JP3531370B2 - Laser processing method and apparatus - Google Patents
Laser processing method and apparatusInfo
- Publication number
- JP3531370B2 JP3531370B2 JP18963496A JP18963496A JP3531370B2 JP 3531370 B2 JP3531370 B2 JP 3531370B2 JP 18963496 A JP18963496 A JP 18963496A JP 18963496 A JP18963496 A JP 18963496A JP 3531370 B2 JP3531370 B2 JP 3531370B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- laser beam
- laser
- irradiation power
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laser Beam Processing (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、レーザ加工によ
って被加工材の切断加工を行うレーザ加工方法及びレー
ザ加工装置に関するもので、特に、加工開始点の穴明け
作業から、次の工程の切断加工へ移行する際、加工条件
を変化させるレーザ加工方法及びその装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a laser processing apparatus for cutting a material to be processed by laser processing, and in particular, from a drilling operation at a processing start point to a cutting processing in the next step. The present invention relates to a laser processing method and apparatus for changing the processing conditions when shifting to.
【０００２】[0002]
【従来の技術】一般に、レーザビームを用いて金属材料
の切断加工を行う場合には、加工開始点で１回のレーザ
ビーム照射を行い、それによって穴明け作業を行った
後、穴明け作業を行った加工開始点から切断加工へと移
行させている。しかし、被加工材が可燃性材料のように
燃焼し易い材料の切断加工においては、１回のレーザビ
ームの照射によって加工開始点の穴明け作業を行った後
に切断加工へと移行した場合、この切断加工への移行時
に加工不具合の生じることがある。例えば、この不具合
としては、入熱不足による加工開始点での切れ残りと、
逆に、入熱不足による不具合を防止する際に発生する不
具合として、レーザビームの照射パワーを高く設定した
際に発生する入熱過多による加工開始点の穴底部の異常
な拡がりがある。2. Description of the Related Art Generally, when cutting a metal material using a laser beam, laser beam irradiation is performed once at a processing start point, and after that, a drilling operation is performed and then a drilling operation is performed. The processing starting point is changed to cutting. However, in the cutting of a material such as a flammable material in which the material to be processed is easily combusted, when the cutting work is performed after the processing start point is drilled by one laser beam irradiation, Machining defects may occur when shifting to cutting. For example, as this defect, there is an uncut portion at the processing start point due to insufficient heat input,
On the other hand, as a problem that occurs when preventing a problem due to insufficient heat input, there is an abnormal expansion of the hole bottom portion at the processing start point due to excessive heat input that occurs when the irradiation power of the laser beam is set high.
【０００３】図８は従来のレーザ加工によって入熱不足
で被加工材の切断加工を行うレーザ加工方法の説明図
で、（ａ）は断面図、（ｂ）は底面図である。また、図
９は従来のレーザ加工によって入熱過多で被加工材の切
断加工を行うレーザ加工方法の説明図で、（ａ）は断面
図、（ｂ）は底面図である。図８及び図９において、１
は照射パワーを低く設定して入熱不足にあるレーザビー
ム、或いは照射パワーを高く設定して入熱過多にあるレ
ーザビーム、２はレーザビーム１を集光する集光光学部
品としての集光レンズ、Ａは加工開始点、Ｂは加工途中
を含む加工終了点、５は加工開始点Ａ付近の加工開始部
の底部位置にある残存部分、６は加工開始点Ａに発生す
る加工開始穴、７はレーザビーム１の移動方向、８はレ
ーザビーム１による切断除去領域、９は可燃性材料から
なる被加工材である。FIGS. 8A and 8B are explanatory views of a conventional laser processing method for cutting a workpiece due to insufficient heat input, FIG. 8A being a sectional view and FIG. 8B being a bottom view. 9A and 9B are explanatory views of a conventional laser processing method for cutting a workpiece with excessive heat input by laser processing. FIG. 9A is a sectional view and FIG. 9B is a bottom view. 8 and 9, 1
Is a laser beam with low heat input and low heat input, or a laser beam with high heat input and high heat input.
Laser beam , 2 is a condensing lens as a condensing optical component for condensing the laser beam 1, A is a processing start point, B is a processing end point including the middle of processing, 5 is a bottom of the processing start portion near the processing start point A The remaining portion at the position, 6 is a processing start hole generated at the processing start point A, 7 is the moving direction of the laser beam 1, 8 is a cutting removal area by the laser beam 1, and 9 is a work material made of a flammable material. .
【０００４】図８に示すように、入熱不足によるレーザ
加工では、加工開始点Ａで加工開始穴６が穿設され、レ
ーザビーム１は移動方向７側の移動を行い、その後、加
工終了点Ｂで加工を停止したとする。この入熱不足によ
るレーザ加工では、加工開始点Ａの付近に、加工開始穴
６が穿設されてからレーザビーム１を移動方向７に移動
を行うから、加工開始穴６の下部が入熱不足の状態でレ
ーザビーム１が移動するから、加工開始穴６の下部付近
に残存部分５が生じる。即ち、加工開始穴６が穿設され
てしまうと、レーザビーム１が移動方向７に対して入熱
を行わない状態となり、そこで、レーザビーム１が移動
を行うと加工開始穴６の下部が入熱不足の状態で他のレ
ーザビーム１の移動方向７に入熱するから、加工開始穴
６の下部付近のエネルギー不足により残存部分５が生じ
る。逆に、入熱過多になると、図９に示すように、入熱
過多によるレーザ加工により、加工開始点Ａで加工開始
穴６が穿設され、レーザビーム１は移動方向７側の移動
を行い、その後、加工終了点Ｂで加工を停止したとす
る。この入熱過多によるレーザ加工においても、加工開
始点Ａを中心に、加工開始穴６が穿設されるが、入熱過
多によるレーザ加工ではレーザビーム１の反入射面側の
穴底部側が拡がり、その径が大きくなる。その後、レー
ザビーム１を移動方向７に移動を行うが、このときの加
工幅に比較して、加工開始穴６の底部が拡がり、均一幅
の切断除去領域８が得られず、悪い仕上りとなる。As shown in FIG. 8, in laser processing due to insufficient heat input, a processing start hole 6 is bored at the processing start point A, the laser beam 1 moves in the moving direction 7 side, and then the processing end point. It is assumed that the processing is stopped at B. In the laser processing due to this insufficient heat input, since the laser beam 1 is moved in the moving direction 7 after the processing start hole 6 is formed near the processing start point A, the heat input is insufficient at the lower part of the processing start hole 6. Since the laser beam 1 moves in this state, a residual portion 5 is formed near the lower portion of the processing start hole 6. That is, when the processing start hole 6 is bored, the laser beam 1 does not heat in the moving direction 7, and when the laser beam 1 moves, the lower part of the processing start hole 6 enters. Since the heat is input in the moving direction 7 of the other laser beam 1 in a heat-insufficient state, the remaining portion 5 is generated due to the energy shortage near the lower portion of the processing start hole 6. On the contrary, if the heat input is excessive, as shown in FIG. 9, the laser beam 1 is moved in the moving direction 7 side by the laser processing due to the excessive heat input to form the processing start hole 6 at the processing start point A. Then, it is assumed that the processing is stopped at the processing end point B. Also in the laser processing due to this excessive heat input, the processing start hole 6 is formed around the processing start point A, but in the laser processing due to excessive heat input, the hole bottom side on the side opposite to the incident surface of the laser beam 1 expands, Its diameter increases. After that, the laser beam 1 is moved in the moving direction 7, but the bottom of the processing start hole 6 expands as compared with the processing width at this time, and the cutting removal region 8 having a uniform width cannot be obtained, resulting in a bad finish. .
【０００５】[0005]
【発明が解決しようとする課題】このように、従来のレ
ーザ加工方法は、可燃性材料のように燃焼し易い素材を
被加工材９とする場合の切断加工でも、金属材料の切断
加工の場合と同様に、１回のレーザビーム照射によっ
て、加工開始点Ａの穴明け作業を行っている。したがっ
て、入熱不足によって加工開始点Ａでの切れ残りが生じ
たり、これを防止する目的でレーザ照射パワーを高く設
定した場合には、入熱過多によって加工開始穴６の底部
が異常な拡がりを呈したりするという不都合があった。As described above, according to the conventional laser processing method, even in the case where the material 9 which is easily combustible such as the combustible material is used as the material to be processed 9, the cutting processing is performed on the metal material. Similarly to the above, the drilling work of the processing start point A is performed by one laser beam irradiation. Therefore, when the laser irradiation power is set high for the purpose of preventing uncut portions at the processing start point A due to insufficient heat input, or excessive heat input, the bottom portion of the processing start hole 6 may expand abnormally. There was the inconvenience of presenting it.
【０００６】そこで、この発明は前述の如き問題点を解
決するためになされたもので、加工開始点で入熱不足や
入熱過多による加工の不具合の発生もなく、切断断面が
良好な切断加工が実現できるレーザ加工方法及びレーザ
加工装置の提供を課題とするものである。Therefore, the present invention has been made to solve the above-mentioned problems, and there is no problem of processing due to insufficient heat input or excessive heat input at the processing start point, and a cutting process with a good cutting cross section. Processing method and laser capable of realizing
It is an object to provide a processing device .
【０００７】請求項１にかかるレーザ加工方法は、可燃
性材料のように燃焼しやすい被加工材を、レーザビーム
を高エネルギー密度に集光した熱源を用いて加工するレ
ーザ加工方法において、前記被加工材の加工開始点から
加工経路に沿った所定の距離を、複数回のレーザ加工に
より、加工開始穴を貫通させ、その後、次の切断加工動
作へと移行するものである。A laser processing method according to a first aspect of the present invention is a laser processing method for processing a material that easily burns, such as a flammable material, using a heat source that focuses a laser beam at a high energy density. from the machining start point of the workpiece
Predetermined distance along the processing path for multiple laser processing
More, the machining start hole is penetrated, then, it is to transition to the next cutting operation.
【０００８】請求項２にかかるレーザ加工方法は、更
に、前記加工開始穴を貫通させた後、被加工材の表面に
対して任意の所定量だけレーザビームの集光ポイントを
上方または下方へ変位させ、レーザビームを照射し、前
記被加工材の切断溝を所望の形状に形成するものであ
る。In the laser processing method according to a second aspect of the present invention, further, after the processing start hole is penetrated, the converging point of the laser beam is displaced upward or downward by an arbitrary predetermined amount with respect to the surface of the workpiece. And irradiating with a laser beam to form the cut groove of the workpiece in a desired shape.
【０００９】請求項３にかかるレーザ加工方法は、前記
加工経路に沿って行う複数回のレーザ加工を、初回と第
２回目以降のレーザビームの照射パワーを変化させるも
のである。In the laser processing method according to the third aspect, the irradiation power of the laser beam is changed between the first time and the second and subsequent laser processes performed a plurality of times along the processing path.
【００１０】請求項４にかかるレーザ加工方法は、請求
項１乃至請求項３の何れか１つに記載の前記加工経路に
沿って行う複数回のレーザ加工を、初回のレーザビーム
の照射パワーで被加工材の板厚の１／３乃至２／３程度
の深さまで除去し、第２回目以降のレーザビームの照射
パワーを前記初回の照射パワーよりも低く設定して残存
部分の除去を行うものである。According to a fourth aspect of the present invention, there is provided a laser processing method, wherein laser processing is performed a plurality of times along the processing path according to any one of the first to third aspects with an irradiation power of a first laser beam. Removal to a depth of about ⅓ to ⅔ of the plate thickness of the work material, and the remaining portion is removed by setting the irradiation power of the second and subsequent laser beams lower than the irradiation power of the first time. Is.
【００１１】請求項５にかかるレーザ加工装置は、可燃
性材料のように燃焼しやすい被加工材に対してレーザビ
ームを照射する加工ヘッドと、前記加工ヘッドと前記被
加工材との位置制御を行う制御・電源装置とを備えたレ
ーザ加工装置において、前記制御・電源装置は、前記被
加工材の加工開始点から加工経路に沿った所定の距離
を、前記加工ヘッドから照射されるレーザビームによる
複数回のレーザ加工により加工開始穴を貫通させ、次の
切断加工動作へと移行するように動作するものである。 According to a fifth aspect of the present invention, there is provided a laser processing apparatus for a laser beam for a work material such as a combustible material which is easily burnt.
A processing head for irradiating a beam, the processing head and the workpiece.
In a laser processing apparatus provided with a control / power supply device for position control with respect to a processing material, the control / power supply device is
A predetermined distance along the machining path from the machining start point of the machining material
By the laser beam emitted from the processing head
The processing start hole is penetrated by multiple times of laser processing, and the next
It operates so as to shift to the cutting operation.
【００１２】請求項６にかかるレーザ加工装置は、更
に、前記加工開始穴を貫通させた後、被加工材の表面に
対して任意の所定量だけレーザビームの集光ポイントを
上方または下方へ変位させ、レーザビームを照射し、前
記被加工材の切断溝を所望の形状に形成するものであ
る。According to a sixth aspect of the present invention, in the laser processing apparatus, after the processing start hole is further penetrated, the converging point of the laser beam is displaced upward or downward by an arbitrary predetermined amount with respect to the surface of the workpiece. And irradiating with a laser beam to form the cut groove of the workpiece in a desired shape.
【００１３】請求項７にかかるレーザ加工装置は、請求
項５または請求項６に記載の前記加工経路に沿って行う
複数回のレーザ加工を、初回と第２回目以降のレーザビ
ームの照射パワーを変化するものである。According to a seventh aspect of the present invention, there is provided a laser processing apparatus which performs processing along the processing route according to the fifth or sixth aspect.
The laser processing is performed a plurality of times to change the irradiation power of the laser beam for the first time and the second time and thereafter.
【００１４】請求項８にかかるレーザ加工装置は、請求
項５乃至請求項７の何れか１つに記載の初回のレーザビ
ームの照射パワーで被加工材の板厚の１／３乃至２／３
程度の深さまで除去し、第２回目以降のレーザビームの
照射パワーを前記初回の照射パワーよりも低く設定して
残存部分の除去を行うものである。According to an eighth aspect of the present invention, there is provided a laser processing apparatus in which the irradiation power of the first laser beam according to any one of the fifth to seventh aspects is 1/3 to 2/3 of the plate thickness of the workpiece.
The remaining power is removed by removing to a certain depth and setting the irradiation power of the second and subsequent laser beams lower than the irradiation power of the first time.
【００１５】請求項９にかかるレーザ加工装置は、請求
項５乃至請求項８の何れか１つに記載の前記加工経路に
沿って行う複数回のレーザ加工における初回のレーザビ
ームの照射パワーと第２回目以降のレーザビームの照射
パワーを、パルス発振制御によって決定するものであ
る。According to a ninth aspect of the present invention, there is provided a laser processing apparatus, wherein the first laser beam irradiation power and the first laser beam irradiation power in a plurality of times of laser processing performed along the processing path according to any one of the fifth to eighth aspects. The irradiation power of the laser beam from the second time onward is determined by pulse oscillation control.
【００１６】[0016]
【発明の実施の形態】以下、この発明の実施の形態につ
いて説明する。図１はこの発明の一実施の形態のレーザ
加工機の全体構成図、図２はこの発明の一実施の形態の
レーザ加工機のレーザビームの制御を行う制御系の制御
回路図である。図１において、１１はレーザ加工機の機
械系のベースとなるベッド、１２はベッド１１の上に載
置され、ベッド１１との間でＸ軸方向の移動のみを許容
されているメインテーブル、１３はメインテーブル１２
の上に載置され、メインテーブル１２との間でＹ軸方向
の移動のみを許容されているサブテーブルである。ま
た、１４はメインテーブル１２をベッド１１に対してＸ
軸方向に移動させるサーボモータ等からなるＸ軸駆動モ
ータ、１５はサブテーブル１３をメインテーブル１２に
対してＹ軸方向に移動させるサーボモータ等からなるＹ
軸駆動モータである。９は可燃性材料からなる被加工材
で、サブテーブル１３の上に図示しない固定具で固定さ
れる。１６はレーザを発振させるレーザ発振器、１７は
レーザビーム１の管路、１８は加工機本体で、ここでは
その構成部材の一部を示すものである。１９は後述する
加工ヘッド２０を上下動、即ち、メインテーブル１２及
びサブテーブル１３に対してＺ軸方向に移動させるサー
ボモータ等からなるＺ軸駆動モータで、加工機本体１８
に取付けられている。２０は加工ヘッドで、Ｚ軸駆動モ
ータ１９によってＺ軸方向に移動させられる。２は集光
光学部品としての集光レンズである。３０はコンピュー
タ等からなる制御・電源装置で、Ｘ軸駆動モータ１４、
Ｙ軸駆動モータ１５、Ｚ軸駆動モータ１９及びレーザ発
振器１６等に接続され、プログラム制御により、メイン
テーブル１２をベッド１１に対してＸ軸方向に移動させ
たり、サブテーブル１３をメインテーブル１２に対して
Ｙ軸方向に移動させたり、加工ヘッド２０をメインテー
ブル１２に対してＺ軸方向に移動させたりする。また、
レーザ発振器１６を連続発振（ＣＷ）またはパルス発振
（ＰＷ）させる電流を出力する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 is an overall configuration diagram of a laser processing machine according to an embodiment of the present invention, and FIG. 2 is a control circuit diagram of a control system for controlling a laser beam of the laser processing machine according to the embodiment of the present invention. In FIG. 1, 11 is a bed which is a base of a mechanical system of the laser processing machine, 12 is a main table which is placed on the bed 11 and is allowed to move only in the X-axis direction with the bed 11, 13 Is the main table 12
The sub-table is placed on the table and is allowed to move only in the Y-axis direction with the main table 12. Further, 14 is the main table 12 with respect to the bed 11 X
An X-axis drive motor including a servo motor that moves in the axial direction, and a Y including a servo motor that moves the sub table 13 in the Y-axis direction with respect to the main table 12
It is a shaft drive motor. A work material 9 made of a flammable material is fixed on the sub-table 13 by a fixture (not shown). Reference numeral 16 is a laser oscillator that oscillates a laser, 17 is a conduit for the laser beam 1, and 18 is a processing machine main body, which shows a part of its constituent members. Reference numeral 19 denotes a Z-axis drive motor including a servo motor or the like that moves a machining head 20 described later up and down, that is, moves in the Z-axis direction with respect to the main table 12 and the sub-table 13.
Installed on. A processing head 20 is moved in the Z-axis direction by a Z-axis drive motor 19. Reference numeral 2 denotes a condenser lens as a condenser optical component. Reference numeral 30 denotes a control / power supply device including a computer and the like. The X-axis drive motor 14,
It is connected to the Y-axis drive motor 15, the Z-axis drive motor 19, the laser oscillator 16, etc., and moves the main table 12 in the X-axis direction with respect to the bed 11 or the sub-table 13 with respect to the main table 12 by program control. And moves the processing head 20 in the Z-axis direction with respect to the main table 12. Also,
The current that causes the laser oscillator 16 to continuously oscillate (CW) or pulse (PW) is output.
【００１７】図２において、１６は前述したレーザ発振
器、２５は部分反射ミラー、２６は全反射ミラー、２７
は放電電極、２８は共振器内に封入されたレーザ媒質の
混合ガス、１はレーザ発振器１６から出射（出力）した
レーザビーム、３０は前述した連続発振（ＣＷ）または
パルス発振（ＰＷ）を行わせる電流を出力すると共に、
Ｘ軸駆動モータ１４、Ｙ軸駆動モータ１５、Ｚ軸駆動モ
ータ１９によって位置制御を行う制御・電源装置、３２
は制御・電源装置３０の主電源回路で、その出力として
連続発振を選択したとき、定電流源として機能する。ま
た、その内部には定電流出力を直接的または間接的に截
断することにより矩形波のパルス出力とするアナログゲ
ートが接続されており、パルス発振を選択したとき、定
電流源から矩形波の電流パルスを出力する。また、ここ
では詳細に説明しないが、主電源回路３２には、放電電
極２７を最初に点灯するとき、高電圧を発生させるため
のトリガートランス、点灯後の放電電極２７の点灯の維
持に必要な最小限の電流（以下、『シマー電流』とい
う）を通電するための回路等も内蔵している。３１はマ
イクロコンピュータ等からなる制御・電源装置３０の主
電源回路３２をプログラム制御する主制御回路、３０Ａ
はパルス出力及び定電流出力の出力電流のピークを決定
するピーク電流設定器で、ポテンショメータからなる。
同様に、３０Ｂはパルス出力の周波数設定器、３０Ｃは
パルス出力のデューティ比設定器で、共にポテンショメ
ータからなる。３０Ｄは定電流出力を選択する連続発振
とパルス出力を選択するパルス発振との切替えを行う連
続発振／パルス発振切替器（以下、単に『ＣＷ／ＰＷ切
替器』という）で、切替スイッチからなる。なお、３３
はキーボード、３４はディスプレイである。In FIG. 2, 16 is the above-mentioned laser oscillator, 25 is a partial reflection mirror, 26 is a total reflection mirror, and 27.
Is a discharge electrode, 28 is a mixed gas of the laser medium enclosed in the resonator, 1 is a laser beam emitted (output) from the laser oscillator 16, and 30 is the continuous oscillation (CW) or pulse oscillation (PW) described above. Output the current to
A control / power supply device 32 for position control by the X-axis drive motor 14, the Y-axis drive motor 15, and the Z-axis drive motor 19.
Is a main power supply circuit of the control / power supply device 30 and functions as a constant current source when continuous oscillation is selected as its output. In addition, an analog gate that outputs a rectangular wave pulse output by directly or indirectly cutting the constant current output is connected inside it.When pulse oscillation is selected, the rectangular wave current from the constant current source is Output pulse. Although not described in detail here, the main power supply circuit 32 needs a trigger transformer for generating a high voltage when the discharge electrode 27 is first lit, and is necessary for maintaining the lighting of the discharge electrode 27 after lighting. It also has a built-in circuit for energizing a minimum current (hereinafter referred to as "shimmer current"). Reference numeral 31 denotes a main control circuit for program-controlling the main power supply circuit 32 of the control / power supply device 30 including a microcomputer, 30A
Is a peak current setting device that determines the peak of the output current of the pulse output and the constant current output, and is composed of a potentiometer.
Similarly, 30B is a pulse output frequency setting device, and 30C is a pulse output duty ratio setting device, both of which are potentiometers. 30D is a continuous oscillation / pulse oscillation switching device (hereinafter, simply referred to as "CW / PW switching device") for switching between continuous oscillation for selecting a constant current output and pulse oscillation for selecting a pulse output, and includes a changeover switch. 33
Is a keyboard and 34 is a display.
【００１８】次に、制御・電源装置３０の電源の動作に
ついて説明する。レーザ発振器１６の励起光源の放電電
極２７の励起光によってレーザ媒質の混合ガス２８を照
射すると、レーザ媒質の混合ガス２８が励起され、レー
ザ媒質の混合ガス２８を挟むように設けられた部分反射
鏡２５と全反射鏡２６によりレーザビーム１が発振され
る。この発振によって部分反射鏡２５よりレーザビーム
１が出力され、レーザ加工の熱源等として使用される。
このとき、制御・電源装置３０は、レーザ発振器１６の
励起光源となる放電電極２７に電力を供給するものであ
り、励起光源として放電ランプを使用する本実施の形態
においては、定電流方式として使用している。所望の加
工条件、言い換えれば、電流波形を決めるパラメータ
（ピーク電流値、繰返しパルス周波数、デューティ比）
は、それぞれピーク電流設定器３０Ａ、周波数設定器３
０Ｂ、デューティ比設定器３０Ｃを基に主制御回路３１
で設定され、ここで所望の電流指令値信号が生成されて
主電源回路３２に出力される。この電流指令値信号が主
電源回路３２に入力されると、主電源回路３２はこの電
流指令値信号の指令値に基づいて放電電極２７に所望の
電流値を通電する。なお、主制御回路３１から出力され
る電流指令値信号は、定電流源のピーク出力及びＰＷＭ
信号として主電源回路３２のアナログゲートを開閉制御
する。Next, the operation of the power supply of the control / power supply device 30 will be described. When the mixed gas 28 of the laser medium is irradiated by the excitation light of the discharge electrode 27 of the excitation light source of the laser oscillator 16, the mixed gas 28 of the laser medium is excited and the partial reflection mirror provided so as to sandwich the mixed gas 28 of the laser medium. The laser beam 1 is oscillated by 25 and the total reflection mirror 26. The laser beam 1 is output from the partial reflecting mirror 25 by this oscillation, and is used as a heat source for laser processing.
At this time, the control / power supply device 30 supplies electric power to the discharge electrode 27 serving as the excitation light source of the laser oscillator 16, and in the present embodiment using the discharge lamp as the excitation light source, it is used as the constant current method. is doing. Desired processing conditions, in other words, parameters that determine the current waveform (peak current value, repetitive pulse frequency, duty ratio)
Are the peak current setting device 30A and the frequency setting device 3, respectively.
0B, based on the duty ratio setter 30C, the main control circuit 31
The desired current command value signal is generated and output to the main power supply circuit 32. When this current command value signal is input to the main power supply circuit 32, the main power supply circuit 32 energizes the discharge electrode 27 with a desired current value based on the command value of this current command value signal. The current command value signal output from the main control circuit 31 is the peak output of the constant current source and the PWM.
As a signal, the analog gate of the main power supply circuit 32 is opened and closed.
【００１９】また、レーザ発振器１６がレーザ加工等の
熱源として使用される場合、加工の種類や目的に応じて
連続発振（ＣＷ）とパルス発振（ＰＷ）とを選択して使
用され、連続発振とパルス発振とを選択する切替器とし
てＣＷ／ＰＷ切替器３０Ｄを有している。ＣＷ／ＰＷ切
替器３０ＤのＣＷ側が選択されているときは、ピーク電
流設定器３０Ａで設定したピーク電流値のみが有効とな
り、周波数設定器３０Ｂ、デューティ比設定器３０Ｃで
設定された周波数、デューティ比は無効とするように主
制御回路３１が動作する。また、ＰＷ側が選択されてい
るときは、ピーク電流設定器３０Ａ、周波数設定器３０
Ｂ、デューティ比設定器３０Ｃの全てが有効とするよう
に主制御回路３１が動作する。図３はこの発明の一実施
の形態によるレーザ加工方法の加工開始点における切断
断面を示す模式図である。図３において、１はレーザビ
ーム、２はレーザビーム１を集光する集光光学部品とし
ての集光レンズ、３はビーム集光ポイント、４は被加工
材の板厚、Ａは加工開始点、５は加工開始点Ａ付近の加
工開始部の底部位置にある残存部分、６は加工開始点Ａ
に発生する加工開始穴、７はレーザビーム１の移動方
向、８はレーザビーム１による切断除去領域、９は可燃
性材料からなる被加工材である。Further, when the laser oscillator 16 is used as a heat source for laser processing or the like, continuous oscillation (CW) or pulse oscillation (PW) is selected and used according to the type and purpose of processing, and continuous oscillation is performed. It has a CW / PW switch 30D as a switch for selecting pulse oscillation. When the CW side of the CW / PW switch 30D is selected, only the peak current value set by the peak current setting device 30A is valid, and the frequency and duty ratio set by the frequency setting device 30B and the duty ratio setting device 30C are set. The main control circuit 31 operates so as to invalidate. Further, when the PW side is selected, the peak current setting device 30A and the frequency setting device 30
B, the main control circuit 31 operates so that all of the duty ratio setters 30C are valid. FIG. 3 is a schematic view showing a cut cross section at a processing start point of the laser processing method according to the embodiment of the present invention. In FIG. 3, 1 is a laser beam, 2 is a condenser lens as a condensing optical component for condensing the laser beam 1, 3 is a beam converging point, 4 is a plate thickness of a workpiece, A is a processing start point, 5 is the remaining portion at the bottom position of the machining start portion near the machining start point A, 6 is the machining start point A
Is a moving start hole of the laser beam 1, 7 is a moving direction of the laser beam 1, 8 is a cutting and removing region by the laser beam 1, and 9 is a work material made of a combustible material.
【００２０】次に、この実施の形態のレーザ加工機の動
作について説明する。まず、被加工材９を切断加工する
には、図３に示すように、加工開始点Ａに加工開始穴６
を明ける作業を実行する。その動作は、集光レンズ２で
集光されたレーザビーム１を被加工材９の表面に照射す
る。同時に、レーザビーム１または被加工材９を切断経
路に沿って移動させる。このときのレーザビーム１の照
射パワーは、被加工材９の炭化を抑制するために、被加
工材９を瞬時に燃焼除去可能な出力を短時間に投入させ
るのが好ましい。かつ、加工開始穴６の貫通を短時間で
完了させるために、初回のレーザビーム１の照射で被加
工材９の板厚４の１／２程度の深さまで除去する。発明
者等の実験によれば、初回のレーザビーム１の照射で被
加工材９の板厚４の１／３〜２／３程度の深さまで除去
すると、好ましい処理が可能であった。また、レーザビ
ーム１の照射パワーも制御が容易で高効率で切断除去が
できる。この切断動作によって図３に示す被加工材９に
は切断除去領域８が形成される。Next, the operation of the laser processing machine of this embodiment will be described. First, in order to cut and process the work material 9, as shown in FIG.
Perform the work that opens. The operation irradiates the surface of the workpiece 9 with the laser beam 1 condensed by the condenser lens 2. At the same time, the laser beam 1 or the workpiece 9 is moved along the cutting path. The irradiation power of the laser beam 1 at this time is preferably such that an output capable of instantaneously burning and removing the work material 9 is input in a short time in order to suppress carbonization of the work material 9. In addition, in order to complete the penetration of the processing start hole 6 in a short time, the first irradiation of the laser beam 1 removes the material 9 to a depth of about 1/2 of the plate thickness 4. According to the experiments conducted by the inventors, a preferable treatment was possible when the laser beam 1 was irradiated for the first time to remove the workpiece 9 to a depth of about 1/3 to 2/3 of the plate thickness 4. Also, the irradiation power of the laser beam 1 can be easily controlled, and cutting and removal can be performed with high efficiency. By this cutting operation, the cutting removal area 8 is formed in the workpiece 9 shown in FIG.
【００２１】なお、本実施の形態では、主電源回路３２
の応答性を良くするため、主制御回路３１でレーザビー
ム１の照射パワーをＰＷＭ等の電流制御にて実行し、パ
ルス発振で所定のパワーへの移行を速やかに行ってい
る。その後、レーザビーム１を遮断した状態で切断経路
に沿って移動させて、前回明けた加工開始点Ａの加工開
始穴６へ戻り、再度、集光レンズ２で集光されたレーザ
ビーム１を被加工材９の表面に照射しながら、レーザビ
ーム１または被加工材９を切断経路に沿って移動させ
る。これらの動作は、加工開始点Ａの近傍にて複数回実
行され、切断除去領域８は徐々に被加工材９の底部へと
進行し、最終的には加工開始穴６が貫通形成される。In this embodiment, the main power supply circuit 32
In order to improve the responsiveness of the above, the main control circuit 31 executes the irradiation power of the laser beam 1 by current control such as PWM and promptly shifts to a predetermined power by pulse oscillation. After that, the laser beam 1 is moved along the cutting path in a blocked state, returned to the processing start hole 6 at the processing start point A which was opened last time, and the laser beam 1 focused by the condenser lens 2 is again covered. While irradiating the surface of the processed material 9, the laser beam 1 or the processed material 9 is moved along the cutting path. These operations are performed a plurality of times in the vicinity of the processing start point A, the cutting removal region 8 gradually advances to the bottom of the workpiece 9, and finally the processing start hole 6 is formed through.
【００２２】このとき、第２回目以降のレーザビーム１
の照射パワーは、初回の照射よりも照射パワーを低く設
定し、熱容量の小さくなった被加工材９の加工開始穴６
の残存部分５に照射する。第２回目以降のレーザビーム
１の照射で掘り下げていく深さは、熱伝導による被加工
材９の燃焼が進行しないように、初回または前回のレー
ザビーム１の照射で残った被加工材９の残存部分５の１
／２を残す程度の照射パワーで除去するのが好ましい。
このような繰返し動作により、入熱不足による切れ残
り、或いは入熱過多による加工開始穴６の底部での異常
な拡がりの発生もなく加工開始穴６が貫通形成される。
加工開始穴６が貫通形成された後、ビーム集光ポイント
３は任意の所定量だけ被加工材９の表面を基準に移動す
る。このとき、ビーム集光ポイント３を上方或いは下方
へと変位させながら、所定の位置に移動することもでき
る。At this time, the second and subsequent laser beams 1
The irradiation power of is set lower than the irradiation power of the first irradiation, and the processing start hole 6 of the workpiece 9 having a small heat capacity is
And irradiate the remaining portion 5. The depth to be dug down by the irradiation of the laser beam 1 after the second time is the depth of the processed material 9 remaining after the irradiation of the laser beam 1 for the first time or the previous time so that combustion of the processed material 9 due to heat conduction does not proceed. 1 of the remaining part 5
It is preferable to remove it with an irradiation power that leaves about / 2.
By such repetitive operation, the machining start hole 6 is formed through without being left uncut due to insufficient heat input, or without abnormal expansion at the bottom of the machining start hole 6 due to excessive heat input.
After the processing start hole 6 is formed so as to penetrate therethrough, the beam condensing point 3 moves by an arbitrary predetermined amount with reference to the surface of the workpiece 9. At this time, the beam focusing point 3 can be moved to a predetermined position while being displaced upward or downward.
【００２３】この制御は、図４に示すように主制御回路
３１で制御される。図４はこの発明の一実施の形態のレ
ーザ加工機の加工開始穴を明けるプログラム制御を行う
フローチャートである。この加工開始穴を明けるプログ
ラムはメインルーチンの処理中にコールされ、継続して
切断除去動作が実行される。まず、ステップＳ１で予め
メモリに格納されている被加工材９の材質及び厚みをデ
ィスプレイ３４で表示し、そこから被加工材９の材質及
び厚みをキーボード３３で選択し、それを設定する。ス
テップＳ２で切断経路をキーボード３３で入力する。ス
テップＳ３で選択された被加工材９の材質及び厚みか
ら、既にメモリに格納されたテーブルによってレーザビ
ーム１の初期照射パワーを選択する。この初期照射パワ
ーは、被加工材９の炭化を抑制するために、被加工材９
を瞬時に燃焼除去可能な出力を短時間に投入させ、か
つ、加工開始穴６の貫通を短時間で完了させるために、
初回のレーザビーム１の照射で被加工材９の板厚４の１
／３〜２／３程度の深さまで除去する能力のピーク電流
値のデューティ比とする。ステップＳ４で入力した経路
から移動距離Ｌを演算する。即ち、本実施の形態では加
工開始穴６でなく切断溝が形成されることから、予め切
断方向にその切断溝を一致させておく。ステップＳ５で
繰返し回数を計数するカウンタＮをクリアし、ステップ
Ｓ６で加工開始のキー操作が行われたか判定し、加工開
始のキー操作が行われるまで、ステップＳ６に止まる。This control is controlled by the main control circuit 31 as shown in FIG. FIG. 4 is a flow chart for performing program control for making a processing start hole of the laser processing machine according to the embodiment of the present invention. The program for making the machining start hole is called during the processing of the main routine, and the cutting and removing operation is continuously executed. First, in step S1, the material and thickness of the material 9 to be processed, which are stored in advance in the memory, are displayed on the display 34, and the material and thickness of the material 9 to be processed are selected from the display 33 using the keyboard 33 and set. In step S2, the cutting path is input with the keyboard 33. Based on the material and thickness of the workpiece 9 selected in step S3, the initial irradiation power of the laser beam 1 is selected by the table already stored in the memory. This initial irradiation power is applied to the work material 9 in order to suppress carbonization of the work material 9.
In order to turn on the output capable of burning and removing in a short time and to complete the penetration of the processing start hole 6 in a short time,
The first irradiation of the laser beam 1 causes the plate thickness 4 of the workpiece 9 to be 1
The duty ratio of the peak current value of the ability to remove to a depth of about / 3 to 2/3. The moving distance L is calculated from the route input in step S4. That is, in the present embodiment, the cutting groove is formed instead of the processing start hole 6, so that the cutting groove is previously aligned in the cutting direction. In step S5, the counter N that counts the number of repetitions is cleared, in step S6 it is determined whether or not the key operation for starting the machining is performed, and the process is stopped at step S6 until the key operation for starting the machining is performed.
【００２４】ステップＳ６で加工開始のキー操作が行わ
れたと判定したとき、ステップＳ７でレーザビーム１の
初期照射パワーを照射パワー１００％で加工開始点Ａの
照射を行い、ステップＳ８で移動距離Ｌを移動し、ステ
ップＳ９で移動距離Ｌの移動の完了を判定し、ステップ
Ｓ９で移動距離Ｌの移動の完了を判定するまで、ステッ
プＳ７からステップＳ９のルーチンを繰返し実行する。
ステップＳ９で移動距離Ｌの移動の完了を判定すると、
ステップＳ１０でレーザビーム１の初期照射を断ち、ス
テップＳ１１で移動距離Ｌから加工開始点Ａに戻す。ス
テップＳ１２で加工開始点Ａに戻ったかを判定し、ステ
ップＳ１２で加工開始点Ａに戻ったことを判定するま
で、ステップＳ１０からステップＳ１２のルーチンを繰
返し実行する。When it is determined in step S6 that a key operation for starting the processing has been performed, the processing start point A is irradiated with the initial irradiation power of the laser beam 1 of 100% in step S7, and the movement distance L is calculated in step S8. Is moved, and the completion of the movement of the movement distance L is determined in step S9, and the routine of steps S7 to S9 is repeatedly executed until the completion of the movement of the movement distance L is determined in step S9.
When it is determined in step S9 that the movement of the movement distance L is completed,
The initial irradiation of the laser beam 1 is stopped in step S10, and the movement distance L is returned to the processing start point A in step S11. The routine from step S10 to step S12 is repeatedly executed until it is determined in step S12 whether the machining start point A has been returned to, and until it is determined in step S12 that the machining start point A has been returned to.
【００２５】ステップＳ１２で加工開始点Ａに戻ったこ
とを判定すると、ステップＳ１３でレーザビーム１とし
て第２回目以降の照射パワーを照射する。この照射パワ
ーは、初回の照射よりも低く設定し、特に、第２回目の
レーザビーム１は、熱伝導による被加工材９の燃焼が進
行しないように、初回のレーザビーム１の照射で残った
被加工材９の残存部分５の１／２を残す程度の照射パワ
ーとする。即ち、初回のレーザビーム１の照射で被加工
材９の板厚４の残存部分５の１／２程度の深さまで除去
する能力のピーク電流値のデューティ比とする。ステッ
プＳ１４で繰返し回数を計数するカウンタＮをインクリ
メントし、ステップＳ１５で繰返し回数を計数するカウ
ンタＮが「３」であるか判定し、カウンタＮが「３」と
判定されるまで、ステップＳ１０からステップＳ１５の
ルーチンを繰返し実行する。カウンタＮが「３」と判定
されたとき、加工開始穴６が貫通形成される。なお、加
工開始穴６が貫通形成された後、ビーム集光ポイント３
は任意の所定量だけ被加工材９の表面を基準に移動す
る。このとき、レーザビーム１の初期照射パワーを照射
パワー１００％を所定の値に上昇させる。または、ビー
ム集光ポイント３を上方或いは下方へと変位させなが
ら、所定の切断経路に沿って移動する。When it is determined in step S12 that the processing has returned to the processing start point A, the second and subsequent irradiation powers are emitted as the laser beam 1 in step S13. This irradiation power is set lower than that of the first irradiation, and in particular, the second laser beam 1 remains after the first irradiation of the laser beam 1 so that combustion of the workpiece 9 due to heat conduction does not proceed. The irradiation power is set so that half of the remaining portion 5 of the work material 9 is left. That is, the duty ratio of the peak current value of the ability to remove to the depth of about 1/2 of the remaining portion 5 of the plate thickness 4 of the work material 9 by the first irradiation of the laser beam 1 is set. The counter N that counts the number of repetitions is incremented in step S14, it is determined in step S15 whether the counter N that counts the number of repetitions is "3", and steps S10 to S10 are performed until the counter N is determined to be "3". The routine of S15 is repeatedly executed. When the counter N is determined to be “3”, the processing start hole 6 is formed through. In addition, after the processing start hole 6 is formed through, the beam focusing point 3
Moves with reference to the surface of the work material 9 by an arbitrary predetermined amount. At this time, 100% of the initial irradiation power of the laser beam 1 is increased to a predetermined value. Alternatively, the beam focusing point 3 is moved upward or downward while moving along a predetermined cutting path.
【００２６】このように、図３に示すように、加工開始
点Ａに加工開始穴６を明ける作業を実行する際、集光レ
ンズ２で集光されたレーザビーム１を被加工材９の表面
に照射し、同時に、レーザビーム１または被加工材９を
切断経路に沿って移動させる。このときのレーザビーム
１の照射パワーは、被加工材９の炭化を抑制するため
に、被加工材９を瞬時に燃焼除去可能な出力を短時間に
投入させるのが好ましい。かつ、加工開始穴６の貫通を
短時間で完了させるために、初回のレーザビーム１の照
射で被加工材９の板厚４の１／３〜２／３程度の深さま
で除去するのがよい。勿論、前記値よりも小さくするこ
と、大きくすることも可能である。この切断動作によっ
て図３に示す被加工材９には切断除去領域８が形成され
る。その後、レーザビーム１を遮断した状態で切断経路
に沿って移動させて、前回明けた加工開始点Ａの加工開
始穴６へ戻り、再度、集光レンズ２で集光されたレーザ
ビーム１を被加工材９の表面に照射しながら、レーザビ
ーム１または被加工材９を切断経路に沿って移動させ
る。このとき、ビーム集光ポイント３は任意の所定量だ
け被加工材９の表面を基準に移動させ、所定の切断溝を
形成することができる。これらの動作は、加工開始点Ａ
の近傍にて複数回実行され、切断除去領域８を徐々に被
加工材９の底部に進行させ、最終的には加工開始穴６が
貫通形成される。第２回目以降のレーザビーム１の照射
パワーは、熱伝導による被加工材９の燃焼が進行しない
ように、初回または前回のレーザビーム１の照射で残っ
た被加工材９の残存部分５の１／２を残す程度の照射パ
ワーで除去するのが好ましい。このような繰返し動作に
より、入熱不足による切れ残り、或いは入熱過多による
加工開始穴６の底部での異常な拡がりの発生もなく加工
開始穴６が貫通形成される。Thus, as shown in FIG. 3, when the work for forming the processing start hole 6 at the processing start point A is performed, the laser beam 1 focused by the condenser lens 2 is applied to the surface of the workpiece 9. And at the same time, the laser beam 1 or the workpiece 9 is moved along the cutting path. The irradiation power of the laser beam 1 at this time is preferably such that an output capable of instantaneously burning and removing the work material 9 is input in a short time in order to suppress carbonization of the work material 9. In addition, in order to complete the penetration of the processing start hole 6 in a short time, it is preferable to remove the material to a depth of about 1/3 to 2/3 of the plate thickness 4 of the work material 9 by the first irradiation of the laser beam 1. . Of course, it is possible to make it smaller or larger than the above value. By this cutting operation, the cutting removal area 8 is formed in the workpiece 9 shown in FIG. After that, the laser beam 1 is moved along the cutting path in a blocked state, returned to the processing start hole 6 at the processing start point A which was opened last time, and the laser beam 1 focused by the condenser lens 2 is again covered. While irradiating the surface of the processed material 9, the laser beam 1 or the processed material 9 is moved along the cutting path. At this time, the beam condensing point 3 can be moved by an arbitrary predetermined amount with reference to the surface of the workpiece 9 to form a predetermined cutting groove. These operations are the processing start point A
Is performed a plurality of times in the vicinity of, the cutting removal area 8 is gradually advanced to the bottom of the work material 9, and finally the processing start hole 6 is formed through. The irradiation power of the laser beam 1 after the second time is set to 1 of the remaining portion 5 of the work material 9 left after the first or previous irradiation of the laser beam 1 so that combustion of the work material 9 due to heat conduction does not proceed. It is preferable to remove it with an irradiation power that leaves about / 2. By such repetitive operation, the machining start hole 6 is formed through without being left uncut due to insufficient heat input, or without abnormal expansion at the bottom of the machining start hole 6 due to excessive heat input.
【００２７】このようにして切断加工した後、形成され
た切断除去領域８の溝に、例えば、刃物等を挿入して簡
易抜き型として使用する。このとき、溝形状によってそ
の挿入物の拘束力が大きく変わる。次に、切断除去領域
８の溝形状について説明する。図５はこの発明の一実施
の形態によるレーザ加工方法によるレーザビームの焦点
が被加工材の表面にあるときの切断断面を示す模式図、
図６はこの発明の一実施の形態によるレーザ加工方法に
よるレーザビームの焦点が被加工材の表面の上部にある
ときの切断断面を示す模式図、図７はこの発明の一実施
の形態によるレーザ加工方法によるレーザビームの焦点
が被加工材の表面の下部にあるときの切断断面を示す模
式図である。レーザ切断加工の場合、大別すると、図
５、図６、図７に示すように３パターンの溝形状とな
る。図５に示す切断断面の溝形状を形成させるには、ビ
ーム集光ポイント３を被加工材９の表面に設定する。ま
た、図６の溝形状を形成させるためには、ビーム集光ポ
イント３を被加工材９の表面より上方に設定する。そし
て、図７の溝形状を形成させるためにはビーム集光ポイ
ント３を被加工材９の表面よりも下方に設定する。例え
ば、刃物等を切断溝に挿入して簡易抜き型として使用す
る場合、適正な溝形状は、被加工材９の表面では狭く、
板厚４の中央部で拡がり、被加工材９の裏面で再び狭く
なるような図５に示す断面空洞部分が略太鼓状を呈する
ものが好ましい。即ち、狭くなっている被加工材９の表
面に刃物を挿入し、そこを支点として切離しが容易にな
る。このような溝形状として、所望の断面を得るには、
加工開始穴６の貫通後は切断加工に移行するとともにレ
ーザビーム１の集光ポイント３を適正位置、例えば、被
加工材９の表面を基準として上下動、或いは被加工材９
の表面から所定の位置でその平面に沿って移動させるこ
とにより、切断除去を行う。After cutting and processing in this way, a tool or the like is inserted into the groove of the cut and removed region 8 thus formed to be used as a simple punching die. At this time, the restraining force of the insert changes greatly depending on the groove shape. Next, the groove shape of the cut and remove region 8 will be described. FIG. 5 is a schematic view showing a cut cross section when a laser beam is focused on the surface of a workpiece by a laser processing method according to an embodiment of the present invention,
FIG. 6 is a schematic view showing a cut cross section when a laser beam is focused on an upper surface of a workpiece by a laser processing method according to one embodiment of the present invention, and FIG. 7 is a laser according to one embodiment of the present invention. It is a schematic diagram which shows the cutting cross section when the focus of the laser beam by a processing method is in the lower part of the surface of a to-be-processed material. In the case of the laser cutting process, when roughly classified, the groove shape has three patterns as shown in FIGS. 5, 6, and 7. In order to form the groove shape of the cut cross section shown in FIG. 5, the beam focusing point 3 is set on the surface of the work material 9. Further, in order to form the groove shape of FIG. 6, the beam focusing point 3 is set above the surface of the work material 9. Then, in order to form the groove shape of FIG. 7, the beam focusing point 3 is set below the surface of the work material 9. For example, when a tool or the like is inserted into the cutting groove and used as a simple punching die, the proper groove shape is narrow on the surface of the work material 9,
It is preferable that the hollow portion in cross section shown in FIG. 5 which is widened in the central portion of the plate thickness 4 and becomes narrower again on the back surface of the workpiece 9 has a substantially drum shape. That is, cutlery was inserted into the surface of the workpiece 9 which is narrower, disconnection is facilitated there as a fulcrum. To obtain a desired cross section with such a groove shape,
After the processing start hole 6 is penetrated, the cutting process is performed and the converging point 3 of the laser beam 1 is vertically moved with respect to the proper position, for example, the surface of the work material 9, or the work material 9
Cutting and removal is performed by moving along the plane at a predetermined position from the surface of.
【００２８】このように、本実施の形態のレーザ加工装
置は、可燃性材料のように燃焼しやすい被加工材９を、
レーザビーム１を高エネルギー密度に集光した熱源を用
いて加工するレーザ加工装置において、被加工材９の加
工開始点Ａの近傍にて、加工開始点Ａから加工経路に沿
って所定の距離Ｌを移動させたレーザビーム１を、加工
経路に沿って繰返し複数回往復動作させ、加工開始穴６
を貫通させた後、次の切断加工動作へと移行して切断す
るものであり、また、これは被加工材９の加工開始点Ａ
の近傍にて、加工開始点Ａから加工経路に沿って所定の
距離Ｌを移動させたレーザビーム１を、加工経路に沿っ
て繰返し複数回往復動作させ、加工開始穴６を貫通させ
た後、次の切断加工動作へと移行して切断するレーザ加
工方法とすることもできる。As described above, in the laser processing apparatus according to the present embodiment, the workable material 9 that is easily burned, such as a combustible material, is
In a laser processing apparatus that processes a laser beam 1 using a heat source that has a high energy density, a predetermined distance L from the processing start point A along the processing path in the vicinity of the processing start point A of the workpiece 9. The laser beam 1 which has been moved is repeatedly reciprocated a plurality of times along the machining path to form the machining start hole 6
After passing through, the process moves to the next cutting processing operation for cutting, and this is also the processing start point A of the work material 9.
In the vicinity of, the laser beam 1 moved a predetermined distance L from the processing start point A along the processing path is repeatedly reciprocated a plurality of times along the processing path to penetrate the processing start hole 6, It is also possible to use a laser processing method of shifting to the next cutting processing operation and cutting.
【００２９】即ち、上記実施の形態では、初回のレーザ
ビーム１の照射においては被加工材９の炭化を防ぎ、被
加工材９を瞬時に燃焼除去が可能な照射パワーを短時間
に投入させる照射パワーを電流制御にて実行し、かつ、
初回のレーザビーム１の照射で、少なくとも被加工材９
の板厚の１／２程度の深さまで除去せしめ、第２回目以
降のレーザ照射パワーを前回の照射よりもパワーを低く
設定し、熱容量の小さくなった被加工材９の加工開始点
Ａの残存部分５を過剰な入熱を与えずに掘り下げていく
ように、照射パワーの制御を行うものである。しかし、
本発明を実施する場合には、予め、複数回で加工開始点
Ａにおける穴明け作業が完了するように、均一な照射パ
ワーで加工経路に沿って繰返し複数回往復動作させ、加
工開始穴６を貫通させることもできる。したがって、可
燃性材料のように燃焼しやすい被加工材９の切断加工の
場合でも、従来のレーザ加工方法のように１回のレーザ
ビーム１の照射によって加工開始点Ａにおける穴明け作
業を実行するのではなく、複数回のレーザビーム１の照
射によって加工開始点Ａにおける穴明け作業を行うた
め、入熱不足や入熱過多による加工不具合の発生もな
く、切断断面が良好な切断加工ができる。That is, in the above-described embodiment, irradiation is performed in which irradiation of the laser beam 1 for the first time prevents irradiation of carbonization of the material 9 to be processed, and applies irradiation power capable of instantaneously burning and removing the material 9 in a short time. Power is executed by current control, and
The first irradiation of the laser beam 1 causes at least the work piece 9
The laser irradiation power after the second irradiation is set lower than that of the previous irradiation, and the processing start point A of the work material 9 having a reduced heat capacity remains. The irradiation power is controlled so that the portion 5 is dug down without giving an excessive heat input. But,
In the case of carrying out the present invention, the machining start hole 6 is reciprocated repeatedly a plurality of times along the machining path with uniform irradiation power so that the drilling work at the machining start point A is completed a plurality of times in advance. It can also be penetrated. Therefore, even in the case of cutting the workable material 9 such as a flammable material that is easily burned, the drilling work is performed at the processing start point A by one irradiation of the laser beam 1 as in the conventional laser processing method. Instead of performing the drilling work at the processing start point A by irradiating the laser beam 1 a plurality of times, it is possible to perform a cutting process with a good cutting cross section without causing a processing defect due to insufficient heat input or excessive heat input.
【００３０】また、本実施の形態のレーザ加工装置は、
加工開始穴６を貫通させた後、被加工材９の表面に対し
て任意の所定量だけレーザビーム１の集光ポイント３を
上方または下方へ変位させてレーザビーム１を照射し、
被加工材９の切断溝を所望の形状に制御させるものであ
り、また、これを加工開始穴６を貫通させた後、被加工
材９の表面に対して任意の所定量だけレーザビーム１の
集光ポイント３を上方または下方へ変位させてレーザビ
ーム１を照射し、被加工材９の切断溝を所望の形状に制
御させるレーザ加工方法とすることができる。したがっ
て、所望の切断溝の断面形状が得られ、可燃性材料のよ
うに燃焼しやすい被加工材９の切り離し形態に応じた切
断除去ができる。Further, the laser processing apparatus of this embodiment is
After passing through the processing start hole 6, the laser beam 1 is irradiated by displacing the focusing point 3 of the laser beam 1 upward or downward with respect to the surface of the workpiece 9 by an arbitrary predetermined amount,
The cutting groove of the work material 9 is controlled to a desired shape, and after the machining start hole 6 is penetrated, the surface of the work material 9 is cut by an arbitrary predetermined amount of the laser beam 1. A laser processing method in which the focusing point 3 is displaced upward or downward and the laser beam 1 is irradiated to control the cutting groove of the workpiece 9 to have a desired shape can be used. Therefore, a desired cross-sectional shape of the cutting groove can be obtained, and cutting and removal can be performed according to the cut-off form of the workable material 9 which is easy to burn like a flammable material.
【００３１】そして、本実施の形態のレーザ加工装置
は、加工経路に沿って行う繰返し複数回往復動作は、初
回と第２回目以降のレーザビーム１の照射パワーを変化
させるものであり、また、これはレーザ加工方法とする
こともできる。即ち、複数回のレーザビーム１の照射に
おいて初回と第２回目以降の照射パワーを変化させ、例
えば、初回のレーザビーム１の照射においては被加工材
９の炭化を防ぐために、被加工材９を瞬時に燃焼除去が
可能な照射パワーを短時間に投入させる目的で、照射パ
ワーをＰＷ等の電流制御にて実行し、所定の照射パワー
への移行を速やかに行い、かつ、加工開始穴６の貫通を
短時間で完了させるために、初回のレーザビーム１の照
射で、少なくとも被加工材９の板厚の１／２程度の深さ
まで除去せしめ、第２回目以降のレーザ照射パワーを前
回の照射よりもパワーを低く設定し、熱容量の小さくな
った被加工材９の加工開始点Ａの残存部分５を過剰な入
熱を与えずに掘り下げていくように、照射パワーの制御
を行うものであり、より効率的で、良好な切断が可能と
なる。The laser processing apparatus according to the present embodiment changes the irradiation power of the laser beam 1 for the first time and the second and subsequent times by the repeated plural reciprocating operations performed along the processing path. This can also be a laser processing method. That is, the irradiation power of the first time and the second and subsequent times is changed in the irradiation of the laser beam 1 a plurality of times, and, for example, in the irradiation of the first laser beam 1, in order to prevent carbonization of the processing material 9, For the purpose of turning on the irradiation power capable of instantaneously burning and removing it in a short time, the irradiation power is executed by current control such as PW, the transition to the predetermined irradiation power is performed quickly, and the machining start hole 6 In order to complete the penetration in a short time, the first irradiation of the laser beam 1 is performed to remove at least a depth of about ½ of the plate thickness of the work material 9, and the laser irradiation power of the second time or later is applied last time. The irradiation power is controlled such that the power is set lower than that and the remaining portion 5 of the processing start point A of the work material 9 having a small heat capacity is dug down without giving excessive heat input. More efficient Good cutting is possible.
【００３２】更に、本実施の形態のレーザ加工装置は、
加工経路に沿って行う繰返し複数回往復動作は、初回の
レーザビーム１の照射パワーで被加工材の板厚の１／３
乃至２／３程度の深さまで除去し、第２回目以降のレー
ザビーム１の照射パワーを初回の照射パワーよりも低く
設定して残存部分の除去を行うものであり、また、これ
はレーザ加工方法とすることもできる。したがって、初
回のレーザビーム１の照射においては被加工材９の炭化
を防ぐために、被加工材９を瞬時に燃焼除去が可能な照
射パワーを短時間に投入させる目的で、照射パワーをＰ
Ｗ等の電流制御にて実行し、所定の照射パワーへの移行
を速やかに行い、かつ、加工開始穴６の貫通を短時間で
完了させるために、初回のレーザビーム１の照射で、少
なくとも被加工材９の板厚の１／３乃至２／３程度の深
さまで除去し、第２回目以降のレーザ照射パワーを前回
の照射よりもパワーを低く設定し、熱容量の小さくなっ
た被加工材９の加工開始点Ａの残存部分５を過剰な入熱
を与えずに掘り下げていくように、照射パワーの制御を
行うものであり、より良好な切断が可能となる。Further, the laser processing apparatus of this embodiment is
Repeated multiple reciprocating operations performed along the machining path are 1/3 of the plate thickness of the workpiece with the irradiation power of the first laser beam 1.
To a depth of about 2/3, the irradiation power of the laser beam 1 from the second time onward is set lower than the irradiation power of the first time to remove the remaining portion, and this is a laser processing method. Can also be Therefore, in the first irradiation of the laser beam 1, in order to prevent carbonization of the material 9 to be processed, the irradiation power is set to P for the purpose of turning on the irradiation power capable of instantaneously burning and removing the material 9 to be processed.
In order to perform the transition to the predetermined irradiation power promptly and complete the penetration of the processing start hole 6 in a short time by performing current control of W or the like, at least the first irradiation of the laser beam 1 is performed. The work material 9 is removed to a depth of about ⅓ to ⅔ of the plate thickness of the processed material 9 and the laser irradiation power for the second and subsequent times is set to be lower than that of the previous irradiation to reduce the heat capacity. The irradiation power is controlled so that the remaining portion 5 of the machining starting point A is dug down without giving an excessive heat input, and a better cutting is possible.
【００３３】更にまた、本実施の形態のレーザ加工装置
は、加工経路に沿って行う繰返し複数回往復動作におけ
る初回のレーザビーム１の照射パワーと第２回目以降の
レーザビーム１の照射パワーは、パルス発振制御によっ
て決定するものであり、その応答性により、高速移動を
行っても追随性を良くすることができる。Furthermore, in the laser processing apparatus of this embodiment, the irradiation power of the first laser beam 1 and the irradiation power of the second and subsequent laser beams 1 in the reciprocating reciprocating operation performed along the processing path are as follows. It is determined by the pulse oscillation control, and its response makes it possible to improve followability even when moving at high speed.
【００３４】なお、本実施の形態では、初回のレーザビ
ーム１の照射パワーと第２回目以降のレーザビーム１の
照射パワーを変更する事例で説明したが、切断移動速度
を変更することによっても実現できる。しかし、本実施
の形態で説明したレーザビーム１の照射パワーを変更す
る方が、制御が容易であり、かつ効率的である。また、
本実施の形態では、初回のレーザビーム１の照射の後、
加工開始点Ａの第２回目以降のレーザビーム１の照射を
レーザビーム１の出射を断った状態で戻して行っている
が、本発明を実施する場合には、連続照射した状態で徐
々に照射パワーを低下させながら行うことができ、ま
た、極端に低い照射パワーで戻すこともできる。そし
て、本実施の形態では、初回のレーザビーム１の照射の
後、加工開始点Ａの第２回目以降のレーザビーム１の照
射を同一照射距離Ｌとしているが、本発明を実施する場
合には、徐々にその移動距離を狭くしたり、逆に広くす
ることもできる。In this embodiment, the case where the irradiation power of the laser beam 1 for the first time and the irradiation power of the laser beam 1 for the second time and thereafter are changed has been described, but it is also realized by changing the cutting movement speed. it can. However, changing the irradiation power of the laser beam 1 described in the present embodiment is easier and more efficient to control. Also,
In the present embodiment, after the first irradiation of the laser beam 1,
The irradiation of the laser beam 1 from the second time onward at the processing start point A is performed with the emission of the laser beam 1 turned off, but when the present invention is carried out, the irradiation is gradually performed in the state of continuous irradiation. It can be performed while lowering the power, or can be returned with extremely low irradiation power. Further, in the present embodiment, after the first irradiation of the laser beam 1, the second irradiation of the laser beam 1 after the processing start point A and the subsequent irradiation of the laser beam 1 have the same irradiation distance L. However, in the case of implementing the present invention, , It is also possible to gradually narrow the moving distance or conversely widen it.
【００３５】[0035]
【発明の効果】以上のように、請求項１のレーザ加工方
法は、可燃性材料のように燃焼しやすい被加工材を、レ
ーザビームを高エネルギー密度に集光した熱源を用いて
加工するレーザ加工方法において、前記被加工材の加工
開始点から加工経路に沿った所定の距離を、複数回のレ
ーザ加工により、加工開始穴を貫通させ、その後、次の
切断加工動作へと移行するものである。したがって、可
燃性材料のように燃焼しやすい素材の切断加工の場合で
も、従来のレーザ加工方法のように１回のレーザビーム
の照射によって加工開始点における穴明け作業を実行す
るのではなく、複数回のレーザビーム照射によって加工
開始点における穴明け作業を行うため、入熱不足や入熱
過多による加工不具合の発生もなく、切断断面が良好な
切断加工ができる。As described above, in the laser processing method according to the first aspect of the present invention, a work material which is easily burnt, such as a flammable material,
Using a heat source that focuses the laser beam at a high energy density
In the laser processing method for processing, processing of the work material
A predetermined distance along the machining path from the start point is repeated multiple times.
Through the machining start hole by laser machining, and then
The operation shifts to a cutting operation. Therefore, even in the case of cutting a material that easily burns, such as a flammable material, it is not necessary to perform the drilling work at the processing start point by irradiating the laser beam once as in the conventional laser processing method. Since the drilling work is performed at the processing start point by performing the laser beam irradiation once, there is no processing defect due to insufficient heat input or excessive heat input, and it is possible to perform cutting processing with a good cutting cross section.
【００３６】請求項２のレーザ加工方法は、請求項１に
記載の前記加工開始穴を貫通させた後、被加工材の表面
に対して任意の所定量だけレーザビームの集光ポイント
を上方または下方へ変位させ、レーザビームを照射し、
前記被加工材の切断溝を所望の形状に制御するものであ
り、請求項１に記載の効果に加えて、所望の切断溝の断
面形状が得られ、可燃性材料のように燃焼しやすい被加
工材の切り離し形態に応じた切断除去ができる。According to a second aspect of the present invention, there is provided a laser processing method, wherein after the processing start hole of the first aspect is penetrated, the laser beam focusing point is moved upward or upward by an arbitrary predetermined amount with respect to the surface of the workpiece. Displace downward, irradiate laser beam,
The cutting groove of the work material is controlled to have a desired shape. In addition to the effect according to claim 1, a desired cutting groove cross-sectional shape can be obtained, and a material that easily burns like a flammable material can be obtained. It can be cut and removed according to the form of cutting the processed material.
【００３７】請求項３のレーザ加工方法は、請求項１ま
たは請求項２に記載の前記加工経路に沿って行う複数回
のレーザ加工を、初回と第２回目以降のレーザビームの
照射パワーを変化させるものであり、請求項１または請
求項２に記載の効果に加えて、複数回のレーザビームの
照射において初回と第２回目以降の照射パワーを変化さ
せ、初回のレーザビームの照射においては被加工材の炭
化を防ぐために、被加工材を瞬時に燃焼除去が可能な照
射パワーを短時間に投入させ、第２回目以降のレーザ照
射パワーを前回の照射よりもパワーを低くし、熱容量の
小さくなった被加工材の加工開始点の残存部分を過剰な
入熱を与えずに掘り下げ、より効率的で、切断断面が良
好な切断が可能となる。According to a third aspect of the laser processing method, a plurality of times is performed along the processing path according to the first or second aspect.
The laser processing described above is performed by changing the irradiation power of the laser beam at the first time and the second time and thereafter. In addition to the effect described in claim 1 or claim 2, in the irradiation of the laser beam at a plurality of times, the first time and the second time are performed. In order to prevent carbonization of the work material in the first laser beam irradiation by changing the irradiation power after the second time, the irradiation power capable of instantaneously burning and removing the work material is input in a short time, and the second time The laser irradiation power after that is made lower than that of the previous irradiation, and the remaining portion of the processing start point of the work material having a reduced heat capacity is dug down without giving excessive heat input, resulting in a more efficient and cut cross section. Good cutting is possible.
【００３８】請求項４のレーザ加工方法は、請求項１乃
至請求項３の何れか１つに記載の前記加工経路に沿って
行う複数回のレーザ加工を、初回のレーザビームの照射
パワーで被加工材の板厚の１／３乃至２／３程度の深さ
まで除去した後、第２回目以降のレーザビームの照射パ
ワーを前記初回の照射パワーよりも低く設定して残存部
分の除去を行うものであり、請求項１乃至請求項３の何
れか１つに記載の効果に加えて、初回のレーザビームの
照射においては被加工材の炭化を防ぐために、被加工材
を瞬時に燃焼除去が可能な照射パワーを短時間に投入さ
せて、所定の照射パワーへの移行を速やかに行い、か
つ、加工開始穴の貫通を短時間で完了させるために、初
回のレーザビームの照射で、少なくとも被加工材の板厚
の１／３乃至２／３程度の深さまで除去し、第２回目以
降のレーザ照射パワーを前回の照射よりもパワーを低く
設定し、熱容量の小さくなった被加工材の加工開始点の
残存部分を過剰な入熱を与えずに掘り下げていくよう
に、照射パワーの制御を行うものであり、切断断面がよ
り良好な切断が可能となる。According to a fourth aspect of the present invention, there is provided a laser processing method, wherein a plurality of times of laser processing are performed along the processing path according to any one of the first to third aspects with an irradiation power of a first laser beam. After removing to a depth of about ⅓ to ⅔ of the plate thickness of the processed material, the irradiation power of the second and subsequent laser beams is set lower than the irradiation power of the first time to remove the remaining portion. In addition to the effect according to any one of claims 1 to 3, in the first irradiation of the laser beam, the material to be processed can be instantaneously burned and removed in order to prevent carbonization of the material to be processed. At the first laser beam irradiation, at least the work to be processed is performed in order to quickly change the irradiation power to a predetermined irradiation power, and to complete the penetration of the processing start hole in a short time. 1/3 to 2/3 of the plate thickness The laser irradiation power for the second and subsequent times is set lower than that for the previous irradiation, and the remaining portion of the processing start point of the work material with reduced heat capacity is not given excessive heat input. The irradiation power is controlled so as to dig into the area, and it becomes possible to perform cutting with a better cutting cross section.
【００３９】請求項５のレーザ加工装置は、可燃性材料
のように燃焼しやすい被加工材に対してレーザビームを
照射する加工ヘッドと、前記加工ヘッドと前記被加工材
との位置制御を行う制御・電源装置とを備えたレーザ加
工装置において、前記制御・電源装置は、前記被加工材
の加工開始点から加工経路に沿った所定の距離を、前記
加工ヘッドから照射されるレーザビームによる複数回の
レーザ加工により加工開始穴を貫通させ、次の切断加工
動作へと移行するように動作するものである。したがっ
て、可燃性材料のように燃焼しやすい素材の切断加工の
場合でも、従来のレーザ加工方法のように１回のレーザ
ビームの照射によって加工開始点における穴明け作業を
実行するのではなく、複数回のレーザビーム照射によっ
て加工開始点における穴明け作業を行うため、入熱不足
や入熱過多による加工不具合の発生もなく、切断断面が
良好な切断加工ができる。The laser processing apparatus according to claim 5, the laser beam to burn easily workpiece as combustible material
Irradiating machining head, the machining head and the workpiece
Laser controller equipped with a control and power supply device for position control of
In the processing equipment, the control / power supply device is the work material.
The specified distance along the machining path from the machining start point of
Multiple times by the laser beam emitted from the processing head
Next cutting process by passing through the processing start hole by laser processing
It operates so as to shift to the operation . Therefore, even in the case of cutting a material that easily burns, such as a flammable material, it is not necessary to perform the drilling work at the processing start point by irradiating the laser beam once as in the conventional laser processing method. Since the drilling work is performed at the processing start point by performing the laser beam irradiation once, there is no processing defect due to insufficient heat input or excessive heat input, and it is possible to perform cutting processing with a good cutting cross section.
【００４０】請求項６のレーザ加工装置は、請求項５に
記載の前記加工開始穴を貫通させた後、被加工材の表面
に対して任意の所定量だけレーザビームの集光ポイント
を上方または下方へ変位させ、レーザビームを照射し、
前記被加工材の切断溝を所望の形状に制御するものであ
るから、請求項５に記載の効果に加えて、所望の切断溝
の断面形状が得られ、可燃性材料のように燃焼しやすい
被加工材の切り離し形態に応じた切断除去ができる。According to a sixth aspect of the present invention, there is provided a laser beam machining apparatus, wherein after the machining start hole of the fifth aspect is penetrated, a laser beam focusing point is moved upward or upward by an arbitrary predetermined amount with respect to the surface of the workpiece. Displace downward, irradiate laser beam,
Since the cutting groove of the material to be processed is controlled to have a desired shape, in addition to the effect according to claim 5, a desired cutting groove cross-sectional shape is obtained, and it is easy to burn like a flammable material. It is possible to cut and remove the work material depending on the form of separation.
【００４１】請求項７のレーザ加工装置は、請求項５ま
たは請求項６に記載の前記加工経路に沿って行う複数回
のレーザ加工は、初回と第２回目以降のレーザビームの
照射パワーを変化させるものであるから、請求項５また
は請求項６の効果に加えて、複数回のレーザビームの照
射において初回と第２回目以降の照射パワーを変化さ
せ、初回のレーザビームの照射においては被加工材の炭
化を防ぐために、被加工材を瞬時に燃焼除去が可能な照
射パワーを短時間に投入させ、第２回目以降のレーザ照
射パワーを前回の照射よりもパワーを低くし、熱容量の
小さくなった被加工材の加工開始点の残存部分を過剰な
入熱を与えずに掘り下げ、より効率的で、切断断面がよ
り良好な切断が可能となる。According to a seventh aspect of the present invention, there is provided a laser processing apparatus which performs a plurality of times along the processing route according to the fifth or sixth aspect.
Since the laser processing described above changes the irradiation power of the laser beam at the first time and the second time and thereafter, in addition to the effect of claim 5 or 6, the laser beam irradiation at the first time and the second time is performed in the plurality of times of laser beam irradiation. The irradiation power after the second time is changed, and in order to prevent carbonization of the work material in the first laser beam irradiation, the irradiation power capable of instantaneously burning and removing the work material is input in a short time, and the second and subsequent times. Laser irradiation power is set lower than that of the previous irradiation, and the remaining portion of the processing start point of the work material with reduced heat capacity is dug down without giving excessive heat input, making it more efficient and cutting section more Good cutting is possible.
【００４２】請求項８のレーザ加工装置は、請求項５乃
至請求項７の何れか１つに記載の前記加工経路に沿って
行う複数回のレーザ加工は、初回のレーザビームの照射
パワーで被加工材の板厚の１／３乃至２／３程度の深さ
まで除去し、第２回目以降のレーザビームの照射パワー
を前記初回の照射パワーよりも低く設定して残存部分の
除去を行うものであるから、請求項５乃至請求項７の何
れか１つに加えて、初回のレーザビームの照射において
は被加工材の炭化を防ぐために、被加工材を瞬時に燃焼
除去が可能な照射パワーを短時間に投入させて、所定の
照射パワーへの移行を速やかに行い、かつ、加工開始穴
の貫通を短時間で完了させるために、初回のレーザビー
ムの照射で、少なくとも被加工材の板厚の１／３乃至２
／３程度の深さまで除去し、第２回目以降のレーザ照射
パワーを前回の照射よりもパワーを低く設定し、熱容量
の小さくなった被加工材の加工開始点の残存部分を過剰
な入熱を与えずに掘り下げていくように、照射パワーの
制御を行うものであり、切断断面がより良好な切断が可
能となる。In the laser processing apparatus according to claim 8, the laser processing performed a plurality of times along the processing path according to any one of claims 5 to 7 is performed with the irradiation power of the first laser beam. The removal is performed to a depth of about 1/3 to 2/3 of the plate thickness of the processed material, and the irradiation power of the second and subsequent laser beams is set lower than the irradiation power of the first time to remove the remaining portion. Therefore, in addition to any one of claims 5 to 7, in order to prevent carbonization of the workpiece in the first laser beam irradiation, an irradiation power capable of instantaneously burning and removing the workpiece is set. At least the plate thickness of the material to be processed by the first irradiation of the laser beam in order to make the power supply to the predetermined irradiation power quickly and to complete the penetration of the processing start hole in a short time by putting it in a short time. 1/3 to 2 of
The laser irradiation power after the second irradiation is set to a value lower than that of the previous irradiation by removing to a depth of about / 3, and excessive heat input is applied to the remaining portion of the processing start point of the work material with reduced heat capacity. The irradiation power is controlled so as to dig down without giving it, and it becomes possible to perform cutting with a better cutting cross section.
【００４３】請求項９のレーザ加工装置は、請求項５乃
至請求項８の何れか１つに記載の前記加工経路に沿って
行う複数回のレーザ加工における初回のレーザビームの
照射パワーと第２回目以降のレーザビームの照射パワー
を、パルス発振制御によって決定するものであるから、
請求項５乃至請求項８の何れか１つに記載の効果に加え
て、その応答性により、高速移動を行っても追随性を良
くすることができる。According to a ninth aspect of the present invention, there is provided a laser processing apparatus, wherein the first laser beam irradiation power and the second laser beam irradiation power in a plurality of times of laser processing performed along the processing route according to any one of the fifth to eighth aspects. Since the irradiation power of the laser beam after the first time is determined by the pulse oscillation control,
In addition to the effect according to any one of claims 5 to 8, the responsiveness can improve the followability even when performing high-speed movement.
【図１】 図１はこの発明の一実施の形態のレーザ加工
機の全体構成図である。FIG. 1 is an overall configuration diagram of a laser processing machine according to an embodiment of the present invention.
【図２】 図２はこの発明の一実施の形態のレーザ加工
機のレーザビームの制御を行う制御系の制御回路図であ
る。FIG. 2 is a control circuit diagram of a control system for controlling a laser beam of the laser processing machine according to the embodiment of the present invention.
【図３】 図３はこの発明の一実施の形態によるレーザ
加工方法の加工開始点における切断断面を示す模式図で
ある。FIG. 3 is a schematic view showing a cross section at a processing start point of a laser processing method according to an embodiment of the present invention.
【図４】 図４はこの発明の一実施の形態のレーザ加工
機の加工開始穴を明けるプログラム制御を行うフローチ
ャートである。FIG. 4 is a flow chart for performing program control for making a processing start hole of the laser processing machine according to the embodiment of the present invention.
【図５】 図５はこの発明の一実施の形態によるレーザ
加工方法によるレーザビームの焦点が被加工材の表面に
あるときの切断断面を示す模式図である。FIG. 5 is a schematic view showing a cut cross section when a laser beam is focused on the surface of a workpiece by a laser processing method according to an embodiment of the present invention.
【図６】 図６はこの発明の一実施の形態によるレーザ
加工方法によるレーザビームの焦点が被加工材の表面の
上部にあるときの切断断面を示す模式図である。FIG. 6 is a schematic view showing a cut cross section when a laser beam is focused on an upper surface of a workpiece by a laser processing method according to an embodiment of the present invention.
【図７】 図７はこの発明の一実施の形態によるレーザ
加工方法によるレーザビームの焦点が被加工材の表面の
下部にあるときの切断断面を示す模式図である。FIG. 7 is a schematic view showing a cross section of a laser beam focused by a laser processing method according to an embodiment of the present invention when the focal point of the laser beam is located below a surface of a workpiece.
【図８】 図８は従来のレーザ加工によって入熱不足で
被加工材の切断加工を行うレーザ加工方法の説明図で、
（ａ）は断面図、（ｂ）は底面図である。FIG. 8 is an explanatory view of a conventional laser processing method for cutting a workpiece with insufficient heat input by laser processing,
(A) is sectional drawing, (b) is a bottom view.
【図９】 図９は従来のレーザ加工によって入熱過多で
被加工材の切断加工を行うレーザ加工方法の説明図で、
（ａ）は断面図、（ｂ）は底面図である。FIG. 9 is an explanatory view of a conventional laser processing method for cutting a workpiece with excessive heat input,
(A) is sectional drawing, (b) is a bottom view.
１ レーザビーム、２ 集光レンズ、３ 集光ポイン
ト、４ 板厚、５ 残存部分、６ 加工開始穴、７ レ
ーザビームの移動方向、８ 切断除去領域、９被加工
材。1 laser beam, 2 converging lens, 3 converging point, 4 plate thickness, 5 remaining portion, 6 processing start hole, 7 laser beam moving direction, 8 cutting removal area, 9 workpiece.
フロントページの続き (56)参考文献 特開 平４−309480（ＪＰ，Ａ) 特開 平２−34291（ＪＰ，Ａ) 特開 平３−221286（ＪＰ，Ａ) 特開 昭57−181786（ＪＰ，Ａ) 特開 昭59−209499（ＪＰ，Ａ) 特開 昭61−232085（ＪＰ，Ａ) 特開 昭62−28095（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 26/00 - 26/42 Continuation of the front page (56) Reference JP-A-4-309480 (JP, A) JP-A-2-34291 (JP, A) JP-A-3-221286 (JP, A) JP-A-57-181786 (JP , A) JP 59-209499 (JP, A) JP 61-232085 (JP, A) JP 62-28095 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB) Name) B23K 26/00-26/42
Claims (9)
材を、レーザビームを高エネルギー密度に集光した熱源
を用いて加工するレーザ加工方法において、 前記被加工材の加工開始点から加工経路に沿った所定の
距離を、複数回のレーザ加工により、加工開始穴を貫通
させ、その後、次の切断加工動作へと移行することを特
徴とするレーザ加工方法。The method according to claim 1 combustion tends workpiece as combustible material, in the laser processing method for processing using a heat source obtained by focusing laser beams on the high energy density, the machining start point of the workpiece machining Predetermined along the route
The distance, the laser processing of a plurality of times, a machining start hole to penetrate <br/>, then the laser processing method characterized by proceeds to the next cutting operation.
被加工材の表面に対して任意の所定量だけレーザビーム
の集光ポイントを上方または下方へ変位させてレーザビ
ームを照射し、前記被加工材の切断溝を所望の形状に形
成することを特徴とする請求項１に記載のレーザ加工方
法。2. Further, after passing through the processing start hole,
A laser beam is emitted by displacing the focusing point of the laser beam upward or downward by an arbitrary predetermined amount with respect to the surface of the work material, and the cutting groove of the work material is formed into a desired shape. The laser processing method according to claim 1.
ザ加工は、初回と第２回目以降のレーザビームの照射パ
ワーを変化させることを特徴とする請求項１または請求
項２に記載のレーザ加工方法。3. A plurality of lays performed along the processing path
The laser processing method according to claim 1, wherein the processing is performed by changing the irradiation power of the laser beam for the first time and for the second time and thereafter.
ザ加工は、初回のレーザビームの照射パワーで被加工材
の板厚の１／３乃至２／３程度の深さまで除去し、第２
回目以降のレーザビームの照射パワーを前記初回の照射
パワーよりも低く設定して残存部分の除去を行うことを
特徴とする請求項１乃至請求項３の何れか１つに記載の
レーザ加工方法。4. A plurality of lays performed along the processing path
The processing is performed by removing the depth of about 1/3 to 2/3 of the plate thickness of the workpiece with the irradiation power of the first laser beam.
4. The laser processing method according to claim 1, wherein the irradiation power of the laser beam after the second time is set lower than the irradiation power of the first time to remove the remaining portion.
材に対してレーザビームを照射する加工ヘッドと、前記
加工ヘッドと前記被加工材との位置制御を行う制御・電
源装置とを備えたレーザ加工装置において、前記制御・電源装置は、前記被加工材の加工開始点から
加工経路に沿った所定の距離を、前記加工ヘッドから照
射されるレーザビームによる複数回のレーザ加工により
加工開始穴を貫通させ、次の切断加工動作へと移行する
ように動作することを 特徴とするレーザ加工装置。5. A processing head for irradiating a work material, such as a flammable material, which is easily burnt with a laser beam,
Control / electric control that controls the position between the processing head and the workpiece.
In the laser processing apparatus including a source device , the control / power supply device is provided from a processing start point of the workpiece.
A predetermined distance along the machining path is illuminated from the machining head.
By laser processing multiple times by the emitted laser beam
Penetrate the machining start hole and move to the next cutting machining operation
A laser processing device that operates as follows .
被加工材の表面に対して任意の所定量だけレーザビーム
の集光ポイントを上方または下方へ変位させてレーザビ
ームを照射し、前記被加工材の切断溝を所望の形状に形
成することを特徴とする請求項５に記載のレーザ加工装
置。6. Further, after the processing start hole is penetrated,
A laser beam is emitted by displacing the focusing point of the laser beam upward or downward by an arbitrary predetermined amount with respect to the surface of the work material, and the cutting groove of the work material is formed into a desired shape. The laser processing apparatus according to claim 5.
ザ加工は、初回と第２回目以降のレーザビームの照射パ
ワーを変化することを特徴とする請求項５または請求項
６に記載のレーザ加工装置。7. A plurality of lasers performed along the processing path
The laser processing apparatus according to claim 5, wherein the processing changes the irradiation power of the laser beam for the first time and for the second time and thereafter.
ザ加工は、初回のレーザビームの照射パワーで被加工材
の板厚の１／３乃至２／３程度の深さまで除去し、第２
回目以降のレーザビームの照射パワーを前記初回の照射
パワーよりも低く設定して残存部分の除去を行うことを
特徴とする請求項５乃至請求項７の何れか１つに記載の
レーザ加工装置。8. A plurality of lays performed along the processing path
The processing is performed by removing the depth of about 1/3 to 2/3 of the plate thickness of the workpiece with the irradiation power of the first laser beam.
8. The laser processing apparatus according to claim 5, wherein the irradiation power of the laser beam after the second time is set lower than the irradiation power of the first time to remove the remaining portion.
ザ加工における初回のレーザビームの照射パワーと第２
回目以降のレーザビームの照射パワーは、パルス発振制
御によって決定することを特徴とする請求項５乃至請求
項８の何れか１つに記載のレーザ加工装置。9. A plurality of lays performed along the processing path.
The first laser beam irradiation power in the machining and the second
9. The laser processing apparatus according to claim 5, wherein the irradiation power of the laser beam after the first time is determined by pulse oscillation control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18963496A JP3531370B2 (en) | 1996-07-18 | 1996-07-18 | Laser processing method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18963496A JP3531370B2 (en) | 1996-07-18 | 1996-07-18 | Laser processing method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1034362A JPH1034362A (en) | 1998-02-10 |
| JP3531370B2 true JP3531370B2 (en) | 2004-05-31 |
Family
ID=16244586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18963496A Expired - Fee Related JP3531370B2 (en) | 1996-07-18 | 1996-07-18 | Laser processing method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3531370B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109605138B (en) * | 2019-01-24 | 2020-09-04 | 长春理工大学 | Embedded laser-assisted ultra-precise cylindrical grinding device and working method thereof |
| CN111843237A (en) * | 2020-07-24 | 2020-10-30 | 广州三义激光科技有限公司 | Artificial diamond laser cutting process |
| US11938564B2 (en) * | 2021-04-13 | 2024-03-26 | Saudi Arabian Oil Company | Systems and methods for generating plasma shields |
| CN113070589B (en) * | 2021-04-29 | 2023-06-13 | 深圳市艾雷激光科技有限公司 | Laser cutting method, apparatus and computer readable storage medium |
-
1996
- 1996-07-18 JP JP18963496A patent/JP3531370B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1034362A (en) | 1998-02-10 |
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