JP3468103B2 - Electronic component mounting method - Google Patents

Electronic component mounting method

Info

Publication number
JP3468103B2
JP3468103B2 JP17104998A JP17104998A JP3468103B2 JP 3468103 B2 JP3468103 B2 JP 3468103B2 JP 17104998 A JP17104998 A JP 17104998A JP 17104998 A JP17104998 A JP 17104998A JP 3468103 B2 JP3468103 B2 JP 3468103B2
Authority
JP
Japan
Prior art keywords
electronic component
electrode
work
anisotropic conductive
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17104998A
Other languages
Japanese (ja)
Other versions
JP2000012613A (en
Inventor
忠彦 境
秀喜 永福
誠一 吉永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP17104998A priority Critical patent/JP3468103B2/en
Publication of JP2000012613A publication Critical patent/JP2000012613A/en
Application granted granted Critical
Publication of JP3468103B2 publication Critical patent/JP3468103B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Description

【発明の詳細な説明】 【０００１】 【発明の属する技術分野】本発明は、異方性導電接着剤
を用いた電子部品の実装方法に関するものである。 【０００２】 【従来の技術】電子部品を基板などのワークに実装する
方法として、異方性導電接着剤を用いる方法が知られて
いる。この異方性導電接着剤は、エポキシ樹脂および硬
化剤よりなる接着剤に、導電材を含有させたものであ
る。この異方性導電接着剤を電子部品の電極とワークの
電極との接合面に供給してこれらの電極相互を接合する
と、接着剤成分により電子部品とワークの電極相互を固
着させるとともに、含有された導電材がそれぞれの電極
の間に挟まれて電子部品とワークの電極との電気的な導
通が確保される。 【０００３】ここで導電材としては、従来銀などの金属
良導体を粒子状にしたものや、樹脂製のボールの表面に
金などの金属のメッキを施した導電粒子が用いられてい
た。これらの導電粒子を介して電子部品とワークの電極
間を実用上十分な低抵抗値で導通させるには、通常一組
の電極と電極の間に数十個単位の導電粒子の存在が必要
とされる。このため、異方性導電接着剤中の導電粒子の
含有量は、導電性確保の観点から定められる所定量以上
としなければならなかった。 【０００４】 【発明が解決しようとする課題】しかしながら、ファイ
ンピッチ化の進行に伴い電極間の間隔が微細化したこと
から、前記所定量以上の導電性粒子が含有された異方性
導電接着剤を使用すると、ワークの電極間の隙間にも多
数の導電粒子が供給されることとなる。そしてこれらの
導電粒子が隣接する電極間で連なって接触状態にあると
電極間の短絡が発生する。このように、従来の異方性導
電接着剤には、良好な低接続抵抗を実現するために導電
粒子の含有量を増やすと、電極間の短絡が発生しやすい
という問題点があった。 【０００５】そこで本発明は、電極間の短絡の不具合を
発生することなく低接続抵抗を実現することができる電
子部品の実装方法を提供することを目的とする。 【０００６】 【０００７】 【課題を解決するための手段】請求項１記載の電子部品
の実装方法は、ワークの電極に、エポキシ樹脂に硬化剤
および導電材としてのカーボンを含んだ異方性導電接着
剤を供給する工程と、このワークに電子部品を搭載して
この電子部品の電極を前記ワークの電極に前記異方性導
電接着剤を介して接合する工程と、前記電子部品を前記
ワークに対して押圧することにより前記カーボンを破壊
してこのカーボンと前記ワークおよび電子部品の電極と
の接触点数を増加させる工程と、前記異方性導電接着剤
を熱硬化させる工程とを含む。 【０００８】本発明によれば、導電粒子としてカーボン
を用いることにより、実装時に電子部品とワークの電極
間の導電材が破壊されて導電材と電極との接触点数を増
やすことができるとともに電極間の隙間が短縮され、導
電粒子の含有量を増加させることなく低接続抵抗を実現
することができる。 【０００９】 【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１（ａ），（ｂ），（ｃ）、図２
（ａ），（ｂ），（ｃ）は本発明の一実施の形態の電子
部品の実装方法の工程説明図である。 【００１０】図１（ａ）において、ワークとしての基板
１には電極２が形成されている。この基板１の上面には
図１（ｂ）に示すように異方性導電接着剤３が塗布さ
れ、電極２の周囲に異方性導電接着剤３が供給される。
塗布の方法としては、ディスペンサにより吐出させる方
法や、印刷による方法などを用いることができる。ここ
で異方性導電接着剤３は、接着剤としてのエポキシ樹脂
および硬化剤に、粒状の導電材である導電粒子３ａを含
有させたものである。導電粒子３ａとしては、グラファ
イトなどのカーボンの粒子が用いられている。 【００１１】次に、基板１に対して、電極としてのバン
プ５が形成された電子部品４が搭載される。図１（ｃ）
に示すように、バンプ５を電極２に位置合せし、電子部
品４を基板１に対して下降させる。これにより、バンプ
５の下端部は異方性導電接着剤３中に沈降し、図２
（ａ）に示すように、導電粒子３ａは電極２とバンプ５
との隙間に挟まれる。次いで、図２（ｂ）に示すように
電子部品４を基板１に対して押圧すると、導電粒子３ａ
は脆性材料であるカーボンよりなる破壊されやすいもの
であるため、押圧荷重により容易に破壊され、複数の粒
子に分裂する。 【００１２】その後、更に押圧を継続することにより、
図２（ｃ）に示すように導電粒子３ａはさらに小さな導
電粒子３ｂに破砕される。その結果、電極２の上面とバ
ンプ５の下面との隙間内には多数の破砕された導電粒子
３ｂが挟み込まれ、したがって電極２の上面とバンプ５
の下面が導電粒子３ｂと接触する接触点数が増加する。
また、電極２の上面とバンプ５の下面の隙間Ｃは、導電
粒子３ａが単体で存在する場合と比較して大幅に縮小さ
れる。 【００１３】この後、基板１は熱処理工程に送られる。
ここで所定時間加熱されることにより、異方性導電接着
剤３は熱硬化し、電子部品４の基板１への実装が完了す
る。このようにしてカーボンの導電粒子を含有した異方
性導電接着剤による接合部は、以下のような特徴を有し
ている。すなわちバンプ５が導電粒子３ｂを介して電極
２と接触する接触点数が増加することにより、また電極
２とバンプ５を距てる隙間Ｃが短縮されることにより、
図２（ａ）に示すような状態のまま異方性導電接着剤３
を硬化させた場合と比較して、電極２とバンプ５の接続
抵抗は大幅に低下する。 【００１４】このとき、この接続抵抗低下の効果によ
り、従来必要とされた導電粒子３ａの含有量そのものを
減少させることができることから、基板１の回路電極２
間の隙間に多数の導電性粒子３ａが入り込むことによる
電極間の短絡の不具合を生じることなく、接合部の接続
抵抗が低く導電性に優れた電子部品の実装を行うことが
できる。また、導電粒子３ａとして用いられるカーボン
は熱膨張係数が小さいため、ヒートサイクルにより接合
部に発生する熱応力を軽減させるという利点を有してい
る。 【００１５】なお、本実施の形態では、異方性導電接着
剤３を電極２に供給する方法として、基板１の電極２に
異方性導電接着剤３を塗布する方法を用いているが、異
方性導電接着剤３をテープに粘着させた導電性テープを
電極２に貼付する方法を用いてもよく、また異方性導電
接着剤３を電子部品４のバンプ５に転写して塗布するこ
とにより、バンプ５を介して異方性導電接着剤３を基板
１の電極２に供給してもよい。 【００１６】 【発明の効果】本発明によれば、導電粒子としてカーボ
ンを用いるようにしたので、実装時に電子部品とワーク
の電極間の導電材が破壊されて導電材と電極との接触点
数を増やすことができるとともに実装後の電極間の隙間
が縮小され、導電粒子の含有量を増加させることなく低
接続抵抗を実現することができる。したがって、電極間
の短絡の不具合を発生することなく、接合部の導電性に
優れた電子部品の実装を行うことができる。BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to method of mounting an electronic component using an anisotropic conductive adhesive. 2. Description of the Related Art As a method for mounting an electronic component on a work such as a substrate, a method using an anisotropic conductive adhesive is known. This anisotropic conductive adhesive is obtained by adding a conductive material to an adhesive composed of an epoxy resin and a curing agent. When this anisotropic conductive adhesive is supplied to the joint surface between the electrode of the electronic component and the electrode of the work and these electrodes are joined to each other, the adhesive component fixes the electrodes of the electronic component and the work to each other and contains the adhesive. The electrically conductive material is sandwiched between the electrodes to ensure electrical continuity between the electronic component and the electrodes of the work. [0003] Here, as the conductive material, a material made of a good metal conductor such as silver in the form of particles or a conductive particle obtained by plating a metal ball such as gold on the surface of a resin ball has been used. In order to conduct between the electrodes of the electronic component and the work at a sufficiently low resistance value for practical use through these conductive particles, usually several tens of conductive particles need to be present between a pair of electrodes. Is done. For this reason, the content of the conductive particles in the anisotropic conductive adhesive must be equal to or more than a predetermined amount determined from the viewpoint of ensuring conductivity. [0004] However, since the distance between the electrodes has been reduced with the progress of fine pitch, anisotropic conductive adhesive containing conductive particles in a predetermined amount or more. When this is used, a large number of conductive particles are also supplied to the gap between the electrodes of the work. If these conductive particles are in contact with each other between adjacent electrodes, a short circuit between the electrodes occurs. As described above, the conventional anisotropic conductive adhesive has a problem that when the content of the conductive particles is increased in order to realize good low connection resistance, a short circuit between the electrodes is likely to occur. [0005] The present invention aims to provide a low connection implementation of Ru electrodeposition <br/> child components can be realized without resistance may cause poor short-circuit between the electrodes. According to a first aspect of the present invention, there is provided a method for mounting an electronic component, wherein an anisotropic conductive material containing an epoxy resin containing a curing agent and carbon as a conductive material is used for an electrode of a work. A step of supplying an adhesive, a step of mounting an electronic component on the work and joining an electrode of the electronic component to an electrode of the work via the anisotropic conductive adhesive, and applying the electronic component to the work. A step of increasing the number of contact points between the carbon and the electrodes of the work and the electronic component by destroying the carbon by pressing the same, and a step of thermally curing the anisotropic conductive adhesive. According to the present invention, by using carbon as the conductive particles, the conductive material between the electronic component and the electrode of the work is broken at the time of mounting, and the number of contact points between the conductive material and the electrode can be increased. Is reduced, and a low connection resistance can be realized without increasing the content of the conductive particles. Next, an embodiment of the present invention will be described with reference to the drawings. 1 (a), (b), (c), FIG.
(A), (b), (c) is process explanatory drawing of the mounting method of the electronic component of one Embodiment of this invention. In FIG. 1A, an electrode 2 is formed on a substrate 1 as a work. As shown in FIG. 1B, an anisotropic conductive adhesive 3 is applied to the upper surface of the substrate 1, and the anisotropic conductive adhesive 3 is supplied around the electrodes 2.
As a coating method, a method of discharging with a dispenser, a method of printing, or the like can be used. Here, the anisotropic conductive adhesive 3 is obtained by adding conductive particles 3a, which is a granular conductive material, to an epoxy resin and a curing agent as an adhesive. Carbon particles such as graphite are used as the conductive particles 3a. Next, the electronic component 4 on which the bumps 5 as electrodes are formed is mounted on the substrate 1. FIG. 1 (c)
As shown in (2), the bump 5 is aligned with the electrode 2 and the electronic component 4 is lowered with respect to the substrate 1. As a result, the lower end of the bump 5 sinks into the anisotropic conductive adhesive 3, as shown in FIG.
As shown in (a), the conductive particles 3a are composed of the electrode 2 and the bump 5
Between the gaps. Then, when the electronic component 4 is pressed against the substrate 1 as shown in FIG.
Is easily broken by carbon, which is a brittle material, and thus is easily broken by a pressing load and split into a plurality of particles. Then, by continuing to press further,
As shown in FIG. 2C, the conductive particles 3a are crushed into smaller conductive particles 3b. As a result, a large number of crushed conductive particles 3b are sandwiched in the gap between the upper surface of the electrode 2 and the lower surface of the bump 5, so that the upper surface of the electrode 2 and the bump 5
The number of contact points at which the lower surface of the substrate contacts the conductive particles 3b increases.
In addition, the gap C between the upper surface of the electrode 2 and the lower surface of the bump 5 is significantly reduced as compared with the case where the conductive particles 3a exist alone. Thereafter, the substrate 1 is sent to a heat treatment step.
Here, by heating for a predetermined time, the anisotropic conductive adhesive 3 is thermally cured, and the mounting of the electronic component 4 on the substrate 1 is completed. The joint made of the anisotropic conductive adhesive containing the conductive carbon particles has the following features. That is, by increasing the number of contact points at which the bump 5 contacts the electrode 2 via the conductive particles 3b, and by shortening the gap C between the electrode 2 and the bump 5,
Anisotropic conductive adhesive 3 as shown in FIG.
Is hardened, the connection resistance between the electrode 2 and the bumps 5 is greatly reduced. At this time, the effect of reducing the connection resistance makes it possible to reduce the content itself of the conductive particles 3a which has been conventionally required.
It is possible to mount an electronic component having a low connection resistance at the junction and excellent conductivity, without causing a short circuit between the electrodes due to a large number of conductive particles 3a entering the gaps between them. In addition, since carbon used as the conductive particles 3a has a small coefficient of thermal expansion, it has an advantage of reducing thermal stress generated at a joint due to a heat cycle. In the present embodiment, as a method of supplying the anisotropic conductive adhesive 3 to the electrode 2, a method of applying the anisotropic conductive adhesive 3 to the electrode 2 of the substrate 1 is used. A method in which a conductive tape in which anisotropic conductive adhesive 3 is adhered to a tape may be attached to electrode 2, or anisotropic conductive adhesive 3 may be transferred to bumps 5 of electronic component 4 and applied. Thereby, the anisotropic conductive adhesive 3 may be supplied to the electrode 2 of the substrate 1 via the bump 5. According to the present invention, since carbon is used as the conductive particles, the conductive material between the electronic component and the electrode of the work is destroyed during mounting, and the number of contact points between the conductive material and the electrode is reduced. The gap between the electrodes after mounting can be reduced, and a low connection resistance can be realized without increasing the content of conductive particles. Therefore, it is possible to mount an electronic component having excellent conductivity at the junction without causing a short circuit between the electrodes.

【図面の簡単な説明】 【図１】（ａ）本発明の一実施の形態の電子部品の実装
方法の工程説明図 （ｂ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 （ｃ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 【図２】（ａ）本発明の一実施の形態の電子部品の実装
方法の工程説明図 （ｂ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 （ｃ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 【符号の説明】 １ 基板 ２ 電極 ３ 異方性導電接着剤 ３ａ，３ｂ 導電粒子 ４ 電子部品 ５ バンプBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a) Process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention (b) Process description of an electronic component mounting method according to an embodiment of the present invention FIG. 2 (c) is an explanatory view of a process of a method of mounting an electronic component according to an embodiment of the present invention. FIG. 2 (a) is an explanatory view of a process of a mounting method of an electronic component according to an embodiment of the present invention. Process description diagram of electronic component mounting method of one embodiment (c) Process description diagram of electronic component mounting method of one embodiment of the present invention [Description of symbols] 1 substrate 2 electrode 3 anisotropic conductive bonding Agents 3a, 3b Conductive particles 4 Electronic components 5 Bump

フロントページの続き (56)参考文献 特開 平７−169795（ＪＰ，Ａ) 特開 平２−10316（ＪＰ，Ａ) 特開 平４−223348（ＪＰ，Ａ) 特開 平６−220413（ＪＰ，Ａ) 特開 平11−134934（ＪＰ，Ａ) 実開 平７−32953（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 C09J 9/02 C09J 193/00 Continuation of the front page (56) References JP-A-7-169795 (JP, A) JP-A-2-10316 (JP, A) JP-A-4-223348 (JP, A) JP-A-6-220413 (JP) , A) JP-A-11-134934 (JP, A) JP-A-7-32953 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60 C09J 9/02 C09J 193/00

Claims (1)

(57)【特許請求の範囲】 【請求項１】ワークの電極に、エポキシ樹脂に硬化剤お
よび導電材としてのカーボンを含んだ異方性導電接着剤
を供給する工程と、このワークに電子部品を搭載してこ
の電子部品の電極を前記ワークの電極に前記異方性導電
接着剤を介して接合する工程と、前記電子部品を前記ワ
ークに対して押圧することにより前記カーボンを破壊し
てこのカーボンと前記ワークおよび電子部品の電極との
接触点数を増加させる工程と、前記異方性導電接着剤を
熱硬化させる工程とを含むことを特徴とする電子部品の
実装方法。(57) Claims 1. A step of supplying an anisotropic conductive adhesive containing a curing agent and carbon as a conductive material to an epoxy resin to an electrode of a work, and an electronic component to the work. Mounting the electrode of the electronic component to the electrode of the work via the anisotropic conductive adhesive, and breaking the carbon by pressing the electronic component against the work. A method of mounting an electronic component, comprising: a step of increasing the number of contact points between carbon and electrodes of the work and the electronic component; and a step of thermally curing the anisotropic conductive adhesive.
JP17104998A 1998-06-18 1998-06-18 Electronic component mounting method Expired - Fee Related JP3468103B2 (en)

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Application Number Priority Date Filing Date Title
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JP2000012613A JP2000012613A (en) 2000-01-14
JP3468103B2 true JP3468103B2 (en) 2003-11-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010093035A1 (en) * 2009-02-16 2010-08-19 株式会社村田製作所 Conductive resin composition, process for producing electronic part using same, connecting method, connection structure, and electronic part

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4089632B2 (en) 2003-03-07 2008-05-28 セイコーエプソン株式会社 Mask manufacturing method, mask manufacturing apparatus, and film forming method of light emitting material
JP2015135878A (en) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 Connection body, method for manufacturing connection body, connection method and anisotropic conductive adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010093035A1 (en) * 2009-02-16 2010-08-19 株式会社村田製作所 Conductive resin composition, process for producing electronic part using same, connecting method, connection structure, and electronic part
JP5561174B2 (en) * 2009-02-16 2014-07-30 株式会社村田製作所 Conductive resin composition, method of manufacturing electronic component using the same, bonding method, bonding structure, and electronic component
US9491868B2 (en) 2009-02-16 2016-11-08 Murata Manufacturing Co., Ltd. Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component

Also Published As

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JP2000012613A (en) 2000-01-14

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