JP3511368B2 - Electronic board fixing sheet - Google Patents
Electronic board fixing sheetInfo
- Publication number
- JP3511368B2 JP3511368B2 JP08851099A JP8851099A JP3511368B2 JP 3511368 B2 JP3511368 B2 JP 3511368B2 JP 08851099 A JP08851099 A JP 08851099A JP 8851099 A JP8851099 A JP 8851099A JP 3511368 B2 JP3511368 B2 JP 3511368B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- weight
- parts
- sensitive adhesive
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Jigs For Machine Tools (AREA)
- Adhesive Tapes (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、１〜５ｍｍの表面
凹凸を有する電子基盤を固定しつつダイシング（チップ
状に切断・分離すること）する際に、その固定用に貼り
付けられる電子基板固定用シートに関する。
【０００２】
【従来の技術】従来、ダイシングの際に使用される電子
基盤固定用シートとして、本出願人は、紫外線硬化型粘
着剤を使用したものを開示している（特開平１０−３３
８８５３号公報参照）。
【０００３】
【発明が解決しようとする課題】ここで、かかるシート
は、半導体ウエハをダイシングする際には、非常に優れ
たものである。
【０００４】このダイシングの際、ダイシングの対象物
である電子基盤に密着しないで隙間があると、該隙間に
ある酸素が光硬化を阻害し、粘着剤の粘着力を制御でき
なくなり場合によってはダイシングの際に電子基盤チッ
プを飛散させるばかりでなく、該粘着剤に糊残り（非着
体である電子基板に粘着剤が移行すること）が生じてし
まうという課題があった。
【０００５】この課題を解決するために、シート積層時
には丁寧に積層して密着させることが要求されていた。
【０００６】しかし、最近の電子基盤では、金属ボール
状の端子が形成されたり、基盤自体が大きくなったりし
て、その凹凸が１〜５ｍｍまで大きくなり、隙間が生じ
やすい環境になってきた。凹凸のある電子基盤として
は、半導体デバイス部品として用いられる物であって主
にエポキシ樹脂で封止されたものを挙げることができ、
具体的にはＢＧＡ（ボール・グリッド・アレイ）、ＣＰ
Ｓ（チップ・サイズ・パッケージ）、スタック・メモリ
ー・モジュール、システム・オン・モジュールなどがあ
る。
【０００７】したがって、本発明の目的は、電子基盤に
１〜５ｍｍの凹凸があってもダイシングの際に電子基盤
チップを飛散させることなく、さらには確実に電子基盤
に密着して糊残りを生じさせない電子基盤固定用シート
を提供することにある。
【０００８】
【課題を解決するための手段】本発明者らは、上記に鑑
み鋭意検討を行った結果、シート状で光透過性の基材
と、該基材の一方の面に積層された粘着剤層を有する電
子基盤固定用シートにおいて、該基材の２５％モジュラ
ス（ＪＩＳ Ｚ ０２３７の６準拠）が０．５〜１．２
ｋｇｆ／２０ｍｍである一方、該基材の厚さが７０〜３
００μｍであり、該粘着剤層がアクリル系粘着剤であ
り、その組成物が、ベースポリマ１００重量部、紫外線
重合性樹脂３〜１００重量部、紫外線重合開始剤０．１
〜５重量部及び１〜３０重量部の粘着付与樹脂で配合さ
れ、該粘着剤層の厚さを１０〜５０μｍとすることによ
り、上記課題を解決できることを見出だし本発明を完成
した。
【０００９】
【発明の実施の形態】本発明にかかる電子基盤固定用シ
ートにおいて、基材の２５％モジュラスと厚さを限定し
たのは、あまりに高い（厚い）と凹凸に対する追従性が
減少し電子基盤との間に隙間ができていしまい、あまり
に小さい（薄い）とシートの強度が不足しダイシングの
際にシートが破損してしまうためである。
【００１０】基材として採用されるベースポリマとして
は、上記条件を満たすものであれば適宜選択でき、具体
的にはポリエチレン、ポリ塩化ビニル、ポリプロピレ
ン、ポリエステルフイルム、エチレンビニルアルコール
フイルム等がある。
【００１１】該基材にあっては、コロナ処理やプライマ
処理を行うことにより、粘着剤層との密着性を向上させ
て粘着剤の糊残り防止効果を向上させることができる。
【００１２】本発明にかかる電子基盤固定用シートの粘
着剤層には、粘着付与剤を添加することにより、ダイシ
ング時のチップ飛散防止を強化できる。該粘着付与樹脂
の配合量は、あまりに少ないと初期の効果を発揮できず
あまりに多いと該粘着剤層の糊残り（電子基盤側への転
写）が生じてしまうため、該粘着剤のベースポリマ１０
０重量部に対して１〜３０重量部である。
【００１３】また、前記粘着剤層には、前記粘着付与剤
の他に必要に応じて軟化剤、老化防止剤、充填剤、硬化
剤などの添加剤を適宜選択して添加できる。
【００１４】粘着剤層の厚さは１０〜５０μｍが好まし
い。これは、あまりに薄いと粘着力不足となりダイシン
グの際に電子基盤チップが飛散し、あまり厚くても効果
が頭打ちになってしまうためである。
【００１５】該粘着剤層におけるベースポリマは、上記
特開平１０−３３８８５３号公報で開示したもののうち
アクリル系粘着剤であり、紫外線重合性樹脂および紫外
線重合開始剤は、上記特開平１０−３３８８５３号公報
で開示したものを適宜選択して採用すればよい。
【００１６】本発明にかかる電子基盤固定用シートによ
って固定される電子基盤は、従来公知の凹凸のある電子
基盤であり、具体的には、上述のＢＧＡ（ボール・グリ
ッド・アレイ）、ＣＰＳ（チップ・サイズ・パッケー
ジ）、スタック・メモリー・モジュール、システム・オ
ン・モジュールなどである。なお、凹凸の少ない電子基
盤であってもよいのはもちろんのことである。
【００１７】本発明にかかる電子基盤固定用シートは、
例えば、次のような工程によって製造される。基材の一
方の面にコンマロールコーター方式によって粘着剤層を
塗布し、該粘着剤層の表面に剥離紙を積層する。該剥離
紙積層にあっては、剥離紙に粘着剤を塗布し基材を積層
してもよい。
【００１８】本発明にあっては、基材の２５％モジュラ
ス（ＪＩＳ Ｚ ０２３７の６準拠）を０．５〜１．２
ｋｇｆ／２０ｍｍとし、該基材の厚さを７０〜３００μ
ｍとし、該粘着剤層をアクリル系粘着剤とし、その組成
物をベースポリマ１００重量部、紫外線重合性樹脂３〜
１００重量部、紫外線重合開始剤０．１〜５重量部及び
１〜３０重量部の粘着付与樹脂で配合し、該粘着剤層の
厚さを１０〜５０μｍとし、これにより電子基盤に１〜
５ｍｍの凹凸があってもダイシングの際に電子基盤チッ
プを飛散させることなく、さらには確実に電子基盤に密
着して糊残りを生じさせない。
【００１９】
【実施例】本発明の一実施例を比較例と比較しつつ詳細
に説明する。
【００２０】実施例における電子基盤固定用シートは、
シート状で光透過性の基材（厚み１００μｍ）と、該基
材の一方の面に積層された粘着剤層（厚み３０μｍ）を
有するものである。具体的には、基材として２５％モジ
ュラス（ＪＩＳ Ｚ ０２３７の６に準拠）で０．９ｋ
ｇｆ／２０ｍｍのポリエチレン、該粘着剤層としてアク
リルゴム系粘着剤（日本ゼオン製ＡＲ７２ＬＦ）を採用
し、該粘着剤層には紫外線重合性樹脂としてウレタンア
クリレート系オリゴマ（荒川化学工業社製ビームセット
５７５）１００重量部、紫外線重合開始剤としてイルガ
キュア６５１（チバガイギー社製）３重量部、粘着付与
樹脂５重量部が配合されたものである。
【００２１】本実施例にあっては、後で説明する密着性
がよく、糊残りが無く、シート強度も良好であった。ま
た、ダイシング時に電子基盤が何も飛散しなかった。
【００２２】比較例について、表１を参照しつつ説明す
る。表１において、「２５％モジュラス」とはＪＩＳ
Ｚ ０２３７の６に準じて測定したもの（単位；ｋｇｆ
／２０ｍｍ）であり、「密着性」とは電子基盤固定用シ
ートを電子基盤に貼り付けた際に５ｍｍの深さの凹溝底
部にまでシートが貼り付き気泡が混入しなかったものを
○、気泡が混入したものを×とした。「糊残り」とは一
旦電子基盤にシートを貼り付けてから６５℃で７日間保
存した後、該シートを剥離して２００倍の顕微鏡で該電
子基盤の粘着剤貼付面を観察したものであり、粘着剤が
発見されたものを×、発見されなかったものを○とし
た。「シート強度」とはダイシングの際に使用されるダ
イシングブレードによるシートの破損の有無を表したも
のであり、シートが破損しなかったものを○、破損して
しまったものを×とした。また、「接着力」とはＪＩＳ
Ｚ ０２３７に準拠した１８０゜剥離接着力（ｇｆ／
２０ｍｍ）であり、紫外線照射前のサンプルと高圧水銀
灯を使用して照射光量１００ｍＪ／ｃｍ ２ で紫外線照射
した後のサンプルを測定した。
【００２３】
【表１】
【００２４】比較例１が示すように、基材の２５％モジ
ュラスが低かったり厚さが薄いと、シート強度が弱く、
比較例２が示すように、基材の２５％モジュラスが高か
ったり厚さが厚いと、密着性が悪かった。
【００２５】比較例３、４が示すように、粘着剤の紫外
線重合性樹脂又は紫外線重合開始剤の配合比が少ない
と、糊残りが生じた。
【００２６】比較例５が示すように、粘着剤が薄いと密
着性が悪かった。
【００２７】比較例６は、実施例の粘着剤の配合のう
ち、粘着付与樹脂が配合されていないものである。
【００２８】この比較例６にあっては、密着性、糊残
り、シート強度、チップ飛散等において、有る程度、良
好な値を得た。
【００２９】また、表への記載は省略したが、粘着剤の
紫外線重合性樹脂を多く配合しても（６００重量部）、
紫外線重合開始剤多く配合しても（１０重量部）、さら
には、粘着剤の厚みが厚くても（６５μｍ）、実施例の
特性値と大差がなく、効果が頭打ちであることが分かっ
た。なお、このときの他の構成は実施例と同一にしたも
のである。
【００３０】
【発明の効果】本発明にあっては、シート状で光透過性
の基材と、該基材の一方の面に積層された粘着剤層を有
する電子基盤固定用シートにおいて、該基材の２５％モ
ジュラス（ＪＩＳ Ｚ ０２３７の６準拠）が０．５〜
１．２ｋｇｆ／２０ｍｍである一方、該基材の厚さが７
０〜３００μｍであり、該粘着剤層がアクリル系粘着剤
であり、その組成物が、ベースポリマ１００重量部、紫
外線重合性樹脂３〜１００重量部、紫外線重合開始剤
０．１〜５重量部及び１〜３０重量部の粘着付与樹脂で
配合され、該粘着剤層の厚さが１０〜５０μｍであるこ
とを特徴とし、これにより電子基盤に１〜５ｍｍの凹凸
があってもダイシングの際に電子基盤チップを飛散しな
くなり、さらには確実に電子基盤に密着して糊残りが生
じなくなった。
【００３１】Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for dicing (cutting and separating into chips) while fixing an electronic substrate having surface irregularities of 1 to 5 mm. The present invention relates to an electronic substrate fixing sheet to be attached for fixing. [0002] Heretofore, as a sheet for fixing an electronic substrate used in dicing, the present applicant has disclosed a sheet using an ultraviolet-curable pressure-sensitive adhesive (JP-A-10-33).
No. 8853). [0003] Here, such a sheet is very excellent when dicing a semiconductor wafer. At the time of this dicing, if there is a gap without adhering to the electronic substrate to be diced, oxygen in the gap inhibits light curing, and the adhesive force of the adhesive cannot be controlled. In this case, there is a problem that not only the electronic substrate chip is scattered, but also the adhesive is left on the adhesive (the adhesive is transferred to the non-adhered electronic substrate). [0005] In order to solve this problem, it has been required to carefully laminate and adhere the sheets when laminating the sheets. However, in recent electronic substrates, metal ball-shaped terminals are formed or the substrate itself becomes large, so that the unevenness is increased to 1 to 5 mm, so that an environment in which a gap is apt to be generated. Examples of the uneven electronic substrate include those used as semiconductor device components, which are mainly sealed with epoxy resin.
Specifically, BGA (ball grid array), CP
S (chip size package), stack memory module, system on module, etc. Therefore, an object of the present invention is to prevent the chip of the electronic substrate from being scattered during dicing even if the electronic substrate has irregularities of 1 to 5 mm, and furthermore to surely adhere to the electronic substrate to form glue residue. An object of the present invention is to provide a sheet for fixing an electronic board, which is not restricted. Means for Solving the Problems The inventors of the present invention have made intensive studies in view of the above, and as a result, have found that a sheet-shaped light-transmitting base material and a light-transmitting base material are laminated on one surface of the base material. In the electronic substrate fixing sheet having an adhesive layer, the base material has a 25% modulus (according to JIS Z 0237-6) of 0.5 to 1.2.
kgf / 20 mm, while the thickness of the substrate is 70-3
00 μm, and the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive.
And the composition comprises 100 parts by weight of a base polymer,
Polymerizable resin 3 to 100 parts by weight, ultraviolet polymerization initiator 0.1
Compounded with ~ 5 parts by weight and 1-30 parts by weight of tackifying resin
Is, by a 10~50μm of thickness of the adhesive layer, and completed the onsets present invention viewed the above problems can be solved. In the sheet for fixing an electronic substrate according to the present invention, the 25% modulus and the thickness of the base material are limited because if the thickness is too high (thickness), the ability to follow irregularities is reduced, and This is because a gap is formed between the base and the base, and if it is too small (thin), the strength of the sheet is insufficient, and the sheet is damaged during dicing. The base polymer used as the base material can be appropriately selected as long as it satisfies the above conditions, and specifically includes polyethylene, polyvinyl chloride, polypropylene, polyester film, ethylene vinyl alcohol film and the like. By subjecting the substrate to a corona treatment or a primer treatment, the adhesiveness with the pressure-sensitive adhesive layer can be improved, and the effect of preventing the adhesive from leaving adhesive can be improved. By adding a tackifier to the pressure-sensitive adhesive layer of the electronic substrate fixing sheet according to the present invention, it is possible to enhance the prevention of chip scattering during dicing. If the compounding amount of the tackifier resin is too small, the initial effect cannot be exerted, and if it is too large, adhesive residue (transfer to the electronic substrate side) of the pressure-sensitive adhesive layer will occur.
It is 1 to 30 parts by weight with respect to 0 parts by weight . Further, in addition to the tackifier, if necessary, additives such as a softener, an antioxidant, a filler and a curing agent can be appropriately selected and added to the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer is preferably from 10 to 50 μm. This is because if the thickness is too small, the adhesive strength becomes insufficient, and the electronic substrate chip is scattered at the time of dicing, and the effect becomes flat even if the thickness is too large. The base polymer in the pressure-sensitive adhesive layer is as described above.
Of those disclosed in Japanese Patent Application Laid-Open No. 10-338853.
The acrylic pressure-sensitive adhesive, and the ultraviolet-polymerizable resin and the ultraviolet-polymerization initiator may be appropriately selected from those disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 10-338853. The electronic substrate fixed by the electronic substrate fixing sheet according to the present invention is a conventionally known electronic substrate having unevenness, and specifically, the above-mentioned BGA (ball grid array), CPS (chip) Size package), stack memory module, system on module, etc. It is needless to say that an electronic substrate having less unevenness may be used. [0017] The electronic substrate fixing sheet according to the present invention comprises:
For example, it is manufactured by the following steps. An adhesive layer is applied to one surface of the substrate by a comma roll coater method, and a release paper is laminated on the surface of the adhesive layer. In the release paper lamination, an adhesive may be applied to the release paper to laminate the base material. In the present invention, the 25% modulus (based on JIS Z 0237-6) of the substrate is 0.5 to 1.2.
kgf / 20 mm, and the thickness of the substrate is 70 to 300 μm.
m, the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive, and its composition
100 parts by weight of base polymer, UV-polymerizable resin 3 ~
100 parts by weight, 0.1 to 5 parts by weight of an ultraviolet polymerization initiator and
1 to 30 parts by weight of a tackifying resin is blended, and the thickness of the pressure-sensitive adhesive layer is set to 10 to 50 μm.
Even if there is unevenness of 5 mm, the electronic substrate chip is not scattered at the time of dicing, and furthermore, it is surely adhered to the electronic substrate and no adhesive residue is generated. EXAMPLE An example of the present invention will be described in detail while comparing it with a comparative example.
Will be described. The electronic board fixing sheet in the embodiment is as follows.
A sheet-shaped light-transmitting substrate (thickness: 100 μm);
Adhesive layer (thickness 30μm) laminated on one side of the material
Have Specifically, 25%
0.9k with a hard disk (based on JIS Z 0237-6)
gf / 20 mm polyethylene,
Ril rubber adhesive (Zeon AR72LF)
The pressure-sensitive adhesive layer contains urethane as an ultraviolet polymerizable resin.
Acrylate oligomer (Arakawa Chemical Industries beam set)
575) 100 parts by weight, Iruga as an ultraviolet polymerization initiator
Cure 651 (Ciba-Geigy) 3 parts by weight, tackification
5 parts by weight of a resin is blended. In this embodiment, the adhesion will be described later.
And no adhesive residue, and the sheet strength was good. Ma
Also, the electronic board did not scatter anything during dicing. A comparative example will be described with reference to Table 1.
You. In Table 1, "25% modulus" is defined by JIS.
Measured according to Z 0237-6 (unit: kgf
/ 20mm), and “adhesion” means the electronic board fixing sheet.
5mm deep groove bottom when the board is attached to the electronic board
The sheet was stuck to the part and air bubbles did not mix.
、, x was mixed with air bubbles. What is "glue residue"?
After attaching the sheet to the electronic board, keep it at 65 ° C for 7 days.
After the sheet is removed, the sheet is peeled off, and the
Observation of the adhesive-applied surface of the child substrate
X is for those found, and ○ is for those not found
Was. "Sheet strength" refers to the
It also indicates whether the sheet has been damaged by the ising blade.
If the sheet was not damaged,
Those that had been lost were marked as x. "Adhesive strength" is defined in JIS
180 ° peel adhesion (gf /
20mm), the sample before UV irradiation and high pressure mercury
UV irradiation with a light intensity of 100 mJ / cm 2 using a lamp
The sample after the measurement was measured. [Table 1] As shown in Comparative Example 1, the 25%
If the thickness is low or the thickness is thin, the sheet strength is weak,
As shown in Comparative Example 2, whether the 25% modulus of the substrate is high
If the thickness was too thick, the adhesion was poor. As shown in Comparative Examples 3 and 4, the ultraviolet ray of the pressure-sensitive adhesive was
Low compounding ratio of linear polymerizable resin or UV polymerization initiator
And glue residue occurred. As shown in Comparative Example 5, when the pressure-sensitive adhesive is thin, the
Wearability was poor. Comparative Example 6 shows the composition of the pressure-sensitive adhesive of Example.
That is, no tackifier resin is blended. In Comparative Example 6, adhesion, adhesive residue
To a certain degree in sheet strength, chip scattering, etc.
Good value was obtained. Although not shown in the table, even if a large amount of an ultraviolet-polymerizable resin as an adhesive is mixed (600 parts by weight),
Even when a large amount of the ultraviolet polymerization initiator was added (10 parts by weight), and even when the thickness of the pressure-sensitive adhesive was large (65 μm), there was no significant difference from the characteristic values of the examples, and it was found that the effect leveled off. The other configuration at this time is the same as that of the embodiment. According to the present invention, there is provided an electronic substrate fixing sheet having a sheet-shaped light-transmitting substrate and an adhesive layer laminated on one surface of the substrate. 25% modulus (based on JIS Z 0237-6) of the substrate is 0.5 to
1.2 kgf / 20 mm, while the thickness of the substrate is 7
0 to 300 μm, and the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive
Is 100 parts by weight of the base polymer, purple
3 to 100 parts by weight of outside-line polymerizable resin, ultraviolet polymerization initiator
0.1 to 5 parts by weight and 1 to 30 parts by weight of tackifying resin
Formulated, and wherein the thickness of the adhesive layer is 10 to 50 [mu] m, thereby even if unevenness of 1~5mm on electronic circuit boards no longer scattered electrons base chip when dicing, more reliably The adhesive adhered to the electronic substrate and no adhesive residue was left. [0031]
───────────────────────────────────────────────────── フロントページの続き (72)発明者 久米 雅士 神奈川県鎌倉市台２丁目13番１号 東洋 化学株式会社内 (56)参考文献 特開 平３−66772（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C09J 7/02 B23Q 3/08 C09J 201/00 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Masashi Kume 2-3-1-1, Dai, Kamakura-shi, Kanagawa Toyo Chemical Co., Ltd. (56) References JP-A-3-66772 (JP, A) (58) Survey Field (Int.Cl. 7 , DB name) C09J 7/02 B23Q 3/08 C09J 201/00
Claims (1)
一方の面に積層された粘着剤層を有する電子基盤固定用
シートにおいて、該基材の２５％モジュラス（ＪＩＳ
Ｚ ０２３７の６準拠）が０．５〜１．２ｋｇｆ／２０
ｍｍである一方、該基材の厚さが７０〜３００μｍであ
り、該粘着剤層がアクリル系粘着剤で形成され、その組
成物が、ベースポリマ１００重量部、紫外線重合性樹脂
３〜１００重量部、紫外線重合開始剤０．１〜５重量部
及び１〜３０重量部の粘着付与樹脂で配合され、該粘着
剤層の厚さが１０〜５０μｍであることを特徴とする電
子基盤固定用シート。(57) Claims 1. An electronic substrate fixing sheet having a sheet-like light-transmitting base material and an adhesive layer laminated on one surface of the base material, 25% modulus of wood (JIS
0.5-1.2 kgf / 20 )
mm, the thickness of the substrate is 70 to 300 μm, and the pressure-sensitive adhesive layer is formed of an acrylic pressure-sensitive adhesive.
The product is 100 parts by weight of a base polymer and an ultraviolet-polymerizable resin.
3 to 100 parts by weight, UV polymerization initiator 0.1 to 5 parts by weight
A sheet for fixing an electronic substrate, wherein the sheet is mixed with 1 to 30 parts by weight of a tackifier resin, and the thickness of the pressure-sensitive adhesive layer is 10 to 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08851099A JP3511368B2 (en) | 1999-03-30 | 1999-03-30 | Electronic board fixing sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08851099A JP3511368B2 (en) | 1999-03-30 | 1999-03-30 | Electronic board fixing sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000281990A JP2000281990A (en) | 2000-10-10 |
| JP3511368B2 true JP3511368B2 (en) | 2004-03-29 |
Family
ID=13944831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08851099A Expired - Fee Related JP3511368B2 (en) | 1999-03-30 | 1999-03-30 | Electronic board fixing sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3511368B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4674836B2 (en) * | 2001-02-13 | 2011-04-20 | 日東電工株式会社 | Dicing adhesive sheet |
| JP3838637B2 (en) * | 2002-06-10 | 2006-10-25 | 日東電工株式会社 | Glass substrate dicing adhesive sheet and glass substrate dicing method |
| JP2008066688A (en) * | 2006-08-11 | 2008-03-21 | Furukawa Electric Co Ltd:The | Wafer processing tape |
| JP2009065186A (en) * | 2008-10-20 | 2009-03-26 | Furukawa Electric Co Ltd:The | Method for controlling adhesive force of base film of adhesive tape and base film for adhesive tape |
-
1999
- 1999-03-30 JP JP08851099A patent/JP3511368B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000281990A (en) | 2000-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6467551B1 (en) | Reinforcement film | |
| JP5178732B2 (en) | Pressure-sensitive adhesive, pressure-sensitive adhesive sheet, multilayer pressure-sensitive adhesive sheet, and electronic component manufacturing method | |
| CN102421865B (en) | Adhesive agent, adhesive sheet, and process for production of electronic component | |
| JP6000595B2 (en) | Heat-peelable pressure-sensitive adhesive sheet for electronic component cutting and electronic component processing method | |
| JP4874011B2 (en) | A pressure-sensitive adhesive, a pressure-sensitive adhesive sheet using a pressure-sensitive adhesive, a multilayer pressure-sensitive adhesive sheet using a pressure-sensitive adhesive sheet, and an electronic component manufacturing method using the multilayer pressure-sensitive adhesive sheet. | |
| EP0194706A1 (en) | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same | |
| JP4030630B2 (en) | Adhesive sheet and adhesive sheet bonding method | |
| EP2096153A2 (en) | Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same | |
| KR101766399B1 (en) | Dicing sheet | |
| WO2020100491A1 (en) | Workpiece processing sheet | |
| KR102478993B1 (en) | Method for manufacturing adhesive sheet for stealth dicing and semiconductor device | |
| JP4531911B2 (en) | Release sheet and adhesive | |
| JP5235271B2 (en) | Water-dispersible acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet | |
| KR20170141651A (en) | Carrier film for transparent electroconductive film, and laminate | |
| JP3511368B2 (en) | Electronic board fixing sheet | |
| JP2004075940A (en) | Adhesive tape for electronic components | |
| KR102560374B1 (en) | Method for manufacturing adhesive sheet for stealth dicing and semiconductor device | |
| JP4107729B2 (en) | Thermal foaming adhesive and adhesive member | |
| JPH1025456A (en) | Semiconductor wafer fixing sheet | |
| JP5250202B2 (en) | A multilayer adhesive sheet and a method for producing an electronic component. | |
| JP2024097803A (en) | Kit and method for producing third laminate using said kit | |
| KR20180048658A (en) | Adhesive sheet | |
| JPWO2003022572A1 (en) | Release sheet and adhesive | |
| JP4410366B2 (en) | Cover tape | |
| JP6673677B2 (en) | Double-sided adhesive tape for semiconductor processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20031224 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20031224 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080116 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090116 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100116 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100116 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110116 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110116 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120116 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120116 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130116 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130116 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140116 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |