JP3522467B2 - Operation method of rotary coating apparatus and substrate processing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of operating a rotary coating apparatus having a plurality of coating liquid supply systems and a substrate processing apparatus equipped with the rotary coating apparatus.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a substrate processing apparatus is used in which an apparatus for performing a series of mutually related processing is unitized and integrated. Figure 5
FIG. 6 is a schematic configuration diagram of a conventional substrate processing apparatus. The substrate treatment apparatus 1 shown in FIG. 5 includes a rotary coating device 10 that spin-coats a thin film on the surface of a substrate such as a semiconductor wafer. Although not shown, units such as a substrate heat treatment device, a substrate cleaning device, a substrate developing device, and a peripheral exposure device are also provided.

The rotary coating apparatus 10 includes a substrate 100 and a rotary drive unit for holding and rotating the substrate 100 in a horizontal posture.
4 coating liquid supply systems 5a to 5d for supplying the coating liquid to the surface of the. Each of the coating liquid supply systems 5a to 5d includes a coating liquid storage tank that stores various coating liquids, such as a resist liquid, a pipe that guides the coating liquid, and a nozzle that discharges the coating liquid. Then, for example, the substrate 1
In the case of spin-coating the resist solution onto No. 00, a coating solution supply system for supplying a desired resist solution is selected from the four coating solution supply systems 5a to 5d, and the nozzle of the selected coating solution supply system is selected. While supplying the resist solution from the
The substrate 100 is rotated to form a resist film on the surface of the substrate.

Incidentally, with recent high integration of semiconductor devices, it is required to miniaturize thin film patterns such as semiconductor layers and metal layers on a substrate. For this,
It is necessary to narrow the line width of the resist pattern used for forming the thin film pattern. However, when attempting to narrow the line width of the resist pattern, scattering of the exposure light reflected on the surface of the base film during exposure of the resist film becomes a major obstacle. When the reflected light of the exposure light is irregularly reflected, the resist portion other than the desired pattern area is exposed and the pattern accuracy is lowered. Therefore, recently, an anti-reflection coating agent (hereinafter referred to as ARC) for preventing the reflection of exposure light is applied to the surface of the resist film or the lower surface of the resist film.

On the other hand, various resist liquids are selectively used according to the film quality of the substrate and the thin film on the substrate surface. Furthermore, depending on the type of resist solution, AR
C is also used properly.

Therefore, a resist solution supply system and an ARC supply system are provided in one rotary coating apparatus to form a resist film and an AR.
It is conceivable to form a two-layer film of C film. That is,
First, the resist solution is spin-coated on the substrate, and then the heat treatment device is used to subject the resist film to a predetermined heat treatment. Then, the substrate is returned to the same rotary coating device to form the ARC on the resist film.
Spin coating.

However, in this method, it is necessary to carry in and carry out the substrate before the resist film is formed and the substrate after the heat treatment of the resist film are completed in and out of one rotary coating apparatus, so that the entire substrate processing apparatus is carried out. Timing control becomes complicated.

If the resist film and the ARC film can be continuously formed on the substrate in the same rotary coating apparatus, the above-mentioned inconvenience does not occur. However, the time required for one substrate to occupy one rotary coating device is about twice as long as that for the case where one layer of thin film is spin coated. Therefore, there is a problem that the processing time of the entire substrate processing apparatus is rate-controlled by the processing time in one rotary coating apparatus, and the throughput of the entire substrate processing apparatus is reduced.

Therefore, it is conceivable to form the resist film and the ARC film by separate rotary coating devices. In this case, the timing control of the entire substrate processing apparatus does not become complicated, and the problem of reduction in throughput does not occur.

[0010]

However, there is a limit to the number of coating liquid supply systems that can be provided in one rotary coating apparatus. For example, in the above example, the number of coating liquid supply systems provided in one rotary coating apparatus is four. Therefore, when the number of types of resist liquid exceeds 4, it is necessary to increase the number of rotary coating devices for resist coating by one, as shown in FIG. 6, for example.

In the substrate processing apparatus 2 of FIG. 6, the first rotary coating apparatus 10a is provided with two types of coating solution supply systems A1 and A2 for supplying ARC, and the second rotary coating apparatus 1 is provided.
0b, coating film supply system R1 for supplying four types of resist solution
R4 is provided, and in the third rotary coating device 10c,
Coating liquid supply systems R5 and R6 for supplying two types of resist liquid are provided. As described above, in the above method, the number of rotary coating apparatuses required is large, and the substrate processing apparatus 2
Becomes larger. Moreover, in the first and third rotary coating apparatuses 10a and 10c, among the four coating liquid supply systems,
Each two lines are unused. For this reason, although the number of the coating liquid supply systems is 3 in 3 units, only the coating liquid supply systems of 8 systems are used and the utilization efficiency is low.

An object of the present invention is to provide a method for operating a rotary coating apparatus and a substrate processing apparatus capable of efficiently operating the rotary coating apparatus in forming a multilayer coating film.

[0013]

[Means for Solving the Problems and Effects of the Invention]

(1) First Invention In a method for operating a rotary coating apparatus according to a first invention, a first coating is applied onto a substrate by using first and second rotary coating apparatuses having a plurality of coating liquid supply systems. A method of operating a rotary coating device for laminating a film and a second coating film, comprising: filling one or more coating liquid supply systems of the first rotary coating device with the first coating liquid; The one or more coating liquid supply systems are filled with the second coating liquid, the one or more coating liquid supply systems of the second rotary coating device are filled with the first coating liquid, and the remaining one or more coating liquids are filled. The second coating liquid is filled in the first coating liquid, and the first coating liquid is supplied onto the first substrate by one of the coating liquid supply systems of the first rotary coating apparatus to perform the first coating. After the film is formed, the second coating film is formed on the first coating film by one of the coating liquid supply systems of the second rotary coating device. A cloth liquid is provided to form a second coating film, and the first coating liquid is supplied onto the second substrate by one of the coating liquid supply systems of the second rotary coating device to form the first coating film. First after forming
By any one of the coating liquid supply systems of the rotary coating device
The second coating liquid is supplied onto the coating film to form the second coating film.

In the method for operating a rotary coating apparatus according to the first aspect of the present invention, the first coating liquid is distributed and filled in both the first rotary coating apparatus and the second rotary coating apparatus,
Further, the second coating liquid is distributed and filled in both the first and second rotary coating devices. The substrate on which the first coating film is formed by using the first rotary coating apparatus is transferred to the second rotary coating apparatus, and the first rotary coating apparatus is used to perform the first coating.
A second coating film is formed on the coating film. On the other hand, the substrate on which the first coating film has been formed by using the second rotary coating apparatus is conveyed to the first rotary coating apparatus, and the first coating film is formed by using the first rotary coating apparatus. A second coating film is formed on top.

In this case, since the first and second coating films are formed on one substrate by using different rotary coating devices, the timing control of the substrate processing is not complicated. (2) Second invention A method for operating a rotary coating apparatus according to a second invention is the same as the method for operating a rotary coating apparatus according to the first invention,
The one or more coating liquid supply systems of the first rotary coating device and the one or more coating liquid supply systems of the second rotary coating device are filled with different types of the first coating liquid,
The type of the second coating liquid filled in the one or more coating liquid supply systems of the first rotary coating device and the one or more coating liquid supply systems of the second rotary coating device are different from each other. .

In this case, a rotary coating device is added by appropriately distributing a plurality of types of first coating liquid and a plurality of types of second coating liquid to the first and second rotary coating devices. Instead, it becomes possible to allocate a plurality of types of first and second coating liquids to the first and second rotary coating devices.

(3) Third Invention A method of operating a rotary coating apparatus according to a third aspect of the present invention is the same as the method of operating a rotary coating apparatus according to the second invention.
The number of types of the first coating liquid is larger than the number of coating liquid supply systems of the first rotary coating device and the number of coating liquid supply systems of the second rotary coating device, respectively. The number of types of liquid is smaller than the number of coating liquid supply systems of the first rotary coating device and the number of coating liquid supply systems of the second rotary coating device, respectively.

In this case, the first and second coating solutions can be efficiently allocated to the first and second rotary coating devices without increasing the number of rotary coating devices. (4) Fourth Invention In a substrate processing apparatus according to a fourth invention, one or a plurality of coating liquid supply systems filled with a first coating liquid and one or a plurality of coating liquids filled with a second coating liquid. First with liquid supply system
Rotation coating apparatus, and second rotary coating having one or a plurality of coating solution supply systems filled with a first coating solution and one or a plurality of coating solution supply systems filled with a second coating solution The first coating liquid to form the first coating film on the first substrate by either the apparatus or the coating liquid supply system of the first rotary coating device, and then the second rotary coating. Any one of the coating liquid supply systems of the second rotary coating device, by supplying the second coating liquid onto the first coating film by any one of the coating liquid supply systems of the apparatus to form the second coating film. The first coating liquid is supplied onto the second substrate to form the first coating film, and then the second coating liquid is supplied onto the first coating film by the first rotary coating device. And a control means for controlling the first and second rotary coating devices so as to form the second coating film.

In the substrate processing apparatus according to the fourth aspect of the present invention, the first coating liquid is distributed and filled in both the first rotary coating apparatus and the second rotary coating apparatus, and the second coating solution is used. The liquid is also distributed and filled in both the first and second spin coaters. The substrate on which the first coating film has been formed by using the first rotary coating apparatus is transported to the second rotary coating apparatus, and the substrate is formed on the first coating film by using the second rotary coating apparatus. A second coating film is formed. On the other hand, the substrate on which the first coating film has been formed by using the second rotary coating apparatus is conveyed to the first rotary coating apparatus, and the first coating film is formed by using the first rotary coating apparatus. A second coating film is formed on top. In this case, since the first and second coating films are formed on one substrate by using different rotary coating devices, timing control of substrate processing in the substrate processing device does not become complicated.

(5) Fifth Invention A substrate processing apparatus according to a fifth invention is the same as the substrate processing apparatus according to the fourth invention, except that in the configuration of the first rotary coating apparatus,
Alternatively, the types of the first coating liquid filled in the plurality of coating liquid supply systems and the one or more coating liquid supply systems of the second rotary coating device are different from each other, and the first coating liquid of the first rotary coating device is different.
Alternatively, the types of the second coating liquid filled in the plurality of coating liquid supply systems and the one or more coating liquid supply systems of the second rotary coating device are different from each other.

In this case, the number of rotary coating devices is increased by appropriately distributing the plurality of types of first coating liquids and the plurality of types of second coating liquids to the first and second rotary coating devices. It is possible to allocate a plurality of types of the first and second coating liquids to the first and second rotary coating devices without using them. This can prevent the substrate processing apparatus from increasing in size.

(6) Sixth Invention In the substrate processing apparatus according to the sixth invention, in the configuration of the substrate processing apparatus according to the fifth invention, the number of types of the first coating liquid is the first rotary type. The number of coating liquid supply systems of the coating device is larger than the number of coating liquid supply systems of the second rotary coating device, and the number of types of the second coating liquid is the same as that of the first rotary coating device. The number is smaller than the number of liquid supply systems and the number of coating liquid supply systems of the second rotary coating apparatus, respectively.

In this case, the first and second coating liquids can be efficiently allocated to the first and second rotary coating devices without increasing the number of rotary coating devices.
This can prevent the substrate processing apparatus from increasing in size.

[0024]

1 is a block diagram of a substrate processing apparatus according to an embodiment of the present invention. In FIG. 1, the substrate processing apparatus 3 includes a first rotary coating apparatus 10d and a second rotary coating apparatus 10d.
e.

First, the first and second rotary coating devices 10
The configurations of d and 10e will be described. FIG. 2 is a plan view of the rotary coating device 10d (10e) shown in FIG. 1, and FIG. 3 is a side view of a main part of the rotary coating device. The rotary coating device 10d has four nozzles and can selectively supply four types of coating liquid onto the substrate.

As shown in FIG. 2, a rotary coating device 10d.
The substrate 100 arranged in the housing is held in a horizontal posture and is rotationally driven in the direction of the arrow X around the vertical rotation axis. In addition, the cup 11 surrounds the substrate 100.
Is provided so that it can move up and down.

Four support blocks 14a to 14d are arranged on the side of the cup 11, and each of the support blocks 14a to 1 is formed.
Nozzle arms 12a to 12d are respectively supported by 4d. The tip portions of the four nozzle arms 12a to 12d are curved downward, and the nozzles are attached to the tip portions. The support blocks 14a to 14d are configured to be horizontally movable along the guide rail 30 in the arrow W direction.

That is, as shown in FIG. 3, the movable frame 31 connected to the lower surface of the support block 14a is reciprocally movable along the fixed guide rail 30. Then, the rack 29 fixed to the movable frame 31 and the pinion 27 connected to the electric motor 26 engage with each other and rotate, so that the movable frame 31 reciprocates. Thereby, the four nozzle arms 12a (to 1
2d) reciprocates in the direction of arrow W shown in FIG.

Further, the arm rotation support 33 has a cylindrical shaft 22a (to 22) extending from each nozzle arm 12a (to 12d).
d) is rotatably held inside and the movable frame 31
It goes up and down along the rail part formed in. When the arm rotation support 33 moves up and down, at the same time, the support block 14a (to 14d) and the nozzle arm 12a (to 1
2d) also moves up and down.

The tube for supplying the coating liquid includes the nozzle arm 12a (to 12d), the cylinder shaft 22a (to 22d), and the pipe 2.
4a (to 24d) and passes through the coating liquid storage tank 25.
It extends to a (~ 25d). As schematically shown in FIG. 2, the rotary coating device 10d (10e) is provided with four coating liquid storage tanks 25a to 25d for supplying the coating liquid to each of the four nozzle arms 12a to 12d. Has been. The resist solutions or ARCs are stored in the coating solution storage tanks 25a to 25d, respectively, and are supplied onto the substrate through the nozzle arms 12a to 12d, respectively.
That is, the coating liquid storage tanks 25a to 25d and the nozzle arms 12a to 12d form a coating liquid supply system, respectively.

On the sides of the support blocks 14a to 14d,
A movable bracket 17 is arranged. On the movable bracket 17, the drive arm 18 is rotated by the support shaft 19 to rotate the rotation axis P1.
It is mounted so that it can rotate around. Drive arm 1
An engaging hole 16a corresponding to the engaging pin 15 is formed at the tip of 8, and an engaging protrusion 16 corresponding to the engaging concave portion 28 is formed on the lower surface.
b is formed. The support shaft 19 is rotationally driven by a motor 21 via a belt 20 around a rotation axis P1.

The movable bracket 17 has a movable frame 3 which is vertically movable via an air cylinder 32.
4 is attached. The lower end of the movable frame 34 is formed so as to engage with the tip projection of the arm rotation support 33. When the air cylinder 32 extends,
The movable frame 34 operates so as to push the arm rotation support 33 upward. That is, the movable frame 34 and the air cylinder 32 engage the drive arm 18 with one of the support blocks 14a (to 14d), and the nozzle arm attached to the engaged support block is selected.

Further, the movable bracket 17 is formed so as to be able to move up and down by a pair of air cylinders 23a and 23b arranged in series, and is positioned so as not to interfere with other nozzle arms when the selected nozzle arm rotates. Move up and down.

In the rotary coating apparatus having the above structure, one of the four coating liquid supply systems is selected, and the substrate 100 is selected from the selected coating liquid storage tanks 25a to 25d.
The coating liquid is supplied to the surface and the spin coating process is performed.

In this embodiment, as shown in FIG.
It is possible to supply two kinds of ARC and six kinds of resist solutions by using the total eight systems of the coating liquid supply system of the one rotary type coating device 10d and 10e. The first rotary coating apparatus 10d is provided with one type of ARC supply system A1 and three types of resist liquid supply systems R1 to R3. Also,
For the second rotary coating device 10e, another type of ARC is used.
Supply system A2 and three different resist liquid supply systems R
4 to R6 are provided. First rotary coating device 1
The resist liquid supply systems R1 to R3 of 0d are for supplying the resist liquid suitable for the ARC of the supply system A2 of the ARC of the second rotary coating apparatus 10e, and the resist liquid of the second rotary coating apparatus 10e. The supply systems R4 to R6 supply a resist solution suitable for the ARC of the ARC supply system A1 of the first rotary coating apparatus 10d.

The transfer operation of the substrate 100 and the spin coating operation by the rotary coating apparatuses 10d and 10e are controlled by the control unit 6 provided in the substrate processing apparatus 3 as follows. FIG. 4 is an explanatory diagram of a coating film forming process using the above rotary coating device. 4A and 4B show a case where a resist is applied on the lower layer side of the substrate and an ARC film is formed on the upper surface thereof, and FIGS.
The case where the RC film is formed and the resist film is formed above is shown.

In FIGS. 1 and 4A, the substrate is carried into the first rotary coating apparatus 10d, and the resist solution is supplied from the resist solution supply system selected from the resist solution supply systems R1 to R3 onto the substrate surface. And then spin coated. When the spin coating of the resist solution is completed, the substrate is taken out of the first rotary coating apparatus 10d, carried into a heat treatment apparatus (not shown) provided in the substrate processing apparatus 3 and subjected to a predetermined heat treatment, It is carried into the second rotary coating apparatus 10e. In the second rotary coating apparatus 10e, the ARC supply system A2 is selected, ARC is supplied onto the resist film, and spin coating is performed.

In this coating step, while the ARC is being spin-coated by the second rotary coating device 10e, the first rotary coating device 10d forms a resist film on the next substrate. You can Therefore, as compared with the case of coating a two-layer film of a resist film and an ARC film by using one rotary coating device, the spin coating processing time is reduced and the throughput is improved.

Next, in FIG. 4B, the resist solution to be applied is provided in the resist solution supply systems R4 to R6 of the second rotary coating apparatus 10e, and the ARC suitable for this is the first rotation. When provided in the rotary coating apparatus 10d, the substrate is first loaded into the second rotary coating apparatus 10e. Then, the resist solution is supplied onto the substrate from the resist solution supply system selected from the three systems of resist solution supply systems R4 to R6, and spin-coated. After that, the substrate is carried into a predetermined heat treatment apparatus and subjected to heat treatment, and then carried into the first rotary coating apparatus 10d. And the ARC supply system A1
ARC is supplied on the resist film already applied,
It is applied by spin coating.

Further, when the ARC film is formed as the lower layer and the resist film is formed as the upper layer, as shown in FIG. 4C, the ARC supply system A1 is applied to the substrate carried into the first rotary coating apparatus 10d. The ARC is supplied from the above and spin-coated, then heat-treated by a predetermined heat-treatment device, and further carried into the second rotary coating device 10e. Then, the resist solution is supplied by the resist solution supply system selected from the three systems of resist solution supply systems R4 to R6, and spin-coated.

Further, in the case shown in FIG. 4D, the substrate is carried into the second rotary coating apparatus 10e, the ARC coating liquid is supplied from the ARC supply system A2, and spin coating is performed.
After that, the substrate is sent to a predetermined heat treatment apparatus and subjected to heat treatment, and then carried into the first rotary coating apparatus 10d.
Then, the resist solution is supplied from the resist solution supply system selected from the three systems of resist solution supply systems R1 to R3, and spin-coated.

In the above process, if the heat treatment performed after forming the first resist film or ARC film is unnecessary, the heat treatment is omitted and the first or second rotary coating apparatus 10d is used. , 10e forms the first thin film, and the substrate is immediately transferred to the second or first rotary coating apparatus 10e, 10d.

As described above, in the present invention, the first layer or the second layer
When the type of coating liquid for forming a thin film of any one of the layers exceeds the number of coating liquid supply systems of one rotary coating device, the coating liquids for forming the thin films of the first layer and the second layer are respectively supplied. Two layers that conventionally required three rotary coating devices by being provided in different rotary coating devices and configured to perform thin film formation of the first layer and the second layer using different rotary coating devices. The thin film coating step can be performed using two rotary coating devices. For this reason, it is possible to prevent the size of the entire substrate processing apparatus in which the rotary coating apparatus is incorporated from becoming excessively large.

The first and second rotary type coating devices 1
In each of 0d and 10e, when the waste liquid treatment of the three types of resist liquid and one type of ARC used is different, a function is provided to switch the connection of the waste liquid line to guide the waste liquid to the appropriate waste liquid treatment section. Preferably. Further, when corrosion resistance corresponding to each treatment liquid is required, it is sufficient to take measures against it.

Further, the above-mentioned rotary coating devices 10d, 10
The processing liquid filled in e is a resist liquid or ARC.
However, the treatment liquid is not limited to the above, and other treatment liquid can be filled. Further, the present invention can be applied not only to a wafer as the substrate 100 but also to a treatment liquid application treatment of a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disc, or the like.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a rotary coating device.

FIG. 3 is a side view of a main part of the rotary coating apparatus shown in FIG.

FIG. 4 is a process diagram of forming a coating film using the rotary coating apparatus according to the present invention.

FIG. 5 is a schematic configuration diagram of a substrate processing apparatus according to a conventional example.

FIG. 6 is a schematic configuration diagram of a substrate processing apparatus according to another conventional example.

[Explanation of symbols]

3 Substrate processing equipment 6 control unit 10d, 10e First and second rotary coating apparatus 12a to 12d nozzle arm A1, A2 ARC supply system R1 to R6 resist solution supply system

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeru Sasada 322 Hazushishi Furukawa-cho, Fushimi-ku, Kyoto Dai Nippon Screen Mfg. Co., Ltd. Rakusai Plant (56) Reference Japanese Patent Laid-Open No. 8-51067 (JP, A) Kaihei 7-176589 (JP, A) JP 61-263224 (JP, A) JP 2-121346 (JP, A) JP 8-22128 (JP, A) (58) Fields investigated ( Int.Cl. ⁷ , DB name) H01L 21/027

Claims (6)

(57) [Claims] 1. A method of operating a rotary coating apparatus, which comprises stacking a first coating film and a second coating film on a substrate using first and second rotary coating apparatuses having a plurality of coating liquid supply systems. And filling the one or more coating liquid supply systems of the first rotary coating apparatus with the first coating liquid and filling the remaining one or more coating liquid supply systems with the second coating liquid. Then, while filling one or more coating liquid supply systems of the second rotary coating apparatus with the first coating liquid, the remaining one or more coating liquid supply systems are filled with the second coating liquid, After the first coating liquid is supplied onto the first substrate by any of the coating liquid supply systems of the first rotary coating device to form a first coating film, the second rotary coating device Second coating liquid is supplied onto the first coating film by any one of the coating liquid supply systems After forming a film and supplying the first coating liquid onto the second substrate by any of the coating liquid supply systems of the second rotary coating apparatus to form the first coating film, the first coating film is formed. Of the rotary coating apparatus, the second coating solution is supplied onto the first coating film by any one of the coating solution supply systems of the rotary coating apparatus to form a second coating film. Method. 2. One or a plurality of coating liquid supply systems of the first rotary coating apparatus and one of the second rotary coating apparatuses.
Alternatively, the types of the first coating liquid filled in the plurality of coating liquid supply systems are different, and one or a plurality of coating liquid supply systems of the first rotary coating device and one of the second rotary coating device 2. The method for operating a rotary coating apparatus according to claim 1, wherein the types of the second coating liquid filled in the plurality of coating liquid supply systems are different from each other. 3. The number of types of the first coating liquid is the number of coating liquid supply systems of the first rotary coating apparatus and the number of the second coating liquid supply systems.
The number of types of the second coating liquid is greater than the number of the coating liquid supply systems of the rotary coating device, and the number of types of the second coating liquid is equal to the number of the coating liquid supply systems of the first rotary coating device and the number of the second coating liquid. 3. The method for operating a rotary coating apparatus according to claim 2, wherein the number of coating liquid supply systems of the rotary coating apparatus is smaller than each of the coating liquid supply systems. 4. A first rotary coating apparatus having one or a plurality of coating liquid supply systems filled with a first coating liquid and one or a plurality of coating liquid supply systems filled with a second coating liquid. A second rotary coating device having one or a plurality of coating liquid supply systems filled with a first coating liquid and one or a plurality of coating liquid supply systems filled with a second coating liquid; The first coating liquid is supplied onto the first substrate to form a first coating film by any one of the coating liquid supply systems of the second rotary coating device, and then the second coating liquid of the second rotary coating device. The second coating liquid is supplied onto the first coating film by any one of the supply systems to form the second coating film, and the second coating liquid is formed by any one of the coating liquid supply systems of the second rotary coating apparatus. After supplying the first coating liquid on the second substrate to form the first coating film,
The second coating liquid is supplied onto the first coating film by any one of the coating liquid supply systems of the first rotary coating device to form the second coating liquid.
And a control means for controlling the first and second rotary coating devices so as to form the coating film. 5. One or a plurality of coating liquid supply systems of the first rotary coating apparatus and one of the second rotary coating apparatuses.
Alternatively, the types of the first coating liquid filled in the plurality of coating liquid supply systems are different, and one or a plurality of coating liquid supply systems of the first rotary coating device and one of the second rotary coating device The substrate processing apparatus according to claim 4, wherein the types of the second coating liquid filled in the plurality of coating liquid supply systems are different from each other. 6. The number of types of the first coating liquid is the number of coating liquid supply systems of the first rotary coating apparatus and the number of the second coating liquid supply systems.
The number of types of the second coating liquid is larger than the number of the coating liquid supply systems of the rotary coating device, and the number of types of the second coating liquid is the number of the coating liquid supply systems of the first rotary coating device and the number of the second type. 6. The substrate processing apparatus according to claim 5, wherein the number of coating liquid supply systems of the rotary coating apparatus is smaller than each of the numbers.