JP3472989B2 - Projection exposure apparatus and element manufacturing method using the apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a projection exposure apparatus used, for example, in manufacturing a semiconductor device, and more particularly, when exposing each shot area on a photosensitive substrate, the mask and the photosensitive substrate are arranged in a one-dimensional direction. The present invention relates to a so-called step-and-scan projection exposure apparatus that performs synchronous scanning.

[0002]

2. Description of the Related Art Conventionally, a pattern formed on a photomask or a reticle (hereinafter referred to as a "reticle") when a semiconductor device, a liquid crystal display device, or the like is manufactured by using a photolithography technique. There is used a projection exposure apparatus that transfers and exposes the light onto a photosensitive substrate such as a wafer or a glass plate coated with a photoresist or the like via a projection optical system.

In recent years, in particular, since the size of one chip pattern of a semiconductor element tends to increase, there is a demand for a projection exposure apparatus that exposes a pattern having a larger area on a reticle onto a photosensitive substrate. If a so-called step-and-repeat type projection exposure apparatus that collectively exposes the entire surface of the chip can meet such a demand for an increase in the exposure area, the projection optical system becomes large as it is, and the apparatus cost also rises. is there.

Therefore, a so-called step-and-scan method (in which a reticle and a photosensitive substrate are synchronously scanned with respect to a rectangular or arcuate illumination area (hereinafter referred to as "slit-shaped illumination area")). Hereinafter, a "scan type" or "scan type" projection exposure apparatus has been developed. FIG. 7 shows a schematic configuration of a conventional scan-type projection exposure apparatus. In FIG. 7, illumination light IL from an optical integrator (not shown) in the illumination optical system is viewed through the first relay lens 1. Illuminate the diaphragm 2. Illumination light that has passed through the slit-shaped opening of the field stop 2 passes through the second relay lens 3, the mirror 4 for bending the optical path, and the illumination condenser lens 5, and makes the slit-shaped illumination area 7 on the reticle 6 uniform. Illuminate with a constant illuminance. The arrangement surface of the field stop 2 and the pattern formation surface of the reticle 6 are conjugate, and the projection image of the rectangular aperture of the width d _{S in} the short side direction formed on the field stop 2 becomes the slit-shaped illumination area 7. ing. However, in FIG. 7, the projection magnification from the field stop 2 to the reticle 6 is substantially equal.

The reticle 6 is installed on a reticle base 9 via a movable reticle stage 8, and is measured by a movable mirror 10 fixed to the end of the reticle stage 8 and a laser interferometer 11 installed outside. The coordinates of the reticle stage 8 in the scanning direction are supplied to the main control system 12. The main control system 12 controls the scanning speed and position of the reticle stage 8 via the reticle drive device 13.

The pattern image in the slit-shaped illumination area 7 on the reticle 6 is transmitted through the both-side telecentric (or one-side telecentric) projection optical system 14 into the slit-shaped exposure area 18 on the photosensitive substrate (wafer or the like) 17. The image is projected. That is, the exposure area 18 is conjugate with the illumination area 7, and thus the opening of the field stop 2. Further, the projection optical system 14 is configured by housing the lens 15 on the reticle 6 side to the lens 16 on the photosensitive substrate 17 side in a lens barrel.

FIG. 8 shows a slit-shaped exposure area 18 on the photosensitive substrate 17 in FIG. 7, and in FIG. 8, a circular effective exposure field 2 having a diameter d _PL by the projection optical system.
The slit-shaped exposure region 18 is set so as to be substantially inscribed in the No. 4. Therefore, the width d _L of the long side of the slit-shaped exposure region 18 on the exposure surface of the wafer is substantially equal to the diameter d _PL of the effective exposure field 24. Further, when the projection magnification of the projection optical system 14 in FIG. 7 is β, the width d _S in the short side direction of the rectangular aperture of the field stop 2 in FIG. -Represented by d _S.

At the time of exposure, an exposure field (shot area) 2 having a width in the short side direction on the photosensitive substrate of d _FS (≈d _L ).
The pattern image of the reticle 6 is projected and exposed onto the exposure field 25 by scanning 5 along the short side direction of the exposure area 18 in the C1 direction and scanning the reticle in the opposite direction. In this case, the width d _{L of} the slit-shaped exposure area 18 in the long side direction is equal to the width d _{FS of the} exposure field 25 in the short side direction.
Therefore, a larger exposure field can be obtained by using the projection optical system having the same size as compared with the collective exposure method in which the size of the exposure field is determined by the diameter d _PL of the effective exposure field of the projection optical system. I understand.

Returning to FIG. 7, the photosensitive substrate 17 is placed on a movable wafer stage 20 via a wafer holder 19, and a movable mirror 21 fixed on the wafer stage 20 and laser interference installed outside. The two-dimensional coordinates of the wafer stage 20 and the photosensitive substrate 17 measured by the total 22 are supplied to the main control system 12. The main control system 12 is
The positioning operation and the scanning operation of the wafer stage 20 are controlled via the wafer driving device 23. Under the control of the main control system 12 at the time of scanning exposure, for example, the reticle stage 8 in synchronism with scanning at a speed V _R in the B1 direction, the speed of the wafer stage 20 in the C1 direction V _W (= β · V _R ), The pattern image of the reticle 6 is successively projected and exposed on the photosensitive substrate 17.

FIG. 9 is a perspective view showing the state of the synchronous scanning. In FIG. 9, the pattern area 26 of the reticle 6 is scanned in the direction B1 with respect to the obliquely illuminated slit-shaped illumination area 7. Synchronized and shaded exposure area 1
Exposure field 2 of the photosensitive substrate 17 in the C1 direction with respect to 8
5 are scanned. As a result, the pattern images in the pattern area 26 of the reticle 6 are successively projected and exposed on the exposure field 25.

In a projection exposure apparatus as well as the scanning method, it is important to perform relative positioning between the reticle 6 and the photosensitive substrate 17 with high accuracy, and a sensor or the like for that purpose is provided. FIG. 10 shows a state in which such a sensor and the like are added to the scanning type projection exposure apparatus of FIG. 7, and in FIG.
A through-the-lens (TTL) type alignment microscope 27 for detecting the position of the alignment mark in each shot area of the photosensitive substrate 17 via the projection optical system 14 is provided near the upper end of 4. . An alignment microscope 28 for detecting the alignment mark on the photosensitive substrate 17 by the off-axis method is also arranged near the lower end of the projection optical system 14, and these alignment microscopes 2 are arranged.
The photosensitive substrate 17 is positioned using 7 and 28.

Further, in order to position the photosensitive substrate 17 in the optical axis direction of the projection optical system 14, that is, to perform focusing and leveling, a through-the-lens type focus leveling sensor (not shown) and projection optical system are used. System 14
A so-called grazing incidence type focus / leveling sensor that utilizes a gap between the photosensitive substrate 17 and the photosensitive substrate 17 is provided.
In FIG. 10, only the light projecting system 29 of the oblique incidence type focus / leveling sensor is shown. It should be noted that, in practice, the alignment microscope 28 and the light projecting system 29 are shown on the same plane for convenience, which are arranged at asymmetrical positions around the optical axis of the projection optical system 14.

As described above, the sensors of these positioning means are required to be non-contact, so that optical sensors are often used.
In order to perform accurate measurement with such an optical sensor, it is important to eliminate air fluctuations in the optical path of the probe light as much as possible. Therefore, the reticle 6 and the projection optical system 14
There may be a case where a dedicated air conditioner 30 is provided between and.

Further, in FIG. 10, an actuator 31 for driving, for example, the lens element 15 among the individual lens elements of the projection optical system 14 is attached to the upper side surface of the projection optical system 14. By finely adjusting the position or the tilt angle of the lens element 15 via the actuator 31, various aberrations of the projection optical system 14 can be adjusted and a more desirable projected image can be obtained.
As the lens element driven by the actuator in the projection optical system 14, various lens elements other than the lens element 15 can be considered.

[0015]

As described above, in the conventional scan type projection exposure apparatus, various mechanisms for securing various accuracies are attached around the projection optical system 14 which has recently become large in size. However, in some cases, the attached mechanisms may mechanically interfere with each other, which may make designing or installation difficult. Alternatively, there is also a disadvantage that desired performance cannot be obtained because the mechanisms are forcibly arranged.

In view of the above point, the present invention has a projection optical system necessary and sufficient for scan type projection exposure, and
An object of the present invention is to provide a projection exposure apparatus which can efficiently arrange an alignment microscope or an auxiliary mechanism such as a focus / leveling sensor necessary for positioning a photosensitive substrate by using the projection optical system.

[0017]

In a projection exposure apparatus according to the present invention, for example, as shown in FIG. 1, a slit-shaped illumination area (7) on a mask (6) on which a transfer pattern is formed.
And an illumination optical system (1-5) for illuminating the image, and a projection for forming an image of the pattern of the mask (6) in the slit-shaped illumination area (7) provided with a plurality of lens elements on the photosensitive substrate (17). A slit-shaped illumination area (7) having an optical system
The pattern image of the mask (6) is sequentially exposed on the photosensitive substrate (17) by scanning the photosensitive substrate (17) in a predetermined direction in synchronism with the scanning of the mask (6) in the lateral direction. In the scanning type projection exposure apparatus, the projection optical system (1
4A), a portion (15B) through which only a light beam that does not contribute to image formation of the image of the pattern of the mask (6) in the slit-shaped illumination region (7) passes, and slit-shaped illumination. This is a cutout of a predetermined portion of the portion (16B) through which the image forming light flux of the image of the mask (6) in the area (7) does not pass.

In other words, the projection optical system (1
4A), the photosensitive substrate (1
This is a cutout of a predetermined portion other than the portion through which the imaging light flux of the image of the pattern of the mask (6) reaching 7) passes.

In these cases, the projection optical system (14A)
An example of the predetermined portion cut out in such a manner among the plurality of lens elements is a portion (16B) near the photosensitive substrate (17), and a portion (16B) near the photosensitive substrate (16B).
5B, a part of the alignment optical system (28) for detecting the position of the alignment mark on the photosensitive substrate (17) may be arranged as shown in FIG. Further, in a portion (16B) near the photosensitive substrate, as shown in FIG. 5, for example, the state of the surface of the photosensitive substrate (17) (focus position,
A part of the optical system (29) for detecting the inclination angle or the like may be arranged.

Another example of the predetermined portion thus cut out in the plurality of lens elements in the projection optical system (14A) is a portion (15B) near the mask (6).
In the vicinity portion (15B), for example, as shown in FIG. 5, among the plurality of lens elements in the projection optical system (14A), a predetermined lens element (47) closer to the mask (6) is provided. A part of the driving means (31) for changing the state may be arranged. Further, as shown in FIG. 5, for example, as shown in FIG. 5, a blower means (30) for blowing a clean gas between the projection optical system (14A) and the mask (6) in a portion (15B) near the mask (6). ) May be partially arranged. Further, the element manufacturing method of the present invention includes the step of transferring the mask pattern onto the substrate using the projection exposure apparatus of the present invention.

[0021]

According to the present invention, in the projection optical system of the scan type projection exposure apparatus, it is effective in the lens element near the mask (6) and the lens element near the photosensitive substrate (17). Paying attention to the fact that the area through which the image-forming light flux passes is not an axially symmetrical area, the glass material in the portion where the effective image-forming light flux does not pass is shaved to secure a space. And
In this space, for example, a part of an alignment optical system for detecting the position of the alignment mark of the photosensitive substrate (17), the surface state of the photosensitive substrate (17) (focus position, etc.)
Of the optical system for detecting light, projection optical system (14A)
By installing a part of the driving means for driving the lens element inside, or an air conditioner or the like, it is possible to efficiently arrange various incidental mechanical parts.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the projection exposure apparatus according to the present invention will be described below with reference to FIGS. In this embodiment, the present invention is applied to a step-and-scan type projection exposure apparatus, and in FIG. 1, FIG. 5 and FIG. 6, parts corresponding to FIG. 7 and FIG. The detailed description thereof will be omitted.

FIG. 1 shows the essential parts of the optical system and stage system of the projection exposure apparatus of this embodiment. In FIG. 1, the projected image of the rectangular aperture of width d _S in the short side direction in the field stop 2 is A slit-shaped illumination area 7 having a width d _{R in} the short side direction on the reticle 6.
Has become. The projection optical system 14A of the present embodiment is arranged on the bottom side of the reticle 6, and the projection optical system 1 for the illumination area 7 is provided.
The conjugate image of 4A is the slit-shaped exposure area 18 on the photosensitive substrate 17. The Z axis is taken parallel to the optical axis of the projection optical system 14A, the X axis is taken perpendicular to the optical axis of the projection optical system 14A and parallel to the paper surface of FIG. 1, and the Y axis is taken perpendicular to the paper surface of FIG. take. In this case, the short side direction of the illumination area 7 is X
It is a direction parallel to the axis, and during exposure with the scanning method,
The reticle 6 is scanned in the B direction parallel to the X axis with respect to the illumination area 7, and the photosensitive substrate 17 is scanned in the C direction parallel to the X axis with respect to the exposure area 18.

In this embodiment, the difference from the projection exposure apparatus of FIG. 7 is the configuration of the projection optical system 14A, and the projection optical system 14A will be described in detail below. First,
In FIG. 1, a slit-shaped illumination area 7 having a width d _{R in} the short side direction is shown.
The light fluxes D and E passing through both ends in the scanning direction are indicated by arrows. The light flux D passing through the right end of the illumination area 7 is
Only the light flux that vertically enters the reticle 6 is represented, and the light flux E that passes through the left end of the illumination area 7 represents the light flux having the maximum inclination angle among the light flux that obliquely enters the reticle 6.

Now, the numerical aperture (N
A) is determined by the aperture stop 41 fixed inside. Letting NA _{W be} the value of the numerical aperture on the photosensitive substrate 17 side and NA _R be the value on the reticle 6 side, the projection magnification (reduced projection in FIG. 1) is β (β <1), and the following relationship exists. . NA _W × β = NA _R (1) Further, in FIG. 1, the maximum opening angle of the light flux emitted from the reticle 6 and passing through the aperture of the aperture stop 41 is θ _R , and the light flux passing through the aperture of the aperture stop 41 is The maximum opening angle is θ _W
Then, the opening angles θ _W and θ _R are determined by numerical apertures NA _W and N
Each is defined as follows using A _R.

NA _W = _sin θ _W (2A) NA _R = _Sin θ _R (2B) At this time, in the X direction, which is the short side direction of the illumination area 7, opening from the slit-shaped illumination area 7 on the reticle 6 is performed. Angle θ _R
The light flux exceeding 1.0 is not blocked by the aperture stop 41 of the projection optical system 14A and does not participate in the projection exposure, and the opening angle θ _W from the projection optical system 14A is increased by the action of the aperture stop 41.
Light fluxes exceeding the above range do not enter the slit-shaped exposure area 18. Therefore, among the lens elements constituting the projection optical system 14A, as the lens element 15A closest to the reticle 6, a member obtained by removing the hatched portion 15B which is not necessary for the projection exposure from the axisymmetric lens can be used. Similarly, as the lens element 16A closest to the photosensitive substrate 17, a member obtained by removing the hatched portion 15B which is not necessary for projection exposure from the axisymmetric lens can be used. In addition, the lens element 15A,
Several lens elements adjacent to 16A (not shown)
Also in (1), although depending on the design of the projection optical system, there is a portion that does not participate in projection exposure as well, so a member obtained by removing such a portion from an axisymmetric lens can be used.

On the other hand, in the direction of the long side of the slit-shaped illumination area 7 (direction perpendicular to the paper surface of FIG. 1), each lens element constituting the projection optical system 14A has the entire diameter of the axially symmetric lens. It has been used throughout. Therefore, taking the above into consideration, in the scan type projection exposure apparatus, it is sufficient that the lens element 15A has a shape in which both ends in the scanning direction are cut off from the axially symmetric lens 15, as shown in FIG. I understand. Lens element 16
The same applies to A. Therefore, in the present embodiment, as shown in FIG. 3, the lens elements 15A and 16A and, if possible, the lens elements adjacent to them have a shape in which both ends in the scanning direction are cut off from an axially symmetric lens. Use a lens.

A normal lens element uses a metal frame for holding the lens barrel of the projection optical system when the lens element is housed in the metal frame. In the case of the lens element 15A whose both ends are cut off as in the present embodiment (the same applies to 16A), the metal frame is a substantially rectangular metal frame in which unnecessary parts are omitted as shown in FIG. 3 (a). 44 can be used. Other,
As shown in FIG. 3B, the lens element 15A is held in the circular metal frame 45, and the lens element 15A
It is also possible to leave the gap 46 at both ends and to arrange various mechanisms in this gap 46 as described later.
Even in the case of using the circular metal frame 45 as described above, in the sense that the gap 46 can be used, it is essentially the same as the case of using the substantially rectangular metal frame 44.

In FIG. 1, the lens elements 15A and 1
As the metal frame of 6A, an example in which a substantially rectangular metal frame (44 or the like) is used as shown in FIG. 3A is shown. Figure 4
FIG. 4A is a perspective view of the projection optical system 14A of FIG.
4B is a side view from the direction of arrow A in FIG. 4A,
As shown in FIGS. 4A and 4B, in comparison with the projection optical system 14 of FIG. 7, the projection optical system 14A of this embodiment has both end portions in the scanning direction (B direction) on the illumination area 7 side. Spaces 42A and 42B are created by deleting. Further, also on the exposure area 18 side, in the projection optical system 14A of the present embodiment, both ends in the scanning direction (C direction) are deleted and spaces 43A and 43B are generated, as compared with the projection optical system 14 of FIG. . Therefore, in this embodiment, various mechanisms are arranged in the spaces 42A, 42B and 43A, 43B created by deleting the constituent members.

FIG. 5 shows a main part of the projection exposure apparatus of FIG. 1 with various mechanisms added, and FIG. 6 shows the projection optical system 1 of FIG.
4A is a bottom view of FIG. 4A, and FIGS. 5 and 6 correspond to FIG. 10 of the conventional example. First, in FIG. 5, a so-called through-the-lens (TTL) type alignment microscope 27 is provided in a space 42B created in the vicinity of a metal frame 47 that holds the lens element 15A in the projection optical system 14A.
Install the tip of. In the configuration of FIG. 10 of the conventional example, the lens element 15 is included in the optical path of the alignment system, but in the case of the present embodiment, the lens element 15A and the like are removed from the optical path of the alignment system, so that the alignment microscope 27 is used as necessary. Lens element 15 in the optical system of
It is necessary to incorporate an optical element suitable for A or the like. According to this embodiment, it is not necessary to install the alignment microscope 27 between the projection optical system 14A and the reticle 6.

Further, when the tip ends of a plurality of TTL type alignment microscopes 27 are installed in the space 42B or the space 42A, the distance for stepping movement between the microscopes at the time of alignment measurement can be short, so that the measurement time can be shortened. There is also an advantage that the throughput of the alignment and exposure process is improved. The alignment microscope 27
Instead of, the focus position detection system of the TTL method or the tilt angle detection system for leveling may be installed.

Next, the tip of the off-axis alignment microscope 28 is set in one space 43B created at the lower end of the projection optical system 14A. By installing the tip of the off-axis type alignment microscope 28 in the space 43B, that is, the space generated at the lower end of the projection optical system 14A, the optical axis of the projection optical system 14A and the off-axis type alignment microscope 28 are installed. The so-called baseline, which is the distance from the optical axis of, becomes shorter than before, and in the case of a mechanism having the same positioning accuracy, problems such as instability of the baseline affected by thermal expansion are alleviated.

Further, in the other space 43A at the lower end thereof, the projection system 29 of the oblique incidence type focus / leveling sensor is provided.
Set up. In FIG. 5, the alignment microscope 28 and the light projecting system 29 are drawn so as to be on the same plane for convenience. However, as shown in the bottom view of FIG. 6, both of them are related to the optical axis of the projection optical system 14A. It is arranged in an asymmetrical position. Further, in FIG. 6, the light receiving system 48 of the focus / leveling sensor is arranged at a position symmetrical with respect to the light projecting system 29. The arrangement of FIG. 5 is a view of the projection exposure apparatus of this embodiment as viewed from the direction along the line GG of FIG.

Further, in FIG. 5, a part of the bottom surface portion of the air conditioner 30 for flowing clean air between the reticle 6 and the projection optical system 14A is provided in a space 42A formed near the upper end of the projection optical system 14A. Deploy. Correspondingly, in FIG. 6, the space 43 generated near the lower end of the projection optical system 14A.
At A, a part of an air conditioner 49 for flowing clean air is arranged between the photosensitive substrate 17 and the projection optical system 14A. Especially in the latter air conditioner 49, the focus / leveling system 2
Since air can be made to flow from the vicinity of the optical paths of 9 and 48, the effect of reducing air fluctuations is great.

Finally, referring to FIG. 5, the projection optical system 14A
An actuator 31 for driving the lens element 15A of the projection optical system 14A by a minute amount is fixed in the space 42A near the upper end of the. The drive mechanism for the lens elements other than the lens element 15A is omitted.
5 and 6, all the accessory mechanisms such as the alignment microscope and the focus / leveling sensor are installed in the spaces 42A, 42B and 43A, 43B generated near the projection optical system 14A. However, it goes without saying that, for example, the tip of the TTL alignment microscope 27 is installed in the space 42B, and the air conditioner 30 is left in the space between the projection optical system 14A and the reticle 6 in various modifications. However, in any case, the space created in the vicinity of the projection exposure apparatus can be effectively used.

In the above description, the projection optical system 14A
Although a projection optical system composed of a refraction system has been assumed as the above, even in a projection optical system in which a reflection system or a mixture of a reflection system and a refraction system is used, an image is formed on an optical element or an optical system in the same manner as in the above embodiment. It goes without saying that by scraping off the portion that does not contribute, it is possible to create a space in which the auxiliary mechanism can be arranged without deteriorating the imaging characteristics.

In the illumination optical system shown in FIG. 1, for example, the ends 1a and 1b in the scanning direction of the first relay lens 1 and the second
A light beam for illuminating the slit-shaped illumination region 7 does not pass through the scanning direction ends 3a and 3b of the relay lens 3 and the scanning direction ends 5a and 5b of the illumination condenser lens 5. Therefore, the end portions 1a, 1b, 3a, 3 through which the light flux for illuminating the illumination area 7 does not pass in such a manner.
It is also possible to cut off b and 5a, 5b, and arrange the auxiliary mechanism in the space created by this.

As described above, the present invention is not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

[0039]

According to the present invention, of the lens elements in the projection optical system, the portions that do not contribute to the image formation on the photosensitive substrate are cut out, so that the projection characteristics are not deteriorated. New spaces are created above and below the optical system. Therefore, there is an advantage that some or all of various auxiliary mechanisms such as an alignment system and a focus / leveling sensor can be efficiently arranged in this space. There is also an advantage that the projection optical system can be downsized and lightened.

Furthermore, by installing an off-axis type alignment optical system in the space formed near the lower end of the projection optical system, the optical axis of the projection optical system and the optical axis of the off-axis type alignment optical system are set. The so-called baseline, which is the distance between the two, becomes shorter than the conventional one, and in the case of the same positioning accuracy, there is an advantage that problems such as instability of the baseline affected by thermal expansion are alleviated.

Further, an optical system for detecting the surface state of the photosensitive substrate (focusing / focusing) in a space near the lower end of the projection optical system.
If a leveling sensor or the like) is arranged, the optical path length of the light from the optical system is shortened, so that there is an advantage that the influence of air fluctuation is reduced. Further, when the driving means for the predetermined lens element is arranged in the space near the upper end of the projection optical system, the image forming characteristics of the projection optical system can be adjusted, and a clean gas is supplied to the space near the upper end of the projection optical system. When the blowing means for blowing is provided, the image forming characteristic of the projection optical system can be stably maintained. In addition, the part where the imaging light flux does not pass through in the projection optical system.
When an element with a shape cut off is included
Creates a new space without degrading imaging performance
it can. In addition, a sensor for detecting the surface condition of the substrate
(Focus / leveling sensor, etc.) and its sensors
When equipped with an air conditioner that allows gas to flow from near the optical path of
Has a great effect of reducing air fluctuations.

[Brief description of drawings]

FIG. 1 is a partially cutaway configuration diagram showing essential parts of an optical system and a stage system of an embodiment of a projection exposure apparatus according to the present invention.

FIG. 2 is a perspective view showing the shape of a lens element 15A of FIG.

3A is a perspective view showing an example of a metal frame for the lens element 15A of FIG. 1, and FIG. 3B is a perspective view showing another example of the metal frame for the lens element 15A.

4A is a perspective view showing the projection optical system 14A of FIG. 1, and FIG. 4B is a side view from the direction of arrow A in FIG. 4A.

5 is a configuration diagram showing a main part of the projection exposure apparatus of FIG. 1 in which various auxiliary mechanisms are mounted.

6 is a bottom view of a projection optical system 14A of the projection exposure apparatus of FIG.

FIG. 7 is a partially cutaway configuration diagram showing an optical system and a stage system of a conventional projection exposure apparatus.

8 is an enlarged plan view showing the slit-shaped exposure area of FIG. 7. FIG.

FIG. 9 is an explanatory diagram of a scan type exposure method.

10 is a configuration diagram showing a state in which various auxiliary mechanisms are attached to the projection exposure apparatus of FIG.

[Explanation of symbols]

2 Field stop 5 Lighting condenser lens 6 reticle 7 Slit-shaped illumination area 14A Projection optical system 15A, 16A Lens element with some parts removed 17 Photosensitive substrate 18 Slit-shaped exposure area 27 TTL alignment microscope 28 Off-axis alignment microscope 29 Focus / leveling sensor projection system 30,49 Air conditioner 41 Aperture stop 42A, 42B, 43A, 43B space 44,47 hardware frame 45 hardware frame 48 Light receiving system of focus / leveling sensor

─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-64-46606 (JP, A) JP-A-61-160934 (JP, A) JP-A-8-167549 (JP, A) JP-A-5- 283313 (JP, A) JP 5-231820 (JP, A) JP 5-188298 (JP, A) JP 5-152191 (JP, A) JP 2-272305 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/027 G03F 7/20

Claims (10)

(57) [Claims] 1. An illumination optical system for illuminating a slit-shaped illumination area on a mask on which a transfer pattern is formed, and an image of the mask pattern in the slit-shaped illumination area provided with a plurality of lens elements. A projection optical system for image-forming and projecting onto the photosensitive substrate, and by scanning the photosensitive substrate in a predetermined direction in synchronization with scanning of the mask in the lateral direction of the slit-shaped illumination region. A scanning projection exposure apparatus that sequentially exposes the pattern image of the mask onto the photosensitive substrate, wherein an image of the pattern of the mask in the slit-shaped illumination region among a plurality of lens elements in the projection optical system Notches a predetermined portion of a portion through which only the light flux that does not contribute to the image formation of the mask and a portion through which the image formation light flux of the image of the mask in the slit-shaped illumination region does not pass through Projection exposure apparatus, characterized in that. 2. The predetermined portion cut out in the plurality of lens elements in the projection optical system is a portion in the vicinity of the photosensitive substrate, and the predetermined portion on the photosensitive substrate is in a portion in the vicinity of the photosensitive substrate. 2. The projection exposure apparatus according to claim 1, wherein a part of an alignment optical system for detecting the position of the alignment mark is arranged. 3. The predetermined portion cut out in the plurality of lens elements in the projection optical system is a portion in the vicinity of the photosensitive substrate, and the surface of the photosensitive substrate is in the portion in the vicinity of the photosensitive substrate. 2. The projection exposure apparatus according to claim 1, further comprising a part of an optical system for detecting the state of. 4. The predetermined portion cut out of the plurality of lens elements in the projection optical system is a portion in the vicinity of the mask, and the predetermined portion in the projection optical system is in a portion in the vicinity of the mask. 2. The projection exposure apparatus according to claim 1, further comprising a part of driving means for changing a state of a predetermined lens element of the plurality of lens elements near the mask. 5. The predetermined portion cut out of a plurality of lens elements in the projection optical system is a portion near the mask, and the projection optical system and the projection optical system are provided in a portion near the mask. 2. The projection exposure apparatus according to claim 1, wherein a part of blowing means for blowing a clean gas is arranged between the mask and the mask. 6. An illumination optical system for illuminating a slit-shaped illumination area on a mask on which a transfer pattern is formed, and an image of the mask pattern in the slit-shaped illumination area provided with a plurality of lens elements. A projection optical system for image-forming and projecting onto the photosensitive substrate, and by scanning the photosensitive substrate in a predetermined direction in synchronization with scanning of the mask in the lateral direction of the slit-shaped illumination region. In a scanning type projection exposure apparatus that sequentially exposes the pattern image of the mask onto the photosensitive substrate, among the plurality of lens elements in the projection optical system, an image of the pattern of the mask reaching the photosensitive substrate A projection exposure apparatus characterized in that a predetermined portion other than a portion through which an imaging light flux passes is cut out. 7. An illumination optical system for illuminating an illumination area on a mask on which a pattern is formed, and a projection optical system including a plurality of elements for projecting an image of the mask pattern in the illumination area onto a substrate. And scanning in which the pattern image of the mask is sequentially exposed on the substrate by scanning the substrate in a predetermined direction in synchronization with scanning the mask in the lateral direction of the illumination region. A projection exposure apparatus of the type, wherein the projection optical system has an element having a shape in which a portion of the mask pattern image through which an imaging light flux does not pass is cut off. 8. The projection exposure apparatus according to claim 7, wherein the element has a shape in which a portion apart from the optical axis of the projection optical system in the lateral direction is cut off. 9. The projection exposure apparatus according to claim 7, further comprising a sensor for detecting a surface state of the substrate, and an air conditioner for causing gas to flow from near the optical path of the sensor. . 10. The method of claim 1 device manufacturing method comprising the step of transferring a mask pattern on a substrate using a projection exposure apparatus according to any one claim of 9.