JP3473532B2 - Substrate dividing device - Google Patents
Substrate dividing deviceInfo
- Publication number
- JP3473532B2 JP3473532B2 JP2000002378A JP2000002378A JP3473532B2 JP 3473532 B2 JP3473532 B2 JP 3473532B2 JP 2000002378 A JP2000002378 A JP 2000002378A JP 2000002378 A JP2000002378 A JP 2000002378A JP 3473532 B2 JP3473532 B2 JP 3473532B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate holding
- claw
- dividing
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】この発明は、適当な大きさの
基板を所定サイズに分割する基板分割装置に関する。
【０００２】
【従来の技術】従来、適当な大きさの基板（例えば、ア
ルミナ基板やセラミック基板）をチップ抵抗、発振子等
の電子部品用のサイズに分割する基板分割装置があっ
た。図４に、従来の基板分割装置の概略図を示す。従来
の基板分割装置は、分割するプリント基板２０（以下、
単に基板２０と言う。）の一方の端部を保持する基板保
持部２１と、上記基板２０の他方の端部を掴む分割爪２
２とを備えていた。基板保持部２１は保持している基板
２０を分割爪２２側に搬送する一軸テーブル（不図示）
に取り付けられた本体２３に固定されている。分割爪２
２は、図４に示す状態から図に矢印で示す反時計方向に
動作するものであり、基板２０の底面よりも下側に回転
中心になる支点Ａが設けられている。なお、図に示す２
４は、基板保持部２１が保持している基板２０を分割爪
２２側に搬送するためのレールである。
【０００３】上記従来の基板分割装置は、図４に示す状
態から分割爪２２を反時計方向（図５に示す状態）に動
作させて基板２０を分割するものであり、基板２０の分
割後に図４に示す状態に戻る。なお、分割爪２２が掴ん
でいる分割された基板２０は、図示していない基板取出
部によって本体外部に取り出される。その後、基板２０
を保持した状態の基板保持部２１（本体２３）を分割爪
２２側に移動させ、再度分割爪２２に基板２０の他方の
端部を掴ませて、上記動作を繰り返す。
【０００４】
【発明が解決しようとする課題】しかしながら、分割爪
２２を反時計方向に動作させたときに、分割爪２２と基
板２０との間ですべりが発生する等して基板２０の下面
に形成されている電極等が切れず、基板２０が分割でき
ないことがあった。また、この状態で分割爪２２が掴ん
でいる分割されていない基板２０を、図示していない上
記基板取出部が本体外部に取り出そうとして該基板２０
を破損させるという問題もあった。
【０００５】なお、基板２０の下面に形成されている電
極等が切れずに基板２０が分割できなかった場合、分割
爪２２を図６に示すように時計方向に動作させれば基板
２０を分割できるのであるが、分割爪２２の支点Ａを基
板２０の底面よりも下側に設けているため、分割爪２２
を時計方向に動作させると、上記基板２０を上記基板保
持部２１側に押圧する向きの力が作用し、基板２０の分
割位置において分割される側（基板保持部２１が保持し
ている側）の基板と分割する側（分割爪２２が掴んでい
る側）の基板とが干渉し、基板２０を破損させてしま
う。このため、従来の基板分割装置では、分割爪２２を
図６に示すように時計方向に動作させることを禁止して
おり、基板２０の下面に形成されている電極等が切れず
に基板２０が分割されない分割不良の発生率が高いとい
う問題があった。
【０００６】この発明の目的は、基板が分割されない分
割不良の発生率を低減することで、上記分割不良にとも
なう基板の破損を防止することができる基板分割装置を
提供することにある。
【０００７】
【課題を解決するための手段】この発明の基板分割装置
は、上記課題を解決するために以下の構成を備えてい
る。
【０００８】すなわち、スライド部材を取り付ける取付
部材と、該取付部材に対して上下方向にスライド自在に
取り付けられたスライド部材と、該スライド部材を上方
向に付勢する圧縮バネと、上記スライド部材に設けられ
た回転軸で回転し、且つスライド部材の所定位置に当接
して回転規制されるように形成された回転部材と、該回
転部材が回転規制された状態に当該回転部材を付勢する
引っ張りバネと、上記回転部材に取り付けられ、基板の
一方の端部を保持する基板保持部と、基板の他方の端部
を掴んだ状態で、上記基板の下方または上方のいずれか
を支点として回転して基板を分割する分割爪部とを備
え、上記分割爪部が上記基板を上記基板保持部から分割
爪部側へ引っ張る方向に回転する際、上記回転部材が回
転規制されることにより上記基板保持部の移動が規制さ
れ、且つ上記分割爪部が上記基板を上記基板保持部側に
押圧する方向に回転した際、基板を基板保持部側へ移動
させるとともに、上記引っ張りバネの反付勢方向に上記
回転部材を回転させ、該基板が上記基板保持部と上記回
転部材とともに上記スライド部材を上記圧縮バネの付勢
方向へスライドさせるように、上記基板保持部を上記回
転部材に設けたものとする。
【０００９】
【００１０】
【００１１】この構成では、分割爪部を一方の方向（支
点側）に回転させてプリント基板の分割を行ったとき
に、該プリント基板に形成されている電極等が切れなか
ったときを考慮して、分割爪部を他方の方向にも動作さ
せて確実に基板を分割する構成としたので、分割不良の
発生率を低減することができる。
【００１２】また、分割爪部を他方の方向に動作させた
ときには、基板を基板保持部側に移動させて逃がす構成
としたので、基板の分割位置における分割される側の基
板と分割する側の基板との干渉を抑制することができ
る。したがって、分割時に分割される側の基板と分割す
る側の基板とが干渉して破損するという問題もおきな
い。
【００１３】
【発明の実施の形態】図１は、この発明の実施形態であ
る基板分割装置を示す図である。この実施形態の基板分
割装置は、例えばアルミナ基板やセラミック基板を分割
する装置である。基板分割装置は、基板１０の一方の端
部を保持する基板保持部１と、上記基板１０の他方の端
部を掴む分割爪２とを備えている。基板保持部１は回転
軸３に回転自在に取り付けられている回転部材４に取り
付けられている。また、上記回転軸３は上記回転部材４
の上方に配置されているスライド部材５に取り付けられ
ている。スライド部材５は、取付部材６に対して図に示
す上下方向にスライド自在に取り付けられている。ま
た、上記回転部材４とスライド部材５とは引張バネ７に
よって互いに引き合う方向に付勢されており、スライド
部材５と取付部材６とは圧縮バネ８によって互いに離れ
る方向に付勢されている。さらに、回転部材４は、スラ
イド部材５によって図１に示す位置から時計方向への回
転が規制されている。
【００１４】上記取付部材６は、図示していない一軸テ
ーブルに取り付けられており、該一軸テーブルによって
上記基板保持部１、回転部材４、スライド部材５（回転
軸３を含む）、および取付部材６を分割爪２側に移動さ
せることができる。すなわち、基板保持部１に保持させ
た基板１０を分割爪２側に搬送できるように構成されて
いる。なお、図に示す１１は基板保持部１に保持させた
基板１０の搬送路となるレールである。また、分割爪２
の支点Ａは基板１０の底面よりも下側に設けられてい
る。
【００１５】以下，この実施形態の基板分割装置の動作
について説明する。この実施形態の基板分割装置は、図
１に示すように基板保持部１が基板１０の一方の端部を
保持し、該基板１０の他方の端部を分割爪２が掴んだ状
態にセットされる。このとき、回転部材４は引っ張りバ
ネ７によってスライド部材５に当接した状態（図１に示
す状態）が保持される。この状態で、分割爪２を図２に
示すように反時計方向に回転動作させる。このとき、分
割爪２側へ引っ張る方向（図２中に矢印で示す方向）の
力が基板１０に作用するが、上述したようにスライド部
材５によって回転部材４の時計方向の回転を規制してい
るので、回転部材４が時計方向に回転することはない。
したがって、分割爪２を反時計方向に動作させたときに
は、回転部材４が時計方向に回転して基板１０が分割爪
２側にスライドすることはなく、基板１０の分割位置が
ずれるという問題もおきない。
【００１６】しかし、上記「従来の技術」の欄で説明し
たように、上記動作では基板１０の下面の電極等が切れ
ずに基板１０が分割されないことがある。そこで、この
実施形態の基板分割装置は分割爪２を図２に示す状態か
ら図３に示すように時計方向に回転動作させる。このと
き、基板１０に基板保持部１側へ押す方向（図３中に矢
印で示す方向）の力が作用するため、回転部材４が反時
計方向に回転して基板保持部１に保持されている基板１
０を基板保持部１側に逃がす。したがって、分割爪２を
時計方向に動作させても、基板保持部１に保持されてい
る側（分割される側）の基板１０と、分割爪２が掴んで
いる側（分割する側）の基板１０との分割位置における
干渉を抑えて、基板１０に欠けを生じさせることなく、
確実に基板１０を分割することができる。
【００１７】また、この実施形態の基板分割装置では、
回転部材４が反時計方向に回転したときに基板保持部１
も反時計方向に回転し、その結果基板保持部１の開口溝
がレール１１面に対して傾斜し、分割される側の基板１
０が破損することも防止している。具体的には、回転部
材４が反時計方向に回転したとき、基板保持部１を上方
に押し上げようとする向きの力が作用するため、この力
によってスライド部材５が上方に移動させられる。な
お、圧縮バネ８がスライド部材５の上方への移動を補助
しており、該移動がスムーズに行われる。この上記スラ
イド部材５の上方への移動にともなって、回転軸３、回
転部材４および基板保持部１も上方に移動するので、基
板保持部１における基板１０の保持位置が上方へ持ち上
がる。したがって、基板保持部１が反時計方向に回転す
るものの、分割される側の基板１０にクラックを生じさ
せることがない。
【００１８】このように、この実施形態の基板分割装置
は基板１０を確実に分割するために分割爪２を時計方向
に動作させるように構成しただけではなく、分割爪２を
時計方向に動作させたときに基板１０を逃がす構成とし
たので、分割する側の基板と分割される側の基板との干
渉を抑え、基板１０に欠け等を生じさせることなく確実
に分割することができる。
【００１９】なお、本願発明者はこの実施形態の基板分
割装置で実際に基板１０の分割を行い、分割不良の発生
率が９０％削減できることを確認した。
【００２０】また、この実施形態の基板分割装置は、基
板１０の分割動作の完了後、分割爪２が掴んでいる分割
された基板１０を図示していない基板取出部によって本
体外部に取り出す。その後、基板分割装置は図示してい
ない一軸テーブルによって上記基板保持部１、回転部材
４、スライド部材５（回転軸３を含む）、および取付部
材６を分割爪２側に搬送し、基板保持部１が保持してい
る基板１０の他方の端部を分割爪２に掴ませて上記分割
動作を繰り返す。
【００２１】また、上記実施形態では分割爪２の支点Ａ
を基板１０の底面よりも下側に設けたが、分割爪２の支
点Ａは基板１０の上面よりも上側に設けても同様の作用
効果が得られる。
【００２２】
【発明の効果】以上のように、この発明によれば、分割
爪部を時計方向および反時計方向の両方向に動作できる
ようにしたので基板を確実に分割することができる。ま
た、上記分割爪部が上記基板を上記基板保持部側に押圧
する向きに動作したときには、該基板が基板保持部側に
移動するようにしたので、分割する側の基板と分割され
る側の基板との干渉を抑え、分割時に基板が欠ける等の
分割不良の発生率も大幅に低減できる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate dividing apparatus for dividing a substrate of an appropriate size into a predetermined size. 2. Description of the Related Art Conventionally, there has been a substrate dividing apparatus for dividing a substrate of an appropriate size (for example, an alumina substrate or a ceramic substrate) into a size for electronic components such as a chip resistor and an oscillator. FIG. 4 shows a schematic view of a conventional substrate dividing apparatus. A conventional board dividing apparatus is configured to divide a printed circuit board 20 (hereinafter, referred to as a divided board).
It is simply called the substrate 20. ) And a split claw 2 for gripping the other end of the substrate 20.
And 2. The substrate holding unit 21 is a uniaxial table (not shown) for transporting the held substrate 20 to the divided claw 22 side.
Is fixed to the main body 23 attached to the main body. Split claw 2
Numeral 2 operates in a counterclockwise direction indicated by an arrow in the figure from the state shown in FIG. 4, and a fulcrum A serving as a rotation center is provided below the bottom surface of the substrate 20. In addition, 2 shown in the figure
Reference numeral 4 denotes a rail for transporting the substrate 20 held by the substrate holding unit 21 to the split claw 22 side. The conventional substrate dividing apparatus divides the substrate 20 by operating the dividing claw 22 in the counterclockwise direction (the state shown in FIG. 5) from the state shown in FIG. The state returns to the state shown in FIG. The divided substrate 20 gripped by the division claw 22 is taken out of the main body by a substrate take-out unit (not shown). Then, the substrate 20
Is moved to the split claw 22 side, and the other end of the substrate 20 is again gripped by the split claw 22, and the above operation is repeated. However, when the split claw 22 is operated in the counterclockwise direction, slippage occurs between the split claw 22 and the substrate 20 so that the lower surface of the substrate 20 is In some cases, the formed electrodes and the like were not cut, and the substrate 20 could not be divided. In this state, the undivided substrate 20 gripped by the dividing claw 22 is taken out by the above-mentioned substrate extracting portion (not shown) to the outside of the main body.
There was also a problem that it was damaged. When the substrate 20 cannot be divided because the electrodes and the like formed on the lower surface of the substrate 20 are not cut, the substrate 20 can be divided by operating the dividing claw 22 clockwise as shown in FIG. Since the fulcrum A of the split claw 22 is provided below the bottom surface of the substrate 20, the split claw 22
Is operated in a clockwise direction, a force acts in a direction of pressing the substrate 20 toward the substrate holding portion 21, and the substrate 20 is divided at the dividing position (the side held by the substrate holding portion 21). This substrate interferes with the substrate on the side to be split (on the side where the split claw 22 is gripping), and damages the substrate 20. For this reason, in the conventional substrate dividing apparatus, the operation of the dividing claw 22 in the clockwise direction as shown in FIG. 6 is prohibited, and the electrodes and the like formed on the lower surface of the substrate 20 are not cut off. There is a problem that the incidence of division failures that are not divided is high. An object of the present invention is to provide a substrate dividing apparatus capable of preventing the substrate from being damaged due to the division failure by reducing the incidence of division failures in which the substrate is not divided. A substrate dividing apparatus according to the present invention has the following arrangement to solve the above-mentioned problems. [0008] That is, mounting the slide member
Slidable up and down with respect to the member and the mounting member
The attached slide member and the slide member are
A compression spring that biases the slide member;
Rotate on the rotating shaft and contact the slide member at the specified position
A rotating member formed so as to be restricted in rotation
Urges the rotating member to a state where the rotating member is restricted in rotation.
A tension spring and the rotating member
A substrate holder for holding one end and the other end of the substrate
While holding it, either below or above the substrate
And a dividing claw that rotates around the fulcrum to divide the board.
The dividing claw part divides the substrate from the substrate holding part.
When rotating in the direction of pulling to the claw side, the rotating member rotates.
The movement of the substrate holding unit is restricted by the rotation control.
And the dividing claw portion moves the substrate toward the substrate holding portion.
When rotated in the pressing direction, the substrate moves to the substrate holding part side
In the opposite direction of the tension spring.
By rotating a rotating member, the substrate is brought into contact with the substrate holding section and the circuit.
Urging the slide member together with the rolling member by the compression spring
So that it slides in the direction
It is assumed to be provided on the transfer member . In this configuration, when the printed circuit board is divided by rotating the divided claw in one direction (the fulcrum side), the electrodes and the like formed on the printed circuit board are cut off. In consideration of the case where the substrate does not exist, the dividing claw portion is also operated in the other direction to surely divide the substrate, so that the occurrence rate of division failure can be reduced. Further, when the dividing claw is operated in the other direction, the substrate is moved to the substrate holding portion and released, so that the substrate to be divided and the substrate to be divided at the substrate dividing position are separated. Interference with the substrate can be suppressed. Therefore, there is no problem that the substrate to be divided and the substrate to be divided interfere with each other during the division and are broken. FIG. 1 is a diagram showing a substrate dividing apparatus according to an embodiment of the present invention. The substrate dividing apparatus of this embodiment is an apparatus for dividing, for example, an alumina substrate or a ceramic substrate. The substrate dividing device includes a substrate holding unit 1 for holding one end of the substrate 10 and a split claw 2 for grasping the other end of the substrate 10. The substrate holding unit 1 is attached to a rotating member 4 that is attached to the rotating shaft 3 so as to be freely rotatable. The rotating shaft 3 is connected to the rotating member 4.
Is attached to a slide member 5 arranged above the first member. The slide member 5 is attached to the attachment member 6 so as to be slidable in the vertical direction shown in the figure. The rotating member 4 and the slide member 5 are urged by a tension spring 7 in a direction to attract each other, and the slide member 5 and the mounting member 6 are urged by a compression spring 8 in a direction away from each other. Further, the rotation of the rotating member 4 in the clockwise direction from the position shown in FIG. The mounting member 6 is mounted on a single-axis table (not shown), and the substrate holding section 1, the rotating member 4, the sliding member 5 (including the rotating shaft 3), and the mounting member 6 are mounted on the single-axis table. Can be moved to the split claw 2 side. That is, it is configured such that the substrate 10 held by the substrate holding unit 1 can be transported to the split claw 2 side. Reference numeral 11 shown in the figure is a rail serving as a transport path for the substrate 10 held by the substrate holding unit 1. Also, split claw 2
Is provided below the bottom surface of the substrate 10. Hereinafter, the operation of the substrate dividing apparatus according to this embodiment will be described. In the substrate dividing apparatus according to this embodiment, as shown in FIG. 1, the substrate holding unit 1 holds one end of the substrate 10 and the other end of the substrate 10 is set in a state where the dividing claw 2 grips the other end. You. At this time, the state where the rotating member 4 is in contact with the slide member 5 by the tension spring 7 (the state shown in FIG. 1) is maintained. In this state, the split claw 2 is rotated counterclockwise as shown in FIG. At this time, a force in a direction of pulling toward the split claw 2 side (a direction indicated by an arrow in FIG. 2) acts on the substrate 10, but the clockwise rotation of the rotary member 4 is regulated by the slide member 5 as described above. Therefore, the rotating member 4 does not rotate clockwise.
Therefore, when the dividing claw 2 is operated in the counterclockwise direction, the rotating member 4 rotates clockwise and the substrate 10 does not slide to the dividing claw 2 side, and the division position of the substrate 10 is shifted. Absent. However, as described above in the section of "Prior Art", in the above operation, the substrate 10 may not be divided without cutting off the electrodes and the like on the lower surface of the substrate 10. Therefore, the substrate dividing device of this embodiment rotates the dividing claw 2 clockwise from the state shown in FIG. 2 as shown in FIG. At this time, since a force is applied to the substrate 10 in the direction of pressing the substrate 10 toward the substrate holding part 1 (the direction indicated by the arrow in FIG. 3), the rotating member 4 rotates counterclockwise and is held by the substrate holding part 1. Substrate 1
0 is released to the substrate holding unit 1 side. Therefore, even if the dividing claw 2 is operated in the clockwise direction, the substrate 10 held on the substrate holding portion 1 (the side to be split) and the substrate on the side which the dividing claw 2 grips (the side to be split) The interference at the division position with the substrate 10 is suppressed, and without causing the substrate 10 to be chipped,
The substrate 10 can be reliably divided. Further, in the substrate dividing apparatus of this embodiment,
When the rotating member 4 rotates counterclockwise, the substrate holding unit 1
Also rotates counterclockwise, and as a result, the opening groove of the substrate holding part 1 is inclined with respect to the rail 11 surface, and
0 is also prevented from being damaged. Specifically, when the rotating member 4 rotates in the counterclockwise direction, a force acts to push the substrate holding unit 1 upward, and the sliding member 5 is moved upward by this force. The compression spring 8 assists the upward movement of the slide member 5, and the movement is performed smoothly. With the upward movement of the slide member 5, the rotating shaft 3, the rotating member 4, and the substrate holding unit 1 also move upward, so that the holding position of the substrate 10 in the substrate holding unit 1 is lifted upward. Therefore, although the substrate holding unit 1 rotates in the counterclockwise direction, cracks do not occur in the substrate 10 on the divided side. As described above, the substrate dividing apparatus of this embodiment not only operates the dividing claw 2 clockwise to reliably divide the substrate 10 but also operates the dividing claw 2 clockwise. When the substrate 10 is released, the substrate 10 is released, so that interference between the substrate to be divided and the substrate to be divided can be suppressed, and the substrate 10 can be reliably divided without causing chipping or the like. The inventor of the present application has actually divided the substrate 10 with the substrate dividing apparatus of this embodiment, and has confirmed that the occurrence rate of division failure can be reduced by 90%. Further, in the substrate dividing apparatus of this embodiment, after the division operation of the substrate 10 is completed, the divided substrate 10 gripped by the division claw 2 is taken out of the main body by a substrate take-out section (not shown). Thereafter, the substrate dividing device conveys the substrate holding unit 1, the rotating member 4, the sliding member 5 (including the rotating shaft 3), and the mounting member 6 to the dividing claw 2 by a uniaxial table (not shown). The other end of the substrate 10 held by 1 is gripped by the split claw 2 and the above splitting operation is repeated. In the above embodiment, the fulcrum A of the split claw 2
Is provided below the bottom surface of the substrate 10, but the same operation and effect can be obtained even if the fulcrum A of the split claw 2 is provided above the upper surface of the substrate 10. As described above, according to the present invention, the substrate can be reliably divided since the dividing claw can be operated in both the clockwise direction and the counterclockwise direction. Further, when the dividing claw portion is operated in a direction of pressing the substrate toward the substrate holding portion, the substrate is moved to the substrate holding portion side, so that the substrate to be divided and the substrate to be divided are moved. Interference with the substrate is suppressed, and the occurrence rate of division failure such as chipping of the substrate during division can be significantly reduced.
【図面の簡単な説明】
【図１】この発明の実施形態である基板分割装置の構成
を示す図である。
【図２】この発明の実施形態である基板分割装置の動作
を説明する図である。
【図３】この発明の実施形態である基板分割装置の動作
を説明する図である。
【図４】従来の基板分割装置の構成を示す図である。
【図５】従来の基板分割装置の動作を説明する図であ
る。
【図６】従来の基板分割装置における課題を説明する図
である。
【符号の説明】
１−基板保持部
２−分割爪
３−回転軸
４−回転部材
５−スライド部材
６−取付部材
７−引張バネ
８−圧縮バネ
１０−基板BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a configuration of a substrate dividing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram illustrating an operation of the substrate dividing apparatus according to the embodiment of the present invention. FIG. 3 is a diagram illustrating an operation of the substrate dividing apparatus according to the embodiment of the present invention. FIG. 4 is a diagram showing a configuration of a conventional substrate dividing apparatus. FIG. 5 is a diagram illustrating the operation of a conventional substrate dividing apparatus. FIG. 6 is a diagram illustrating a problem in a conventional substrate dividing apparatus. DESCRIPTION OF SYMBOLS 1-substrate holding portion 2-divided claw 3-rotation shaft 4-rotation member 5-slide member 6-mounting member 7-tension spring 8-compression spring 10-substrate
Claims (1)
られたスライド部材と、 該スライド部材を上方向に付勢する圧縮バネと、 上記スライド部材に設けられた回転軸で回転し、且つス
ライド部材の所定位置に当接して回転規制されるように
形成された回転部材と、 該回転部材が回転規制された状態に当該回転部材を付勢
する引っ張りバネと、 上記回転部材に取り付けられ、基板の一方の端部を保持
する基板保持部と、 基板の他方の端部を掴んだ状態で、上記基板の下方また
は上方のいずれかを支点として回転して基板を分割する
分割爪部とを備え、 上記分割爪部が上記基板を上記基板保持部から分割爪部
側へ引っ張る方向に回転する際、上記回転部材が回転規
制されることにより上記基板保持部の移動が規制され、
且つ上記分割爪部が上記基板を上記基板保持部側に押圧
する方向に回転した際、基板を基板保持部側へ移動させ
るとともに、上記引っ張りバネの反付勢方向に上記回転
部材を回転させ、該基板が上記基板保持部と上記回転部
材とともに上記スライド部材を上記圧縮バネの付勢方向
へスライドさせるように、上記基板保持部を上記回転部
材に設けた 基板分割装置。(57) [Claim 1] A mounting member for mounting a slide member, and a vertically slidable mounting on the mounting member.
A sliding member, a compression spring that urges the sliding member upward , and a slide that rotates around a rotation shaft provided on the sliding member.
So that it comes into contact with a predetermined position of the ride
The formed rotating member and the biasing of the rotating member in a state where the rotating member is restricted in rotation.
A tension spring that is attached to the rotating member and holds one end of the substrate
Holding the other end of the substrate and the substrate holding portion to be
Rotates around one of the fulcrums to divide the board
A split claw portion, wherein the split claw portion separates the substrate from the substrate holding portion.
When rotating in the pulling direction, the rotating member
The movement of the substrate holding unit is regulated by being controlled,
And the split claw presses the substrate toward the substrate holding unit.
When the substrate is rotated in the direction
And the rotation in the counter-bias direction of the tension spring.
The member is rotated, and the substrate is moved to the substrate holding portion and the rotating portion.
Urging direction of the compression spring together with the material
So that the substrate holding part is
Substrate dividing device installed on the material .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000002378A JP3473532B2 (en) | 2000-01-11 | 2000-01-11 | Substrate dividing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000002378A JP3473532B2 (en) | 2000-01-11 | 2000-01-11 | Substrate dividing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001196329A JP2001196329A (en) | 2001-07-19 |
| JP3473532B2 true JP3473532B2 (en) | 2003-12-08 |
Family
ID=18531492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000002378A Expired - Fee Related JP3473532B2 (en) | 2000-01-11 | 2000-01-11 | Substrate dividing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3473532B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217245B2 (en) * | 2013-08-29 | 2017-10-25 | 三星ダイヤモンド工業株式会社 | Splitting mechanism |
| JP2019196281A (en) * | 2018-05-09 | 2019-11-14 | 三星ダイヤモンド工業株式会社 | Substrate dividing device |
-
2000
- 2000-01-11 JP JP2000002378A patent/JP3473532B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001196329A (en) | 2001-07-19 |
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