation axis of the rotating portion. A rotary displacement table for micro-displacement, a transmitting and receiving device capable of inputting and outputting power and signals required for micro-displacement driving of the rotating rotary displacement table in a rotating state, and the positioning object performing rotary motion And a controller for controlling the displacement of the object through the transmission / reception device, and a reinforcing member is provided on the base for holding the rotational displacement table, and a rotational displacement table for positioning the displacement and inclination of the positioning object. Is mounted on the rotating part of the rotating device so that the drive shaft of the rotary displacement table and the rotating axis of the rotating part can be matched, It is possible to improve the positioning accuracy of the positioning object by eliminating errors have occurred by the offset of the rotation axis.
[0049]
In addition, since the rigidity of the base constituting the rotary displacement table is improved by the reinforcing material, a displacement error (rotation angle dependent run-out error) depending on the rotation angle of the rotary displacement table caused by deformation of the base due to its own weight of the rotary displacement table. Can be suppressed. As a result, when the rotary positioning device is used for, for example, a grinding device for a hard and brittle material such as a silicon wafer, a rotation angle-dependent run-out error generated in a grinding wheel to be positioned is suppressed, and at the same time, a higher level is achieved. Accurate positioning becomes possible, and it is possible to cope with an increase in the size of the silicon wafer without deteriorating the positioning accuracy.
[0050]
In addition, the above-described rotary positioning device includes a base fastened to a rotating part of the rotary device, a diaphragm fixed to the base and holding and mounting a positioning target, and a plurality of diaphragms provided in a circumferential direction of the base with respect to the base. A gap sensor that detects the relative displacement of the sensor, and a controller that converts the signal of the gap sensor into a locus drawn by a normal vector of the diaphragm on a virtual screen and displays the locus in real time, so that the controller is attached to the rotating unit. It is possible to detect the inclination of a tool or the like that has been cut, and it is possible to prevent cutting defects and abnormal vibrations.
[0051]
In addition, the above-described rotary positioning device is provided on a grindstone spindle that is provided on a grindstone spindle that can be relatively positioned and moved with respect to the workpiece, and a grindstone posture measuring device in which the inclination of the grindstone is measured, according to measurement information of the grindstone posture measuring device. A control device that monitors the inclination of the grindstone in real time and determines whether or not machining is being performed under appropriate machining conditions, and selects a machining condition based on the determination result and determines whether or not dressing of the grindstone is necessary. Therefore, the inclination of the grindstone can be detected, and it is possible to know whether the grindstone is crushed or clogged, etc., and it is possible to select the processing conditions and determine the necessity of dressing the grindstone to prevent cutting defects and abnormal vibration. It is possible to do.
[0052]
【The invention's effect】
The rotary positioning device of the present invention holds and mounts the positioning target while rotating and rotating with the rotary unit on the rotary unit of the rotary device via a base, and holds the positioning target parallel to the rotation axis of the rotary unit. A rotational displacement table for minute displacement in a direction, a diaphragm fixed to the base for holding the rotational displacement table, and a plurality of displacement measuring devices provided in a circumferential direction of the base for detecting relative displacement of the diaphragm with respect to the base. And the displacement amount Measurement It has a controller that converts the output signal of the device into a locus drawn by the normal vector of the diaphragm on a virtual screen and displays it in real time, so that it is possible to detect the inclination of a tool or the like attached to the rotating part Thus, defective cutting and abnormal vibration can be prevented.
[0053]
According to a first aspect of the present invention, there is provided a machining apparatus using the tool according to the first aspect, wherein a machining tool is attached to the rotary displacement table of the rotary positioning apparatus according to the first aspect so as to be relatively movable with respect to a workpiece. With displacement measuring device To the base due to the load during processing Measure the inclination of the machining tool in real time, and from the result When the processing tool is tilted from the desired state with respect to the base Machining with machining tools Bad And processing Bad Control means for selecting the processing conditions and determining whether or not the processing tool needs to be corrected based on the determination result of To the base due to the load during processing The inclination can be detected, the state of the processing tool can be known, the selection of processing conditions and the necessity of correction of the processing item part can be determined, and processing defects and abnormal vibration can be prevented beforehand. .
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of a rotary positioning device according to an embodiment of the present invention.
FIG. 2 is a side cross-sectional view of a rotary displacement table according to one embodiment.
FIG. 3 is a front view of a rotary displacement table according to one embodiment;
FIG. 4 is a front view of a base.
FIG. 5 is a view taken along line VV in FIG. 4;
FIG. 6 is a control block diagram of a rotational displacement table.
FIG. 7 is a graph showing a result of a rotation angle-dependent shake error.
FIG. 8 is a sectional view of a rotary positioning device according to another embodiment of the present invention.
FIG. 9 is a view taken along line IX-IX in FIG. 8;
FIG. 10 is a conceptual diagram illustrating a tool posture positioning method.
FIG. 11 is a plan view of a semiconductor wafer grinding apparatus.
FIG. 12 is a schematic configuration diagram of a conventional grinding apparatus.
[Explanation of symbols]
21 Rotating device
22 Rotating part
23 Bearing
24 rotation drive means
25 Positioning target
26 Rotational displacement table
27 Transceiver
28 Amplifier for displacement measurement device
29 Controller
31 Moving parts
32 elastic guide mechanism
33 Displacement measuring device
34 Actuator
35 base
38 Pressurized screw
42 Noise Filter
43 Comparator
44 signal generator
45 Gain adjuster
46 Integrator
47 Notch filter
61 Target
62, 63 Lock nut
71 Radial rib
72 cylindrical rib

Claims (2)

A rotation displacement table that holds and mounts the positioning target while rotating with the rotation unit and that is held and mounted on the rotation unit of the rotation device via a base, and that minutely displaces the positioning target in a direction parallel to the rotation axis of the rotation unit; ,
A diaphragm fixed to the base and holding the rotational displacement table;
A displacement amount measurement device that is provided in the circumferential direction of the base and detects relative displacement of the diaphragm with respect to the base,
A rotary positioning device comprising: a controller that converts an output signal of the displacement measuring device into a locus drawn by a normal vector of the diaphragm on a virtual screen and displays the locus in real time. A machining tool is attached to the rotary displacement table of the rotary positioning device according to claim 1 so as to be relatively movable with respect to the workpiece,
The displacement measuring device according to claim 1, wherein the inclination of the machining tool with respect to the base due to the load during machining is measured in real time,
A control means is provided for judging a machining defect by the machining tool when the machining tool is tilted from a desired state with respect to the base from the result, and for selecting machining conditions and necessity of correction of the machining tool based on the decision result of the machining defect. A processing device using a tool characterized by the following.

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