JP3524258B2 - Method of manufacturing inkjet head - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an inkjet head for discharging a printing liquid used in an inkjet printing system. More specifically, the present invention provides a photosensitive resin that contributes to the formation of an ink flow path on an inkjet head substrate, and further provides a coating resin on the photosensitive resin, and then, The present invention relates to a method for manufacturing an inkjet head including a step of forming an ink flow path by dissolving and removing a resin.

[0002]

2. Description of the Related Art An ink jet head used in an ink jet printing system (liquid jet recording system) generally has an ejection port (hereinafter also referred to as an orifice) for ejecting a printing liquid (ink) and the ejection port. It is provided with an ink flow path communicating with each other and a liquid ejection energy generating element provided in the ink flow path. As a method of manufacturing such an inkjet head, for example,
After forming a groove for forming a fine ink flow path on a plate such as glass or metal by a processing means such as cutting or etching, an ink jet head substrate provided with a liquid ejection energy generating element is bonded to the plate on which the groove is formed. Then, a method of forming an ink flow path is known.

However, in the method of manufacturing an ink jet head according to the conventional method, it is difficult to smooth the inner wall surface of the groove when the groove is formed by a cutting process, and the plate is not chipped or cracked. Yield is not so good because it easily occurs. On the other hand, when the groove is formed by etching, it is difficult to make the etching state uniform for all the ink flow path forming grooves, and there is a disadvantage that the process is complicated and the manufacturing cost is increased. is there. Therefore, it is difficult to consistently produce an inkjet head having a uniform ink flow path shape by any of these processing means, and the obtained inkjet head tends to have variations in print characteristics. Furthermore, when joining the plate in which the groove for forming the ink flow path described above and the inkjet head substrate provided with the ejection energy generating element,
It is difficult to align the groove with the ejection energy generating element. Therefore, the above-described conventional inkjet head manufacturing method is not suitable for mass-producing high-quality inkjet heads.

In order to solve these problems in the prior art, US Pat. No. 4,450,455 (hereinafter referred to as
It is referred to as "Document 1". ), A dry film made of a photosensitive resin material is provided on the inkjet head substrate on which the liquid ejection energy generating element is formed, and a groove for forming an ink flow path is formed on the dry film by photolithography, A method has been proposed in which a top plate such as a glass plate is bonded to an inkjet head substrate in which the groove is formed by using an adhesive or the like, and the end face of the resulting bonded body is mechanically cut to form a discharge port. ing.

According to the method described in Document 1, since the groove for forming the ink flow path is formed by the photolithography method, the groove can be formed with high accuracy, and the groove is provided with the liquid ejection energy element. Since it is already formed on the inkjet head substrate, accurate alignment is not always necessary, and the inkjet head substrate and the top plate can be easily joined.

However, even the method described in Document 1 has the following problems. That is, (1) when the top plate is bonded to the inkjet head substrate, the adhesive may be sunk into the ink flow path where the adhesive is formed, and the shape of the obtained flow path may be deformed. (2)
When cutting the bonded body to form the ejection port, cutting waste may enter the ink flow path, in which case the resulting inkjet head may be clogged.
(3) In the above-mentioned joined body, since the portion which becomes the ink flow path is hollow, when mechanically cutting the joined body, there is a risk of chipping on a part of the ejection port formed by the cutting. is there.

Therefore, the method described in Document 1 is not necessarily suitable for mass production of high quality ink jet heads with high yield.

As a method for solving such a problem, US Pat. No. 4,657,631 (hereinafter referred to as "reference 2") proposes a method having the following contents.
That is, this method uses a resin pattern (solid layer) made of a resin that can be dissolved in the ink flow path forming portion on the inkjet head substrate on which the liquid ejection energy generating element is formed.
And forming a coating resin layer such as an epoxy resin on the inkjet head substrate so as to cover the pattern,
After the coating resin layer is cured, the soluble resin pattern is dissolved and removed to form an ink flow path.

Furthermore, US Pat. No. 5,331,344
No. 1 (hereinafter referred to as “Document 3”), a photosensitive resin layer having a two-layer structure is provided on a substrate for an inkjet head.
Forming a latent image of the ink flow path pattern on the photosensitive resin layer of
Next, a second photosensitive resin layer is formed on the first photosensitive resin layer by laminating a dry film, and a latent image of the ejection port pattern is formed on the first photosensitive resin layer.
Then, a method of manufacturing an ink jet head in which an ink flow path is formed by developing these latent images is described.

US Pat. No. 5,458,254
No. (hereinafter, referred to as "Reference 4") describes a method for manufacturing an inkjet head using an ionizing radiation-decomposable resin as a material for a resin pattern in Reference 2.

In any of the manufacturing methods described in Documents 2 to 4, a soluble resin layer is provided in a portion which becomes an ink flow path, and the soluble resin layer is provided in the state where the soluble resin layer is provided. A coating resin layer for covering the resin layer is provided on the resin layer, and the soluble resin layer is removed. Therefore, the adhesive does not drip in the ink flow path portion, and the shape of the ink flow path can be accurately formed. Further, even when cutting the inkjet head substrate provided with the coating resin layer, since the resin that can be dissolved is filled in the portion that becomes the ink flow path, cutting debris may enter the ink flow path, It is possible to reduce the risk of chipping at a part of the discharge port formed by cutting. As the above-described soluble resin in the manufacturing method described in Documents 2 to 4, a positive resist is used from the viewpoint of easy removal. This positive resist forms a pattern by the difference in dissolution rate between the exposed portion and the unexposed portion, and in any of the manufacturing methods described in Documents 2 to 4, the ink flow path portion is exposed after being exposed. It is dissolved and removed.

By the way, in Documents 2 to 4, it is described that the coating resin layer provided on the ink flow path forming portion is formed by using a so-called solvent coating method.
The solvent coating method is a method in which a predetermined resin to be coated is dissolved in a solvent and applied, and a typical example thereof is a spin coating method. This spin coating method has an advantage that the film thickness can be easily controlled uniformly. Among the inkjet heads, in particular, in a method for manufacturing a so-called side shooter type inkjet head having an ejection port above an electrothermal converter that is a liquid ejection energy generating element, the ejection port is formed in the coating resin layer, The film thickness of the resin layer is a factor that determines the distance between the electrothermal converter and the ejection port, which affects the ejection characteristics. Therefore, the formation of the coating resin layer in the method for manufacturing the side shooter type inkjet head is often performed by the spin coating method.

As described above, when the coating resin layer is formed by the solvent coating method, since the positive resist is provided as the soluble resin layer that is the ink flow path forming portion, the solvent is used. It requires careful selection and use. That is, if the solvent used in the solvent coating method has an excessively strong dissolving power, the solvent may be partially dissolved not only in the exposed portion of the positive resist that can be dissolved by this solvent, but also in the unexposed portion. However, there is a problem that the obtained ink flow path is deformed.

By the way, in order to make the film thickness of the film formed on the ink jet head substrate uniform by the solvent coating method typified by the above-mentioned spin coating method, the evaporation rate of the solvent and the viscosity of the solvent are adjusted. There is a need to.
In particular, the film in the inkjet head field is usually formed to be considerably thicker than the film thickness in the semiconductor field, and the film thickness can be made uniform unless various film forming conditions are controlled more strictly than the film in the semiconductor field. Difficult to do.
Further, since the film thickness of the coating resin layer described above affects the ejection characteristics, the adjustment of the evaporation rate and the viscosity greatly affects the yield of the inkjet head. In particular, regarding the evaporation rate of the solvent, a solvent having a lower evaporation rate can more easily achieve uniform film thickness.

However, such a solvent having a slow evaporation rate generally has a strong dissolving power, and as described above, in the conventional method for producing an ink jet head, when the resin is applied when forming the resin layer for coating. When a solvent having a strong dissolving power is used, the shape of the ink flow path may be deformed, which causes a problem in yield and does not necessarily lead to improvement in productivity.

[0016]

As described above, in the prior art, a photosensitive resin layer that contributes to the formation of ink channels is provided on the ink jet head substrate, and the coating resin is further provided on the photosensitive resin layer. In a method for manufacturing an inkjet head including a step of forming an ink flow path by dissolving and removing the photosensitive resin layer in the ink flow path portion after providing the layer, the yield is improved while forming the ink flow path with high accuracy. There is a problem that it is difficult to further improve.

[0017]

In view of such technical problems in the prior art, the inventor of the present invention uses an ink even if a solvent having a strong dissolving power is used when forming the coating resin layer through the coating means. The inventors have earnestly studied a method of manufacturing an inkjet head that has no possibility of the shape of the flow path being deformed and that can significantly improve the yield of the inkjet head as compared with the prior art.

That is, an ionizing radiation-decomposable type photosensitive resin layer containing a crosslinkable structural unit is formed in the ink flow path forming portion, the photosensitive resin layer is crosslinked, and then the crosslinked photosensitive resin layer is formed. By providing a coating resin layer on top and irradiating the crosslinked photosensitive resin layer of the part which becomes an ink flow path with ionizing radiation through the said coating resin layer, the knowledge which can solve the above-mentioned subject was obtained. The present invention has been completed based on the knowledge.

An object of the present invention is to provide a method of manufacturing an ink jet head which can manufacture an ink jet head having a highly accurate ink flow path with high yield.

Another object of the present invention is to provide a method of manufacturing an ink jet head in which the ink flow path is not deformed even when a coating resin layer is formed using a solvent having a strong dissolving power.

Another object of the present invention is to provide a method for manufacturing an ink jet head, which has a wide range of selection of coating resin layer materials and coating resin layer coating solvents.

Another object of the present invention is to provide a method for manufacturing an ink jet head which can easily achieve uniform thickness of the coating resin layer.

In order to achieve the above-mentioned object, the method of manufacturing an ink jet head provided by the present invention provides an ink flow path communicating with an ejection port for ejecting ink and energy used for ejecting the ink. A method of manufacturing an inkjet head, comprising: an energy generating element for generating energy; a step of preparing a substrate having the energy generating element; and the energy generating element on a surface of the substrate on which the energy generating element is provided. A step of forming an ionizing radiation-decomposable photosensitive resin layer containing a crosslinkable structural unit so as to cover, a step of intermolecularly crosslinking the photosensitive resin layer, and the crosslinked photosensitive resin layer A step of forming a coating resin layer, a step of curing the coating resin layer, and a step of decomposing the crosslinked photosensitive resin layer so as to contribute to the formation of ink flow paths. A step of irradiating the crosslinked photosensitive resin layer for solubilization with ionizing radiation through the coating resin layer, and an ink flow path that elutes the solubilized photosensitive resin layer and communicates with the ejection port. And the step of forming.

According to the present invention, since the resin in the ink flow path forming portion is insolubilized when the coating resin layer is formed, the ink flow path is formed even if the coating resin layer is formed using a solvent having a strong dissolving power. There is no risk of the shape of the. Therefore, it is possible to easily achieve uniformization of the thickness of the coating resin layer, and it is possible to manufacture an inkjet head having a highly accurate ink flow path with high yield. Further, the restriction on the solvent for coating resin layer coating is substantially eliminated, and as a result, it becomes possible to use the coating resin material that could not be used until now, and the range of choice of the coating resin material and the solvent for coating resin layer coating expands. .

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. The embodiment of the present invention is
The present invention is broadly classified into the following two, and the present invention includes any of these embodiments.

(First Embodiment) In the manufacturing method of the first embodiment of the present invention, an ink flow path communicating with an ejection port for ejecting ink and energy used for ejecting the ink are generated. And a step of preparing a substrate including the energy generating element, and coating the energy generating element on a surface of the substrate on which the energy generating element is provided. To form an ionizing radiation-decomposable photosensitive resin layer containing a crosslinkable structural unit, a step of intermolecularly crosslinking the photosensitive resin layer, and the crosslinked photosensitive resin before forming the coating resin layer. The step of irradiating ionizing radiation except for the portion of the photosensitive resin layer that contributes to the formation of the ink flow path, and eluting the portion of the crosslinked photosensitive resin layer irradiated with ionizing radiation. A step of forming an ink flow path pattern, a step of forming a coating resin layer on the ink flow path pattern, a step of curing the coating resin layer, and the cross-linked photosensitive resin that contributes to the formation of an ink flow path. Step of irradiating the crosslinked photosensitive resin layer with ionizing radiation through the coating resin layer in order to decompose and solubilize the photosensitive resin layer, and elute the solubilized photosensitive resin layer to the discharge port. Forming a communicating ink flow path.

This embodiment will be described below in order of steps with reference to the drawings. 1 to 9 are views showing a basic manufacturing process of this embodiment. Although an ink jet head having two orifices is shown in the drawings, the same applies to a high density multi-array ink jet head having more orifices or a case having only one orifice.

FIG. 1 is a schematic perspective view of an example of an ink jet head substrate used in this embodiment.

First, in this embodiment, an ink jet head substrate 1 made of glass, ceramic, plastic, metal or the like as shown in FIG. 1 is prepared. The inkjet head substrate 1 is not particularly limited in its shape, material, etc. as long as it can function as a part of the ink flow path constituting member and can also function as a support for the coating resin layer described later.

A desired number of ejection energy generating elements 2 such as electrothermal converting elements or piezoelectric elements are arranged on the ink jet head substrate 1 (two in FIG. 1). The ejection energy generating element 2 gives ejection energy for ejecting the printing liquid droplets to the ink to eject the ink, and printing is performed. For example, when an electrothermal conversion element is used as the ejection energy generating element 2, the electrothermal conversion element heats the ink in the vicinity of the element to generate ejection energy and eject the ink.

The ejection energy generating elements 2 are connected to control signal input electrodes (not shown) for operating these elements. Further, in general, for the purpose of improving the durability of these ejection energy generating elements,
Although various functional layers such as a protective layer are provided on the ejection energy generating element 2, the provision of such a functional layer is also acceptable in the present invention.

Further, the ink supply port 3 for supplying the ink into the ink flow path in the above-mentioned ink jet head substrate 1 penetrates a portion of the ink jet head substrate 1 where the energy generating element 2 does not exist. It is provided by forming a mouth.

Then, as shown in FIG. 2, an ionizing radiation-decomposable photosensitive resin 4 containing a crosslinkable structural unit is coated on the ink jet head substrate 1 so as to cover the ejection energy generating elements on the substrate 1. To form. Here, the ionizing radiation decomposition type photosensitive resin has a molecular weight of about 10
More than 000 polymer compounds are ionizing radiation (Deep-U
V, electron beam, X-ray and the like) means that the intermolecular bond is cleaved to become a low molecular weight compound. Since this ionizing radiation-decomposable photosensitive resin has film properties and strength as a polymer compound unless it is irradiated with ionizing radiation, the photosensitive resin layer is formed on the inkjet head substrate 1 provided with an ink supply port. The film of the photosensitive resin as No. 4 can be formed in a desired state.

The photosensitive resin layer 4 used in the present invention has at least a high molecular weight copolymer having a structural unit which causes a decomposition reaction upon irradiation with ionizing radiation in a specific wavelength range and an intermolecular crosslinkable structural unit in its molecular structure. It is composed of a molecular compound (that is, a photosensitive resin).

As a structural unit which causes a decomposition reaction of such a copolymerized molecular compound upon irradiation with ionizing radiation, a polyvinyl ketone polymer compound containing the structural unit represented by the general formula (1) or a general formula (2 The polymethacrylate type high molecular compound containing the structural unit shown by these can be mentioned.

[0036]

[Chemical 1]

[0037]

[Chemical 2]

Specific examples of the polyvinyl ketone polymer compound include polymethyl isopropenyl ketone, polyphenyl isopropynyl ketone, polymethyl vinyl ketone, polyphenyl vinyl ketone and polyisopropenyl t.
-Butyl ketone and the like can be mentioned.

Specific examples of the polymethacrylate type polymer compound include polymethylmethacrylate, polyn-butylmethacrylate, polyt-butylmethacrylate, polyphenylmethacrylate, polyhexafluorobutylmethacrylate, polymethacrylic acid and the like. be able to.

A crosslinkable structural unit is copolymerized with the structural unit which causes a decomposition reaction upon irradiation with such ionizing radiation. Examples of such intermolecular crosslinkable structural units include reactive groups such as epoxy groups, carboxylic acids, carboxylic acid chlorides, hydroxyl groups, unsaturated double bonds, and compounds having these reactive groups. Specific examples include glycidyl methacrylate, methacrylic acid, methacrylic acid chloride and the like.

These reactive functional groups may be intermolecularly crosslinked by directly bonding the functional groups to each other by irradiation of heat or ionizing radiation, or may be intermolecularly crosslinked via an appropriate crosslinking agent (curing agent). May be. Furthermore, when a crosslinking reaction is caused by irradiation with ionizing radiation, it is of course possible to use an appropriate sensitizer (radical, cationic polymerization initiator, etc.) together.

In the above-mentioned photosensitive resin, the copolymerization ratio of the structural unit causing the decomposition reaction and the crosslinkable structural unit can be appropriately determined, but generally, the crosslinkable structural unit is based on the copolymer. If it is about 30 mol% or less, the purpose (improvement of solvent resistance, heat resistance, etc.) can be sufficiently achieved.
If the number of crosslinkable structural units is extremely large, the decomposition rate (sensitivity) due to ionizing radiation may be decreased, which is not preferable.

Specific examples of the above-mentioned photosensitive resin include, but are not limited to, the following copolymers.

[0044]

[Chemical 3]

[0045]

[Chemical 4]

[0046]

[Chemical 5]

[0047]

[Chemical 6]

[0048]

[Chemical 7]

[0049]

[Chemical 8]

[0050]

[Chemical 9]

[0051]

[Chemical 10]

In this embodiment, it is preferable to use a polyvinyl ketone compound as the material of the photosensitive resin layer. Since a polyvinyl ketone-based compound generally has a high yield of decomposition reaction to ionizing radiation (high sensitivity), the photosensitive resin layer can be rapidly dissolved and removed.

The ionizing radiation-decomposable photosensitive resin layer 4 is formed by dissolving the photosensitive resin in a solvent and coating it once on a film such as a PET film to form a dry film, and then using an ink jet head with a laminator. It can be performed by a method of transferring onto the substrate 1.

In addition, the ink supply port 3 is formed by anisotropic etching in a state where the coating resin layer 6 is provided on the ink jet head substrate 1, so that the ink jet head substrate 1 is spin-coated and rolled. It can also be carried out by a method of forming a film by a solvent coating method such as a coating method.

Next, the photosensitive resin layer 4 is intermolecularly crosslinked by using an appropriate means such as heating or irradiation with ionizing radiation. In this case, it goes without saying that ionizing radiation in a wavelength range in which the photosensitive resin layer itself is decomposed cannot be used when intermolecular crosslinking is carried out by irradiation with ionizing radiation.

The intermolecularly crosslinked photosensitive resin layer is substantially insoluble in the organic solvent.

Then, as shown in FIG. 3, the photosensitive resin layer 4 is formed.
On the other hand, the mask 5 is used to irradiate ionizing radiation and solubilize it except for a portion which becomes an ink flow path, and the solubilized portion is eluted with a solvent to form an ink flow path as shown in FIG. The pattern 4a is formed. The ink flow path pattern 4
a is to secure an ink flow path provided with the ink supply port 3 and the energy generating element 2, and the pattern of the ionizing radiation-decomposable photosensitive resin layer remains in the ink flow path (see FIG. 4). ).

Further, in the present invention, the photosensitive resin layer 4
It is also possible to intermolecularly crosslink the ink flow path pattern by using the above-mentioned means after patterning the ink flow path pattern 4a to form the ink flow path pattern 4a, but at that time, the shape of the pattern once formed does not change. You have to be careful.

Next, as shown in FIG. 5, a coating resin layer 6 is formed on the ink flow path pattern 4a so as to cover the pattern 4a. Since the coating resin layer 6 is a structural material of the inkjet head, it is required to have characteristics such as high mechanical strength, heat resistance, adhesion to the inkjet head substrate 1, and resistance to ink. As the constituent material of the coating resin layer 6 satisfying such characteristics, epoxy resin, acrylic resin, diglycol dialkyl carbonate resin, unsaturated polyester resin, diaryl phthalate resin, polyurethane resin, polyimide resin,
Curable resins such as melamine resin, phenol resin and urea resin can be mentioned. Of course, a commonly used curing agent is used in combination with these curable resins, and light and heat energy are applied as necessary to cause a curing reaction.

The coating resin layer 6 is formed by dissolving the above-mentioned curable resin in a desired solvent and forming it by solvent coating, or by heating and melting the above-mentioned curable resin and forming it by transfer molding. can give. Here, the ink flow path pattern 4a of the ionizing radiation decomposition type photosensitive resin layer is
Since it has already been intermolecularly crosslinked in the above-mentioned step, it is no longer substantially soluble in an organic solvent, without being dissolved in the solvent at the time of solvent coating when forming the coating resin layer, It does not dissolve in the formed coating resin layer material itself. This not only does not affect the interface between the photosensitive resin layer and the coating resin layer at all,
There is no restriction on the solvent at the time of the solvent coating, and the range of selection of the coating resin material is widened. That is, the coating resin material can be selected as an optimal material for the structural material of the inkjet head.

Next, an ink ejection port is formed on the coating resin layer 6. The ink ejection port can be formed by dry etching using oxygen plasma. Hereinafter, the ink ejection port can be formed by dry etching using oxygen plasma, for example, by the method described below.

First, as shown in FIG. 6, a silicon-based resist 7 serving as a mask for forming ejection openings is provided on the coating resin layer 6, and then an ink ejection opening pattern is formed by photolithography. As the silicon-based resist 7,
Any resist can be used as long as it has sufficient resistance to etching by oxygen plasma described later. For example, chloromethylated polydiphenylsiloxane (Toyo Beam SNR manufactured by Tosoh Corporation), polydimethylsiloxane,
Examples thereof include polyphenyl silsesquioxane and silicon-containing polymethacrylic resin. These silicon-based resists are generally of the ionizing radiation functional type and are Deep-UV.
It is exposed to light and electron beams. In addition, it is also possible to use an ultraviolet functional resist.

Next, as shown in FIG. 7, the ink discharge port 9 is formed by dry etching the coating resin layer 6 with oxygen plasma through the silicon-based resist 7. At this time, it is desirable that the etching by oxygen plasma is performed using an anisotropic etching device such as a reactive ion etching device or a magnetron type ion etching device. In addition, as the etching conditions at this time, it is necessary to optimize the oxygen gas pressure and the input power that enable anisotropic etching. Silicon resist 7
In the etching operation, the ink ejection port 9 can be formed with high accuracy because it is hardly etched in the etching operation. At the etching end point, the etching is the ink flow path pattern 4
It is only necessary to set the end point after reaching the point a, and highly accurate end point detection is not necessarily required.

Although dry etching using oxygen plasma is mentioned as a method for forming the ink ejection port 9 here, other than this, a method of providing a mask having an ink ejection port pattern on the coating resin layer and irradiating an excimer laser, or a coating resin. The ink discharge port can also be formed by a method using photolithography using a photosensitive resin for the layer as shown in FIG.

When the ejection port is formed by oxygen plasma or excimer laser, the coating resin layer is cured.

Then, as shown in FIG. 8, the ink flow path pattern 4a is irradiated with ionizing radiation through the coating resin layer 6 to solubilize the ink flow path pattern 4a.

Finally, as shown in FIG. 9, the solubilized ink flow path pattern 4a is eluted with a solvent to form an ink flow path 8. In this way, an inkjet head is obtained. (See FIG. 9) In the above description, the manufacturing method of the side shooter type ink jet head is used, but the present invention ejects ink in the direction along the surface on which the ejection energy generating element is provided. It goes without saying that the present invention can also be applied to a so-called edge shooter type inkjet head. When the present invention is applied to a method for manufacturing an edge shooter type inkjet head, the above-described ejection port forming step is necessary because the ejection port is provided on the end surface of the inkjet head substrate provided with the coating resin layer. Not.

(Second Embodiment) In the first embodiment, the photosensitive resin layer is patterned into the ink flow path shape before the coating resin layer is provided. In the present embodiment, the coating resin layer is formed on the photosensitive resin layer. After the provision of, the photosensitive resin layer is patterned.

That is, in the manufacturing method of the second embodiment of the present invention, the ink flow path communicating with the ejection port for ejecting ink and the energy generation for generating the energy used for ejecting the ink. A method of manufacturing an inkjet head including an element, the method comprising: providing a substrate including the energy generating element; and cross-linking the surface of the substrate on which the energy generating element is provided so as to cover the energy generating element. Forming an ionizing radiation-decomposable photosensitive resin layer containing possible structural units; intermolecularly crosslinking the photosensitive resin layer; and forming a coating resin layer on the crosslinked photosensitive resin layer. A step of curing the coating resin layer, and through the coating resin layer for decomposing and solubilizing the crosslinked photosensitive resin layer so as to contribute to formation of an ink flow path. The step of irradiating ionizing radiation only to the portion of the crosslinked photosensitive resin layer that contributes to the formation of the ink flow path, and the ink flow path that elutes the solubilized photosensitive resin layer and communicates with the ejection port And a step of forming.

The present embodiment will be described in detail below with reference to the drawings. It should be noted that the description of the same parts as those in the first embodiment will be omitted.

10 to 17 are explanatory views showing the basic manufacturing process of the second embodiment.

First, as shown in FIG. 10, an ink jet head substrate 1 having an energy generating element and an ink supply port 3 is prepared as in the first embodiment.

Next, as shown in FIG. 11, an ionizing radiation decomposable photosensitive resin layer 4 containing a crosslinkable structural unit is formed on the ink jet head substrate 1 including the liquid discharge energy generating element 2. In this embodiment,
Since this photosensitive resin layer 4 also forms a part of the ink flow path, a polymethacrylate-based resin having excellent film strength is used among the resins applicable to the photosensitive resin layer 4 described in the first embodiment. It is preferable to use a molecular compound.

Then, the photosensitive resin layer 4 is intermolecularly cross-linked by using an appropriate means such as heating or irradiation of ionizing radiation as described above. The photosensitive resin layer 4 thus intermolecularly crosslinked in this manner is substantially insoluble in the organic solvent.

Next, as shown in FIG. 12, a coating resin layer 6 is further formed on the cross-linked ionizing radiation-decomposable photosensitive resin layer 4.
To form.

Here, the ionizing radiation-decomposable photosensitive resin layer 4
Is already substantially insoluble in the organic solvent because it has already been intermolecularly crosslinked in the above-mentioned step, and does not dissolve in the solvent at the time of solvent coating when forming the coating resin layer. Further, it does not dissolve in the formed coating resin layer material itself. Therefore, also in this embodiment, there is no restriction on the solvent at the time of solvent coating, and the range of selection of the coating resin layer material is widened.

Next, the discharge port 9 is formed in the coating resin layer 6. The ink ejection port can be formed by a photolithography method. Hereinafter, the ink ejection port can be formed by the photolithography method, for example, by the method described below.

First, when the ink ejection port is formed by the photolithography method, the coating resin layer material having a negative type photosensitive property is used as the coating resin layer as described above. Then, as shown in FIG. 13, the coating resin layer 6 having a negative photosensitive property is exposed through a mask 7 for forming a discharge port in which the discharge port portion is shielded. As a result, the exposed portion of the coating resin layer 6 is hardened and the ink ejection port portion can be patterned. Then, as shown in FIG. 14, an unexposed portion of the coating resin layer 6 is eluted with a solvent to form an ink ejection port 9 in the coating resin layer 6.

Next, the portion of the photosensitive resin layer 4 of the ionizing radiation-decomposable type which becomes the ink flow path is irradiated with ionizing radiation through the coating resin layer 6 to solubilize the photosensitive resin layer in the ink flow path forming portion. To do. In this embodiment, since the photosensitive resin layer 4 is left in a portion other than the portion which becomes the ink flow path, the mask 5 as shown in FIG. The channel forming portion 4a is solubilized.

Finally, as shown in FIG. 16, the solubilized ionizing radiation-decomposable photosensitive resin layer 4a is eluted to form an ink flow path to obtain an ink jet head. (See FIG. 17) In the present embodiment, the ejection port is formed by the photosensitive resin layer 4
It is carried out before the solubilization step of the ink flow path forming part. This is because a negative type photosensitive resin is used as the coating resin layer 6, and therefore, when the ink flow path portion is first irradiated with ionizing radiation, the ink ejection port forming portion of the coating resin layer 6 is cured and the ink ejection port This is because it cannot be formed.

Even when the ink ejection port is formed by etching with oxygen plasma, the ink flow path forming portion of the photosensitive resin layer 4 is solubilized,
When etching with oxygen plasma is performed, gas is generated from the solubilized portion of the photosensitive resin layer 4, which may impair the shape of the ink flow path. It is desirable to perform it before the solubilization step of the channel forming portion.

According to this embodiment, since the substrate is in a substantially flat state during the solvent coating, the surface of the coating resin layer can be easily flattened. Therefore, the distance between the ejection port and the ejection energy generating element can be controlled more strictly.

The following is an example of an ink jet device in which the ink jet head obtained by the present invention can be mounted.

FIG. 32 shows an ink jet head obtained by the present invention as an ink jet head cartridge (IJ
It is an appearance perspective view showing an example of an ink jet device (IJA) equipped as C). In the figure, IJC 20 is a plurality of ink jet head cartridges provided with nozzle groups for ejecting ink so as to face a print surface of a print paper P which is a print medium sent onto a platen 24. Reference numeral 16 denotes a carriage for holding the IJC 20, which is connected to a part of a drive belt 18 for transmitting the driving force of the drive motor 17 and is slidable with two guide shafts 19A and 19B arranged in parallel with each other. This enables reciprocal movement over the entire width of the IJC 20 print paper.

Reference numeral 26 is a head recovery device, which is an IJC20.
Is arranged at one end of the movement path of, for example, at a position facing the home position. The IJC 20 is capped by the driving force of the motor 22 via the transmission mechanism 23.
Further, the IJC 20 is protected by capping at the end of printing.

A blade 30 is provided on the side surface of the head recovery device 26 and is a wiping member made of silicon rubber. The blade 30 is a blade holding member 30.
The head recovery device 26 is held by A in a cantilever form.
Similarly to the above, the motor 22 and the transmission mechanism 23 operate to enable engagement with the ejection surface of the IJC 20. As a result, the blade 30 is projected into the movement path of the IJC 20 at an appropriate timing in the printing operation of the IJC 20 or after the ejection recovery processing using the head recovery device 26, and the ejection surface of the IJC 20 is moved along with the movement operation of the IJC 20. It wipes off condensation, wetness, dust, etc.

[0087]

EXAMPLE An example of the present invention will be described below with reference to FIGS.

Examples 1 to 4 are examples according to the first embodiment of the present invention.
Reference numeral 6 shows an example according to the second embodiment of the present invention.

(Example 1) First, as shown in FIG.
An inkjet head substrate 1 made of silicon having an electrothermal conversion element (heater made of HfB ₂ ) formed thereon as a liquid ejection energy generation element 2 was prepared, and an ink supply port 3 was provided on the substrate 1 by a YAG laser.

Then, as shown in FIG. 20, methyl isopropenyl ketone / methacrylic acid chloride = 85/1.
5 Copolymer (weight average molecular weight: about 200,000) was adjusted to a cyclohexanone 15 wt% solution, coated on PET and dried to form a dry film, which was transferred to an inkjet head substrate 1 by lamination at a temperature of 130 ° C. The ionizing radiation-decomposable photosensitive resin layer 4 was used. Then 150
The photosensitive resin layer 4 was intermolecularly crosslinked by baking at 1 ° C. for 1 hour.

Next, Canon mask aligner PL
Ionizing radiation for forming an ink flow path pattern on the photosensitive resin layer 4 was irradiated with A-520FA (using a cold mirror CM-290). The irradiation time was 2 minutes. Then, the exposed portion of the photosensitive resin layer 4 is eluted with methyl isobutyl ketone and rinsed with xylene, whereby the ink flow path pattern 4a shown in FIG.
Was formed. The ink flow path pattern 4a secures the ink flow path of the ink supply port 3 and the electrothermal conversion element 2, and the resist pattern was left at the location that becomes the flow path. The film thickness of the resist pattern after the elution step is 1
It was 1 μm.

Then, as shown in FIG. 22, a methylmethacrylate / glycidylmethacrylate copolymer (copolymerization ratio 1/4, weight average molecular weight about 200,000 (in terms of polystyrene)) and diethylenetetramine (epoxy group in the copolymer were used. In contrast, a mixture of active amine [-NH] equivalent) was dissolved in a solution of cyclohexanone at 21 wt% and applied on the ink flow path pattern 4a with a spinner, followed by curing at 100 ° C for 2 hours to form a coating resin layer 6. Formed. The film thickness of the coating resin layer 6 after curing is the ink flow path pattern 4a.
It was 10 μm above. In forming the coating resin layer 6, since the ink flow path pattern 4a made of the ionizing radiation-decomposable photosensitive resin layer is already intermolecularly crosslinked, it is not deformed by cyclohexanone or the coating resin layer material. It was

Then, a silicon negative resist (SNR-M2 manufactured by Tosoh Corporation) 7 was spin-coated on the coating resin layer 6 to a film thickness of 0.6 μm, and prebaked at 80 ° C. for 20 minutes. A mask having a pattern corresponding to an ink ejection port was overlaid on this silicon-based resist layer and exposure was performed. Exposure is PLA-520FA (cold mirror CM
-250)) for 20 seconds, development is propylene glycol-α-monomethyl ether / di-n-butyl ether = 5/2 vol, and rinse is propylene glycol-α-monomethyl ether / di-n-butyl ether =
1/1 vol was used. In this way, the discharge port forming mask 7 as shown in FIG. 23 was formed. The present silicon-based resist is a negative type resist, and the pattern formation of the ink ejection port 9 is a blank pattern, which is disadvantageous for forming a fine pattern, but since the resist film thickness is thin,
It is possible to form patterns up to about 2 μm. In this example, a discharge port pattern having a diameter of 25 μm was formed.

Then, as shown in FIG. 24, the substrate 1 is parallel-plate dry etching apparatus (manufactured by Anerva: DE).
M-451) and coated with oxygen plasma to coat resin layer 6
Was etched. The oxygen gas pressure was 8 Pa, the input power was 150 W, and the etching time was 30 minutes. The etching rate of the coating resin layer 6 under the above-mentioned etching conditions is 0.4 μm / min, and the ink ejection port 9 penetrates after 30 minutes of etching. It is possible to change the degree of etching anisotropy by changing the oxygen gas pressure and the input power, and it is also possible to control the shape of the ink ejection port 9 in the depth direction. Further, the etching rate can be further increased in the magnetron type etching apparatus.

Next, in order to disassemble the ink flow path pattern 4a, PLA-520 (cold mirror CM
(Using 290), the substrate 1 on which the coating resin layer 6 was formed was immersed in methyl isobutyl ketone for 15 seconds while applying ultrasonic waves to wash out the ink flow path pattern 4a. The ink flow path pattern 4a is
Since it has already been disassembled, it can be easily washed out. The copolymer used for the coating resin layer 6 is an ionizing radiation-decomposable type, but the amine curing agent causes high-density cross-linking, and when CM290 is used, the decomposition reaction can be substantially ignored. .

Thus, the ink flow path 8 was formed to obtain an ink jet head. (See FIG. 25) (Example 2) 100 parts of methyl isopropenyl ketone / glycidyl methacrylate copolymer (copolymerization ratio 8/2, weight average molecular weight 150,000), Irgacure 261 (manufactured by Ciba Geigy) as a cationic polymerization initiator A solution of 20 parts by weight of 2 parts dissolved in diacetone alcohol was applied onto an aramid film and dried to form a dry film. This dry film was transferred at a temperature of 120 ° C. to the inkjet head substrate 1 prepared in the same manner as in Example 1 to form an ionizing radiation-decomposable photosensitive resin layer 4. Then, the PLA 501 is exposed for 10 minutes,
By baking at 0 ° C. for 30 minutes, the epoxy ring of glycidyl methacrylate of the copolymer was subjected to ring-opening polymerization, and the photosensitive resin layer 4 was subjected to intermolecular crosslinking. The main emission bright line of PLA501 at this time is 366 nm, and the methyl isopropyl ketone / glycidyl methacrylate copolymer does not substantially undergo a decomposition reaction with light in this wavelength range. Next, in order to form an ink flow path pattern on the photosensitive resin layer 4, PLA520 (using CM290) was irradiated with ionizing radiation for 70 seconds. Then, the exposed portion of the photosensitive resin layer 4 was eluted with methyl isobutyl ketone and rinsed with xylene. Ink flow path pattern 4 after elution step
The film thickness of a was 12 μm.

Then, a coating resin layer 6 was formed in the same manner as in Example 1. As the coating resin layer 6, an epoxy resin (bisphenol A type: oiled shell Epicoat 100
3) 70 parts, propylene oxide-modified bisphenol A type epoxy resin (Kyoeisha: Eporite 3002) 2
6 parts and 4 parts of diethylenetetramine as a curing agent dissolved in cyclohexanone at 50 wt% were formed by spin coating on the substrate 1. 3 at 100 ℃ as it is
Curing reaction was carried out for 1 hour at 150 ° C. The film thickness of the coating resin layer 6 was 10 μm on the ink flow path pattern 4a.

Then, in the same manner as in Example 1, a discharge port forming mask 7 was formed with a silicon-based resist layer, and etching was performed with oxygen plasma. However, the etching conditions were an oxygen gas pressure of 8 Pa, an input power of 180 W, and an etching time of 1 hour.

Next, in order to decompose the ink flow path pattern 4a, ionizing radiation is irradiated for 2 minutes with PLA520 (CM290), and then the substrate 1 on which the coating resin layer 6 is formed is ultrasonically irradiated in methyl isobutyl ketone. The ink flow path pattern 4a was washed out by dipping while applying.

Thus, the ink flow path 8 was formed to obtain the ink jet head of this embodiment.

Example 3 Phenyl isopropenyl ketone / ethyl methacrylate / methacrylic acid (copolymerization ratio 4
A cyclohexanone solution (25 wt%) of / 4/2 and a weight average molecular weight of 150,000 was applied onto the PET film to form a dry film. This dry film is heated to 1
The laminate was transferred at 30 ° C. to the inkjet head substrate 1 prepared in the same manner as in Example 1 to obtain an ionizing radiation-decomposable photosensitive resin layer 4. The photosensitive resin layer 4 was pre-baked at 130 ° C. for 10 minutes and then baked at 180 ° C. for 30 minutes to cross-link the photosensitive resin layer 4 intermolecularly. In order to form an ink flow path pattern, PLA-5
Ionizing radiation was irradiated for 1.5 minutes through the mask with 20FA (using Cold Mirror CM290). afterwards,
The exposed portion of the photosensitive resin layer 4 was eluted with methyl isobutyl ketone / xylene = 1/1 and rinsed with xylene. The film thickness of the ink flow path pattern 4a after the elution step was 15 μm.

Next, an ink flow path was formed on the ink flow path pattern 4a in the same manner as in Example 2 using the coating resin layer described in Example 2 to obtain an ink jet head of this example.

(Embodiment 4) Electrothermal conversion element (heater made of HfB ₂ ) as liquid ejection energy generating element 2
Was formed on the silicon substrate 1 having a surface crystal surrounding <100>. Then, a mask (Si ₃ N ₄ ) for forming an ink supply port was formed on the back surface of the substrate 1 (the surface on which the heater is not formed) by using anisotropic etching of silicon. The ionizing radiation-decomposable photosensitive resin layer 4 used in Example 1 was formed on this substrate 1 by a spin coating method (the photosensitive resin was adjusted to 18 wt% cyclohexanone and rotated at 700 rpm on the substrate 1). Is spin coated on
Dry on a hot plate at 110 ° C. for 3 minutes. ).
Then, the photosensitive resin layer 4 is baked at 150 ° C. for 1 hour.
Was intermolecularly crosslinked. Next, in order to create an ink flow path pattern, the photosensitive resin layer 4 was irradiated with ionizing radiation through a mask with a Canon mask aligner PLA-520FA (using a cold mirror CM290). The irradiation time was 2 minutes. Then, the exposed portion of the photosensitive resin layer 4 was eluted with methyl isobutyl ketone and rinsed with xylene. The ink flow path pattern 4a is
The ink flow path for the ink supply port 3 and the electrothermal conversion element 2 is secured, and the resist pattern is left at the location that becomes the flow path. The film thickness of the resist pattern after the elution step was 11 μm.

Next, the composition shown in the following Table 1 was dissolved in cyclohexanone at a concentration of 50 wt% as a coating resin layer 6 on the ink flow path pattern 4a, and the solution was applied with a spinner and heated on a hot plate at 90 ° C. for 5 minutes. Dried.
(Film thickness 12 μm). Since the composition has a negative type (a portion irradiated with light is reactively cured), the composition was subjected to pattern exposure through a mask as shown in FIG. Exposure is Canon mask aligner MPA60
0 was used and the exposure amount was 3 J / cm ² . MPA600
The main emission bright line is in the wavelength range of 366 nm or more, and the ionizing radiation-decomposable photosensitive resin forming the ink flow path pattern 4a is not substantially decomposed. Then, after heating at 90 ° C. for 5 minutes, the unexposed coating resin layer was eluted with methyl isobutyl ketone to form the discharge port 9.

Next, in this example, anisotropic etching for forming the ink supply port 3 was performed on the substrate 1.
The anisotropic etching was carried out by using a 22% tetraammonium hydroxide aqueous solution as an etching solution at 80 ° C. and using a jig so that the etching solution would not wrap around the ink flow path forming surface (substrate surface).

Then, the ink flow path pattern 4a was washed out in the same manner as in Example 1 to form the ink flow path 8, and the ink jet head of this example was obtained.

[0107]

[Table 1]

(Example 5) As shown in FIG. 27, a methylmethacrylate / methacrylic acid 8/2 copolymer (weight average molecular weight 180,000) was adjusted to a cyclohexanone 18 wt% solution, coated on an aramid film and dried. A dry film was transferred onto a substrate 1 (FIG. 26) prepared in the same manner as in Example 1 by laminating to form an ionizing radiation-decomposable photosensitive resin layer 4. Then, 180 ℃,
The photosensitive resin layer 4 was subjected to intermolecular crosslinking by baking for 1 hour.

Next, as shown in FIG. 28, the negative photosensitive resin described in Example 4 was used as the coating resin layer 6 in Example 4.
It was formed in the same manner as. Here, the photosensitive resin layer 4 is intermolecularly cross-linked and is substantially insoluble in the organic solvent, so that it is not affected at all when the coating resin layer 6 is formed.

Then, as shown in FIG. 29, the ejection port 9 was patterned by the same method as in the fourth embodiment.

Next, in this example, ionizing radiation was applied to decompose the portion of the photosensitive resin layer 4 which was intermolecularly crosslinked through the mask 5 as shown in FIG. . Irradiation of ionizing radiation is 2KW made by USHIO INC.
-Deep-UV exposure was performed for 10 minutes. here,
A portion of the photosensitive resin layer 4 which becomes the ink flow path pattern 4a is decomposed and becomes soluble in the organic solvent. Then, the ink flow path pattern 4a was washed out in the same manner as in Example 1 to form the ink flow path 8, and the inkjet head of this example was obtained. (See FIG. 31) (Example 6) Methyl methacrylate / glycidyl methacrylate copolymer (copolymerization ratio 9/1, weight average molecular weight 1
80,000) 100 parts, and 2 parts of Irgacure 261 (trade name: manufactured by Ciba Geigy) as a cationic polymerization initiator were adjusted to a 20 wt% solution of cyclohexanone, coated on an aramid film, and dried to prepare a dry film. It was transferred by laminating onto a substrate 1 prepared in the same manner as in 1 to obtain an ionizing radiation-decomposable photosensitive resin layer 4. Then, PLA501 was exposed for 10 minutes and baked at 110 ° C. for 15 minutes to perform epoxy ring-opening polymerization of glycidyl methacrylate to perform intermolecular crosslinking of the photosensitive resin layer 4. At this time, the main emission line of PLA501 is 366 nm, and the methyl methacrylate / glycidyl methacrylate copolymer does not substantially undergo a decomposition reaction with light in this wavelength range. Thereafter, the coating resin layer material described in Example 1 was used to form ejection ports in the same manner as in Example 1. Then
An ink flow path pattern 4a was formed in the same manner as in Example 5 to obtain an inkjet head.

(Comparative Example 1) OZATE as a positive dry film was formed on the substrate 1 prepared in the same manner as in Example 1.
The photosensitive resin layer 4 was formed by laminating using CR-255 (trade name: manufactured by Hoechst). The OZAT
ECR-255 is a resist composed of a novolac resin and a dissolution inhibitor. The photosensitive resin layer 4 is 110 ° C., 2
After being baked for 0 minutes, pattern exposure was performed with PLA 501 and development was performed with a developer MIF-312 (trade name: Hoechst) to form an ink flow path pattern 4a. Then, using the coating resin layer material shown in Example 1, the coating resin layer 6 and the discharge port 9 are formed in the same manner as in Example 1,
An ink jet head was created by eluting the ink flow path pattern 4a.

(Comparative Example 2) A methyl methacrylate / methacrylic acid copolymer (copolymerization ratio 8/2, weight average molecular weight 120,000) was added onto the substrate 1 prepared in the same manner as in Example 1.
A dry film prepared by applying a 0 wt% cyclohexanone solution onto an aramid film and drying it was transferred by laminating to form an ionizing radiation-decomposable photosensitive resin layer 4. Then, prebaking was performed at 120 ° C. for 30 minutes. Here, in such a heated state, the crosslinking of the photosensitive resin layer 4 does not substantially proceed. Then, the ink flow path pattern 4a was formed in the same manner as in Example 1. Then, Example 1
The coating resin layer material shown in 1 was used to form the coating resin layer 6 and the ejection ports 9 in the same manner as in Example 1, and the ink flow path pattern 4a was eluted to form an inkjet head.

(Comparative Example 3) A methyl methacrylate / methacrylic acid copolymer (copolymerization ratio 8/2, weight average molecular weight 120,000) was added onto the substrate 1 prepared in the same manner as in Example 1.
A dry film prepared by applying a 0 wt% cyclohexanone solution onto an aramid film and drying it was transferred by laminating to form an ionizing radiation-decomposable photosensitive resin layer 4. Then, after performing intermolecular crosslinking by baking at 200 ° C. for 30 minutes, pattern exposure for forming the ink flow path pattern 4a was performed to solubilize the ink flow path forming portion. Exposure is 2KW-deep-UV made by USHIO INC.
The exposure was performed for 10 minutes. Then, a coating resin layer was formed in the same manner as in Example 2 without performing the developing step of the photosensitive resin layer 4, and a discharge port was further formed. Then, the solubilized ink flow path pattern 4a was formed as in Example 1. Elution was performed in the same manner to prepare an inkjet head.

In order to confirm the quality of the ink jet heads produced in Examples 1 to 6 and Comparative Examples 1 to 3, the shape of the ink flow path was first observed with a microscope. Since all the coating resin layers used in this example are colorless and transparent, the shape of the ink flow path can be observed through the coating resin layer.

In the ink jet heads produced in Examples 1 to 6, none of the ink jet heads produced in any of the examples had a deformed ink flow path.

On the other hand, in the ink jet head manufactured in Comparative Example 1, the shape of the ink flow path portion was severely deformed,
The ink flow path having a desired shape was not obtained. Also,
In the ink jet head manufactured in Comparative Example 2,
Deformation was found in a part of the ink flow path. Further, in the inkjet head manufactured in Comparative Example 3, a thin film-like residue was found at the interface between the coating resin layer and the photosensitive resin layer in the latent image forming portion.

It is considered that these are all because the solvent used in forming the coating resin layer has a strong dissolving power, and the photosensitive resin layer in the portion which becomes the ink flow path is partially dissolved and lost its shape.

Next, in order to examine the print quality of the ink jet heads produced in Examples 1 to 6 and Comparative Examples 1 to 3,
The inkjet heads obtained in Examples 1 to 6 and Comparative Examples 1 to 3 were mounted on a recording device, and pure water / glycerin / direct black 154 (water-soluble black dye) = 65/3.
A4 size test print was performed using an ink composed of 0/5 wt.

In the ink jet heads produced in Examples 1 to 6, the ink jet heads produced in any of the Examples had the same print quality as conventional ones, and stable printing was possible.

On the other hand, in the ink jet head manufactured in Comparative Example 1, normal ink ejection could not be performed. Further, in the inkjet head manufactured in Comparative Example 2, the image was partially distorted in the output image. In addition, in the inkjet head manufactured in Comparative Example 3, deviation of ink was generated, and white streaks were found in the output image.

As described above, according to the method of manufacturing an ink jet head of the present invention, it is possible to obtain a high quality ink jet head even when a solvent having a strong dissolving power is used when forming the coating resin layer.

Next, in the method of manufacturing the ink jet head, the superiority due to the wide range of selection of the solvent when forming the coating resin layer will be described.

(Embodiment 7) First, a 5-inch silicon wafer in which ejection energy element patterns are arranged so that 200 ink jet heads can be taken is prepared, and this silicon wafer is used as a substrate in the same manner as in Embodiment 4 to form ejection ports. And the ink flow path was formed. Then, by cutting this silicon wafer into individual inkjet heads, 200 inkjet heads were obtained. here,
As described above, the solvent when applying the coating resin layer is cyclohexanone.

Comparative Example 4 200 ink jet heads were prepared in the same manner as in Example 7 except that the solvent at the time of coating the coating resin layer was changed to toluene / cyclohexanone = 9/1 (weight ratio).

With respect to the ink jet heads of Example 7 and Comparative Example 4 thus obtained, the yields due to the variations in the ejection amounts were examined, and in comparison with Example 7, the yield was 80%. In Example 4, the yield was 65%.

In the composition of toluene / cyclohexanone = 9/1 which is the solvent used in Comparative Example 4, since the non-polar solvent toluene occupies most of the composition, the ink flow path pattern 4a
It is possible to use a general-purpose novolac-based resist as a material for forming the. However, when considering the above composition as the coating solvent for the coating resin layer, it is considered that the yield in Comparative Example 4 was reduced because the film thickness uniformity of the coating film was reduced.

Then, in Comparative Example 4, when the distribution of defective heads in the 5-inch wafer was examined, it was found that the defective heads were concentrated on the heads arranged on the outer peripheral portion of the wafer. It is considered that this is because the film thickness uniformity at the time of forming the coating resin layer becomes worse toward the outer peripheral portion of the wafer.

As described above, it can be seen that the use of a solvent having a strong dissolving power generally improves the film thickness uniformity of the coating film and improves the yield of the ink jet head.

[0130]

As described above, according to the present invention, it becomes possible to manufacture a high quality ink jet head with a high yield, and it is possible to remarkably improve the productivity in manufacturing the ink jet head. is there. Further, the restriction of the solvent for coating the coating resin layer is substantially eliminated, and as a result, the coating resin material, which has been unusable until now, can be used, and the performance of the inkjet head itself can be improved.

As described above, it is understood that the ink jet head manufacturing method of the present invention has the above-mentioned effects which cannot be predicted conventionally.

[Brief description of drawings]

FIG. 1 is an explanatory diagram for explaining a manufacturing process according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram for explaining a manufacturing process according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram illustrating a manufacturing process according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram for explaining the manufacturing process for the first embodiment of the present invention.

FIG. 5 is an explanatory diagram for explaining the manufacturing process according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram for explaining the manufacturing process for the first embodiment of the present invention.

FIG. 7 is an explanatory diagram for explaining the manufacturing process for the first embodiment of the present invention.

FIG. 8 is an explanatory diagram for explaining the manufacturing process for the first embodiment of the present invention.

FIG. 9 is an explanatory diagram for explaining the manufacturing process for the first embodiment of the present invention.

FIG. 10 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 11 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 12 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 13 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 14 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 15 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 16 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 17 is an explanatory diagram for explaining the manufacturing process for the second embodiment of the present invention.

FIG. 18 is an explanatory diagram for explaining a step of forming a discharge port by photolithography.

FIG. 19 shows Example 1 according to the first embodiment of the present invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 20 is a first example of the first embodiment of the present invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 21 is a first example according to the first embodiment of the present invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 22 is a first example of the first embodiment of the invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

[FIG. 23] Example 1 according to the first embodiment of the present invention
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 24 is a first example of the first embodiment of the invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 25 is a first to a first embodiment according to the present invention.
4 is a cross-sectional view of a main part in each manufacturing process of No. 4 of FIG.

FIG. 26 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 27 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 28 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 29 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 30 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 31 is a fifth example according to the second embodiment of the present invention;
FIG. 6 is a cross-sectional view of main parts in each manufacturing process of No. 6.

FIG. 32 is a schematic perspective view of an inkjet device in which the inkjet head obtained by the present invention can be mounted.

[Explanation of symbols] 1 Inkjet head substrate 2 Discharge energy generation element 3 ink supply port 4 Ionizing radiation decomposition type photosensitive resin 4a Ink flow path pattern 5 masks 6 Coating resin layer 7 Silicon resist 8 ink channels 9 Ink outlet

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-5-330066 (JP, A) JP-A-4-216955 (JP, A) JP-A-5-330068 (JP, A) JP-A-5- 124205 (JP, A) JP-A-4-312856 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B41J 2/05 B41J 2/16

Claims (31)

(57) [Claims] 1. A method of manufacturing an ink jet head, comprising: an ink flow path communicating with an ejection port for ejecting ink; and an energy generating element for generating energy used for ejecting ink. And a method for manufacturing an inkjet head, including the following steps (1) to (7). (1) Step of preparing a substrate having the energy generating element (2) Ionizing radiation decomposing type including a structural unit crosslinkable on the surface of the substrate on which the energy generating element is provided so as to cover the energy generating element (3) Intermolecular crosslinking of the photosensitive resin layer of (4) Step (4) Forming a coating resin layer on the crosslinked photosensitive resin layer (5) The coating resin layer (6) Irradiating the crosslinked photosensitive resin layer with ionizing radiation through the coating resin layer in order to decompose and solubilize the crosslinked photosensitive resin layer so as to contribute to the formation of ink flow paths. Step (7) A step of eluting the solubilized photosensitive resin layer to form an ink flow path communicating with the ejection port 2. A step of irradiating ionizing radiation except a portion of the crosslinked photosensitive resin layer that contributes to formation of an ink flow path before forming the coating resin layer, and a step of forming the crosslinked photosensitive resin layer. The method of manufacturing an inkjet head according to claim 1, further comprising a step of eluting a portion irradiated with ionizing radiation. 3. The method for manufacturing an ink jet head according to claim 2, wherein the coating resin layer is formed by solvent coating. 4. The method for manufacturing an inkjet head according to claim 2, wherein the photosensitive resin layer is composed of a photosensitive resin represented by the following general formula (1). [Chemical 1] 5. The method of manufacturing an inkjet head according to claim 3, wherein the coating resin layer is made of a photocurable resin. 6. The method for manufacturing an inkjet head according to claim 5, further comprising the step of forming a discharge port in the coating resin layer. 7. The method of manufacturing an ink jet head according to claim 6, wherein the ejection port is formed by dry etching using oxygen plasma. 8. The method of manufacturing an inkjet head according to claim 6, wherein the formation of the ejection port is performed by photolithography. 9. The method of manufacturing an inkjet according to claim 6, wherein the discharge port is formed by an excimer laser. 10. The method of manufacturing an inkjet head according to claim 3, wherein the coating resin layer is made of a thermosetting resin. 11. The method for manufacturing an inkjet head according to claim 10, further comprising the step of forming a discharge port in the coating resin layer. 12. The method of manufacturing an inkjet head according to claim 11, wherein the ejection port is formed by dry etching using oxygen plasma. 13. The method of manufacturing an ink jet head according to claim 11, wherein the ejection port is formed by an excimer laser. 14. The method of manufacturing an inkjet head according to claim 1, wherein in the irradiation step of the ionizing radiation, the irradiation of the ionizing radiation is performed only on a portion that contributes to the formation of the ink flow path. 15. The method of manufacturing an inkjet head according to claim 14, wherein the coating resin layer is formed by solvent coating. 16. The photosensitive resin layer has the following general formula (2):
15. The method for manufacturing an inkjet head according to claim 14, wherein the method is formed of a photosensitive resin represented by. [Chemical 2] 17. The method of manufacturing an inkjet head according to claim 15, wherein the coating resin layer is made of a photocurable resin. 18. The method for manufacturing an inkjet head according to claim 17, further comprising the step of forming a discharge port in the coating resin layer. 19. The method of manufacturing an ink jet head according to claim 18, wherein the ejection port is formed by dry etching using oxygen plasma. 20. The method of manufacturing an ink jet head according to claim 18, wherein the ejection port is formed by photolithography. 21. The method of manufacturing an ink jet head according to claim 18, wherein the discharge port is formed by an excimer laser. 22. The method of manufacturing an inkjet head according to claim 15, wherein the coating resin layer is made of a thermosetting resin. 23. The method of manufacturing an ink jet head according to claim 22, further comprising the step of forming a discharge port in the coating resin layer. 24. The method of manufacturing an inkjet head according to claim 23, wherein the ejection port is formed by dry etching using oxygen plasma. 25. The method for manufacturing an inject head according to claim 23, wherein the discharge port is formed by an excimer laser. 26. The photosensitive resin layer has the following general formula (1):
The method for manufacturing an inkjet head according to claim 1, wherein the inkjet head is made of a photosensitive resin. [Chemical 1] 27. The method of manufacturing an inkjet head according to claim 26, wherein the photosensitive resin is a photocrosslinking type. 28. The method for manufacturing an inkjet head according to claim 26, wherein the photosensitive resin is a heat-crosslinking type. 29. The photosensitive resin layer has the following general formula (2):
The method for manufacturing an inkjet head according to claim 1, wherein the inkjet head is made of a photosensitive resin. [Chemical 2] 30. The method of manufacturing an inkjet head according to claim 29, wherein the photosensitive resin is a photocrosslinking type. 31. The method of manufacturing an inkjet head according to claim 29, wherein the photosensitive resin is a heat-crosslinking type.