JP3504828B2 - Mold for warm powder molding - Google Patents

Mold for warm powder molding

Info

Publication number
JP3504828B2
JP3504828B2 JP19788297A JP19788297A JP3504828B2 JP 3504828 B2 JP3504828 B2 JP 3504828B2 JP 19788297 A JP19788297 A JP 19788297A JP 19788297 A JP19788297 A JP 19788297A JP 3504828 B2 JP3504828 B2 JP 3504828B2
Authority
JP
Japan
Prior art keywords
die
temperature
mold
cooling pipe
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19788297A
Other languages
Japanese (ja)
Other versions
JPH1128596A (en
Inventor
輝彦 鹿島
勝彦 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Powdered Metals Co Ltd
Original Assignee
Hitachi Powdered Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Powdered Metals Co Ltd filed Critical Hitachi Powdered Metals Co Ltd
Priority to JP19788297A priority Critical patent/JP3504828B2/en
Publication of JPH1128596A publication Critical patent/JPH1128596A/en
Application granted granted Critical
Publication of JP3504828B2 publication Critical patent/JP3504828B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Powder Metallurgy (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、温間粉末成形用
の金型装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device for warm powder molding.

【0002】[0002]

【従来の技術】特殊な潤滑剤を含む鉄系金属粉末を15
0℃程度の温度に加熱して圧縮すると、通常の方法で圧
粉した場合よりも、密度の高い成形体が得られることが
知られており、焼結機械部品の製造に利用されている。
この粉末成形に使用する装置の一つとしてウィズドロア
ル方式のものがある。図3はその基本構造を示す縦断面
図である。
2. Description of the Related Art Iron-based metal powder containing a special lubricant is used
It is known that when heated to a temperature of about 0 ° C. and compressed, a compact having a higher density than that obtained by compacting by a normal method can be obtained, and it is used for manufacturing a sintered machine part.
As one of the devices used for this powder molding, there is a withdrawal system. FIG. 3 is a vertical sectional view showing the basic structure.

【0003】同図において、上パンチ13とダイ21に
棒状のヒータ16および25をそれぞれ付設し、温度計
(図示せず)によって温度を計測しつつ、ヒータ16お
よび25への電流を調整し、成形キャビティの周囲が適
温になるように調節する。また、加熱手段を備えたシャ
トルフィーダを用いて、通常の方法により金属粉末の充
填を行い、上下のパンチで圧縮した後、ダイ21から抜
き出す。
In the figure, rod-shaped heaters 16 and 25 are attached to the upper punch 13 and the die 21, respectively, and the current to the heaters 16 and 25 is adjusted while measuring the temperature with a thermometer (not shown). Adjust the temperature around the molding cavity to a suitable temperature. Further, using a shuttle feeder equipped with a heating means, metal powder is filled by a usual method, compressed by upper and lower punches, and then extracted from the die 21.

【0004】図3に示す従来の成形装置では、上パンチ
プレート10、ダイプレート23、ベースプレート40
の温度が異なるため、ガイドポスト14と軸受24との
間、およびガイドロッド60とベースプレート40の軸
受41との間で、きしみ、かじり、あるいは異常摩耗を
生じ、成形装置の精度低下を招き、かつ寿命が短くなる
という問題点があり、それらの解決が望まれていた。
In the conventional molding apparatus shown in FIG. 3, the upper punch plate 10, the die plate 23, and the base plate 40 are used.
Because of different temperatures, squeaking, galling, or abnormal wear occur between the guide post 14 and the bearing 24 and between the guide rod 60 and the bearing 41 of the base plate 40, leading to a decrease in precision of the molding apparatus, and There is a problem that the life is shortened, and it has been desired to solve them.

【0005】この問題点を解決するために、本出願人は
特願平8−93507号において、図4および図5に示
すような構造の成形装置を提案した。図4に示すもの
は、ダイ21とダイプレート23の間に冷却管29を設
けてあり、ダイプレート23の下面に隙間Aおよび断熱
材27による断熱手段を介してダイプレート受け板26
を備え、そのダイプレート受け板26に前記ガイドロッ
ド60を固定し、かつ、ガイドポスト14を前記ダイプ
レート23と無縁の状態でダイプレート受け板26に固
定する構造とした。図5に示すものは、前記冷却管29
の代わりに、ダイ21の外周および上端面にフッ素樹脂
やジルコニア等の断熱材20を被覆した点が異なる。
In order to solve this problem, the applicant of the present invention has proposed, in Japanese Patent Application No. 8-93507, a molding apparatus having a structure as shown in FIGS. In the structure shown in FIG. 4, a cooling pipe 29 is provided between the die 21 and the die plate 23, and the die plate receiving plate 26 is provided on the lower surface of the die plate 23 via a gap A and heat insulating means by a heat insulating material 27.
The guide rod 60 is fixed to the die plate receiving plate 26, and the guide post 14 is fixed to the die plate receiving plate 26 without being connected to the die plate 23. What is shown in FIG. 5 is the cooling pipe 29.
Instead of the above, the outer periphery and the upper end surface of the die 21 are coated with a heat insulating material 20 such as fluororesin or zirconia.

【0006】このように構成した成形装置では、ダイプ
レート23とガイドポスト14とは無縁であり、ガイド
ポスト14およびガイドロッド60が固定または嵌合し
ているダイプレート受け板26の温度上昇が制御されて
熱膨張が少なくなるので、上パンチプレート10、ダイ
プレート受け板26、ベースプレート40のガイドポス
ト14またはガイドロッド60の軸間寸法の熱膨張変化
量がほぼ同様になる結果、軸受24および41に対する
偏荷重やラジアル荷重の増加がなく、摩耗を減少するこ
とができる。
In the molding apparatus thus constructed, the die plate 23 and the guide post 14 are free from each other, and the temperature rise of the die plate receiving plate 26 to which the guide post 14 and the guide rod 60 are fixed or fitted is controlled. As a result, the thermal expansion of the bearings 24 and 41 is reduced because the thermal expansion of the bearings 24 and 41 becomes substantially the same as the axial expansion of the upper punch plate 10, the die plate receiving plate 26, the guide post 14 of the base plate 40 or the guide rod 60. It is possible to reduce wear without increasing an unbalanced load or a radial load with respect to.

【0007】[0007]

【発明が解決しようとする課題】しかし、図4に示す構
造のものでは、ダイプレート23の温度を低くするため
に冷却管29に冷却水を大量に流すと、ダイ21の温度
も下げることになり、ヒータ25に与える電力量が増加
する。一方、図5に示す構造のものでは、熱伝導の抑制
手段が断熱材のみであるから、ダイプレート受け板26
の温度はあまり低下しないため、前記軸受部にきしみを
生じ、成形速度の向上を阻害することは避け得ない。
However, in the structure shown in FIG. 4, if a large amount of cooling water is flown through the cooling pipe 29 in order to lower the temperature of the die plate 23, the temperature of the die 21 is also lowered. Therefore, the amount of electric power supplied to the heater 25 increases. On the other hand, in the structure shown in FIG. 5, since the heat conduction suppressing means is only the heat insulating material, the die plate receiving plate 26
Since the temperature does not decrease so much, it is unavoidable that the bearing part is squeaked and the improvement of the molding speed is hindered.

【0008】[0008]

【課題を解決するための手段】これらの問題を解決する
ため、本発明の金型のダイを加熱するヒータを備えたウ
イズドロアル方式の温間粉末成形用金型においては、ダ
イプレート23に嵌合したダイケース28の内孔に断熱
材20を介してダイ21を固定すると共に、ダイケース
28と断熱材20の間に冷却管29a、およびダイプレ
ート23とダイケース28の間に冷却管29bを設け
る。また、この粉末成形金型において、外側の冷却管2
9bに供給する冷却媒体の温度を常温とし、内側の冷却
管29aに供給する冷却媒体の温度を外側の冷却管29
bの冷却媒体の温度より高く、かつダイの温度より低く
することを特徴としている。
In order to solve these problems, in the mold for warm powder molding of the withdrawal type having a heater for heating the die of the present invention, the die plate 23 is fitted. The die 21 is fixed to the inner hole of the die case 28 via the heat insulating material 20, and the cooling pipe 29a is provided between the die case 28 and the heat insulating material 20, and the cooling pipe 29b is provided between the die plate 23 and the die case 28. Set up. Further, in this powder molding die, the outer cooling pipe 2
The temperature of the cooling medium supplied to 9b is normal temperature, and the temperature of the cooling medium supplied to the inner cooling pipe 29a is the outer cooling pipe 29a.
The temperature is higher than the temperature of the cooling medium of b and lower than the temperature of the die.

【0009】[0009]

【発明の実施の形態】図1は、ダイ周辺の断面構造を示
す。ダイプレート23は、ガイドロッド60によって支
持し、軸受24でガイドポスト14を軸支している点は
従来の金型の構造と同様である。ダイ21の下端部に
は、リング状の電気ヒータ25を設けてある。ダイ21
を超硬合金製にすると、熱伝導性が比較的良好であるた
め、ダイケース28全体の温度差を少なくすることがで
きる。また、温度計(図示せず)によりヒータ電流を制
御することは従来と同様である。
DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows a cross-sectional structure around a die. The die plate 23 is supported by the guide rod 60, and the bearing 24 axially supports the guide post 14, which is similar to the structure of the conventional mold. A ring-shaped electric heater 25 is provided at the lower end of the die 21. Die 21
If it is made of cemented carbide, the thermal conductivity is relatively good, so the temperature difference in the entire die case 28 can be reduced. Further, controlling the heater current with a thermometer (not shown) is the same as in the conventional case.

【0010】ダイ21の外周は断熱材20のリングで覆
われている。断熱材20は熱伝導率が低く、ある程度の
機械強度と耐熱性があるものであればよいが、ジルコニ
ア製が最適である。ダイ21と断熱材20は互いに接合
し、ダイケース28の内孔に固定して、ユニットを形成
する。ダイケース28の内孔面には、冷却管29aと連
通した螺旋状の溝が形成されており、断熱材20を圧入
または嵌合することによって、水などの冷媒の流路を形
成し、図中の矢印方向に冷媒を流す。冷媒は水あるいは
油などである。冷媒の温度は、金型装置の大きさによっ
て異なるが、ダイ21の温度より低く常温より高いもの
とし、50〜90℃程度である。この冷媒は、リザーブ
タンク(図示せず)で予熱し、ポンプで圧送する。同図
では、ダイ21と断熱材20を圧入した例を示すが、嵌
合して冷媒漏れ止めシールを用いる方が組立が容易であ
る。
The outer periphery of the die 21 is covered with a ring of heat insulating material 20. The heat insulating material 20 may have a low thermal conductivity and a certain degree of mechanical strength and heat resistance, but zirconia is most suitable. The die 21 and the heat insulating material 20 are joined to each other and fixed in the inner hole of the die case 28 to form a unit. A spiral groove communicating with the cooling pipe 29a is formed on the inner hole surface of the die case 28, and the heat insulating material 20 is press-fitted or fitted to form a flow path for a coolant such as water. Refrigerant flows in the direction of the arrow inside. The refrigerant is water or oil. The temperature of the coolant is lower than the temperature of the die 21 and higher than normal temperature, and is about 50 to 90 ° C., although it depends on the size of the mold device. This refrigerant is preheated in a reserve tank (not shown) and pumped by a pump. In the figure, an example in which the die 21 and the heat insulating material 20 are press-fitted is shown, but it is easier to assemble by fitting and using a refrigerant leakage prevention seal.

【0011】ダイプレート23の内孔面にも冷却管29
bと連通した螺旋状の溝を形成し、ダイ21と断熱材2
0およびダイケース28のユニットを装着したときに、
冷媒の流路を形成し、図中の矢印方向に冷媒を供給す
る。冷媒の温度および流量は、金型装置の大きさによっ
ても異なるが、ダイプレート23の温度がベースプレー
ト40や上パンチプレート10の温度とほぼ同じになる
ように、10〜25℃程度の常温に近い比較的低い温度
とし、状況に応じて流量を変更する。
A cooling pipe 29 is also provided on the inner surface of the die plate 23.
b to form a spiral groove communicating with the die 21 and the heat insulating material 2
When the unit of 0 and die case 28 is attached,
A coolant passage is formed and the coolant is supplied in the direction of the arrow in the figure. Although the temperature and flow rate of the coolant vary depending on the size of the mold device, the temperature of the die plate 23 is close to room temperature of about 10 to 25 ° C. so that the temperature of the die plate 23 is almost the same as the temperatures of the base plate 40 and the upper punch plate 10. Use a relatively low temperature and change the flow rate according to the situation.

【0012】このような構造の金型装置のダイ21は、
下方に設けたヒータ25により均一に加熱される。ダイ
21の外側には断熱材20があるため、横方向への熱伝
導は抑制される。断熱材20の外側は、ダイ21の温度
よりも低いが比較的高い温度の冷媒で冷却されており、
断熱材20を比較的強く冷却するが、ダイ21の温度を
奪いヒータ25の消費電力を増加させることはない。ま
た、その周囲のダイケース28の温度もある程度低下さ
せる。ダイケース28の温度はダイ21の温度と常温の
中間にあり、ダイケース28の外側の冷却手段(冷却管
29b)によりダイケース28から伝導される温度を系
外に排出することができ、これによりその外側のダイプ
レート23の昇温を防いでいる。
The die 21 of the mold apparatus having the above structure is
It is uniformly heated by the heater 25 provided below. Since the heat insulating material 20 is provided outside the die 21, heat conduction in the lateral direction is suppressed. The outside of the heat insulating material 20 is cooled with a refrigerant having a temperature lower than the temperature of the die 21 but relatively high,
Although the heat insulating material 20 is cooled relatively strongly, it does not deprive the temperature of the die 21 and increase the power consumption of the heater 25. Further, the temperature of the die case 28 around it is also lowered to some extent. The temperature of the die case 28 is between the temperature of the die 21 and room temperature, and the temperature conducted from the die case 28 can be discharged to the outside of the system by the cooling means (cooling pipe 29b) outside the die case 28. This prevents the temperature of the die plate 23 on the outside thereof from rising.

【0013】図2は、ダイセットの横方向の温度分布を
示すグラフである。実線Aは図1に示す本発明の金型装
置の場合を示し、鎖線Bは図4に示す従来の装置の場合
および破線Cは図3に示す従来の装置の場合を示す。い
ずれもダイ21を150℃に加熱した試験例である。ま
た、鎖線Bの装置の冷却管29および実線Aの装置の外
側の冷却管には温度25℃の水を流し、実線Aの装置の
内側の冷却管には温度90℃の温水を流した。破線Cの
装置ではガイドポスト14の近傍の温度が90℃であ
る。鎖線Bの装置では冷却管29によってその周囲温度
が約90℃であり、ガイドポスト14付近の温度は約7
0℃である。温度をさらに低下させるためには、冷却媒
体の温度を低くして、流量を増やせばよいが、ヒータ2
5の所要電力量が増加することになる。実線Aの装置に
おいては、断熱材20で熱伝導が抑制され、内側の温水
冷却でダイケース28の平均温度が約100℃程度とな
っており、約100℃程度のダイケース28を外側の冷
却管により水冷し、ダイプレート全体が約30℃になっ
た。このことから、横方向の部材の熱膨張が抑制される
ことが分かる。
FIG. 2 is a graph showing the temperature distribution in the lateral direction of the die set. A solid line A shows the case of the mold apparatus of the present invention shown in FIG. 1, a chain line B shows the case of the conventional apparatus shown in FIG. 4, and a broken line C shows the case of the conventional apparatus shown in FIG. Both are test examples in which the die 21 is heated to 150 ° C. Further, water having a temperature of 25 ° C. was passed through the cooling pipe 29 of the device indicated by the chain line B and cooling pipe outside the device indicated by the solid line A, and hot water having a temperature of 90 ° C. was caused to flow through the cooling pipe inside the device indicated by the solid line A. In the device indicated by the broken line C, the temperature in the vicinity of the guide post 14 is 90 ° C. In the device of the chain line B, the ambient temperature is about 90 ° C. due to the cooling pipe 29, and the temperature in the vicinity of the guide post 14 is about 7 ° C.
It is 0 ° C. In order to further reduce the temperature, the temperature of the cooling medium may be lowered and the flow rate may be increased.
The required power amount of 5 will be increased. In the apparatus indicated by the solid line A, heat conduction is suppressed by the heat insulating material 20, and the average temperature of the die case 28 is about 100 ° C. by cooling with hot water inside, and the die case 28 of about 100 ° C. is cooled outside. After water cooling with a tube, the entire die plate reached about 30 ° C. From this, it can be seen that the thermal expansion of the lateral member is suppressed.

【0014】[0014]

【発明の効果】以上説明したように、この発明の温間成
形用金型は、ダイの周囲の断熱材による熱伝導抑制と、
温度の高い側から2段階に順次温度を低下させる冷却構
造とすることにより、ダイの加熱ヒータに要する消費電
力の増加を少なくし、かつ、ダイプレートの温度が上昇
して熱膨張するという問題点を解決したものであり、こ
の金型によれば、きしみや金型損傷がなく、従って粉末
成形の能率を高めることができる。
As described above, the mold for warm forming of the present invention suppresses heat conduction by the heat insulating material around the die,
By adopting a cooling structure in which the temperature is gradually decreased in two steps from the higher temperature side, the increase in power consumption required for the heater for the die is reduced, and the temperature of the die plate rises to cause thermal expansion. According to this mold, there is no squeak or damage to the mold, and therefore the efficiency of powder molding can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の温間粉末成形用金型の部分縦断面図で
ある。
FIG. 1 is a partial vertical cross-sectional view of a warm powder molding die of the present invention.

【図2】本発明の金型と従来の金型の温度分布を示すグ
ラフである。
FIG. 2 is a graph showing temperature distributions of a mold of the present invention and a conventional mold.

【図3】従来の金型の縦断面図である。FIG. 3 is a vertical sectional view of a conventional mold.

【図4】改良された従来の金型の部分縦断面図である。FIG. 4 is a partial vertical sectional view of an improved conventional die.

【図5】改良された別の従来の金型の部分縦断面図であ
る。
FIG. 5 is a partial vertical cross-sectional view of another improved conventional mold.

【符号の説明】[Explanation of symbols]

14 ガイドポスト 20 断熱材 21 ダイ 23 ダイプレート 24 軸受 25 ヒータ 28 ダイケース 29a、29b 冷却管 60 ガイドロッド 14 Guide post 20 insulation 21 die 23 die plate 24 bearing 25 heater 28 die case 29a, 29b Cooling pipe 60 Guide rod

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B30B 11/02 B22F 3/035 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) B30B 11/02 B22F 3/035

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 金型のダイを加熱するヒータを備えたウ
ィズドロアル方式の金型装置において、ダイプレート2
3に嵌合したダイケース28の内孔に、断熱材20を介
してダイ21を固定すると共に、前記ダイケース28と
断熱材20の間に冷却管29a、および前記ダイプレー
ト23とダイケース28の間に冷却管29bを設けたこ
とを特徴とする温間粉末成形用金型。
1. A die plate 2 in a withdrawal type die apparatus having a heater for heating a die of a die.
3, the die 21 is fixed to the inner hole of the die case 28 fitted with the heat insulating material 20, and the cooling pipe 29a is provided between the die case 28 and the heat insulating material 20, and the die plate 23 and the die case 28. A mold for warm powder molding, characterized in that a cooling pipe 29b is provided between the molds.
【請求項2】 外側の冷却管29bに供給する冷却媒体
の温度が常温であり、内側の冷却管29aに供給する冷
却媒体の温度が前記冷却管29bの冷却媒体の温度より
も高く、かつダイ21の温度より低くしてなる請求項1
に記載の温間粉末成形用金型。
2. The temperature of the cooling medium supplied to the outer cooling pipe 29b is room temperature, the temperature of the cooling medium supplied to the inner cooling pipe 29a is higher than the temperature of the cooling medium of the cooling pipe 29b, and the die 21. The temperature is lower than the temperature of 21.
The mold for warm powder molding according to 1.
JP19788297A 1997-07-08 1997-07-08 Mold for warm powder molding Expired - Lifetime JP3504828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19788297A JP3504828B2 (en) 1997-07-08 1997-07-08 Mold for warm powder molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19788297A JP3504828B2 (en) 1997-07-08 1997-07-08 Mold for warm powder molding

Publications (2)

Publication Number Publication Date
JPH1128596A JPH1128596A (en) 1999-02-02
JP3504828B2 true JP3504828B2 (en) 2004-03-08

Family

ID=16381880

Family Applications (1)

Application Number Title Priority Date Filing Date
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Publication number Priority date Publication date Assignee Title
EP2123377A1 (en) * 2008-05-23 2009-11-25 Rovalma, S.A. Method for manufacturing a workpiece, in particular a forming tool or a forming tool component
US10406598B2 (en) * 2014-12-02 2019-09-10 Halliburton Energy Services, Inc. Mold assemblies with integrated thermal mass for fabricating infiltrated downhole tools
US10118220B2 (en) 2014-12-02 2018-11-06 Halliburton Energy Services, Inc. Mold assemblies used for fabricating downhole tools
US9718126B2 (en) 2014-12-02 2017-08-01 Halliburton Energy Services, Inc. Mold assembly caps used in fabricating infiltrated downhole tools
WO2016089376A1 (en) 2014-12-02 2016-06-09 Halliburton Energy Services, Inc. Mold assemblies that actively heat infiltrated downhole tools

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