JP3525000B2 - Semiconductor test equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus in which a performance board is mounted at a predetermined position on a test head to measure a device under test on the performance board, and more particularly to a performance board for the test head. The replacement workability of the is improved.

[0002]

2. Description of the Related Art A performance board on which a device under test is mounted is set on a test head, and a signal required for a test is transmitted from the test head to the device under test. The performance board is usually set by pin-engaging the performance board at a predetermined position on the test head, pressing the performance board against the test head, and pressing the pogo pin on the test head side against the performance board.

FIG. 9 is an explanatory diagram showing a state of pin engagement when the performance board 52 is replaced with respect to the test head 50. In order to mount the performance board 52 at a predetermined position on the test head 50, a plurality of guide pins 51 are vertically provided on the test head 50.
The performance board 52 is provided with a guide hole 53 that engages with the guide pin 51. By engaging the guide hole 53 with the guide pin 51 of the test head 50, the performance board 52 is moved to a predetermined position of the test head 50. It can be attached to.

As shown in the figure, the performance board 52 is provided with a reinforcing frame 54 on the periphery thereof, and a plurality of handles 55 are attached to the reinforcing frame 54. When removing the performance board 52, one or two people grasp this handle 55 and lift the performance board 52 to release the pin engagement. When mounting, the guide hole 53 of the performance board 52 should be connected to the test head 50.
The guide pins 51 are engaged with each other.

[0005]

However, the conventional manual replacement work of the performance board described above has the following problems.

(1) Generally, since the performance board is large and heavy, if the replacement work of the performance board is manually performed all the time, the workability is poor and there is a risk of dropping the performance board on the test head.

(2) In order to remove the performance board, if the performance board is not lifted vertically when it is lifted, the guide pin may come into contact with the guide hole, and the guide pin may be rubbed or caught, which makes it very difficult to pull out the performance board.

(3) If the performance board cannot be removed smoothly, an extra external force may be applied to the pogo pin that is in pressure contact with the performance board, and the pogo pin may be damaged.

(4) When mounting the performance board, it is necessary to align the guide hole of the performance board with the guide pin of the test head, but at that time, the guide pin must be searched by looking through the small guide hole. , It is difficult to align the position.

An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a semiconductor test apparatus capable of facilitating the work of exchanging a performance board.

[0011]

According to a first aspect of the present invention, a performance board on which a device to be measured is mounted is provided with a guide hole, and the guide hole is engaged with a guide pin provided on a test head. In a semiconductor testing device in which a performance board is mounted at a predetermined position on the head, it is a mounting member for temporarily mounting the performance board, and is provided so that it can be raised and lowered, and when mounted, it is mounted on the test head. The performance board was lifted to a position higher than the guide pin to disengage the pin engagement between the guide pin and the guide hole, and the performance board was placed on the mounting member from the test head and mounted on the mounting member at the time of mounting. Lower the performance board to engage the guide pins with the guide holes and place the performance board on the mount. A mounting member replaced mounted on the test head from, in which an actuator for raising and lowering the the placing rest members vertically.

In the first invention, when the performance board is removed from the test head, the lowered mounting member is raised by the actuator, and the performance board is replaced from the test head onto the mounting member. Since the actuator is automatically raised by the actuator rather than manually, the performance board can be easily disengaged from the pin engagement and disengaged from the test head without being rubbed with the guide pin or caught on the guide pin during the ascent.

When mounting the performance board on the test head, the mounting member is previously raised by the actuator to a position higher than the guide pin, and at that position the performance board is temporarily mounted on a predetermined position on the mounting member and then mounted. The mounting member is lowered by the actuator as it is, the performance board on the mounting member is replaced on the test head, and the guide pin is engaged with the guide hole to be mounted. In this way, the performance board is once placed on the mounting member and then replaced with the test head, so there is no need to directly align the guide board with the guide pin while holding the large and heavy performance board, and workability is greatly improved. To do.

According to a second aspect of the present invention, in the first aspect, the mounting member includes two arms that support two opposite sides of the lower surface of the performance board, and positioning pins provided on the arms. The performance board is provided with positioning pin holes that engage with the positioning pins. According to this, since the mounting member has an arm shape,
It is relatively easy to configure.

In a third aspect based on the first aspect, the mounting member is composed of two arms that support two opposite sides of the lower surface of the performance board, and the performance board is engaged with both ends of the arm. An engaging protrusion is provided to position the performance board in combination. According to this, the performance board can be easily positioned on the arm only by engaging the engaging protrusions provided on the performance board with both ends of the arm.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the mounting member is composed of two L-shaped cross-section members engaging with opposite corners on the lower surface side of the performance board. Tapers are provided at both opposite corners of the side to facilitate engagement with the L-shaped member in cross section. According to this, using the taper, the two cross sections L
The performance board can be easily positioned on the L-shaped member simply by sliding the performance board between the L-shaped members.

In a fifth aspect based on the first aspect, a plurality of positioning pins for supporting the lower surface of the performance board in a dot shape by the mounting member described above, and a collar-shaped stopper provided below the positioning pins. The performance board is provided with positioning pin holes that engage with the positioning pins. According to this, since the mounting member has a pin shape, the configuration is simple and the amount of members is small.

According to a sixth aspect of the present invention, in the first aspect, the mounting member is composed of a frame that supports the four sides of the lower surface of the performance board, and when the performance board is mounted on the frame, the performance board is framed. In order to be positioned at the center of the frame, the entire circumference of the frame is provided with an inclination that falls from the outside to the inside of the frame. According to this, since the frame is provided with the inclination, the performance board can be easily positioned at the center position of the frame by sliding on the frame.

In a seventh aspect based on the sixth aspect, the positioning pin is provided on the frame, and the positioning pin hole for engaging with the positioning pin is provided on the performance board. According to this, the performance board positioned at the center position of the frame can be fixed by pin engagement.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a semiconductor test apparatus of the present invention will be described below. The shape of the test head is divided into two types, and there are a rectangular parallelepiped body having a parallel arrangement of internal daughter boards and a cylindrical body having a radial arrangement.

First, a case of a parallel-arranged type rectangular parallelepiped test head will be described. FIG. 1 is a perspective view of a parallel-type parallelepiped test head and a performance board mounted on the test head, and FIG. 2 is a cross-sectional view of a main part of the test head with the test head mounted.

As shown in FIG. 2, daughter boards 2 are provided in parallel inside the test head 1, and a large number of pogo pins 7 are attached to the daughter board 2. These pogo pins 7 are mounted on the test head 1. The performance board 10 and the daughter board 2 are electrically connected to each other by being pressed against the land portion 8 of the board 10.

At a predetermined position of the test head 1, a plurality of guide pins 3 are vertically provided for mounting the performance board 10 at a predetermined position on the test head 1.
The performance board 10 is provided with a plurality of guide holes 11 that engage with the plurality of guide pins 3 of the test head 1.

As shown in FIG. 1, at the left and right ends of the test head 1, a plate as a mounting member for temporarily mounting the performance board 10 by supporting two opposite sides of the lower surface of the performance board 10. -Shaped arms 4 are provided in parallel. The arm 4 is provided so as to be vertically movable.
At the time of removal, the test head 1 is lifted to a position higher than the guide pin 3, and the performance board 10 that is pin-engaged and mounted on the test head 1 is dismounted from the test head 1 on the arm 4 during the ascending process. Remove. At the time of mounting, the performance board 10 is sunk into the test head 1, and in the lowering process, the performance board 10 is replaced from the arm 4 onto the test head 1 and mounted on the test head 1 while being pin-engaged.

Performance board 1 for arm 4
A plurality of positioning pins 5 are provided on the arm 4 to facilitate the positioning of 0. Correspondingly, the reinforcing frame 12 of the performance board 10 is provided with a plurality of positioning pin holes 13 that engage with the positioning pins 5. The positioning accuracy of the performance board 10 on the arm 4 is not as high as the positioning accuracy on the test head 1 since it is a temporary placement, and therefore the positioning pin 5 is made thinner than the guide pin 3.
Positioning pin hole 13 provided on the performance board 10
Make an idiot.

Each arm 4 is vertically moved by a plurality of, for example, two actuators 6 provided at appropriate intervals while maintaining a horizontal state. The actuator 6 may be, for example, an air cylinder, a hydraulic cylinder, a motor, or the like.

Now, the operation of the above configuration will be described.

When the performance board 10 mounted on the test head 1 is removed from the test head 1, the actuator 6 is driven and the arm 4 submerged in the test head 1 is lifted vertically to move the test head 1. The performance board 10 is replaced on the arm 4 from above 1. The performance board 10 is lifted above the guide pins 3 and removed from the test head 1. At this time, the performance board 10 rises in a horizontal state supported on the two arms 4, so that the guide pin 3 naturally comes out of the guide hole 11, and the guide hole 11 rubs against the guide pin 3 or the guide pin 3. It does not get caught in. At this time, performance board 10
Since the pogo pin 7 that has been press-contacted with is not subjected to an extraneous external force, there is no risk of damage.

When the performance board 10 is mounted on the test head 1, the arm 4 is moved by the actuator 6.
Is raised to a position higher than the guide pin 3, the performance board 10 is once placed at a predetermined position on the arm 4 at that position, and the positioning pin 5 and the positioning pin hole 13 are engaged with each other by a pin. At this time, since the positioning pin holes 13 provided on the performance board 10 are foolish holes with respect to the positioning pins 5 on the arm 4, they can be roughly placed. When the performance board 10 is placed on the arm 4, the actuator 6 is driven, and the arm 4 is lowered as it is to lower the performance board 10 on the test head 1. At this time, performance board 10
Is roughly placed on the arm 4, but when the arm 4 is remounted on the test head 1, the position of the performance board 10 is automatically corrected by engaging the guide pin 3 with the guide hole 11. Therefore, the guide pin 3 of the test head 1 and the guide hole 11 of the performance board 10 are closely engaged with each other. Therefore, arm 4
Since it is possible to align the guide pins 3 by simply placing it on the predetermined position above, the workability is much improved compared to the case where the performance board 10 is directly aligned with the guide pins 3, and the position of the guide pins 3 is improved. Matching becomes easy.

The above embodiment can be modified as follows. As shown in FIG. 3, the engaging projection 15 orthogonal to the arm 4 is provided to the reinforcing frame 1 of the performance board 10.
If the performance board 10 is positioned on the arm 4 by engaging both ends of each arm 4 provided on the test head 1 side so as to be sandwiched between them, the position of the arm 4 can be determined. The output pin can be omitted.
According to this, when the performance board 10 is placed on the arm 4, the one engaging projection 15 is bridged between the arms 4 like a bridge and then the performance board 1 is mounted.
If 0 is shifted in the length direction of the arm 4, both engaging protrusions 15 are easily set at both ends of the arm 4, so that the engagement becomes easier than the pin engagement. In the illustrated example, the long engaging projections 15 are provided on the two opposite sides of the reinforcing frame 12 over the entire length, but short engaging projections may be provided at the four corners of the performance board 10.

The mounting member is not limited to the plate-shaped arm described above. For example, as shown in FIG. 4A, both corners 1 of opposite sides on the lower surface side of the performance board 10
8 has two L-shaped cross-section members 16 to engage with each other, and a taper 17 for facilitating the engagement with the L-shaped cross-section members 16 is provided at the corners of the opposite sides on the lower surface side of the performance board 10. You may When the taper 17 cannot be directly attached to the corner of the performance board 10, as shown in FIG. 4B, arms 19 with the taper 17 are provided on both sides of the performance board 10, and the arm 19 is set to L.
It may be locked on the character member 16. According to these, instead of being mounted on the arm that is completely hidden behind the performance board 10 and disappeared as in the above-described embodiment, it is partially visible even after mounting.
Since the performance board 10 is mounted on the character-shaped member and the performance board 10 is tapered, the mounting is further facilitated.

Further, as shown in FIG. 5, the mounting member has a pin shape, four positioning pins 21 for supporting the performance board in a dot shape, and a collar-shaped member provided below the positioning pins 21. It can also be configured with the stopper 22. The performance board engages with the positioning pins 21,
It is supported on the stopper 22.

Further, the mounting member may be a frame 25 closed in a rectangular shape as shown in FIG. in this case,
When the performance board is placed on the frame 25,
In order to guide the performance board to the central position of the frame 25, the frame 25 is provided all around the surface of the frame 25.
It is preferable to provide a slope 27 that falls from the outside to the inside. Although the positioning pin 26 may be provided on the frame 25 as shown in FIG. 6B, it may not be provided as shown in FIG. 6A. As a result, when the performance board hits the inclination of the frame 25, the performance board slides and can be automatically positioned. In particular, the frame 2 with a slope
When the positioning pin 26 is provided on the frame 5, the frame 25
Simply by placing the performance board on the top and sliding it, the positioning pin holes provided in the performance board automatically engage with the positioning pins 26, and the position of the performance board on the frame 25 is determined.

Next, the case of a test head having a radial array type cylindrical body will be described. As shown in FIG. 7, the test head 31 has a daughter board 32 inside thereof.
The basic configuration is the same as in the case of the parallel arrangement except that is in a radial arrangement. Some of them have a microscope insertion hole 33 at the center of the test head 31. Performance board 4 for radial array
The mounting member 35 on which 0 is temporarily mounted is a ring 35 as shown in the figure, or an arc shape (a), a pin shape (b), or a microscope insertion hole as shown in FIG. When 33 is present, it can be formed into a disc shape (c) that can be accommodated therein by using the microscope insertion hole 33. These can also be provided with positioning pins 36 and can be provided with an inclination. Also in this case, the same operation and effect as in the case of the parallel-arranged test heads can be obtained.
In FIG. 7, 37 is an actuator, 41 is a guide hole, 42 is a microscope insertion hole, and 43 is a positioning pin hole.

[0035]

According to the present invention, the performance board is automatically placed on the mounting member from the test head so that the performance board can be automatically removed without manual operation. It is easy to remove the performance board without getting caught in. Therefore, it is possible to effectively prevent breakage of the pogo pin or the connector of the test head. Also, when mounting the performance board, place the performance board on the mounting member once and lower the performance board placed on this mounting member to replace the performance board from the mounting member on the test head, Moreover, since the guide pin on the test head can be engaged with the pin, the alignment on the test head becomes easy.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a parallel-arranged test head and a performance board mounted thereon for explaining a semiconductor test apparatus according to a first embodiment of the present invention.

FIG. 2 is a main-portion cross-sectional view of a test head to which the performance board according to the first embodiment is mounted.

FIG. 3 is a schematic view of a test head and a performance board mounted on the test head according to the second embodiment.

FIG. 4 is a schematic view showing a state where a performance board is placed on an L-shaped placing member according to the third embodiment.

FIG. 5 is a schematic view showing a pin-shaped mounting member showing a fourth embodiment.

FIG. 6 is a schematic view of a frame-shaped mounting member showing a fifth embodiment.

FIG. 7 is a schematic view of a radial arrangement of test heads and a performance board mounted thereon according to a sixth embodiment.

FIG. 8 is a schematic view of various mounting members showing a seventh embodiment.

FIG. 9 is a schematic view of a conventional test head and a performance board mounted on the test head.

[Explanation of symbols]

1 test head 3 guide pins 4 arm (mounting member) 5 Positioning pin 6 actuators 10 performance board 11 Guide hole 13 Positioning pin hole

Continuation of the front page (56) Reference JP-A-1-259277 (JP, A) JP-A-3-53179 (JP, A) JP-A-6-118112 (JP, A) JP-A-7-27820 (JP , A) JP 7-130801 (JP, A) JP 6-130111 (JP, A) JP 1-100938 (JP, A) JP 63-222274 (JP, A) 7-41474 (JP, U) (58) Fields surveyed (Int.Cl. ⁷ , DB name) G01R 31/26-31/3193 G01R 1/06-1/073 H01L 21/66

Claims (7)

(57) [Claims] 1. A performance board on which a device under test is mounted is provided with a guide hole, and the guide hole is engaged with a guide pin provided on the test head to mount the performance board at a predetermined position on the test head. In the semiconductor test device configured as described above, it is a mounting member for temporarily mounting the performance board, and is provided so that it can be moved up and down.When removing the performance board, the performance board mounted on the test head is positioned higher than the guide pins. To remove the pin engagement between the guide pin and the guide hole, replace the performance board from the test head on the mounting member, and when mounting, lower the performance board mounted on the mounting member to remove the guide pin. Replace the performance board from the mounting member on the test head by engaging the pin with the guide hole. A semiconductor test apparatus comprising: a mounting member for moving the mounting member; and an actuator for moving the mounting member up and down. 2. The mounting member comprises two arms for supporting two opposite sides of the lower surface of the performance board, and positioning pins provided on the arms, and the performance board is engaged with the positioning pins. The semiconductor testing device according to claim 1, wherein a positioning pin hole is provided for matching. 3. The mounting member is composed of two arms supporting two opposite sides of the lower surface of the performance board, and the performance board is engaged with both ends of the arm to position the performance board. The semiconductor test apparatus according to claim 1, wherein a protrusion is provided. 4. The mounting member is composed of two L-shaped cross-section members engaging with opposite corners on the lower surface side of the performance board, and the cross-sections are provided on both opposite corners on the lower surface side of the performance board. The semiconductor test apparatus according to claim 1, wherein a taper is provided to facilitate engagement with the L-shaped member. 5. The mounting member comprises a plurality of positioning pins for supporting the lower surface of the performance board in a dot shape, and a collar-shaped stopper provided below the positioning pins. The semiconductor test apparatus according to claim 1, further comprising a positioning pin hole that engages with the positioning pin. 6. The mounting member comprises a frame for supporting the four sides of the lower surface of the performance board, and when the performance board is mounted on the frame, the performance board is positioned in the center of the frame. The semiconductor test apparatus according to claim 1, wherein an inclination that falls from the outside to the inside of the frame is provided on the entire circumference of the frame. 7. The semiconductor testing device according to claim 6, wherein positioning pins are provided on the frame, and positioning pin holes for engaging with the positioning pins are provided on the performance board.