JP3530829B2 - Fluororesin composition for electronic parts - Google Patents
Fluororesin composition for electronic partsInfo
- Publication number
- JP3530829B2 JP3530829B2 JP2001068899A JP2001068899A JP3530829B2 JP 3530829 B2 JP3530829 B2 JP 3530829B2 JP 2001068899 A JP2001068899 A JP 2001068899A JP 2001068899 A JP2001068899 A JP 2001068899A JP 3530829 B2 JP3530829 B2 JP 3530829B2
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- liquid crystal
- composition
- crystal polymer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高周波用プリント
基板、ミリ波通信用機器などに用いられ得る、フッ素樹
脂と液晶ポリマーとを含有するフッ素樹脂組成物に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluororesin composition containing a fluororesin and a liquid crystal polymer, which can be used in high frequency printed boards, millimeter wave communication devices and the like.
【０００２】[0002]
【従来の技術】高周波用の電子部品材料としては、静電
正接が低い、低比誘電率であるなどの理由からフッ素樹
脂が汎用されてきた。2. Description of the Related Art As a high frequency electronic component material, a fluororesin has been widely used because of its low electrostatic tangent and low relative dielectric constant.
【０００３】しかし、フッ素樹脂は溶融粘度が極めて高
いため成形性が悪く、通常の射出成形などによる成形が
困難である。わずかにテトラフルオロエチレン−パーフ
ルオロアルキルビニルエーテル共重合体（以下、ＰＦＡ
と記載する場合がある）などの比較的低溶融粘度のフッ
素樹脂を用いて、押出し成形などによるシートの成形が
可能であるにすぎない。従って、例えば、ミリ波ＬＡＶ
システムのトランシーバなどに適用される非放射性誘電
体線路（Non Radiative Dielectric Wave Guide；ＮＲ
Ｄガイド）のような幅の狭いパターンや複雑な形状を精
密に形成するのは困難であり、もしくは歩留まりが極め
て悪いという欠点がある。さらに、フッ素樹脂は熱膨張
係数が大きい（ＰＦＡで約１．００×１０−４／℃）と
いう性質を有する。そのため、例えば、フッ素樹脂基板
の温度変化による膨張・収縮のため充分な寸法安定性が
確保できず、微細なパターンが形成できない。さらに、
フッ素樹脂シートを銅箔と共にホットプレスし、プリン
ト基板を調製したときに、フッ素樹脂を銅箔との熱膨張
係数の差が大きいため、エッチングなどの工程において
銅箔が除去されると基板にそりが生じるなどの欠点があ
る。However, since the fluororesin has a very high melt viscosity, it has poor moldability and is difficult to mold by ordinary injection molding or the like. Slightly tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (hereinafter referred to as PFA
It may only be possible to form a sheet by extrusion molding using a fluororesin having a relatively low melt viscosity. Therefore, for example, a millimeter wave LAV
Non-radiative dielectric applied to system transceivers, etc.
Body line (Non Radiative Dielectric Wave Guide; NR
It is difficult to precisely form a narrow pattern such as a D guide) or a complicated shape, or there is a drawback that the yield is extremely low. Further, the fluororesin has a property of having a large coefficient of thermal expansion (about 1.00 × 10 −4 / ° C. in PFA). Therefore, for example, due to expansion / contraction of the fluororesin substrate due to temperature change, sufficient dimensional stability cannot be ensured and a fine pattern cannot be formed. further,
When a printed circuit board is prepared by hot-pressing a fluororesin sheet together with copper foil, the difference in thermal expansion coefficient between fluororesin and copper foil is large. There are drawbacks such as
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記従来の
課題を解決するものであり、その目的とするところは、
高周波用の電子部品に用いられるフッ素樹脂をベースと
するフッ素樹脂組成物であって、成形性に優れ、かつ得
られる成形体の寸法安定性に優れ、さらにフッ素樹脂が
有する優れた電気特性をそのまま有する、組成物を提供
することにある。DISCLOSURE OF THE INVENTION The present invention is to solve the above-mentioned conventional problems, and an object thereof is to:
A fluororesin composition based on a fluororesin used for high-frequency electronic parts, which has excellent moldability, and also has excellent dimensional stability of the resulting molded product, and further retains the excellent electrical characteristics of the fluororesin. Having a composition.
【０００５】[0005]
【課題を解決するための手段】発明者らは、上記課題を
検討した結果、フッ素樹脂と液晶ポリマーとを含有する
組成物が、成形性に優れ、かつ得られる成形体の寸法安
定性に優れ、さらにフッ素樹脂が有する優れた電気特性
をそのまま保持することを見出し、本発明を完成するに
至った。As a result of studying the above-mentioned problems, the inventors have found that a composition containing a fluororesin and a liquid crystal polymer has excellent moldability and the resulting molded article has excellent dimensional stability. Further, they have found that the excellent electrical characteristics of the fluororesin are maintained as they are, and have completed the present invention.
【０００６】本発明の電子部品用フッ素樹脂組成物は、
フッ素樹脂と液晶ポリマーとを含有し、その溶融粘度が
１０６ｃｐｓ以下である。好適な実施態様においては、
上記液晶ポリマーは、該液晶ポリマーおよび上記フッ素
樹脂の合計量の２〜５０重量％の割合で含有される。本
発明は、上記フッ素樹脂組成物を有する電子部品を包含
する。この電子部品は、例えば高周波基板またはＮＲＤ
ガイドである。The fluororesin composition for electronic parts of the present invention comprises
It contains a fluororesin and a liquid crystal polymer and has a melt viscosity of 10 6 cps or less. In a preferred embodiment,
The liquid crystal polymer is contained in a proportion of 2 to 50% by weight based on the total amount of the liquid crystal polymer and the fluororesin. The present invention includes electronic parts having the fluororesin composition. This electronic component is, for example, a high frequency substrate or NRD.
Be a guide.
【０００７】[0007]
【発明の実施の形態】本発明のフッ素樹脂組成物に用い
られるフッ素樹脂は、特に限定されない。通常、電子部
品の材料などに用いられるフッ素樹脂が、いずれも利用
可能である。例えば、次のフッ素樹脂が用いられる：ポ
リテトラフルオロエチレン（ＰＴＦＥ）、テトラフルオ
ロエチレン−パーフルオロアルキルビニルエーテル共重
合体（ＰＦＡ）、テトラフルオロエチレン−ヘキサフル
オロプロピレン共重合体（ＦＥＰ）、エチレン−テトラ
フルオロエチレン共重合体（ＥＴＦＥ）、ポリビニリデ
ンフルオライド（ＰＶＤＦ）、エチレン−クロロトリフ
ルオロエチレン共重合体（ＥＣＴＦＥ）、ポリクロリネ
ートトリフルオロエチレン（ＰＣＴＦＥ）、ポリビニル
フルオライド（ＰＶＦ）など。これらのフッ素樹脂は単
独で用いられても複数の樹脂の組み合わせで用いられて
もよい。BEST MODE FOR CARRYING OUT THE INVENTION The fluororesin used in the fluororesin composition of the present invention is not particularly limited. Generally, any fluororesin used as a material for electronic parts can be used. For example, the following fluororesins are used: polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), ethylene-tetra. Fluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), ethylene-chlorotrifluoroethylene copolymer (ECTFE), polychlorinate trifluoroethylene (PCTFE), polyvinyl fluoride (PVF) and the like. These fluororesins may be used alone or in combination of a plurality of resins.
【０００８】本発明のフッ素樹脂組成物に用いられる液
晶ポリマーとしては、液晶ポリマーのいずれのタイプを
も使用することが可能である。液晶ポリマーは、主とし
てＩ型、II型、およびIII型に分類される。Ｉ型、II
型、およびIII型の液晶ポリマーは、各々次の繰り返し
単位を有するポリマーである。As the liquid crystal polymer used in the fluororesin composition of the present invention, any type of liquid crystal polymer can be used. Liquid crystal polymers are mainly classified into type I, type II, and type III. Type I, II
Type III and type III liquid crystal polymers are polymers having the following repeating units, respectively.
【０００９】[0009]
【化１】 [Chemical 1]
【００１０】各型の液晶ポリマーは、その鎖長により、
融点などの性質が異なる。本発明において特に好ましい
のはII型の液晶ポリマーである。樹脂組成物の使用目的
により、適切な（例えば適切な融点を有する）液晶ポリ
マーが適宜選択される。Each type of liquid crystal polymer has a chain length
Properties such as melting point are different. Especially preferred in the present invention are the type II liquid crystal polymers. An appropriate liquid crystal polymer (for example, having an appropriate melting point) is appropriately selected depending on the purpose of use of the resin composition.
【００１１】本発明の樹脂組成物は、必要に応じて適切
な添加剤を、該組成物の性質を実質的に変化させない量
で含有し得る。The resin composition of the present invention may optionally contain appropriate additives in an amount that does not substantially change the properties of the composition.
【００１２】本発明の樹脂組成物の溶融粘度は、１０６
ｃｐｓ以下、好ましくは１０４ｃｐｓ以下、さらに好ま
しくは１０３ｃｐｓ以下である。通常、フッ素樹脂の溶
融粘度は高く、例えば、ＰＴＦＥの溶融粘度は１０１１
ｃｐｓ程度であるが、液晶ポリマーと混合することによ
り溶融粘度を効果的に下げることが可能である。上記フ
ッ素樹脂と液晶ポリマーの混合割合は、フッ素樹脂およ
び液晶ポリマーの種類により異なり、特に限定されな
い。上記溶融粘度を達成できるように混合することによ
り、本発明の樹脂組成物が得られる。通常、この樹脂組
成物においては、上記液晶ポリマーは、フッ素樹脂およ
び液晶ポリマーの合計量の２〜５０重量％、好ましくは
２〜２０重量％の割合で含有される。The melt viscosity of the resin composition of the present invention is 10 6
cps or less, preferably 10 4 cps or less, and more preferably 10 3 cps or less. Usually, the melt viscosity of a fluororesin is high, and for example, the melt viscosity of PTFE is 10 11
Although it is about cps, it is possible to effectively reduce the melt viscosity by mixing with a liquid crystal polymer. The mixing ratio of the fluororesin and the liquid crystal polymer varies depending on the types of the fluororesin and the liquid crystal polymer and is not particularly limited. The resin composition of the present invention is obtained by mixing so as to achieve the above melt viscosity. Usually, in the resin composition, the liquid crystal polymer is contained in a proportion of 2 to 50% by weight, preferably 2 to 20% by weight based on the total amount of the fluororesin and the liquid crystal polymer.
【００１３】フッ素樹脂と液晶ポリマーとは均一に混合
されてアロイ化していること（ポリマーブレンドとする
こと；アロイ化しているものも含む）が好ましい。これ
らの樹脂は、押出し機などの汎用の混練機を用いること
により均一に混合され、ポリマーブレンドとされる。こ
れにより、得られる樹脂組成物の溶融粘度はそこに含有
されるフッ素樹脂の溶融粘度よりも低くなり、成形性が
良好となる。It is preferable that the fluororesin and the liquid crystal polymer are uniformly mixed and alloyed (made into a polymer blend; including those alloyed). These resins are uniformly mixed by using a general-purpose kneader such as an extruder to obtain a polymer blend. Thereby, the melt viscosity of the obtained resin composition becomes lower than the melt viscosity of the fluororesin contained therein, and the moldability becomes good.
【００１４】本発明のフッ素樹脂組成物を用いて得られ
る高周波用基板およびＮＲＤガイドの一例を示す模式図
を図１および２に示す。図１の高周波基板は、該樹脂組
成物でなる樹脂シート１の両面に金属箔、例えば銅箔２
を有する構造を有する。金属箔は、片面のみに形成され
ていてもよい。図２のＮＲＤガイドは所定の形状の溝５
を有する金属基板３の該溝５部分に、該樹脂組成物でな
る導波路４を有する。1 and 2 are schematic views showing an example of a high frequency substrate and an NRD guide obtained by using the fluororesin composition of the present invention. The high-frequency substrate of FIG. 1 has a metal sheet, for example, a copper foil 2 on both sides of a resin sheet 1 made of the resin composition.
Has a structure having. The metal foil may be formed on only one side. The NRD guide of FIG. 2 has a groove 5 of a predetermined shape.
A waveguide 4 made of the resin composition is provided in the groove 5 portion of the metal substrate 3 having.
【００１５】上記のように、本発明の組成物は成形性が
良好であるため、例えば上記ＮＲＤガイドような幅の狭
いパターンの成形が可能となる。図２に示すように、所
定の形状の溝５を有する金属基板３の該溝５部分に、本
発明の樹脂組成物を加熱溶融して注入することにより、
該樹脂組成物でなる導波路４を有するＮＲＤガイドが得
られる。このＮＲＤガイドは、図３に示すような従来用
いられているＮＲＤガイド（金属基板３０上にＰＴＦＥ
を切削して得た所定の形状の成形体でなる導波路４０を
接着させて得られるＮＲＤガイド）とは異なり、振動な
どにより該導波路が剥離しにくく、安定した性能が保持
される。As described above, since the composition of the present invention has good moldability, it is possible to mold a narrow pattern such as the NRD guide. As shown in FIG. 2, by heating and melting and injecting the resin composition of the present invention into the groove 5 portion of the metal substrate 3 having the groove 5 of a predetermined shape,
An NRD guide having a waveguide 4 made of the resin composition can be obtained. This NRD guide is a conventionally used NRD guide as shown in FIG.
Unlike the NRD guide obtained by adhering the waveguide 40 formed of a molded body of a predetermined shape obtained by cutting the above, the waveguide is unlikely to peel off due to vibration and the like, and stable performance is maintained.
【００１６】さらに、液晶ポリマーの熱膨張係数は低い
ため、樹脂組成物自体の熱膨張係数が低くなり、例えば
得られる基板の寸法安定性に優れる。液晶ポリマーの熱
膨張係数は銅箔の熱膨張係数に近い。従って、この樹脂
組成物でなるフィルムと銅箔とを積層してプレス成形に
より得られる基板は、エッチングなどにより銅箔が除去
されてもそりが極めて少ない。さらに、エッチング時に
おける吸水率も極めて低い。従って、本発明の樹脂組成
物を用いて多層基板を作製し、各基板のパターンを接続
するため該基板に必要に応じて孔（スルーホールまたは
ビアホール）をあけ金属メッキを行なったときに、該ホ
ールの信頼性が高い。ＬＣＰの比誘電率、誘電正接およ
び吸水率はフッ素樹脂よりはやや高いが、基板の材料と
して汎用されているエポキシ樹脂やポリアミド樹脂に比
べると充分に低い値である。従って、フッ素樹脂にＬＣ
Ｐ樹脂を混合した場合に、得られる樹脂組成物の比誘電
率、誘電正接および吸水率はフッ素樹脂に比べて実質的
には高くならない。Further, since the liquid crystal polymer has a low coefficient of thermal expansion, the resin composition itself has a low coefficient of thermal expansion, and, for example, the obtained substrate has excellent dimensional stability. The coefficient of thermal expansion of liquid crystal polymer is close to that of copper foil. Therefore, a substrate obtained by laminating a film made of this resin composition and a copper foil and performing press molding has very little warpage even if the copper foil is removed by etching or the like. Further, the water absorption rate during etching is also extremely low. Therefore, when a multilayer board is produced using the resin composition of the present invention, and holes (through holes or via holes) are formed in the boards as necessary to connect the patterns of the boards, metal plating is performed. The reliability of the hall is high. The relative permittivity, dielectric loss tangent, and water absorption of LCP are slightly higher than those of fluororesins, but they are sufficiently low values as compared with epoxy resins and polyamide resins that are widely used as a substrate material. Therefore, LC is added to fluororesin.
When P resin is mixed, the relative permittivity, dielectric loss tangent and water absorption of the obtained resin composition are not substantially higher than those of fluororesin.
【００１７】このように、本発明のフッ素樹脂組成物は
成形性が良好であり、該組成物を用いて得られる成形体
は寸法安定性に優れ、温度変化によるそりが極めて少な
い。この組成物は、フッ素樹脂が有する優れた電気特性
をそのまま保持している。従って、本発明の組成物は、
高周波基板、ＮＲＤガイドなど、各種の高周波用電子部
品に好適に利用される。As described above, the fluororesin composition of the present invention has good moldability, the molded product obtained by using the composition has excellent dimensional stability, and warpage due to temperature change is extremely small. This composition retains the excellent electric characteristics of the fluororesin as it is. Therefore, the composition of the present invention is
It is preferably used for various high frequency electronic components such as high frequency substrates and NRD guides.
【００１８】[0018]
【実施例】以下に本発明を実施例につき説明する。EXAMPLES The present invention will be described below with reference to examples.
【００１９】実施例１（樹脂組成物の物性評価）
ＰＴＦＥと、液晶ポリマー（ＬＣＰ樹脂）である６-ヒ
ドロキシ２−ナフトエ酸およびｐ−ヒドロキシ安息香酸
からなる液晶ポリエステルとを、表１に示す重量割合で
混合しポリマーブレンドを得た。これとは別に、ＰＦＡ
と上記ＬＣＰ樹脂とを表１に示す重量割合で混合してポ
リマーブレンドを得た。これらのポリマーブレンドの溶
融粘度を粘弾性測定解析装置などにて測定した。さらに
これらのポリマーブレンドを板状に成形し、線膨張係
数、１２ＧＨｚにおける比誘電率、１２ＧＨｚにおける
誘電正接、および吸水率を測定した。吸水率について
は、ＪＩＳ−Ｃ６４８１の５．１４項の試験方法を適用
して測定を行なった。それらの結果を表１に示す。ＰＴ
ＦＥ、ＰＦＡ、および上記ＬＣＰ樹脂についてもこれら
の値を同様に測定した。その結果を合わせて表１に示
す。Example 1 (Evaluation of Physical Properties of Resin Composition) Table 1 shows the weight of PTFE and a liquid crystal polyester composed of 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid, which are liquid crystal polymers (LCP resins). Polymer blends were obtained by mixing in proportions. Apart from this, PFA
And the above LCP resin were mixed in a weight ratio shown in Table 1 to obtain a polymer blend. The melt viscosity of these polymer blends was measured with a viscoelasticity analysis analyzer or the like. Further, these polymer blends were molded into a plate shape, and the linear expansion coefficient, the relative dielectric constant at 12 GHz, the dielectric loss tangent at 12 GHz, and the water absorption were measured. The water absorption rate was measured by applying the test method of JIS-C6481 item 5.14. The results are shown in Table 1. PT
These values were similarly measured for FE, PFA, and the LCP resin. The results are shown together in Table 1.
【００２０】実施例２（基板のスルーホール信頼性の評
価）
上記実施例１で得られたポリマーブレンドを用いて、下
記の方法により高周波プリント配線用基板を作製した。
この基板は、図１に示すように、押出し成形により得ら
れた厚み０．２ｍｍのポリマーブレンドからなる樹脂シ
ート１の両面に厚み１８μｍの銅箔２をホットプレスし
て得られた。Example 2 (Evaluation of Through Hole Reliability of Substrate) Using the polymer blend obtained in Example 1 above, a substrate for high frequency printed wiring was prepared by the following method.
As shown in FIG. 1, this substrate was obtained by hot-pressing a copper foil 2 having a thickness of 18 μm on both sides of a resin sheet 1 made of a polymer blend having a thickness of 0.2 mm obtained by extrusion molding.
【００２１】これとは別に、比較として上記ポリマーブ
レンドの代わりに、ＰＴＦＥ、ＰＦＡ、および上記ＬＣ
Ｐ樹脂を各々用いて、同様に高周波プリント配線用基板
を作製した。但し、ＰＴＦＥについては、スカイビング
法により樹脂シートを得、これに銅箔をホットプレスし
た。さらに、上記エポキシ樹脂およびポリイミド樹脂を
それぞれ厚み０．０５ｍｍのガラスクロスに含浸させた
後、上記と同様に銅箔をホットプレスし、プリント配線
用基板得た。それぞれの基板は、幅２０ｃｍ、長さ２０
ｃｍ、そして厚みが０．２ｍｍである。Apart from this, for comparison, instead of the polymer blends mentioned above, PTFE, PFA and the above LC were used.
A high frequency printed wiring board was similarly prepared using each of the P resins. However, regarding PTFE, a resin sheet was obtained by a skiving method, and a copper foil was hot-pressed on the resin sheet. Further, each of the epoxy resin and the polyimide resin was impregnated in a glass cloth having a thickness of 0.05 mm, and then a copper foil was hot pressed in the same manner as above to obtain a printed wiring board. Each substrate has a width of 20 cm and a length of 20
cm, and the thickness is 0.2 mm.
【００２２】得られた基板のスルーホール信頼性をＩＰ
Ｃ−ＴＭ−６５０の試験方法に準拠して評価した。この
方法においては、検体の基板を２０℃の液中および２６
０℃の液中に交互に１０秒間ずつ浸漬し、これを１サイ
クルとして、スルーホール導通抵抗値が１０％以上増加
したサイクル数を調べた。エポキシ樹脂含浸ガラスクロ
ス基板およびポリイミド樹脂含浸ガラスクロス基板につ
いては、該基板（銅箔を含まない）の比誘電率、誘電正
接、および吸水率についても測定を行なった。それぞれ
の結果を下記の表１に示す。The through-hole reliability of the obtained substrate is IP
It evaluated based on the test method of C-TM-650. In this method, the sample substrate is placed in a liquid at 20 ° C.
The samples were alternately immersed in a liquid at 0 ° C. for 10 seconds each, and one cycle was used to examine the number of cycles in which the through-hole conduction resistance value increased by 10% or more. With respect to the epoxy resin-impregnated glass cloth substrate and the polyimide resin-impregnated glass cloth substrate, the relative dielectric constant, dielectric loss tangent, and water absorption of the substrate (not including the copper foil) were also measured. The respective results are shown in Table 1 below.
【００２３】[0023]
【表１】 [Table 1]
【００２４】実施例３（ＮＲＤガイドの作製）
図２に示すように、所定の形状の溝を有する金属基板の
該溝部分に、実施例１で得たＰＦＡ／ＬＣＰポリマーブ
レンド（混合比：９０／１０）を加熱溶融して注入し、
所定の形状の導波路４を有するＮＲＤガイドを作製し
た。このＮＲＤガイドは長期間にわたる使用においても
剥離することがなく、安定した性能を保持した。Example 3 (Preparation of NRD guide) As shown in FIG. 2, the PFA / LCP polymer blend obtained in Example 1 (mixing ratio: 90) was added to the groove portion of a metal substrate having a groove having a predetermined shape. / 10) is melted by heating and injected,
An NRD guide having a waveguide 4 having a predetermined shape was produced. This NRD guide did not peel off even after long-term use and maintained stable performance.
【００２５】[0025]
【発明の効果】本発明は、このように、高周波用の電子
部品に用いられ得る、フッ素樹脂をベースとしたフッ素
樹脂組成物が提供される。この材料は成形性に優れるた
め、複雑で微細な形状を有する成形体であっても射出成
形などの手段により容易に成形することが可能である。
得られた成形体は、寸法安定性に優れるため、例えば、
微細なパターンが形成される積層基板であっても効果的
に調製することが可能である。さらに、この材料で表面
に銅箔を有する基板を調製した場合に、エッチングなど
により銅箔が除去されてもそりが極めて少なく、さら
に、エッチング時における吸水率も極めて低い。スルー
ホール信頼性も高い。As described above, the present invention provides a fluororesin-based fluororesin composition that can be used in high-frequency electronic components. Since this material has excellent moldability, even a molded body having a complicated and fine shape can be easily molded by means such as injection molding.
The obtained molded article has excellent dimensional stability, and therefore, for example,
It is possible to effectively prepare even a laminated substrate on which a fine pattern is formed. Furthermore, when a substrate having a copper foil on the surface is prepared from this material, even if the copper foil is removed by etching or the like, the warpage is extremely small, and the water absorption rate at the time of etching is also extremely low. Through hole reliability is also high.
【００２６】このように、本発明のフッ素樹脂組成物は
成形性が良好であり、該組成物を用いて得られる成形体
は寸法安定性に優れ、温度変化によるそりが極めて少な
い。従って、本発明のフッ素樹脂組成物は、高周波基
板、ＮＲＤガイド、各種の高周波用電子部品に好適に利
用される。As described above, the fluororesin composition of the present invention has good moldability, the molded product obtained by using the composition has excellent dimensional stability, and warpage due to temperature change is extremely small. Therefore, the fluororesin composition of the present invention is suitable for use in high frequency substrates, NRD guides and various high frequency electronic components.
【図１】本発明のフッ素樹脂組成物を用いて得られる高
周波用基板の模式図である。FIG. 1 is a schematic view of a high frequency substrate obtained by using the fluororesin composition of the present invention.
【図２】本発明のフッ素樹脂組成物を用いて得られるＮ
ＲＤガイドを示す模式図である。FIG. 2 shows N obtained by using the fluororesin composition of the present invention.
It is a schematic diagram which shows an RD guide.
【図３】従来のＮＲＤガイドを示す模式図である。FIG. 3 is a schematic diagram showing a conventional NRD guide.
１ 樹脂シート ２ 銅箔 ３、３０ 金属基板 ４、４０ 導波路 ５ 溝 1 resin sheet 2 copper foil 3, 30 Metal substrate 4,40 Waveguide 5 grooves
フロントページの続き (56)参考文献 特開2001−26699（ＪＰ，Ａ) 特開2001−7613（ＪＰ，Ａ) 特開2000−313812（ＪＰ，Ａ) 特昭63−230756（ＪＰ，Ａ) 特開 平９−219608（ＪＰ，Ａ) 特開 平８−181509（ＪＰ，Ａ) 特開 平７−272801（ＪＰ，Ａ) 特開 平７−138440（ＪＰ，Ａ) 特開 平７−94916（ＪＰ，Ａ) 特開 平２−110156（ＪＰ，Ａ) 特開 平２−107656（ＪＰ，Ａ) 特開 平２−73843（ＪＰ，Ａ) 特開 平１−263144（ＪＰ，Ａ) 特開 平１−197551（ＪＰ，Ａ) 特開 平１−165647（ＪＰ，Ａ) 特公 平４−5693（ＪＰ，Ｂ２) (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 27/12 - 27/20 C08L 67/03 H01P 3/16 Continuation of the front page (56) References JP 2001-26699 (JP, A) JP 2001-7613 (JP, A) JP 2000-313812 (JP, A) JP 63-230756 (JP, A) JP Kaihei 9-219608 (JP, A) JP 8-181509 (JP, A) JP 7-272801 (JP, A) JP 7-138440 (JP, A) JP 7-94916 ( JP, A) JP 2-110156 (JP, A) JP 2-107656 (JP, A) JP 2-73843 (JP, A) JP 1-263144 (JP, A) JP 1-197551 (JP, A) JP-A-1-165647 (JP, A) Japanese Patent Publication 4-5693 (JP, B2) (58) Fields investigated (Int.Cl. 7 , DB name) C08L 27 / 12-27/20 C08L 67/03 H01P 3/16
Claims (5)
に、フッ素樹脂組成物を加熱溶融して注入し、該組成物
でなる導波路を形成する工程を包含し、 該フッ素樹脂組成物が、フッ素樹脂と液晶ポリマーとを
含有し、その溶融粘度が１０６ｃｐｓ以下である、製造
方法。1. A method of manufacturing an NRD guide, which comprises melting and injecting a fluororesin composition into a groove portion of a substrate having a groove of a predetermined shape for forming a waveguide by heating and melting the composition. A method for producing, comprising the step of forming a waveguide, wherein the fluororesin composition contains a fluororesin and a liquid crystal polymer, and has a melt viscosity of 10 6 cps or less.
び前記フッ素樹脂の合計量の２〜５０重量％の割合で前
記組成物中に含有される、請求項１に記載の製造方法。2. The method according to claim 1, wherein the liquid crystal polymer is contained in the composition in a proportion of 2 to 50% by weight based on the total amount of the liquid crystal polymer and the fluororesin.
レンおよびテトラフルオロエチレン−パーフルオロアル
キルビニルエーテル共重合体のうちの少なくとも一方で
ある、請求項１または２に記載の製造方法。3. The method according to claim 1, wherein the fluororesin is at least one of polytetrafluoroethylene and a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer.
フトエ酸およびｐ−ヒドロキシ安息香酸からなる液晶ポ
リエステルである、請求項１から３のいずれかに記載の
製造方法。4. The production method according to claim 1, wherein the liquid crystal polymer is a liquid crystal polyester composed of 6-hydroxy-2-naphthoic acid and p-hydroxybenzoic acid.
り得られるＮＲＤガイド。5. An NRD guide obtained by the manufacturing method according to claim 1.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001068899A JP3530829B2 (en) | 2001-03-12 | 2001-03-12 | Fluororesin composition for electronic parts |
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| JP3530829B2 true JP3530829B2 (en) | 2004-05-24 |
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| KR101615082B1 (en) | 2011-03-24 | 2016-04-29 | 키사, 아이엔씨. | Integrated circuit with electromagnetic communication |
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| WO2012174350A1 (en) | 2011-06-15 | 2012-12-20 | Waveconnex, Inc. | Proximity sensing and distance measurement using ehf signals |
| JP2014528492A (en) * | 2011-09-30 | 2014-10-27 | サン−ゴバン パフォーマンス プラスティックス コーポレイション | Melt-processed fluoropolymer article and method for melt-processing fluoropolymer |
| TWI562555B (en) | 2011-10-21 | 2016-12-11 | Keyssa Inc | Contactless signal splicing |
| EP2792031A1 (en) | 2011-12-14 | 2014-10-22 | Keyssa, Inc. | Connectors providing haptic feedback |
| CN104272284B (en) | 2012-03-02 | 2017-09-08 | 凯萨股份有限公司 | duplex communication system and method |
| EP2832192B1 (en) | 2012-03-28 | 2017-09-27 | Keyssa, Inc. | Redirection of electromagnetic signals using substrate structures |
| US10305196B2 (en) | 2012-04-17 | 2019-05-28 | Keyssa, Inc. | Dielectric lens structures for EHF radiation |
| TWI595715B (en) | 2012-08-10 | 2017-08-11 | 奇沙公司 | Dielectric coupling systems for ehf communications |
| CN106330269B (en) | 2012-09-14 | 2019-01-01 | 凯萨股份有限公司 | Wireless connection with virtual magnetic hysteresis |
| WO2014100058A1 (en) | 2012-12-17 | 2014-06-26 | Waveconnex, Inc. | Modular electronics |
| CN105264785B (en) | 2013-03-15 | 2017-08-11 | 凯萨股份有限公司 | Extremely high frequency communication chip |
| EP2974504B1 (en) | 2013-03-15 | 2018-06-20 | Keyssa, Inc. | Ehf secure communication device |
| CN110669302A (en) * | 2018-07-02 | 2020-01-10 | 清华大学 | Fluorine-containing resin composition and method for producing same |
| WO2020190488A1 (en) * | 2019-03-18 | 2020-09-24 | Corning Incorporated | Composites for high-frequency printed circuit boards and methods of making |
| CN114208401A (en) * | 2019-08-06 | 2022-03-18 | 株式会社村田制作所 | Resin multilayer substrate and method for manufacturing resin multilayer substrate |
| WO2021095656A1 (en) | 2019-11-11 | 2021-05-20 | Ａｇｃ株式会社 | Powder composition, film, and method for producing film |
| CN113024973A (en) * | 2019-12-24 | 2021-06-25 | 大金工业株式会社 | Composition and injection molded article |
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