JP3447890B2 - Substrate processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate for liquid crystal, a glass substrate for photomask, etc. on the surface of which a thin film made of a photoresist coating solution, a photosensitive polyimide resin, a dyeing agent for a color filter, etc. is formed. The present invention relates to a substrate processing apparatus for processing by supplying a predetermined processing liquid to the surfaces of these substrates.

[0002]

2. Description of the Related Art Conventionally, there is known a substrate processing apparatus in which a substrate is subjected to a chemical solution supply process, then subjected to cleaning treatment with cleaning water, and then conveyed to a subsequent process. Such a substrate processing apparatus is formed by arranging a chemical treatment section, a water washing section and a drying section in series. A substrate transfer means is laid so as to penetrate through the chemical solution processing section, the water washing section and the drying section, and the substrate is processed while being transferred in the substrate processing apparatus in this order by the chemical solution processing section, the water washing section and the drying section. It

The substrate is subjected to a predetermined treatment by supplying a chemical solution such as an alkali cleaning solution, a developing solution, an etching solution or a stripping solution to the surface in a chemical solution processing section, and then subjected to a water cleaning processing in a water cleaning section, and finally. In the drying section, a drying process such as gas injection is performed.

By the way, the substrate which has been subjected to the predetermined treatment with the chemical liquid in the chemical liquid processing unit has a state in which the chemical liquid adheres to its surface. Chemicals will be brought in,
The cleaning water that is circulated is contaminated by the mixture of chemicals,
There is an inconvenience that the cleaning performance cannot be maintained.

Therefore, an air knife is usually arranged at the boundary between the chemical treatment section and the water washing section, and a curtain-like gas is blown from the gas discharge port toward the surface of the substrate and adheres to the surface of the substrate. The chemical solution is blown back toward the inside of the chemical treatment section to the extent that the surface of the substrate is not dried, thereby preventing the chemical solution from being brought into the washing section. In addition, in the water washing section, at least two stages of water washing treatment are performed by the first water washing section and the second water washing section so that the water washing treatment is completed. First flush section and second
An air knife is also used between the first washing water and the water washing section, which tends to be contaminated by the chemical in the chemical treatment section, and is brought into the second washing section that uses cleaner treatment water. Is being prevented.

[0006]

However, in recent years,
Due to the increase in size of the substrate, there is a duplication of processes in which the upstream side of the substrate receives the first cleaning water supplied from the first washing unit and the downstream side receives the second cleaning water supplied from the second washing unit. Even if the gas is jetted from the air knife toward the surface of the substrate at the boundary between the first water washing section and the second water washing section, the first washing is performed on the upstream surface of the substrate. Since the second cleaning water is simultaneously supplied to the surface on the downstream side, the first cleaning water enters the second cleaning section through the surface of the substrate, and conversely the second cleaning water is supplied. The wash water may move to the first water wash section, which causes a problem that the wash water cannot be reliably replaced at the boundary portion.

In order to solve such a problem, an untreated transfer section is provided between the first water washing section and the second water washing section,
It is conceivable that neither the first cleaning water nor the second cleaning water is supplied to the substrate when the substrate is approaching the boundary between the first water washing section and the second water washing section. In this case, the processing tank must be upsized, which causes a new problem that the equipment cost increases.

On the other hand, as the processing tank becomes larger,
The surface of the substrate may be dried by the gas discharged from the air knife to the surface of the substrate at the boundary portion,
When the surface of the substrate dries, spots occur on that part. This stain cannot be removed even by washing with water, and there is also a problem that after the substrate is finally dried, particles are generated from this stain and the surface of the substrate is re-contaminated. There is.

The present invention has been made in order to solve the above-mentioned problems, and prevents the processing liquid from draining the processing liquid on the surface of the substrate while suppressing the enlargement of the equipment. An object of the present invention is to provide a substrate processing apparatus in which generation of particles due to drying of the substrate is prevented.

[0010]

The invention according to claim 1 is
In a substrate processing apparatus for supplying a processing liquid to a main surface of a substrate which is transported on a substrate mounting surface inclined with respect to a horizontal direction in a plane orthogonal to the transport direction, the substrate mounting surface On the upper side of the , the processing liquid in the form of a strip with a predetermined length in the transport direction.
Processing liquid supply means for supplying the substrate is provided .

According to the present invention , the processing liquid is supplied in the form of a strip from the processing liquid supply means to the substrate being conveyed in the inclined posture.
Since the main surface of the substrate is processed and flows down along the slope, the processing liquid does not move in a liquid flow state on the upstream side of the substrate, and therefore, on the main surface of the substrate on the downstream side of the processing liquid supply means. However, the processing liquid remains only in a thin film state, and the substrate is in a state of being substantially drained before being transferred to the next step. Therefore, unlike the prior art, it is not necessary to provide a liquid draining means such as an air knife between the processing device on the downstream side, the equipment cost is reduced accordingly, and the processing liquid in a thin film state on the main surface of the substrate. By remaining, the drying of the main surface of the substrate is suppressed, and the generation of particles due to the drying of the main surface of the substrate can be prevented.

According to a second aspect of the present invention, in the first aspect of the present invention, the processing liquid supply means is a liquid discharge member having a slit-shaped discharge port having a predetermined length in the carrying direction. It is a feature.

According to the present invention, the treatment liquid is ejected from the liquid ejection member onto the substrate in a band shape.

The invention according to claim 3 is the invention according to claim 1 or 2.
In the invention described above, a second processing liquid supply means extending in a direction crossing the substrate mounting surface (a direction intersecting the substrate transport direction) is provided.

According to the present invention, in addition to the processing liquid discharged from the liquid discharging member, the processing liquid from the second processing liquid supply means is also supplied to the main surface of the substrate, so that the processing liquid on the main surface of the substrate is obtained. A turbulent flow is generated in the flow of the processing liquid, the contact state between the processing liquid and the main surface of the substrate is made uniform by mixing due to the turbulent flow, and the processing efficiency of the main surface of the substrate by the processing liquid is improved. Further, the impact effect of the discharged second processing liquid further enhances the cleaning effect on the substrate surface.

[0016]

1 is an explanatory diagram showing an embodiment of a substrate processing apparatus group to which a substrate processing apparatus according to the present invention is applied. In the substrate processing apparatus group 1, a chemical liquid processing unit 1a that supplies a predetermined chemical liquid to the surface (main surface) of the substrate for processing, a first water washing unit 2, and a water washing process in the first water washing unit 2. A secondary washing section 3 for washing the substrate B with further clean washing water,
And the substrate B which has been subjected to the washing treatment in the secondary washing section 3
Is formed by sequentially arranging a drying unit 4 for drying the same from the upstream side.

The chemical solution treating section 1a, the first water washing section 2, the second water washing section 3 and the drying section 4 are respectively box-shaped chemical solution treating tanks 1b, a first water washing tank 21, and a second water washing tank 31. And a drying tank 41. Each tank 1b, 21,
Substrate passage ports 11 facing each other in the horizontal direction are opened in the upstream wall and the downstream wall of 31, 41, respectively.
Substrate B is put into and taken out of each tank 1b, 21, 31, 41 through 1. In the present embodiment, a cleaning liquid in which a detergent is mixed is used as a processing liquid (chemical liquid) used in the chemical liquid processing unit 1a, normal cleaning water is used in the first water washing unit 2, and a secondary water washing unit is used. In No. 3, ion-exchanged water or pure water is used.

A roller conveyor is used as a transfer means for transferring the substrate B in each of the tanks 1b, 21, 31, 41. In this roller conveyor, conveyance rollers 5 each having a support shaft inclined with respect to the horizontal direction in a plane orthogonal to the conveyance direction of the substrate B are arranged side by side at substantially equal pitches in the conveyance direction (right side in FIG. 1). As a result, a substrate mounting surface is formed, and is driven to rotate synchronously in the same direction by driving a driving means (not shown). Therefore, each tank 1b, 21, 3 of the substrate B is
The transport paths in the insides of 1, 41 are inclined in the width direction as a whole with respect to the transport direction, and the substrate B is transported in an inclined posture along the substrate mounting surface of this inclined transport path while each tank 1b is being transported. ，
Predetermined processing is performed in 21, 31, and 41. In this embodiment, the inclination angle α (FIG. 3) of the substrate B with respect to the horizontal plane is set to approximately 5 °.

The substrate B is tilted from the previous step through an unillustrated upstream take-up means, and is then transferred to the transport roller 5 arranged immediately upstream of the chemical treatment tank 1b.
Then, it is introduced into the substrate processing apparatus group 1 by driving the transport roller 5, and while being transported in the transport direction (rightward in FIG. 1) by the transport roller 5, a predetermined amount of chemical solution is supplied in the chemical solution processing tank 1b. The chemical treatment is performed, and then the primary washing treatment is performed by receiving the supply of the washing water in the primary washing tank 21 and then the secondary discharge vessel 31 in the secondary washing tank 31 (the treating liquid supply means). 6 and pure water supply nozzle 32
The second washing process is performed by supplying washing water from the above, and after the drying process is performed by the gas injection supply from the air knife 42 in the last drying tank 41, it is disposed immediately downstream of the drying tank 41. It is returned to the original horizontal posture through the illustrated unillustrated downstream side take-up means, and is led out toward the next step. The liquid ejection member 6 has a slit-shaped ejection port having a predetermined length in the substrate transport direction.

The substrate processing apparatus 10 according to the present invention is applied to a part of the primary water washing section 2 and the secondary water washing section 3 in this embodiment. Hereinafter, the substrate processing apparatus 10 according to the present invention will be described as being applied to the primary water washing section 2. FIG. 2 is a partially cutaway perspective view showing an embodiment of the primary washing tank 21 of the primary washing section 2. As shown in this figure, in the primary washing tank 21, between the upstream and downstream substrate passage ports 11, at the same height level, five transport rollers 5 are directed toward the transport direction (rightward). Is provided, and by the synchronous rotation of the respective conveying rollers 5 in the same direction by a drive means (not shown), the primary water washing tank 21 from the substrate passage opening 11 on the upstream side is provided.
The substrate B introduced therein is conveyed in the primary washing tank 21 toward the substrate passage port 11 on the downstream side.

The transport roller 5 has a roller shaft 51 bridged between the side walls of the primary washing tank 21 so as to be rotatable about its own axis, and roller shafts 51 on both left and right sides of the roller shaft 51.
A pair of left and right side rollers 52 provided so as to rotate together with
And a central roller 53 provided at the center of the roller shaft 51.
A so-called partially supported roller, which is formed from the above, is used. By applying such a partially-supported roller, it is possible to regulate the bending and reduce the contact area of the back surface of the substrate B by the transport roller 5, and to favorably supply the cleaning water and the gas to the back surface of the substrate B. It is possible to minimize contamination due to the contact between the transport roller 5 and the back surface of the substrate B in the cleaning process and the drying process.

The left and right side rollers 52 each have a flange portion 52a on the outer side thereof which is integral with the side roller 52, and are placed on the rollers 52 and 53 by the flange portion 52a. The lateral deviation of the substrate B being conveyed is prevented, and in particular, the lower flange 52a prevents the substrate B from sliding down along the inclined surface of the conveying path. Further, an O-ring 54 made of a flexible material such as rubber is fitted on each of the rollers 52 and 53 so that the substrate B can be reliably transported by the non-slip action of the O-ring 54. I have to.

In the primary washing tank 21, a support frame 25 extending in the transport direction is provided on the inner wall surface of the upper side of the transport roller 5, which is a substantially central portion in the transport direction. 25
The liquid discharge member 6 is fixed so that the slit-shaped discharge port facing downward is arranged along the transport direction.
The length dimension of the liquid ejection member 6 in the front-rear direction is set to approximately 1/3 of the length dimension of the substrate B (dimension extending in the transport direction). Then, as shown in FIG. 2, the substrate processing area A by the flow of the cleaning water L from the liquid ejection member 6 to the portion extending from the portion facing the liquid ejection member 6 on the substrate B to the side edge on the lower side.
Are formed.

On the other hand, a cleaning water storage tank 22 for storing the cleaning water L to be supplied to the liquid discharge member 6 is disposed near the primary water cleaning tank 21. A cleaning water conduit 22a is provided between the cleaning water storage tank 22 and the liquid discharge member 6, and cleaning is performed between the bottom of the primary water cleaning tank 21 and the upper portion of the cleaning water storage tank 22. A water return line 22b is provided, and these wash water line 22a and wash water return line 22 are provided.
By b, a circulation pipeline for circulating the cleaning water L in the cleaning water storage tank 22 through the liquid discharge member 6 is formed.

A wash water pump 23 is provided in the wash water conduit 22a immediately downstream of the wash water storage tank 22, and a filter 24 is provided immediately downstream of the wash water pump 23. . Therefore, the wash water pump 2
By driving 3 of the cleaning water L in the cleaning water storage tank 22, foreign matters are first removed by the filter 24 through the cleaning water conduit 22a, and then the liquid discharging member 6 and the transport roller 5 are removed.
After being discharged toward the upper edge of the surface of the substrate B in the upper tilted posture, the surface of the substrate B is subjected to predetermined processing while flowing down along the inclination of the substrate B, and then from the lower edge of the substrate B. It falls to the bottom of the primary water washing tank 21 and is returned to the washing water storage tank 22 through the washing water return pipe line 22b, and thereafter is circulated and used.

FIG. 3 is a partially cutaway perspective view showing an embodiment of the liquid discharge member 6. First, the liquid discharge member 6 is formed by including a long rectangular parallelepiped member body 61 extending in the front-rear direction and a tapered nozzle portion 62 extending from a lower portion of the member body 61. The member main body 61 has a washing water supply pipe line 63 extending in the front-rear direction in the inside thereof, and also has a connection cylinder 64 in which a male screw is screwed at the top. A joint 22c provided at the downstream end of the cleaning water pipe 22a is screwed to the connection cylinder 64, so that the cleaning water pipe 22a is connected to the liquid discharge member 6.

Further, the nozzle portion 62 is provided with a slit-shaped cleaning water discharge port 65 which extends in the front-rear direction and communicates with the cleaning water supply conduit 63, and the cleaning water of the member main body 61 is passed through the cleaning water conduit 22a. The cleaning water L supplied to the supply pipeline 63 is supplied onto the substrate B from the cleaning water discharge port 65.

4A and 4B are explanatory views for explaining the operation of the present invention. FIG. 4A shows a state immediately after the front end portion of the substrate B in the carrying direction has entered the substrate processing area A, and FIG. 4B shows the substrate B. The front and rear direction central portion of FIG. 3 is in the state of being located in the substrate processing area A, and FIG.

First, as shown in FIG. 4A, the transfer roller 5 is driven to be introduced into the primary washing tank 21 through the substrate passage port 11 on the upstream side (left side) and the substrate processing area. The substrate B that has entered A is washed water conduit 22a on the upper side of the front end portion in the transport direction by driving the washing water pump 23 (FIGS. 1 and 2).
The cleaning water L discharged from the cleaning water discharge port 65 of the liquid discharging member 6 is supplied through the cleaning water L, and the cleaning water L flows down from the upper front surface of the substrate B toward the lower surface thereof. The cleaning process is performed. The treated cleaning water L passes through the lower edge of the substrate B and falls to the bottom of the primary water washing tank 21. Then, since the cleaning water L flows down along the inclination of the substrate B, the inconvenience that the cleaning water L leaks from the rear edge of the substrate B to the outside of the primary rinsing tank 21 along the surface of the substrate B is avoided. It

Then, as shown in FIG. 4B, the central portion of the substrate B is moved to the substrate processing area A by driving the conveying roller 5.
When the cleaning liquid L is discharged from the liquid discharging member 6, the cleaning water L is supplied to the upper edge of the central portion of the substrate B, whereby the central portion of the substrate B is subjected to the cleaning treatment, and the cleaning water after the treatment is processed. L is the primary washing tank 21 passing through the lower edge of the substrate B.
Fall to the bottom of the. Then, the cleaning water L vigorously flows down along the inclination of the substrate B and does not flow toward the downstream side as a liquid flow. Therefore, the surface of the substrate B that has passed through the liquid discharge member 6 on the downstream side has the cleaning water L. Remains in a very thin film state.

Further, as shown in FIG. 4C, when the substrate B is completely removed from the substrate processing area A by driving the transport roller 5, the surface of the substrate B has already been washed with water L.
Since the cleaning process is completed, and the surface of the substrate B is in a liquid-runout state in which only a very thin thin film of cleaning water L exists, the secondary water cleaning unit 3 (FIG. The amount of the cleaning water L mixed into the cleaning water can be minimized at the time of the cleaning process in (1), and the generation of particles due to the cleaning water L due to the partial drying of the surface of the substrate B can be reliably suppressed. It will be possible.

In the present invention, as described in detail above, the substrate B is inclined in the primary washing tank 21 by the conveying roller 5 which is inclined with respect to the horizontal direction in the plane orthogonal to the conveying direction of the substrate B. Since the cleaning water L from the liquid discharge member 6 is supplied in a curtain shape (strip shape) to the upper edge of the substrate B when the substrate B is transported in the posture, the cleaning liquid supplied to the substrate B is cleaned. The water L flows down the inclined surface of the substrate B from the upper side to the lower side, and the surface of the substrate B is washed during this flow, and the washing water L is in the flow path along the inclination, that is, the substrate processing area. The substrate B is transported in a liquid flow state from A, and therefore the substrate B is transported in a state where a large amount of cleaning water L does not move to the upstream side and the downstream side of the substrate processing area A on the substrate B.

Therefore, as in the conventional case, the primary washing tank 21
The draining process of the wash water L is performed without providing a draining means such as an air knife at the boundary between the second washing tank 31 and the secondary washing tank 31, and the facility cost can be reduced. Since an extremely thin thin film layer of the cleaning water L is formed on the surface of the substrate B on the downstream side of the substrate processing area A, it is not necessary to blow air or the like before the transfer to the secondary water washing tank 31. , The surface of the substrate B is partially dried,
As a result, inconveniences such as generation of particles do not occur, and the effect of effectively suppressing the contamination of the substrate is great.

FIG. 5 is a perspective view showing another embodiment of the arrangement of the treatment liquid supply means in the primary washing tank 21. In this embodiment, a sprinkling pipe (second processing liquid supply means) 60 is arranged in the central portion of the liquid discharge member 6 in the substrate transport direction so as to cross the processing liquid discharge area A in the width direction. In addition to the discharge of the cleaning water L from the discharge member 6, water is also sprayed toward the substrate B from this spray pipe 60. This sprinkling pipe 60 has a plurality of fan-shaped, full-cone-shaped,
Alternatively, it has a straight type sprinkling nozzle 601 and the washing water L is sprayed from these sprinkling nozzles 601.

As described above, by supplying the cleaning water L to the main surface of the substrate B not only from the liquid discharge member 6 but also from the sprinkling pipe 60, a turbulent flow occurs in the flow of the cleaning water L on the substrate B, Since the cleaning water L comes into contact with the substrate B in a state of being sufficiently stirred, it is possible to improve the processing efficiency of the cleaning water L. Also, due to the impact effect of the discharge pressure of the wash water L,
Excessive substances such as particles attached to the substrate B can be removed more reliably.

The present invention is not limited to the above-mentioned embodiment, but also includes the following contents.

(1) In the above embodiment, the primary water washing tank 21 is applied as the substrate processing apparatus 10, but the invention is not limited to the application to the primary water washing tank 21. It may be applied to the secondary washing tank 31.

(2) In the above embodiment, the cleaning water L for cleaning the surface of the substrate B is used as the processing liquid. However, instead of the cleaning water L, a developing solution as the processing liquid,
It may be an etching solution, a stripping solution for stripping off the resist film deposited on the surface of the substrate B subjected to the etching treatment, or pure water for washing off a stripping solution or a substitution fluid such as isopropyl alcohol for replacing the stripping solution.

(3) In the above embodiment, the liquid ejection member 6 is provided on the front surface side of the substrate B, but in addition to this, it may be provided on the back surface side of the substrate B.

(4) In the above embodiment, the inclination angle of the substrate B conveyed in the inclined posture by the conveying roller 5 in the substrate processing apparatus group 1 is set to about 5 °.
The present invention is not limited to setting the inclination angle of the substrate B to approximately 5 °, but may be set to 1 ° to 40 °. Further, more preferably, the inclination of 3 to 40 ° or more improves the flowability of the treatment liquid.

(5) In the above embodiment, only the surface of the substrate B is treated with the cleaning water L discharged from the liquid discharging member 6, but the present invention is not limited to this.
Is not limited to treating only the surface of
A liquid ejection member for ejecting the cleaning water L may be provided on the upper surface of the back surface of the substrate B which is being conveyed, and the back surface of the substrate B may be treated by ejecting the cleaning water L from the liquid ejection member. By doing so, the cleaning water L discharged to the upper side of the back surface of the substrate B flows down along the inclination of the substrate B, so that the back surface of the substrate B is cleaned without trouble.

(6) In the above embodiment, the cleaning water L is discharged in the form of a strip from the liquid discharging member 6, but the present invention is not limited to the use of such a liquid discharging member 6. Alternatively, the cleaning water L may be discharged from a normal cone nozzle, a fan-shaped nozzle or the like toward the upper side edge of the substrate B.

[0043]

According to the first aspect of the present invention, the processing liquid is supplied by the processing liquid supply means in a strip shape toward the upper edge of the substrate being conveyed in the inclined posture. The supplied processing liquid flows down along the slope while processing the main surface of the substrate, and the main surface of the substrate is not uniformly exposed to the liquid flow and does not move in the liquid flow state to the upstream side of the substrate. Only the processing liquid remains in a thin film state on the main surface of the substrate on the upstream side of the liquid supply means, and the substrate can be in a state of being substantially drained before being transferred to the next step.

Therefore, it is not necessary to provide a liquid draining means such as an air knife between the processing apparatus on the downstream side as in the conventional case, and the equipment cost can be reduced accordingly, and the main substrate Drying of the substrate main surface is suppressed by leaving the treatment liquid in a thin film state on the surface, and it is possible to reliably prevent generation of particles due to partial drying of the substrate main surface. Recontamination of the substrate is reliably prevented.

According to the second aspect of the invention, since the treatment liquid supply means is a liquid ejection member having a slit-shaped ejection port having a predetermined length in the carrying direction, the treatment liquid is ejected. Is discharged in a strip shape from the substrate to the substrate so that the main surface of the substrate is uniformly exposed to the liquid flow, and the substrate can be processed with less variation.

According to the third aspect of the present invention, since the second processing liquid supply means extending in the direction crossing the substrate mounting surface is provided, the second processing liquid supply means disperses the liquid onto the main surface of the substrate. The liquid causes the processing liquid to be in a turbulent state on the main surface, which makes the contact state between the processing liquid and the main surface of the substrate uniform, thereby improving the processing efficiency of the main surface of the substrate by the processing liquid.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of a substrate processing apparatus group to which a substrate processing apparatus according to the present invention is applied.

FIG. 2 is a partially cutaway perspective view showing an embodiment of a primary washing tank.

FIG. 3 is a partially cutaway perspective view showing an embodiment of a liquid discharge member.

FIG. 4 is an explanatory diagram for explaining the operation of the present invention,
(A) is the state immediately after the front end of the substrate in the transport direction has entered the substrate processing area, (b) is the state in which the front-rear center of the substrate is located in the substrate processing area, and (c) is the substrate processing area. The respective states derived from are shown.

FIG. 5 is a perspective view showing another embodiment of the arrangement of the treatment liquid supply means in the primary washing tank.

[Explanation of symbols]

1 Substrate processing equipment group 10 Substrate processing equipment 11 Substrate passage port 1a Chemical processing part 1b Chemical treatment tank 2 First flush section 21 First flush tank 22 Wash water storage tank 22a washing water line 22b Wash water return line 23 Wash water pump 24 filters 3 Second washing section 31 Second flush tank 32 Pure water supply nozzle 4 drying section 41 Drying tank 42 Air knife 5 Conveyor rollers 51 roller shaft 52 side roller 52a collar part 53 Central roller 54 O-ring 6 Liquid discharge member (processing liquid supply means) 60 Sprinkling pipe (second processing liquid supply means) 61 body 62 nozzle 63 Washing water supply line 64 connection tube 65 Cleaning water outlet A Processing liquid discharge area B board

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/304 B05C 11/08 B08B 3/08 G02F 1/1333 B05C 5/02

Claims (3)

(57) [Claims] 1. A substrate processing apparatus for supplying a processing liquid to a main surface of a substrate transported on a substrate mounting surface inclined with respect to a horizontal direction in a plane orthogonal to the transport direction to perform a predetermined process, A predetermined length in the carrying direction on the upper side of the substrate mounting surface
A strip with a processing solution treatment liquid supply means for supplying to said substrate
A substrate processing apparatus, wherein the substrate processing apparatus is provided . 2. The substrate processing apparatus according to claim 1, wherein the processing liquid supply means is a liquid discharge member having a slit-shaped discharge port having a predetermined length in the carrying direction. 3. The substrate processing apparatus according to claim 1, further comprising a second processing liquid supply means extending in a direction traversing the substrate mounting surface.